EP4736580A1 - Led luminance tuning to adjust illumination distribution - Google Patents

Abstract

A light emitting diode (LED) array, illumination device, and method of operating the LED array are described. The illumination device includes the LED array with LEDs. Drivers drive different sets of the LEDs. Each driver drives the LEDs of an associated set in parallel to produce light. The light from at least one of the LEDs has a different radiance from the light from at least one other of the LEDs. A processor controls the drivers to drive the sets of LEDs via driver channels to achieve a targeted illumination from the LED array. The radiance is varied using different reflectors, tile resistances, and/or eVias having different diameters and/or spatial densities.

Description

LED LUMINANCE TUNING TO ADJUST ILLUMINATION DISTRIBUTION

PRIORITY CLAIM

[0001] This application claims the benefit of priority to United States Provisional Patent Application Serial No. 63/523,459, filed June 27, 2023, which is incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

[0002] The present disclosure relates to light emitting diode (LED) arrays. In particular, embodiments are directed to adjusting illumination provided by LED arrays.

BACKGROUND OF THE DISCLOSURE

[0003] LED arrays are used in a wide variety of applications. In certain applications, the distribution of the illumination from the LED arrays is of little importance. In other embodiments, such as illumination for used to obtain images, it may be desirable to provide illumination having a predetermined distribution. Attaining a desired distribution may be dependent on a number of factors, including limitations on components within the device providing the illumination.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] FIG. 1 shows an example illumination apparatus, in accordance with some examples.

[0005] FIG. 2 illustrates an example of a general device in accordance with some embodiments.

[0006] FIG. 3 illustrates an example LED array, in accordance with some examples.

[0007] FIG. 4A illustrates a cross-section of an LED in an LED array, in accordance with some examples. [0008] FIG. 4B illustrates a cross-section of another LED in an LED array, in accordance with some examples.

[0009] FIG. 4C illustrates a cross-section of another LED in an LED array, in accordance with some examples.

[0010] FIG. 5 illustrates a cross-sectional view of a single-die package architecture, in accordance with some examples.

[0011] FIGS. 6A and 6B illustrate illumination without and with flux compensation in accordance with some embodiments.

[0012] FIG. 7 illustrates an example lighting system, according to some embodiments.

[0013] FIG. 8 illustrates an example lighting device, according to some embodiments.

[0014] FIG. 9 shows a block diagram of an example of a system, according to some embodiments.

[0015] FIG. 10 illustrates an example method of fabricating an illumination device, according to some embodiments.

[0016] FIG. 11 illustrates a top plan view of an example array suitable for implementing embodiments described herein.

DETAILED DESCRIPTION

[0017] The illumination distribution of segmented LEDs may be controlled in various ways. Illumination as used herein may include visible illumination, infrared illumination, and/or ultraviolet (UV) illumination, and may be used in a variety of applications, for example in time-of-flight applications or for adaptive UV for industrial UV curing. In particular, adaptive flash may use segmented LEDs and a near-imaging lens to control the illuminance distribution of a target area (“scene”); that is, segmented emitters with one or more optical elements may be used to realize steerable illumination (either with or without mechanically adjusting the position of the segmented LEDs). By selectively illuminating specific segments, the scene is also selectively illuminated in those areas corresponding to the activated segments. Ideally, the current of each segment is individually set; individual segments can be switched on or off or tuned with different currents between segments such that the scene is illuminated selectively, with an illumination distribution proportional to the applied current density distribution.

[0018] However, as the number of segments of the emitter increases (i.e., the higher the resolution of the MxN matrix forming the emitter), the greater the number of channels used for the driver(s). Moreover, hardware (and perhaps spatial) limitations may exist that limit increasing the number of drivers, limiting the number of channels to significantly fewer than the MxN elements, e.g., (N+l)/2 in some embodiments. A large number of current drivers (MxN) may result in an integration of the driver with the emitter. If, however, integration does not occur, choices for tunability may be employed. Such choices may result in, for example, only a variable beam collimation being implemented. In this case, several segments may be grouped together and fewer than one current source used per segment. In the above MxN rectangular array for example, the center segment may be driven by a first channel, adjacent segments may be driven together as a ring for a second channel, and similarly continuing outwards, groups of segments forming rings of driven together. Each channel thus drives the segments grouped together in parallel (which may be, as above, concentric rings around a center pixel), with the flux density per segment being equal to the current density and the segments of the channel emitting close to or substantially equal brightness or radiance.

[0019] In addition to the tunability, the shape of the target area may be taken into account. For adaptive flash applications, the array may be incorporated in a camera that also contains one or more sensor chips (which each may contain one or more sensors). The sensor chip of the camera may, in general, be rectangular. The segmented emitter, as above, may be rectangular to copy the sensor symmetry and allow the use of rotationally symmetric optical element(s). However, due to geometric differences, the illumination of the ring channels, especially for rectangular emitters, may not be uniform; instead of providing a ring of equal illumination, a ring having bright spots may result. This may result in unequal illumination of the scene instead of a desired substantially uniform illumination.

[0020] Consequently, while the current may be effectively distributed within a group of segments proportionally within the die area, such a distribution may not result in a preferred illuminance distribution. To enhance the illuminance distribution, the current flow may be tuned within the die independently of the segment area, and the flux may be adjusted within each group of segments. That is, the illumination distribution of arrays of segmented LEDs that have a limited number of drivers may be controlled by selecting segments to be driven by each driver through a different channel that drives the segment in parallel; the driving may be used in conjunction with providing additional internal and/or external changes to achieve substantially uniform illumination. This may significantly improve the illuminance distribution such that, while it may be desirable to entirely remove bright spots within the illuminated area, the illuminance distribution is adjusted such that the brightest area of the illuminance distribution may be in the center of the illuminance distribution and decrease monotonically to the borders of the illuminance distribution.

[0021] FIG. 1 shows an example illumination apparatus 100, in accordance with some examples. The illumination apparatus 100 may be, for example, a smart phone or standalone camera. Other embodiments, which may contain some or all of the components shown in FIG. 1 (as well as additional components not shown), include displays, automotive adaptive headlights, augmented-, virtual-, mix-reality (AR/VR/MR) headsets (in particular illumination of liquid crystal on silicon display within the AR/VR/MR headsets), smart glasses and displays for mobile phones, smart watches, monitors, and TVs. The illumination apparatus 100 may be used in adaptive flash and video for mobile devices, steerable illumination for general illumination or automotive illumination, or steerable irradiance for industrial purposes for example. The illumination apparatus 100 may include both a light source 110 and a camera 120. The camera 120 may capture an image of a scene 104 during an exposure duration of the camera 120, whether or not the scene 104 is illuminated by the light source 110. A processor 130 may be used to control various functions of the light source 110 and the camera 120, including whether or not a shutter is open in an opening 108 of a housing of the illumination apparatus 100.

[0022] The opening 108 may be a single opening as shown in FIG. 1 or may include multiple separate openings. Similarly, the shutter may be a single shutter that covers both the light source 110 and the camera 120 or may include multiple separate shutters that covers only one of the light source 110 or the camera 120 and are individually controllable by the processor 130.

[0023] The illumination apparatus 100 may include one or more LED arrays 112. Each of the one or more LED arrays 112 may include a plurality of segmented LEDs 114 that may produce light during at least a portion of the exposure duration of the camera 120. Each of the segmented LEDs 114 may be divided into a grid of light emitting areas and non-light emitting areas.

[0024] Each of the segmented LEDs 114 may be formed from one or more inorganic materials (e.g., binary compounds such as gallium arsenide (GaAs), ternary compounds such as aluminum gallium arsenide (AlGaAs), quaternary compounds such as indium gallium phosphide (InGaAsP), gallium nitride (GaN), or other suitable materials), usually either III-V materials (defined by columns of the Periodic Table) or II- VI materials. Each of the segmented LEDs 114 may emit light in the visible spectrum (about 400nm to about 800 nm) or may emit light in the infrared spectrum (above about 800nm). In some embodiments, one or more other layers, such as a layer that contain phosphor particles may be disposed on each of the one or more LED arrays 112 to convert the light from the segmented LEDs 114 into white (or another color) light. The segmented LEDs 114 in a particular LED array 112 that emit light in the infrared spectrum may be, for example, interspersed with segmented LEDs 114 may emit light in the visible spectrum, or each type of segmented LED (visible emitter/infrared emitter) may be disposed on different sections of the particular LED array 112. Alternatively, each LED array 112 may only emit light in either the visible spectrum or the infrared spectrum; separate (one or more) LED arrays may be used to emit light in the infrared spectrum, each of the individual ones of the LED arrays 112, The segmented LEDs 114 and/or LED segments controllable by the processor 130.

[0025] Each of the one or more LED arrays 112 may be a microLED or miniLED array, for example. A microLED array contains thousands to millions of microscopic segmented microLEDs that emit light and that may be individually controlled or controlled in groups of, e.g., pixels (such as 5x5 groups of pixels), or other shapes such as rows or rings. The microLEDs are small (e.g., < 0.01 mm on a side) and may provide monochromatic or multi- chromatic light, typically red, green, blue, or yellow using inorganic semiconductor material such as that indicated above.

[0026] The light source 110 may include at least one lens 116 and/or other optical elements such as reflectors. The lens 116 and/or other optical elements may direct the light emitted by the one or more LED arrays 112 toward the scene 104 as illumination 102.

[0027] The camera 120 may sense light at least the wavelength or wavelengths emitted by the one or more LED arrays 112. Similar to the light source 110, the camera 120 may include one or more optical elements (e.g., at least one camera lens 122) that are able to collect reflected light 106 of the illumination 102 that is reflected from and/or emitted by the scene 104. The camera lens 122 may direct the reflected light 106 onto a multi-pixel sensor 124 (also referred to as a light sensor) to form an image of the scene 104 on the multi-pixel sensor 124.

[0028] The processor 130 may receive a data signal that represents the image of the scene 104. The processor 130 may additionally control and drive the LEDs 114 in the one or more LED arrays 112 via one or more drivers 132. For example, the processor 130 may optionally control one or more segmented LEDs 114 in the one or more segmented LED arrays 112 independent of another one or more LEDs 114 in the one or more LED arrays 112, so as to illuminate the scene in a specified manner.

[0029] In addition, one or more detectors 126 may be incorporated in the camera 120. In other embodiments, instead of being incorporated in the camera 120, the one or more detectors 126 may be incorporated in one or more different areas, such as the light source 110 or elsewhere close to the camera 120. The one or more detectors 126 may include multiple different sensors to sense visible and/or infrared light (e.g., from the scene 104), and may further sense the ambient light and/or variations/flicker in the ambient light in addition to reception of the reflected light from the segmented LEDs 114. The multi-pixel sensor 124 of the camera 120 may be of higher resolution than the sensors of the one or more detectors 126 to obtain an image of the scene with a desired resolution. The sensors of the one or more detectors 126 may have one or more segments (that are able to sense the same wavelength/range of wavelengths or different wavelength/range of wavelengths), similar to the LED arrays 112. In some embodiments, if multiple detectors are used, one or more of the detectors may detect light of visible wavelengths and one or more of the detectors may detect light of infrared wavelengths; like the one or more LED arrays 112, the one or more detectors 126 may be individually controllable by the processor 130

[0030] In some embodiments, instead of, or in addition to, being provided in the camera 120, one or more of the sensors of the one or more detectors 126 may be provided in the light source 110. In some embodiments, the light source 110 and the camera 120 may be integrated in a single module, while in other embodiments, the light source 110 and the camera 120 may be separate modules that are disposed on a PCB. In other embodiments, the light source 110 and the camera 120 may be attached to different PCBs - for example, as the camera 120 may be thicker than the light source 110, which may result in design issues if the light source 110 and the camera 120 are attached to the same PCB. In the latter embodiment, multiple openings may be present in the housing at least one of which may be eliminated with the use of an integrated version of the light source 110 and camera 120.

[0031] The segmented LEDs 114 may be driven in an analog or digital manner, i.e., using a direct current (DC) driver or pulse width modulation (PWM). As shown, a drivers 132 may be used to drive the segmented LEDs 114 in the LED arrays 112, as well as other components, such as the actuators.

[0032] The illumination apparatus 100 may also include an input device 134, for example, a user-activated input device such as a button that is depressed to take a picture. The light source 110 and camera 120 may be disposed in a single housing.

[0033] The illumination apparatus 100 shown in FIG. 1, segmented LEDs can be used to form different types of displays, LED matrices and light engines including automotive adaptive headlights, augmented-, virtual-, mixreality (AR/VR/MR) headsets, smart glasses and displays for mobile phones, smart watches, monitors and TVs. The individual segmented LEDs in these architectures may, as above, have an area of few square millimeters down to few square micrometers depending on the matrix or display size and pixel-per-inch requirements. One approach is to create a monolithic array of segmented LEDs on an epitaxial wafer and later transfer and hybridize the array to a backplane to allow individual control of the segmented LEDs, as described in more detail below.

[0034] The segmented LEDs may be formed by combining n- and p-type semiconductors (e.g., III-V semiconductors above) on a substrate of sapphire aluminum oxide (A12O3) or silicon carbide (SiC), among others. In particular, various layers are deposited and processed on the substrate during fabrication of the segmented LED. The surface of the substrate may be pretreated to anneal, etch, polish, etc. the surface prior to deposition of the various layers.

[0035] In general, the various LED layers may be fabricated using epitaxial semiconductor deposition (e.g., by metal organic chemical vapor deposition) to deposit one or more semiconductor layers, metal deposition (e.g., by sputtering), oxide growth, as well as etching, liftoff, and cleaning, among other operations. The substrate may be removed from the LED structure after fabrication and after connection to contacts on a backplane via metal bonding such as via wire or ball bonding. The backplane may be a printed circuit board or wafer containing integrated circuits (ICs), such as a CMOS IC wafer. The semiconductor deposition operations may be used to create a segmented LED with an active region in which electron-hole recombination occurs and the light from the segmented LED is generated. The active region may be, for example, one or more quantum wells. Metal contacts may be used to drive provide current to the n- and p-type semiconductors from the ICs (such as drivers) of the backplane on which the segmented LED is disposed. Methods of depositing materials, layers, and thin films may include, for example: sputter deposition, atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced atomic layer deposition (PEALD), plasma enhanced chemical vapor deposition (PECVD), and combinations thereof.

[0036] Inorganic segmented LEDs and LED architectures have been widely used to create different types of devices. The individual segmented LEDs in these architectures may have an area of few square mm down to few square pm depending on the matrix or display size and pixel per inch characteristics. One approach is to create a monolithic array of segmented LEDs on an epitaxial wafer and later transfer and hybridize the LED arrays to a backplane to control individual pixels. One embodiment of such monolithic arrays uses metal (e.g., aluminum (Al)- or silver (Ag)-based) side-contacts. These contacts may serve as the electrical cathode for each pixel and also provide reflective sidewalls between the pixels to reduce light scattering and propagation in lateral directions.

[0037] FIG. 2 illustrates an example of a general device in accordance with some embodiments. The device 200 may be a mobile device such as a laptop computer (PC), a tablet PC, a smart phone, or an augmented reality (AR)/virtual reality (VR), or an automotive device, for example. Various elements may be provided on the backplane indicated above, while other elements may be local or remote. Examples, as described herein, may include, or may operate on, logic or a number of components, modules, or mechanisms. [0038] Modules and components are tangible entities (e.g., hardware) capable of performing specified operations and may be configured or arranged in a certain manner. In an example, circuits may be arranged (e.g., internally or with respect to external entities such as other circuits) in a specified manner as a module. In an example, the whole or part of one or more computer systems (e.g., a standalone, client or server computer system) or one or more hardware processors may be configured by firmware or software (e.g., instructions, an application portion, or an application) as a module that operates to perform specified operations. In an example, the software may reside on a machine readable medium. In an example, the software, when executed by the underlying hardware of the module, causes the hardware to perform the specified operations.

[0039] Accordingly, the term “module” (and “component”) is understood to encompass a tangible entity, be that an entity that is physically constructed, specifically configured (e.g., hardwired), or temporarily (e.g., transitorily) configured (e.g., programmed) to operate in a specified manner or to perform part or all of any operation described herein. Considering examples in which modules are temporarily configured, each of the modules need not be instantiated at any one moment in time. For example, where the modules comprise a general -purpose hardware processor configured using software, the general -purpose hardware processor may be configured as respective different modules at different times. Software may accordingly configure a hardware processor, for example, to constitute a particular module at one instance of time and to constitute a different module at a different instance of time.

[0040] The electronic device 200 may include a hardware processor (or equivalently processing circuitry) 202 (e.g., a central processing unit (CPU), a GPU, a hardware processor core, or any combination thereof), a memory 204 (which may include main and static memory), some or all of which may communicate with each other via an interlink (e.g., bus) 208. The memory 204 may contain any or all of removable storage and non-removable storage, volatile memory or non-volatile memory. The electronic device 200 may further include a display/light source 210 such as the LEDs described above, or a video display, an alphanumeric input device 212 (e.g., a keyboard), and a user interface (UI) navigation device 214 (e.g., a mouse). In an example, the display/light source 210, input device 212 and UI navigation device 214 may be a touch screen display. The electronic device 200 may additionally include a storage device (e.g., drive unit) 216, a signal generation device 218 (e.g., a speaker), a network interface device 220, one or more cameras 228, and one or more sensors 230, such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensor such as those described herein. The electronic device 200 may further include an output controller, such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).

[0041] The storage device 216 may include a non-transitory machine readable medium 222 (hereinafter simply referred to as machine readable medium) on which is stored one or more sets of data structures or instructions 224 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 224 may also reside, completely or at least partially, within the memory 204 and/or within the hardware processor 202 during execution thereof by the electronic device 200. While the machine readable medium 222 is illustrated as a single medium, the term "machine readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 224.

[0042] The term “machine readable medium” may include any medium that is capable of storing, encoding, or carrying instructions for execution by the electronic device 200 and that cause the electronic device 200 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions. Non-limiting machine-readable medium examples may include solid-state memories, and optical and magnetic media. Specific examples of machine-readable media may include: non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; Random Access Memory (RAM); and CD-ROM and DVD-ROM disks.

[0043] The instructions 224 may further be transmitted or received over a communications network using a transmission medium 226 via the network interface device 220 utilizing any one of a number of wireless local area network (WLAN) transfer protocols or a SPI or CAN bus. Example communication networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), mobile telephone networks (e.g., cellular networks), Plain Old Telephone (POTS) networks, and wireless data networks. Communications over the networks may include one or more different protocols, such as Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi, or other IEEE 802.16 standards, a Long Term Evolution (LTE) family of standards, a Universal Mobile Telecommunications System (UMTS) family of standards, peer-to-peer (P2P) networks, a next generation (NG)/6^th generation (6G) standards among others. In an example, the network interface device 220 may include one or more physical jacks (e.g., Ethernet, coaxial, or phonejacks) or one or more antennas to connect to the transmission medium 226. [0044] Note that the term “circuitry” as used herein refers to, is part of, or includes hardware components such as an electronic circuit, a logic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group), an Application Specific Integrated Circuit (ASIC), a field-programmable device (FPD) (e.g., a field-programmable gate array (FPGA), a programmable logic device (PLD), a complex PLD (CPLD), a high-capacity PLD (HCPLD), a structured ASIC, or a programmable SoC), digital signal processors (DSPs), etc., that are configured to provide the described functionality. In some embodiments, the circuitry may execute one or more software or firmware programs to provide at least some of the described functionality. The term “circuitry” may also refer to a combination of one or more hardware elements (or a combination of circuits used in an electrical or electronic system) with the program code used to carry out the functionality of that program code. In these embodiments, the combination of hardware elements and program code may be referred to as a particular type of circuitry.

[0045] The term “processor circuitry” or “processor” as used herein thus refers to, is part of, or includes circuitry capable of sequentially and automatically carrying out a sequence of arithmetic or logical operations, or recording, storing, and/or transferring digital data. The term “processor circuitry” or “processor” may refer to one or more application processors, one or more baseband processors, a physical central processing unit (CPU), a single- or multi-core processor, and/or any other device capable of executing or otherwise operating computer-executable instructions, such as program code, software modules, and/or functional processes.

[0046] The camera 228 may sense light at least the wavelength or wavelengths emitted by the segmented LEDs. The camera 228 may include one or more optical elements (e.g., at least one camera lens) that are able to collect reflected light of illumination that is reflected from and/or emitted by an illuminated region. The camera lens may direct the reflected light onto a multipixel sensor (also referred to as a light sensor) to form an image of on the multipixel sensor.

[0047] The processor 202 may control and drive the segmented LEDs via one or more drivers. For example, the processor 202 may optionally control one or more segmented LEDs in LED arrays independent of another one or more segmented LEDs in the LED arrays, so as to illuminate an area in a specified manner.

[0048] In addition, the sensors 230 may be incorporated in the camera 228 and/or the light source 210. The sensors 230 may sense visible and/or infrared light and may further sense the ambient light and/or variations/flicker in the ambient light in addition to reception of the reflected light from the segmented LEDs. The sensors may have one or more segments (that are able to sense the same wavelength/range of wavelengths or different wavelength/range of wavelengths), similar to the LED arrays.

[0049] FIG. 3 illustrates an example LED array 300, in accordance with some examples. The LEDs 302, which are segmented in the LED array 300, are separated by non-emitting areas 304. Sets of the segmented LEDs 302 that are driven in parallel may be referred to herein as emitter segments. In some examples, the LEDs 302 can be arranged in a rectilinear array along orthogonal first and second dimensions. In some examples, the segmented LEDs 302 can be arranged in a non-rectilinear array along non-orthogonal first and second dimensions. In some examples, each of the non-emitting areas 304 can be arranged as an elongated area that extends along one of the first or second dimensions. As shown, at least one of the non-emitting areas 304 can extend in an unbroken line along a full extent of the first dimension and/or second dimension. A lens 306 and/or other optical element may be used to shape illumination from the LED array 300. In other embodiments, multiple lenses may be used to shape the illumination, in which each lens is associated with one or more LEDs 302 that do not overlap with other LEDs 302 associated with another lens.

[0050] FIG. 4A illustrates a cross-section of a segmented LED 400 in an LED array, in accordance with some examples. FIG. 4B illustrates a crosssection of another LED in an LED array, in accordance with some examples. FIG. 4C illustrates a cross-section of another LED in an LED array, in accordance with some examples. The segmented LED 400 includes multiple semiconductor layers 404 grown on a substrate 402 (e.g., a sapphire substrate). The substrate 402 may be any substrate, such as Sapphire, capable of having epitaxial layers grown thereon. The substrate 402 may have patterns 402a on which the epitaxial layers are grown. The semiconductor layers 404 may be formed from gallium nitride (GaN), having an n-type semiconductor 404a adjacent to the substrate 402, a p-type semiconductor 404c, and an active region 404b between the n-type semiconductor 404a and the p-type semiconductor 404c. The active region 404b may be, for example, a multiple quantum well structure in which light is generated for emission from the semiconductor layers 404. After processing, the substrate 402 may be removed in some embodiments. [0051] Before etching of the epitaxial GaN layers, die layers of chipscale packages (CSP) allowing uniform current distribution and optical coupling may be deposited or otherwise formed. For example, uniform current injection in the p-type semiconductor 404c may be obtained by depositing a Transparent Conductive Oxide (TCO) layer 405 (such as an Indium Tin Oxide (ITO) layer) on the p-type semiconductor 404c. In some embodiments, the TCO layer 405 of different pixel segments may have different thicknesses (or the TCO layer 405 of all pixel segments may have the same thickness).

[0052] To reduce Ag absorption losses, a dielectric spacer 406, such as SiO? or SiN and/or other dielectric material or materials, is deposited or otherwise formed on the TCO layer 405. An array of openings is etched in a uniform distribution within the dielectric spacer 406 over the TCO layer 405 through, for example, lithographic processes (e.g., using a photoresist). A reflective layer 408 (or other optically reflective structure such as a Bragg reflector), such as an Ag mirror, may then be formed on the dielectric spacer 406. The reflective layer 408 (Bragg reflector) may reflect light from the active region 404b towards an exit surface of the segmented LED 400. The material forming the reflective layer 408 may fill the openings in the dielectric spacer 406 to form eVias 406a and electrically connect the TCO layer 405 and the reflective layer 408. Thus, the eVias 406a may provide uniform current distribution over the area of the p-type semiconductor 404c. The dielectric spacer 406 may combine several different dielectrics to form a composite mirror to reduce light reflected by the Ag mirror and hence lower absorption losses by the Ag mirror. The addition of the composite mirror provides total internal reflection (TIR) at the SiCh/GaN interface to enhance reflection and, as the Ag mirror is not in contact with the p-GaN, a transparent spreading current layer (the TCO layer) is used on the p-GaN.

[0053] In various embodiments, a hard mask 410 is then deposited on the reflective layer 408. The hard mask 410 may be formed from a material substantially denser than a polymer, for example, SiCh, SiC, or aluminum nitride (AIN). The hard mask 410 may have openings to allow current injection from the p-bonding layer (p-BL) to the reflective layer 408. The hard mask 410 may have openings to allow current injection from a p-bonding layer (p-BL) to the reflective layer 408 and thus the p-type semiconductor 404c, and from an n- bonding layer (n-BL) to the n-type semiconductor 404a. Electrical connections of the n-BL to the n-type semiconductor 404a are referred to as nVias.

[0054] The hard mask 410 is used to permit etching of a trench, as well as connections to the n-type semiconductor 404a. Note that although (wet or dry) etching is referred to, other techniques may be used to form various layers such as laser drilling, ion-beam formation, etc. To then insulate the pixels formed by the semiconductor layers 404, one or more sidewall dielectric layers 412, such as SiCL, may be deposited or otherwise formed on the sidewalls of the semiconductor layers 404.

[0055] A bonding layer 414 may be disposed on the hard mask 410. The bonding layer 414 may be formed from copper (Cu) and/or Al, for example. In other embodiments, a single dielectric may be used to partially or completely fill the trench. In this case of a single dielectric layer, a conductive layer may be disposed on the single dielectric layer to promote reflection into the semiconductor layers. The trench may be on the order of several microns (e.g., up to about 10 microns), while the sidewall dielectric layers may be considerably thinner, e.g., up to about a few tenths of a micron. The thickness of the sidewall dielectric layers may be dependent on the desired index of refraction created by the structure.

[0056] FIG. 5 illustrates a cross-sectional view of a single-die package architecture, in accordance with some examples. The package architecture 500 illustrates only a single LED die 510 for clarity. The LED die 510 may contain a semiconductor stack fabricated by combining n-type and p-type semiconductors (e.g., the above III-V semiconductors) on a substrate such as sapphire or silicon carbide (SiC). Various layers may be deposited and processed on the substrate during fabrication of the LED as described above. The surface of the substrate may be pretreated to anneal, etch, polish, etc. the surface prior to deposition of the various layers.

[0057] The LED die 510 may also contain contacts fabricated on the semiconductor stack to make electrical contact with different layers of the semiconductor stack. The LED die 510 may be electrically coupled to, for example, a cathode under bump metallization (UBM) (nUBM) 512a and an anode UBM (pUBM) 512b. The nUBM 512a and the pUBM 512b may be patterned and formed from a metal, such as copper (Cu), nickel (Ni), gold (Au), silver (Ag), and/or titanium (Ti), for example, which may be deposited on the LED die 510.

[0058] The nUBM 512a and the pUBM 512b may be electrically coupled to a PCB 520 through a patterned tile metallization 514 that is disposed on a tile 522 (also referred to as a submount). The electrical connection may be formed by direct contact (e.g., thermocompression bonding) or through a solder and reflow process whereby the solder wets to both metal interfaces and forms a solid joint upon cooling. The tile metallization 514 may be formed from a metal, such as Cu, which may be the same as, or different from, the material(s) used to form the nUBM 512a and the pUBM 512b. The tile metallization 514 may entirely overlap the nUBM 512a and the pUBM 512b to ensure electrical contact therebetween.

[0059] The tile 522 may be formed from FR4, a ceramic, or aluminum nitride (AIN), for example. The tile 522 may provide mechanical support for the LED die 510. The tile 522 may be disposed on a Thermal Interface Material (TIM)/electrode layer 524, which may include a metal, such as those above, and may further include thermal epoxy or thermal grease, for example. The TIM/electrode layer 524 may act as an electrode layer, connecting the tile 522 to a heat sink 526 formed, for example, from Al.

[0060] In some embodiments, a light-converting layer 530 containing phosphor particles may be disposed on the LED die 510. The light-converting layer 530 may convert light emitted by the segmented LEDs of the LED die 510 to white light, for example. The light-converting layer 530 may be a continuous layer or may be segmented to be disposed only on the LEDs. A lens 532 and/or other one or more optical elements may be disposed over the entire LED die 510 as shown. In other embodiments, individual lenses may be disposed over each LED or over sets of LEDs. In some cases, optical efficiency of the illuminance within each segment of the LED die 510 may be affected due to the geometry of the lens 532 and the LED die 510, and thus the relative position of the LEDs of the segment with respect to the lens 532. The lens 532 and the LED die 510 may have different shapes (e.g., as shown in FIG. 5, the lens 532 may have an ovular or circular shape while the LED die 510 has a rectangular shape).

[0061] Various embodiments may permit changing the flux output of the emitter segments independent of the segment area. As indicated above, for example, the segments in an LED array may be formed in rings of increasing numbers of segmented LEDs surrounding a center of the LED array. FIGS. 6A and 6B illustrate illumination respectively without and with flux compensation in accordance with some embodiments. The illuminance distribution 600a, 600b of FIGS. 6A and 6B is based on driving each element within a particular segment at same voltage and current density. The illuminance distribution 600a, 600b of FIGS. 6A and 6B is on a rectangular target scene with a rectangular segmented die of which the outer pixels are driven in parallel. The illuminance distribution 600a of FIG. 6A shows the LED array emitting proportionally to segment area and current density (i.e., without flux compensation among the segments), in which the illuminance distribution 600a includes bright areas 602a and dark areas 602b. The illuminance distribution 600b of FIG. 6B shows a flux output tuned independent of segment area (i.e., with flux compensation among the segments). The tuned embodiment of FIG. 6B leads to a smooth, substantially uniform, distribution.

[0062] One or more mechanisms may be used to change the flux output of the emitter segments independent of the segment area. For example, the reflective layer 408 shown in FIGS. 4A-4C may be adjusted for one or more segmented LEDs. In embodiments in which the reflective layer 408 is an Ag mirror, the coverage area of the reflective layer 408 may be independently adjusted. In embodiments in which the reflective layer 408 is a Bragg reflector, the thickness, composition, and/or coverage area of one or more of the layers forming the Bragg reflector may be independently adjusted for each element within the segment to provide a different amount of reflectance for the light emitted by the active region of the semiconductor layers.

[0063] Alternatively, or in addition, the spatial density and/or diameter of the eVias 406a and/or nVias 406b to one or both of the n-type semiconductor 404a or p-type semiconductor 404c to direct the current flow in the dielectric spacer 406 shown in FIGS. 4A-4C may be adjusted for one or more elements of the particular segment. The nVias 406b may serve a similar purpose as the eVias 406a but may be formed differently. The resistance being modulated to modulate light emission between segments is different: the p-metal-TCO contact resistance and the TCO sheet resistance (of the TCO layer 405) is modulated for the eVias 406a; the n-metal-nGaN contact resistance and the nGaN sheet resistance are modulated for the nVias 406b.

[0064] As above, each element of different elements within the particular segment may have the same number or a different number of the eVias 406a and/or nVias 406b and/or the diameters of the the eVias 406a and/or nVias 406b of the different elements may be the same or different. For example, the density may change by a factor of up to about 5 to provide the desired adjustment. This multi-fold parameter design may permit, as above, independent adjustment of the current flow for each element within the segment. Compared to changing the reflectance of the mirror, the current flow may be redistributed, and total flux output may be less affected compared to introducing lossy mirrors. Reflectance tuning, on the other hand, permits the distribution to be independent of the current while the resistance tuning and thus may be more desirable for a predetermined current and change with current. Similarly, the diameter and/or density of n-edge contacts between pixel segments on same driver channel may be varied. The n-edge contacts are n-BL to contacts to the n-type semiconductor (e.g., nGaN) at the die edge. The contact may be a fully continuous ring at the die edge (typically about 5 pm wide) or be discontinuous (n Via-like).

Alternatively, the die may have no edge contact at all.

[0065] Alternatively, or in addition, as shown in FIG. 4C, the resistance may be provided by varying the entire thickness and/or different densities of smaller reduced thickness regions 405b of the TCO layer 405a between the eVias 406a and p-type semiconductor 404c for one or more elements of a particular segment or for pixels where less light emission is desired. As above, each element of different elements within the particular segment may have the same number, or different numbers, of TCO reduced thickness regions. The TCO thickness can be varied for each segment to control the relative light output, either uniformly within a segment or, as shown in FIG. 4C, in a way that is patterned. The patterning may result in TCO areas that are thinner than other TCO areas or regions in which the TCO is completely removed. In some embodiments, the patterning may be formed in an array. Patterning may provide improved current spreading compared to blanket removal (e.g., using etching) as current spreading through a blanket TCO may be non-uniform. As shown in FIG. 4C, the TCO layer 405a has regions 405b between the eVias 406a in which the TCO is removed. The pattern may be identical or may be different between pixels.

[0066] Alternatively, or in addition, resistance may be provided within the tile 522 or to the tile metallization 514 shown in FIG. 5. As above, the resistance may be independently adjusted for each element of the particular segment. The resistance may be provided via conductive traces (thin film resistors) and/or separate components on or within the tile 522 or the tile metallization 514 to change the resistance between the PCB 520 and the LED die 510.

[0067] FIG. 7 illustrates an example lighting system, according to some embodiments. As above, some of the elements shown in the lighting system 700 may not be present, while other additional elements may be disposed in the lighting system 700. The lighting system 700 may include a controller 702 that controls illumination using a pixel array 710 that contains multiple individual pixels 712.

[0068] In some embodiments, some or all of the components described as the controller 702 may be disposed on a backplane such as, for example, a complementary metal oxide semiconductor (CMOS) backplane. The controller 702 may be coupled to or include one or more processors 704. The processor 704 may receive image data (in frames) via an interface and may process the image data to control a generator 706a, for example, controlling analog signals or PWM duty cycles and/or turn-on times for causing the lighting system 700 to produce the images indicated by the image data.

[0069] The generator 706a may be controlled by the processor 704 and may produce driving signals in accordance with the indications. The generator 706a may be coupled to a driver 706b (such as that described in FIG. 2) to drive the pixel array 710 so that the pixels 712 provide desired intensities of light.

[0070] Each pixel 712 may include one or more LEDs 714. The LEDs 714 may be different colors and may be controlled individually or in groups. As shown, the pixel 712 may include, for each pixel 712 or LED 714, a PWM switch, and a current source. The pixel 712 may be driven by the driver 706b. The signal from the generator 706a may cause the switch to open and close in accordance with the value of the signal. The signal corresponding to the intensities of light may cause the current source to produce a current flow to cause the pixels 712 to produce the corresponding intensities of light.

[0071] The lighting system 700 may further include a power supply 720. In some embodiments, the power supply 720 may be a battery that produces power for the controller 702.

[0072] FIG. 8 illustrates an example lighting device 800, according to some embodiments. As above, some of the elements shown in the exemplary lighting device 800 may not be present, while other additional elements may be disposed in the lighting device 800. The lighting device 800 may include controller electronics 802, one or more LED arrays 804, and one or more optical elements 806. The lighting device 800 may be contained within a housing 810. [0073] The controller electronics 802 may include, among others, one or more PCBs to control the LEDs of the one or more LED arrays 804, drivers to drive the segmented LEDs using one or more channels, and WiFi or other communication modules to communicate with a remote controller. The controller electronics 802 may be disposed in one or more locations within the lighting device 800 and may be different from that shown in FIG. 8.

[0074] The segmented LEDs and circuitry supporting the LED array can be packaged and include a submount, PCB, and/or CMOS backplane for powering and controlling light production by the LEDs. The PCB supporting the LED array may include electrical vias, heat sinks, ground planes, electrical traces, and flip chip or other mounting systems. The submount or PCB may be formed of any suitable material, such as ceramic, silicon, aluminum, etc. If the submount material is conductive, an insulating layer may be formed over the substrate material, and a metal electrode pattern formed over the insulating layer for contact with the micro-LED array. The submount can act as a mechanical support, providing an electrical interface between electrodes on the LED array and a power supply, and also provide heat sink functionality.

[0075] The number of LED arrays 804 may vary from a single array up to a desired number able to be contained within the housing 810. The optical elements 806 may include lenses, reflective elements, and other devices that permit the light from the LEDs to be directed to a particular individual area. The shape of the housing 810 may be different from that shown in FIG. 8.

[0076] In general, a variety of applications may be supported by LED arrays. Such applications may include stand-alone applications to provide general illumination (e.g., within or external to a room or vehicle) or to provide specific images. In addition to devices such as a luminaire, projector, mobile device, the system may be used to provide AR- and VR-based applications. Visualization systems, such as VR and AR systems, are becoming increasingly more common across numerous fields such as entertainment, education, medicine, and business. Various types of devices may be used to provide AR/VR to users, including headsets, glasses, and projectors. Such an AR/VR system may include components similar to those described above: the micro- LED array (either as LCoS display illumination unit or as self-emitting display), a display or screen (which may include touchscreen elements), a micro-LED array controller, sensors, and a controller, among others. The AR/VR components can be disposed in a single structure, or one or more of the components shown can be mounted separately and coupled via wired or wireless communication. Power and user data may be provided to the controller. The user data input can include information provided by audio instructions, haptic feedback, eye or pupil positioning, or coupled keyboard, mouse, or game controller. The sensors may include cameras, depth sensors, audio sensors, accelerometers, two or three axis gyroscopes and other types of motion and/or environmental/wearer sensors that provide the user input data. Other sensors can include but are not limited to air pressure, stress sensors, temperature sensors, or any other suitable sensors for local or remote environmental monitoring. In some embodiments, the control input can include detected touch or taps, gestural input, or control based on headset or display position. As another example, based on the one or more measurement signals from one or more gyroscope or position sensors that measure translation or rotational movement, an estimated position of the AR/VR system relative to an initial position can be determined.

[0077] In some embodiments, the controller may control individual micro-LEDs or one or more groups of LEDs to display content (AR/VR and/or non- AR/VR) to the user while controlling other LEDs and sensors used in eye tracking to adjust the content displayed. Content display LEDs may be designed to emit light within the visible band (approximately 400 nm to 780 nm) while LEDs used for tracking may be designed to emit light in the IR band (approximately 780 nm to 2,200 nm). In some embodiments, the tracking LEDs and content LEDs may be simultaneously active. In some embodiments, the tracking LEDs may be controlled to emit tracking light during a time period that content LEDs are deactivated and are thus not displaying content to the user. The AR/VR system can incorporate one or more optical elements, such as those described above, and/or an AR/VR display, for example to couple light emitted by LED array onto the AR/VR display.

[0078] In some embodiments, the AR/VR controller may use data from the sensors to integrate measurement signals received from the accelerometers over time to estimate a velocity vector and integrate the velocity vector over time to determine an estimated position of a reference point for the AR/VR system. In other embodiments, the reference point used to describe the position of the AR/VR system can be based on depth sensor, camera positioning views, or optical field flow. Based on changes in position, orientation, or movement of the AR/VR system, the system controller can send images or instructions the light emitting array controller. Changes or modification the images or instructions can also be made by user data input, or automated data input.

[0079] In general, in a VR system, a display can present to a user a view of scene, such as a three-dimensional scene. The user can move within the scene, such as by repositioning the user’s head or by walking. The VR system can detect the user’s movement and alter the view of the scene to account for the movement. For example, as a user rotates the user’s head, the system can present views of the scene that vary in view directions to match the user’s gaze. In this manner, the VR system can simulate a user’s presence in the three- dimensional scene. Further, a VR system can receive tactile sensory input, such as from wearable position sensors, and can optionally provide tactile feedback to the user.

[0080] In an AR system, on the other hand, the display can incorporate elements from the user’s surroundings into the view of the scene. For example, the AR system can add textual captions and/or visual elements to a view of the user’s surroundings. For example, a retailer can use an AR system to show a user what a piece of furniture would look like in a room of the user’s home, by incorporating a visualization of the piece of furniture over a captured image of the user’s surroundings. As the user moves around the user’s room, the visualization accounts for the user’s motion and alters the visualization of the furniture in a manner consistent with the motion. For example, the AR system can position a virtual chair in a room. The user can stand in the room on a front side of the virtual chair location to view the front side of the chair. The user can move in the room to an area behind the virtual chair location to view a back side of the chair. In this manner, the AR system can add elements to a dynamic view of the user’s surroundings.

[0081] FIG. 9 shows a block diagram of an example of a system, according to some embodiments. The system 900 may provide AR/VR functionality using microLEDs. The system 900 can include a wearable housing 912, such as a headset or goggles. The housing 912 can mechanically support and house the elements detailed below. In some examples, one or more of the elements detailed below can be included in one or more additional housings that can be separate from the wearable housing 912 and couplable to the wearable housing 912 wirelessly and/or via a wired connection. For example, a separate housing can reduce the weight of wearable goggles, such as by including batteries, radios, and other elements. The housing 912 can include one or more batteries 914, which can electrically power any or all of the elements detailed below. The housing 912 can include circuitry that can electrically couple to an external power supply, such as a wall outlet, to recharge the batteries 914. The housing 912 can include one or more radios 916 to communicate wirelessly with a server or network via a suitable protocol, such as WiFi.

[0082] The system 900 can include one or more sensors 918, such as optical sensors, audio sensors, tactile sensors, thermal sensors, gyroscopic sensors, time-of-flight sensors, triangulation-based sensors, and others. In some examples, one or more of the sensors can sense a location, a position, and/or an orientation of a user. In some examples, one or more of the sensors 918 can produce a sensor signal in response to the sensed location, position, and/or orientation. The sensor signal can include sensor data that corresponds to a sensed location, position, and/or orientation. For example, the sensor data can include a depth map of the surroundings. In some examples, such as for an AR system, one or more of the sensors 918 can capture a real-time video image of the surroundings proximate a user.

[0083] The system 900 can include one or more video generation processors 920. The one or more video generation processors 920 can receive scene data that represents a three-dimensional scene, such as a set of position coordinates for objects in the scene or a depth map of the scene. This data may be received from a server and/or a storage medium. The one or more video generation processors 920 can receive one or more sensor signals from the one or more sensors 918. In response to the scene data, which represents the surroundings, and at least one sensor signal, which represents the location and/or orientation of the user with respect to the surroundings, the one or more video generation processors 920 can generate at least one video signal that corresponds to a view of the scene. In some examples, the one or more video generation processors 920 can generate two video signals, one for each eye of the user, that represent a view of the scene from a point of view of the left eye and the right eye of the user, respectively. In some examples, the one or more video generation processors 920 can generate more than two video signals and combine the video signals to provide one video signal for both eyes, two video signals for the two eyes, or other combinations. [0084] The system 900 can include one or more light sources 922 that can provide light for a display of the system 900. Suitable light sources 922 can include the microLEDs above, for example. The one or more light sources 922 can include light-producing elements having different colors or wavelengths. For example, a light source can include a red light-emitting diode that can emit red light, a green light-emitting diode that can emit green light, and a blue lightemitting diode that can emit blue right. The red, green, and blue light combine in specified ratios to produce any suitable color that is visually perceptible in a visible portion of the electromagnetic spectrum. Other light sources 922 may emit infrared light.

[0085] The system 900 can include one or more modulators 924. The modulators 924 can be implemented in one of at least two configurations. In a first configuration, the modulators 924 can include circuitry that can modulate the light sources 922 directly. For example, the light sources 922 can include an array of light-emitting diodes, and the modulators 924 can directly modulate the electrical power, electrical voltage, and/or electrical current directed to each light-emitting diode in the array to form modulated light. The modulation can be performed in an analog manner and/or a digital manner. In some examples, the light sources 922 can include an array of red light-emitting diodes, an array of green light-emitting diodes, and an array of blue light-emitting diodes, and the modulators 924 can directly modulate the red light-emitting diodes, the green light-emitting diodes, and the blue light-emitting diodes to form the modulated light to produce a specified image.

[0086] In a second configuration, the modulators 924 may include a modulation panel, such as a liquid crystal panel. The light sources 922 may produce uniform illumination, or nearly uniform illumination, to illuminate the modulation panel. The light sources 922 may be modulated, typically with a lower resolution than the liquid crystal panel, to increase the dynamic range of the display or to build a more efficient system by only illuminating the areas of the display that carries content. The modulation panel can include pixels. Each pixel can selectively attenuate a respective portion of the modulation panel area in response to an electrical modulation signal to form the modulated light. In some examples, the modulators 924 can include multiple modulation panels that can modulate different colors of light. For example, the modulators 924 can include a red modulation panel that can attenuate red light from a red light source such as a red light-emitting diode, a green modulation panel that can attenuate green light from a green light source such as a green light-emitting diode, and a blue modulation panel that can attenuate blue light from a blue light source such as a blue light-emitting diode.

[0087] In some examples of the second configuration, the modulators 924 can receive uniform white light or nearly uniform white light from a white light source, such as a white-light light-emitting diode. The modulation panel can include wavelength-selective filters on each pixel of the modulation panel. The panel pixels can be arranged in groups (such as groups of three or four), where each group can form a pixel of a color image. For example, each group can include a panel pixel with a red color filter, a panel pixel with a green color filter, and a panel pixel with a blue color filter. Other suitable configurations can also be used.

[0088] The system 900 can include one or more modulation processors 926, which can receive a video signal, such as from the one or more video generation processors 920, and, in response, can produce an electrical modulation signal. For configurations in which the modulators 924 directly modulate the light sources 922, the electrical modulation signal can drive the modulators 924. For configurations in which the modulators 924 include a modulation panel, the electrical modulation signal can drive the modulation panel.

[0089] The system 900 can include one or more beam combiners 928 (also known as beam splitters), which can combine light beams of different colors to form a single multi-color beam. For configurations in which the light sources 922 can include multiple light-emitting diodes of different colors, the system 900 can include one or more wavelength-sensitive (e.g., dichroic) beam combiners 928 that can combine the light of different colors to form a single multi-color beam.

[0090] The system 900 can direct the modulated light toward the eyes of the viewer in one of at least two configurations. In a first configuration, the system 900 can function as a projector, and can include suitable projection optics 930 (one or more optical elements) that can project the modulated light onto one or more screens 932. The screens 932 can be located a suitable distance from an eye of the user. The system 900 can optionally include one or more lenses 934 that can locate a virtual image of a screen 932 at a suitable distance from the eye, such as a close-focus distance, such as 500 mm, 750 mm, or another suitable distance. In some examples, the system 900 can include a single screen 932, such that the modulated light can be directed toward both eyes of the user. In some examples, the system 900 can include two screens 932, such that the modulated light from each screen 932 can be directed toward a respective eye of the user. In some examples, the system 900 can include more than two screens 932. In a second configuration, the system 900 can direct the modulated light directly into one or both eyes of a viewer. For example, the projection optics 930 can form an image on a retina of an eye of the user, or an image on each retina of the two eyes of the user.

[0091] For some configurations of AR systems, the system 900 can include at least a partially transparent display, such that a user can view the user’s surroundings through the display. For such configurations, the AR system can produce modulated light that corresponds to the augmentation of the surroundings, rather than the surroundings itself. For example, in the example of a retailer showing a chair, the AR system can direct modulated light, corresponding to the chair but not the rest of the room, toward a screen or toward an eye of a user.

[0092] FIG. 10 illustrates an example method 1000 of fabricating an illumination device, according to some embodiments. Not all of the operations may be undertaken in the method 1000, and/or additional operations may be present. The operations may occur in a different order from that indicated in FIG. 10

[0093] At operation 1002, the driver channel information and segment information may be determined. The driver channel information may include the number of channels; the segment information may include the number of segments (equal to the number of channels) and grouping for each segment. Each segment (and thus the corresponding elements) may be driven using an independent current for each channel. [0094] At operation 1004, the shape of the LED array may be used to design the shape of the one or more optical elements used to shape light from the LED array. The lens shape may match both the die groups and target areas. [0095] At operation 1006, the illuminance from the illumination device may be simulated using the parameters determined and the output simulated. That is, the overall illumination may be simulated for parallel driving of the elements in each segment based on the number of driver channels, the desired segment grouping, the shape of the LED array, and the shape of the one or more optical elements, among others. The modeling may be used to establish a target brightness or radiance distribution per channel to achieve multiple targeted illumination cases. Each channel may be independent of each other channel. [0096] At operation 1008, the illumination device design may be modified based on the simulated targeted illumination cases. That is, defects in the illumination cases caused by the factors described above may be compensated for. In some embodiments, the characteristics of the LED die and/or tile may be adjusted such that individual elements or subgroups within a particular segment may be driven to provide unequal flux output to allow parallel driving and optimized target illumination.

[0097] While only certain features of the system and method have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes. Method operations may be performed substantially simultaneously or in a different order. [0098] FIG. 11 illustrates a top plan view of an example array suitable for implementing embodiments described herein. The example hybridized device illustrated in FIG. 11 includes an LED die 1110 that includes LEDs 1112, such as those described herein. Projected patterned light may define images that may include light emitted from the LEDs 1112. Each LED 1112 (or group of LEDs) of the array may correspond to a projector picture element or projector pixel. In embodiments described herein, the LEDs 1112. Suitable hybridized devices may include monolithic LED arrays, micro LED arrays, etc. Each LED 1112 in LED die 1110 may be individually addressable.

Alternatively, groups or subsets of LEDs 1112 may be addressable. In embodiments described herein, each array may comprise micro LEDs. Each LED 1112 may have a size in the range of micrometers (e.g., between 1 micrometer (pm) and 100 pm). For example, LED 1112 may have dimensions of approximately (within 10 pm by 10 pm) 40 pm by 40 pm in some embodiments. An LED 1112 may have a lateral dimension of less than about 100 pm in some embodiments.

[0099] LEDs 1112 may be arranged as a matrix comprising one or more rows and one or more columns to define a rectangle. In other embodiments, LEDs 1112 may be arranged to define other shapes. Each micro-LED included in the LED die 1110 may encompass, for example, thousands or millions of projector pixels or LEDs. For example, an LED die 1110 that contains a pLED may include within 5,000 pixels, 20,000 pixels or more - such as millions of pixels. Each pixel may include an emitter. An LED die 1110 that contains the pLED can support high-density pixels having a lateral dimension less than about 150pm by about 150pm. In some embodiments, a pLED die can have dimensions of about 50 pm in diameter or width. In some embodiments, the height dimension of an array including the LEDs 1112, their supporting substrate and electrical traces, and associated micro-optical elements may be less than about 5 millimeters.

[00100] An exploded view of a 3x3 sub-array 1116 of LEDs 1112 included in LED die 1110 is also shown in FIG. 11. Sub-array 1116 may include LEDs 1112, each defined by a width wl. In some example embodiments, width wl can be approximately 100pm or less (e.g., 40pm). As shown in the sub-array 1116, lanes 1114 may be defined extending horizontally and vertically to define rows and columns of LEDs 1112. Lanes 1114 between the LEDs 1112 may have a width, w2, wide. In some embodiments, the width w2 may be approximately 20pm or less (e.g., 5pm). In some embodiments, the width w2 may be as small as about 1pm. The lanes 1114 may provide an air gap between adjacent emitters or may contain other material. A distance dl from the center of one LED 1112 to the center of an adjacent LED 1112 may be approximately about 120pm or less (e.g., 45pm). It will be understood that the widths and distances provided herein are examples of one of many possible embodiments in which widths and/or other dimensions may vary. [00101] In some example embodiments, lanes 1114 may be defined by a width w2 that can be approximately 20pm or less (e.g., 5pm). In some example embodiments, width w2 can be as small as about 1pm. Lanes 1114 can serve to provide an air gap between adjacent LEDs 1112 and may contain material other than light emitting material. In some example embodiments, a distance dl from the center of one LED 1112 to the center of an adjacent LED 1112 can be approximately 120pm or less (e.g., 45pm). It will be understood that the LED and lane widths and distances between LEDs are intended as examples. Persons of ordinary skill reading the disclosure herein will appreciate a range of widths and/or dimensions will be suitable for various implementations, and those embodiments will fall within the scope of the disclosure.

[00102] For the convenience of illustration, LED 1112 that are included in the LED die 1110 are depicted herein as having a rectangular shape. However, as persons of ordinary skill will appreciate, a variety of other emitter shapes would be suitable for implementing the LED 1112 and LED die 1110 in various applications, and those would fall within the scope of the embodiments described herein. Likewise, LED die 1110 is depicted in FIG. 11 as a symmetric matrix of LEDs 1112. However, various other implementations of the LED die 1110 may be suitable for implementing embodiments described herein, depending on application and design considerations. For example, in some implementations, LED die 1110 can comprise a linear array of LEDs 1112, and in other implementations a rectangular array of LEDs 1112. In some implementations, the LED die 1110 can comprise a symmetric or asymmetric matrix of LEDs 1112. LED die 1110 can comprise an array or matrix defined by a dimension or order that differs from the array dimensions or orders depicted herein.

[00103] For example, in some practical applications, the LED die 1110 depicted in FIG. 11 may include over 20,000 LEDs 1112 in asymmetric or symmetric arrangements in a wide range of array dimensions and orders (e.g., a 200x100 array, a symmetric matrix, or a non-symmetric matrix). For example, in some practical applications, two or more LED dice 1110 can be stacked such that LEDs 1112 are arranged to define rows and columns that extend in three spatial directions or dimensions. It will also be understood that the LED die 1110 can itself be a subarray of a larger array (not shown) of LEDs 1112. [00104] LED die 1110 may have a surface area of about 90 mm² or greater and may require significant power to drive the array. In some applications, this power can be as much as 60 watts or more. The LED die 1110 may include hundreds, thousands, or even millions of LEDs or emitters arranged within a centimeter-scale area substrate or smaller. A micro LED may include an array of individual emitters provided on a substrate or may be a single silicon wafer, or die partially or fully divided into light-emitting segments that form the LEDs 1112. In some embodiments, the emitters may have distinct non-white colors. For example, at least four of the emitters may be RGBY groupings of emitters.

[00105] Examples

[00106] Example 1 is an illumination device comprising: a light emitting diode (LED) array comprising segmented LEDs; a plurality of drivers configured to drive different sets of the segmented LEDs, each of the plurality of drivers configured to drive the segmented LEDs of an associated set of the segmented LEDs in parallel to produce light, the light from at least one of the segmented LEDs of the associated set of the segmented LEDs has a different brightness per current density or radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs; and a processor configured to control the drivers to drive the sets of segmented LEDs via driver channels to achieve a targeted illumination from the LED array. [00107] In Example 2, the subject matter of Example 1 includes, wherein the sets of the segmented LEDs are dependent on a number of the driver channels.

[00108] In Example 3, the subject matter of Examples 1-2 includes, wherein: the LED array is rectangular, and the sets of the segmented LEDs include concentric rings around a center.

[00109] In Example 4, the subject matter of Examples 1-3 includes, one or more optical elements configured to adjust light from the LED array, the one or more optical elements having a different shape than the LED array, the light from the sets of segmented LEDs being dependent on the shapes of the one or more optical elements and the LED array.

[00110] In Example 5, the subject matter of Examples 1-4 includes, one or more optical elements configured to adjust light from the LED array, the one or more optical elements having a different shape than the LED array, the drivers configured to drive the sets of segmented LEDs dependent on the shapes of the one or more optical elements and the LED array.

[00111] In Example 6, the subject matter of Example 5 includes, wherein the LED array is rectangular and the one or more optical elements include a rotationally symmetric lens.

[00112] In Example 7, the subject matter of Examples 1-6 includes, wherein each of the segmented LEDs comprises a reflector configured to reflect light from the segmented LED towards an exit surface, reflectivity of the reflector of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different from reflectivity of the reflector of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00113] In Example 8, the subject matter of Examples 1-7 includes, a tile through which the segmented LEDs are electrically coupled to the driver, the tile providing different resistances to couple the at least one of the segmented LEDs of the associated set of the segmented LEDs to the driver than the at least one other of the segmented LEDs of the associated set of segmented LEDs to the driver.

[00114] In Example 9, the subject matter of Examples 1-8 includes, wherein the LED array further comprises: semiconductor layers comprising an active layer configured to generate the light; a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers; a dielectric spacer disposed on the TCO layer; a mirror disposed on the dielectric spacer, the mirror configured to reflect the light toward an exit surface of the LED array; and eVias of each segmented LED to electrically couple the TCO layer to the mirror, at least one characteristic of the eVias of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different than at least one characteristic of the eVias of the at least one other of the segmented LEDs of the associated set of segmented LEDs. [00115] In Example 10, the subject matter of Example 9 includes, wherein the at least one characteristic of the eVias comprises a diameter of the eVias.

[00116] In Example 11, the subject matter of Examples 9-10 includes, wherein the at least one characteristic of the eVias comprises a spatial density of the eVias.

[00117] In Example 12, the subject matter of Examples 1-11 includes, wherein the illumination device is a mobile electronic device.

[00118] In Example 13, the subject matter of Examples 1-12 includes, wherein the illumination device is an automotive adaptive headlight.

[00119] In Example 14, the subject matter of Examples 1-13 includes, wherein the illumination device is at least one headset type including an augmented-reality headset and a virtual-reality headset.

[00120] In Example 15, the subject matter of Examples 1-14 includes, one or more optical elements configured to adjust light from the LED array, the one or more optical elements having a different shape than the LED array, the drivers configured to provide a predetermined current distribution dependent on a field of view of a camera in which the illumination device is incorporated.

[00121] In Example 16, the subject matter of Examples 1-15 includes, wherein: in each segmented LED, nVias couple an n bonding layer to an n-type semiconductor of the segmented LED, and at least one characteristic of the nVias of at least one of the segmented LEDs is different than the at least one characteristic of the nVias of at least one other of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include diameter and density.

[00122] In Example 17, the subject matter of Examples 1-16 includes, wherein: each segmented LED contains: semiconductor layers that include an active layer configured to generate the light; and a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers, and at least one characteristic of the TCO layer of at least one of the segmented LEDs is different than the at least one characteristic of the TCO layer of at least one other of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include uniform thickness over a substantial entirety of the TCO layer and diameter and density of regions of different thicknesses of the TCO layer.

[00123] In Example 18, the subject matter of Examples 1-17 includes, wherein at least one characteristic of is different between pixel segments on a same driver channel, the at least one characteristic selected from a group of characteristics that include: diameter and density of n-edge contacts, diameter and density of nVias that couple an n bonding layer to an n-type semiconductor of the semiconductor layers, and uniform thickness over a substantial entirety of a Transparent Conductive Oxide (TCO) layer disposed on the n-type semiconductor, or diameter and density of regions of different thicknesses of the TCO layer.

[00124] Example 19 is a light emitting diode (LED) array comprising a plurality of segmented LEDs, each of the plurality of segmented LEDs comprising: semiconductor layers comprising an active layer configured to generate light; a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers; a dielectric spacer disposed on the TCO layer; a mirror disposed on the dielectric spacer, the mirror configured to reflect the light toward an exit surface of the LED array; and eVias electrically coupling the TCO layer to the mirror, the segmented LEDs being separated into sets of segmented LEDs that are driven in parallel to produce the light, the light from at least one of the segmented LEDs of an associated set of the segmented LEDs having a different brightness per current density or radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00125] In Example 20, the subject matter of Example 19 includes, wherein the sets of the segmented LEDs are dependent on a number of driver channels configured to drive the segmented LEDs.

[00126] In Example 21, the subject matter of Examples 19-20 includes, wherein the light from at least one of the segmented LEDs of one of the sets of the segmented LEDs having a different brightness per current density or radiance from at least one other of the segmented LEDs of the one of the sets of segmented LEDs dependent on a difference between a shape of the LED array and a shape of one or more optical elements configured to adjust light from the LED array.

[00127] In Example 22, the subject matter of Examples 19-21 includes, wherein: the LED array is rectangular; and the sets of the segmented LEDs include concentric rings around a center pixel.

[00128] In Example 23, the subject matter of Examples 19-22 includes, wherein each of the segmented LEDs comprises a reflector configured to reflect light from the segmented LED towards an exit surface, reflectivity of the reflector of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different from reflectivity of the reflector of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00129] In Example 24, the subject matter of Examples 19-23 includes, wherein a tile through which the segmented LEDs are electrically coupled to a driver is to provide different resistances to couple the at least one of the segmented LEDs of the associated set of the segmented LEDs to the driver than the at least one other of the segmented LEDs of the associated set of segmented LEDs to the driver.

[00130] In Example 25, the subject matter of Examples 19-24 includes, wherein a diameter of the eVias of the at least one of the segmented LEDs of the associated set of the segmented LEDs is different than a diameter of the eVias of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00131] In Example 26, the subject matter of Examples 19-25 includes, wherein a density of the eVias of the at least one of the segmented LEDs of the associated set of the segmented LEDs is different than a density of the e Vias of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00132] In Example 27, the subject matter of Examples 19-26 includes, one or more optical elements configured to adjust light from the LED array, the one or more optical elements having a different shape than the LED array, drivers configured to provide a predetermined current distribution dependent on a field of view of a camera in which the LED array is incorporated. [00133] In Example 28, the subject matter of Examples 19-27 includes, wherein: in each segmented LED, nVias couple an n bonding layer to n-type semiconductor of the semiconductor layers, and at least one characteristic of the nVias of the at least one of the segmented LEDs of the associated set of the segmented LEDs is different than the at least one characteristic of the nVias of at least one other of the segmented LEDs of the associated set of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include diameter and density.

[00134] In Example 29, the subject matter of Examples 19-28 includes, wherein at least one characteristic of the TCO layer of at least one of the segmented LEDs of the associated set of the segmented LEDs is different than the at least one characteristic of the TCO layer of at least one other of the segmented LEDs of the associated set of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include uniform thickness over a substantial entirety of the TCO layer and diameter and density of regions of different thicknesses of the TCO layer.

[00135] In Example 30, the subject matter of Examples 19-29 includes, wherein at least one characteristic of is different between pixel segments on a same driver channel, the at least one characteristic selected from a group of characteristics that include: diameter and density of n-edge contacts, diameter and density of nVias that couple an n bonding layer to an n-type semiconductor of the semiconductor layers, and uniform thickness over a substantial entirety of the TCO layer, or diameter and density of regions of different thicknesses of the TCO layer.

[00136] In Example 31, the subject matter of Examples 19-30 includes, wherein: in each segmented LED of the associated set of the segmented LEDs, nVias couple an n bonding layer to an n-type semiconductor of the segmented LED, and at least one characteristic of the nVias of at least one of the segmented LEDs of the associated set of the segmented LEDs is different than the at least one characteristic of the nVias of at least one other of the segmented LEDs of the associated set of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include diameter and density. [00137] Example 32 is a method of producing light from an illumination device, the method comprising driving sets of segmented light emitting diodes (LEDs) of an LED array to produce a targeted illumination, the segmented LEDs of an associated set of the segmented LEDs being driven in parallel to produce light, the light from at least one of the segmented LEDs of the associated set of the segmented LEDs has a different brightness per current density or radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00138] In Example 33, the subject matter of Example 32 includes, wherein the sets of the segmented LEDs are dependent on a number of a driver channels.

[00139] In Example 34, the subject matter of Examples 32-33 includes, wherein: the LED array is rectangular; and the sets of the segmented LEDs include concentric rings around a center pixel.

[00140] In Example 35, the subject matter of Examples 32-34 includes, using one or more optical elements to adjust light from the LED array, the one or more optical elements having a different shape than the LED array; and driving of the sets of segmented LEDs being dependent on the shapes of the one or more optical elements and the LED array.

[00141] In Example 36, the subject matter of Example 35 includes, wherein the LED array is rectangular and the one or more optical elements includes a rotationally symmetric lens.

[00142] In Example 37, the subject matter of Examples 32-36 includes, wherein each of the segmented LEDs comprises a reflector to reflect light from the segmented LED towards an exit surface, reflectivity of the reflector of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different from reflectivity of the reflector of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00143] In Example 38, the subject matter of Examples 32-37 includes, wherein the segmented LEDs are electrically coupled to a driver through a tile, the tile providing different resistances to couple the at least one of the segmented LEDs of the associated set of the segmented LEDs to the driver than the at least one other of the segmented LEDs of the associated set of segmented LEDs to the driver.

[00144] In Example 39, the subject matter of Examples 32-38 includes, wherein the LED array comprises: semiconductor layers comprising an active layer configured to generate the light; a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers; a dielectric spacer disposed on the TCO layer; a mirror disposed on the dielectric spacer, the mirror configured to reflect the light toward an exit surface of the LED array; and eVias of each segmented LED electrically coupling the TCO layer to the mirror, at least one characteristic of the eVias of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different than at least one characteristic of the eVias of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

[00145] In Example 40, the subject matter of Example 39 includes, wherein the at least one characteristic of the eVias comprises a diameter of the eVias.

[00146] In Example 41, the subject matter of Examples 39-40 includes, wherein the at least one characteristic of the eVias comprises a density of the eVias.

[00147] In Example 42, the subject matter of Examples 32-41 includes, wherein: in each segmented LED, nVias couple an n bonding layer to an n-type semiconductor of the segmented LED, and at least one characteristic of the nVias of at least one of the segmented LEDs is different than the at least one characteristic of the nVias of at least one other of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include diameter and density.

[00148] In Example 43, the subject matter of Examples 32-42 includes, wherein: each segmented LED contains: semiconductor layers that include an active layer configured to generate the light; and a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers, and at least one characteristic of the TCO layer of at least one of the segmented LEDs is different than the at least one characteristic of the TCO layer of at least one other of the segmented LEDs, the at least one characteristic selected from a group of characteristics that include uniform thickness over a substantial entirety of the TCO layer and diameter and density of regions of different thicknesses of the TCO layer.

[00149] In Example 44, the subject matter of Examples 32-43 includes, wherein at least one characteristic of is different between pixel segments on a same driver channel, the at least one characteristic selected from a group of characteristics that include: diameter and density of n-edge contacts, diameter and density of nVias that couple an n bonding layer to an n-type semiconductor of the semiconductor layers, and uniform thickness over a substantial entirety of a Transparent Conductive Oxide (TCO) layer disposed on the n-type semiconductor, or diameter and density of regions of different thicknesses of the TCO layer.

[00150] Example 45 is at least one machine-readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations to implement of any of Examples 1-44.

[00151] Example 46 is an apparatus comprising means to implement of any of Examples 1-44.

[00152] Example 47 is a system to implement of any of Examples 1-44.

[00153] Example 48 is a method to implement of any of Examples 1-44.

[00154] Although an embodiment has been described with reference to specific example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader scope of the present disclosure. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. The accompanying drawings that form a part hereof show, by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced. The embodiments illustrated are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. This Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[00155] The subject matter may be referred to herein, individually and/or collectively, by the term “embodiment” merely for convenience and without intending to voluntarily limit the scope of this application to any single inventive concept if more than one is in fact disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description. [00156] In this document, the terms "a" or "an" are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of "at least one" or "one or more." In this document, the term "or" is used to refer to a nonexclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain-English equivalents of the respective terms "comprising" and "wherein." Also, in the following claims, the terms "including" and "comprising" are open-ended, that is, a system, UE, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. As indicated herein, although the term “a” is used herein, one or more of the associated elements may be used in different embodiments. For example, the term “a processor” configured to carry out specific operations includes both a single processor configured to carry out all of the operations as well as multiple processors individually configured to carry out some or all of the operations (which may overlap) such that the combination of processors carry out all of the operations. Note that the term “about x” and similar terms (e.g., substantially) as used herein may be understood to be within 10% of x or otherwise within a range known to one of skill in the art to be within tolerance of the quantity or quality described, unless otherwise indicated.

[00157] The Abstract of the Disclosure is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it may be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

Claims

WHAT IS CLAIMED IS:

1. An illumination device comprising: a light emitting diode (LED) array comprising segmented LEDs; a plurality of drivers configured to drive different sets of the segmented LEDs, each of the plurality of drivers configured to drive the segmented LEDs of an associated set of the segmented LEDs in parallel to produce light, the light from at least one of the segmented LEDs of the associated set of the segmented LEDs having a different radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs; and a processor configured to control the drivers to drive the sets of segmented LEDs via driver channels to achieve a targeted illumination from the LED array.

2. The illumination device of claim 1, wherein the sets of the segmented LEDs are dependent on a number of the driver channels.

3. The illumination device of claim 1 or 2, wherein: the LED array is rectangular, and the sets of the segmented LEDs are concentric rings around a center.

4. The illumination device of any of claims 1-3, further comprising one or more optical elements configured to adjust light from the LED array, wherein: the one or more optical elements have a different shape than the LED array, the light from the sets of segmented LEDs is dependent on the shapes of the one or more optical elements and the LED array, and the drivers are configured to drive the sets of segmented LEDs dependent on the shapes of the one or more optical elements and the LED array.

5. The illumination device of any of claims 1-4, wherein each of the segmented LEDs comprises a reflector configured to reflect light from the segmented LED towards an exit surface of the segmented LED, reflectivity of the reflector of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different from reflectivity of the reflector of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

6. The illumination device of any of claims 1-5, further comprising a tile through which the segmented LEDs are electrically coupled to the driver, the tile providing different resistances to couple the at least one of the segmented LEDs of the associated set of the segmented LEDs to the driver than the at least one other of the segmented LEDs of the associated set of segmented LEDs to the driver.

7. The illumination device of any of claims 1-6, wherein the LED array further comprises: semiconductor layers comprising an active layer configured to generate the light; a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers; a dielectric spacer disposed on the TCO layer; a mirror disposed on the dielectric spacer, the mirror configured to reflect the light toward an exit surface of the LED array; and eVias of each segmented LED to electrically couple the TCO layer to the mirror, at least one characteristic of the e Vias of the at least one of the segmented LEDs of the associated set of the segmented LEDs being different than at least one characteristic of the eVias of the at least one other of the segmented LEDs of the associated set of segmented LEDs.

8. The illumination device of claim 7, wherein the at least one characteristic of the eVias comprises a diameter of the eVias.

9. The illumination device of claim 7, wherein the at least one characteristic of the eVias comprises a spatial density of the eVias.

10. The illumination device of any of claims 1-9, further comprising one or more optical elements configured to adjust light from the LED array, the one or more optical elements having a different shape than the LED array, the drivers configured to provide a predetermined current distribution dependent on a field of view of a camera in which the illumination device is incorporated.

11. The illumination device of any of claims 1-10, wherein: in each segmented LED, nVias couple an n bonding layer to an n-type semiconductor of the segmented LED, and at least one characteristic of the nVias of at least one of the segmented LEDs is different than the at least one characteristic of the nVias of at least one other of the segmented LEDs.

12. The illumination device of claim 11, wherein the at least one characteristic of the nVias comprises a diameter of the nVias.

13. The illumination device of claim 11, wherein the at least one characteristic of the nVias comprises a spatial density of the nVias.

14. The illumination device of any of claims 1-13, wherein: each segmented LED contains: semiconductor layers that include an active layer configured to generate the light; and a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers, and at least one characteristic of the TCO layer of at least one of the segmented LEDs is different than the at least one characteristic of the TCO layer of at least one other of the segmented LEDs.

15. The illumination device of claim 14, wherein the at least one characteristic is selected from a group of characteristics that include uniform thickness over a substantial entirety of the TCO layer and diameter and density of regions of different thicknesses of the TCO layer.

16. The illumination device of any of claims 1-15, wherein at least one characteristic is different between pixel segments on a same driver channel, the at least one characteristic selected from a group of characteristics that include: diameter and density of n-edge contacts, diameter and density of nVias that couple an n bonding layer to an n-type semiconductor of the semiconductor layers, and uniform thickness over a substantial entirety of a Transparent Conductive Oxide (TCO) layer disposed on the n-type semiconductor, or diameter and density of regions of different thicknesses of the TCO layer.

17. A light emitting diode (LED) array comprising a plurality of segmented LEDs, each of the plurality of segmented LEDs comprising: semiconductor layers comprising an active layer configured to generate light; a Transparent Conductive Oxide (TCO) layer disposed on the semiconductor layers; a dielectric spacer disposed on the TCO layer; a mirror disposed on the dielectric spacer, the mirror configured to reflect the light toward an exit surface of the LED array; and eVias electrically coupling the TCO layer to the mirror, the segmented LEDs being separated into sets of segmented LEDs that are driven in parallel to produce the light, the light from at least one of the segmented LEDs of an associated set of the segmented LEDs having a different radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs.

18. The LED array of claim 17, wherein a tile through which the segmented LEDs are electrically coupled to a driver is to provide different resistances to couple the at least one of the segmented LEDs of the associated set of the segmented LEDs to the driver than the at least one other of the segmented LEDs of the associated set of segmented LEDs to the driver.

19. A method of producing light from an illumination device, the method comprising driving sets of segmented light emitting diodes (LEDs) of an LED array to produce a targeted illumination, the segmented LEDs of an associated set of the segmented LEDs being driven in parallel to produce light, the light from at least one of the segmented LEDs of the associated set of the segmented LEDs has a different radiance from the light from at least one other of the segmented LEDs of the associated set of segmented LEDs.

20. The method of claim 19, wherein the sets of the segmented LEDs include concentric rings around a center pixel.