FI118363B - Tehopuolijohdekomponenttien suojaus - Google Patents

Tehopuolijohdekomponenttien suojaus Download PDF

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Publication number
FI118363B
FI118363B FI20040462A FI20040462A FI118363B FI 118363 B FI118363 B FI 118363B FI 20040462 A FI20040462 A FI 20040462A FI 20040462 A FI20040462 A FI 20040462A FI 118363 B FI118363 B FI 118363B
Authority
FI
Finland
Prior art keywords
temperature
semiconductors
power
interface
heating
Prior art date
Application number
FI20040462A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20040462A0 (fi
FI20040462A (fi
Inventor
Risto Komulainen
Juha Norrena
Original Assignee
Vacon Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacon Oyj filed Critical Vacon Oyj
Priority to FI20040462A priority Critical patent/FI118363B/fi
Publication of FI20040462A0 publication Critical patent/FI20040462A0/fi
Priority to DK05075651.9T priority patent/DK1583197T3/en
Priority to EP05075651.9A priority patent/EP1583197B1/fr
Priority to US11/090,066 priority patent/US7176804B2/en
Publication of FI20040462A publication Critical patent/FI20040462A/fi
Application granted granted Critical
Publication of FI118363B publication Critical patent/FI118363B/fi

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H6/00—Emergency protective circuit arrangements responsive to undesired changes from normal non-electric working conditions using simulators of the apparatus being protected, e.g. using thermal images
    • H02H6/005—Emergency protective circuit arrangements responsive to undesired changes from normal non-electric working conditions using simulators of the apparatus being protected, e.g. using thermal images using digital thermal images
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
    • H02H7/10—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for converters; for rectifiers
    • H02H7/12—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for converters; for rectifiers for static converters or rectifiers
    • H02H7/1216—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for converters; for rectifiers for static converters or rectifiers for AC-AC converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Power Conversion In General (AREA)
  • Inverter Devices (AREA)
  • General Induction Heating (AREA)
FI20040462A 2004-03-29 2004-03-29 Tehopuolijohdekomponenttien suojaus FI118363B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20040462A FI118363B (fi) 2004-03-29 2004-03-29 Tehopuolijohdekomponenttien suojaus
DK05075651.9T DK1583197T3 (en) 2004-03-29 2005-03-18 Protection of power semiconductor components
EP05075651.9A EP1583197B1 (fr) 2004-03-29 2005-03-18 Protection de composants de puissance semi-conducteurs
US11/090,066 US7176804B2 (en) 2004-03-29 2005-03-28 Protection of power semiconductor components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040462A FI118363B (fi) 2004-03-29 2004-03-29 Tehopuolijohdekomponenttien suojaus
FI20040462 2004-03-29

Publications (3)

Publication Number Publication Date
FI20040462A0 FI20040462A0 (fi) 2004-03-29
FI20040462A FI20040462A (fi) 2005-09-30
FI118363B true FI118363B (fi) 2007-10-15

Family

ID=32039480

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20040462A FI118363B (fi) 2004-03-29 2004-03-29 Tehopuolijohdekomponenttien suojaus

Country Status (4)

Country Link
US (1) US7176804B2 (fr)
EP (1) EP1583197B1 (fr)
DK (1) DK1583197T3 (fr)
FI (1) FI118363B (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3963175B2 (ja) * 2004-03-19 2007-08-22 日産自動車株式会社 温度検出装置および温度検出用プログラム
FI121803B (fi) * 2005-05-03 2011-04-15 Vacon Oyj Taajuusmuuttajan valvontajärjestely
JP5016967B2 (ja) * 2007-04-20 2012-09-05 株式会社日立産機システム 電力変換装置及びパワーサイクル寿命予測方法
US8035240B2 (en) * 2007-05-30 2011-10-11 Acciona Windpower, S.A. Systems and methods for synchronous speed avoidance in doubly-fed induction generators
US20090012739A1 (en) * 2007-07-03 2009-01-08 Continental Automotive Systems Us, Inc. Method for determining power semiconductor temperature
US7988354B2 (en) * 2007-12-26 2011-08-02 Infineon Technologies Ag Temperature detection for a semiconductor component
US8380451B2 (en) * 2009-07-14 2013-02-19 Ford Global Technologies, Llc System and method for monitoring the state of health of a power electronic system
WO2012000545A1 (fr) * 2010-06-30 2012-01-05 Abb Technology Ag Système de transmission hvdc, poste hvdc et procédé de mise en oeuvre de poste hvdc
CN101997302B (zh) * 2010-08-13 2014-03-19 乌云翔 大功率变流器的电力电子器件温度过高的保护方法
TWI417795B (zh) * 2010-08-25 2013-12-01 Macronix Int Co Ltd 積體電路及其操作方法
DE102011006696A1 (de) * 2011-04-04 2012-10-04 Zf Friedrichshafen Ag Leistungselektronikbaugruppe
EP2551982B1 (fr) * 2011-07-27 2013-09-25 Siemens Aktiengesellschaft Surveillance thermique d'un convertisseur
US20140079092A1 (en) * 2012-09-19 2014-03-20 Abb Oy Method and apparatus for pre-emptive power semiconductor module fault indication
CN102930093B (zh) * 2012-10-24 2015-07-08 南车株洲电力机车研究所有限公司 一种两电平变流器的建模方法
FI125501B (fi) * 2013-02-14 2015-10-30 Abb Technology Oy Ohjausjärjestelmä puolijohdekytkimiä varten
CN104155587B (zh) * 2014-07-18 2017-05-10 浙江大学 一种igbt模块工作结温的在线检测系统及检测方法
CN105572558A (zh) * 2015-12-09 2016-05-11 浙江大学 一种功率二极管模块工作结温的在线检测系统及其检测方法
CN105718694B (zh) * 2016-01-28 2019-02-19 重庆大学 基于igbt结温信息的热网络参数辨识方法
CN107238761A (zh) 2016-03-28 2017-10-10 通用电气公司 开关放大器、梯度放大器及估算开关放大器剩余寿命的方法
CN109669112B (zh) * 2017-10-16 2021-01-22 北京金风科创风电设备有限公司 风机的变流器、igbt模块的结温监测方法和装置
CN111293671B (zh) * 2020-02-07 2021-01-08 山东大学 基于结温预测的功率器件热保护与预警方法及系统
CN112134261B (zh) * 2020-08-27 2024-05-28 上海沪工焊接集团股份有限公司 一种连续过载保护和功率器件降温控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4669025A (en) * 1986-04-21 1987-05-26 Digital Equipment Corporation Semiconductor junction temperature emulator
DE4322650A1 (de) * 1993-07-07 1995-01-12 Siemens Ag Temperatursensor mit einem p-n-Übergang
JPH07135731A (ja) 1993-11-09 1995-05-23 Fuji Electric Co Ltd 半導体素子の過熱保護装置
US5600575A (en) * 1994-10-05 1997-02-04 Anticole; Robert B. Drive protection monitor for motor and amplifier
US5737169A (en) * 1996-02-28 1998-04-07 Eni, A Division Of Astec America, Inc. Intrinsic element sensing integrated SOA protection for power MOSFET switches
GB9614590D0 (en) * 1996-07-11 1996-09-04 Smiths Industries Plc Electrical apparatus
GB2337121B (en) * 1998-05-09 2002-07-31 Motorola Ltd Temperature estimation arrangement and method
JP3585105B2 (ja) * 1999-12-08 2004-11-04 矢崎総業株式会社 過熱保護機能付き半導体装置の制御回路
DE10203577A1 (de) * 2002-01-30 2003-08-21 Siemens Ag Verfahren zum Prognostizieren der Lebensdauer von leistungselektronischen Bauelementen
US6888469B2 (en) * 2003-01-02 2005-05-03 Copley Controls Corporation Method and apparatus for estimating semiconductor junction temperature

Also Published As

Publication number Publication date
EP1583197A2 (fr) 2005-10-05
FI20040462A0 (fi) 2004-03-29
FI20040462A (fi) 2005-09-30
US7176804B2 (en) 2007-02-13
EP1583197A3 (fr) 2011-09-21
EP1583197B1 (fr) 2015-03-18
DK1583197T3 (en) 2015-06-29
US20050212679A1 (en) 2005-09-29

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