FR2083421B1 - - Google Patents

Info

Publication number
FR2083421B1
FR2083421B1 FR7109677A FR7109677A FR2083421B1 FR 2083421 B1 FR2083421 B1 FR 2083421B1 FR 7109677 A FR7109677 A FR 7109677A FR 7109677 A FR7109677 A FR 7109677A FR 2083421 B1 FR2083421 B1 FR 2083421B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7109677A
Other languages
French (fr)
Other versions
FR2083421A1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2083421A1 publication Critical patent/FR2083421A1/fr
Application granted granted Critical
Publication of FR2083421B1 publication Critical patent/FR2083421B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
FR7109677A 1970-03-19 1971-03-19 Expired FR2083421B1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702013220 DE2013220A1 (de) 1970-03-19 1970-03-19 Verfahren zum Herstellen einer Transistor anordnung aus Silicium

Publications (2)

Publication Number Publication Date
FR2083421A1 FR2083421A1 (https=) 1971-12-17
FR2083421B1 true FR2083421B1 (https=) 1977-01-21

Family

ID=5765627

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7109677A Expired FR2083421B1 (https=) 1970-03-19 1971-03-19

Country Status (8)

Country Link
US (1) US3754321A (https=)
AT (1) AT312054B (https=)
CH (1) CH522954A (https=)
DE (1) DE2013220A1 (https=)
FR (1) FR2083421B1 (https=)
GB (1) GB1310806A (https=)
NL (1) NL7103588A (https=)
SE (1) SE378154B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999318A (en) * 1986-11-12 1991-03-12 Hitachi, Ltd. Method for forming metal layer interconnects using stepped via walls

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3523038A (en) * 1965-06-02 1970-08-04 Texas Instruments Inc Process for making ohmic contact to planar germanium semiconductor devices
US3571913A (en) * 1968-08-20 1971-03-23 Hewlett Packard Co Method of making ohmic contact to a shallow diffused transistor
ES374318A1 (es) * 1968-12-10 1972-03-16 Matsushita Electronics Corp Un metodo de fabricar un dispositivo semiconductor sensiblea la presion.

Also Published As

Publication number Publication date
DE2013220A1 (de) 1971-11-25
FR2083421A1 (https=) 1971-12-17
CH522954A (de) 1972-05-15
GB1310806A (en) 1973-03-21
NL7103588A (https=) 1971-09-21
SE378154B (https=) 1975-08-18
AT312054B (de) 1973-12-10
US3754321A (en) 1973-08-28

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Legal Events

Date Code Title Description
ST Notification of lapse