FR2023323A1 - - Google Patents
Info
- Publication number
- FR2023323A1 FR2023323A1 FR6935663A FR6935663A FR2023323A1 FR 2023323 A1 FR2023323 A1 FR 2023323A1 FR 6935663 A FR6935663 A FR 6935663A FR 6935663 A FR6935663 A FR 6935663A FR 2023323 A1 FR2023323 A1 FR 2023323A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/654—Top-view layouts
- H10W70/655—Fan-out layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP43076079A JPS5128829B1 (https=) | 1968-10-21 | 1968-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2023323A1 true FR2023323A1 (https=) | 1970-08-21 |
Family
ID=13594790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR6935663A Withdrawn FR2023323A1 (https=) | 1968-10-21 | 1969-10-17 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5128829B1 (https=) |
| DE (1) | DE1952789C3 (https=) |
| FR (1) | FR2023323A1 (https=) |
| GB (1) | GB1277254A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2508705A1 (fr) * | 1981-06-27 | 1982-12-31 | Bosch Gmbh Robert | Composant electronique a inserer dans un dispositif de branchement |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615059U (https=) * | 1979-07-11 | 1981-02-09 | ||
| JPS5651846A (en) * | 1979-10-04 | 1981-05-09 | Fujitsu Ltd | Ic package |
| US4320438A (en) | 1980-05-15 | 1982-03-16 | Cts Corporation | Multi-layer ceramic package |
| DE3147790A1 (de) * | 1981-12-03 | 1983-06-09 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungsmodul und verfahren zu seiner herstellung |
| DE3147789A1 (de) * | 1981-12-03 | 1983-06-09 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungsmodul und verfahren zu seiner herstellung |
| JPS5987893A (ja) * | 1982-11-12 | 1984-05-21 | 株式会社日立製作所 | 配線基板とその製造方法およびそれを用いた半導体装置 |
| US4750092A (en) * | 1985-11-20 | 1988-06-07 | Kollmorgen Technologies Corporation | Interconnection package suitable for electronic devices and methods for producing same |
| DE3703280A1 (de) * | 1987-02-04 | 1988-08-18 | Licentia Gmbh | Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen |
| GB2209867B (en) * | 1987-09-16 | 1990-12-19 | Advanced Semiconductor Package | Method of forming an integrated circuit chip carrier |
| US5702985A (en) * | 1992-06-26 | 1997-12-30 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method |
| DE19548050A1 (de) * | 1995-12-21 | 1997-06-26 | Siemens Matsushita Components | Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement - |
| CN113937067A (zh) * | 2021-09-23 | 2022-01-14 | 中国电子科技集团公司第十三研究所 | 磁电阻随机存储器及其封装外壳和制备方法 |
-
1968
- 1968-10-21 JP JP43076079A patent/JPS5128829B1/ja active Pending
-
1969
- 1969-10-13 GB GB50245/69A patent/GB1277254A/en not_active Expired
- 1969-10-17 FR FR6935663A patent/FR2023323A1/fr not_active Withdrawn
- 1969-10-20 DE DE1952789A patent/DE1952789C3/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2508705A1 (fr) * | 1981-06-27 | 1982-12-31 | Bosch Gmbh Robert | Composant electronique a inserer dans un dispositif de branchement |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1277254A (en) | 1972-06-07 |
| JPS5128829B1 (https=) | 1976-08-21 |
| DE1952789A1 (de) | 1970-04-30 |
| DE1952789B2 (de) | 1971-09-30 |
| DE1952789C3 (de) | 1974-04-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |