EP4662685A1 - Novel planar pcb integrated transformers - Google Patents
Novel planar pcb integrated transformersInfo
- Publication number
- EP4662685A1 EP4662685A1 EP24711698.1A EP24711698A EP4662685A1 EP 4662685 A1 EP4662685 A1 EP 4662685A1 EP 24711698 A EP24711698 A EP 24711698A EP 4662685 A1 EP4662685 A1 EP 4662685A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- core
- transformer
- integrated
- winding
- inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/08—High-leakage transformers or inductances
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/01—Resonant DC/DC converters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
- H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
- H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
- H02M3/325—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
- H01F2027/065—Mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
Definitions
- the conventional PCB transformers can be used discrete comonents. In most magnetics-based power converter topologies, such as an LC resonant converter, a discrete resonant inductor is generally required. Journal publications exist (e.g., listed below) on an integrated transformer structure, but this structure does not solve the stray magnetic field issue (either from magnetic structures or passive shielding). 1. M. D’Antonio, S. Chakraborty and A. Khaligh, “Planar Transformer With Asymmetric Integrated Leakage Inductance Using Horizontal Air Gap,” in IEEE Transactions on Power Electronics, vol. 36, no. 12, pp. 14014-14028, Dec.
- One aspect is an integrated magnetic structure that comprises a top core, a bottom core, one or more posts interposed between the top core and the bottom core, an inductor portion comprising a center post different from and spaced apart from the one or more posts, a first portion of a primary winding, and a first portion of a secondary winding, and a transformer integrated with the inductor portion by sharing a post of the one or more posts.
- the transformer comprises a second portion of the primary winding and a second portion of the secondary winding.
- the second portion of the primary winding and the second portion of the secondary winding are vertically overlap each other.
- the primary winding surrounds the secondary winding.
- at least one of the primary winding or the secondary winding comprises an interleaved winding structure.
- the center post is vertically disposed at a center position of the bottom core of the inductor portion.
- the one or more posts, the transformer, the inductor portion, and the center post are disposed in a fully enclosed housing.
- a flux shaping air gap is formed on each post of the one or more posts and the center post.
- a flux shaping air gap is formed on the center post.
- the integrated magnetic structure further comprises a metal shield plate disposed adjacent to the one or more posts and configured to at least partially shield a stray magnetic field.
- a metal shield plate disposed adjacent to the one or more posts and configured to at least partially shield a stray magnetic field.
- Another aspect is an integrated magnetic structure that comprises a top core, a bottom core, one or more posts interposed between the top core and the bottom core, an TSLA.712WO PATENT inductor portion comprising a center post, and a flux shaping plate disposed on top of the center post, and a transformer integrated with the inductor portion by sharing a post of the one or more posts.
- the inductor portion further comprises a first portion of a primary winding and a first portion of a secondary winding.
- the transformer comprises a second portion of the primary winding and a second portion of the secondary winding.
- the primary winding surrounds the secondary winding.
- the second portion of the primary winding and the second portion of the secondary winding are vertically overlap each other.
- a flux shaping air gap is formed on each post of the one or more posts and the center post.
- a flux shaping air gap is formed on the center post.
- FIG. 1 Another aspect is an integrated magnetic structure that comprises a top core comprising a first portion and a second portion, the first portion and the second portion of the top core being disposed in a different height, a bottom core, one or more posts interposed between the top core and the bottom core, an inductor portion comprising a center post, a first portion of a primary winding, and a first portion of a secondary winding, the center post different from and spaced apart from the one or more posts, and a transformer disposed between the second portion of the top core and the bottom core, the transformer comprising a second portion of the primary winding and a second portion of the secondary winding.
- a flux shaping air gap is formed on each post of the one or more posts and the center post.
- a flux shaping air gap is formed on the center post.
- a first portion of the top core is disposed on top of the transformer, and wherein the second portion of the top core is disposed on top of the inductor portion.
- FIGs.1A-1C illustrate Litz-based transformers and inductors.
- FIG.2A illustrates a non-planar magnetics structure.
- FIG.2B illustrates an example of a planar magnetics structure according to some embodiments.
- FIG.3A illustrates another example of a non-planar magnetics structure.
- FIG. 3B illustrates another example of a planar magnetics structure according to some embodiments.
- FIG. 4A illustrates a circuit model in which the transformer and inductor have discrete structures.
- FIG. 4B illustrates a circuit model in which the transformer and inductor portions are integrated together according to some embodiments.
- FIG. 5 illustrates examples of integrated transformer structures according to some embodiments.
- FIG.6A illustrates an example of a fully enclosed pot-core integrated planar structure according to some embodiments.
- FIG. 6B illustrates a comparison figure in which a discrete transformer/inductor portion is compared with an integrated transformer.
- FIG. 6C illustrates another example of a fully enclosed pot-core integrated planar structure according to some embodiments.
- FIG. 6D illustrates a perspective view of the fully enclosed pot-core integrated planar structure of FIG.6A or FIG.6C according to some embodiments.
- FIG. 6E illustrates near-field reduction in pot-core structures compared to EE core structures according to some embodiments.
- FIG. 6F illustrates current density distribution for an enclosed pot-core structure without flux shaping plates.
- FIG. 6G illustrates current density distribution for an enclosed pot-core structure with flux shaping plates.
- FIG. 7A illustrates an example of a hybrid pot-core integrated planar structure according to some embodiments.
- FIG. 7B illustrates another example of a hybrid pot-core integrated planar structure according to some embodiments.
- FIG.8A illustrates a concept of core laminations to minimize eddy current.
- FIG. 8B illustrates an example structure to improve flux density sharing in split cores by using an air gap on the center post in the magnetizing flux path according to some embodiments.
- FIG. 8C illustrates an example structure to improve flux density sharing in split cores by using consistent bond-line thickness control in each laminated core according to some embodiments.
- FIG.8D illustrates an example of an alternative structure.
- FIG. 9A illustrates high-current termination in non-planar-magnetics with wire windings. [0051] FIG.
- FIG. 9B illustrates high-current termination in non-planar-magnetics with bus bar windings.
- FIG. 9C and FIG. 9D illustrate examples of low-loss high-current PCB winding terminations.
- FIG. 10A illustrates PCB winding terminations (in and out) disposed side- by-side.
- FIG.10B illustrates overlapped PCB winding terminations (in and out).
- TSLA.712WO PATENT [0055]
- FIGs. 11A and 11B illustrate a fully enclosed pot-core integrated planar structure according to some embodiments.
- FIGs.12A-12E illustrate an open EE 3-legged structure with or without flux shaping according to some embodiments.
- FIG.12F illustrates a simulation results of an induced loss in adjacent metal heatsinks.
- FIG. 13A illustrates an open EE 4-legged structure without flux shaping according to some embodiments.
- FIG. 13B illustrates an open EE 4-legged structure with flux shaping and symmetric air gaps according to some embodiments.
- FIG. 13C illustrates an open EE 4-legged structure with flux shaping and asymmetric air gaps according to some embodiments.
- FIG. 14 illustrates a near field reduction in open EE core structures with a metal shield according to some embodiments.
- FIG.15A illustrates an example of an EE core structure with a metal shield according to some embodiments.
- FIG.15A illustrates an example of an EE core structure with a metal shield according to some embodiments.
- FIG. 15B illustrates an example of a metal shield application according to some embodiments.
- FIG. 15B illustrates another example of an EE core structure with a metal shield according to some embodiments.
- FIGs. 16A-16D illustrate concepts of partially interleaved winding structures between two power stages.
- FIG. 16E illustrates an example of induced current density distribution for the winding structure without winding interleaving between the two stages shown in FIG.16C.
- FIG. 16F illustrates an example of induced current density distribution for the partially interleaved winding structure with winding interleaving between the two stages shown in FIG.16D.
- Embodiments of the present disclosure and their advantages are best understood by referring to the detailed description that follows.
- a magnetic component such as inductors and transformers generally can include conductors (e.g., windings) wound around magnetic cores. They come in many shapes and sizes and can serve different functions (voltage conversion, isolation, electromagnetic interference (EMI) mitigation, etc.).
- conductors e.g., windings
- FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
- FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
- FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
- FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
- FIG. 1 A block diagram illustrating an exemplary computing environment in accordance with the present disclosure.
- Some structures also allow the flexibility to distribute the inductance symmetrically/asymmetrically on both primary and secondary windings.
- the proposed integrated transformer structures also include magnetic flux shaping features to minimize conduction losses.
- Various embodiments can be used for onboard chargers in electric vehicles, stationary storage, powerwall, megapacks, battery chargers, or an autonomous driving hardware. Any power electronic converter that requires an isolation/voltage step ratio and/or energy storage requires a magnetic component.
- Various embodiments cover all the different concepts/structures that can be used for any power converter to be designed for any of the above applications.
- core structures can be made with a magnetic material, such as ferrite and powder core.
- This high-power integrated transformer structures may require the TSLA.712WO PATENT cores to be laminated to minimize eddy current loss in the core.
- Splitting the cores can be used in the high-power integrated transformer structure, however, these splitting cores may have a technical challenge in terms of a flux-density distribution between various core split structures.
- Some embodiments, as disclosed herein, can improve the flux density distribution between different split cores. For example, the flux density distribution can be improved by providing an air gap in the center post. As another example, the flux density distribution can be improved by providing a uniform bond line thickness between the top and bottom core halves.
- the integrated transformer structures may potentially generate significant stray magnetic fields, which can lead to electromagnetic compatibility (EMC) issues on nearby components.
- EMC electromagnetic compatibility
- the present disclosure provides various integrated inductor and transformer structures that can keep the strong magnetic fields confined within the core structure with a minimum stray field present.
- the present disclosure also provides other structures with a metal shield cover.
- Various embodiments can provide novel shield structures to minimize near fields from planar transformer structures with integrated resonant inductors.
- Various embodiments provide novel winding design techniques that overlap the incoming and the outgoing current carrying PCB traces for the same winding to minimize the stray field/termination losses.
- Various embodiments also provide concepts to overlap windings from parallel power converter stages to achieve flux cancellation and reduce the losses in the heat sink and/or reduce the overall footprint.
- power converters designed using high power planar magnetics can significantly increase power capability with lower costs.
- Some embodiments can remove a portion of a supply chain altogether (e.g., suppliers who assemble different pieces like core, windings, bobbins, etc., to make a transformer/inductor). This may be essential to reach a high-volume production rate with lower costs.
- Various embodiments can also provide a manufacturing improvement. For example, LV terminations using bolted joints requiring strict micro-resistance measurements have proven to be challenging, but with planar magnetics, the conductors on the PCB can be directly integrated into the PCB (e.g., printed circuit board assembly, PCBA).
- Various embodiments provide a fully enclosed pot-core integrated planar structure that can minimize a stray magnetic field compared to open EE core structures.
- TSLA.712WO PATENT Various embodiments also provide a hybrid pot-core integrated planar structure that can further reduce weight and cost compared to a fully enclosed pot-core structure and maintain minimized stray magnetic field benefits.
- Various embodiments provide an enclosed pot-core structure (e.g., a fully enclosed pot-core integrated planar structure) that can include a fewer number of PCB layers needed compared to other structures with overlapped winding sections, where a resonant inductor can be integrated and distributed.
- FIGs.1A-1C illustrate high-frequency power magnetics such as Litz-based transformers and inductors. Specifically, FIGs.
- FIG.1A illustrates a DCDC converter that can include a transformer and inductor.
- FIG.1B illustrates a charger that can include a transformer and inductor.
- FIG. 1C illustrates an example of a DCDC converter that can include a transformer and inductor.
- the conventional converter and/or charger utilizes Litz-wire based magnetics (transformer and inductor) that can provide low loss in certain frequency ranges, such as 100-500 kHz frequency range and low proximity/skin-effect loss in Litz wires.
- FIG.2A illustrates an example of an exploded view of a conventional non- planar magnetics structure 200.
- the non-planar magnetics structure 200 such as Litz wire-based magnetics, can have a multitude of bits and pieces that can cause complicated manufacturing assembly processes.
- the non-planar magnetics structure 200 can include a housing 202, cores 204, windings 206, 208, terminals 210, and a bobbin 212.
- FIG. 2B illustrates an example of a planar magnetics structure 250 according to some embodiments.
- the planar magnetics structure 250 generally can include a relatively fewer number of parts compared to the non-planar magnetics structure 200 (e.g., Litz wire-based magnetics) and can eliminate the complexity of manufacturing processes, such as terminations and winding.
- the planar magnetics structure 250 can include cores 252, an insulator 254, and a PCB winding 256.
- the windings 206, 208, terminals 210, and the bobbin 212 included in the conventional non-planar magnetics structure 200 can be integrated into the PCB winding 256 of the planar magnetics structure 250.
- the non-planar magnetics structure 300 can include a non-planar magnetic structure 302, filim capacitors 304, PCBs 306, transistors (e.g., MOSFETs) 308, thermal interface material 310, pedestals on heatsink 312, and a heatsink 314.
- FIG.3B shows another example of a planar magnetics structure 350 according to some embodiments.
- the planar magnetics structure 350 can include a non-planar magnetic structure 352A/352B, filim capacitors 354, PCBs 356, transistors (e.g., MOSFETs) 358, thermal interface material 360, pedestals on heatsink 362, and a heatsink 364.
- FIG.4A illustrates a schematic view of a conventional discrete transformer and inductor 400.
- the discrete transformer and inductor 400 can include an inductor 402, a transformer 404, and a capacitor 406.
- each of the inductor 402, and the transformer 404 can be a discrete component.
- FIG.4B illustrates a schematic view of an example of integrated magnetics 450 according to some embodiments.
- FIG.5 illustrates examples of various integrated transformer structures 500 according to some embodiments.
- the integrated transformer structures 500 may include an enclosed pot-core structure 510 and an open EE core structure 520.
- the enclosed pot-core structure 510 may include a pot-core structure with or without flux shaping 512 (Example 1; see, for example, FIGs. 6A and 6C).
- the enclosed pot-core structure 510 may also include a hybrid pot-core structure plus an EE core structure with or without flux shaping 514 (Example TSLA.712WO PATENT 2; see, for example, FIGs. 7A and 7B).
- the enclosed pot-core structure 510 may further include an enclosed 5-legged pot-core structure with or without flux shaping 516 (Example 3; FIG.11).
- the open EE core structure 520 may include an open EE 3-legged with flux shaping 522 (Example 4; see, for example, FIGs.12A-12E).
- the open EE core structure 520 may also include an open EE 4-legged with or without flux shaping with resonant inductance independent distributed symmetric/asymmetric structure 524 (Example 5; see, for example, FIGs. 13A-13C).
- FIG.6A illustrates an example of a fully enclosed pot-core integrated planar structure according to some embodiments. Referring to FIG.
- FIG. 6A illustrates an example of a fully enclosed pot-core integrated planar structure 600 according to some embodiments.
- the enclosed pot-core integrated planar structure 600 of FIG. 6A does not include a flux shaping plate.
- the enclosed pot-core integrated planar structure 600 can include an inductor portion 630 and a transformer portion 640.
- the inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 636.
- the core center post 636 can be disposed between the first side 632 and the second side 634.
- the first side 632 and the second side 634 can surround the center post 636.
- the first side 632 can include a number of layers of primary winding 638A (e.g., a first portion of the primary winding)
- the second side 634 can include a number of layers of secondary winding 638B (e.g., a first portion of the secondary winding).
- the present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 6A.
- the first side 632 can include a first portion of the primary winding 638A
- the second side 634 can include a first portion of the secondary winding 638B.
- the transformer portion 640 can include a second portion of the primary winding 638C and a second portion of the secondary winding 638D.
- the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically with respect to each other.
- a primary winding can surround the inductor portion 630 and the transformer portion 640.
- a first portion of the primary winding can be disposed on the inductor portion 630 (e.g., the first side 632), and a second portion of the primary winding can be disposed on the transformer TSLA.712WO PATENT portion 640.
- the secondary winding can surround the transformer portion 640.
- a first portion of the secondary winding can be disposed on the inductor portion 630 (e.g., second side 634), and a second portion of the secondary winding can be disposed on the transformer portion 640.
- one or more posts 650 can be interposed between the top core 610A and the bottom core 610B.
- the posts 650, 650A can be interposed between the top core 610A and 610B.
- the magnetic body 610 can include the top core 610A and the bottom core 610B.
- the inductor portion 630 and the transformer portion 640 can be enclosed by the top core 610A, the bottom core 610B, and posts 650 (shown in FIG. 6B).
- the inductor portion 630, the transformer portion 640, the center post 636, and other posts can be vertically disposed on the top of the bottom core 610B and below the top core 610A.
- FIG. 6B illustrates a comparison figure in which a conventional discrete transformer/inductor structure 500 is compared with an integrated transformer 600.
- the discrete transformer/inductor structure 500 can include the discrete components of a transformer 502 and an inductor 504.
- the discrete transformer/inductor structure 500 can include three windings, whereas the integrated transformer 600 can include two windings since the inductor winding can be shared with a primary winding of the transformer portion in the integrated transformer 600.
- the discrete transformer/inductor structure 500 can include six core posts (e.g., core posts 550, 550A, and 550B), whereas the integrated transformer 600 can include four core posts (e.g., core posts 650 and 650A)since a shared core post (e.g., 650A) can be used between the inductor portion 630 and transformer portion 640 in the integrated transformer 600.
- the integrated transformer 600 can be manufactured more cost-effectively and operated more efficiently than the discrete transformer/inductor structure 500.
- FIG. 6C illustrates another example of a fully enclosed pot-core integrated planar structure 650 according to some embodiments. Referring to FIG.
- an inductor air gap 620 can be enclosed inside the magnetics body 610 for a minimum stray field.
- the TSLA.712WO PATENT enclosed pot-core integrated planar structure 650 of FIG. 6B can include a flux shaping plate 670 disposed on the center post 660.
- the enclosed pot-core integrated planar structure 650 of FIG. 6C can include a flux shaping plate 670.
- the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640.
- the inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660.
- the core center post 660 can be disposed between the first side 632 and the second side 634.
- the first side 632 and the second side 634 surround the center post 636.
- the first side 632 can include a number of layers of the first portion of the primary winding 638A
- the second side 634 can include a number of layers of the first portion of the secondary winding 638B.
- the present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 6C.
- the transformer portion 640 can include a second portion of the primary winding 638C and a second portion of the secondary winding 638D.
- the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically with respect to each other.
- the inductor portion 630 can include the flux shaping plate 670.
- the flux shaping plate 670 can be disposed on top of the core center post 660.
- the width of the flux shaping plate 670 can be larger than the width of the core center post 660.
- the air gap 620 can be formed between the top of the flux shaping plate 670 and magnetic body 610.
- symmetric air gaps can be formed in the first side 632 and the second side 634.
- one or more posts 650 can be interposed between the top core 610A and the bottom core 610B.
- FIG. 6A illustrates a perspective view of the fully enclosed pot-core integrated planar structure of FIG.6A or FIG.6C according to some embodiments.
- the fully enclosed pot-core integrated planar structure of FIG. 6D may include a flux shaping plate.
- At least one of the enclosed pot-core integrated planar structure 600 or 650 can include an inductor portion (side) 630 and a transformer portion (side) 640 that can be integrated into a single structure 600 to have a shared winding (e.g., a primary winding 638A and a secondary winding 638B).
- the windings 638A, 638B in the inductor portion 630 and the transformer portion 640 may at least partially vertically overlap each other.
- the primary winding 638A and the secondary winding 638B can be overlapped at portions 639A.
- the primary winding 638A and the secondary winding 638B can be overlapped in a portion of 639B.
- the portions of primary winding 638A and portions of the secondary winding 638B can be stacked together, such that the portion of primary winding 638A can be interposed between two layers of the portion of the secondary windings 638B.
- each of the primary winding 638A and primary winding 638B may perform as an inductor whereas the combination of the primary winding and the secondary winding 638A may perform as a transformer.
- at least a portion of the primary winding may be disposed below or above the secondary winding 638B so that at least a portion of the primary winding 638A may vertically overlap the secondary winding 638B (see, for example, FIG. 6D).
- the secondary winding 638B may perform as an inductor whereas the combination of the primary winding 638A and the secondary winding 638B may perform as a transformer.
- FIG. 6E illustrates the magnetic near-field for the EE core and pot-core structures shown in FIG. 6A and FIG. 6C, respectively, according to some embodiments.
- FIG. 6E the enclosed pot-core structures (shown in lower side of FIG. 6E) can provide a near field reduction compared to a conventional inductor and transformer structure.
- TSLA.712WO PATENT [0093]
- FIG. 6F illustrates a current density distribution for the enclosed pot-core structure 600 that does not include flux shaping (or a flux shaping plate).
- FIG. 6G illustrates an improved current density distribution leading to a minimized winding loss distribution for an enclosed pot-core structure 650 that can include flux shaping (or a flux shaping plate).
- the enclosed pot-core structure with a flux shaping plate can reduce winding loss.
- FIG. 7A and FIG. 7B illustrate example hybrid pot-core integrated planar structures 700 and 750 according to some embodiments.
- the hybrid pot-core integrated planar structures 700 and 750 may have an enclosed pot-core structure on the inductor side and an open EE or EI structure on the transformer side.
- FIG. 7A illustrates an example hybrid pot- core integrated planar structure 700 according to some embodiments.
- the hybrid pot-core integrated planar structure 700 can include a flux shaping plate 670.
- the height of the transformers 640 can be reduced, such that the height of the transformer portion 640 can be less than the height of the inductor portion 630.
- each inductor portion 630 and the transformer portion 640 can include a inductor portion top core 610CC and a transformer portion top core 610AA, respectively.
- the top core 610AA of the transformer can be placed lower than the top core 610CC of the inductor.
- the hybrid pot-core integrated planar structure 700 of FIG. 7A can include a flux shaping plate 670.
- the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640.
- the inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660.
- the core center post 660 can be disposed between the first side 632 and the TSLA.712WO PATENT second side 634.
- the first side 632, and the second side 634 may surround the center post 636.
- the first side 632 can include a number of layers of the first portion of primary winding 638A
- the second side 634 can include a number of layers of the first portion of secondary winding 638B.
- the present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 7A.
- the transformer portion 640 can include a second portion of primary winding 638C and a second portion of secondary winding 638D. In some embodiments, the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically.
- the inductor portion 630 can include the flux shaping plate 670. The flux shaping plate 670 can be disposed on top of the core center post 660. In some examples, the width of the flux shaping plate 670 can be larger than the width of the core center post 660. In some embodiments, the air gap 620 can be formed between the top of the flux shaping plate 670 and magnetic body 610.
- the inductor portion 630, the transformer portion 640, the center post 660, and other posts can be vertically disposed on the top of the bottom core 610B and below the top core 610A and 610C.
- one or more posts 650A- 650C can be interposed between the top core 610AA / 610CC and the bottom core 610B.
- the posts 650B can be interposed between the top core 610AA and 610B.
- the posts 650A and 650C can be interposed between the top core 610CC of the inductor portion 630 and the bottom core 610B.
- FIG. 7B illustrates another example of a hybrid pot-core integrated planar structure 750 according to some embodiments.
- the hybrid pot-core integrated planar structure 750 can form a modified structure from the example hybrid pot-core integrated planar structure 700.
- the hybrid pot-core integrated planar structure 750 can be formed from the hybrid pot-core integrated planar structure 700 by removing the post 650B (shown in FIG.7A) and the top core of the transformer portion 610AA (shown in FIG.7A) and resizing the bottom core 610B to the width of the top core 610CC of the inductor portion 630.
- the hybrid pot-core integrated planar structure 750 can include a flux shaping plate TSLA.712WO PATENT 670 on top of the center post 660.
- These hybrid structures 700 and 750 can minimize weight/cost of the transformer core with a minimal impact on the near field.
- FIG.8A illustrates a concept of core laminations to minimize eddy current.
- the eddy-current core loss for one core can be 1.8x the compared to a design with two splits.
- the core loss can be 1.4x compared to a design with two splits.
- the core splits shown in FIG. 8A are merely examples, and the present disclosure is not limited thereto.
- FIG.8B illustrates an example structure 800 to improve flux density sharing in split cores by using an air gap on the center post to dominate the reluctance of each split core according to some embodiments.
- FIG.8C illustrates an example structure 850 to improve flux density sharing in split cores by using consistent bond-line thickness control according to some embodiments. According to the example structures 800 and 850 of FIGs. 8B and 8C, flux density sharing issues in split core structures can be minimized.
- the post 650A shared between the transformer portion 640 and the inductor portion 630 can include a flux shaping air gap 810.
- the integrated planar structure 800 of FIG. 8B can include a flux shaping plate 670.
- the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640.
- the inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660.
- the core center post 660 can be disposed between the first side 632 and the second side 634.
- the first side 632 and the second side 634 may surround the center post 636.
- the first side 632 can include a number of layers of first portion of primary winding 638A
- the second side 634 can include a number of layers of first portion of secondary winding 638B.
- the present disclosure is not limited to a particular number of layers for each primary winding and the secondary winding.
- the transformer portion 640 can include a second portion of primary winding 638C and a second portion of secondary winding 638D.
- the inductor portion 630 can include the flux shaping plate 670.
- the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically.
- the flux shaping plate 670 can be disposed on top of the core center TSLA.712WO PATENT post 660. In some examples, the width of the flux shaping plate 670 can be larger than the width of the core center post 660. In some embodiments, the air gap 620 can be filled between the top of the flux shaping plate 670 and magnetic body 610. In some embodiments, as described in FIG.8C, the posts 650 and 650A can include a flux shaping air gap 810. In some embodiments, as described in FIG. 8D, a transformer portion 840 can be interposed between two portions 830A, 830B of the inductor portion 830. In some embodiments, as further described in FIG.
- a post 850A can be shared between a portion of the inductor portion 830A and the transformer portion 840 and between another portion of the inductor portion 830B and the transformer portion 840.
- each of the posts 850A and 850B can include an air gap 855.
- FIG. 9A illustrates a conventional high-current termination in planar- magnetics with wire windings.
- FIG.9A shows a conventional complex wire soldering in wire windings.
- FIG.9B illustrates a conventional high-current termination in planar-magnetics with bus bar windings.
- FIG. 9B shows risky bolted joints in bus bar windings.
- FIG. 9D illustrate example low-loss PCB winding terminations according to some embodiments.
- terminals 950 can be integrated into a portion of a PCB winding , which simplifies manufacturing processes and reduces extra loss from termination (e.g. soldering).
- in and out terminals can be overlapped at 930, which can reduce AC winding loss at high frequencies due to stray magnetic field cancellation.
- FIG. 10A illustrates winding terminations (in and out) side-by-side.
- FIG. 10B illustrates winding terminations (in and out) overlapped according to some embodiments. The overlapped winding termination shown in FIG.
- FIGs. 11A and 11B illustrate a fully enclosed pot-core integrated planar structure 1100 according to some embodiments.
- FIGs.11A and 11B can include two inductor portions 630A and 630B (e.g., inductor portion 630 shown in FIG. 6C).
- the inductor portion 630A and 630B can be integrated to the structure 1100 by sharing the post 950A.
- FIG.11A is a side view of the fully enclosed pot-core integrated planar structure 1100.
- FIG.11B is a perspective view of the fully enclosed pot-core integrated planar structure 1100.
- the primary winding 1160 and secondary winding 1150 may not be TSLA.712WO PATENT stacked vertically on top of each other, but side by side in the PCB.
- the integrated inductor may be formed by the air gap and core post (with or without flux shaping plate) between the two windings in this structure.
- the secondary winding 1150 may surround the post 950A, such as the secondary winding 1150 shown in FIG. 11B.
- the primary winding 1160 can surround the core posts 1170A and 1170B of each inductor portion 630A and 630B, respectively.
- the primary winding 1160 can be formed, as illustrated in FIG.11B.
- FIGs. 12A-12E illustrate various examples of open EE 3-legged structures with or without flux shaping according to some embodiments.
- the open EE 3-legged structure 1200 can include a flux shaping air gap on the top core
- the open EE 3-legged structure 1250 can include an air gap without flux shaping on the side between the bottom core and the top core.
- FIGs. 12B-12E show that the secondary winding can be disposed above the primary winding, the present disclosure is not limited thereto.
- the primary winding may be disposed above the secondary winding.
- the open EE 3-legged structure 1200 can include three legs 1210A-1210C vertically disposed on the bottom core 1220.
- a primary winding 1230 can surround the leg 1210B (e.g., a center leg).
- the secondary winding 1240 can surround the leg 1210C (e.g., a side leg).
- a top core 1250 can be disposed on top of the center leg 1210B and the side leg 1210C.
- a flux shaping air gap 1260 can be formed on the portion of the primary winding 1230 that can be uncovered by the top core 1250.
- the open EE 3-legged structure 1200 can be modified as illustrated in FIGs. 12D and 12E.
- three legs e.g., a first side leg 1210A, a middle leg 1210B, and a second side leg 1210C
- An airgap 1250A can be formed on the top core 1250 between the first side leg 1210A and the middle leg 1210B.
- FIG. 12E illustrates another example of the open EE 3-legged structure 1200.
- three legs e.g., a first side leg 1210A, a middle leg 1210B, and a second side leg 1210C
- An airgap 1250B can be formed on the first side leg 1210A (e.g., between the top core 1250 and the bottom core 1220).
- FIG. 13A illustrates an open EE 4-legged structure 1300A without flux shaping according to some embodiments.
- the open EE 4-legged structure 1300A can minimize loss in pedestal/heatsink due to low stray field compared to the 3-legged EE-core structure, and thus the open EE 4-legged structure 1300A can be ideal for designs with a heat- sink.
- the open EE 4-legged structure 1300A can include a first – fourth legs, 1310A-1310D, respectively.
- a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C.
- the secondary winding 1340 can be disposed on top of the primary winding 1330.
- the secondary winding 1340 can also be disposed below the primary winding 1330 in some applications.
- a first air gap can be formed on the first leg 1310A, and a second air gap 1350B can be formed on the fourth leg 1310D.
- the open EE 4-legged structure 1300A can have a symmetrical design with respect to the center 1360 of the open EE 4-legged structure 1300A.
- FIG.13B illustrates an open EE 4-legged structure 1300B with flux shaping and two or more symmetric air gaps according to some embodiments.
- the open EE 4-legged structure 1300B can further reduce winding loss with flux shaping air gap.
- the open EE 4-legged structure 1300B can include a first – fourth legs, 1310A- 1310D, respectively. These 4 legs, 1310A-1310D, can be interposed between the top core 1350 and the bottom core 1320.
- a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C.
- the secondary winding 1340 can be disposed on top of the primary winding TSLA.712WO PATENT 1330.
- the secondary winding 1340 can also be disposed of below the primary winding 1330 in some applications.
- a first air gap 1350C can be formed on the top core 1350, between the first leg 1310A and a second leg 1310B.
- a second air gap 1350D can be formed on top core 1350, between the third leg 1310C and the fourth leg 1310D.
- the open EE 4-legged structure 1300B can have a symmetrical design with respect to the center 1360 of the open EE 4-legged structure 1300A.
- FIG.13C illustrates an open EE 4-legged structure 1300C with flux shaping and two or more asymmetric air gaps according to some embodiments.
- the open EE 4-legged structure 1300C can allow design flexibility to have asymmetric resonant inductance on primary and secondary windings.
- a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C.
- the secondary winding 1340 can be disposed on top of the primary winding 1330.
- the secondary winding 1340 can also be disposed below the primary winding 1330 in some applications.
- a first air gap 1350E can be formed on the top core 1350, between the first leg 1310A and a second leg 1310F.
- a second air gap 1350D can be formed on top core 1350, between the third leg 1310C and the fourth leg 1310D.
- the air gaps 1350E and 1350F can be formed symmetrically with respect to the center 1360 of the open EE 4-legged structure 1300A.
- FIG. 14 illustrates a near field reduction in open EE core structures with a metal shield according to some embodiments.
- FIG. 15A illustrates an example of an EE core structure 1500 with a metal shield 1530 according to some embodiments.
- the metal shield 1530 can contact the heatsink 1510 at all points.
- the open EE core structure 1500 can include features which can be pressed to ensure contact with the heatsink surface 1510 and has multiple small sections to ensure co-planarity with the heatsink 1510 and the bottom core 1520.
- the wall 1540 can be disposed on the top of the heatsink 1510 to compensate any height different between the bottom core 1520 and the heatsink 1510.
- the metal shield 1530 can include multiple small sections of notches.
- FIG. 15C illustrates another example of an EE core structure 1550 with a metal shield 1530 according to some embodiments.
- the open EE core structure 1550 may include one or more walls extending from the heatsink 1510 and the metal shield 1530 can be disposed to overlap the walls 1540, for example, in a horizontal direction.
- the open EE core structure 1550 may allow flexibility to have an imperfect contact between the metal shield 1530 and the heatsink 1510 bottom.
- FIGs. 16A-16D illustrate concepts of partially interleaved winding structures between two stages (stage A and stage B).
- FIG. 16C shows a winding structure without winding interleaving between the two stages.
- FIG. 16D illustrates a partially interleaved winding structure with winding interleaving between the two stages according to some embodiment.
- both the cover and the heat sink width may decrease by about 12%. This is merely an example, and depending on the embodiment, the width may decrease more than about 12%.
- the induced current density in the middle pedestal can decrease because of the overlap cancellation of stray magnetic field.
- FIG. 16E illustrates an example induced current density distribution for the winding structure without winding interleaving between the two stages shown in FIG. 16C.
- FIG. 16F illustrates an example induced current density distribution for the partially interleaved winding with winding interleaving between the two stages shown in FIG. 16D.
- Table 2 below shows induced loss in heatsink for the partially interleaved winding which is lower than the winding structure without winding interleaving.
- any TSLA.712WO PATENT of the components for an energy storage system described herein can be provided separately or integrated together (e.g., packaged together, or attached together) to form an energy storage system.
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Abstract
Planar integrated transformer structures are proposed. The transformer structure may include a top core, a bottom core, and one or more center posts interposed between the top core and the bottom core. The transformer structure may also include a transformer comprising a primary winding and a secondary winding, each of the primary winding and the secondary winding surrounding at least one of the one or more center posts. One of the primary winding or the secondary winding may be configured to perform as an inductor. At least one of the one or more center posts may be shared between the transformer and the inductor.
Description
TSLA.712WO PATENT NOVEL PLANAR PCB INTEGRATED TRANSFORMERS CROSS-REFERENCE TO RELATED APPLICATION [0001] This application claims priority to U.S. Provisional Patent Application No.63/483,418, titled “NOVEL PLANAR PCB INTEGRATED TRANSFORMERS” and filed on February 6, 2023, the disclosure of which is hereby incorporated herein by reference in its entirety. BACKGROUND Field [0002] The present disclosure relates to novel planar printed circuit board (PCB) integrated transformers. Background [0003] PCB based transformers can be used in low power applications and signal processing applications. They utilize PCB processes to achieve low-cost windings. The conventional PCB transformers can be used discrete comonents. In most magnetics-based power converter topologies, such as an LC resonant converter, a discrete resonant inductor is generally required. Journal publications exist (e.g., listed below) on an integrated transformer structure, but this structure does not solve the stray magnetic field issue (either from magnetic structures or passive shielding). 1. M. D’Antonio, S. Chakraborty and A. Khaligh, “Planar Transformer With Asymmetric Integrated Leakage Inductance Using Horizontal Air Gap,” in IEEE Transactions on Power Electronics, vol. 36, no. 12, pp. 14014-14028, Dec. 2021, doi: 10.1109/TPEL.2021.3089606.” SUMMARY [0004] The embodiments disclosed herein each have several aspects, no single one of which is solely responsible for the disclosure’s desirable attributes. Without limiting the scope of this disclosure, its more prominent features will now be briefly discussed. After considering this discussion, and particularly after reading the section entitled “Detailed
TSLA.712WO PATENT Description,” one will understand how the features of the embodiments described herein provide advantages over existing transformers. [0005] One aspect is an integrated magnetic structure that comprises a top core, a bottom core, one or more posts interposed between the top core and the bottom core, an inductor portion comprising a center post different from and spaced apart from the one or more posts, a first portion of a primary winding, and a first portion of a secondary winding, and a transformer integrated with the inductor portion by sharing a post of the one or more posts. [0006] In the above integrated magnetic structure, the transformer comprises a second portion of the primary winding and a second portion of the secondary winding. [0007] In the above integrated magnetic structure, the second portion of the primary winding and the second portion of the secondary winding are vertically overlap each other. [0008] In the above integrated magnetic structure, the primary winding surrounds the secondary winding. [0009] In the above integrated magnetic structure, at least one of the primary winding or the secondary winding comprises an interleaved winding structure. [0010] In the above integrated magnetic structure, the center post is vertically disposed at a center position of the bottom core of the inductor portion. [0011] In the above integrated magnetic structure, the one or more posts, the transformer, the inductor portion, and the center post are disposed in a fully enclosed housing. [0012] In the above integrated magnetic structure, a flux shaping air gap is formed on each post of the one or more posts and the center post. [0013] In the above integrated magnetic structure, a flux shaping air gap is formed on the center post. [0014] In the above integrated magnetic structure, two or more symmetric air gaps are formed on the inductor portion. [0015] In the above integrated magnetic structure, the integrated magnetic structure further comprises a metal shield plate disposed adjacent to the one or more posts and configured to at least partially shield a stray magnetic field. [0016] Another aspect is an integrated magnetic structure that comprises a top core, a bottom core, one or more posts interposed between the top core and the bottom core, an
TSLA.712WO PATENT inductor portion comprising a center post, and a flux shaping plate disposed on top of the center post, and a transformer integrated with the inductor portion by sharing a post of the one or more posts. [0017] In the above integrated magnetic structure, the inductor portion further comprises a first portion of a primary winding and a first portion of a secondary winding. [0018] In the above integrated magnetic structure, the transformer comprises a second portion of the primary winding and a second portion of the secondary winding. [0019] In the above integrated magnetic structure, the primary winding surrounds the secondary winding. [0020] In the above integrated magnetic structure, the second portion of the primary winding and the second portion of the secondary winding are vertically overlap each other. [0021] In the above integrated magnetic structure, a flux shaping air gap is formed on each post of the one or more posts and the center post. [0022] In the above integrated magnetic structure, a flux shaping air gap is formed on the center post. [0023] Another aspect is an integrated magnetic structure that comprises a top core comprising a first portion and a second portion, the first portion and the second portion of the top core being disposed in a different height, a bottom core, one or more posts interposed between the top core and the bottom core, an inductor portion comprising a center post, a first portion of a primary winding, and a first portion of a secondary winding, the center post different from and spaced apart from the one or more posts, and a transformer disposed between the second portion of the top core and the bottom core, the transformer comprising a second portion of the primary winding and a second portion of the secondary winding. [0024] In the above integrated magnetic structure, a flux shaping air gap is formed on each post of the one or more posts and the center post. [0025] In the above integrated magnetic structure, a flux shaping air gap is formed on the center post. [0026] In the above integrated magnetic structure, a first portion of the top core is disposed on top of the transformer, and wherein the second portion of the top core is disposed on top of the inductor portion.
TSLA.712WO PATENT [0027] Any of the features of an aspect is applicable to all aspects identified herein. Moreover, any of the features of an aspect is independently combinable, partly or wholly with other aspects described herein in any way, e.g., one, two, or three or more aspects may be combinable in whole or in part. Further, any of the features of an aspect may be made optional to other aspects. BRIEF DESCRIPTION OF THE DRAWINGS [0028] The foregoing and other features of the disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several embodiments in accordance with the disclosure and are not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings. [0029] FIGs.1A-1C illustrate Litz-based transformers and inductors. [0030] FIG.2A illustrates a non-planar magnetics structure. [0031] FIG.2B illustrates an example of a planar magnetics structure according to some embodiments. [0032] FIG.3A illustrates another example of a non-planar magnetics structure. [0033] FIG. 3B illustrates another example of a planar magnetics structure according to some embodiments. [0034] FIG. 4A illustrates a circuit model in which the transformer and inductor have discrete structures. [0035] FIG. 4B illustrates a circuit model in which the transformer and inductor portions are integrated together according to some embodiments. [0036] FIG. 5 illustrates examples of integrated transformer structures according to some embodiments. [0037] FIG.6A illustrates an example of a fully enclosed pot-core integrated planar structure according to some embodiments. [0038] FIG. 6B illustrates a comparison figure in which a discrete transformer/inductor portion is compared with an integrated transformer.
TSLA.712WO PATENT [0039] FIG. 6C illustrates another example of a fully enclosed pot-core integrated planar structure according to some embodiments. [0040] FIG. 6D illustrates a perspective view of the fully enclosed pot-core integrated planar structure of FIG.6A or FIG.6C according to some embodiments. [0041] FIG. 6E illustrates near-field reduction in pot-core structures compared to EE core structures according to some embodiments. [0042] FIG. 6F illustrates current density distribution for an enclosed pot-core structure without flux shaping plates. [0043] FIG. 6G illustrates current density distribution for an enclosed pot-core structure with flux shaping plates. [0044] FIG. 7A illustrates an example of a hybrid pot-core integrated planar structure according to some embodiments. [0045] FIG. 7B illustrates another example of a hybrid pot-core integrated planar structure according to some embodiments. [0046] FIG.8A illustrates a concept of core laminations to minimize eddy current. [0047] FIG. 8B illustrates an example structure to improve flux density sharing in split cores by using an air gap on the center post in the magnetizing flux path according to some embodiments. [0048] FIG. 8C illustrates an example structure to improve flux density sharing in split cores by using consistent bond-line thickness control in each laminated core according to some embodiments. [0049] FIG.8D illustrates an example of an alternative structure. [0050] FIG. 9A illustrates high-current termination in non-planar-magnetics with wire windings. [0051] FIG. 9B illustrates high-current termination in non-planar-magnetics with bus bar windings. [0052] FIG. 9C and FIG. 9D illustrate examples of low-loss high-current PCB winding terminations. [0053] FIG. 10A illustrates PCB winding terminations (in and out) disposed side- by-side. [0054] FIG.10B illustrates overlapped PCB winding terminations (in and out).
TSLA.712WO PATENT [0055] FIGs. 11A and 11B illustrate a fully enclosed pot-core integrated planar structure according to some embodiments. [0056] FIGs.12A-12E illustrate an open EE 3-legged structure with or without flux shaping according to some embodiments. [0057] FIG.12F illustrates a simulation results of an induced loss in adjacent metal heatsinks. [0058] FIG. 13A illustrates an open EE 4-legged structure without flux shaping according to some embodiments. [0059] FIG. 13B illustrates an open EE 4-legged structure with flux shaping and symmetric air gaps according to some embodiments. [0060] FIG. 13C illustrates an open EE 4-legged structure with flux shaping and asymmetric air gaps according to some embodiments. [0061] FIG. 14 illustrates a near field reduction in open EE core structures with a metal shield according to some embodiments. [0062] FIG.15A illustrates an example of an EE core structure with a metal shield according to some embodiments. [0063] FIG. 15B illustrates an example of a metal shield application according to some embodiments. [0064] FIG. 15B illustrates another example of an EE core structure with a metal shield according to some embodiments. [0065] FIGs. 16A-16D illustrate concepts of partially interleaved winding structures between two power stages. [0066] FIG. 16E illustrates an example of induced current density distribution for the winding structure without winding interleaving between the two stages shown in FIG.16C. [0067] FIG. 16F illustrates an example of induced current density distribution for the partially interleaved winding structure with winding interleaving between the two stages shown in FIG.16D. [0068] Embodiments of the present disclosure and their advantages are best understood by referring to the detailed description that follows. It should be appreciated that like reference numerals are used to identify like elements illustrated in one or more of the
TSLA.712WO PATENT figures, wherein showings therein are for purposts of illustrating embodiments of the present disclosure and not for purposts of limiting the same. DETAILED DESCRIPTION [0069] Provided herein are various embodiments of a novel planar PCB integrated transformer. A magnetic component such as inductors and transformers generally can include conductors (e.g., windings) wound around magnetic cores. They come in many shapes and sizes and can serve different functions (voltage conversion, isolation, electromagnetic interference (EMI) mitigation, etc.). Various embodiments provide novel planar PCB integrated transformer structures, using PCB traces as transformer windings to achieve a low profile and high-power density for high-frequency power converter applications. The planar structures are generally lower in cost than the wire-wound counterpart and can significantly minimize the supply chain constraints by reducing the number of unique suppliers from, for example, 6+ to about 1-2 for assembling magnetic components. [0070] An example of an integrated transformer structure may include an inductor integrated into the transformer structure. The integration of the inductor and transformers leads to a reduction in winding losses and footprint compared to using discrete inductors and transformers. The structures allow the flexibility to have the inductance either entirely on the primary side or on the secondary side. Besides this, some structures also allow the flexibility to distribute the inductance symmetrically/asymmetrically on both primary and secondary windings. The proposed integrated transformer structures also include magnetic flux shaping features to minimize conduction losses. [0071] Various embodiments can be used for onboard chargers in electric vehicles, stationary storage, powerwall, megapacks, battery chargers, or an autonomous driving hardware. Any power electronic converter that requires an isolation/voltage step ratio and/or energy storage requires a magnetic component. Various embodiments cover all the different concepts/structures that can be used for any power converter to be designed for any of the above applications. In some embodiments, core structures can be made with a magnetic material, such as ferrite and powder core. [0072] High-power, high-frequency applications result in integrated transformer structures of a large size. This high-power integrated transformer structures may require the
TSLA.712WO PATENT cores to be laminated to minimize eddy current loss in the core. Splitting the cores can be used in the high-power integrated transformer structure, however, these splitting cores may have a technical challenge in terms of a flux-density distribution between various core split structures. Some embodiments, as disclosed herein, can improve the flux density distribution between different split cores. For example, the flux density distribution can be improved by providing an air gap in the center post. As another example, the flux density distribution can be improved by providing a uniform bond line thickness between the top and bottom core halves. [0073] The integrated transformer structures may potentially generate significant stray magnetic fields, which can lead to electromagnetic compatibility (EMC) issues on nearby components. To address these deficiencies, the present disclosure provides various integrated inductor and transformer structures that can keep the strong magnetic fields confined within the core structure with a minimum stray field present. The present disclosure also provides other structures with a metal shield cover. Various embodiments can provide novel shield structures to minimize near fields from planar transformer structures with integrated resonant inductors. [0074] Various embodiments provide novel winding design techniques that overlap the incoming and the outgoing current carrying PCB traces for the same winding to minimize the stray field/termination losses. Various embodiments also provide concepts to overlap windings from parallel power converter stages to achieve flux cancellation and reduce the losses in the heat sink and/or reduce the overall footprint. [0075] According to various embodiments, power converters designed using high power planar magnetics can significantly increase power capability with lower costs. Some embodiments can remove a portion of a supply chain altogether (e.g., suppliers who assemble different pieces like core, windings, bobbins, etc., to make a transformer/inductor). This may be essential to reach a high-volume production rate with lower costs. [0076] Various embodiments can also provide a manufacturing improvement. For example, LV terminations using bolted joints requiring strict micro-resistance measurements have proven to be challenging, but with planar magnetics, the conductors on the PCB can be directly integrated into the PCB (e.g., printed circuit board assembly, PCBA). [0077] Various embodiments provide a fully enclosed pot-core integrated planar structure that can minimize a stray magnetic field compared to open EE core structures.
TSLA.712WO PATENT Various embodiments also provide a hybrid pot-core integrated planar structure that can further reduce weight and cost compared to a fully enclosed pot-core structure and maintain minimized stray magnetic field benefits. [0078] Various embodiments provide an enclosed pot-core structure (e.g., a fully enclosed pot-core integrated planar structure) that can include a fewer number of PCB layers needed compared to other structures with overlapped winding sections, where a resonant inductor can be integrated and distributed. Various embodiments provide an open EE core structure that can include a 3-legged open EE core and a 4-legged open EE core structure. The 3-legged open EE core structure can minimize a core size and footprint. The 4-legged open EE core structure may have a lower stray field compared to the 3-legged open EE core structure and can also provide integrated resonant inductors distributed symmetrically/asymmetrically on primary or secondary sides. [0079] FIGs.1A-1C illustrate high-frequency power magnetics such as Litz-based transformers and inductors. Specifically, FIGs. 1A – 1C show a conventional DCDC (DC to DC) converter and charger that include an inductor and a transformer that can be used in various applications, such as an electronic vehicle and chargers. For example, FIG.1A illustrates a DCDC converter that can include a transformer and inductor. FIG.1B illustrates a charger that can include a transformer and inductor. Additionally, FIG. 1C illustrates an example of a DCDC converter that can include a transformer and inductor. [0080] The conventional converter and/or charger utilizes Litz-wire based magnetics (transformer and inductor) that can provide low loss in certain frequency ranges, such as 100-500 kHz frequency range and low proximity/skin-effect loss in Litz wires. However, there can be some technical challenges, including higher costs, the high thermal resistance in core and winding, a limited supply chain (e.g., limited qualified Litz wire suppliers), power density (usually, the tallest component in the converter), and/or winding termination complexity/loss (for high current Litz wire terminations). [0081] FIG.2A illustrates an example of an exploded view of a conventional non- planar magnetics structure 200. Generally, the non-planar magnetics structure 200, such as Litz wire-based magnetics, can have a multitude of bits and pieces that can cause complicated manufacturing assembly processes. For example, the non-planar magnetics structure 200 can include a housing 202, cores 204, windings 206, 208, terminals 210, and a bobbin 212.
TSLA.712WO PATENT [0082] FIG. 2B illustrates an example of a planar magnetics structure 250 according to some embodiments. The planar magnetics structure 250 generally can include a relatively fewer number of parts compared to the non-planar magnetics structure 200 (e.g., Litz wire-based magnetics) and can eliminate the complexity of manufacturing processes, such as terminations and winding. For example, the planar magnetics structure 250 can include cores 252, an insulator 254, and a PCB winding 256. Thus, the windings 206, 208, terminals 210, and the bobbin 212 included in the conventional non-planar magnetics structure 200 can be integrated into the PCB winding 256 of the planar magnetics structure 250. [0083] FIG. 3A shows another example of a non-planar magnetics structure 300. In some embodiments, the non-planar magnetics structure 300 can include a non-planar magnetic structure 302, filim capacitors 304, PCBs 306, transistors (e.g., MOSFETs) 308, thermal interface material 310, pedestals on heatsink 312, and a heatsink 314. FIG.3B shows another example of a planar magnetics structure 350 according to some embodiments. In some embodiments, the planar magnetics structure 350 can include a non-planar magnetic structure 352A/352B, filim capacitors 354, PCBs 356, transistors (e.g., MOSFETs) 358, thermal interface material 360, pedestals on heatsink 362, and a heatsink 364. As shown in FIGs. 3A and 3B, the height of the non-planar magnetic structure 302 can be higher than the height of the planar magnetic structures 352A/352B. [0084] FIG.4A illustrates a schematic view of a conventional discrete transformer and inductor 400. For example, the discrete transformer and inductor 400 can include an inductor 402, a transformer 404, and a capacitor 406. In this example shown in FIG.4A, each of the inductor 402, and the transformer 404 can be a discrete component. FIG.4B illustrates a schematic view of an example of integrated magnetics 450 according to some embodiments. For example, the inductor 402 and the transformer 404 can be integrated as the component 408 (e.g., an integrated magnetic), as shown in FIG.4B. [0085] FIG.5 illustrates examples of various integrated transformer structures 500 according to some embodiments. The integrated transformer structures 500 may include an enclosed pot-core structure 510 and an open EE core structure 520. The enclosed pot-core structure 510 may include a pot-core structure with or without flux shaping 512 (Example 1; see, for example, FIGs. 6A and 6C). The enclosed pot-core structure 510 may also include a hybrid pot-core structure plus an EE core structure with or without flux shaping 514 (Example
TSLA.712WO PATENT 2; see, for example, FIGs. 7A and 7B). The enclosed pot-core structure 510 may further include an enclosed 5-legged pot-core structure with or without flux shaping 516 (Example 3; FIG.11). The open EE core structure 520 may include an open EE 3-legged with flux shaping 522 (Example 4; see, for example, FIGs.12A-12E). The open EE core structure 520 may also include an open EE 4-legged with or without flux shaping with resonant inductance independent distributed symmetric/asymmetric structure 524 (Example 5; see, for example, FIGs. 13A-13C). [0086] FIG.6A illustrates an example of a fully enclosed pot-core integrated planar structure according to some embodiments. Referring to FIG. 6A an inductor air gap 620 can be enclosed inside the magnetics body 610 to provide a minimum stray field. FIG. 6A illustrates an example of a fully enclosed pot-core integrated planar structure 600 according to some embodiments. The enclosed pot-core integrated planar structure 600 of FIG. 6A does not include a flux shaping plate. In some embodiments, the enclosed pot-core integrated planar structure 600 can include an inductor portion 630 and a transformer portion 640. The inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 636. In some examples, the core center post 636 can be disposed between the first side 632 and the second side 634. In some examples, the first side 632 and the second side 634 can surround the center post 636. In some embodiments, the first side 632 can include a number of layers of primary winding 638A (e.g., a first portion of the primary winding), and the second side 634 can include a number of layers of secondary winding 638B (e.g., a first portion of the secondary winding). The present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 6A. In some embodiments, the first side 632 can include a first portion of the primary winding 638A, and the second side 634 can include a first portion of the secondary winding 638B. The transformer portion 640 can include a second portion of the primary winding 638C and a second portion of the secondary winding 638D. In some embodiments, the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically with respect to each other. For example, as described in below FIG.6D, a primary winding can surround the inductor portion 630 and the transformer portion 640. A first portion of the primary winding can be disposed on the inductor portion 630 (e.g., the first side 632), and a second portion of the primary winding can be disposed on the transformer
TSLA.712WO PATENT portion 640. Furthermore, the secondary winding can surround the transformer portion 640. In this integrated planar structure (e.g., the transformer portion 640 and the inductor portion 630 can be integrated), a first portion of the secondary winding can be disposed on the inductor portion 630 (e.g., second side 634), and a second portion of the secondary winding can be disposed on the transformer portion 640. In some embodiments, one or more posts 650 can be interposed between the top core 610A and the bottom core 610B. For example, as illustrated in FIG. 6A, the posts 650, 650A can be interposed between the top core 610A and 610B. As further illustrated in FIG. 6A, at least one post (e.g., post 650A) of the one or more posts 650 can be shared between the inductor portion 630 and the transformer portion 640. [0087] As illustrated in FIG. 6A, the magnetic body 610 can include the top core 610A and the bottom core 610B. The inductor portion 630 and the transformer portion 640 can be enclosed by the top core 610A, the bottom core 610B, and posts 650 (shown in FIG. 6B). In some embodiments, the inductor portion 630, the transformer portion 640, the center post 636, and other posts (650 shown in FIG. 6B) can be vertically disposed on the top of the bottom core 610B and below the top core 610A. [0088] FIG. 6B illustrates a comparison figure in which a conventional discrete transformer/inductor structure 500 is compared with an integrated transformer 600. Referring to FIG.6B, the discrete transformer/inductor structure 500 can include the discrete components of a transformer 502 and an inductor 504. As shown in FIG. 6B, the discrete transformer/inductor structure 500 can include three windings, whereas the integrated transformer 600 can include two windings since the inductor winding can be shared with a primary winding of the transformer portion in the integrated transformer 600. Furthermore, the discrete transformer/inductor structure 500 can include six core posts (e.g., core posts 550, 550A, and 550B), whereas the integrated transformer 600 can include four core posts (e.g., core posts 650 and 650A)since a shared core post (e.g., 650A) can be used between the inductor portion 630 and transformer portion 640 in the integrated transformer 600. Thus, the integrated transformer 600 can be manufactured more cost-effectively and operated more efficiently than the discrete transformer/inductor structure 500. [0089] FIG. 6C illustrates another example of a fully enclosed pot-core integrated planar structure 650 according to some embodiments. Referring to FIG. 6C, an inductor air gap 620 can be enclosed inside the magnetics body 610 for a minimum stray field. The
TSLA.712WO PATENT enclosed pot-core integrated planar structure 650 of FIG. 6B can include a flux shaping plate 670 disposed on the center post 660. The enclosed pot-core integrated planar structure 650 of FIG. 6C can include a flux shaping plate 670. In some embodiments, the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640. The inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660. In some examples, the core center post 660 can be disposed between the first side 632 and the second side 634. In some examples, the first side 632 and the second side 634 surround the center post 636. In some embodiments, the first side 632 can include a number of layers of the first portion of the primary winding 638A, and the second side 634 can include a number of layers of the first portion of the secondary winding 638B. However, the present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 6C. In some embodiments, the transformer portion 640 can include a second portion of the primary winding 638C and a second portion of the secondary winding 638D. In some embodiments, the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically with respect to each other. In some embodiments, the inductor portion 630 can include the flux shaping plate 670. The flux shaping plate 670 can be disposed on top of the core center post 660. In some examples, the width of the flux shaping plate 670 can be larger than the width of the core center post 660. In some embodiments, the air gap 620 can be formed between the top of the flux shaping plate 670 and magnetic body 610. In some examples, symmetric air gaps can be formed in the first side 632 and the second side 634. In some embodiments, one or more posts 650 can be interposed between the top core 610A and the bottom core 610B. For example, as illustrated in FIG. 6A, the posts 650, 650A can be interposed between the top core 610A and 610B. As further illustrated in FIG.6A, at least one post (e.g., post 650A) of the one or more posts 650 can be shared between the inductor portion 630 and the transformer portion 640. [0090] FIG. 6D illustrates a perspective view of the fully enclosed pot-core integrated planar structure of FIG.6A or FIG.6C according to some embodiments. Although not shown in FIG. 6D, the fully enclosed pot-core integrated planar structure of FIG. 6D may include a flux shaping plate.
TSLA.712WO PATENT [0091] As illustrated in FIG.6D, in some embodiments, at least one of the enclosed pot-core integrated planar structure 600 or 650 (FIG. 6D illustrates an example of integrated planar structure 600) can include an inductor portion (side) 630 and a transformer portion (side) 640 that can be integrated into a single structure 600 to have a shared winding (e.g., a primary winding 638A and a secondary winding 638B). The windings 638A, 638B in the inductor portion 630 and the transformer portion 640 may at least partially vertically overlap each other. For example, in the inductor portion 630, the primary winding 638A and the secondary winding 638B can be overlapped at portions 639A. Furthermore, in the transformer portion 640, the primary winding 638A and the secondary winding 638B can be overlapped in a portion of 639B. In some embodiments, at portion 639B, the portions of primary winding 638A and portions of the secondary winding 638B can be stacked together, such that the portion of primary winding 638A can be interposed between two layers of the portion of the secondary windings 638B. In some embodiments, each of the primary winding 638A and primary winding 638B may perform as an inductor whereas the combination of the primary winding and the secondary winding 638A may perform as a transformer. In these embodiments, at least a portion of the primary winding may be disposed below or above the secondary winding 638B so that at least a portion of the primary winding 638A may vertically overlap the secondary winding 638B (see, for example, FIG. 6D). In some embodiments, the secondary winding 638B may perform as an inductor whereas the combination of the primary winding 638A and the secondary winding 638B may perform as a transformer. In these embodiments, at least a portion of the secondary winding 638B may be disposed below or above the primary winding so that at least a portion of the secondary winding 638B may vertically overlap the primary winding 638A. The description of this paragraph can apply at least to the embodiments shown in FIGs. 7A, 7B, 8A, 8C, 8D,, 12B-12E, or 13A-13C. Note FIG. 11 shows that at least a portion of the flux shaping plate vertically overlap both the primary and secondary windings while the primary winding and the secondary winding do not overlap each other. [0092] FIG. 6E illustrates the magnetic near-field for the EE core and pot-core structures shown in FIG. 6A and FIG. 6C, respectively, according to some embodiments. Referring to FIG. 6E, the enclosed pot-core structures (shown in lower side of FIG. 6E) can provide a near field reduction compared to a conventional inductor and transformer structure.
TSLA.712WO PATENT [0093] FIG. 6F illustrates a current density distribution for the enclosed pot-core structure 600 that does not include flux shaping (or a flux shaping plate). FIG. 6G illustrates an improved current density distribution leading to a minimized winding loss distribution for an enclosed pot-core structure 650 that can include flux shaping (or a flux shaping plate). Referring to FIGs. 6F and 6G, the enclosed pot-core structure with a flux shaping plate can reduce winding loss. Table 1 shows core loss and conduction loss for the straight induction post structure 600 and the integrated planar structure with flux shaping 650. TABLE 1 Core loss Conduction loss Straight Inductor post (600) 1x 1.28x With flux shaping plate (650) 1.1x 1x [0094] FIG. 7A and FIG. 7B illustrate example hybrid pot-core integrated planar structures 700 and 750 according to some embodiments. The hybrid pot-core integrated planar structures 700 and 750 may have an enclosed pot-core structure on the inductor side and an open EE or EI structure on the transformer side. FIG. 7A illustrates an example hybrid pot- core integrated planar structure 700 according to some embodiments. The hybrid pot-core integrated planar structure 700 can include a flux shaping plate 670. [0095] In some embodiments, as shown in the hybrid pot-core integrated planar structure 700 of FIG. 7A, the height of the transformers 640 can be reduced, such that the height of the transformer portion 640 can be less than the height of the inductor portion 630. For example, each inductor portion 630 and the transformer portion 640 can include a inductor portion top core 610CC and a transformer portion top core 610AA, respectively. The top core 610AA of the transformer can be placed lower than the top core 610CC of the inductor. The hybrid pot-core integrated planar structure 700 of FIG. 7A can include a flux shaping plate 670. In some embodiments, the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640. The inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660. In some examples, the core center post 660 can be disposed between the first side 632 and the
TSLA.712WO PATENT second side 634. In some examples, the first side 632, and the second side 634 may surround the center post 636. In some embodiments, the first side 632 can include a number of layers of the first portion of primary winding 638A, and the second side 634 can include a number of layers of the first portion of secondary winding 638B. The present disclosure is not limited to the number of layers for each primary winding and the secondary winding described above and shown in FIG. 7A. In some embodiments, the transformer portion 640 can include a second portion of primary winding 638C and a second portion of secondary winding 638D. In some embodiments, the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically. In some embodiments, the inductor portion 630 can include the flux shaping plate 670. The flux shaping plate 670 can be disposed on top of the core center post 660. In some examples, the width of the flux shaping plate 670 can be larger than the width of the core center post 660. In some embodiments, the air gap 620 can be formed between the top of the flux shaping plate 670 and magnetic body 610. In some embodiments, the inductor portion 630, the transformer portion 640, the center post 660, and other posts (650 shown in FIG. 6B) can be vertically disposed on the top of the bottom core 610B and below the top core 610A and 610C. In some embodiments, one or more posts 650A- 650C can be interposed between the top core 610AA / 610CC and the bottom core 610B. For example, as illustrated in FIG. 7A, the posts 650B can be interposed between the top core 610AA and 610B. Moreover, the posts 650A and 650C can be interposed between the top core 610CC of the inductor portion 630 and the bottom core 610B. As further illustrated in FIG. 6A, the post 650A can be shared between the inductor portion 630 and the transformer portion 640. [0096] FIG. 7B illustrates another example of a hybrid pot-core integrated planar structure 750 according to some embodiments. The hybrid pot-core integrated planar structure 750 can form a modified structure from the example hybrid pot-core integrated planar structure 700. For example, the hybrid pot-core integrated planar structure 750 can be formed from the hybrid pot-core integrated planar structure 700 by removing the post 650B (shown in FIG.7A) and the top core of the transformer portion 610AA (shown in FIG.7A) and resizing the bottom core 610B to the width of the top core 610CC of the inductor portion 630. As further illustrated in FIG.7B, the hybrid pot-core integrated planar structure 750 can include a flux shaping plate
TSLA.712WO PATENT 670 on top of the center post 660. These hybrid structures 700 and 750 can minimize weight/cost of the transformer core with a minimal impact on the near field. [0097] FIG.8A illustrates a concept of core laminations to minimize eddy current. For example, with no split, the eddy-current core loss for one core can be 1.8x the compared to a design with two splits. Meanwhile, with a single split, the core loss can be 1.4x compared to a design with two splits. The core splits shown in FIG. 8A are merely examples, and the present disclosure is not limited thereto. For example, three or more splits (four or more cores) can also be possible. G [0098] FIG.8B illustrates an example structure 800 to improve flux density sharing in split cores by using an air gap on the center post to dominate the reluctance of each split core according to some embodiments. FIG.8C illustrates an example structure 850 to improve flux density sharing in split cores by using consistent bond-line thickness control according to some embodiments. According to the example structures 800 and 850 of FIGs. 8B and 8C, flux density sharing issues in split core structures can be minimized. [0099] In some embodiments, as shown in FIG.8B, integrated planar structure 800 of FIG.8B, the post 650A shared between the transformer portion 640 and the inductor portion 630 can include a flux shaping air gap 810. The integrated planar structure 800 of FIG. 8B can include a flux shaping plate 670. In some embodiments, the enclosed pot-core integrated planar structure 650 can include an inductor portion 630 and a transformer portion 640. The inductor portion 630 can have an EE structure that can include a first side 632, a second side 634, and a core center post 660. In some examples, the core center post 660 can be disposed between the first side 632 and the second side 634. In some examples, the first side 632 and the second side 634 may surround the center post 636. In some embodiments, the first side 632 can include a number of layers of first portion of primary winding 638A, and the second side 634 can include a number of layers of first portion of secondary winding 638B. The present disclosure is not limited to a particular number of layers for each primary winding and the secondary winding. The transformer portion 640 can include a second portion of primary winding 638C and a second portion of secondary winding 638D. In some embodiments, the inductor portion 630 can include the flux shaping plate 670. In some embodiments, the second portion of the primary winding 638C and the second portion of the secondary winding 638D can be disposed vertically. The flux shaping plate 670 can be disposed on top of the core center
TSLA.712WO PATENT post 660. In some examples, the width of the flux shaping plate 670 can be larger than the width of the core center post 660. In some embodiments, the air gap 620 can be filled between the top of the flux shaping plate 670 and magnetic body 610. In some embodiments, as described in FIG.8C, the posts 650 and 650A can include a flux shaping air gap 810. In some embodiments, as described in FIG. 8D, a transformer portion 840 can be interposed between two portions 830A, 830B of the inductor portion 830. In some embodiments, as further described in FIG. 8D, a post 850A can be shared between a portion of the inductor portion 830A and the transformer portion 840 and between another portion of the inductor portion 830B and the transformer portion 840. In some embodiments, as further described in FIG.8D, each of the posts 850A and 850B can include an air gap 855. [0100] FIG. 9A illustrates a conventional high-current termination in planar- magnetics with wire windings. FIG.9A shows a conventional complex wire soldering in wire windings. FIG.9B illustrates a conventional high-current termination in planar-magnetics with bus bar windings. FIG. 9B shows risky bolted joints in bus bar windings. FIG. 9C and FIG. 9D illustrate example low-loss PCB winding terminations according to some embodiments. For example, according to the structures of FIGs. 9C and 9D, terminals 950 can be integrated into a portion of a PCB winding , which simplifies manufacturing processes and reduces extra loss from termination (e.g. soldering). In the structures of FIGs. 9C and 9D, in and out terminals can be overlapped at 930, which can reduce AC winding loss at high frequencies due to stray magnetic field cancellation. [0101] FIG. 10A illustrates winding terminations (in and out) side-by-side. FIG. 10B illustrates winding terminations (in and out) overlapped according to some embodiments. The overlapped winding termination shown in FIG. 10B can significantly reduce the current density hotspot and reduce AC winding losses. [0102] FIGs. 11A and 11B illustrate a fully enclosed pot-core integrated planar structure 1100 according to some embodiments. FIGs.11A and 11B can include two inductor portions 630A and 630B (e.g., inductor portion 630 shown in FIG. 6C). For example, the inductor portion 630A and 630B can be integrated to the structure 1100 by sharing the post 950A. FIG.11A is a side view of the fully enclosed pot-core integrated planar structure 1100. FIG.11B is a perspective view of the fully enclosed pot-core integrated planar structure 1100. In these embodiments, the primary winding 1160 and secondary winding 1150 may not be
TSLA.712WO PATENT stacked vertically on top of each other, but side by side in the PCB. The integrated inductor may be formed by the air gap and core post (with or without flux shaping plate) between the two windings in this structure. For example, as shown in FIG. 11B, the secondary winding 1150 may surround the post 950A, such as the secondary winding 1150 shown in FIG. 11B. The primary winding 1160 can surround the core posts 1170A and 1170B of each inductor portion 630A and 630B, respectively. Thus, the primary winding 1160 can be formed, as illustrated in FIG.11B. The number of PCB layers may be minimal in this structure for given the number of turns needed. [0103] FIGs. 12A-12E illustrate various examples of open EE 3-legged structures with or without flux shaping according to some embodiments. As illustrated in FIG.12A, the open EE 3-legged structure 1200 can include a flux shaping air gap on the top core, whereas the open EE 3-legged structure 1250 can include an air gap without flux shaping on the side between the bottom core and the top core. Although FIGs. 12B-12E show that the secondary winding can be disposed above the primary winding, the present disclosure is not limited thereto. For example, the primary winding may be disposed above the secondary winding. Again, the integrated inductor and transformer design allows for a size reduction, a flux- shaping air gap can reduce winding loss. Induced loss in heatsink can be a strong function of the stray field, as shown in FIG.12F. [0104] As illustrated in FIG.12A, the open EE 3-legged structure 1200 can include three legs 1210A-1210C vertically disposed on the bottom core 1220. As illustrated in FIG. 12B, a primary winding 1230 can surround the leg 1210B (e.g., a center leg). Also, the secondary winding 1240 can surround the leg 1210C (e.g., a side leg). As further illustrated in FIG. 12C, a top core 1250 can be disposed on top of the center leg 1210B and the side leg 1210C. In some embodiments, a flux shaping air gap 1260 can be formed on the portion of the primary winding 1230 that can be uncovered by the top core 1250. [0105] The open EE 3-legged structure 1200 can be modified as illustrated in FIGs. 12D and 12E. For example, as illustrated in FIG. 12D, three legs (e.g., a first side leg 1210A, a middle leg 1210B, and a second side leg 1210C) can be formed between the top core 1250 and the bottom core 1220. An airgap 1250A can be formed on the top core 1250 between the first side leg 1210A and the middle leg 1210B. Furthermore, the primary winding 1230 can
TSLA.712WO PATENT be formed by surrounding the middle leg 1210B, and the secondary winding 1240 can be formed by surrounding the second side leg 1210C. [0106] FIG. 12E illustrates another example of the open EE 3-legged structure 1200. For examples, as illustrated in FIG.12D, three legs (e.g., a first side leg 1210A, a middle leg 1210B, and a second side leg 1210C) can be formed between the top core 1250 and the bottom core 1220. An airgap 1250B can be formed on the first side leg 1210A (e.g., between the top core 1250 and the bottom core 1220). Furthermore, the primary winding 1230 can be formed by surrounding the middle leg 1210B, and the secondary winding 1240 can be formed by surrounding the second side leg 1210C. [0107] FIG. 13A illustrates an open EE 4-legged structure 1300A without flux shaping according to some embodiments. The open EE 4-legged structure 1300A can minimize loss in pedestal/heatsink due to low stray field compared to the 3-legged EE-core structure, and thus the open EE 4-legged structure 1300A can be ideal for designs with a heat- sink. In some embodiments, the open EE 4-legged structure 1300A can include a first – fourth legs, 1310A-1310D, respectively. These 4 legs, 1310A-1310D, can be interposed between the top core 1350 and the bottom core 1320. In some examples, a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C. In some embodiments, the secondary winding 1340 can be disposed on top of the primary winding 1330. The secondary winding 1340 can also be disposed below the primary winding 1330 in some applications. As further illustrated in FIG. 13A, a first air gap can be formed on the first leg 1310A, and a second air gap 1350B can be formed on the fourth leg 1310D. In some examples, the open EE 4-legged structure 1300A can have a symmetrical design with respect to the center 1360 of the open EE 4-legged structure 1300A. [0108] FIG.13B illustrates an open EE 4-legged structure 1300B with flux shaping and two or more symmetric air gaps according to some embodiments. The open EE 4-legged structure 1300B can further reduce winding loss with flux shaping air gap. In some embodiments, the open EE 4-legged structure 1300B can include a first – fourth legs, 1310A- 1310D, respectively. These 4 legs, 1310A-1310D, can be interposed between the top core 1350 and the bottom core 1320. In some examples, a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C. In some embodiments, the secondary winding 1340 can be disposed on top of the primary winding
TSLA.712WO PATENT 1330. The secondary winding 1340 can also be disposed of below the primary winding 1330 in some applications. As further illustrated in FIG. 13B, a first air gap 1350C can be formed on the top core 1350, between the first leg 1310A and a second leg 1310B. A second air gap 1350D can be formed on top core 1350, between the third leg 1310C and the fourth leg 1310D. In some examples, the open EE 4-legged structure 1300B can have a symmetrical design with respect to the center 1360 of the open EE 4-legged structure 1300A. [0109] FIG.13C illustrates an open EE 4-legged structure 1300C with flux shaping and two or more asymmetric air gaps according to some embodiments. The open EE 4-legged structure 1300C can allow design flexibility to have asymmetric resonant inductance on primary and secondary windings. In some examples, a primary winding 1330 can surround the second leg 1310B, and the secondary winding 1340 can surround the third leg 1310C. In some embodiments, the secondary winding 1340 can be disposed on top of the primary winding 1330. The secondary winding 1340 can also be disposed below the primary winding 1330 in some applications. As further illustrated in FIG. 13B, a first air gap 1350E can be formed on the top core 1350, between the first leg 1310A and a second leg 1310F. A second air gap 1350D can be formed on top core 1350, between the third leg 1310C and the fourth leg 1310D. In some examples, the air gaps 1350E and 1350F can be formed symmetrically with respect to the center 1360 of the open EE 4-legged structure 1300A. [0110] FIG. 14 illustrates a near field reduction in open EE core structures with a metal shield according to some embodiments. The open EE core structure may have a large stray magnetic field, which could be a problem for EMC. As can be shown in FIG. 14, near field can be substantially reduced in open EE core structures with a metal shield. [0111] FIG. 15A illustrates an example of an EE core structure 1500 with a metal shield 1530 according to some embodiments. In the open EE core structure 1500, the metal shield 1530 can contact the heatsink 1510 at all points. For example, the open EE core structure 1500 can include features which can be pressed to ensure contact with the heatsink surface 1510 and has multiple small sections to ensure co-planarity with the heatsink 1510 and the bottom core 1520. In some embodiments, the wall 1540 can be disposed on the top of the heatsink 1510 to compensate any height different between the bottom core 1520 and the heatsink 1510. As illustrated in FIG. 15B, the metal shield 1530 can include multiple small sections of notches.
TSLA.712WO PATENT [0112] FIG. 15C illustrates another example of an EE core structure 1550 with a metal shield 1530 according to some embodiments. The open EE core structure 1550 may include one or more walls extending from the heatsink 1510 and the metal shield 1530 can be disposed to overlap the walls 1540, for example, in a horizontal direction. The open EE core structure 1550 may allow flexibility to have an imperfect contact between the metal shield 1530 and the heatsink 1510 bottom. [0113] FIGs. 16A-16D illustrate concepts of partially interleaved winding structures between two stages (stage A and stage B). FIG. 16C shows a winding structure without winding interleaving between the two stages. FIG. 16D illustrates a partially interleaved winding structure with winding interleaving between the two stages according to some embodiment. According to the FIG.16D embodiment, both the cover and the heat sink width may decrease by about 12%. This is merely an example, and depending on the embodiment, the width may decrease more than about 12%. Furthermore, the induced current density in the middle pedestal can decrease because of the overlap cancellation of stray magnetic field. FIG. 16E illustrates an example induced current density distribution for the winding structure without winding interleaving between the two stages shown in FIG. 16C. FIG. 16F illustrates an example induced current density distribution for the partially interleaved winding with winding interleaving between the two stages shown in FIG. 16D. Table 2 below shows induced loss in heatsink for the partially interleaved winding which is lower than the winding structure without winding interleaving. TABLE 2 Induced loss in heatsink Without winding Interleaving 1.71x With winding interleaving 1x [0114] Features, materials, characteristics, or groups described in conjunction with a particular aspect, embodiment, or example are to be understood to be applicable to any other aspect, embodiment or example described in this section or elsewhere in this specification unless incompatible therewith. All the features disclosed in this specification (including any
TSLA.712WO PATENT accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. The protection is not restricted to the details of any foregoing embodiments. The protection extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed. [0115] Furthermore, certain features that are described in this disclosure in the context of separate implementations can also be implemented in combination in a single implementation. Conversely, various features that are described in the context of a single implementation can also be implemented in multiple implementations separately or in any suitable sub combination. Moreover, although features may be described above as acting in certain combinations, one or more features from a claimed combination can, in some cases, be excised from the combination, and the combination may be claimed as a sub combination or variation of a sub combination. [0116] Moreover, while operations may be depicted in the drawings or described in the specification in a particular order, such operations need not be performed in the particular order shown or in sequential order, or that all operations be performed, to achieve desirable results. Other operations that are not depicted or described can be incorporated in the example methods and processes. For example, one or more additional operations can be performed before, after, simultaneously, or between any of the described operations. Further, the operations may be rearranged or reordered in other implementations. Those skilled in the art will appreciate that in some embodiments, the actual steps taken in the processes illustrated and/or disclosed may differ from those shown in the figures. Depending on the embodiment, certain of the steps described above may be removed, others may be added. Furthermore, the features and attributes of the specific embodiments disclosed above may be combined in different ways to form additional embodiments, all of which fall within the scope of the present disclosure. Also, the separation of various system components in the implementations described above should not be understood as requiring such separation in all implementations, and it should be understood that the described components and systems can generally be integrated together in a single product or packaged into multiple products. For example, any
TSLA.712WO PATENT of the components for an energy storage system described herein can be provided separately or integrated together (e.g., packaged together, or attached together) to form an energy storage system. [0117] For purposts of this disclosure, certain aspects, advantages, and novel features are described herein. Not necessarily all such advantages may be achieved in accordance with any particular embodiment. Thus, for example, those skilled in the art will recognize that the disclosure may be embodied or carried out in a manner that achieves one advantage or a group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein. [0118] Conditional language, such as “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiment include, while other embodiments do not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without user input or prompting, whether these features, elements, and/or steps are included or are to be performed in any particular embodiment. [0119] Conjunctive language such as the phrase “at least one of X, Y, and Z,” unless specifically stated otherwise, is otherwise understood with the context as used in general to convey that an item, term, etc. may be either X, Y, or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z. [0120] Language of degree used herein, such as the terms “approximately,” “about,” “generally,” and “substantially” as used herein represent a value, amount, or characteristic close to the stated value, amount, or characteristic that still performs a desired function or achieves a desired result. [0121] The scope of the present disclosure is not intended to be limited by the specific disclosures of embodiments in this section or elsewhere in this specification and may be defined by claims as presented in this section or elsewhere in this specification or as presented in the future. The language of the claims is to be interpreted broadly based on the language employed in the claims and not limited to the examples described in the present
TSLA.712WO PATENT specification or during the prosecution of the application, which examples are to be construed as non-exclusive. [0122] While certain embodiments have been described, these embodiments have been presented by way of example only and are not intended to limit the scope of the disclosure. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the systems and methods described herein may be made without departing from the spirit of the disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure. Accordingly, the scope of the present inventions is defined only by reference to the appended claims.
Claims
TSLA.712WO PATENT WHAT IS CLAIMED IS: 1. An integrated magnetic structure comprising: a top core; a bottom core; one or more posts interposed between the top core and the bottom core; an inductor portion comprising a center post, a first portion of a primary winding, and a first portion of a secondary winding, the center post different from and spaced apart from the one or more posts; and a transformer integrated with the inductor portion by sharing a post of the one or more posts. 2. The integrated magnetic structure of Claim 1, wherein the transformer comprises a second portion of the primary winding and a second portion of the secondary winding. 4. 3. The integrated magnetic structure of Claim 2, wherein the second portion of the primary winding and the second portion of the secondary winding vertically overlap each other.The integrated magnetic structure of any of Claims 1-3, wherein the primary winding surrounds the secondary winding. 5. The integrated magnetic structure of any of Claims 1-4, wherein at least one of the primary winding or the secondary winding comprises an interleaved winding structure. 6. The integrated magnetic structure of any of Claims 1-5, wherein the center post is vertically disposed at a center position of the bottom core of the inductor portion. 7. The integrated magnetic structure any of Claims 1-6, wherein the one or more posts, the transformer, the inductor portion, and the center post are disposed in a fully enclosed housing.
TSLA.712WO PATENT 8. The integrated magnetic structure of any of Claims 1-7, wherein a flux shaping air gap is formed on each post of the one or more posts and the center post. 9. The integrated magnetic structure of any of Claims 1-8, wherein a flux shaping air gap is formed on the center post. 10. The integrated magnetic structure of any of Claims 1-9, wherein two or more symmetric air gaps are formed on the inductor portion. 11. The integrated magnetic structure of any of Claims 1-10, further comprising a metal shield plate disposed adjacent to the one or more posts and configured to at least partially shield a stray magnetic field. 12. An integrated magnetic structure comprising: a top core; a bottom core; one or more posts interposed between the top core and the bottom core; an inductor portion comprising a center post and a flux shaping plate disposed on top of the center post; and a transformer integrated with the inductor portion by sharing a post of the one or more posts. 13. The integrated magnetic structure of Claim 12, wherein the inductor portion further comprises a first portion of a primary winding and a first portion of a secondary winding, and wherein the transformer comprises a second portion of the primary winding and a second portion of the secondary winding. 14. The integrated magnetic structure of Claim 13, wherein the primary winding is configured to surround the secondary winding.
TSLA.712WO PATENT 15. The integrated magnetic structure of any of Claims 13-14, wherein the second portion of the primary winding and the second portion of the secondary winding vertically overlap each other. 16. The integrated magnetic structure of any of Claims 12-15, wherein a flux shaping air gap is formed on each post of the one or more posts and the center post. 17. The integrated magnetic structure of any of Claims 12-15, wherein a flux shaping air gap is formed on the center post. 18. An integrated magnetic structure comprising: a top core comprising a first portion and a second portion, the first portion and the second portion of the top core having different heights and disposed at different levels; a bottom core; one or more posts interposed between the top core and the bottom core; an inductor portion comprising a center post, a first portion of a primary winding, and a first portion of a secondary winding, the center post different from and spaced apart from the one or more posts; and a transformer disposed between the second portion of the top core and the bottom core, the transformer comprising a second portion of the primary winding and a second portion of the secondary winding. 19. The integrated magnetic structure of Claim 18, wherein a flux shaping air gap is formed on each post of the one or more posts and the center post. 20. The integrated magnetic structure of Claim 18, wherein a flux shaping air gap is formed on the center post. 21. The integrated magnetic structure of any of Claims 18-20, wherein a first portion of the top core is disposed on top of the transformer, and wherein the second portion of the top core is disposed on top of the inductor portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363483418P | 2023-02-06 | 2023-02-06 | |
| PCT/US2024/014463 WO2024167845A1 (en) | 2023-02-06 | 2024-02-05 | Novel planar pcb integrated transformers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4662685A1 true EP4662685A1 (en) | 2025-12-17 |
Family
ID=90364999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP24711698.1A Pending EP4662685A1 (en) | 2023-02-06 | 2024-02-05 | Novel planar pcb integrated transformers |
Country Status (5)
| Country | Link |
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| EP (1) | EP4662685A1 (en) |
| JP (1) | JP2026503777A (en) |
| KR (1) | KR20250124888A (en) |
| CN (1) | CN120642005A (en) |
| WO (1) | WO2024167845A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60004311T2 (en) * | 1999-06-15 | 2004-01-29 | Matsushita Electric Industrial Co Ltd | CONTROL ELEMENTS OF AN INCREASE TRANSFORMER IN A MAGNETRON AND SUPPLY CURRENT CONTROL DEVICES FROM A TRANSFORMER IN A MAGNETRON |
| JP6237269B2 (en) * | 2014-01-28 | 2017-11-29 | Tdk株式会社 | Reactor |
| CN106057433B (en) * | 2016-06-28 | 2018-03-16 | 华为技术有限公司 | Magnetic integrated device, N phases LLC harmonic conversions circuit and power supply change-over device |
| US11404967B2 (en) * | 2018-06-12 | 2022-08-02 | Virginia Tech Intellectual Properties, Inc. | Interleaved converters with integrated magnetics |
| JP7182513B2 (en) * | 2019-05-24 | 2022-12-02 | 株式会社Soken | Magnetic components and power converters equipped with the same |
| CN213988538U (en) * | 2020-12-30 | 2021-08-17 | 成都金之川电子有限公司 | Resonance inductor transformer integrated device |
| US20230005653A1 (en) * | 2021-07-04 | 2023-01-05 | The Research Foundation For The State University Of New York | High frequency integrated planar magnetics for a bidirectional ac to dc cllc resonant converter |
-
2024
- 2024-02-05 CN CN202480010826.8A patent/CN120642005A/en active Pending
- 2024-02-05 WO PCT/US2024/014463 patent/WO2024167845A1/en not_active Ceased
- 2024-02-05 KR KR1020257024960A patent/KR20250124888A/en active Pending
- 2024-02-05 JP JP2025545084A patent/JP2026503777A/en active Pending
- 2024-02-05 EP EP24711698.1A patent/EP4662685A1/en active Pending
Also Published As
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|---|---|
| CN120642005A (en) | 2025-09-12 |
| WO2024167845A1 (en) | 2024-08-15 |
| KR20250124888A (en) | 2025-08-20 |
| JP2026503777A (en) | 2026-01-29 |
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