ES2167402T3 - probe card for high temperature applications. - Google Patents
probe card for high temperature applications.Info
- Publication number
- ES2167402T3 ES2167402T3 ES95301714T ES95301714T ES2167402T3 ES 2167402 T3 ES2167402 T3 ES 2167402T3 ES 95301714 T ES95301714 T ES 95301714T ES 95301714 T ES95301714 T ES 95301714T ES 2167402 T3 ES2167402 T3 ES 2167402T3
- Authority
- ES
- Grant status
- Grant
- Patent type
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
Abstract
LA TARJETA DE SONDA ES UNA PARTE QUE ESTA INCORPORADA DENTRO DE UN EQUIPO DE SONDE PARA PROBAR CHIPS IC ACABADOS. PROBE CARD IS A PART THAT IS INCORPORATED IN A PROBE TEAM FINISHES FOR TESTING IC CHIPS. ESTA TARJETA SE MONTA INDIVIDUALIZADAMENTE CON UNA PLURALIDAD DE SONDAS, UNA AGUJA MUY FINA Y GENERALMENTE DOBLADA, Y CADA SONDA ESTA DISPUESTA DE MANERA QUE SU EXTREMO FRONTAL PUEDA APUNTAR A UNA REBORDE DE CHIP IC DE INTERES. THIS CARD IS MOUNTED WITH INDIVIDUALIZADAMENTE a plurality of probes, a very thin and generally BENT NEEDLE PROBE IS WILLING AND EVERY SO CAN YOUR FRONT END FLANGE point to an IC CHIP INTERESTING. AL REALIZAR LA PRUEBA DE SONDEO, UNA CONDICION MUY IMPORTANTE ES MANTENER LA PRESION DE CONTACTO D SONDA SOBRE EL REBORDE DE UN CHIP IC EN UNA POSICION CONSTANTE DURANTE EL TIEMPO DE MEDICION, PERO AL REALIZARLO A ALTA TEMPERATURA, LOS CHIPS IC CALENTADOS RADIAN LA TARJETA DE SONDA Y CON LO CUAL CAUSAN EL DESVIO PROVISIONAL DEL PUNTO DE CONTACTO POR EXPANSION DE CALOR DE LA TARJETA DE SONDA Y ASI PUDE CAMBIARSE LA PRESION DE CONTACTO. TO MAKE THE TEST POLL, a very important condition is to maintain contact pressure D PROBE ON THE FENCE OF A CHIP IC IN A CONSTANT position during the measurement time, but PERFORMED BY HIGH TEMPERATURE, THE CHIPS IC HEATED RADIAN CARD PROBE AND THUS CAUSING THE PROVISIONAL TRAP CONTACT POINT FOR EXPANSION OF HEAT PROBE CARD COULD BE CHANGED AND SO contact pressure. LA TARJETA DE DONDE DE LA INVENCION EMPLEA UN MATERIAL CERAMICO EN LA FABRICACION DE LA TARJETA DE SONDA PARA POSEER UN COEFICIENTE DE EXPANSION MUY BAJO QUE POSEE UN VALOR DE COEFICIENTE EQUIVALENTE AL CHIP IC O PASTILLAS,CON LO QUE SE EVITA EL DESVIO POSICIONAL DEL CONTACTO DE SONDA Y TAN BIEN SE MUESTRAN OTROS DISPOSITIVOS PARA CUBRIR CON DIFICULTADES CAUSADA POR LA REALIZACION A ALTA TEMPERATURA. CARD WHERE of the invention employs a ceramic material in the manufacture CARD PROBE FOR POSSESSING an expansion coefficient VERY LOW TO HAVE A COEFFICIENT EQUAL TO CHIP IC or pastilles, VALUE WITH WHAT Positional DESVIO CONTACT AVOIDED PROBE AND OTHER DEVICES AS WELL TO COVER SHOWN WITH DIFFICULTIES CAUSED BY PERFORMING A HIGH TEMPERATURE.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27844794A JP2632136B2 (en) | 1994-10-17 | 1994-10-17 | High temperature measuring probe card |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2167402T3 true ES2167402T3 (en) | 2002-05-16 |
Family
ID=17597470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95301714T Expired - Lifetime ES2167402T3 (en) | 1994-10-17 | 1995-03-15 | probe card for high temperature applications. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5670889A (en) |
EP (1) | EP0708338B1 (en) |
JP (1) | JP2632136B2 (en) |
KR (1) | KR100188861B1 (en) |
DE (2) | DE69523860D1 (en) |
ES (1) | ES2167402T3 (en) |
Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6525555B1 (en) * | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US7064566B2 (en) * | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US6064213A (en) * | 1993-11-16 | 2000-05-16 | Formfactor, Inc. | Wafer-level burn-in and test |
JP2002509604A (en) * | 1996-05-17 | 2002-03-26 | フォームファクター,インコーポレイテッド | Contact tip structures and a manufacturing method thereof for microelectronic interconnection element |
US5751157A (en) * | 1996-07-22 | 1998-05-12 | Probe Technology | Method and apparatus for aligning probes |
US6603322B1 (en) * | 1996-12-12 | 2003-08-05 | Ggb Industries, Inc. | Probe card for high speed testing |
JP3193659B2 (en) * | 1997-02-25 | 2001-07-30 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | Probing method |
JP3142801B2 (en) * | 1997-09-04 | 2001-03-07 | 松下電器産業株式会社 | A method of inspecting a semiconductor integrated circuit, the probe card and the burn-in board |
JP3616236B2 (en) * | 1997-09-26 | 2005-02-02 | 株式会社ルネサステクノロジ | Probe card and the wafer test method using the same |
US6011405A (en) * | 1997-10-28 | 2000-01-04 | Qualitau, Inc. | Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer |
EP0922960A1 (en) | 1997-12-12 | 1999-06-16 | Padar Tecnologie di Riccioni Roberto S.a.s. | Microcircuit testing device |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6064215A (en) * | 1998-04-08 | 2000-05-16 | Probe Technology, Inc. | High temperature probe card for testing integrated circuits |
US6297657B1 (en) * | 1999-01-11 | 2001-10-02 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6163162A (en) * | 1999-01-11 | 2000-12-19 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
US6420884B1 (en) * | 1999-01-29 | 2002-07-16 | Advantest Corp. | Contact structure formed by photolithography process |
JP4388620B2 (en) * | 1999-04-16 | 2009-12-24 | 株式会社アドバンテスト | Probe card and probe card manufacturing method |
US6196866B1 (en) * | 1999-04-30 | 2001-03-06 | International Business Machines Corporation | Vertical probe housing |
US7382142B2 (en) * | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US6414477B1 (en) * | 1999-06-07 | 2002-07-02 | Applied Precision, Inc. | Method for optimizing probe card analysis and scrub mark analysis data |
US6468098B1 (en) * | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
US6304092B1 (en) * | 2000-01-28 | 2001-10-16 | Credence Systems Corporation | Self-aligning docking assembly for semiconductor tester |
JP3500105B2 (en) * | 2000-02-10 | 2004-02-23 | 日本発条株式会社 | Electrically for conductive contact child support and the contact probe unit |
US6927586B2 (en) * | 2000-03-06 | 2005-08-09 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6566898B2 (en) | 2000-03-06 | 2003-05-20 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6633175B1 (en) | 2000-03-06 | 2003-10-14 | Wenworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6906539B2 (en) * | 2000-07-19 | 2005-06-14 | Texas Instruments Incorporated | High density, area array probe card apparatus |
US6462568B1 (en) * | 2000-08-31 | 2002-10-08 | Micron Technology, Inc. | Conductive polymer contact system and test method for semiconductor components |
US6462569B2 (en) * | 2001-02-20 | 2002-10-08 | Andy Chen | Probe card |
JP2002267687A (en) * | 2001-03-12 | 2002-09-18 | Advantest Corp | Probe card and test device |
US7396236B2 (en) | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
US6856150B2 (en) | 2001-04-10 | 2005-02-15 | Formfactor, Inc. | Probe card with coplanar daughter card |
US20030234660A1 (en) * | 2002-06-24 | 2003-12-25 | Jain Sunil K. | Direct landing technology for wafer probe |
KR100470970B1 (en) * | 2002-07-05 | 2005-03-10 | 삼성전자주식회사 | Probe needle fixing apparatus and method for semiconductor device test equipment |
US7474113B2 (en) * | 2002-10-25 | 2009-01-06 | Intel Corporation | Flexible head probe for sort interface units |
US6943546B2 (en) * | 2003-04-17 | 2005-09-13 | Infinitum Solutions, Inc. | Magnetoresistive element lifecycle tester |
US7230420B2 (en) | 2003-04-17 | 2007-06-12 | Infinitum Solutions, Inc. | Magnetoresistive element lifecycle tester with temperature control |
US7053638B2 (en) * | 2004-05-14 | 2006-05-30 | Via Technologies Inc. | Surrounding structure for a probe card |
KR100610266B1 (en) * | 2004-07-28 | 2006-08-08 | 주식회사 좋은기술 | Wafer having thermal circuit and its power supplier |
US7167010B2 (en) * | 2004-09-02 | 2007-01-23 | Micron Technology, Inc. | Pin-in elastomer electrical contactor and methods and processes for making and using the same |
JP4171513B2 (en) | 2005-06-27 | 2008-10-22 | 株式会社アドバンテスト | Contactors, the contact structure, a probe card with the contactor, and the test device |
US20070089551A1 (en) * | 2005-09-30 | 2007-04-26 | Sv Probe Ptd. Ltd. | Cantilever probe structure for a probe card assembly |
KR100723206B1 (en) | 2005-12-29 | 2007-05-22 | 삼성전기주식회사 | Probe card comprising pcb for connecting needle |
US20080036483A1 (en) * | 2006-08-08 | 2008-02-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Probe card for flip chip testing |
US20080122469A1 (en) * | 2006-11-28 | 2008-05-29 | Visera Technologies, Company Ltd. | Probe card for testing image-sensing chips |
WO2008070673A3 (en) * | 2006-12-04 | 2008-10-09 | Nanonexus Inc | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
KR100843224B1 (en) * | 2007-01-04 | 2008-07-02 | 삼성전자주식회사 | Probe card for testing wafer |
JP2008180716A (en) * | 2007-01-23 | 2008-08-07 | Nictech Co Ltd | Probe, and probe card therewith |
US8305098B2 (en) * | 2007-04-26 | 2012-11-06 | Advantest (Singapore) Pte Ltd | Element usable with the method, and a standalone probe card tester formable using the method |
KR100867330B1 (en) * | 2007-06-15 | 2008-11-06 | 주식회사 엔아이씨테크 | Probe assembly for probe card |
JP2008309786A (en) * | 2007-06-15 | 2008-12-25 | Nictech Co Ltd | Probe, probe assembly, and probe card including same |
US8330481B2 (en) * | 2007-07-02 | 2012-12-11 | Jae Ha Lee | Probe assembly and manufacturing method thereof |
US7888955B2 (en) | 2007-09-25 | 2011-02-15 | Formfactor, Inc. | Method and apparatus for testing devices using serially controlled resources |
US7977959B2 (en) | 2007-09-27 | 2011-07-12 | Formfactor, Inc. | Method and apparatus for testing devices using serially controlled intelligent switches |
US7816930B2 (en) * | 2007-10-12 | 2010-10-19 | On Semiconductor | High temperature range electrical circuit testing |
US20090164931A1 (en) * | 2007-12-19 | 2009-06-25 | Formfactor, Inc. | Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System |
US20090224793A1 (en) * | 2008-03-07 | 2009-09-10 | Formfactor, Inc. | Method And Apparatus For Designing A Custom Test System |
US8122309B2 (en) | 2008-03-11 | 2012-02-21 | Formfactor, Inc. | Method and apparatus for processing failures during semiconductor device testing |
US7629803B1 (en) | 2008-06-19 | 2009-12-08 | King Yuan Electronics Co., Ltd | Probe card assembly and test probes therein |
US7710134B2 (en) * | 2008-06-19 | 2010-05-04 | King Yuan Electronics Co., Ltd | Probe card assembly |
US8095841B2 (en) | 2008-08-19 | 2012-01-10 | Formfactor, Inc. | Method and apparatus for testing semiconductor devices with autonomous expected value generation |
US7944225B2 (en) | 2008-09-26 | 2011-05-17 | Formfactor, Inc. | Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test |
US7786744B2 (en) * | 2008-11-04 | 2010-08-31 | King Yuan Electronics Co., Ltd. | Probe card assembly and test probes therein |
US9059240B2 (en) | 2012-06-05 | 2015-06-16 | International Business Machines Corporation | Fixture for shaping a laminate substrate |
CN103543298B (en) * | 2012-07-13 | 2016-03-23 | 旺矽科技股份有限公司 | Probe holding structure and optical detection means |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3984620A (en) * | 1975-06-04 | 1976-10-05 | Raytheon Company | Integrated circuit chip test and assembly package |
US4161692A (en) * | 1977-07-18 | 1979-07-17 | Cerprobe Corporation | Probe device for integrated circuit wafers |
US4523144A (en) * | 1980-05-27 | 1985-06-11 | Japan Electronic Materials Corp. | Complex probe card for testing a semiconductor wafer |
JPS5929151B2 (en) * | 1981-08-03 | 1984-07-18 | Nippon Denshi Zairyo Kk | |
US4719417A (en) * | 1983-05-03 | 1988-01-12 | Wentworth Laboratories, Inc. | Multi-level test probe assembly for IC chips |
GB8512916D0 (en) * | 1985-05-22 | 1985-06-26 | Horgan M F | Probe cards |
US5134365A (en) * | 1989-07-11 | 1992-07-28 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
JP3038859B2 (en) * | 1989-09-29 | 2000-05-08 | ジェイエスアール株式会社 | Anisotropic conductive sheet |
JPH06140484A (en) * | 1992-10-28 | 1994-05-20 | Nippon Telegr & Teleph Corp <Ntt> | Probe card |
Also Published As
Publication number | Publication date | Type |
---|---|---|
EP0708338A2 (en) | 1996-04-24 | application |
EP0708338B1 (en) | 2001-11-14 | grant |
KR960014942A (en) | 1996-05-22 | application |
KR100188861B1 (en) | 1999-06-01 | grant |
JPH08114625A (en) | 1996-05-07 | application |
JP2632136B2 (en) | 1997-07-23 | grant |
EP0708338A3 (en) | 1996-07-31 | application |
US5670889A (en) | 1997-09-23 | grant |
DE69523860T2 (en) | 2002-08-29 | grant |
DE69523860D1 (en) | 2001-12-20 | grant |
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