ES209005A1 - Un método de soldar circuitos impresos - Google Patents
Un método de soldar circuitos impresosInfo
- Publication number
- ES209005A1 ES209005A1 ES0209005A ES209005A ES209005A1 ES 209005 A1 ES209005 A1 ES 209005A1 ES 0209005 A ES0209005 A ES 0209005A ES 209005 A ES209005 A ES 209005A ES 209005 A1 ES209005 A1 ES 209005A1
- Authority
- ES
- Spain
- Prior art keywords
- solder
- conductors
- bath
- floating
- submerging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0684—Solder baths with dipping means with means for oscillating the workpiece
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/046—Vibration
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/939—Molten or fused coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49885—Assembling or joining with coating before or during assembling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Método de soldar un conjunto de conductores eléctricos dispuestos sobre una superficie de una baja de material aislante que comprende sumergir dicha superficie y y dichos conductores en un baño de soldadura fundida y sacarles de dicho baño con lo que los conductores quedan cubiertos con soldadura pero con exceso de soldadura adherida entre dichos conductores a dicha superficie aislante sumergir después dicha superficie y dichos conductores en un segundo baño de soldadura fundida que tiene flotando sobre la misma una capa de material líquido relativamente inerte y mantener dicho conjunto con dichas estructuras para abajo sustancialmente en la cara mutua entre dicho segundo baño de soldadura y dicha capa flotante mientras se hace contacto repetido entre la soldadura adherida a dicha superficie aislante y la soldadura fundida en dicho segundo baño hasta que se haya quitado dicho exceso de soldadura en medida suficiente para evitar el corto-circuitado no deseado entre los conductores sacar dicho conjunto de dicha caja flotante.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US289768A US2671264A (en) | 1952-05-24 | 1952-05-24 | Method of soldering printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
ES209005A1 true ES209005A1 (es) | 1953-11-16 |
Family
ID=23112997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES0209005A Expired ES209005A1 (es) | 1952-05-24 | 1953-04-28 | Un método de soldar circuitos impresos |
Country Status (2)
Country | Link |
---|---|
US (1) | US2671264A (es) |
ES (1) | ES209005A1 (es) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2942332A (en) * | 1953-01-12 | 1960-06-28 | Int Standard Electric Corp | Mounting arrangements for components of electrical circuits |
US2740193A (en) * | 1953-07-01 | 1956-04-03 | Rca Corp | Method of soldering printed circuits |
US2885601A (en) * | 1954-05-28 | 1959-05-05 | Rca Corp | Insulation of printed circuits |
BE539366A (es) * | 1954-06-29 | |||
US2918028A (en) * | 1954-12-31 | 1959-12-22 | Rca Corp | Apparatus for soldering printed circuits |
DE1001736B (de) * | 1955-03-24 | 1957-01-31 | Telefunken Gmbh | Gedruckte Schaltung fuer Geraete der Nachrichtentechnik, vorzugsweise Rundfunkgeraete |
US2927251A (en) * | 1955-04-28 | 1960-03-01 | Burroughs Corp | Arrangement and method for connecting electrical circuit elements |
US3002481A (en) * | 1955-05-31 | 1961-10-03 | Hughes Aircraft Co | Electrical component mounting device |
US2962801A (en) * | 1955-06-14 | 1960-12-06 | Pye Ltd | Method of making electric circuits |
US2875717A (en) * | 1955-08-23 | 1959-03-03 | Jefferson Electronic Products | Dip soldering machine |
US2803216A (en) * | 1956-05-02 | 1957-08-20 | Itt | Apparatus for printed-circuit solder coating |
US3058441A (en) * | 1956-10-02 | 1962-10-16 | Sanders Associates Inc | Soldering apparatus and method of soldering electrical conductors |
US3053215A (en) * | 1956-12-03 | 1962-09-11 | Rca Corp | Apparatus for soldering printed sheets |
US2865093A (en) * | 1957-05-20 | 1958-12-23 | Gen Electric | Method of silver dip soldering |
US3092059A (en) * | 1958-01-20 | 1963-06-04 | Motorola Inc | Assembly apparatus |
NL241323A (es) * | 1958-07-17 | 1900-01-01 | ||
US3060402A (en) * | 1959-06-01 | 1962-10-23 | Malco Mfg Co | Solder well terminal |
US3065524A (en) * | 1959-08-31 | 1962-11-27 | Lenkurt Electric Co Inc | Method of interconnecting electrical apparatus |
US3056372A (en) * | 1960-05-23 | 1962-10-02 | Western Electric Co | Soldering machine |
US3184303A (en) * | 1960-10-31 | 1965-05-18 | Ibm | Superconductive solder |
US3146141A (en) * | 1961-10-26 | 1964-08-25 | Dow Chemical Co | Method and apparatus for employing radio frequency and ultrasonic oscillatory energyin uniting thermoplastic materials |
US3277566A (en) * | 1963-03-19 | 1966-10-11 | Western Electric Co | Methods of and apparatus for metalcoating articles |
US4045862A (en) * | 1973-01-10 | 1977-09-06 | P. R. Mallory & Co., Inc. | Electronic component and method |
US3995584A (en) * | 1976-02-27 | 1976-12-07 | General Electric Company | Portable ultrasonic soldering pot |
US4332343A (en) * | 1978-09-20 | 1982-06-01 | International Business Machines Corporation | Process for in-situ modification of solder comopsition |
DE3111809C2 (de) * | 1981-03-25 | 1985-05-15 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
US4619841A (en) * | 1982-09-13 | 1986-10-28 | Schwerin Thomas E | Solder leveler |
US4776508A (en) * | 1985-06-28 | 1988-10-11 | Unit Design Inc. | Electronic component lead tinning device |
US4637541A (en) * | 1985-06-28 | 1987-01-20 | Unit Industries, Inc. | Circuit board soldering device |
US4769083A (en) * | 1986-01-27 | 1988-09-06 | Gould Inc. | Method for removing excess solder from printed circuit boards |
US5130164A (en) * | 1989-04-28 | 1992-07-14 | United Technologies Corporation | Solder-coating method |
US5052612A (en) * | 1989-08-24 | 1991-10-01 | E. I. Du Pont De Nemours And Company | Process for soldering allowing low ionic contamination without cleaning operation |
US5711473A (en) * | 1995-12-22 | 1998-01-27 | Sund; William | Inert atmosphere soldering apparatus |
EP1655389A4 (en) * | 2003-07-23 | 2008-10-15 | Fujikura Ltd | METAL LOADING PROCESS AND DEVICE |
CN107511555B (zh) * | 2017-08-22 | 2020-04-21 | 东莞市蓉工自动化科技有限公司 | 一种全自动化电子线圈浸锡机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1719512A (en) * | 1926-11-08 | 1929-07-02 | Ottmar M Krembs | Dip brazing |
US1837962A (en) * | 1928-07-03 | 1931-12-22 | Gen Electric | Manufacture of electrical apparatus |
US2161556A (en) * | 1937-11-11 | 1939-06-06 | Nat Lead Co | Dip-soldering |
US2426650A (en) * | 1943-12-27 | 1947-09-02 | Bell Telephone Labor Inc | Method of soldering a terminal to a piezoelectric crystal |
US2607821A (en) * | 1949-02-05 | 1952-08-19 | Erie Resistor Corp | Electric circuit assembly |
-
1952
- 1952-05-24 US US289768A patent/US2671264A/en not_active Expired - Lifetime
-
1953
- 1953-04-28 ES ES0209005A patent/ES209005A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US2671264A (en) | 1954-03-09 |
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