EP4713630A1 - High capacity dual circuit chiller assembly - Google Patents

Abstract

A chiller assembly for a heating, ventilating, or air conditioning (HVAC) system can include a frame, a first vapor compression circuit, a second vapor compression circuit, a process fluid circuit, and at least one fan. The first vapor compression circuit includes a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit. The second vapor compression circuit includes a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit. The process fluid circuit passes through the first evaporator and the second evaporator. The first evaporator and the second evaporator are configured to place refrigerant in a heat exchange relationship with the process fluid of the process fluid circuit. The at least one fan is configured to direct air across the first condenser coil and the second condenser coil. The first vapor compression circuit and the second vapor compression circuit are configured to provide between 400 refrigeration tons and 1000 refrigeration tons. The chiller assembly is configured to be housed within an intermodal shipping container.

Description

HIGH CAPACITY DUAL CIRCUIT CHILLER ASSEMBLY

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and the priority to U.S. Provisional Patent Application No. 63/470, 626, filed June 2, 2023, the entire disclosure of which is incorporated by reference herein.

BACKGROUND

[0002] The present disclosure relates generally to systems and methods for thermal heat management and heat exchangers. The present disclosure relates more particularly to a cooling system for heating, ventilating, or air conditioning (HVAC) systems that includes one or more chillers.

[0003] Building equipment, such as heating, ventilating, or cooling (HVAC) equipment, is installed and operated to change environmental conditions within one or more spaces of a building. Buildings may be occupied by equipment (e.g., computing equipment) and/or human occupants. Building occupants can contribute to a thermal load of a building. Chillers can be used to cool/condition various areas of a building.

SUMMARY

[0004] One implementation of the present disclosure relates to a chiller assembly for a heating, ventilating, or air conditioning (HVAC) system. The chiller assembly can include a frame, a first vapor compression circuit, a second vapor compression circuit, a process fluid circuit, and at least one fan. The first vapor compression circuit includes a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit. The second vapor compression circuit includes a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit. The process fluid circuit passes through the first evaporator and the second evaporator. The first evaporator and the second evaporator are configured to place refrigerant in a heat exchange relationship with the process fluid of the process fluid circuit. The at least one fan is configured to direct air across the first condenser coil and the second condenser coil. The chiller assembly is configured to be housed within an intermodal shipping container. [0005] Another implementation of the present disclosure relates to a chiller assembly for a heating, ventilating, or air conditioning (HVAC) system. The chiller assembly can include a frame, a first vapor compression circuit, a second vapor compression circuit, a process fluid circuit, and at least one fan. The first vapor compression circuit includes a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit. The second vapor compression circuit includes a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit. The process fluid circuit passes through the first evaporator and the second evaporator. The at least one fan is configured to direct air across the first condenser coil and the second condenser coil. An outlet of the first evaporator is fluidly coupled to an inlet of the second evaporator. The chiller assembly is configured to be housed within an intermodal shipping container. The shipping container has a maximum length of 40 feet, a maximum width of 8 feet, and a maximum height of 8.5 feet.

[0006] Another implementation of the present disclosure relates to a chiller assembly for a heating, ventilating, or air conditioning (HVAC) system. The chiller assembly can include a frame, a first vapor compression circuit, a second vapor compression circuit, and at least one fan. The first vapor compression circuit includes a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit. The second vapor compression circuit includes a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit. The first evaporator and the second evaporator are coupled to the frame. The first condenser coil includes multiple first coils and the second condenser coil includes multiple second coils, each first coil of the multiple first coils of the first condenser coil is positioned next to and substantially parallel to a corresponding second coil of the multiple second coils of the second condenser coil. The first vapor compression circuit and the second vapor compression circuit are configured to provide between 600 refrigeration tons and 1000 refrigeration tons at an ambient temperature of between 50 degrees F and 100 degrees F.

[0007] In some embodiments, the first vapor compression circuit and the second vapor compression circuit are configured to provide between 700 refrigeration tons and 800 refrigeration tons at an ambient temperature of between 70 degrees F and 80 degrees F. In some embodiments, the first condenser coil includes multiple first coils and the second condenser coil includes multiple second coils, each first coil of the multiple first coils of the first condenser coil is positioned next to and substantially parallel to a corresponding second coil of the multiple second coils of the second condenser coil. In some embodiments, the multiple first coils of the first condenser coil and the plurality of second coils of the second condenser coil use common structural components. In some embodiments, the multiple first coils and the multiple second coils include the same design. In some embodiments, the first compressor and the second compressor are centrifugal compressors. In some embodiments, the first compressor includes an electric motor having a magnetic bearing configured to support a rotor.

[0008] In some embodiments, the intermodal shipping container has a length of 40 feet, a width of 8 feet, and a height of 8.5 feet. In some embodiments, the first refrigerant or the second refrigerant is R-1234ze. In some embodiments, the process fluid is glycol or water. In some embodiments, a mid-frame is coupled to the frame and supports the first condenser coil and the second condenser coil. In some embodiments, the first compressor and the second compressor are coupled to the frame in a space between the mid-frame and the frame. In some embodiments, the first evaporator and the second evaporator are coupled to the frame in a space between the mid-frame and the frame.

[0009] Those skilled in the art will appreciate that the summary is illustrative only and is not intended to be in any way limiting. Other aspects, inventive features, and advantages of the devices and/or processes described herein, as defined solely by the claims, will become apparent in the detailed description set forth herein and taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Various objects, aspects, features, and advantages of the disclosure will become more apparent and better understood by referring to the detailed description taken in conjunction with the accompanying drawings, in which like reference characters identify corresponding elements throughout. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.

[0011] FIG. 1 is a perspective view schematic drawing of a building equipped with an HVAC system, according to some embodiments. [0012] FIG. 2 is a block diagram of a central plant which can be used to serve the energy loads of the building of FIG. 1, according to some embodiments.

[0013] FIG. 3 is a block diagram of an airside system which can be implemented in the building of FIG. 1, according to some embodiments.

[0014] FIG. 4 is a block diagram of a building management system (BMS) which can be used to monitor and control the building of FIG. 1, according to some embodiments.

[0015] FIG. 5 is a block diagram of a building, according to some embodiments.

[0016] FIG. 6 is a perspective view schematic drawing of a shipping container, according to some embodiments.

[0017] FIG. 7 is a schematic diagram of a chiller assembly within the shipping container of FIG. 6, according to some embodiments.

[0018] FIG. 8 is a front perspective view schematic drawing of the chiller assembly of FIG. 7, according to some embodiments.

[0019] FIG. 9 is a side perspective view schematic drawing of the chiller assembly of FIG. 7, according to some embodiments.

[0020] FIG. 10 is a detail view schematic drawing of the chiller assembly of FIG. 7, according to some embodiments.

[0021] FIG. 11 is a schematic diagram of a vapor compression system of the chiller assembly of FIG. 7, according to some embodiments.

[0022] FIG. 12 is a side view schematic drawing of a heat exchanger of the chiller assembly of FIG. 7, according to some embodiments.

[0023] FIG. 13 is a partially exploded view schematic drawing of the heat exchanger of FIG. 12, according to some embodiments.

[0024] FIG. 14 is a perspective view schematic drawing of compressors and evaporators of the chiller assembly of FIG. 7, according to some embodiments.

[0025] FIG. 15 is a sectional view schematic drawing of a compressor of the chiller assembly of FIG. 7, according to some embodiments.

[0026] FIG. 16 is a block diagram of the chiller assembly of FIG. 7, according to some embodiments. [0027] FIG. 17 is a schematic drawing of a user interface and a graphical user interface of the chiller assembly of FIG. 7, according to some embodiments.

[0028] FIG. 18 is a side view schematic drawing of a heat exchanger of the chiller assembly of FIG. 7, according to some embodiments.

[0029] FIG. 19 is a perspective view schematic drawing of the heat exchanger of FIG. 18 of the chiller assembly of FIG. 7, according to some embodiments

DETAILED DESCRIPTION

Overview

[0030] Referring generally to the FIGURES, systems and methods for an improved and compact, high capacity chiller assembly are shown, according to various exemplary embodiments.

[0031] Typical cooling systems for commercial applications (e.g., data centers, hospitals, industrial buildings, banks, schools, apartment buildings, etc.) utilize an expansive and complicated network of separate HVAC components that are fluidly, electrically, and structurally connected at a jobsite. Cooling systems for commercial applications may consume large supplies of fresh water. For example, some cooling systems for commercial applications (such as data centers, for example). As building technology and construction methods improve, the height of commercial buildings and number of floors of commercial buildings tends to increase. Taller buildings can generate a larger thermal load than shorter buildings having the same footprint, which leaves less rooftop area for cooling system equipment. Additionally, commercial buildings are constructed in increasingly remote locations that are not easily accessible by conventional equipment transportation methods. Skilled labor and qualified installers can be scarce in remote locations, which can contribute to increased costs and installation delays. Additionally, buildings in extreme climates (e.g., hot climates) have greater difficulty rejecting thermal loads to the ambient environment. Some commercial buildings house large quantities of electronic devices (e.g., servers, data mining equipment, data centers, supercomputers, etc.) that generate dense thermal loads. Aiming at these and other technical challenges described herein, the present application provides various technical solutions as discussed in greater detail below. Building and HVAC System

[0032] Referring now to FIG. 1, a perspective view of a building 10 is shown. Building 10 can be served by a building management system (BMS). A BMS is, in general, a system of devices configured to control, monitor, and manage equipment in or around a building or building area. A BMS can include, for example, an HVAC system, a security system, a lighting system, a fire alerting system, any other system that is capable of managing building functions or devices, or any combination thereof.

[0033] The BMS that serves building 10 may include an HVAC system 100. HVAC system 100 can include a plurality of HVAC devices (e.g., heaters, chillers, air handling units, pumps, fans, thermal energy storage, etc.) configured to provide heating, cooling, ventilation, or other services for building 10. For example, HVAC system 100 is shown to include a waterside system 120 and an airside system 130. Waterside system 120 may provide a heated or chilled fluid to an air handling unit of airside system 130. Airside system 130 may use the heated or chilled fluid to heat or cool an airflow provided to building 10. In some embodiments, waterside system 120 can be replaced with or supplemented by a central plant or central energy facility (described in greater detail with reference to FIG. 2). An example of an airside system which can be used in HVAC system 100 is described in greater detail with reference to FIG. 3.

[0034] HVAC system 100 is shown to include a chiller 102, a boiler 104, and a rooftop air handling unit (AHU) 106. Waterside system 120 may use boiler 104 and chiller 102 to heat or cool a working fluid (e.g., water, glycol, etc.) and may circulate the working fluid to AHU 106. In various embodiments, the HVAC devices of waterside system 120 can be located in or around building 10 (as shown in FIG. 1) or at an offsite location such as a central plant (e.g., a chiller plant, a steam plant, a heat plant, etc.). In some embodiments, the chiller 102 is a rooftop unit (e.g., an air-cooled chiller). The working fluid can be heated in boiler 104 or cooled in chiller 102, depending on whether heating or cooling is required in building 10. Boiler 104 may add heat to the circulated fluid, for example, by burning a combustible material (e.g., natural gas) or using an electric heating element. Chiller 102 may place the circulated fluid in a heat exchange relationship with another fluid (e.g., a refrigerant) in a heat exchanger (e.g., an evaporator) to absorb heat from the circulated fluid. The working fluid from chiller 102 and/or boiler 104 can be transported to AHU 106 via piping 108. [0035] AHU 106 may place the working fluid in a heat exchange relationship with an airflow passing through AHU 106 (e.g., via one or more stages of cooling coils and/or heating coils). The airflow can be, for example, outside air, return air from within building 10, or a combination of both. AHU 106 may transfer heat between the airflow and the working fluid to provide heating or cooling for the airflow. For example, AHU 106 can include one or more fans or blowers configured to pass the airflow over or through a heat exchanger containing the working fluid. The working fluid may then return to chiller 102 or boiler 104 via piping 110.

[0036] Airside system 130 may deliver the airflow supplied by AHU 106 (i.e., the supply airflow) to building 10 via air supply ducts 112 and may provide return air from building 10 to AHU 106 via air return ducts 114. In some embodiments, airside system 130 includes multiple variable air volume (VAV) units 116. For example, airside system 130 is shown to include a separate VAV unit 116 on each floor or zone of building 10. VAV units 116 can include dampers or other flow control elements that can be operated to control an amount of the supply airflow provided to individual zones of building 10. In other embodiments, airside system 130 delivers the supply airflow into one or more zones of building 10 (e.g., via supply ducts 112) without using intermediate VAV units 116 or other flow control elements. AHU 106 can include various sensors (e.g., temperature sensors, pressure sensors, etc.) configured to measure attributes of the supply airflow. AHU 106 may receive input from sensors located within AHU 106 and/or within the building zone and may adjust the flow rate, temperature, or other attributes of the supply airflow through AHU 106 to achieve setpoint conditions for the building zone.

Central Plant

[0037] Referring now to FIG. 2, a block diagram of a central plant 200 is shown, according to some embodiments. In various embodiments, central plant 200 can supplement or replace waterside system 120 in HVAC system 100 or can be implemented separate from HVAC system 100. When implemented in HVAC system 100, central plant 200 can include a subset of the HVAC devices in HVAC system 100 (e.g., boiler 104, chiller 102, pumps, valves, etc.) and may operate to supply a heated or chilled fluid to AHU 106. The HVAC devices of central plant 200 can be located within building 10 (e.g., as components of waterside system 120) or at an offsite location such as a central energy facility that serves multiple buildings. [0038] Central plant 200 is shown to include a plurality of subplants 202-208. Subplants 202-208 can be configured to convert energy or resource types (e.g., water, natural gas, electricity, etc.). For example, subplants 202-208 are shown to include a heater subplant 202, a heat recovery chiller subplant 204, a chiller subplant 206, and a cooling tower subplant 208. In some embodiments, subplants 202-208 consume resources purchased from utilities to serve the energy loads (e.g., hot water, cold water, electricity, etc.) of a building or campus. For example, heater subplant 202 can be configured to heat water in a hot water loop 214 that circulates the hot water between heater subplant 202 and building 10.

Similarly, chiller subplant 206 can be configured to chill water in a cold water loop 216 that circulates the cold water between chiller subplant 206 building 10.

[0039] Heat recovery chiller subplant 204 can be configured to transfer heat from cold water loop 216 to hot water loop 214 to provide additional heating for the hot water and additional cooling for the cold water. Condenser water loop 218 may absorb heat from the cold water in chiller subplant 206 and reject the absorbed heat in cooling tower subplant or transfer the absorbed heat to hot water loop 214. In various embodiments, central plant 200 can include an electricity subplant (e.g., one or more electric generators) configured to generate electricity or any other type of subplant configured to convert energy or resource types.

[0040] Hot water loop 214 and cold water loop 216 may deliver the heated and/or chilled water to air handlers located on the rooftop of building 10 (e.g., AHU 106) or to individual floors or zones of building 10 (e.g., VAV units 116). The air handlers push air past heat exchangers (e.g., heating coils or cooling coils) through which the water flows to provide heating or cooling for the air. The heated or cooled air can be delivered to individual zones of building 10 to serve thermal energy loads of building 10. The water then returns to subplants 202-206 to receive further heating or cooling.

[0041] Although subplants 202-206 are shown and described as heating and cooling water for circulation to a building, it is understood that any other type of working fluid (e.g., glycol, CO2, etc.) can be used in place of or in addition to water to serve thermal energy loads. In other embodiments, subplants 202-206 may provide heating and/or cooling directly to the building or campus without requiring an intermediate heat transfer fluid. These and other variations to central plant 200 are within the teachings of the present disclosure. [0042] Each of subplants 202-206 can include a variety of equipment configured to facilitate the functions of the subplant. For example, heater subplant 202 is shown to include a plurality of heating elements 220 (e.g., boilers, electric heaters, etc.) configured to add heat to the hot water in hot water loop 214. Heater subplant 202 is also shown to include several pumps 222 and 224 configured to circulate the hot water in hot water loop 214 and to control the flow rate of the hot water through individual heating elements 220. Chiller subplant 206 is shown to include a plurality of chillers 232 configured to remove heat from the cold water in cold water loop 216. Chillers 232 can include any of the chiller assemblies disclosed herein or other types of chiller assemblies. Chiller subplant 206 is also shown to include several pumps 234 and 236 configured to circulate the cold water in cold water loop 216 and to control the flow rate of the cold water through individual chillers 232.

[0043] Heat recovery chiller subplant 204 is shown to include a plurality of heat recovery heat exchangers 226 (e.g., refrigeration circuits) configured to transfer heat from cold water loop 216 to hot water loop 214. Heat recovery chiller subplant 204 is also shown to include several pumps 228 and 230 configured to circulate the hot water and/or cold water through heat recovery heat exchangers 226 and to control the flow rate of the water through individual heat recovery heat exchangers 226. A cooling tower subplant can include a plurality of cooling towers configured to remove heat from the condenser water in a condenser water loop.

[0044] In some embodiments, one or more of the pumps in central plant 200 (e.g., pumps 222, 224, 228, 230, 234, and/or 236) or pipelines in central plant 200 include an isolation valve associated therewith. Isolation valves can be integrated with the pumps or positioned upstream or downstream of the pumps to control the fluid flows in central plant 200. In various embodiments, central plant 200 can include more, fewer, or different types of devices and/or subplants based on the particular configuration of central plant 200 and the types of loads served by central plant 200.

[0045] Still referring to FIG. 2, central plant 200 is shown to include hot thermal energy storage (TES) 210 and cold thermal energy storage (TES) 212. Hot TES 210 and cold TES 212 can be configured to store hot and cold thermal energy for subsequent use. For example, hot TES 210 can include one or more hot water storage tanks 242 configured to store the hot water generated by heater subplant 202 or heat recovery chiller subplant 204. Hot TES 210 may also include one or more pumps or valves configured to control the flow rate of the hot water into or out of hot TES tank 242. [0046] Similarly, cold TES 212 can include one or more cold water storage tanks 244 configured to store the cold water generated by chiller subplant 206 or heat recovery chiller subplant 204. Cold TES 212 may also include one or more pumps or valves configured to control the flow rate of the cold water into or out of cold TES tanks 244. In some embodiments, central plant 200 includes electrical energy storage (e.g., one or more batteries) or any other type of device configured to store resources. The stored resources can be purchased from utilities, generated by central plant 200, or otherwise obtained from any source.

Airside System

[0047] Referring now to FIG. 3, a block diagram of an airside system 300 is shown, according to some embodiments. In various embodiments, airside system 300 may supplement or replace airside system 130 in HVAC system 100 or can be implemented separate from HVAC system 100. When implemented in HVAC system 100, airside system 300 can include a subset of the HVAC devices in HVAC system 100 (e.g., AHU 106, VAV units 116, ducts 112-114, fans, dampers, etc.) and can be located in or around building 10. Airside system 300 may operate to heat or cool an airflow provided to building 10 using a heated or chilled fluid provided by central plant 200.

[0048] Airside system 300 is shown to include an economizer-type air handling unit (AHU) 302. Economizer-type AHUs vary the amount of outside air and return air used by the air handling unit for heating or cooling. For example, AHU 302 may receive return air 304 from building zone 306 via return air duct 308 and may deliver supply air 310 to building zone 306 via supply air duct 312. In some embodiments, AHU 302 is a rooftop unit located on the roof of building 10 (e.g., AHU 106 as shown in FIG. 1) or otherwise positioned to receive both return air 304 and outside air 314. AHU 302 can be configured to operate exhaust air damper 316, mixing damper 318, and outside air damper 320 to control an amount of outside air 314 and return air 304 that combine to form supply air 310. Any return air 304 that does not pass through mixing damper 318 can be exhausted from AHU 302 through exhaust damper 316 as exhaust air 322.

[0049] Each of dampers 316-320 can be operated by an actuator. For example, exhaust air damper 316 can be operated by actuator 324, mixing damper 318 can be operated by actuator 326, and outside air damper 320 can be operated by actuator 328. Actuators 324- 328 may communicate with an AHU controller 330 via a communications link 332. Actuators 324-328 may receive control signals from AHU controller 330 and may provide feedback signals to AHU controller 330. Feedback signals can include, for example, an indication of a current actuator or damper position, an amount of torque or force exerted by the actuator, diagnostic information (e.g., results of diagnostic tests performed by actuators 324-328), status information, commissioning information, configuration settings, calibration data, and/or other types of information or data that can be collected, stored, or used by actuators 324-328. AHU controller 330 can be an economizer controller configured to use one or more control algorithms (e.g., state-based algorithms, extremum seeking control (ESC) algorithms, proportional-integral (PI) control algorithms, proportional-integral- derivative (PID) control algorithms, model predictive control (MPC) algorithms, feedback control algorithms, etc.) to control actuators 324-328.

[0050] Still referring to FIG. 3, AHU 302 is shown to include a cooling coil 334, a heating coil 336, and a fan 338 positioned within supply air duct 312. Fan 338 can be configured to force supply air 310 through cooling coil 334 and/or heating coil 336 and provide supply air 310 to building zone 306. AHU controller 330 may communicate with fan 338 via communications link 340 to control a flow rate of supply air 310. In some embodiments, AHU controller 330 controls an amount of heating or cooling applied to supply air 310 by modulating a speed of fan 338.

[0051] Cooling coil 334 may receive a chilled fluid from central plant 200 (e.g., from cold water loop 216) via piping 342 and may return the chilled fluid to central plant 200 via piping 344. Valve 346 can be positioned along piping 342 or piping 344 to control a flow rate of the chilled fluid through cooling coil 334. In some embodiments, cooling coil 334 includes multiple stages of cooling coils that can be independently activated and deactivated (e.g., by AHU controller 330, by BMS controller 366, etc.) to modulate an amount of cooling applied to supply air 310.

[0052] Heating coil 336 may receive a heated fluid from central plant 200(e.g., from hot water loop 214) via piping 348 and may return the heated fluid to central plant 200 via piping 350. Valve 352 can be positioned along piping 348 or piping 350 to control a flow rate of the heated fluid through heating coil 336. In some embodiments, heating coil 336 includes multiple stages of heating coils that can be independently activated and deactivated (e.g., by AHU controller 330, by BMS controller 366, etc.) to modulate an amount of heating applied to supply air 310. [0053] Each of valves 346 and 352 can be controlled by an actuator. For example, valve 346 can be controlled by actuator 354 and valve 352 can be controlled by actuator 356. Actuators 354-356 may communicate with AHU controller 330 via communications links 358-360. Actuators 354-356 may receive control signals from AHU controller 330 and may provide feedback signals to controller 330. In some embodiments, AHU controller 330 receives a measurement of the supply air temperature from a temperature sensor 362 positioned in supply air duct 312 (e.g., downstream of cooling coil 334 and/or heating coil 336). AHU controller 330 may also receive a measurement of the temperature of building zone 306 from a temperature sensor 364 located in building zone 306.

[0054] In some embodiments, AHU controller 330 operates valves 346 and 352 via actuators 354-356 to modulate an amount of heating or cooling provided to supply air 310 (e.g., to achieve a setpoint temperature for supply air 310 or to maintain the temperature of supply air 310 within a setpoint temperature range). The positions of valves 346 and 352 affect the amount of heating or cooling provided to supply air 310 by cooling coil 334 or heating coil 336 and may correlate with the amount of energy consumed to achieve a desired supply air temperature. AHU 330 may control the temperature of supply air 310 and/or building zone 306 by activating or deactivating coils 334-336, adjusting a speed of fan 338, or a combination of both.

[0055] Still referring to FIG. 3, airside system 300 is shown to include a building management system (BMS) controller 366 and a client device 368. BMS controller 366 can include one or more computer systems (e.g., servers, supervisory controllers, subsystem controllers, etc.) that serve as system level controllers, application or data servers, head nodes, or master controllers for airside system 300, central plant 200, HVAC system 100, and/or other controllable systems that serve building 10. BMS controller 366 may communicate with multiple downstream building systems or subsystems (e.g., HVAC system 100, a security system, a lighting system, central plant 200, etc.) via a communications link 370 according to like or disparate protocols (e.g., LON, BACnet, etc.). In various embodiments, AHU controller 330 and BMS controller 366 can be separate (as shown in FIG. 3) or integrated. In an integrated implementation, AHU controller 330 can be a software module configured for execution by a processor of BMS controller 366.

[0056] In some embodiments, AHU controller 330 receives information from BMS controller 366 (e.g., commands, setpoints, operating boundaries, etc.) and provides information to BMS controller 366 (e.g., temperature measurements, valve or actuator positions, operating statuses, diagnostics, etc.). For example, AHU controller 330 may provide BMS controller 366 with temperature measurements from temperature sensors 362- 364, equipment on/off states, equipment operating capacities, and/or any other information that can be used by BMS controller 366 to monitor or control a variable state or condition within building zone 306.

[0057] Client device 368 can include one or more human-machine interfaces or client interfaces (e.g., graphical user interfaces, reporting interfaces, text-based computer interfaces, client-facing web services, web servers that provide pages to web clients, etc.) for controlling, viewing, or otherwise interacting with HVAC system 100, its subsystems, and/or devices. Client device 368 can be a computer workstation, a client terminal, a remote or local interface, or any other type of user interface device. Client device 368 can be a stationary terminal or a mobile device. For example, client device 368 can be a desktop computer, a computer server with a user interface, a laptop computer, a tablet, a smartphone, a PDA, or any other type of mobile or non-mobile device. Client device 368 may communicate with BMS controller 366 and/or AHU controller 330 via communications link 372.

Building Management Systems

[0058] Referring now to FIG. 4, a block diagram of a building management system (BMS) 400 is shown, according to some embodiments. BMS 400 can be implemented in building 10 to automatically monitor and control various building functions. BMS 400 is shown to include BMS controller 366 and building subsystems 428 and can be implemented using servers (e.g., a cloud-based platform) or one or more thermostats. Building subsystems 428 are shown to include a building electrical subsystem 434, an information communication technology (ICT) subsystem 436, a security subsystem 438, an HVAC subsystem 440, a lighting subsystem 442, a lift/escalators subsystem 432, and a fire safety subsystem 430. In various embodiments, building subsystems 428 can include fewer, additional, or alternative subsystems. For example, building subsystems 428 may also or alternatively include a refrigeration subsystem, an advertising or signage subsystem, a cooking subsystem, a vending subsystem, a printer or copy service subsystem, or any other type of building subsystem that uses controllable equipment and/or sensors to monitor or control building 10. In some embodiments, building subsystems 428 include waterside system 120 and/or airside system 300, as described with reference to FIGS. 2-3. [0059] Each of building subsystems 428 can include any number of devices, controllers, and connections for completing its individual functions and control activities. HVAC subsystem 440 can include many of the same components as HVAC system 100, as described with reference to FIGS. 1-3. For example, HVAC subsystem 440 can include a chiller, a boiler, any number of air handling units, economizers, field controllers, supervisory controllers, actuators, temperature sensors, and other devices for controlling the temperature, humidity, airflow, or other variable conditions within building 10. Lighting subsystem 442 can include any number of light fixtures, ballasts, lighting sensors, dimmers, or other devices configured to controllably adjust the amount of light provided to a building space. Security subsystem 438 can include occupancy sensors, video surveillance cameras, digital video recorders, video processing servers, intrusion detection devices, access control devices and servers, or other security-related devices.

[0060] Still referring to FIG. 4, BMS controller 366 is shown to include a communications interface 407 and a BMS interface 409. Interface 407 may facilitate communications between BMS controller 366 and external applications (e.g., monitoring and reporting applications 422, enterprise control applications 426, remote systems and applications 444, applications residing on client devices 448, etc.) for allowing user control, monitoring, and adjustment to BMS controller 366 and/or subsystems 428. Interface 407 may also facilitate communications between BMS controller 366 and client devices 448. BMS interface 409 may facilitate communications between BMS controller 366 and building subsystems 428 (e.g., HVAC, lighting security, lifts, power distribution, business, etc.).

[0061] Interfaces 407, 409 can be or include wired or wireless communications interfaces (e.g., jacks, antennas, transmitters, receivers, transceivers, wire terminals, etc.) for conducting data communications with building subsystems 428 or other external systems or devices. In various embodiments, communications via interfaces 407, 409 can be direct (e.g., local wired or wireless communications) or via a communications network 446 (e.g., a WAN, the Internet, a cellular network, etc.). For example, interfaces 407, 409 can include an Ethernet card and port for sending and receiving data via an Ethernet-based communications link or network. In another example, interfaces 407, 409 can include a WiFi transceiver for communicating via a wireless communications network. In another example, one or both of interfaces 407, 409 can include cellular or mobile phone communications transceivers. In one embodiment, communications interface 407 is a power line communications interface and BMS interface 409 is an Ethernet interface. In other embodiments, both communications interface 407 and BMS interface 409 are Ethernet interfaces or are the same Ethernet interface.

[0062] Still referring to FIG. 4, BMS controller 366 is shown to include a processing circuit 404 including a processor 406 and memory 408. Processing circuit 404 can be communicably connected to BMS interface 409 and/or communications interface 407 such that processing circuit 404 and the various components thereof can send and receive data via interfaces 407, 409. Processor 406 can be implemented as a general purpose processor, an application specific integrated circuit (ASIC), one or more field programmable gate arrays (FPGAs), a group of processing components, or other suitable electronic processing components.

[0063] Memory 408 (e.g., memory, memory unit, storage device, etc.) can include one or more devices (e.g., RAM, ROM, Flash memory, hard disk storage, etc.) for storing data and/or computer code for completing or facilitating the various processes, layers and modules described in the present application. Memory 408 can be or include volatile memory or non-volatile memory. Memory 408 can include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described in the present application. According to some embodiments, memory 408 is communicably connected to processor 406 via processing circuit 404 and includes computer code for executing (e.g., by processing circuit 404 and/or processor 406) one or more processes described herein.

[0064] In some embodiments, BMS controller 366 is implemented within a single computer (e.g., one server, one housing, etc.). In various other embodiments BMS controller 366 can be distributed across multiple servers or computers (e.g., that can exist in distributed locations). Further, while FIG. 4 shows applications 422 and 426 as existing outside of BMS controller 366, in some embodiments, applications 422 and 426 can be hosted within BMS controller 366 (e.g., within memory 408).

[0065] Still referring to FIG. 4, memory 408 is shown to include an enterprise integration layer 410, an automated measurement and validation (AM&V) layer 412, a demand response (DR) layer 414, a fault detection and diagnostics (FDD) layer 416, an integrated control layer 418, and a building subsystem integration later 420. Layers 410-420 can be configured to receive inputs from building subsystems 428 and other data sources, determine optimal control actions for building subsystems 428 based on the inputs, generate control signals based on the optimal control actions, and provide the generated control signals to building subsystems 428. The following paragraphs describe some of the general functions performed by each of layers 410-420 in BMS 400.

[0066] Enterprise integration layer 410 can be configured to serve clients or local applications with information and services to support a variety of enterprise-level applications. For example, enterprise control applications 426 can be configured to provide subsystem-spanning control to a graphical user interface (GUI) or to any number of enterprise-level business applications (e.g., accounting systems, user identification systems, etc.). Enterprise control applications 426 may also or alternatively be configured to provide configuration GUIs for configuring BMS controller 366. In yet other embodiments, enterprise control applications 426 can work with layers 410-420 to optimize building performance (e.g., efficiency, energy use, comfort, or safety) based on inputs received at interface 407 and/or BMS interface 409.

[0067] Building subsystem integration layer 420 can be configured to manage communications between BMS controller 366 and building subsystems 428. For example, building subsystem integration layer 420 may receive sensor data and input signals from building subsystems 428 and provide output data and control signals to building subsystems 428. Building subsystem integration layer 420 may also be configured to manage communications between building subsystems 428. Building subsystem integration layer 420 translate communications (e.g., sensor data, input signals, output signals, etc.) across a plurality of multi -vendor/multi -protocol systems.

[0068] Demand response layer 414 can be configured to optimize resource usage (e.g., electricity use, natural gas use, water use, etc.) and/or the monetary cost of such resource usage in response to satisfy the demand of building 10. The optimization can be based on time-of-use prices, curtailment signals, energy availability, or other data received from utility providers, distributed energy generation systems 424, from energy storage 427 (e.g., hot TES 242, cold TES 244, etc.), or from other sources. Demand response layer 414 may receive inputs from other layers of BMS controller 366 (e.g., building subsystem integration layer 420, integrated control layer 418, etc.). The inputs received from other layers can include environmental or sensor inputs such as temperature, carbon dioxide levels, relative humidity levels, air quality sensor outputs, occupancy sensor outputs, room schedules, and the like. The inputs may also include inputs such as electrical use (e.g., expressed in kWh), thermal load measurements, pricing information, projected pricing, smoothed pricing, curtailment signals from utilities, and the like.

[0069] According to some embodiments, demand response layer 414 includes control logic for responding to the data and signals it receives. These responses can include communicating with the control algorithms in integrated control layer 418, changing control strategies, changing setpoints, or activating/deactivating building equipment or subsystems in a controlled manner. Demand response layer 414 may also include control logic configured to determine when to utilize stored energy. For example, demand response layer 414 may determine to begin using energy from energy storage 427 just prior to the beginning of a peak use hour.

[0070] In some embodiments, demand response layer 414 includes a control module configured to actively initiate control actions (e.g., automatically changing setpoints) which minimize energy costs based on one or more inputs representative of or based on demand (e.g., price, a curtailment signal, a demand level, etc.). In some embodiments, demand response layer 414 uses equipment models to determine an optimal set of control actions. The equipment models can include, for example, thermodynamic models describing the inputs, outputs, and/or functions performed by various sets of building equipment. Equipment models may represent collections of building equipment (e.g., subplants, chiller arrays, etc.) or individual devices (e.g., individual chillers, heaters, pumps, etc.).

[0071] Demand response layer 414 may further include or draw upon one or more demand response policy definitions (e.g., databases, XML files, etc.). The policy definitions can be edited or adjusted by a user (e.g., via a graphical user interface) so that the control actions initiated in response to demand inputs can be tailored for the user’s application, desired comfort level, particular building equipment, or based on other concerns. For example, the demand response policy definitions can specify which equipment can be turned on or off in response to particular demand inputs, how long a system or piece of equipment should be turned off, what setpoints can be changed, what the allowable set point adjustment range is, how long to hold a high demand setpoint before returning to a normally scheduled setpoint, how close to approach capacity limits, which equipment modes to utilize, the energy transfer rates (e.g., the maximum rate, an alarm rate, other rate boundary information, etc.) into and out of energy storage devices (e.g., thermal storage tanks, battery banks, etc.), and when to dispatch on-site generation of energy (e.g., via fuel cells, a motor generator set, etc.). [0072] Integrated control layer 418 can be configured to use the data input or output of building subsystem integration layer 420 and/or demand response later 414 to make control decisions. Due to the subsystem integration provided by building subsystem integration layer 420, integrated control layer 418 can integrate control activities of the subsystems 428 such that the subsystems 428 behave as a single integrated supersystem. In some embodiments, integrated control layer 418 includes control logic that uses inputs and outputs from a plurality of building subsystems to provide greater comfort and energy savings relative to the comfort and energy savings that separate subsystems could provide alone. For example, integrated control layer 418 can be configured to use an input from a first subsystem to make an energy-saving control decision for a second subsystem. Results of these decisions can be communicated back to building subsystem integration layer 420.

[0073] Integrated control layer 418 is shown to be logically below demand response layer 414. Integrated control layer 418 can be configured to enhance the effectiveness of demand response layer 414 by enabling building subsystems 428 and their respective control loops to be controlled in coordination with demand response layer 414. This configuration may advantageously reduce disruptive demand response behavior relative to conventional systems. For example, integrated control layer 418 can be configured to assure that a demand response-driven upward adjustment to the setpoint for chilled water temperature (or another component that directly or indirectly affects temperature) does not result in an increase in fan energy (or other energy used to cool a space) that would result in greater total building energy use than was saved at the chiller.

[0074] Integrated control layer 418 can be configured to provide feedback to demand response layer 414 so that demand response layer 414 checks that constraints (e.g., temperature, lighting levels, etc.) are properly maintained even while demanded load shedding is in progress. The constraints may also include setpoint or sensed boundaries relating to safety, equipment operating limits and performance, comfort, fire codes, electrical codes, energy codes, and the like. Integrated control layer 418 is also logically below fault detection and diagnostics layer 416 and automated measurement and validation layer 412. Integrated control layer 418 can be configured to provide calculated inputs (e.g., aggregations) to these higher levels based on outputs from more than one building subsystem.

[0075] Automated measurement and validation (AM&V) layer 412 can be configured to verify that control strategies commanded by integrated control layer 418 or demand response layer 414 are working properly (e.g., using data aggregated by AM&V layer 412, integrated control layer 418, building subsystem integration layer 420, FDD layer 416, or otherwise). The calculations made by AM&V layer 412 can be based on building system energy models and/or equipment models for individual BMS devices or subsystems. For example, AM&V layer 412 may compare a model -predicted output with an actual output from building subsystems 428 to determine an accuracy of the model.

[0076] Fault detection and diagnostics (FDD) layer 416 can be configured to provide ongoing fault detection for building subsystems 428, building subsystem devices (i.e., building equipment), and control algorithms used by demand response layer 414 and integrated control layer 418. FDD layer 416 may receive data inputs from integrated control layer 418, directly from one or more building subsystems or devices, or from another data source. FDD layer 416 may automatically diagnose and respond to detected faults. The responses to detected or diagnosed faults can include providing an alert message to a user, a maintenance scheduling system, or a control algorithm configured to attempt to repair the fault or to work-around the fault.

[0077] FDD layer 416 can be configured to output a specific identification of the faulty component or cause of the fault (e.g., loose damper linkage) using detailed subsystem inputs available at building subsystem integration layer 420. In other exemplary embodiments, FDD layer 416 is configured to provide “fault” events to integrated control layer 418 which executes control strategies and policies in response to the received fault events. According to some embodiments, FDD layer 416 (or a policy executed by an integrated control engine or business rules engine) may shut-down systems or direct control activities around faulty devices or systems to reduce energy waste, extend equipment life, or assure proper control response.

[0078] FDD layer 416 can be configured to store or access a variety of different system data stores (or data points for live data). FDD layer 416 may use some content of the data stores to identify faults at the equipment level (e.g., specific chiller, specific AHU, specific terminal unit, etc.) and other content to identify faults at component or subsystem levels. For example, building subsystems 428 may generate temporal (i.e., time-series) data indicating the performance of BMS 400 and the various components thereof. The data generated by building subsystems 428 can include measured or calculated values that exhibit statistical characteristics and provide information about how the corresponding system or process (e.g., a temperature control process, a flow control process, etc.) is performing in terms of error from its setpoint. These processes can be examined by FDD layer 416 to expose when the system begins to degrade in performance and alert a user to repair the fault before it becomes more severe.

Data Center

[0079] As shown in FIG. 5, the indoor air temperature Ti_aof a data center 500 has a thermal capacitance Ga. The indoor air temperature Tia is affected by a variety of heat transfers Q into the data center 500, as described in detail below. It should be understood that although all heat transfers Q (e.g., thermal energy) are shown in FIG. 5 as directed into the data center 1200, the value of one or more of the heat transfers Q may be negative, such that heat flows out of the data center 500.

[0080] The data center equipment 502 contributes data center equipment heat transfer QDCE to the data center 500. The data center equipment 502 includes servers, processor, computers, and other electronic devices in the data center 500 that generate heat through electrical resistance during operation of the data center equipment 502. The heat transferred into the data center 500 by the data center equipment 502 is denoted as QDCE . The heat transfer QDCE may be predicted/modelled by a prediction circuit.

[0081] The building mass 504 contributes building mass heat transfer Q_m to the data center 500. The building mass 504 includes the physical structures in the building, such as walls, floors, ceilings, furniture, etc., all of which can absorb or give off heat. The building mass 504 has a temperature T_m and a lumped mass thermal capacitance Cm. The resistance of the building mass 504 to exchange heat with the indoor air 501 (e.g., due to insulation, thickness/layers of materials, etc.) may be characterized as mass thermal resistance Rmi.

[0082] The outdoor air 506 contributes outside air heat transfer Qoato the data center 500. The outdoor air 506 is the air outside of the building 10 with outdoor air temperature T_oa. The outdoor air temperature T_oa fluctuates with the weather and climate. Barriers between the outdoor air 506 and the indoor air 501 (e.g., walls, closed windows, insulation) create an outdoor-indoor thermal resistance Rot to heat exchange between the outdoor air 506 and the indoor air 501.

[0083] The HVAC system 599 also contributes heat to the data center 500, denoted as QHVAC. The HVAC system 599 includes HVAC equipment 510, controller 512, an indoor air temperature sensor 514 and an outdoor air temperature sensor 516. The HVAC equipment 510 may include any suitable equipment for controllably supplying heating and/or cooling to the data center 500. In general, HVAC equipment 510 is controlled by a controller 512 to provide heating (e.g., positive value of QHVAC) or cooling (e.g., a negative value of QHVAC) to the data center 500.

[0084] The indoor air temperature sensor 514 is located in the data center 500, measures the indoor air temperature 7/_a, and provides the measurement of 7 A to the controller 512. The outdoor air temperature sensor 516 is located outside of the building, measures the outdoor air temperature T a, and provides the measurement of a to the controller 512.

[0085] In some embodiments, the controller 512 receives the temperature measurements Toa and a and generates a control signal for the HVAC equipment 510, and transmits the control signal to the HVAC equipment 510. As discussed in greater detail herein, various chillers may be utilized as part of HVAC equipment 510 to reject heat from a data center or other space or area.

Chiller Assembly

[0086] Referring now to FIGS. 6-17, a chiller assembly 700 is shown according to one embodiment. Chiller assembly 700 is configured to receive heated fluid (e.g., via piping 344), chill (e.g., cool, lower the temperature of, etc.) the fluid, and return chilled fluid to a chilled conduit (e.g., via piping 342), according to some embodiments. As discussed in greater detail below, chiller assembly 700 may be a dual circuit, high capacity chiller that utilizes a dual stack condenser configuration to provide the chilled fluid to air handling units or other components of the HVAC system and/or a data center or other space.

[0087] As shown in FIGS. 6 and 7, the chiller assembly 700 provides volumetrically dense cooling. The chiller assembly 700 can fit within an intermodal container (e.g., shipping container, standardized freight container, etc.), shown as shipping container 600. The shipping container 600 may be an International Organization for Standardization (ISO) compliant shipping container. For example, the shipping container 600 may have a length L*, width W*, and height H* that is compliant with ISO standards. As shown in FIGS. 6 and 7, the shipping container 600 is a 40-foot container (e.g., L* is 40 feet, W* is 8 feet, and H* is 8.5 feet). The interior volume of the shipping container 600 may be 39.5 feet long by 7.75 feet wide, by 7.83 feet high. The chiller assembly 700 may be deposited into the internal volume of the shipping container 600 during, for example, storage and transport. In some embodiments, the chiller assembly 700 includes a frame, shown as frame 702. The frame 702 may extend from a first end 704 of the chiller assembly 700 to a second end 706 of the chiller assembly 700. In some embodiments, the distance, L, between the first end 704 and the second end 706 is less than the length L* of the shipping container 600. For example, distance L between the first end 704 and the second end 706 may be less than 40 feet. In some embodiments, a mid-frame 708 is supported by and coupled to (e.g., welded to, fastened to, adhered to, etc.) the frame 702. The mid-frame 708 may include a rail 710 that spans above the frame 702. The rail 710 may be supported by one or more frame beams 712. The space 714 between the mid-frame 708 and the frame 702 may accommodate one or more compressor assemblies 716, thermal expansion devices 718 (e.g., thermal expansion valves), and/or evaporators 720. In some embodiments, the mid-frame 708 is coupled to and supports one or more condenser assemblies 722. In some embodiments, the chiller assembly 700 includes 9 condenser assemblies 722. In some embodiments, the chiller assembly 700 includes 10 condenser assemblies 722. In some embodiments, the chiller assembly 700 does not include a mid-frame 708. For example, the condenser assemblies 722 may be coupled directly to the frame 702. In some embodiments, the evaporators 720, compressor assemblies 716, and/or thermal expansion devices 718 are coupled to the frame 702 in a space defined between the frame and the condenser assemblies 722. For example, the evaporators 720, compressor assemblies 716, and/or thermal expansion devices 718 may be coupled below the condenser assemblies 722 and above the base of the frame 702.

[0088] In some embodiments, the shipping container 600 is a 10-foot container (e.g., 9'9.75" x 8' x 8'6" exterior, 9'3" x 7'8" x 7'10" interior, footprint of approximately 75 square feet), a 20-foot container (e.g., 19'10.5" x 8' x 8'6" exterior, 9'3" x 7'8" x 7'10" interior, footprint of approximately 150 square feet), a 20-foot high cube container (e.g., 19'10.5" x 8' x 9'6" exterior, 19'3" x 7'8" x 8'10" interior, footprint of approximately 150 square feet), a 40 foot container (e.g., 40' x 8' x 8'6" exterior, 39'5" x 7'8"x 7'10" interior, footprint of approximately 300 square feet), or a 40 foot high cube container (e.g., 40' x 8' x 9'6" exterior, 39'5" x 7'8"x 8'10" interior, footprint of approximately 300 square feet). In some embodiments, the shipping container is a rectangular box. In some embodiments, the chiller assembly 700 is configured to pass through the opening of the shipping container (e.g., a door having dimensions of approximately 7'8" x 7'5" or approximately 7'8" x 8'5.5") while assembled (e.g., fully constructed). That is, the chiller assembly 700 is fully assembled within the shipping container 600. An installer can fluidly and electrically couple the chiller assembly 700 to a building system without needing to unpack and construct (e.g., weld, rivet, crane hoist and position, etc.,) the components of the chiller assembly 700 at the jobsite, according to some embodiments. Advantageously, the chiller assembly 700 facilitates rapid and efficient installation and deployment into a building system.

[0089] As shown in FIG. 11, a vapor compression system 1100 of the chiller assembly 700 includes a first vapor compression circuit 1102 and a second vapor compression circuit 1104. The first vapor compression circuit 1102 includes compressor assembly 716A, a coil of the condenser assembly 722, an expansion valve 718A, and the evaporator 720 A. The second vapor compression circuit 1104 includes compressor assembly 716B, a coil of the condenser assembly 722, the expansion valve 718B, and the evaporator 720B. Using a dual circuit design with chiller assembly 700 may reduce the load on each individual circuit and enable the chiller assembly to have a relatively high capacity while maintaining a relatively small packaging space (e.g., to fit within the container described above).

[0090] As shown in FIG. 11, a fluid loop, shown as water loop 1106 travels from the building, to and through evaporator 720A, then to and through evaporator 720B, and then to a downstream component (e.g., an AHU). The first vapor compression circuit 1102 circulates a fluid that travels in a counterflow arrangement relative to the fluid (e.g., refrigerant) of the water loop 1106. The second vapor compression circuit 1104 circulates a fluid (e.g., refrigerant) that travels in a counterflow arrangement relative to the fluid (e.g., water, process fluid, working fluid, etc.) of the water loop 1106. That is, evaporator 720A is upstream of evaporator 720B in the water loop 1106, according to some embodiments. The evaporator 720A is in a series arrangement with the evaporator 720B within the water loop 1106, according to some embodiments. In some embodiments, evaporators 720A and 720B are positioned to enable fitting chiller assembly 700 within container 600. For example, evaporators 720A, 720B may be arranged generally in line with each other along the length of chiller assembly 700, arranged parallel to each other and be either spaced apart from each other or overlap with each other along the length of chiller assembly 700, arranged at an angle relative to each other and/or the longitudinal axis running along the length of chiller assembly 700, or evaporators 720A, 720B may be positioned in another suitable arrangement that enables chiller assembly 700 to be placed within container 600. Furthermore, while both evaporator 720A and evaporator 720B are shown to operate in a counterflow arrangement, other configurations can be used according to various other embodiments (e.g., one or both of evaporators 720 A, 720B may use a different flow arrangement/direction).

[0091] In some embodiments, the chiller assembly 700 provides between 500 and 1000 refrigeration tons (TOR), i.e., 6,000,000 and 12,000,000 British Thermal Units (BTU) per hour (BTUh), i.e., between 1758 and 3516 kilo-watts (kW), at standard temperature and pressure (STP). In some embodiments, the chiller assembly 700 provides between 700 and 800 TOR, i.e., between 2462 and 2813 kW, i.e., between 8,400,000 and 9,600,000 BTUh, at standard temperature and pressure (STP). In other embodiments, the chiller assembly 700 provides between 700 and 800 refrigeration tons at a temperature of between 70 degrees F and 80 degrees F. For example, chiller assembly may provide at least 700 TOR, at least 740 TOR, or at least 800 TOR. In some embodiments, the chiller assembly 700 is configured to provide between 400 and 800 TOR, i.e., between 1407 and 2813 kW, i.e., between 4,800,000 and 9,600,000 BTUh, at standard temperature and pressure (STP). In some embodiments, the chiller assembly 700 is configured to provide between 400 and 600 TOR, i.e., between 1407 and 2110 kW, i.e., between 4,800,000 and 7,200,000 BTUh, at standard temperature and pressure (STP). In some embodiments, the chiller assembly 700 is configured to provide between 800 to 1000 TOR (e.g. more than 800 TOR) at standard temperature and pressure (STP) and fit within container 600. In some embodiments, the chiller assembly 700 is configured to provide between 800 to 1000 TOR (e.g. more than 800 TOR) at standard temperature and pressure (STP) and fit within container 600.

[0092] In some embodiments, the first vapor compression circuit 1102 is configured to facilitate cooling a process fluid having an inlet temperature (i.e., flow temperature) to an intermediate return temperature, and the second vapor compression circuit 1104 is configured to facilitate cooling the process fluid from the intermediate return temperature to a return temperature (e.g., outlet temperature). That is, the first vapor compression circuit 1102 receives the process fluid at an inlet temperature and cools the process fluid to an intermediate return temperature before providing the process fluid to the second vapor compression circuit 1104. The second vapor compression circuit 1104 subsequently cools the process fluid from the intermediate return temperature to the return temperature. In some embodiments, the first vapor compression circuit 1102 is tuned, optimized, configured, etc., to provide enhanced cooling of the process fluid at temperatures between the flow temperature and the intermediate return temperature. The second vapor compression circuit 1104 may be tuned, optimized, configured, etc., to provide enhanced cooling of the process fluid at temperatures between the intermediate return temperature and the return temperature. For example, the first vapor compression circuit 1102 may operate on a first refrigerant and the second vapor compression circuit 1104 may operate on a second refrigerant that is different than the first refrigerant. In this way, for example, the second refrigerant can facilitate heat transfer between the process fluid and the refrigerant, and/or the refrigerant and the ambient environment, more effectively than the first refrigerant at the intermediate return temperature of the process fluid and the return temperature of the process fluid. In this way, for example, the first vapor compression circuit 1102 is configured to facilitate enhanced cooling of the process fluid within a first temperature range, and the second vapor compression circuit is configured to cool the process fluid within a second temperature range that is different than the first temperature range. That is, the chiller assembly 700 can provide enhanced cooling for the respective temperature ranges. In some embodiments, one circuit that is tuned for low level of water inlet and outlet temperatures and other circuit is tuned for higher level of inlet and outlet temperatures.

[0093] In some embodiments, the chiller assembly 700 is configured to provide cooling at up to an ambient air temperature of 140 degrees Fahrenheit (i.e., 60 degrees Celsius). In some embodiments, the first vapor compression circuit 1102 and/or the second vapor compression circuit 1104 operate on a low global warming potential (GWP) refrigerant, such as R-1234ze. In some embodiments, the first vapor compression circuit 1102 and the second vapor compression circuit 1104 can facilitate operating at high ambient air temperatures (e.g., 140 degrees F) by, for example, the first vapor compression circuit 1102 cooling the process fluid from a flow temperature to an intermediate return temperature, and the second vapor compression circuit 1104 cooling the process fluid further, from the intermediate return temperature to the return temperature. Providing increased capacity and a higher ambient withstand within a relatively compact packaging space may assist in reducing space requirements for the chiller assembly 700, including during shipping, installation, etc., particularly in applications where space may be a constraint (e.g., rooftops, etc.).

[0094] In some embodiments, the chiller assembly 700 is configured to reduce vibrations transmitted through the frame (e.g., to the building) and/or the air (e.g., as sound). For example, the chiller assembly 700 may include a suspension configured to isolate the frame of chiller 102 from the building, and/or one or more of the compressor assemblies 716. In some embodiments, the condenser assemblies include one or more low-noise fan blades configured to reduce the sound output from operating the fans (e.g., reduce tip cavitation). In some embodiments, the chiller assembly 700 outputs a maximum of 97 decibels A (dBA).

[0095] In some embodiments, the chiller assembly 700 may include some or all of the features and functions of the chiller 232. The assembly of chiller 232 may include some or all of the features and functions of the chiller assembly 700.

Chiller Condenser Assembly

[0096] FIG. 12 shows a heat exchanger, or condenser, according to some embodiments. An example of a heat exchanger which can be used in the chiller assembly 700 is described in U.S. Patent Application No. 15/871,826 filed January 15, 2018, the entire disclosure of which is incorporated by reference herein. As shown in FIG. 12, a condenser assembly 722 can have portions 1227 having separate, stacked sections or coils 1234. The outer sections or coils 1235 (of the V-shape) of heat exchanger or condenser portion 1227 can be part of one refrigerant circuit and the inner sections or coils 1237 (of the V-shape) of heat exchanger or condenser portion 1227 can be part of a second refrigerant circuit. The discharge vapor or gas from the compressor(s) can enter each section or coil 1234 at connections 1229 at the top and middle of the section or coil 1234. The liquid refrigerant can exit each section or coil 1234 from a connection 1231 near the bottom of the section or coil 1234. In some embodiments, each section or coil 1234 can be identical in design, configuration, or arrangement with two refrigerant passes through the section or coil 1234. In some embodiments, the sections or coils can have different designs, sizes or configurations and a different number of passes of refrigerant. The use of a section or coil 1234 with two passes results in both inlet and outlet connections being at the same end of the section or coil 1234 and can provide for the cooler air leaving a subcooling portion of the upstream section or coil to be used by a subcooling portion of the downstream section or coil.

[0097] In some embodiments, a single pass or odd-number pass configuration may be used for each section or coil 1234 or particular sections or coils 1234. The single pass or odd-number pass configuration can result in the corresponding refrigerant headers for the section or coil 1234 being at opposite ends of the section or coil 1234 to provide sufficient space for the easy assembly and assembly of the piping connections. [0098] FIG. 13 shows a partially exploded view of the condenser assembly 722. Condenser assembly 722 may include an upper assembly 1328 including a shroud 1330 and one or more fans 1332. The heat exchanger sections or coils 1334 may be positioned beneath shroud 1330 and may be positioned above or at least partially above other components, such as compressor assembly 716, an expansion device 718, or an evaporator 720. The heat exchanger sections or coils 1334 can be mounted using the same or common structural components and can be assembled as part of a packaged unit. Section or coils 1334 may be positioned at any angle between zero degrees and ninety degrees to provide enhanced airflow through coils 1334 and to assist with the drainage of liquid from coils 1334. In some embodiments, the stacking of the heat exchanger sections or coils 1334 as part of a packaged unit provides for a compact unit that can be shipped in standard shipping containers. Further, the stacked coil condenser design enables the chiller assembly to have a relatively high capacity while maintaining a relatively low small packaging size.

Chiller Compressor Assembly

[0099] As shown in FIGS. 14-15, the chiller assembly 700 includes compressor assemblies 1400 A, 1400B and evaporators 720 A, 720B, according to some embodiments. Compressor assembly 1400 A may include some or all of the features of compressor assembly 1400B. Likewise, compressor assembly 1400B may include some or all of the features of compressor assembly 1400 A. Compressor assembly 1400 A includes a compressor 1402 driven by a motor 1404. An example of a compressor which can be used in the chiller assembly 700 is described in U.S. Patent Application No. 16/182,410 filed November 6, 2018, the entire disclosure of which is incorporated by reference herein.

[0100] Motor 1404 can be powered by a variable speed drive (VSD) 1410. VSD 1410 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source and provides power having a variable voltage and frequency to motor 1404. Motor 1404 can be any type of electric motor than can be powered by a VSD 1410. For example, motor 1404 can be a high speed induction motor. Compressor 1402 is driven by motor 1404 to compress a refrigerant vapor received from evaporator 720 through suction line 1412 and to deliver refrigerant vapor to a condenser (e.g., condenser assembly 722) through a discharge line 1424. Compressor 1402 can be a centrifugal compressor, a screw compressor, a scroll compressor, or any other type of suitable compressor. As shown in FIGS. 14-15, compressor 1402 is a centrifugal compressor. [0101] Referring now to FIG. 15, a sectional view of a high speed induction motor utilized to drive a centrifugal compressor is shown. In some embodiments, the high speed induction motor is substantially similar to motor 1404, and the centrifugal compressor is substantially similar to compressor 1402. Motor 1404 is shown to include among other components, an enclosure or housing 1502, a stator 1504, and a rotor 1506. The stator 1504 is the stationary part of the motor's electromagnetic circuit that imparts radial and axial magnetic forces on the rotor 1506. In a properly aligned system, the sum of these forces is zero, or nearly zero. In some embodiments, the stator 1504 is partially encapsulated by a motor jacket 1510, and both the stator 1504 and the motor jacket 1510 may have a substantially cylindrical shape. The motor jacket 1510 may be constructed from aluminum and may be configured to optimize heat transfer from the stator 1504 to prevent overheating of the motor 1404.

[0102] The rotor 1506 is the rotating part of the motor's electromagnetic circuit. In various embodiments, the rotor 1506 may be a squirrel-cage rotor, a wound rotor, a salient-pole rotor, or a cylindrical rotor. The rotor 1506 is coupled to a shaft 1508. The shaft 1508 is shown to include a first end 1538 and a second end 1540. The rotor 1506 and the shaft 1508 collectively rotate about a central axis 1526 in order to transmit torque and rotation to other components and/or assemblies coupled to the motor 1404.

[0103] In some embodiments, the second end 1540 of the shaft 1508 is coupled to an impeller 1530 of the centrifugal compressor 1402 using a direct drive connection 1528. In some embodiments, the direct drive connection 1528 may include a mechanical fastener (e.g., a bolt, a pin) used to couple the shaft 1508 to the impeller 1530. In addition to the impeller 1530, the centrifugal compressor 1402 can include, among other components, an inlet 1542, a diffuser assembly including a variable geometry diffuser (VGD) 1532 and a diffuser plate 1536, and a collector or scroll assembly 1534. The inlet 1542 can include a pipe that draws fluid (e.g., the LP refrigerant) to the impeller 1530, which is a rotating set of vanes that gradually impart kinetic energy to the vapor. Downstream of the impeller 1530 is the diffuser gap formed by the VGD 1532 and the diffuser plate 1536. The kinetic energy of the vapor is converted into pressure energy as it flows and expands through the diffuser gap and before it exits the centrifugal compressor via the collector or scroll assembly 1534.

[0104] Some induction motors utilize an interference fit to retain the stator within the housing. In an interference fit, the stator can be heated until thermal expansion creates a clearance between the inside diameter of the motor housing and the outside diameter of the stator. In other embodiments, the stator is cooled until the stator contracts and a clearance is created between the motor housing and the stator. Once stator is inserted into the housing and both the housing and the stator reach an equilibrium temperature, the clearance between the housing and the stator diminishes to zero. However, as the thermal expansion rates of the housing and the stator may not be identical, this return to equilibrium temperature can cause distortions in the shape (e.g., the circularity) of the stator. A distorted stator caused by an interference fit can lead to unbalanced magnetic forces on the rotor. When the system is improperly aligned such that the sum of the forces exerted by the stator on the rotor is nonzero, designers must overspecify bearing assemblies (i.e., they must select magnetic bearings with oversized components) in order to not exceed the rotor positioning capabilities of the magnetic bearing assemblies.

[0105] Thus, a clearance region 1522 is maintained between the motor jacket 1510 of the stator 1504 and the motor housing 1502 to avoid imperfect circularity of the housing 1502 from distorting the circularity of the stator, according to some embodiments. To prevent displacement and/or rotation of the motor jacket 1510 and the stator 1504 relative to the motor housing 1502, a locating pin 1512 or key may be inserted through the housing 1502 and the motor jacket 1510, and retained within the stator 1504. In order to minimize unbalanced magnetic forces, the stator 1504 and rotor 1506 are concentric and the air gap 1524, between the stator and rotor are maintained as a true cylindrical feature, according to some embodiments. The clearance region 1522 between the motor jacket 1510 and the motor housing 1502 may be controlled such that deviations in the air gap 1524 is less than 10% of the nominal clearance. Nominal clearance may be defined as perfectly concentric alignment between the stator 1504 and the rotor 1506 along central axis 1526.

[0106] The motor 1404 is also shown to include magnetic bearing assemblies 1514, 1516 and 1518 that support the rotor 1506 and shaft 1508 and permit rotation of the rotor 1506 and shaft 1508 relative to the stator 1504. Magnetic bearing assemblies support a load using magnetic levitation, and thus permit relative motion with very low friction and little or no mechanical wear. In some embodiments, magnetic bearing assemblies 1514, 1516, and 1518 are active magnetic bearing (AMB) assemblies. AMB assemblies utilize electromagnetic actuators with continuously adjusted current values to keep the rotor 1506 and shaft 1508 in a desired position and achieve stable levitation.

[0107] The magnetic bearing assemblies 1514 and 1518 may be radial bearing assemblies configured to control the position of the shaft 1508 in a radial direction (i.e., perpendicular to central axis 1526), while magnetic bearing assembly 1516 may be a thrust bearing assembly configured to control the position of the shaft 1508 in an axial direction (i.e., parallel to central axis 1526). In some embodiments, radial magnetic bearing assembly 1514 may be located proximate the first end 1538 of the shaft 1508, while radial magnetic bearing assembly 1518 may be located proximate the second end 1540 of the shaft 1508. Thrust magnetic bearing assembly 1516 may be located between radial bearing assemblies 1514 and 1518, and near the second end 1540 of the shaft 1508 and the impeller 1530. By locating the thrust magnetic bearing assembly 1516 near the impeller 1530, when heat caused by the operation of the motor 1404 causes the shaft 1508 to expand, the proximity of the thrust magnetic bearing assembly 1516 permits precise alignment of the impeller 1530 within the compressor diffuser to achieve an optimized aerodynamic performance.

[0108] As described above, motor 1404 may be semi-hermetically sealed. A hermetic or semi-hermetically sealed motor 1404 may refer to a motor that is exposed to the environment inside the compressor assembly 716 (i.e., such that the motor may be cooled by the refrigerant circulating through the chiller assembly). By contrast, a motor that is not designed to be hermetic or semi-hermetic may be enclosed in a separate housing, and connected to a compressor via a shaft coupling and shaft seal. Motor 1404 may be considered semi-hermetically sealed as end plate 1520 may be detachably fastened to the housing 1502 through the use of mechanical fasteners and seals (e.g., bolts, o-rings). In comparison, a fully hermetically sealed compressor is one which encapsulates the motor and may include a welded enclosure.

Chiller Evaporator(s)

[0109] As shown in FIG. 14, evaporator 720 A includes an internal tube bundle, a supply line 1420 A and a return line 1422 A for supplying and removing a process fluid to the internal tube bundle. The supply line 1420A and the return line 1422A can be in fluid communication with a component within an HVAC system (e.g., an air handler) via conduits that that circulate the process fluid. The process fluid is a chilled liquid for cooling a building and can be, but is not limited to, water, ethylene glycol (i.e., glycol), calcium chloride brine, sodium chloride brine, or any other suitable liquid. Evaporator 720A is configured to lower the temperature of the process fluid as the process fluid passes through the tube bundle of evaporator 720A and exchanges heat with the refrigerant passing through the refrigerant loop. Refrigerant vapor is formed in evaporator 720A by the refrigerant liquid delivered to the evaporator 720A exchanging heat with the process fluid and undergoing a phase change to refrigerant vapor.

[0110] Refrigerant vapor delivered from evaporator 720A by compressor 1402 to condenser assemblies 722 transfers heat to a fluid (e.g., air). Refrigerant vapor condenses to refrigerant liquid in condenser assembly 722 as a result of heat transfer with the fluid. The refrigerant liquid from condenser assembly 722 flows through an expansion device 718 (e.g., expansion valve) and is returned to evaporator 720A to complete a refrigerant cycle of a first refrigerant loop (e.g., a first refrigerant circuit) of the chiller assembly 700.

[OHl] In some embodiments, evaporator 720B may include some or all of the features and functions of evaporator 720A. In some embodiments, evaporator 720A may include some or all of the features and functions of evaporator 720B. In some embodiments, evaporator 720B includes an internal tube bundle, a supply line 1420B and a return line 1422B for supplying and removing a process fluid to the internal tube bundle. The supply line 1420B and the return line 1422B can be in fluid communication with a component within an HVAC system (e.g., an air handler) via conduits that that circulate the process fluid. In some embodiments, the process fluid of evaporator 720A is passed to the evaporator 720B via one or more fluid conduits (e.g., piping, etc.). Evaporator 720B is configured to lower the temperature of the process fluid as the process fluid passes through the tube bundle of evaporator 720B and exchanges heat with the refrigerant passing through the refrigerant loop. Refrigerant vapor is formed in evaporator 720B by the refrigerant liquid delivered to the evaporator 720B exchanging heat with the process fluid and undergoing a phase change to refrigerant vapor.

[0112] As shown in FIG. 14, the supply line 1420B is fluidly coupled to the return line 1422 A of the evaporator 720 A. In some embodiments, the evaporator 720 A and the evaporator 720B are coupled together by a pipe 1440 having one or more bends (e.g., elbow, corner, etc.), shown as bends 1442, 1444. In some embodiments, the process fluid exists the evaporator 720A in a first direction, travels within the pipe 1440 in a second direction perpendicular to the first direction, and then enters the evaporator 720B in a third direction being parallel to the first direction. In some embodiments, the supply line 1420B and return line 1422B are on a first end 1444B of the evaporator 720B. In some embodiments, the supply line 1420 A and return line 1422 A are on a first end 1446 A of the evaporator 720A. In some embodiments, the first end 1446A is proximate the first end 1446B. In some embodiments, the evaporator 720 A and the evaporator 720B extend along a longitudinal axis that is parallel to the direction of the length, L, of the chiller assembly 700.

Chiller Controller

[0113] As shown in FIGS. 14, 16, and 17, the chiller assembly 700 includes a controller 1600 (e.g., microcontroller, etc.). The controller 1600 is shown to include a communications interface 1602 and a processing circuit 1604 having a processor 1606 and a memory 1608. The communications interface 1602 may include wired or wireless communications interfaces (e.g., jacks, antennas, transmitters, receivers, transceivers, wire terminals, etc.) for communicating data between the controller 1600 and external systems or devices (e.g., the BMS 400, the user device 1704, etc.). In some embodiments, the communications interface 1602 facilitates communication between the controller 1600 and external applications (e.g., remote systems and applications), so as to allow a remote entity or user to control, monitor, and/or adjust components of the controller 1600.

Communications conducted via the communications interface 1602 may be direct (e.g., local wired or wireless communications), or via the network 446 (e.g., a WAN, the Internet, a cellular network, etc.). Further, the communications interface 1602 may be configured to communicate with external systems and/or devices using any of a variety of communications protocols (e.g., HTTP(S), WebSocket, CoAP, MQTT, etc.), industrial control protocols (e.g., MTConnect, OPC, OPC-UA, etc.), process automation protocols (e.g., HART, Profibus, etc.), home automation protocols, and/or any of a variety of other protocols. Advantageously, the controller 1600 may obtain, ingest, and process data from any type of system or device, regardless of the communications protocol used by the system or device.

[0114] As shown in FIG. 17, the controller 1600 communicates with the user device 1704 and/or another external device or system (e.g., via the communications interface 1602, the network 446, etc.). For example, the controller 1600 may receive entity access data from the user device 1704, which may include data received via a user interface 1610 (e.g., input via a user). The user interface 1610 may include a display 1702 (e.g., screen, touch screen, liquid crystal display, light emitting diode display, etc.), speaker, etc., and one or more user input devices (e.g., touch sensitive surfaces, buttons, keypads, joysticks, etc.) shown as keypad 1706 to control operation of the vapor compression cycles within chiller assembly 700. For example, the controller 1600 may be operably coupled with chiller plant equipment 1620 and may receive sensor data from chiller plant equipment 1620, and generate or transmit command signals to actuators of the plant equipment 1620.

Coil Configurations

[0115] With reference to FIGS. 18 and 19, coils 1235 and 1237 are provided in units 1735 and 1737, respectively. Units 1735 and 1737 are coil units having a rectangular prismatic shape. Coils 1235 and 137 can have different sizes (e.g., a tall coil and a short coil). A face area 1740 of unit 1735 is different than a face area 1742 of unit 1737. In some embodiments, face area 1740 for unit 1735 has surface area of 80-100 percent (e.g., 88.1 percent) of the surface area of face area 1742 of unit 1737. In some embodiments, face area 1740 for unit 1735 has surface area of 60-100 percent of the surface area of the face area 1742 of unit 1737. In some embodiments, units 1735 and 1737 and coils 1235 and 1237 have different volumes. Face area 1740 has an area of 2368127 square mm and a perimeter of 6371.40 mm in some embodiments. Face area 1740 has an area of 2086416 square mm and a perimeter of 6052.37 mm in some embodiments.

[0116] Unit 1735 can be taller than unit 1737 and have the same horizontal dimension and thickness in some embodiments. In some embodiments, face areas 1740 and 1742 and units 1735 and 1737 are the same size. In some embodiments, the thickness of units 1735 and 1737 is in a range from 20-40 mm (e.g., 25 or 32 mm). In some embodiments, unit 1735 is disposed on an outside of assembly 722, and unit 1737 is disposed closer to the interior of assembly 722 than unit 1737. In some embodiments, a larger of units 1737 and 1735 is disposed on the outside of of assembly 1722, and the smaller of units 1375 and 1377 are disposed closer to the interior of assembly 1722. A shorter unit 1735 can result in more airflow for unit 1737, cooler air for unit 1737, and less heat transfer area for unit 1735 (reduced performance of unit 1735). A taller unit 1735 can result in less airflow for unit 1737, hotter air for unit 1737, and more heat transfer area for unit 1735 (increased performance of unit 1735).

[0117] In some embodiments, an extent 1755 of unit 1735 is less than an extent 1757 of unit 1737. The difference in extents 1755 and 1757 allows assemblies 722 to be placed next to each other without interfering. In some embodiments, extent 1755 of unit 1735 is 60 to 100 percent of extent 1757 of unit 1737. In some embodiments, extent 1755 and extent 1757 of units 1735 and 1737 of assembly 722 have the same length or are close in length. In some embodiments, extent 1755 and extent 1757 of units 1735 and 1737 of one assembly 722 have the same length. In some embodiments, assembly 722 has units 1735 and 1737 with extent 1755 shorter than extent 1757 to accommodate a longer extent of a unit 1767 and/or a unit 1769 (shown in dashed lines) of a neighboring assembly so that unit 1767 and/or unit 1769 of the neighboring assembly can fill a gap 1777. A similar gap can be provided for the neighboring assembly on its right side in some embodiments. For example, unit 1735 and 1737 can each be shorter and the same size, thereby allowing two taller units 1767 and 1769 to have ends that extend into gap 1777. In some embodiments, unit 1767 is longer than shown in FIG. 18 and extends into gap 1777.

[0118] In some embodiments, coils 1235 and 1237 or units 1735 and 1737 are disposed next to each other or in contact with each other. In some embodiments, a spacing 1771 of in a range of 0-40 millimeters is provided between units 1735 and 1737 according to customer specifications. Spacing 1771 can be chosen based upon conditions in the environment of the installation and can be fixed or variable along any axis of units 1735 and 1735. In some embodiments, the headers of coils 1235 and 1237 are touching. In some embodiments, spacing 1771 is provided by brackets 1792 attached to units 1737 and 1735. A spacer can be provided between the brackets to effect larger gaps or spaces. The space 1771 can allow fresh air or other air flow to reach the space between units 1735 and 1737. In some embodiments, the spacing 1771 is less than 3 times the thickness of one of units 1735 or 1737 (e.g., 3*25 mm). In some embodiments, the spacing 1171 is variable form 0 to less than 3 times the thickness of one of units 1735 or 1737. In some embodiments, the space is less than 40 mm (e.g., 18 mm, 30 mm, etc.). A larger gap allows more fresh air to reach a taller unit 1737 while a smaller gap causes the taller unit 1737 to receive a higher percentage of air heated by the shorter unit 1735. In some embodiments, providing a wider spacing 1171 at a bottom improves air temperature for a tall coil de-superheating region of unit 1737 and reduces airflow to the short unit 1735. In some embodiments, providing wider spacing 1171 at a top improvers air flow for a short unit 1735. In some embodiments, providing narrower spacing 1171 at a top improves air flow for a shorter unit 1735.

Configuration of Exemplary Embodiments

[0119] The construction and arrangement of the systems and methods as shown in the various exemplary embodiments are illustrative only. Although only a few embodiments have been described in detail in this disclosure, many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.). For example, the position of elements can be reversed or otherwise varied and the nature or number of discrete elements or positions can be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the present disclosure. The order or sequence of any process or method steps can be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present disclosure.

[0120] The present disclosure contemplates methods, systems, and program products on any machine-readable media for accomplishing various operations. The embodiments of the present disclosure can be implemented using existing computer processors, or by a special purpose computer processor for an appropriate system, incorporated for this or another purpose, or by a hardwired system. Embodiments within the scope of the present disclosure include program products comprising machine-readable media for carrying or having machine-executable instructions or data structures stored thereon. Such machine- readable media can be any available media that can be accessed by a general purpose or special purpose computer or other machine with a processor. By way of example, such machine-readable media can comprise RAM, ROM, EPROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to carry or store desired program code in the form of machine-executable instructions or data structures and which can be accessed by a general purpose or special purpose computer or other machine with a processor. Combinations of the above are also included within the scope of machine-readable media. Machineexecutable instructions include, for example, instructions and data which cause a general purpose computer, special purpose computer, or special purpose processing machines to perform a certain function or group of functions.

[0121] Although the figures show a specific order of method steps, the order of the steps may differ from what is depicted. Also two or more steps can be performed concurrently or with partial concurrence. Such variation will depend on the software and hardware systems chosen and on designer choice. All such variations are within the scope of the disclosure. Likewise, software implementations could be accomplished with standard programming techniques with rule based logic and other logic to accomplish the various connection steps, processing steps, comparison steps and decision steps.

Claims

WHAT IS CLAIMED IS:

1 . A chiller assembly for a heating, ventilating, or air conditioning (HVAC) system, the chiller assembly comprising: a frame; a first vapor compression circuit comprising a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit; a second vapor compression circuit comprising a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit; a process fluid circuit passing through the first evaporator and the second evaporator, wherein the first evaporator and the second evaporator are configured to place the first and second refrigerant in a heat exchange relationship with a process fluid of the process fluid circuit; and at least one fan configured to direct air across the first condenser coil and the second condenser coil; wherein the chiller assembly is configured to be housed within an intermodal shipping container.

2. The chiller assembly of claim 1, wherein the first vapor compression circuit and the second vapor compression circuit are configured to provide between 500 refrigeration tons and 1000 refrigeration tons at an ambient temperature of between 50 degrees F and 100 degrees F.

3. The chiller assembly of claim 1, wherein the first condenser coil comprises a plurality of first coils and the second condenser coil comprises a plurality of second coils, each first coil of the plurality of first coils of the first condenser coil is positioned next to and substantially parallel to a corresponding second coil of the plurality of second coils of the second condenser coil.

4. The chiller assembly of claim 3, wherein the plurality of first coils of the first condenser coil and the plurality of second coils of the second condenser coil use common structural components.

5. The chiller assembly of claim 3, wherein the plurality of first coils and the plurality of second coils comprise the same design.

6. The chiller assembly of claim 1, wherein the first compressor and the second compressor are centrifugal compressors.

7. The chiller assembly of claim 1, wherein the first compressor comprises an electric motor having a magnetic bearing configured to support a rotor.

8. The chiller assembly of claim 1, wherein the intermodal shipping container has a length of up to 40 feet, a width of up to 8 feet, and a height of up to 9.5 feet.

9. The chiller assembly of claim 1, wherein the first refrigerant or the second refrigerant is R-1234ze.

10. The chiller assembly of claim 1, wherein the process fluid is glycol or water.

11. The chiller assembly of claim 1, further comprising a mid-frame coupled to the frame and supporting the first condenser coil and the second condenser coil.

12. The chiller assembly of claim 11, wherein the first compressor and the second compressor are coupled to the frame in a space between the mid-frame and the frame.

13. The chiller assembly of claim 11, wherein the first evaporator and the second evaporator are coupled to the frame in a space between the mid-frame and the frame.

14. A chiller assembly for a heating, ventilating, or air conditioning (HVAC) system, the chiller assembly comprising: a frame; a first vapor compression circuit comprising a first compressor configured to circulate a first refrigerant through a first condenser and a first evaporator of the first vapor compression circuit; a second vapor compression circuit comprising a second compressor configured to circulate a second refrigerant through a second condenser and a second evaporator of the second vapor compression circuit; a process fluid circuit passing through the first evaporator and the second evaporator; and a fan configured to direct a flow of air across the first condenser and the second condenser; wherein an outlet of the first evaporator is fluidly coupled to an inlet of the second evaporator; and wherein the frame is configured to position within an intermodal shipping container, wherein the intermodal shipping container has a maximum length of 40 feet, a maximum width of 8 feet, and a maximum height of 8.5 feet.

15. The chiller assembly of claim 14, wherein the first vapor compression circuit and the second vapor compression circuit are configured to provide between 500 refrigeration tons and 1000 refrigeration tons at an ambient temperature of between 50 degrees F and 100 degrees F.

16. The chiller assembly of claim 14, wherein the first compressor and the second compressor are centrifugal compressors.

17. The chiller assembly of claim 14, wherein the first compressor comprises an electric motor having a magnetic bearing configured to support a rotor.

18. A chiller assembly comprising: a frame; a first vapor compression circuit comprising a first compressor configured to circulate a first refrigerant through a first condenser and a first evaporator of the first vapor compression circuit; a second vapor compression circuit comprising a second compressor configured to circulate a second refrigerant through a second condenser and a second evaporator of the second vapor compression circuit; wherein the first evaporator and the second evaporator are coupled to the frame; and wherein the first condenser comprises a plurality of first coils and the second condenser comprises a plurality of second coils, each first coil of the plurality of first coils of the first condenser is positioned next to and substantially parallel to a corresponding second coil of the plurality of second coils of the second condenser.

19. The chiller assembly of claim 18, wherein the first vapor compression circuit and the second vapor compression circuit are configured to provide between 700 refrigeration tons and 800 refrigeration tons at an ambient temperature of between 70 degrees F and 80 degrees F.

20. The chiller assembly of claim 18, wherein the chiller assembly is configured to be housed within an intermodal shipping container.