ES8505732A1 - Gas distribution system for reactive sputtering - Google Patents

Gas distribution system for reactive sputtering

Info

Publication number
ES8505732A1
ES8505732A1 ES528534A ES528534A ES8505732A1 ES 8505732 A1 ES8505732 A1 ES 8505732A1 ES 528534 A ES528534 A ES 528534A ES 528534 A ES528534 A ES 528534A ES 8505732 A1 ES8505732 A1 ES 8505732A1
Authority
ES
Spain
Prior art keywords
target
reactive
gases
distributor
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES528534A
Other languages
Spanish (es)
Other versions
ES528534A0 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shatterproof Glass Corp
Original Assignee
Shatterproof Glass Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shatterproof Glass Corp filed Critical Shatterproof Glass Corp
Priority to ES528534A priority Critical patent/ES528534A0/en
Publication of ES8505732A1 publication Critical patent/ES8505732A1/en
Publication of ES528534A0 publication Critical patent/ES528534A0/en
Granted legal-status Critical Current

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  • Physical Vapour Deposition (AREA)

Abstract

The system includes a distributor at each side of the cathode for introducing two separate gases into the vacuum chamber between the planar target and the substrates, the distributor comprising a pair of horizontal porous pipes located within a support and outlets in the support through which the gases enter the chamber and by which the gases are directed in divergent directions, one towards the target and the other towards the substrates. - The system is esp. useful in the reactive sputtering of metals or alloys, e.g. Ti or Ta, to produce metal oxide or nitride coatings. The target functions as it would in a non-reactive environment, while the sputtered material is acted on by the reactive gas, along its travel path or at the substrate surface, as it would in a reactive environment. Thus, deposition rates are increased, the required power levels are decreased spiking or arcing is eliminated, gas pulsing to keep the target clean is not required, and the usage of reactive gas is more efficient. (0/7)
ES528534A 1983-12-29 1983-12-29 IMPROVEMENTS IN A GAS DISTRIBUTION SYSTEM FOR SUBLIMATION CATHODES Granted ES528534A0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES528534A ES528534A0 (en) 1983-12-29 1983-12-29 IMPROVEMENTS IN A GAS DISTRIBUTION SYSTEM FOR SUBLIMATION CATHODES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES528534A ES528534A0 (en) 1983-12-29 1983-12-29 IMPROVEMENTS IN A GAS DISTRIBUTION SYSTEM FOR SUBLIMATION CATHODES

Publications (2)

Publication Number Publication Date
ES8505732A1 true ES8505732A1 (en) 1985-06-01
ES528534A0 ES528534A0 (en) 1985-06-01

Family

ID=8486658

Family Applications (1)

Application Number Title Priority Date Filing Date
ES528534A Granted ES528534A0 (en) 1983-12-29 1983-12-29 IMPROVEMENTS IN A GAS DISTRIBUTION SYSTEM FOR SUBLIMATION CATHODES

Country Status (1)

Country Link
ES (1) ES528534A0 (en)

Also Published As

Publication number Publication date
ES528534A0 (en) 1985-06-01

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970203