FR1383713A - Molybdenum diodes and method of manufacturing such diodes - Google Patents

Molybdenum diodes and method of manufacturing such diodes

Info

Publication number
FR1383713A
FR1383713A FR835336A FR835336A FR1383713A FR 1383713 A FR1383713 A FR 1383713A FR 835336 A FR835336 A FR 835336A FR 835336 A FR835336 A FR 835336A FR 1383713 A FR1383713 A FR 1383713A
Authority
FR
France
Prior art keywords
diodes
molybdenum
manufacturing
molybdenum diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR835336A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to FR835336A priority Critical patent/FR1383713A/en
Application granted granted Critical
Publication of FR1383713A publication Critical patent/FR1383713A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20Seals between parts of vessels
    • H01J5/22Vacuum-tight joints between parts of vessel
    • H01J5/26Vacuum-tight joints between parts of vessel between insulating and conductive parts of vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32Seals for leading-in conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037Solid sealing members other than lamp bases
    • H01J2893/0041Direct connection between insulating and metal elements, in particular via glass material
    • H01J2893/0043Glass-to-metal or quartz-to-metal, e.g. by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
FR835336A 1959-08-07 1960-08-08 Molybdenum diodes and method of manufacturing such diodes Expired FR1383713A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR835336A FR1383713A (en) 1959-08-07 1960-08-08 Molybdenum diodes and method of manufacturing such diodes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83238559A 1959-08-07 1959-08-07
FR835336A FR1383713A (en) 1959-08-07 1960-08-08 Molybdenum diodes and method of manufacturing such diodes

Publications (1)

Publication Number Publication Date
FR1383713A true FR1383713A (en) 1965-01-04

Family

ID=26187075

Family Applications (1)

Application Number Title Priority Date Filing Date
FR835336A Expired FR1383713A (en) 1959-08-07 1960-08-08 Molybdenum diodes and method of manufacturing such diodes

Country Status (1)

Country Link
FR (1) FR1383713A (en)

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