FR2079345A1 - - Google Patents

Info

Publication number
FR2079345A1
FR2079345A1 FR7104219A FR7104219A FR2079345A1 FR 2079345 A1 FR2079345 A1 FR 2079345A1 FR 7104219 A FR7104219 A FR 7104219A FR 7104219 A FR7104219 A FR 7104219A FR 2079345 A1 FR2079345 A1 FR 2079345A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7104219A
Other languages
French (fr)
Other versions
FR2079345B1 (US07655688-20100202-C00086.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of FR2079345A1 publication Critical patent/FR2079345A1/fr
Application granted granted Critical
Publication of FR2079345B1 publication Critical patent/FR2079345B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR7104219A 1970-02-10 1971-02-09 Expired FR2079345B1 (US07655688-20100202-C00086.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1158470 1970-02-10

Publications (2)

Publication Number Publication Date
FR2079345A1 true FR2079345A1 (US07655688-20100202-C00086.png) 1971-11-12
FR2079345B1 FR2079345B1 (US07655688-20100202-C00086.png) 1976-09-03

Family

ID=11781939

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7104219A Expired FR2079345B1 (US07655688-20100202-C00086.png) 1970-02-10 1971-02-09

Country Status (3)

Country Link
US (1) US3726733A (US07655688-20100202-C00086.png)
FR (1) FR2079345B1 (US07655688-20100202-C00086.png)
GB (1) GB1339071A (US07655688-20100202-C00086.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2112667A5 (US07655688-20100202-C00086.png) * 1970-11-05 1972-06-23 Lignes Telegraph Telephon
EP0453785A1 (de) * 1990-04-24 1991-10-30 Oerlikon Contraves AG Verfahren zur Herstellung von mehrlagigen Dünnschichtschaltungen mit integrierten Dünnschichtwiderständen

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900944A (en) * 1973-12-19 1975-08-26 Texas Instruments Inc Method of contacting and connecting semiconductor devices in integrated circuits
US4792779A (en) * 1986-09-19 1988-12-20 Hughes Aircraft Company Trimming passive components buried in multilayer structures
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2021264A1 (de) * 1969-05-05 1970-11-12 Western Electric Co Verfahren fuer die Herstellung von diskreten RC-Anordnungen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2021264A1 (de) * 1969-05-05 1970-11-12 Western Electric Co Verfahren fuer die Herstellung von diskreten RC-Anordnungen

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2112667A5 (US07655688-20100202-C00086.png) * 1970-11-05 1972-06-23 Lignes Telegraph Telephon
EP0453785A1 (de) * 1990-04-24 1991-10-30 Oerlikon Contraves AG Verfahren zur Herstellung von mehrlagigen Dünnschichtschaltungen mit integrierten Dünnschichtwiderständen
US5227012A (en) * 1990-04-24 1993-07-13 Hightec Mg Ag Method of manufacturing multi-layer thin film circuits containing integrated thin film resistors

Also Published As

Publication number Publication date
GB1339071A (en) 1973-11-28
DE2105411A1 (de) 1971-12-23
DE2105411B2 (de) 1972-12-28
US3726733A (en) 1973-04-10
FR2079345B1 (US07655688-20100202-C00086.png) 1976-09-03

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