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ES2167402T3 - probe card for high temperature applications. - Google Patents

probe card for high temperature applications.

Info

Publication number
ES2167402T3
ES2167402T3 ES95301714T ES95301714T ES2167402T3 ES 2167402 T3 ES2167402 T3 ES 2167402T3 ES 95301714 T ES95301714 T ES 95301714T ES 95301714 T ES95301714 T ES 95301714T ES 2167402 T3 ES2167402 T3 ES 2167402T3
Authority
ES
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95301714T
Other languages
Spanish (es)
Inventor
Masao Okubo
Nobuyuki Murakami
Kouji Katahira
Hiroshi Iwata
Kazumasa Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Denshizairyo KK
Original Assignee
Nihon Denshizairyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing

Abstract

LA TARJETA DE SONDA ES UNA PARTE QUE ESTA INCORPORADA DENTRO DE UN EQUIPO DE SONDE PARA PROBAR CHIPS IC ACABADOS. PROBE CARD IS A PART THAT IS INCORPORATED IN A PROBE TEAM FINISHES FOR TESTING IC CHIPS. ESTA TARJETA SE MONTA INDIVIDUALIZADAMENTE CON UNA PLURALIDAD DE SONDAS, UNA AGUJA MUY FINA Y GENERALMENTE DOBLADA, Y CADA SONDA ESTA DISPUESTA DE MANERA QUE SU EXTREMO FRONTAL PUEDA APUNTAR A UNA REBORDE DE CHIP IC DE INTERES. THIS CARD IS MOUNTED WITH INDIVIDUALIZADAMENTE a plurality of probes, a very thin and generally BENT NEEDLE PROBE IS WILLING AND EVERY SO CAN YOUR FRONT END FLANGE point to an IC CHIP INTERESTING. AL REALIZAR LA PRUEBA DE SONDEO, UNA CONDICION MUY IMPORTANTE ES MANTENER LA PRESION DE CONTACTO D SONDA SOBRE EL REBORDE DE UN CHIP IC EN UNA POSICION CONSTANTE DURANTE EL TIEMPO DE MEDICION, PERO AL REALIZARLO A ALTA TEMPERATURA, LOS CHIPS IC CALENTADOS RADIAN LA TARJETA DE SONDA Y CON LO CUAL CAUSAN EL DESVIO PROVISIONAL DEL PUNTO DE CONTACTO POR EXPANSION DE CALOR DE LA TARJETA DE SONDA Y ASI PUDE CAMBIARSE LA PRESION DE CONTACTO. TO MAKE THE TEST POLL, a very important condition is to maintain contact pressure D PROBE ON THE FENCE OF A CHIP IC IN A CONSTANT position during the measurement time, but PERFORMED BY HIGH TEMPERATURE, THE CHIPS IC HEATED RADIAN CARD PROBE AND THUS CAUSING THE PROVISIONAL TRAP CONTACT POINT FOR EXPANSION OF HEAT PROBE CARD COULD BE CHANGED AND SO contact pressure. LA TARJETA DE DONDE DE LA INVENCION EMPLEA UN MATERIAL CERAMICO EN LA FABRICACION DE LA TARJETA DE SONDA PARA POSEER UN COEFICIENTE DE EXPANSION MUY BAJO QUE POSEE UN VALOR DE COEFICIENTE EQUIVALENTE AL CHIP IC O PASTILLAS,CON LO QUE SE EVITA EL DESVIO POSICIONAL DEL CONTACTO DE SONDA Y TAN BIEN SE MUESTRAN OTROS DISPOSITIVOS PARA CUBRIR CON DIFICULTADES CAUSADA POR LA REALIZACION A ALTA TEMPERATURA. CARD WHERE of the invention employs a ceramic material in the manufacture CARD PROBE FOR POSSESSING an expansion coefficient VERY LOW TO HAVE A COEFFICIENT EQUAL TO CHIP IC or pastilles, VALUE WITH WHAT Positional DESVIO CONTACT AVOIDED PROBE AND OTHER DEVICES AS WELL TO COVER SHOWN WITH DIFFICULTIES CAUSED BY PERFORMING A HIGH TEMPERATURE.
ES95301714T 1994-10-17 1995-03-15 probe card for high temperature applications. Expired - Lifetime ES2167402T3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27844794A JP2632136B2 (en) 1994-10-17 1994-10-17 High temperature measuring probe card

Publications (1)

Publication Number Publication Date
ES2167402T3 true ES2167402T3 (en) 2002-05-16

Family

ID=17597470

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95301714T Expired - Lifetime ES2167402T3 (en) 1994-10-17 1995-03-15 probe card for high temperature applications.

Country Status (6)

Country Link
US (1) US5670889A (en)
EP (1) EP0708338B1 (en)
JP (1) JP2632136B2 (en)
KR (1) KR100188861B1 (en)
DE (2) DE69523860D1 (en)
ES (1) ES2167402T3 (en)

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US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
JP2002509604A (en) * 1996-05-17 2002-03-26 フォームファクター，インコーポレイテッド Contact tip structures and a manufacturing method thereof for microelectronic interconnection element
US5751157A (en) * 1996-07-22 1998-05-12 Probe Technology Method and apparatus for aligning probes
US6603322B1 (en) * 1996-12-12 2003-08-05 Ggb Industries, Inc. Probe card for high speed testing
JP3193659B2 (en) * 1997-02-25 2001-07-30 インターナショナル・ビジネス・マシーンズ・コーポレ−ション Probing method
JP3142801B2 (en) * 1997-09-04 2001-03-07 松下電器産業株式会社 A method of inspecting a semiconductor integrated circuit, the probe card and the burn-in board
JP3616236B2 (en) * 1997-09-26 2005-02-02 株式会社ルネサステクノロジ Probe card and the wafer test method using the same
US6011405A (en) * 1997-10-28 2000-01-04 Qualitau, Inc. Apparatus and method for probing multiple integrated circuit dice in a semiconductor wafer
EP0922960A1 (en) 1997-12-12 1999-06-16 Padar Tecnologie di Riccioni Roberto S.a.s. Microcircuit testing device
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6064215A (en) * 1998-04-08 2000-05-16 Probe Technology, Inc. High temperature probe card for testing integrated circuits
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6163162A (en) * 1999-01-11 2000-12-19 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
US6420884B1 (en) * 1999-01-29 2002-07-16 Advantest Corp. Contact structure formed by photolithography process
JP4388620B2 (en) * 1999-04-16 2009-12-24 株式会社アドバンテスト Probe card and probe card manufacturing method
US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6414477B1 (en) * 1999-06-07 2002-07-02 Applied Precision, Inc. Method for optimizing probe card analysis and scrub mark analysis data
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US6304092B1 (en) * 2000-01-28 2001-10-16 Credence Systems Corporation Self-aligning docking assembly for semiconductor tester
JP3500105B2 (en) * 2000-02-10 2004-02-23 日本発条株式会社 Electrically for conductive contact child support and the contact probe unit
US6927586B2 (en) * 2000-03-06 2005-08-09 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6566898B2 (en) 2000-03-06 2003-05-20 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6633175B1 (en) 2000-03-06 2003-10-14 Wenworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6906539B2 (en) * 2000-07-19 2005-06-14 Texas Instruments Incorporated High density, area array probe card apparatus
US6462568B1 (en) * 2000-08-31 2002-10-08 Micron Technology, Inc. Conductive polymer contact system and test method for semiconductor components
US6462569B2 (en) * 2001-02-20 2002-10-08 Andy Chen Probe card
JP2002267687A (en) * 2001-03-12 2002-09-18 Advantest Corp Probe card and test device
US7396236B2 (en) 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
US6856150B2 (en) 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
US20030234660A1 (en) * 2002-06-24 2003-12-25 Jain Sunil K. Direct landing technology for wafer probe
KR100470970B1 (en) * 2002-07-05 2005-03-10 삼성전자주식회사 Probe needle fixing apparatus and method for semiconductor device test equipment
US7474113B2 (en) * 2002-10-25 2009-01-06 Intel Corporation Flexible head probe for sort interface units
US6943546B2 (en) * 2003-04-17 2005-09-13 Infinitum Solutions, Inc. Magnetoresistive element lifecycle tester
US7230420B2 (en) 2003-04-17 2007-06-12 Infinitum Solutions, Inc. Magnetoresistive element lifecycle tester with temperature control
US7053638B2 (en) * 2004-05-14 2006-05-30 Via Technologies Inc. Surrounding structure for a probe card
KR100610266B1 (en) * 2004-07-28 2006-08-08 주식회사 좋은기술 Wafer having thermal circuit and its power supplier
US7167010B2 (en) * 2004-09-02 2007-01-23 Micron Technology, Inc. Pin-in elastomer electrical contactor and methods and processes for making and using the same
JP4171513B2 (en) 2005-06-27 2008-10-22 株式会社アドバンテスト Contactors, the contact structure, a probe card with the contactor, and the test device
US20070089551A1 (en) * 2005-09-30 2007-04-26 Sv Probe Ptd. Ltd. Cantilever probe structure for a probe card assembly
KR100723206B1 (en) 2005-12-29 2007-05-22 삼성전기주식회사 Probe card comprising pcb for connecting needle
US20080036483A1 (en) * 2006-08-08 2008-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card for flip chip testing
US20080122469A1 (en) * 2006-11-28 2008-05-29 Visera Technologies, Company Ltd. Probe card for testing image-sensing chips
WO2008070673A3 (en) * 2006-12-04 2008-10-09 Nanonexus Inc Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
KR100843224B1 (en) * 2007-01-04 2008-07-02 삼성전자주식회사 Probe card for testing wafer
JP2008180716A (en) * 2007-01-23 2008-08-07 Nictech Co Ltd Probe, and probe card therewith
US8305098B2 (en) * 2007-04-26 2012-11-06 Advantest (Singapore) Pte Ltd Element usable with the method, and a standalone probe card tester formable using the method
KR100867330B1 (en) * 2007-06-15 2008-11-06 주식회사 엔아이씨테크 Probe assembly for probe card
JP2008309786A (en) * 2007-06-15 2008-12-25 Nictech Co Ltd Probe, probe assembly, and probe card including same
US8330481B2 (en) * 2007-07-02 2012-12-11 Jae Ha Lee Probe assembly and manufacturing method thereof
US7888955B2 (en) 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US7816930B2 (en) * 2007-10-12 2010-10-19 On Semiconductor High temperature range electrical circuit testing
US20090164931A1 (en) * 2007-12-19 2009-06-25 Formfactor, Inc. Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
US7629803B1 (en) 2008-06-19 2009-12-08 King Yuan Electronics Co., Ltd Probe card assembly and test probes therein
US7710134B2 (en) * 2008-06-19 2010-05-04 King Yuan Electronics Co., Ltd Probe card assembly
US8095841B2 (en) 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US7786744B2 (en) * 2008-11-04 2010-08-31 King Yuan Electronics Co., Ltd. Probe card assembly and test probes therein
US9059240B2 (en) 2012-06-05 2015-06-16 International Business Machines Corporation Fixture for shaping a laminate substrate
CN103543298B (en) * 2012-07-13 2016-03-23 旺矽科技股份有限公司 Probe holding structure and optical detection means

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Also Published As

Publication number Publication date Type
EP0708338A2 (en) 1996-04-24 application
EP0708338B1 (en) 2001-11-14 grant
KR960014942A (en) 1996-05-22 application
KR100188861B1 (en) 1999-06-01 grant
JPH08114625A (en) 1996-05-07 application
JP2632136B2 (en) 1997-07-23 grant
EP0708338A3 (en) 1996-07-31 application
US5670889A (en) 1997-09-23 grant
DE69523860T2 (en) 2002-08-29 grant
DE69523860D1 (en) 2001-12-20 grant

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