EP4677962A1 - Device and method for depositing a printing material on a substrate - Google Patents
Device and method for depositing a printing material on a substrateInfo
- Publication number
- EP4677962A1 EP4677962A1 EP24710884.8A EP24710884A EP4677962A1 EP 4677962 A1 EP4677962 A1 EP 4677962A1 EP 24710884 A EP24710884 A EP 24710884A EP 4677962 A1 EP4677962 A1 EP 4677962A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- optical
- layer
- impediment
- absorption layer
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3485—Application of solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Definitions
- the present invention is directed at a device for depositing a printing material on a substrate, the device comprising: an optically transmissive plate comprising a first surface and a second surface opposite the first surface, wherein the first surface provides an optical reception surface for receiving an optical radiation signal, and wherein the second surface comprises at least one deposition cavity configured for holding said printing material prior to deposition thereof, wherein the first surface is configured for cooperating with an optical source for receiving said optical radiation signal.
- the invention is further directed at a method of depositing a dot of printing material on a substrate using a device as described above.
- an optically transmissive plate comprises a surface provided with printing or deposition cavities.
- cavities for deposition, hold a printing material which is to be deposited on the substrate that is located underneath the optically transmissive plate.
- the opposite side or back side of the optically transmissive printing plate is selectively illuminated by an optical signal, e.g. a laser pulse.
- LIFT is based on the principle that the illuminated printing material in the cavity will heat-up and be propelled, as a result of gas production due to evaporation, from the cavity.
- an optical absorption layer may be present on the walls of the cavity, in order to take-up the optical radiation and convert it into heat.
- the LIFT technique is a promising technology for enabling a larger range of printing materials to be deposited onto a substrate efficiently
- control of the deposition technique is difficult for a variety of reasons. Therefore, the deposition results are not always satisfactory.
- differences in the amount of heat conveyed to various parts of the cavity cause unpredictable evaporation in different parts of the cavity.
- a droplet of material may be released from the cavity, but the direction of release may be arbitrary.
- due to surface tension the unpredictable and unequal evaporation causes the droplet to break-up, resulting in undesired printing results.
- various improvements of the process have been proposed.
- US20170268100 improvement is sought by relying on diffused light profile coming from a high-intensity flash lamp, with the intention to achieve uniform heat flux distribution within a cavity.
- reflections of the incident light within the carrier plate fail to allow a sufficient level of homogenization of the incident heat profile.
- US20180171468 proposes to diffuse the incident light profile by introducing a diffusing pattern on the back side on the carrier.
- the diffusing of incident light is insufficient to achieve homogenization over the small dimensions of the cavities.
- the application of a dichroic mirror prior to an absorber layer to achieve homogenized absorption of the incident profile within the cavity is more efficient to obtain desired results.
- each layer should be thinner than the wavelength of incident light (to avoid direct absorption effects) and at the same time should withstand thermal shock while the absorbing layer heats up.
- the complex stack composition of the proposed dichroic mirror has to be modified and tailored to the angle and shape of the cavity, as it highly depends on the angle of the side walls. Summary of the invention It is an object of the present invention to provide for depositing of a printing material on a substrate, enabling the deposition of ultrafine dots, which is suitable for a large range of printing materials, and which provides for predictable and desirable printing results.
- the at least one deposition cavity comprises one or more walls forming an interface between the at least one deposition cavity and the transmissive plate, the one or more walls comprising a multilayer release stack, wherein the multilayer release stack comprises an optical absorption layer and a impediment layer, wherein the optical absorption layer is contiguous to the optically transmissive plate and is configured for converting optical energy from the optical radiation signal into a heat amount, and wherein the impediment layer is located between the optical absorption layer and an inside of the at least one deposition cavity, wherein the impediment layer comprises one or more thermal barrier layers, and wherein the optical absorption layer has a first thermal conductivity that is larger than a further thermal conductivity of the one or more thermal barrier layers, such as to enable lateral heat transfer within the optical absorption layer for homogeneously distributing the heat amount across the optical absorption layer during conduction of said heat amount through the impedi
- the impediment layer provides a thermal barrier that diminishes the direct heat transfer from the optical absorption layer to the printing material in the cavity. Because the optical absorption layer has a first thermal conductivity that is larger than the further thermal conductivities of the one or more thermal barrier layers that form the impediment layer, heat conducts more easily within the optical absorption layer. Therefore, if due to the illumination of the optical absorption layer, heat is distributed unequally across the optical absorption layer, heat is conducted more easily via lateral heat transfer through the optical absorption layer. Therefore, the impediment layer (or alternatively called ⁇ thermal impediment layer ⁇ ) impedes fast heat transfer to the printing material which thereby prevents an unequal distribution of heat in the printing material.
- the optical source is a collimated optical source for receiving the optical radiation signal as a collimated optical radiation signal.
- the advantages of using a collimated optical source are to be found in the fact that the alignment of the optical signal results in a uniform distribution of optical radiation that is received on the receiving surface of the optical absorption layer, i.e. at the interface between the optically transmissive material of the optically transmissive plate and the optical absorption layer.
- the device further comprises or is configured for cooperating with an optical source, wherein the optical source is a pulsed laser source for enabling the optical radiation signal to be received as an optical pulse of limited time duration.
- the optical source is a pulsed laser source for enabling the optical radiation signal to be received as an optical pulse of limited time duration.
- the amount of optical radiation provided to each deposition cavity can be well controlled using a pulsed laser, e.g. by changing the pulse duration or duty cycle of the pulse, or by modifying the time dependent intensity profile of each pulse.
- the impediment layer has a second thermal conductivity, wherein the second thermal conductivity is determined by the further thermal conductivities of the one or more thermal barrier layers, and wherein the first thermal conductivity of the optical absorption layer is larger than the second thermal conductivity of the impediment layer.
- this class of embodiments discriminates between the thermal conductivities of each thermal barrier layer – which are referred to as further thermal conductivities – and the thermal conductivity of the impediment layer – which is referred to as the second thermal conductivity.
- These two may be different for example when multiple thermal barrier layers together form the impediment layer, or when some parts of the impediment layer are made of thermal barrier layers of different material.
- the side walls of the deposition cavities which typically receive less optical radiation per surface area, may have an impediment layer being manufactured of different thermal barrier layers in order to either lower or raise the thermal conductivity. This allows to design with more control how heat is being conducted to the deposition cavity.
- the impediment layer has a thickness that is dependent on the first thermal conductivity and the second thermal conductivity for enabling said homogenizing of said heat amount.
- the balance of conducted heat amounts through the impedance layer or within the optical absorption layer depends not only on the thermal conductivities but also on the dimensions, such as the thicknesses, of these layers. Therefore, given a certain ratio between thermal conductivities as determined by the materials of choice for these layers, e.g. the first thermal conductivity with respect to the second thermal conductivity being in a certain ratio to each other, if a specific ratio of conducted heat amounts per unit of time is desired, this may be achieved by properly selecting the thicknesses of these layers in relation to each other.
- the pulse duration and the time dependent intensity profile of the optical radiation will play a role in this.
- the preferred thicknesses may be calculated from the desired the desired initial heat flux ratio.
- the preferred thicknesses for achieving a heat flux ratio of 10:1 between the internal heat flux through the optical absorption layer q1 and the heat flux through the impediment layer q2 can be calculated from this. Therefore, in a same manner in some further embodiments, the optical absorption layer has a thickness that is dependent on the first thermal conductivity and the second thermal conductivity for enabling said homogenizing of said heat amount.
- the impediment layer comprises a plurality of thermal barrier layers.
- the second thermal conductivity of the impediment layer is provided by a composite thermal conductivity of the further thermal conductivities of the plurality of thermal barrier layers forming the impediment layer. From the thermal conductivities of each layer, a composite thermal conductivity or effective thermal conductivity may be determined for the impediment layer.
- the optical absorption layer is provided by a material layer of a first material, wherein the first material comprises at least one of a metal or an alloy.
- the first material is a material having a very high thermal conductivity, while also being usable as an optical absorption layer.
- the metal molybdenum (Mo) would be a good candidate or alloys thereof.
- at least one of the one or more thermal barrier layers comprises, or is provided by, a material layer of a second material, wherein the second material comprises at least one of: a ceramic, a polymer, or a composite layer.
- a ceramic such as silicon nitride (SiN) provides a good candidate.
- At least one of the material absorption layer comprises a molybdenum chromium alloy; or at least one of the one or more thermal barrier layers comprises silicon nitride.
- a method of depositing a dot of printing material on a substrate using a device according to any one or more of the preceding claims the device comprising an optically transmissive plate comprising a first surface and a second surface opposite the first surface, wherein the first surface provides an optical reception surface for receiving an optical radiation signal, and wherein the second surface comprises at least one deposition cavity configured for holding said printing material prior to deposition thereof, wherein the method comprises: filling the at least one deposition cavity with the printing material; and selectively illuminating at least a portion of the optical reception surface with the optical radiation signal, such as to convey the optical radiation signal via the transmissive plate to the at least one deposition cavity, for depositing the printing material onto the substrate; wherein the optical radiation signal is conveyed
- the optical radiation signal is a collimated optical radiation signal.
- the device further comprises or is configured for cooperating with an optical source, wherein the optical source is a pulsed laser source for enabling the optical radiation signal to be received as an optical pulse of limited time duration.
- the printing material is at least one of: an interconnection material for use on the substrate, a solder paste, a glue, a resin, an ink, or a polymer.
- Figure 1 schematically illustrates a device in accordance with an embodiment of the present invention
- Figure 2 schematically illustrates an enlarged view of a deposition cavity in a device in accordance with an embodiment of the present invention
- Figures 3A to 3D schematically illustrate a deposition process in accordance with an embodiment, applying a device in accordance with an embodiment of the invention
- Figures 4A and 4B illustrate deposition problems experienced due to inhomogeneous cavity temperatures
- Figures 5A and 5B provide a comparison of the printing results obtainable with an inventive printing process as compared to the results in absence of a multilayer release stack as proposed.
- Terminology used for describing particular embodiments is not intended to be limiting of the invention.
- the device 1 is suitable for depositing a printing material 16 on a substrate 5. In fact, the device 1 enables to deposit portions 21 of printing material 16 on the surface 6 of the substrate 5.
- the printing material 16 is deposited by the formation of droplets 20 that are propelled from deposition cavities 15 that are filled with the printing material 16 prior to release thereof.
- the device 1 is suitable for and may be used to perform laser induced forward transfer (LIFT) of the printing material 16.
- the device 1 comprises an optically transmissive plate 2.
- the optically transmissive plate 2 may be made of an optically transmissive material, such as quartz or another type of transmissive crystal or mineral, a type of glass, a transmissive polymer, a transmissive resin or any other transmissive material providing suitable optical and thermodynamic properties.
- the material of which the optically transmissive plate 2 is made preferably transmits an optical radiation signal 10, with which it may be illuminated, effectively in order to convey the majority thereof and prevent the formation of heat in the optically transmissive plate 2 as much as possible.
- the optically transmissive plate 2 comprises a first surface 3 and a second surface 4 opposite the first surface 3.
- the first surface 3 provides an optical reception surface for receiving an optical radiation signal 10 from an optical source 11.
- the second surface 4 comprises one or more, and preferably a plurality of deposition cavities 15.
- the deposition cavities 15 are configured for holding the printing material 16 prior to deposition.
- a plurality of deposition cavities 15 in a regular arrangement is present on the second surface 4 of the optically transmissive plate 2.
- the regular arrangement may form a matrix of pixels or another regular arrangement of pixels.
- the printing or deposition of printing material 16 may then be performed by selectively illuminating such pixels, for example under the control of a controller (not shown) or control system (not shown).
- the first surface 3 is configured for cooperating with the optical source 11 for receiving the optical radiation signal 10.
- the optical source 11 moves in the direction indicated by arrow 12 relative to the optically transmissive plate 2.
- the plate 2 may be moved while keeping the optical source 11 stationary, or even both the optically transmissive plate 2 and the optical source 11 may be moved to provide a relative motion as indicated by the arrow 12 in figure 1.
- the optical source 11 moves over each deposition cavity 15 and selectively illuminates the cavities 15 by means of the optical radiation signal 10.
- the optical radiation signal 10 may be provided by the optical source 11 as a continuous signal which is temporarily blocked, e.g. by an optical obstruction such as a shutter or similar, there where deposition cavities 15 do not need to be illuminated (because they are not selected for illumination).
- the optical obstruction could be moved away for illuminating a cavity 15 selectively.
- the optical source may be triggered selectively to fire the optical radiation signal 10 as an optical pulse.
- the pulse may contain sufficient optical energy (desirably distributed in time) to trigger the deposition of the printing material 16 from the cavity 15.
- the optical radiation signal 10 provided by the optical source 11 may be a pulsed laser beam formed of a (continuous or discontinuous) pulse train, where the pulses may be selectively blocked or transmitted. This may for example be achieved by using an optical obstruction, such as a controllable shutter, or by switching the source on and off selectively.
- the deposition cavities 15 comprise walls 23 that are covered with a multilayer release stack 18. Each cavity 15 of the deposition cavities 15 comprises one or more walls 23 forming an interface between the deposition cavity 15 and the optically transmissive plate 2.
- the multilayer release stack 18 comprises an optical absorption layer 25 and an impediment layer 26.
- the optical absorption layer 25 is contiguous to the optically transmissive plate 2 and is configured for converting optical energy from the optical radiation signal 10 into heat, such as to aggregate a heat amount.
- the optical absorption layer 25 may for example be made of a material that effectively converts the an optical signal, at the optical wavelengths comprised by the signal, into heat.
- the choice of materials for the optical absorption layer 25 may be (although this is optional) tuned to the optical radiation signal 10 provided by the optical source 11.
- some materials are known to be perfect absorbers for a large range of optical wavelengths, in which case it may not be necessary to tune the choice of material for the optical absorption layer 25 to the optical radiation signal 10 of the optical source 11.
- the material of which the optical absorption layer 25 is made is selected to be a good thermal conductor.
- the impediment layer 26 is located between the optical absorption layer 25 and an inside of the deposition cavity 15.
- the main task of the impediment layer 26 is to delay heat transfer between the optical absorption layer 25 and the printing material 16 in the deposition cavity 15. Although this may sound counterproductive, in fact this provides an important advantage to the device 1 of the present invention. Due this function of the impediment layer 26, heat conduction between the optical absorption layer 25 and the printing material 16 is slowed down, leaving more time available for obtaining a homogeneous distribution of heat in the optical absorption layer 25.
- the impediment layer 26 therefore comprises one or more thermal barrier layers.
- the impediment layer 26 comprises only a single thermal barrier layer which thus forms the impediment layer 26.
- the optical absorption layer 25 has a first thermal conductivity that is larger than a further thermal conductivity of the (one or more) thermal barrier layers that form the impediment layer 26. Heat will then be conducted more easily within the optical absorption layer 25 then through the impediment layer 26.
- the multilayer release stack 18 is applied as a set of layers covering the whole of (or majority of) the second surface 4 of the optically transmissive plate 2. This is allowed in accordance with a certain class of embodiments. However in some other or further embodiments, the multilayer release stack 18 is only present inside the cavities 15, for example as is illustrated in figure 2.
- the optical absorption layer 25 is for example metals or metal alloys, such as molybdenum (Mo) or alloys of molybdenum.
- Mo molybdenum
- the optical absorption layer 25 was made of a molybdenum chromium (MoCr) alloy.
- MoCr molybdenum chromium
- Other metals or alloys thereof may likewise be applied, such as iron, aluminum, or any other metal.
- the impediment layer 26 may be made of a thermal insulator or dielectric, for example silicon nitride (SiN) or some polymer or resin.
- the dimensions of the layer may be selected in the design of device 1.
- the optical absorption layer 25 may be ten times as thick as the impediment layer 26.
- an optical absorption layer 25 made of molybdenum chromium (MoCr) was used having a thickness of 500 nm (nanometers), with an impediment layer 26 made of silicon nitride (SiN) having a thickness of 50 nm.
- MoCr molybdenum chromium
- SiN silicon nitride
- the thickness of each layer may be tuned to the other relevant parameters in order to obtain, within each layer 25 and 26 and given a certain temperature difference, a desired amount of heat conduction in relation to the heat conduction in the other layers.
- the initial temperatures within each layer 25 and 26 and the printing material 16, as well as within various parts of the optical absorption layer 25 and the impediment layer 26 may be estimated. From this, a desired initial magnitude of heat transfer within and between al layers may be determined based on the thermal conductivity of each layer 25, 26 and the printing material 16.
- the temporal distribution of optical energy may also play a role in this, and can even be used to optimize the deposition process. This altogether may result in a preferred thickness of each layer, and therefore it is not really possible to indicate a preferred thickness range for each layer (this depends on the thermal and optical properties of the other layers). Therefore, without being limiting on the invention, a rough estimate of thickness ranges may at best be provided here.
- the optical absorption layer 25 this may be less than 2 micrometer (less then 2000 nm).
- the impediment layer 26 at least some thickness is desired, say between 30 nm and 1000 nm.
- the layers may be coated on the walls, or deposited thereon using a layer deposition technique (e.g. atomic layer deposition (ALD) or chemical vapour deposition (CVD)).
- ALD atomic layer deposition
- CVD chemical vapour deposition
- a selective removal technique may be used such as etching or grinding.
- the depth of the cavities 15 may be in the order of micrometers, tens of micrometers, or hundreds of micrometers.
- FIGs 3A to 3D illustrate the working principle of the present invention.
- an optical radiation signal 10 illuminated a cavity 15.
- a printing material 16 is present, which is applied to the cavity 15 prior to the start of the deposition method or between two subsequent printing steps.
- the optical radiation signal 10 preferably illuminates the whole optical absorption layer 25 that surrounds the cavity 15 covering its walls 23.
- the optical radiation signal is a collimated optical signal, such that the beam energies are uniformly distributed across the beams cross-section.
- the vapourized printing material 16 escapes partly via the circumference of the pocket of printing material 16, as illustrated by flow arrows 39. However, the pressure build-up illustrated by arrow 40 propels the pocket of printing material 16 from the deposition cavity 15 downwards.
- Figure 3D show this process, where the printing material 16 starts to form a droplet 20 while accelerating to the substrate surface 6.
- Figures 4A and 4B show what may happen in absence of the impediment layer 26, leading to suboptimal or bad printing quality experienced with other (LIFT) deposition techniques.
- the lower temperature of the side walls 23 cause the printing material 16 to come loose over only a part of the side wall 23. This results in an oblique propulsion of the droplet 20.
- FIG. 5A shows the results of the deposition method of the present invention. Clear and sharp printed portions 55 at very regular distances can be seen in the figure. A comparative test was performed with a device without the multilayer release stack 18 of the present invention. Clearly, the printing material 16 is exploded across the surface, and no clear printing portions can be distinguished.
- the present invention has been described in terms of some specific embodiments thereof.
- any reference signs shall not be construed as limiting the claim.
- the term 'comprising' and ‘including’ when used in this description or the appended claims should not be construed in an exclusive or exhaustive sense but rather in an inclusive sense.
- the expression ‘comprising’ as used herein does not exclude the presence of other elements or steps in addition to those listed in any claim.
- Expressions such as “consisting of”, when used in this description or the appended claims, should be construed not as an exhaustive enumeration but rather in an inclusive sense of "at least consisting of”.
- the words ‘a’ and ‘an’ shall not be construed as limited to ‘only one’, but instead are used to mean ‘at least one’, and do not exclude a plurality.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP23160473.7A EP4429417A1 (en) | 2023-03-07 | 2023-03-07 | Device and method for depositing a printing material on a substrate |
| PCT/NL2024/050104 WO2024186206A1 (en) | 2023-03-07 | 2024-03-06 | Device and method for depositing a printing material on a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4677962A1 true EP4677962A1 (en) | 2026-01-14 |
Family
ID=85601730
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP23160473.7A Withdrawn EP4429417A1 (en) | 2023-03-07 | 2023-03-07 | Device and method for depositing a printing material on a substrate |
| EP24710884.8A Pending EP4677962A1 (en) | 2023-03-07 | 2024-03-06 | Device and method for depositing a printing material on a substrate |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP23160473.7A Withdrawn EP4429417A1 (en) | 2023-03-07 | 2023-03-07 | Device and method for depositing a printing material on a substrate |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP4429417A1 (en) |
| JP (1) | JP2026510765A (en) |
| CN (1) | CN120836193A (en) |
| TW (1) | TW202436077A (en) |
| WO (1) | WO2024186206A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4742841A1 (en) * | 2024-11-12 | 2026-05-13 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A method for transferring a functional material |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11089690B2 (en) | 2016-03-16 | 2021-08-10 | Ncc Nano, Llc | Method for depositing a functional material on a substrate |
| US20180171468A1 (en) | 2016-12-21 | 2018-06-21 | Ncc Nano, Llc | Method for deposting a functional material on a substrate |
| EP3889319A1 (en) | 2020-04-01 | 2021-10-06 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Controlled deposition of a functional material onto a target surface |
-
2023
- 2023-03-07 EP EP23160473.7A patent/EP4429417A1/en not_active Withdrawn
-
2024
- 2024-03-06 CN CN202480016834.3A patent/CN120836193A/en active Pending
- 2024-03-06 WO PCT/NL2024/050104 patent/WO2024186206A1/en not_active Ceased
- 2024-03-06 JP JP2025552034A patent/JP2026510765A/en active Pending
- 2024-03-06 EP EP24710884.8A patent/EP4677962A1/en active Pending
- 2024-03-06 TW TW113108194A patent/TW202436077A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024186206A1 (en) | 2024-09-12 |
| CN120836193A (en) | 2025-10-24 |
| EP4429417A1 (en) | 2024-09-11 |
| TW202436077A (en) | 2024-09-16 |
| JP2026510765A (en) | 2026-04-10 |
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