ES2011037B3 - Procedimiento para fabricar estratificados de poliimida y metal. - Google Patents

Procedimiento para fabricar estratificados de poliimida y metal.

Info

Publication number
ES2011037B3
ES2011037B3 ES87106980T ES87106980T ES2011037B3 ES 2011037 B3 ES2011037 B3 ES 2011037B3 ES 87106980 T ES87106980 T ES 87106980T ES 87106980 T ES87106980 T ES 87106980T ES 2011037 B3 ES2011037 B3 ES 2011037B3
Authority
ES
Spain
Prior art keywords
layer
metal
polyimide
solution
stratificates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES87106980T
Other languages
English (en)
Inventor
Volker Benz
Ernst F Kundinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo NV
Original Assignee
Akzo NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo NV filed Critical Akzo NV
Application granted granted Critical
Publication of ES2011037B3 publication Critical patent/ES2011037B3/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

SE DESCRIBE UN PROCEDIMIENTO PARA PREPARAR LAMINADO DE METAL Y POLIAMIDA. SE APLICA UNA SOLUCION O ETPA PREVIA DE POLIAMIDAS EN UNA SUPERFICIE METALICA DE LOS SOPORTES. A CONTINUACION SE TRANFORMAN LOS POLIAMIDAS APLICADAS. EL SOPORTE CONSISTE EN DOS CAPAS LINDANTES DE MATERIAL DIFERENTE UNA DE LAS CUALES ES METALICA. PARA LA TRANSFORMACION DE LAS POLIAMIDAS SE ELIMINA LA CAPA DE LOS SOPORTES APARTADA DE LA CAPA DE POLIAMIDA. CON ESTE PROCEDIMIENTO ES POSIBLE PREPARAR LAMINADO CON PEQUEÑO GROSOR. POR ESTO SE DEJA DE PREPARA EL LAMINADO MULTIPLE. EL LAMINADO ES APROPIADO ENTRE OTROS PARA CIRCUITO DE CONTROL DE PRESION.
ES87106980T 1986-06-19 1987-05-14 Procedimiento para fabricar estratificados de poliimida y metal. Expired ES2011037B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863620601 DE3620601A1 (de) 1986-06-19 1986-06-19 Verfahren zur herstellung von polyimid-metall-laminaten

Publications (1)

Publication Number Publication Date
ES2011037B3 true ES2011037B3 (es) 1989-12-16

Family

ID=6303292

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87106980T Expired ES2011037B3 (es) 1986-06-19 1987-05-14 Procedimiento para fabricar estratificados de poliimida y metal.

Country Status (6)

Country Link
EP (1) EP0249744B1 (es)
JP (1) JPS62299338A (es)
AT (1) ATE47050T1 (es)
DE (2) DE3620601A1 (es)
DK (1) DK299387A (es)
ES (1) ES2011037B3 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
JPH0693537B2 (ja) * 1989-09-19 1994-11-16 新日鐵化学株式会社 両面導体ポリイミド積層体の製造方法
JPH07102661B2 (ja) * 1989-12-08 1995-11-08 宇部興産株式会社 多層押出ポリイミドフィルムの製法
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
JPH04239637A (ja) * 1991-01-23 1992-08-27 Chisso Corp 可撓性両面金属張基板及びその製造方法
DE4223887A1 (de) * 1992-07-21 1994-01-27 Basf Ag Verfahren zur Herstellung eines Polymer/Metall- oder Polymer/Halbleiter-Verbundes
AU2105300A (en) * 1999-01-14 2000-08-01 Hans-Jurgen Schafer Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
JP2003145674A (ja) 2001-11-08 2003-05-20 Learonal Japan Inc 樹脂複合材料の形成方法
ES2955049T3 (es) * 2017-11-17 2023-11-28 Imerys Usa Inc Recubrimientos de sellado térmico

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1160381A (fr) * 1955-09-15 1958-07-15 Hunt Capacitors Ltd A Procédé pour fabriquer des condensateurs électriques
FR1160380A (fr) * 1955-09-15 1958-07-15 Hunt Capacitors Ltd A Perfectionnements aux condensateurs
GB841473A (en) * 1955-09-15 1960-07-13 Hunt Capacitors Ltd A Improvements in or relating to electrical capacitors
USRE29820E (en) * 1971-08-30 1978-10-31 Perstorp, Ab Method for the production of material for printed circuits
DE2264956C2 (de) * 1971-08-30 1984-03-08 Perstorp AB, 28400 Perstorp Vormaterial für gedruckte Schaltungen
GB1423952A (en) * 1973-06-26 1976-02-04 Oike & Co Process for preparing a metallized resin film for condenser element
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
DE3301197A1 (de) * 1983-01-15 1984-07-19 Akzo Gmbh, 5600 Wuppertal Polyimid-laminate mit hoher schaelfestigkeit
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法
DE3424232A1 (de) * 1984-06-30 1986-01-23 Akzo Gmbh, 5600 Wuppertal Flexible polyimid-mehrschicht-laminate
US4650545A (en) * 1985-02-19 1987-03-17 Tektronix, Inc. Polyimide embedded conductor process

Also Published As

Publication number Publication date
ATE47050T1 (de) 1989-10-15
DK299387A (da) 1987-12-20
EP0249744A1 (de) 1987-12-23
EP0249744B1 (de) 1989-10-11
DE3620601A1 (de) 1987-12-23
DE3760708D1 (en) 1989-11-16
JPS62299338A (ja) 1987-12-26
DK299387D0 (da) 1987-06-12

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