EP4721518A1 - Electronic drive architecture using blu controller and segmented die - Google Patents

Abstract

An LED driver architecture for vehicular and other applications and method of fabricating the LED and driver architecture are described. LED arrays are coupled in parallel to backlight unit (BLU) drivers and to a boost converter to provide a constant voltage to the LED arrays. Data from a Controller Area Network (CAN) bus suppled to the BLU drivers drives the LED arrays. Hybrid driving of low-dropout (LDO) voltage current sources permits individual control of a current and on/off time of an LED coupled to the LDO voltage current source. A vertical synchronization (VSYNC) pulse resets row/column logic of the LED arrays between frames. Each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric.

Description

ELECTRONIC DRIVE ARCHITECTURE USING BLU CONTROLLER AND SEGMENTED DIE

PRIORITY CLAIM

[0001] This application claims the benefit of priority to United States Provisional Patent Application Serial No. 63/469,946, filed May 31, 2023, which is incorporated herein by reference in its entirety.

FIELD OF THE DISCLOSURE

[0002] The present disclosure relates to light emitting diode (LED) arrays. In particular, embodiments are directed to driving LED arrays.

BACKGROUND OF THE DISCLOSURE

[0003] Driver architectures for LED arrays may enable the LEDs to be relatively efficient at the cost of being monetarily expensive. In certain environments, however, increasing the efficiency is less desirable than a significant cost reduction.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] FIG. 1 shows a driver architecture.

[0005] FIG. 2 illustrates a driver architecture, in accordance with some examples.

[0006] FIG. 3A illustrates layers of a segmented die, in accordance with some examples.

[0007] FIG. 3B illustrates an additional layer of the segmented die shown in FIG. 3A, in accordance with some examples.

[0008] FIG. 3C illustrates an additional layer of the segmented die shown in FIG. 3B, in accordance with some examples.

[0009] FIG. 4A illustrates a top view of a printed circuit board (PCB), in accordance with some examples.

[0010] FIG. 4B illustrates a perspective view of the PCB of FIG. 4A, according to some examples. [0011] FIG. 5 illustrates an example of a general device in accordance with some embodiments.

[0012] FIG. 6 illustrates an example lighting system, according to some embodiments.

[0013] FIG. 7 illustrates an example hardware arrangement for implementing the above disclosed subject matter, according to some embodiments.

[0014] FIG. 8 illustrates an example method of fabricating an illumination device, according to some embodiments.

[0015] FIG. 9 is a diagram of an example vehicle headlamp system.

DETAILED DESCRIPTION

[0016] Existing LED driver architectures contain a variety of components, some of which are excessively expensive for the system in which the driver and LED array is to be located. In some systems, notably (but not only) vehicular systems, cost is one of the parameters used to determine attractiveness of a particular LED system for a particular application.

[0017] FIG. 1 shows an example of a driver architecture. The driver architecture 100 may be disposed in a vehicle or used in other consumer or industrial applications. The driver architecture 100 may be an MxN driver architecture that includes multiple matrix drivers 106. Each of the matrix drivers 106 has twelve bypass switches 106a integrated to control a string of twelve LEDs 108. Multiple strings of LEDs 108 are connected in parallel to create an MxN LED architecture (FIG. 1 shows an 84-up system (7*12) as an example). Each bypass switch 106a is coupled to a level shifter 106b to set an appropriate voltage for the bypass switch 106a as the bypass switches 106a are not grounded. Each of the string of LEDs 108 uses a constant current source, typically in the form of a switched mode down converter (buck converter 104). Power from a battery may be supplied to a boost converter 102 that increases the battery voltage of typically 8- 12V to about 42V to provide a constant array voltage, which is then converted to a relatively high constant current of about 700mA by the buck converter 104. As shown, a single buck converter 104 may provide separate constant currents to two strings of LEDs 108. LED matrix drivers are monolithic high-efficiency LED drivers designed to supply LED arrays used in the backlighting of LCD panels various applications.

[0018] A digital serial interface coupled to a vehicle Controller Area Network (CAN) bus 110 may be provided for control of each LED in the strings of LEDs 108. The LEDs of a string of LEDs 108 are connected in series, with the associated bypass switch 106a of an LED acting as a shunt to allow the LED to be bypassed. This permits individual control of the operation of tightly packed (e.g., 80-100) high power LEDs.

[0019] Such a driver architecture 100 may be relatively expensive as not only are a high-power boost converter and CAN interface used to operate the LEDs, but in addition, a large number of matrix drivers and associated buck converters are used.

[0020] FIG. 2 illustrates a driver architecture, in accordance with some examples. The driver architecture 200 of FIG. 2 may use a lower power booster converter 202 than that of the driver shown in FIG. 1. The booster converter 202 increases a battery voltage of, for example, typically 8-12V to about 27-28V to provide a constant array voltage at a current of less than about, for example, 66mA to the LEDs 208 (e.g., about 56mA). Instead of a large number of matrix drivers being used to individually control the LEDs 208, a smaller number of backlight unit (BLU) drivers 206 may be used to drive the same number of LEDs 208.

[0021] Each BLU driver 206 may be coupled with a larger number of LEDs 208 than the matrix driver 106 (as shown in FIG. 2, most of the BLU drivers 206 are coupled to 32 LEDs). In some embodiments, the number of LEDs may be equally distributed such that each BLU driver 206 is coupled to an identical number of LEDs 208; in other embodiments, such as that in FIG. 2, at least one BLU driver 206 has a different number of LEDs 208 coupled thereto than at least one other BLU driver 206. Although three BLU drivers 206 are shown in FIG. 2, in which only one BLU driver 206 has a different number of LEDs 208 coupled thereto than the other two BLU drivers 206, which have an identical number of LEDs 208 coupled thereto, in other embodiments, additional BLU drivers 206 may be used in which each of the other BLU driver 206 may have a different number of LEDs 208 coupled thereto than each other BLU driver 206 or a first set of multiple BLU drivers 206 may have an identical first number of LEDs 208 coupled thereto, which may be different than a second set of multiple BLU drivers 206 that have an identical second number of LEDs 208 coupled thereto.

[0022] Each BLU driver 206 may have a channel that contains a switch 206a for each LED 208. Unlike the driver architecture 100 shown in FIG. 1, in which LEDs in each string of LEDs 108 are connected in series between the boost converter 102 and ground, the LEDs 208 in FIG. 2 are coupled in parallel between the boost converter 202 and the associated BLU driver 206 (and thus ground through the associated switch 206a in the BLU driver 206). Note that although a 1-1 correspondence is shown between the LEDs 208 and the switches 206a in FIG. 2, in other embodiments this correspondence may be different; multiple switches 206a may be coupled to a single LED 208 or multiple LEDs 208 may be coupled to a single switch 206a dependent on a desired redundancy of components for example. A digital serial interface may be coupled to a vehicle CAN bus 210, as well as being coupled to each BLU driver 206 and used to individually control driving of each LED 208 coupled to the BLU driver 206 via control of the corresponding switch 206a.

[0023] In some embodiments, each LED 208 coupled to the BLU driver 206 may be controlled in a hybrid manner. That is, unlike the matrix drivers 106 in FIG. 1 in which the LEDs 108 are individually bypassed, each LED 208 coupled to the BLU driver 206 may be controlled using both analog signals and digital (e.g., pulse width modulation (PWM)) signals. For example, the analog signals and/or PWM signals may be used to dim, rather than entirely deactivate, an individual LED 208 by controlling the timing of current supplied to the corresponding LED 208. Each of the analog signals and PWM signals may be provided by a different signal generator.

[0024] Each switch 206a may be a transconductance device such as a metal-oxide-semiconductor (MOS) transistor. The switch 206a may operate in a nearly saturated state to permit operation in either analog or digital mode and provide increased dimming options. In addition, due to the parallel arrangement of the LEDs 208, the driver architecture 200 of FIG. 2 may enjoy built-in protection against open and shorting of the LEDs 208. That is, one of the LEDs 208 being open or shorted may not affect operation of others of the LEDs 208. [0025] Each BLU driver 206 may include a low-dropout (LDO) voltage current source (one or more linear regulators) in series with the LEDs 208 to individually control the current and the on/off time of each LED 208, as above hybrid driving. This is unlike the matrix drivers 106 of FIG. 1, which use MOSFETs as switches in parallel with each LED to individually control only the on/off time of each LED 108. Thus, hybrid driving is not possible with a matrix driver 106.

[0026] The driver architecture 200 of FIG. 2 may also permit vertical synchronization (VSYNC) to be used between images, which may be displayed for a predetermined time period. Every time a new frame (image) is to be displayed (i.e., the predetermined time period is reached), the data used to generate the frame may be followed by a VSYNC pulse to reset the row/column logic and make the display ready for the next frame. The backplane (discussed in more detail in the description of FIG. 7) may act as a display driver where frames are loaded for the next image to be displayed, so the driver architecture 200 uses a VSYNC pulse to clear the logic. In some headlamp applications for example, the LED array (which, as used herein may include microLEDs and/or larger LEDs) and MxN driver are combined to illuminate different portions of the road, and data sent to both the LED array and MxN driver is synchronized. The matrix drivers 106 do not have a built-in VSYNC and are synchronized using firmware or other methods. The BLU drivers 206 however, have separate VSYNC inputs, which simplifies incorporation and use of VSYNC in the driver architecture 200.

[0027] Similarly, a serial peripheral interface (SPI) bus is typically a point-to-point serial bus that may not be available when the matrix drivers 106 are used. However, pass-through may be used in an integrated circuit (IC) coupled to the SPI bus so that more than one device can be controlled. A pass- through input may be available for the BLU drivers 206. That is, in some embodiments, a single SPI bus interface may be used to control a larger number of BLU drivers 206. [0028] The driver architecture 200 of FIG. 2 may thus contain fewer components than of driver architecture 100 of FIG. 1. For example, the seven matrix drivers 106 and associated buck converters 104 shown in FIG. 1 may be replaced with only three BLU drivers 206 shown in FIG. 2. As the BLU drivers 206 shown use a relatively low current, the individual LEDs 108 shown in FIG.

1 may be replaced with segmented LEDs.

[0029] FIG. 3A illustrates layers of a segmented die, in accordance with some examples. FIG. 3B illustrates an additional layer of the segmented die shown in FIG. 3A, in accordance with some examples. FIG. 3C illustrates an additional layer of the segmented die shown in FIG. 3B, in accordance with some examples.

[0030] In FIG. 3A illustrates a die 300 that may be separated into a plurality of pixels 302. The pixels 302 may be equally sized (i.e., each pixel 302 has identical dimensions as each other pixel 302) or unequally sized (i.e., at least one pixel 302 has a different corresponding dimension than at least one other pixel 302). In the example shown in FIG. 3A, 3x3 equally sized pixels 302 are disposed in a matrix and are separated by epitaxial trenches 304 in the materials that form the pixels 302. The 3x3 matrix is provided merely as an example; other matrix sizes are contemplated and may be of any shape (rectangular, square, or other). The trenches 304 may be formed e.g., by etching (chemical and/or plasma) through the semiconductor forming the LED, filling the area with one or more layers of dielectric such as silicon oxide or silicon dioxide (SiO_x) or silicon nitride (SiN) (with perhaps other conductive materials to form a reflective barrier between the pixels), and then planarizing the resulting structure. Other fabrication steps are not described for convenience.

[0031] Adjacent pairs of pixels 302 may be electrically coupled together via segmented bonding layers 306 that bridge one of the trenches 304. The bonding layers 306 may be formed from copper (Cu) and/or Al, for example. In particular, vias to the p-type semiconductor (p-vias) and vias to the n-type semiconductor (n-vias) may be interconnected over the trenches 304.

[0032] In FIG. 3B a redistribution (RDL) dielectric layer 308 is disposed over the segmented bonding layers 306. The RDL dielectric layer 308 may be significantly thicker than other dielectric layers such as the dielectric used to fill the trenches 304 and may be planarized after deposition or other deposition mechanism. Openings 310 are formed in the RDL dielectric layer 308; the openings 310 correspond to the first and ninth pixels 302 shown in FIG. 3A. [0033] FIG. 3C shows Under Bump Metallurgy (UBM) pads 312 disposed on the RDL dielectric layer 308. The UBM pads 312 may form an anode and a cathode. If SiN_x is used for the trenches 304, segmentation may result in less than 10% loss in efficiency, which may be reduced even further if SiO? is used. This loss may be partially compensated by techniques such as hybrid dimming, use of a different insulator, or a different package assembly. In other embodiments, other types of connects, such as

[0034] FIG. 4A illustrates a top view of a PCB, in accordance with some examples. FIG. 4B illustrates a perspective view of the PCB of FIG. 4A, according to some examples. The PCB 400 shown in FIGS. 4A and 4B may have fewer components than conventional PCBs, as described above, leading to a reduced PCB size. Multiple PCBs may be coupled to a backplane as is understood by a person of ordinary skill in the art. A light source that contains LEDs, when the driver architecture of FIG. 2 is used in the headlamp of an automobile, for example, may be driven in either a high beam or a low beam configuration.

[0035] Each of the LEDs in a light source may be formed from one or more inorganic materials (e.g., binary compounds such as gallium arsenide (GaAs), ternary compounds such as aluminum gallium arsenide (AlGaAs), quaternary compounds such as indium gallium phosphide (InGaAsP), gallium nitride (GaN), or other suitable materials), usually either III-V materials (defined by columns of the Periodic Table) or II- VI materials. Each of the LEDs may emit light in the visible spectrum (about 400nm to about 800 nm). In some embodiments, one or more other layers, such as a phosphor layer may be disposed on each of the one or more LED arrays to convert the light from the LEDs into white (or another color) light.

[0036] In some embodiments, at least some of the LEDs may emit light in the infrared spectrum (above about 800nm) LEDs. In this case, LEDs that emit light in the infrared spectrum may be, for example, interspersed with LEDs that emit light in the visible spectrum, or each type of LED (visible emitter/infrared emitter) may be disposed on different sections of a particular array. Alternatively, each LED array may only emit light in either the visible spectrum or the infrared spectrum; separate (one or more) LED arrays may be used to emit light in the infrared spectrum, each of the LEDs may be controllable by a processor.

[0037] Each of the LEDs may be a microLED or may be larger than a microLED. A microLED array may include thousands to millions of microscopic LEDs that may emit light and that may be individually controlled or controlled in groups of pixels (e.g., 5x5 groups of pixels). MicroLEDs are small (e.g., < 0.01 mm on a side) and may provide monochromatic or multi -chromatic light, typically red, green, or blue using inorganic semiconductor material such as that indicated above.

[0038] The light source may include at least one lens and/or other optical elements such as reflectors. The lens and/or other optical elements may direct the light emitted by the one or more LED arrays towards one or more locations to be illuminated.

[0039] FIG. 5 illustrates an example of a general device in accordance with some embodiments. The device 500 may be a mobile device such as a laptop computer (PC), a tablet PC, or a smart phone, or an automotive device, for example. Various elements may be provided on the backplane indicated above, while other elements may be local or remote. Examples, as described herein, may include, or may operate on, logic or a number of components, modules, or mechanisms.

[0040] Modules and components are tangible entities (e.g., hardware) capable of performing specified operations and may be configured or arranged in a certain manner. In an example, circuits may be arranged (e.g., internally or with respect to external entities such as other circuits) in a specified manner as a module. In an example, the whole or part of one or more computer systems (e.g., a standalone, client or server computer system) or one or more hardware processors may be configured by firmware or software (e.g., instructions, an application portion, or an application) as a module that operates to perform specified operations. In an example, the software may reside on a machine readable medium. In an example, the software, when executed by the underlying hardware of the module, causes the hardware to perform the specified operations.

[0041] Accordingly, the term “module” (and “component”) is understood to encompass a tangible entity, be that an entity that is physically constructed, specifically configured (e.g., hardwired), or temporarily (e.g., transitorily) configured (e.g., programmed) to operate in a specified manner or to perform part or all of any operation described herein. Considering examples in which modules are temporarily configured, each of the modules need not be instantiated at any one moment in time. For example, where the modules comprise a general-purpose hardware processor configured using software, the general -purpose hardware processor may be configured as respective different modules at different times. Software may accordingly configure a hardware processor, for example, to constitute a particular module at one instance of time and to constitute a different module at a different instance of time.

[0042] The electronic device 500 may include a hardware processor (or equivalently processing circuitry) 502 (e.g., a central processing unit (CPU), a GPU, a hardware processor core, or any combination thereof), a memory 504 (which may include main and static memory), some or all of which may communicate with each other via an interlink (e.g., bus) 508. The memory 504 may contain any or all of removable storage and non-removable storage, volatile memory or non-volatile memory. The electronic device 500 may further include a display/light source 510 such as the LEDs described above, or a video display, an alphanumeric input device 512 (e.g., a keyboard), and a user interface (UI) navigation device 514 (e.g., a mouse). In an example, the display/light source 510, input device 512 and UI navigation device 514 may be a touch screen display. The electronic device 500 may additionally include a storage device (e.g., drive unit) 516, a signal generation device 518 (e.g., a speaker), a network interface device 520, one or more cameras 528, and one or more sensors 530, such as a global positioning system (GPS) sensor, compass, accelerometer, or other sensor such as those described herein. The electronic device 500 may further include an output controller, such as a serial (e.g., universal serial bus (USB), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC), etc.) connection to communicate or control one or more peripheral devices (e.g., a printer, card reader, etc.).

[0043] The storage device 516 may include a non-transitory machine readable medium 522 (hereinafter simply referred to as machine readable medium) on which is stored one or more sets of data structures or instructions 524 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 524 may also reside, completely or at least partially, within the memory 504 and/or within the hardware processor 502 during execution thereof by the electronic device 500. While the machine readable medium 522 is illustrated as a single medium, the term "machine readable medium" may include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) configured to store the one or more instructions 524.

[0044] The term “machine readable medium” may include any medium that is capable of storing, encoding, or carrying instructions for execution by the electronic device 500 and that cause the electronic device 500 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding or carrying data structures used by or associated with such instructions. Non-limiting machine-readable medium examples may include solid-state memories, and optical and magnetic media. Specific examples of machine-readable media may include: non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; Random Access Memory (RAM); and CD-ROM and DVD-ROM disks.

[0045] The instructions 524 may further be transmitted or received over a communications network using a transmission medium 526 via the network interface device 520 utilizing any one of a number of wireless local area network (WLAN) transfer protocols (e.g., frame relay, internet protocol (IP), transmission control protocol (TCP), user datagram protocol (UDP), hypertext transfer protocol (HTTP), etc.) or the SPI or CAN bus. Example communication networks may include a local area network (LAN), a wide area network (WAN), a packet data network (e.g., the Internet), mobile telephone networks (e.g., cellular networks), Plain Old Telephone (POTS) networks, and wireless data networks. Communications over the networks may include one or more different protocols, such as Institute of Electrical and Electronics Engineers (IEEE) 802.11 family of standards known as Wi-Fi, IEEE 802.16 family of standards known as WiMax, IEEE 802.15.4 family of standards, a Long Term Evolution (LTE) family of standards, a Universal Mobile Telecommunications System (UMTS) family of standards, peer-to-peer (P2P) networks, a next generation (NG)/5^th generation (5G) standards among others. In an example, the network interface device 520 may include one or more physical jacks (e.g., Ethernet, coaxial, or phonejacks) or one or more antennas to connect to the transmission medium 526.

[0046] Note that the term “circuitry” as used herein refers to, is part of, or includes hardware components such as an electronic circuit, a logic circuit, a processor (shared, dedicated, or group) and/or memory (shared, dedicated, or group), an Application Specific Integrated Circuit (ASIC), a field-programmable device (FPD) (e.g., a field-programmable gate array (FPGA), a programmable logic device (PLD), a complex PLD (CPLD), a high-capacity PLD (HCPLD), a structured ASIC, or a programmable SoC), digital signal processors (DSPs), etc., that are configured to provide the described functionality. In some embodiments, the circuitry may execute one or more software or firmware programs to provide at least some of the described functionality. The term “circuitry” may also refer to a combination of one or more hardware elements (or a combination of circuits used in an electrical or electronic system) with the program code used to carry out the functionality of that program code. In these embodiments, the combination of hardware elements and program code may be referred to as a particular type of circuitry.

[0047] The term “processor circuitry” or “processor” as used herein thus refers to, is part of, or includes circuitry capable of sequentially and automatically carrying out a sequence of arithmetic or logical operations, or recording, storing, and/or transferring digital data. The term “processor circuitry” or “processor” may refer to one or more application processors, one or more baseband processors, a physical central processing unit (CPU), a single- or multi-core processor, and/or any other device capable of executing or otherwise operating computer-executable instructions, such as program code, software modules, and/or functional processes.

[0048] The camera 528 may sense light at least the wavelength or wavelengths emitted by the LEDs. The camera 528 may include optics (e.g., at least one camera lens) that are able to collect reflected light of illumination that is reflected from and/or emitted by an illuminated region. The camera lens may direct the reflected light onto a multi-pixel sensor (also referred to as a light sensor) to form an image of on the multi-pixel sensor.

[0049] The processor 502 may control and drive the LEDs via one or more drivers. For example, the processor 502 may optionally control one or more LEDs in LED arrays independent of another one or more LEDs in the LED arrays, so as to illuminate an area in a specified manner.

[0050] In addition, the sensors 530 may be incorporated in the camera 528 and/or the light source 510. The sensors 530 may sense visible and/or infrared light, and may further sense the ambient light and/or variations/flicker in the ambient light in addition to reception of the reflected light from the LEDs. The sensors may have one or more segments (that are able to sense the same wavelength/range of wavelengths or different wavelength/range of wavelengths), similar to the LED arrays.

[0051] FIG. 6 illustrates an example lighting system, according to some embodiments. As above, some of the elements shown in the lighting system 600 may not be present, while other additional elements may be disposed in the lighting system 600. The lighting system 600 may include a controller 602 that controls illumination using a pixel array 610 that contains multiple individual pixels 612.

[0052] In some embodiments, some or all of the components described as the controller 602 may be disposed on a backplane such as, for example, a complementary metal oxide semiconductor (CMOS) backplane. The controller 602 may be coupled to or include one or more processors 604. The processor 604 may receive image data (in frames) via an interface and may process the image data to control a generator 606a, for example, controlling analog signals or PWM duty cycles and/or turn-on times for causing the lighting system 600 to produce the images indicated by the image data.

[0053] The controller 602 may further include a frame buffer 608. The frame buffer 608 may store one or more images prior to the one or more processors 604 and store the images for implementation by the one or more processors 604.

[0054] The generator 606a may be controlled by the processor 604 and may produce driving signals in accordance with the indications. The generator 606a may be coupled to a driver 606b (such as that described in FIG. 2) to drive the pixel array 610 so that the pixels 612 provide desired intensities of light.

[0055] Each pixel 612 may include one or more LEDs 614. The LEDs 614 may be different colors and may be controlled individually or in groups. As shown, the pixel 612 may include, for each pixel 612 or LED 614, a PWM switch, and a current source. The pixel 612 may be driven by the driver 606b. The signal from the generator 606a may cause the switch to open and close in accordance with the value of the signal. The signal corresponding to the intensities of light may cause the current source to produce a current flow to cause the pixels 612 to produce the corresponding intensities of light.

[0056] The lighting system 600 may further include a power supply 620. In some embodiments, the power supply 620 may be a battery that produces power for the controller 602.

[0057] FIG. 7 illustrates an example hardware arrangement for implementing the above disclosed subject matter, according to some embodiments. In particular, the hardware arrangement 700 may include an LED die 702 that contains the LED array(s) and a backplane, such as a CMOS backplane 704. The LED die 702 may be coupled to the CMOS backplane 704 by one or more interconnects 710, where the interconnects 710 may provide for transmission of signals between the LED die 702 and the CMOS backplane 704. The interconnects 710 may comprise one or more solder bump joints, one or more copper pillar bump joints, other types of interconnects known in the art, or some combination thereof.

[0058] The LED die 702 may include circuitry to implement the LED array described above. In particular, the LED die 702 may include a plurality of LEDs. The LED die 702 may include a shared active layer and a shared substrate for the LED array, and thereby the LED array may be a monolithic LED array. Each LED of the LED array may include an individual segmented active layer and/or substrate. In some embodiments, the LED die 702 may further include switches and current sources to drive the LED array as described above. In other embodiments, the switches and the current sources may be included in the CMOS backplane 704. The LEDs may be micro-LEDs or LEDs larger than micro-LEDs.

[0059] The CMOS backplane 704 may include circuitry to implement the control module. The CMOS backplane 704 may utilize the interconnects 710 to provide the LED array with the driving signals and the signals for the intensity for causing the LED array to produce light in accordance with the signals and the intensity.

[0060] The hardware arrangement 700 may further include a PCB 706. The PCB 706 may include circuitry to implement various functionality described herein. The PCB 706 may be coupled to the CMOS backplane 704. For example, the PCB 706 may be coupled to the CMOS backplane 704 via one or more wire bonds 712. The PCB 706 and the CMOS backplane 704 may exchange image data, power, and/or feedback via the coupling, among other signals. The LED die 702 and the CMOS backplane 704 may form a hybridized die on the PCB 706.

[0061] As shown, the LEDs and circuitry supporting the LED array can be packaged and include a submount or printed circuit board for powering and controlling light production by the LEDs. The PCB supporting the LED array may include electrical vias, heat sinks, ground planes, electrical traces, and flip chip or other mounting systems. The submount or PCB may be formed of any suitable material, such as ceramic, silicon, aluminum, etc. In some embodiments, the PCB may be formed using a flexible substrate such as a polymer such as polyimide and polyethylene terephthalate (PET). If the submount material is conductive, an insulating layer may be formed over the substrate material, and a metal electrode pattern formed over the insulating layer for contact with the micro-LED array. The submount can act as a mechanical support, providing an electrical interface between electrodes on the LED array and a power supply, and also provide heat sink functionality.

[0062] In general, a variety of applications may be supported by LED arrays. Such applications may include stand-alone applications to provide general illumination (e.g., within or external to a room or vehicle) or to provide specific images. In addition to devices such as a luminaire, projector, mobile device, the system may be used to provide either augmented reality (AR) and virtual reality (VR)-based applications. Visualization systems, such as VR and AR systems, are becoming increasingly more common across numerous fields such as entertainment, education, medicine, and business. Various types of devices may be used to provide AR/VR to users, including headsets, glasses, and projectors. Such an AR/VR system may include components similar to those described above: the micro-LED array, a display or screen (which may include touchscreen elements), a micro-LED array controller, sensors, and a controller, among others. The AR/VR components can be disposed in a single structure, or one or more of the components shown can be mounted separately and connected via wired or wireless communication. Power and user data may be provided to the controller. The user data input can include information provided by audio instructions, haptic feedback, eye or pupil positioning, or connected keyboard, mouse, or game controller. The sensors may include cameras, depth sensors, audio sensors, accelerometers, two or three axis gyroscopes and other types of motion and/or environmental/wearer sensors that provide the user input data. Other sensors can include but are not limited to air pressure, stress sensors, temperature sensors, or any other suitable sensors for local or remote environmental monitoring. In some embodiments, the control input can include detected touch or taps, gestural input, or control based on headset or display position. As another example, based on the one or more measurement signals from one or more gyroscope or position sensors that measure translation or rotational movement, an estimated position of the AR/VR system relative to an initial position can be determined.

[0063] In some embodiments, the controller may control individual micro-LEDs or one or more groups of LEDs to display content (AR/VR and/or non- AR/VR) to the user while controlling other LEDs and sensors used in eye tracking to adjust the content displayed. Content display LEDs may be designed to emit light within the visible band (approximately 400 nm to 780 nm) while LEDs used for tracking may be designed to emit light in the IR band (approximately 780 nm to 2,200 nm). In some embodiments, the tracking LEDs and content LEDs may be simultaneously active. In some embodiments, the tracking LEDs may be controlled to emit tracking light during a time period that content LEDs are deactivated and are thus not displaying content to the user.

The AR/VR system can incorporate optics, such as those described above, and/or an AR/VR display, for example to couple light emitted by LED array onto the AR/VR display.

[0064] In some embodiments, the AR/VR controller may use data from the sensors to integrate measurement signals received from the accelerometers over time to estimate a velocity vector and integrate the velocity vector over time to determine an estimated position of a reference point for the AR/VR system. In other embodiments, the reference point used to describe the position of the AR/VR system can be based on depth sensor, camera positioning views, or optical field flow. Based on changes in position, orientation, or movement of the AR/VR system, the system controller can send images or instructions the light emitting array controller. Changes or modification the images or instructions can also be made by user data input, or automated data input.

[0065] In general, in a VR system, a display can present to a user a view of scene, such as a three-dimensional scene. The user can move within the scene, such as by repositioning the user’s head or by walking. The VR system can detect the user’s movement and alter the view of the scene to account for the movement. For example, as a user rotates the user’s head, the system can present views of the scene that vary in view directions to match the user’s gaze. In this manner, the VR system can simulate a user’s presence in the three- dimensional scene. Further, a VR system can receive tactile sensory input, such as from wearable position sensors, and can optionally provide tactile feedback to the user.

[0066] In an AR system, on the other hand, the display can incorporate elements from the user’s surroundings into the view of the scene. For example, the AR system can add textual captions and/or visual elements to a view of the user’s surroundings. For example, a retailer can use an AR system to show a user what a piece of furniture would look like in a room of the user’s home, by incorporating a visualization of the piece of furniture over a captured image of the user’s surroundings. As the user moves around the user’s room, the visualization accounts for the user’s motion and alters the visualization of the furniture in a manner consistent with the motion. For example, the AR system can position a virtual chair in a room. The user can stand in the room on a front side of the virtual chair location to view the front side of the chair. The user can move in the room to an area behind the virtual chair location to view a back side of the chair. In this manner, the AR system can add elements to a dynamic view of the user’s surroundings.

[0067] FIG. 8 illustrates an example method 800 of fabricating an illumination device, according to some embodiments. Not all of the operations may be undertaken in the method 800, and/or additional operations may be present. The operations may occur in a different order from that indicated in FIG. 8

[0068] At operation 802, one or more LED arrays are attached to a backplane. The backplane may have additional circuitry and components (e.g., one or more processors) installed thereon. The LED arrays may contain LEDs that are segmented during fabrication; the semiconductor layers that form the LEDs being separated by trenches etched in at least some of the semiconductor layers and then filled with dielectric material or materials as described above. [0069] At operation 804, one or more BLU controllers are attached to the backplane. The BLU controllers and LEDs may be electrically connected by circuitry in the backplane.

[0070] At operation 806, the entire assembly that includes the LEDs, BLU controllers, optics, and other components may be installed in an apparatus. The apparatus may be, for example, a vehicle headlight or an electronic device as provided in the examples above. The vehicle headlight may be installed in a vehicle.

[0071] At operation 808, the LEDs may be driven using the BLU controllers. Any testing of driving of the LEDs may be undertaken before and/or after installation of the assembly in the apparatus. [0072] FIG. 9 is a diagram of an example vehicle headlamp system 900. The example vehicle headlamp system 900 illustrated in FIG. 9 includes power lines 902, a data bus 904, an input filter and protection module 906, a bus transceiver 908, a sensor module 910, an LED direct current to direct current (DC/DC) module 912, a logic low-dropout (LDO) module 914, a microcontroller 916 and an active headlamp 918. In embodiments, the active headlamp 918 may include an LED lighting system. In some embodiments, some electronic components of some or all of the modules in the vehicle headlamp system 900 may be accommodated on the top surface of the LED lighting system and some may be provided on the circuit board.

[0073] The power lines 902 may have inputs that receive power from a vehicle, and the data bus 904 may have inputs/outputs over which data may be exchanged between the vehicle and the vehicle headlamp system 900. For example, the vehicle headlamp system 900 may receive instructions from other locations in the vehicle, such as instructions to turn on turn signaling or turn on headlamps, and may send feedback to other locations in the vehicle if desired. The sensor module 910 may be communicatively coupled to the data bus 904 and may provide additional data to the vehicle headlamp system 900 or other locations in the vehicle related to, for example, environmental conditions (e.g., time of day, rain, fog, or ambient light levels), vehicle state (e.g., parked, inmotion, speed of motion, or direction of motion), and presence/position of other objects (e.g., vehicles or pedestrians). A headlamp controller that is separate from any vehicle controller communicatively coupled to the vehicle data bus may also be included in the vehicle headlamp system 900. In FIG. 9, the headlamp controller may be a micro-controller, such as micro-controller (pc) 916. The micro-controller 916 may be communicatively coupled to the data bus 904

[0074] The input filter and protection module 906 may be electrically coupled to the power lines 902 and may, for example, support various filters to reduce conducted emissions and provide power immunity. Additionally, the input filter and protection module 906 may provide electrostatic discharge (ESD) protection, load-dump protection, alternator field decay protection, and/or reverse polarity protection. [0075] The LED DC/DC module 912 may be coupled between the filter and protection module 906 and the active headlamp 918 to receive filtered power and provide a drive current to power LEDs in the LED array in the active headlamp 918. The LED DC/DC module 912 may have an input voltage between 7 and 18 volts with a nominal voltage of approximately 3.2 volts and an output voltage that may be slightly higher (e.g., 0.3 volts) than a maximum voltage for the LED array (e.g., as determined by factor or local calibration and operating condition adjustments due to load, temperature or other factors).

[0076] The logic LDO module 914 may be coupled to the input filter and protection module 906 to receive the filtered power. The logic LDO module 914 may also be coupled to the micro-controller 916 and the active headlamp 918 to provide power to the micro-controller 916 and/or the silicon backplane (e.g., CMOS logic) in the active headlamp 918.

[0077] The bus transceiver 908 may have, for example, a universal asynchronous receiver transmitter (UART) or serial peripheral interface (SPI) interface and may be coupled to the micro-controller 916. The micro-controller 916 may translate vehicle input based on, or including, data from the sensor module 910. The translated vehicle input may include a video signal that is transferrable to an image buffer in the active headlamp 918. In addition, the micro-controller 916 may load default image frames and test for open/short pixels during startup. In embodiments, an SPI interface may load an image buffer in CMOS. Image frames may be full frame, differential or partial frames. Other features of micro-controller 916 may include control interface monitoring of CMOS status, including die temperature, as well as logic LDO output. In embodiments, LED DC/DC output may be dynamically controlled to minimize headroom. In addition to providing image frame data, other headlamp functions, such as complementary use in conjunction with side marker or turn signal lights, and/or activation of daytime running lights, may also be controlled.

[0078] While only certain features of the system and method have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes. Method operations may be performed substantially simultaneously or in a different order. [0079] Examples

[0080] Example l is a vehicular headlamp comprising: a driver architecture comprising: light emitting diode (LED) arrays each containing a plurality of LEDs; backlight unit (BLU) drivers coupled to the LED arrays; and a boost converter configured to provide a constant voltage to the LED arrays.

[0081] In Example 2, the subject matter of Example 1 includes, wherein the LEDs coupled to one or more of the BLU drivers are coupled in parallel to the boost converter and to the one or more of the BLU drivers.

[0082] In Example 3, the subject matter of Examples 1-2 includes, wherein at least one of the BLU drivers has a different number of LEDs coupled thereto than at least one other of the BLU drivers.

[0083] In Example 4, the subject matter of Examples 1-3 includes, wherein each BLU driver is configured to drive the coupled LED array based on data from a Controller Area Network (CAN) bus suppled to the BLU driver.

[0084] In Example 5, the subject matter of Examples 1-4 includes, wherein each BLU driver comprises low-dropout (LDO) voltage current sources, each LDO voltage current source in series with one of the LEDs coupled to the BLU driver.

[0085] In Example 6, the subject matter of Example 5 includes, wherein hybrid driving of each LDO voltage current source is configured to individually control a current and on/off time of the LED coupled to the LDO voltage current source.

[0086] In Example 7, the subject matter of Examples 1-6 includes, wherein the BLU driver has a vertical synchronization (VSYNC) input configured to receive a VSYNC pulse to reset row/column logic between frames of images to be displayed by the driver architecture.

[0087] In Example 8, the subject matter of Examples 1-7 includes, a single serial peripheral interface (SPI) bus configured to control the BLU drivers, each BLU driver having a pass-through input to allow bypass of control of the BLU driver by data on the SPI bus.

[0088] In Example 9, the subject matter of Examples 1-8 includes, one or more processors configured to control driving of the LED arrays. [0089] In Example 10, the subject matter of Examples 1-9 includes, wherein each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric.

[0090] In Example 11, the subject matter of Example 10 includes, wherein each segmented LED die is formed from equally-sized pixels.

[0091] In Example 12, the subject matter of Examples 10-11 includes, wherein adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches. [0092] In Example 13, the subject matter of Example 12 includes, a redistribution (RDL) dielectric layer disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die.

[0093] In Example 14, the subject matter of Example 13 includes, Under Bump Metallurgy (UBM) pads deposited on the RDL dielectric layer.

[0094] Example 15 is a lighting arrangement comprising: light emitting diode (LED) arrays each containing a plurality of LEDs; backlight unit (BLU) drivers coupled to the LED arrays; and a boost converter configured to provide a constant voltage to the LED arrays.

[0095] In Example 16, the subject matter of Example 15 includes, wherein the LEDs coupled to one or more of the BLU drivers are coupled in parallel to the boost converter and to the one or more of the BLU drivers.

[0096] In Example 17, the subject matter of Examples 15-16 includes, wherein at least one of the BLU drivers has a different number of LEDs coupled thereto than at least one other of the BLU drivers.

[0097] In Example 18, the subject matter of Examples 15-17 includes, wherein each BLU driver is configured to drive the coupled LED array based on data from a Controller Area Network (CAN) bus suppled to the BLU driver.

[0098] In Example 19, the subject matter of Examples 15-18 includes, wherein each BLU driver comprises low-dropout (LDO) voltage current sources, each LDO voltage current source in series with one of the LEDs coupled to the BLU driver. [0099] In Example 20, the subject matter of Example 19 includes, wherein hybrid driving of each LDO voltage current source is configured to individually control a current and on/off time of the LED coupled to the LDO voltage current source.

[00100] In Example 21, the subject matter of Examples 15-20 includes, wherein the BLU driver has a vertical synchronization (VSYNC) input configured to receive a VSYNC pulse to reset row/column logic between frames of images to be displayed using the LEDs.

[00101] In Example 22, the subject matter of Examples 15-21 includes, a single serial peripheral interface (SPI) bus configured to control the BLU drivers, each BLU driver having a pass-through input to allow bypass of control of the BLU driver by data on the SPI bus.

[00102] In Example 23, the subject matter of Examples 15-22 includes, wherein each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric.

[00103] In Example 24, the subject matter of Example 23 includes, wherein each segmented LED die is formed from equally-sized pixels.

[00104] In Example 25, the subject matter of Examples 23-24 includes, wherein adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches. [00105] In Example 26, the subject matter of Example 25 includes, a redistribution (RDL) dielectric layer disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die.

[00106] In Example 27, the subject matter of Example 26 includes, Under Bump Metallurgy (UBM) pads deposited on the RDL dielectric layer.

[00107] Example 28 is a method of fabricating a lighting device for a vehicle, the method comprising: coupling light emitting diode (LED) arrays each containing a plurality of LEDs coupled in parallel to backlight unit (BLU) drivers; and coupling a boost converter to the LED arrays to provide a constant voltage to the LEDs of the LED arrays for light generation from the vehicle. [00108] In Example 29, the subject matter of Example 28 includes, driving the LED arrays based on data from Controller Area Network (CAN) bus suppled to the BLU drivers.

[00109] In Example 30, the subject matter of Examples 28-29 includes, wherein each BLU driver comprises low-dropout (LDO) voltage current sources, each LDO voltage current source in series with one of the LEDs coupled to the BLU driver.

[00110] In Example 31, the subject matter of Example 30 includes, individually controlling a current and on/off time of an LED coupled to one of the LDO voltage current sources via hybrid driving of the one of the LDO voltage current sources.

[00111] In Example 32, the subject matter of Examples 28-31 includes, receiving a vertical synchronization (VSYNC) at the BLU driver to reset row/column logic between frames of images to be displayed by the LEDs.

[00112] In Example 33, the subject matter of Examples 28-32 includes, allowing bypass of the BLU drivers to permit a single serial peripheral interface (SPI) bus to control each BLU driver.

[00113] In Example 34, the subject matter of Examples 28-33 includes, wherein each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric.

[00114] In Example 35, the subject matter of Example 34 includes, wherein adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches. [00115] In Example 36, the subject matter of Example 35 includes, wherein a redistribution (RDL) dielectric layer is disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die.

[00116] In Example 37, the subject matter of Example 36 includes, wherein Under Bump Metallurgy (UBM) pads is deposited on the RDL dielectric layer. [00117] Example 38 is at least one machine-readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations to implement of any of Examples 1-37.

[00118] Example 39 is an apparatus comprising means to implement of any of Examples 1-37.

[00119] Example 40 is a system to implement of any of Examples 1-37.

[00120] Example 41 is a method to implement of any of Examples 1-37.

[00121] Although an embodiment has been described with reference to specific example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader scope of the present disclosure. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. The accompanying drawings that form a part hereof show, by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced. The embodiments illustrated are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be utilized and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. This Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[00122] The subject matter may be referred to herein, individually and/or collectively, by the term “embodiment” merely for convenience and without intending to voluntarily limit the scope of this application to any single inventive concept if more than one is in fact disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the above description. [00123] In this document, the terms "a" or "an" are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of "at least one" or "one or more." In this document, the term "or" is used to refer to a nonexclusive or, such that "A or B" includes "A but not B," "B but not A," and "A and B," unless otherwise indicated. In this document, the terms "including" and "in which" are used as the plain-English equivalents of the respective terms "comprising" and "wherein." Also, in the following claims, the terms "including" and "comprising" are open-ended, that is, a system, UE, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms "first," "second," and "third," etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. For example, the term “a processor” configured to carry out specific operations includes both a single processor configured to carry out all of the operations as well as multiple processors individually configured to carry out some or all of the operations (which may overlap) such that the combination of processors carry out all of the operations. Note that the term “about x” and similar terms (e.g., substantially) as used herein may be understood to be within 10% of x or otherwise within a range known to one of skill in the art to be within tolerance of the quantity or quality described unless indicated otherwise.

[00124] The Abstract of the Disclosure is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it may be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment.

Claims

WHAT IS CLAIMED IS:

1. A vehicular headlamp comprising: a driver architecture comprising: light emitting diode (LED) arrays each containing a plurality of LEDs; backlight unit (BLU) drivers coupled to the LED arrays; and a boost converter configured to provide a constant voltage to the LED arrays.

2. The vehicular headlamp of claim 1, wherein the LEDs coupled to one or more of the BLU drivers are coupled in parallel to the boost converter and to the one or more of the BLU drivers.

3. The vehicular headlamp of claim 1 or 2, wherein at least one of the BLU drivers has a different number of LEDs coupled thereto than at least one other of the BLU drivers.

4. The vehicular headlamp of any of claims 1-3, wherein each BLU driver is configured to drive the coupled LED array based on data from a Controller Area Network (CAN) bus suppled to the BLU driver.

5. The vehicular headlamp of any of claims 1-4, wherein each BLU driver comprises low-dropout (LDO) voltage current sources, each LDO voltage current source in series with one of the LEDs coupled to the BLU driver.

6. The vehicular headlamp of claim 5, wherein hybrid driving of each LDO voltage current source is configured to individually control a current and on/off time of the LED coupled to the LDO voltage current source.

7. The vehicular headlamp of any of claims 1-6, wherein the BLU driver has a vertical synchronization (VSYNC) input configured to receive a VSYNC pulse to reset row/column logic between frames of images to be displayed by the driver architecture.

8. The vehicular headlamp of any of claims 1-7, further comprising a single serial peripheral interface (SPI) bus configured to control the BLU drivers, each BLU driver having a pass-through input to allow bypass of control of the BLU driver by data on the SPI bus.

9. The vehicular headlamp of any of claims 1-8, wherein each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric.

10. The vehicular headlamp of claim 9, wherein adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches.

11. The vehicular headlamp of claim 10, further comprising a redistribution (RDL) dielectric layer disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die.

12. A lighting arrangement comprising: light emitting diode (LED) arrays each containing a plurality of LEDs; backlight unit (BLU) drivers coupled to the LED arrays; and a boost converter configured to provide a constant voltage to the LED arrays.

13. The lighting arrangement of claim 12, wherein the LEDs coupled to one or more of the BLU drivers are coupled in parallel to the boost converter and to the one or more of the BLU drivers.

14. The lighting arrangement of claim 12 or 13, wherein at least one of the BLU drivers has a different number of LEDs coupled thereto than at least one other of the BLU drivers.

15. The lighting arrangement of any of claims 12-14, wherein at least one of: each BLU driver is configured to drive the coupled LED array based on data from a Controller Area Network (CAN) bus suppled to the BLU driver, the BLU driver has a vertical synchronization (VSYNC) input configured to receive a VSYNC pulse to reset row/column logic between frames of images to be displayed using the LEDs, or the lighting arrangement further comprises a single serial peripheral interface (SPI) bus configured to control the BLU drivers, each BLU driver having a pass-through input to allow bypass of control of the BLU driver by data on the SPI bus.

16. The lighting arrangement of any of claims 12-15, wherein: each BLU driver comprises low-dropout (LDO) voltage current sources, each LDO voltage current source in series with one of the LEDs coupled to the BLU driver, and hybrid driving of each LDO voltage current source is configured to individually control a current and on/off time of the LED coupled to the LDO voltage current source.

17. The lighting arrangement of any of claims 12-16, wherein: each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric, and adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches.

18. The lighting arrangement of claim 17, further comprising: a redistribution (RDL) dielectric layer disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die, and

Under Bump Metallurgy (UBM) pads deposited on the RDL dielectric layer.

19. A method of fabricating a lighting device for a vehicle, the method comprising: coupling light emitting diode (LED) arrays each containing a plurality of LEDs coupled in parallel to backlight unit (BLU) drivers; and coupling a boost converter to the LED arrays to provide a constant voltage to the LEDs of the LED arrays for light generation from the vehicle.

20. The method of claim 19, wherein: each LED array comprises a segmented LED die having epitaxial semiconductor layers separated by trenches filled with a dielectric, adjacent pairs of pixels in one of the segmented LED die are coupled together via segmented bonding layers that bridge the trenches, vias to a p-type semiconductor layer of the segmented LED die and vias to an n-type semiconductor of the segmented LED die are interconnected over the trenches, and a redistribution (RDL) dielectric layer is disposed over the segmented bonding layers, openings formed in the RDL dielectric layer corresponding to a first pixel and a last pixel of the segmented LED die.