ES2183733A1 - Flexible heat conductor - Google Patents

Flexible heat conductor

Info

Publication number
ES2183733A1
ES2183733A1 ES200101797A ES200101797A ES2183733A1 ES 2183733 A1 ES2183733 A1 ES 2183733A1 ES 200101797 A ES200101797 A ES 200101797A ES 200101797 A ES200101797 A ES 200101797A ES 2183733 A1 ES2183733 A1 ES 2183733A1
Authority
ES
Spain
Prior art keywords
heat conductor
flexible heat
laminate
overlapped
packet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200101797A
Other languages
Spanish (es)
Other versions
ES2183733B1 (en
Inventor
Candel Tomas Munoz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Instituto Nacional de Tecnica Aeroespacial Esteban Terradas
Original Assignee
Instituto Nacional de Tecnica Aeroespacial Esteban Terradas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Instituto Nacional de Tecnica Aeroespacial Esteban Terradas filed Critical Instituto Nacional de Tecnica Aeroespacial Esteban Terradas
Priority to ES200101797A priority Critical patent/ES2183733B1/en
Publication of ES2183733A1 publication Critical patent/ES2183733A1/en
Application granted granted Critical
Publication of ES2183733B1 publication Critical patent/ES2183733B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

Flexible heat conductor that comprises of a series of equal elongated laminates (1) based on a good heat conducting metal, with reduced thickness that are overlapped in a matching position. Forming a packet (2) that has a curved shape and whose end parts finish in terminals (3) and (4) whose contact surface (7-8) is covered with an indium layer or laminate (9-10).
ES200101797A 2001-07-31 2001-07-31 FLEXIBLE THERMAL DRIVER. Expired - Fee Related ES2183733B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES200101797A ES2183733B1 (en) 2001-07-31 2001-07-31 FLEXIBLE THERMAL DRIVER.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES200101797A ES2183733B1 (en) 2001-07-31 2001-07-31 FLEXIBLE THERMAL DRIVER.

Publications (2)

Publication Number Publication Date
ES2183733A1 true ES2183733A1 (en) 2003-03-16
ES2183733B1 ES2183733B1 (en) 2003-12-16

Family

ID=8498587

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200101797A Expired - Fee Related ES2183733B1 (en) 2001-07-31 2001-07-31 FLEXIBLE THERMAL DRIVER.

Country Status (1)

Country Link
ES (1) ES2183733B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
JPH09159339A (en) * 1995-12-12 1997-06-20 Olympus Optical Co Ltd Device for natural cooling
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
JP2001122672A (en) * 1999-10-20 2001-05-08 Ngk Insulators Ltd Member for heatsink and electronic substrate module for electronic instrument using the same as heatsink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
JPH09159339A (en) * 1995-12-12 1997-06-20 Olympus Optical Co Ltd Device for natural cooling
US6111749A (en) * 1996-09-25 2000-08-29 International Business Machines Corporation Flexible cold plate having a one-piece coolant conduit and method employing same
JP2001122672A (en) * 1999-10-20 2001-05-08 Ngk Insulators Ltd Member for heatsink and electronic substrate module for electronic instrument using the same as heatsink

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
BASE DE DATOS PAJ de JPO; & JP 09159339 A (OLYMPUS OPTICAL CO. LTD.) 20.06.1997, resumen; figura. *
BASE DE DATOS PAJ de JPO; & JP 2001122672 A (NGK INSULATORS LTD.; MITSUBISHI HEAVY IND. LTD.) 08.05.2001, resumen; figura. *

Also Published As

Publication number Publication date
ES2183733B1 (en) 2003-12-16

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