FR2098143A5 - - Google Patents

Info

Publication number
FR2098143A5
FR2098143A5 FR7124014A FR7124014A FR2098143A5 FR 2098143 A5 FR2098143 A5 FR 2098143A5 FR 7124014 A FR7124014 A FR 7124014A FR 7124014 A FR7124014 A FR 7124014A FR 2098143 A5 FR2098143 A5 FR 2098143A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7124014A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signetics Corp filed Critical Signetics Corp
Application granted granted Critical
Publication of FR2098143A5 publication Critical patent/FR2098143A5/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
FR7124014A 1970-07-01 1971-06-30 Expired FR2098143A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5161070A 1970-07-01 1970-07-01

Publications (1)

Publication Number Publication Date
FR2098143A5 true FR2098143A5 (fr) 1972-03-03

Family

ID=21972343

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7124014A Expired FR2098143A5 (fr) 1970-07-01 1971-06-30

Country Status (7)

Country Link
US (1) US3740900A (fr)
JP (2) JPS5227993B1 (fr)
CA (1) CA927017A (fr)
DE (1) DE2132174A1 (fr)
FR (1) FR2098143A5 (fr)
GB (1) GB1334583A (fr)
NL (1) NL7109087A (fr)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece
NL7404364A (nl) * 1974-04-01 1975-10-03 Philips Nv Werkwijze en inrichting voor het bewerken van vlakke voorwerpen.
JPS5419298B2 (fr) * 1974-05-10 1979-07-13
JPS5810193B2 (ja) * 1974-08-02 1983-02-24 株式会社日立製作所 ラツピングソウチ
JPS54143770U (fr) * 1977-11-29 1979-10-05
US4519593A (en) * 1982-09-01 1985-05-28 Westinghouse Electric Corp. Grid assembly fixture, retention strap
JPS6099538A (ja) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 ピンチヤツク
US4747608A (en) * 1984-10-30 1988-05-31 Canon Kabushiki Kaisha Wafer chuck
KR910009320B1 (ko) * 1986-08-19 1991-11-09 미쓰비시 마테리알 가부시기가이샤 연마장치
EP0348757B1 (fr) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Procédé de polissage d'une plaquette semi-conductrice
US5189843A (en) * 1990-08-30 1993-03-02 Silicon Technology Corporation Wafer slicing and grinding machine and a method of slicing and grinding wafers
US5230184A (en) * 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
US5273615A (en) * 1992-04-06 1993-12-28 Motorola, Inc. Apparatus and method for handling fragile semiconductor wafers
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
JPH07169660A (ja) * 1993-09-09 1995-07-04 Xerox Corp ウェハ対を接合する装置及び方法
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
WO2003052435A1 (fr) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Systeme de detection a membrane
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
EP1509776A4 (fr) 2002-05-23 2010-08-18 Cascade Microtech Inc Sonde d'essai d'un dispositif soumis essai
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7001827B2 (en) * 2003-04-15 2006-02-21 International Business Machines Corporation Semiconductor wafer front side protection
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
US20070090479A1 (en) * 2005-10-20 2007-04-26 Chien-Hua Chen Controlling bond fronts in wafer-scale packaging
KR100898793B1 (ko) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 액정표시소자용 기판 합착 장치
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US9922851B2 (en) 2014-05-05 2018-03-20 International Business Machines Corporation Gas-controlled bonding platform for edge defect reduction during wafer bonding
CN104385129B (zh) * 2014-09-29 2016-11-16 无锡康柏斯机械科技有限公司 一种专用于工件底面钻孔找平的安装夹具
USD811452S1 (en) * 2015-12-14 2018-02-27 Ngk Spark Plug Co., Ltd. Vacuum chuck
USD811451S1 (en) * 2015-12-14 2018-02-27 Ngk Spark Plug Co., Ltd. Vacuum chuck
DE102016106706A1 (de) * 2016-04-12 2017-10-12 Laser Imaging Systems Gmbh Vorrichtung zum Fixieren von Objekten mittels Vakuum
CN105834900B (zh) * 2016-04-28 2019-03-26 浙江工业大学 一种抛光工件真空夹具自动调节装置
CN106141910A (zh) * 2016-08-26 2016-11-23 卢明杰 一种具有全方位打磨功能的石材加工平台
CN107738203B (zh) * 2017-10-10 2019-06-28 青岛永丰高新包装制品有限公司 用于塑料编织袋固定的吸附定位装置
KR102010271B1 (ko) * 2017-11-03 2019-10-21 에이엠테크놀로지 주식회사 연마장치
CN108705690B (zh) * 2018-05-29 2020-08-25 新昌县皇骐电子科技有限公司 一种半导体晶圆划片机
CN110549184A (zh) * 2018-05-30 2019-12-10 佛山市三水区琪昌机械设备有限公司 一种用于一次烧瓷砖生坯的抛平机
CN110610879B (zh) * 2019-09-27 2023-11-24 江西兆驰半导体有限公司 一种承载led晶圆片的陶瓷盘自动传送下蜡设备
CN112726358A (zh) * 2021-01-27 2021-04-30 刘金月 一种建筑施工用混凝土磨光机
CN113400186B (zh) * 2021-07-20 2022-02-15 深圳市科源信科技有限公司 一种石英晶振片研磨架
CN113649949A (zh) * 2021-08-24 2021-11-16 上海致领半导体科技发展有限公司 一种用于半导体晶片抛光的多通路真空吸盘部件

Also Published As

Publication number Publication date
NL7109087A (fr) 1972-01-04
CA927017A (en) 1973-05-22
GB1334583A (en) 1973-10-24
JPS5237782A (en) 1977-03-23
DE2132174A1 (de) 1972-01-05
JPS5227993B1 (fr) 1977-07-23
US3740900A (en) 1973-06-26

Similar Documents

Publication Publication Date Title
ATA96471A (fr)
AU1146470A (fr)
AU2044470A (fr)
AU1473870A (fr)
AU1326870A (fr)
AU2085370A (fr)
AU2017870A (fr)
AU1833270A (fr)
AU1716970A (fr)
AU1517670A (fr)
AU1336970A (fr)
AU1591370A (fr)
AU1004470A (fr)
AU2144270A (fr)
AU2131570A (fr)
AU2130770A (fr)
AU1277070A (fr)
AU1328670A (fr)
AU1247570A (fr)
AU1343870A (fr)
AU1235770A (fr)
AU2130570A (fr)
AU1189670A (fr)
AU1581370A (fr)
AU1086670A (fr)

Legal Events

Date Code Title Description
ST Notification of lapse