EP4649511A1

EP4649511A1 - High-voltage transformers, devices for generating high voltages and medical devices

Info

Publication number: EP4649511A1
Application number: EP24756340.6A
Authority: EP
Inventors: Biao Luo; Guoping ZHU; Haibo Li
Original assignee: Shanghai United Imaging Healthcare Co Ltd
Current assignee: Shanghai United Imaging Healthcare Co Ltd
Priority date: 2023-02-13
Filing date: 2024-02-12
Publication date: 2025-11-19
Also published as: WO2024169969A1

Abstract

The present disclosure discloses a device for generating a high voltage, a high-voltage transformer and a medical device. The device for generating a high voltage (100) comprising: a liquid insulation medium (110); a high-voltage transformer (120) disposed in the liquid insulation medium (110), the high-voltage transformer (120) including at least one primary winding (121), a plurality of secondary windings (122), and at least one magnetic column (123), wherein the at least one primary winding (121) is around the at least one magnetic column (123) and the plurality of secondary windings (122) are spacedly disposed on the at least one magnetic column (123), and the plurality of secondary windings (122) are stacked to allow the liquid insulation medium (110) to flow between different secondary windings.

Description

HIGH-VOLTAGE TRANSFORMERS, DEVICES FOR GENERATING HIGH VOLTAGES AND MEDICAL DEVICES

CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority to Chinese Patent Application No. CN 202310108960.9, filed on February 13, 2023 and Chinese Patent Application No. CN 202310105157. X, filed on February 13, 2023, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to the technical field of a transformer and, in particular, to a high-voltage transformer, a device for generating a high voltage, and a medical device including thereof.

BACKGROUND

In a device for generating a high voltage, an alternating low voltage may be converted to a direct high voltage through the voltage boosting of a high-voltage transformer and the rectification of a rectification circuit. In order to avoid partial discharges and short circuits between a high voltage component and a low voltage component, an insulation component with complex structure is usually required. However, the design and production cost of the complex insulation component is high, and the oil circulation and heat dissipation efficiency is low, which is not conducive to the device for generating a high voltage to work for a long time with high power.

SUMMARY

One embodiment of the present disclosure provides a device for generating a high voltage, comprising: a high-voltage transformer disposed in a liquid insulation medium, the high-voltage transformer including at least one primary winding, a plurality of secondary windings, and at least one magnetic column, wherein the at least one primary winding is disposed around the at least one magnetic column and the plurality of secondary windings are spacedly disposed on the at least one of the magnetic column , to allow the liquid insulation medium to flow between different secondary windings.
One embodiment of the present disclosure provides a high-voltage transformer, comprising: at least one magnetic column; at least one primary winding; and a plurality of secondary windings corresponding to the at least one primary winding, wherein the at least one primary winding is disposed around the at least one magnetic column and the plurality of secondary windings are spacedly disposed on the at least one of the magnetic column, the plurality of secondary windings corresponding to the at least one primary winding are stacked, and the plurality secondary windings are disposed on at least one printed circuit board (PCB) , and each of the plurality of secondary windings includes at least one coil.
One embodiment of the present disclosure provides a medical device, comprising a high- voltage transformer.

BRIEF DESCRIPTION OF THE DRAWINGS

This description will be further explained in the form of exemplary embodiments, which will be described in detail by means of accompanying drawings. These embodiments are not restrictive, in which the same numbering indicates the same structure, wherein:
FIG. 1 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 2 is a curve diagram illustrating a relationship between a width of an oil channel and a strength of a starting local discharge field according to some embodiments of the present disclosure;
FIG. 3 is a schematic diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 4 is a schematic diagram illustrating a circuit connection of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 5 is a schematic diagram illustrating a U-shaped connection according to some embodiments of the present disclosure;
FIG. 6 is a schematic diagram illustrating a Z-shaped connection according to some embodiments of the present disclosure;
FIG. 7 is a schematic diagram illustrating a circuit connection of a rectification circuit according to some embodiments of the present disclosure;
FIG. 8 is a schematic diagram illustrating a layout of a rectification circuit according to some embodiments of the present disclosure;
FIG. 9 is a schematic diagram illustrating an internal structure of a device for generating a high voltage, according to some other embodiments of the present disclosure;
FIG. 10 is a schematic diagram illustrating a connection method of a U-shaped connection according to some other embodiments of the present disclosure;
FIG. 11 is a schematic diagram illustrating a connection method of a Z-shaped connection according to some other embodiments of the present disclosure;
FIG. 12 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some embodiments of the present disclosure;
FIG. 13 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some other embodiments of the present disclosure;
FIG. 14 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some other embodiments of the present disclosure;
FIG. 15 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some other embodiments of the present disclosure;
FIG. 16 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some other embodiments of the present disclosure;
FIG. 17 is a schematic diagram illustrating a cross-section of a high-voltage transformer according to some other embodiments of the present disclosure;
FIG. 18 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 19 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage, according to some embodiments of the present disclosure;
FIG. 20 is a schematic diagram illustrating a cross-section of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 21 is an exemplary structural block diagram illustrating a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 22 is an exemplary internal structure block diagram illustrating a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 23 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure;
FIG. 24 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage, according to some embodiments of the present disclosure;
FIG. 25 is a top perspective diagram illustrating a connection structure between a high-voltage transformer 120 and a plurality of rectification circuits according to some embodiments of the present disclosure;
FIG. 26 is a top perspective diagram illustrating a connection structure between a high-voltage transformer 120 and a plurality of rectification circuits according to some embodiments of the present disclosure;
FIG. 27 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 according to some embodiments of the present disclosure;
FIG. 28 is a schematic diagram illustrating a plurality of rectification circuits connected in series through resistors, according to some embodiments of the present disclosure;
FIG. 29 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 including a plurality of PCBs, according to some embodiments of the present disclosure;
FIG. 30 is a top perspective diagram illustrating a high-voltage transformer 120 including a plurality of PCBs, according to some embodiments of the present disclosure;
FIG. 31 is a schematic diagram illustrating another connection between a high-voltage transformer 120 and a plurality of rectification circuits according to some other embodiments of the present disclosure;
FIG. 32 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 including a plurality of PCBs, according to some other embodiments of the present disclosure; and
FIG. 33 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 including a plurality of PCBs, according to some other embodiments of the present disclosure.

DETAILED DESCRIPTION

The technical schemes of embodiments of the present disclosure will be more clearly described below, and the accompanying drawings need to be configured in the description of the embodiments will be briefly described below. Obviously, the drawings in the following description are merely some examples or embodiments of the present disclosure, and will be applied to other similar scenarios according to these accompanying drawings without paying creative labor. Unless obviously obtained from the context or the context illustrates otherwise, the same numeral in the drawings refers to the same structure or operation.
It should be understood that the "system" , "device" , "unit" and /or "module" used herein is a method for distinguishing different components, elements, components, parts or assemblies of different levels. However, if other words may achieve the same purpose, the words may be replaced by other expressions.
As shown in the present disclosure and claims, unless the context clearly prompts the exception, "a" , "one" , and/or "the" is not specifically singular, and the plural may be included. It will be further understood that the terms “comprise, ” “comprises, ” and/or “comprising, ” “include, ” “includes, ” and/or “including, ” when used in present disclosure, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The flowcharts are used in present disclosure to illustrate the operations performed by the system according to the embodiment of the present disclosure. It should be understood that the preceding or following operations is not necessarily performed in order to accurately. Instead, the operations may be processed in reverse order or simultaneously. Moreover, one or more other operations may be added to the flowcharts. One or more operations may be removed from the flowcharts.
FIG. 1 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure. As shown in FIG. 1, in some embodiments, the device for generating a high voltage 100 may include a high-voltage transformer 120, disposed in a liquid insulation medium 110 in the device.
In some embodiments, the high-voltage transformer 120 includes at least one primary winding 121, a plurality of secondary windings 122, and at least one magnetic column 123; the at least one primary winding 121 is disposed around the at least one magnetic column 123 and the plurality of secondary windings 122 are spacedly disposed on the at least one of the magnetic column 123 to allow the liquid insulation medium to flow between different secondary windings. For ease of understanding, that “two secondary windings 122 are spacedly disposed” refers to that the two secondary windings 122 are disposed around one or more magnetic columns and they are apart from each other by an interval. Specifically, the two secondary windings 122 may be apart from each other in the extension direction of the magnetic column (s) where the two secondary windings 122 are disposed around, and in such case, the two secondary windings can also be considered as being stacked with a gap.
Based on the principle of electromagnetic induction, when an alternating current passes through the at least one primary winding 121, an alternating magnetic field is generated in the at least one magnetic column 123, the magnetic field is transmitted to the plurality of secondary windings 122 through the at least one magnetic column 123, and the plurality of secondary windings 122 generates an electromotive force and outputs a corresponding voltage. When a primary voltage and a count of coil turns of the at least one primary winding 121 are determined, output voltages of different secondary windings 122 are proportional to the counts of coil turns of the plurality of secondary windings 122. The output voltages of the plurality of secondary windings 122 may be stacked to obtain a total output voltage, realizing a high voltage transformation from the at least one primary winding 121 to the plurality of secondary windings 122.
In some embodiments, by replacing a small count (e.g., 1 or 2) of secondary windings 122 with a large count of turns by the plurality of secondary windings 122 with a small count of turns, thereby reducing the count of coil turns in each secondary winding 122, an output voltage of a single secondary winding 122 may be decreased, thereby decreasing a voltage difference between adjacent secondary windings 122, thereby decreasing an insulation requirement between the adjacent secondary windings 122. In this case, an insulation component that is simpler and has a lower insulation level, such as the liquid insulation medium 110, may be used to realize the insulation of the device for generating a high voltage 100.
Exemplarily, assuming that the overall secondary windings of the high voltage transformer 120 has an output voltage of A, by setting N secondary windings 122 of fewer turns in series, a voltage difference between two adjacent secondary windings is A/N, which reduces the voltage difference between the adjacent secondary windings 122, and thereby reduces the requirement for insulation between the adjacent secondary windings 122 by insulation medium (e.g., the liquid insulation medium flowing between the two adjacent secondary windings, or, a flat insulation component) .
It should be noted that, in order to ensure the insulation of the adjacent secondary windings, the breakdown voltage B of the liquid insulation medium flowing through the secondary windings (or the breakdown voltage B of a flat insulation component in the case that the flat insulation component is used for the insulation purpose) , needs to be greater than the voltage difference A/N between the two adjacent secondary windings. In other words, the count of the secondary windings, N, correlates to the breakdown voltage of the insulation medium (e.g., the flat insulation component, the liquid insulation medium) of the two adjacent secondary windings. Exemplarily, when an output voltage of the overall secondary windings is A, assuming that N secondary windings 122 are provided, then the breakdown voltage B of the liquid insulation medium and the flat insulation component needs to be greater than the voltage difference between the two adjacent secondary windings A/N. For more information on the breakdown voltage, please refer to the relevant description below.
The at least one primary winding 121 may also be referred to as an elementary winding or a primary winding. The at least one primary winding 121 may be winded on the at least one magnetic column 123 in a certain direction and position by a copper wire, an aluminum wire, an enameled wire, a silk-coated wire, a Leeds wire, or other materials.
The plurality of secondary windings 122 may also be referred to as subordinate windings or secondary windings. The material and fabrication of the plurality of secondary windings 122 may refer to the material and fabrication of the at least one primary winding 121.
In some embodiments, each of the plurality of secondary windings 122 is separately connected to a corresponding rectification circuit, and rectification circuits corresponding to two adjacent secondary windings 122 are in series connection. For more information on the rectification circuits, please refer to FIG. 3 and its related descriptions.
In some embodiments, the plurality of secondary windings 122 are disposed on at least one printed circuit board (PCB) , and each of the plurality of secondary windings 122 and the corresponding rectification circuits are disposed on a same PCB.
Various ways of arranging the plurality of secondary windings 122 on the at least one PCB include, for example, using plug-in windings as the plurality of secondary windings 122, which are disposed and soldered to the at least one PCB. As another example, wires printed on a metal layer of the at least one PCB in a specific manner are utilized as the plurality of secondary windings 122 etc., the specific manner includes a helical wiring, etc. As another example, copper foil tapes are utilized as the winding wires, and the copper foil tapes are pasted or fixed to the at least one PCB, etc.
In some embodiments, the plurality of secondary windings 122 may be disposed on a single PCB. For example, different secondary windings 122 are disposed on different layers of the PCB, or two or more secondary windings 122 are disposed on a same layer.
In some embodiments, the plurality of secondary windings 122 may be disposed on a plurality of PCBs. For example, each of the plurality of secondary windings 122 is disposed on an independent PCB, or some of the plurality of secondary windings 122 are disposed on a same PCB, and some of the plurality of secondary windings 122 are disposed on a different or other PCBs, and so on.
Each of the plurality of secondary windings 122 and its corresponding rectification circuit may be disposed on the same PCB. That is, if a secondary winding 122 is disposed on a specific PCB, as shown in FIG. 25, the rectification circuit corresponding to that secondary winding 122 may be wired in any of signal layers of the specific PCB, and a soldered component in the rectification circuit may be provided on a top layer of the specific PCB, and can be connected to the wiring by means of punched holes. In some embodiments, different secondary windings 122 of the plurality of secondary windings 122 are disposed in different layers of the same PCB, the rectification circuits corresponding to each secondary winding 122 may be wired in a signal layer of the same PCB that is corresponding to a layer in which the corresponding secondary winding 122 is disposed, and soldered components of each rectification circuit can be disposed on the top layer or bottom layer of the same PCB, and are connected to the wiring of each of the rectification circuits by means of punched holes. Alternatively, the rectification circuits corresponding to the plurality of secondary windings 122 may be jointly wired on the top layer of the PCB, with the soldered components in each rectification circuit being provided on the top layer, and the rectification circuits being connected to the corresponding secondary windings 122 by means of connecting wires as shown in FIG. 26.
In the embodiments of the present disclosure, by arranging the plurality of secondary windings 122 and their corresponding rectification circuits on different PCBs, different secondary windings 122 can be realized to be disposed in stacked manner, providing space to facilitate the liquid insulation medium 110 to perform its insulation function.
In some embodiments, an insulation layer in the PCB may be used to electrically isolate the two adjacent secondary windings 122. The insulation layer in the PCB may fulfill the function of a flat insulation component. For more information on the flat insulation component, please refer to the following description.
In some embodiments, in the case of reducing an output voltage of a single secondary winding, without the need to additionally arrange other complex insulation components, the PCB on which the secondary windings 122 and the rectification circuits are located may be utilized to realize the insulation between the two adjacent secondary windings 122, thereby reducing the production cost of the high-voltage transformer 120.
In some embodiments, each of the plurality of secondary windings 122 includes at least one coil.
The at least one coil is a wire winding in the shape of a ring with ports on the inside and outside of the ring. The at least one coil may be obtained by wiring in a certain direction, such as from the outside to the inside based on a clockwise direction or a counterclockwise direction. In some embodiments, the at least one coil may be wire wrapped, Leeds wire wound, copper foil coiled, etc., and may also be disposed on the PCB.
Coils of the at least one primary winding 121 may be disposed around the at least one magnetic column 123 and the plurality of secondary windings 122 may be spacedly disposed on the at least one of the magnetic column 123, and based on the principle of electromagnetic induction, when an alternating magnetic field is transmitted to the plurality of secondary windings 122 through the at least one magnetic column 123, the coils may generate an electric potential in a corresponding direction based on the alternating magnetic field, thereby outputting a voltage through two ports.
In some embodiments, each of the plurality of secondary windings 122 may include a coil. For example, coils of one secondary winding 122 may be disposed in a signal layer of the PCB, and each of the plurality of secondary windings 122 may be connected to input ends of the rectification circuit through each of the two ports of one coil, as shown in FIG. 21.
In some embodiments, each of the plurality of the secondary windings 122 may include a plurality of coils. The plurality of coils of the plurality of the secondary windings 122 may be disposed on a single PCB or on a plurality of PCBs, and the way the coils are disposed on the PCBs may be referred to the way the plurality of secondary windings 122 are disposed on the PCBs as described above. Each of the plurality of the secondary windings 122 may be connected to input ends of the rectification circuit through ports of two of the plurality of coils, respectively. For example, as shown in FIG. 22, the secondary windings disposed on the same PCB may be connected to the input ends of the rectification unit through the port a and port b of the two coils, respectively.
In some embodiments, at least two of the plurality of coils are electrically connected to each other. The at least two coils are electrically connected to each other in a variety of ways. For example, adjacent coils are electrically connected via inner ring ports (as shown in FIG. 22, adjacent coils may be electrically connected via the inner ring ports (e.g., port c, port d) ) , or are electrically connected via outer ring ports, or via an inner ring port of one coil electrically connected to an outer ring port of the other coil.
The two adjacent coils in one secondary winding 122 may have same or opposite wiring directions. For example, one of the two adjacent coils is wired counterclockwise and the other is wired clockwise, as shown in the adjacent coils 1 and 2 in FIG. 23, the direction from outside to inside is counterclockwise for coil 1 and clockwise for coil 2.
In the embodiments of the present disclosure, by designing features such as a connection method and wiring direction of the coil, the consistency between different coils may be improved, thereby improving the quality of the output voltages of the plurality of secondary windings 122.
In some embodiments, two adjacent secondary windings are respectively disposed on a plurality of the PCBs. One secondary winding of the two adjacent secondary windings includes a first coil, and the other secondary winding of the two adjacent secondary winding includes a second coil. The first coil and the second coil are positioned adjacent to each other, and the first coil and the second coil are staggered.
The “staggered” means that positions of wires of the two coils are staggered in a certain direction (e.g., a radial direction) , reducing an effective overlap area of the two adjacent coils, thereby reducing a parasitic capacitance between the secondary windings 122. The parasitic capacitance is a capacitance formed due to the proximity of the adjacent coils to each other, and a magnitude of the capacitance is affected by the effective overlap area of the adjacent coils. For example, a larger effective overlap area of the adjacent coils would increase the parasitic capacitance between the adjacent coils.
For adjacent secondary windings 122, staggering the two adjacent coils located in the different secondary windings 122 may make the effective overlap area of the two adjacent coils decrease, thereby reducing the parasitic capacitance between the adjacent secondary windings 122. For example, as shown in FIG. 20, the staggered setting of the two adjacent coils in the secondary winding 1 and the secondary winding 2, i.e., the staggering of the radial position between the coils disposed in layers 2 and 3 of the PCB, may decrease the effective overlap area between the coils of the second and third layers, thereby, the parasitic capacitance between the coils of the layers 2 and 3 is reduced. The radial direction may be a stacking direction of the secondary windings. For more information on the stacking direction, please refer to the following description.
In the embodiments of the present disclosure, by staggering the two adjacent coils of the adjacent secondary windings 122, the effective overlap area of the two coils may be reduced, and thus the parasitic capacitance between the secondary windings 122 may be reduced, which is suitable for scenarios where the high-voltage transformer 120 is operated at a high frequency.
In some embodiments, for adjacent secondary windings 122, current flows are the same direction in the two adjacent coils. For example, a flow direction of current in a first coil and a flow direction of current in a second coil are the same, wherein the first coil and the second coil belong to two adjacent secondary windings of the plurality of secondary windings, respectively, and the first coil is adjacent to the second coil. Furthermore, and the two adjacent secondary windings are disposed on two adjacent PCBs of a plurality of PCBs.
In scenarios of electromagnetic induction, the directions of the current flows generated by the two coils may be influenced by a direction of the alternating magnetic field and a direction in which the coils are winded. For example, the same wiring direction of two coils with the same direction of the received magnetic fields may result in the same direction of current flows generated in the two coils.
For the adjacent secondary windings 122, the directions of the current flows in the two adjacent coils are the same, which may cause a voltage between the corresponding adjacent secondary windings 122 to be a direct current voltage. For example, as shown in FIG. 23, in adjacent secondary winding a and secondary winding b, the coil 2 of the secondary winding a and the coil 3 of the secondary winding b are adjacent to each other, and wiring directions of both the coil 2 and the coil 3 are counterclockwise from the outside to the inside, so that the currents generated by the coil 2 and the coil 3 have the same flow direction, and the voltage Vab between the secondary winding a and the secondary winding b is the direct current voltage, thereby reducing the dielectric loss caused by different polarization directions.
In the embodiments of the present disclosure, for the adjacent secondary windings 122, by controlling the current flows in the adjacent two coils to flow in the same direction, the voltage between the adjacent two coils in the two adjacent secondary windings 122 may be made to be the direct current voltage, so that the dielectric loss brought about by the high-frequency alternating current may be reduced, and the boosting efficiency may be improved.
In some embodiments, at least one of the plurality of secondary windings 122 includes at least two coils, the at least two coils being electrically connected to each other. The at least two coils may be distributed in different layers of the PCB and the currents in the at least two coils generate magnetic fields in the same direction.
In some embodiments, some of the plurality of secondary windings 122 may include two, three, or other plurality of counts of coils, and the other secondary windings 122 may include a single coil. Alternatively, each of the secondary windings 122 in the plurality of secondary windings 122 may include a plurality of coils.
In some embodiments, the at least two coils of a secondary windings 122 are distributed on different layers of the PCB, and the at least two coils may be electrically connected to each other in a variety of ways. For example, the at least two coils may be electrically connected via a peripheral connecting wire through through-holes in the PCB, or the at least two coils may be electrically connected via wires within the PCB. For more information on the electrical connection between the at least two coils and the distribution of the coils, please refer to the foregoing description thereof.
For a single secondary winding 122, the magnetic fields generated by the currents in the at least two coils are in the same direction, preventing the magnetic fields from canceling each other out, thereby increasing the current in the same secondary winding 122. Correspondingly, in some embodiments, the wiring directions of two adjacent coils in the at least two coils in a single secondary winding 122 may be reversed so that the current directions of the currents in the adjacent two coils are the same. For example, as shown in FIG. 23, coil 1 in the secondary winding a is wired counterclockwise from the outside to the inside, and coil 2 in the secondary winding a is wired clockwise from the outside to the inside, and when coils 1 and 2 receive a same alternating magnetic field, coils 1 and 2 may generate currents in the same direction such that magnetic fields generated by the currents in coils 1 and 2 are in the same direction. For more information on the same direction of the magnetic fields generated by the currents in the at least two coils, please refer to FIGs. 22 to 24 below and their related descriptions.
In the embodiments of the present disclosure, for the at least two coils of the same secondary winding 122, different coils may be disposed with the same direction of current, thereby making the different coils produce the same direction of magnetic field, avoiding the magnetic fields from canceling each other out, and thus increasing the current in the same winding.
In some embodiments, two adjacent coils of the at least two coils of a single secondary winding 122 may be staggered.
In a secondary winding 122, staggering two adjacent coils in the secondary winding 122 may cause an effective overlap area of the two adjacent coils to be reduced, thereby reducing a parasitic capacitance between the two adjacent coils. For example, as shown in FIG. 20, the staggered setting of two adjacent coils in the secondary winding 2, i.e., the staggered setting between the coils located in layers 3 and 4 of the PCB, may reduce the effective overlap area between the coils in layers 3 and 4, thus reducing the parasitic capacitance between the coils in layers 3 and 4, which is equivalent to reducing the parasitic capacitance between the coils inside the secondary winding 122. For more information on the staggered setting of the adjacent coils, please refer to its related description above.
In the embodiments of the present disclosure, by staggering two adjacent coils in the secondary winding 122, an effective overlap area of the two coils may be reduced, thereby reducing a parasitic capacitance of the coils inside the secondary winding 122, which is suitable for scenarios in which the high-voltage transformer 120 is operated at a high frequency.
In some embodiments, a count of PCBs may be at least two, and rectification circuits in two adjacent PCBs are in series connection.
In some embodiments, the rectification circuits in the two adjacent PCBs may be in series connection in a variety of ways, such as through one or more electrical connections such as connection plates, wires, etc.
For example, as shown in FIG. 27, the high-voltage transformer 120 may include one primary winding 121 and n secondary windings 122, m secondary windings 122 are disposed on each PCB, the n/m PCBs may be stacked, and the primary winding 121 is disposed around the at least one magnetic column and all of the secondary windings 122 are spacedly disposed on the at least one of the magnetic column 123. In some embodiments, each of the plurality of secondary windings 122 is connected to a corresponding rectification circuit, each of the plurality of secondary windings 122 and its corresponding rectification circuit are disposed on a same PCB, rectification circuits of two adjacent PCBs may be in series connection. The rectification circuits of the two adjacent PCBs are connected to each other by a connection plate. For more information on the rectification circuits, please refer to FIG. 3 and its related description.
In the embodiments of the present disclosure, by arranging a plurality of PCBs and arranging the plurality of secondary windings 122 on the plurality of PCBs, and by connecting rectification circuits of two adjacent PCBs in series, a voltage difference between adjacent PCBs may be reduced, and the insulation cost may be reduced, and the production cost of the high-voltage transformer 120 may be reduced accordingly.
In some embodiments, the rectification circuits of the two adjacent PCBs may be in series connection through a resistor. In some embodiments, the resistor may enable a series connection of the direct current high voltage in each layer of the plurality of PCBs and limit a discharge current generated in the event of a short-circuit fault in a back-end load. For example, the higher the resistance value of the resistor between the two adjacent PCBs is, the lower the discharge current is. Correspondingly, in some embodiments, the magnitude of the discharge current between the two adjacent PCBs may be adjusted by adjusting the magnitude of the resistance value of the resistor connected in series between the two adjacent PCBs, so as to reduce the dielectric loss between the PCBs. In some embodiments, the magnitude of the resistance value of the resistor may lie within a preset resistance value range, and the preset resistance value range may be set according to a resistance value of the plurality of secondary windings and/or a resistance value of the rectification circuits. Further, in order to more effectively realize insulation between two adjacent secondary windings 122, a ratio of the voltage difference between the two adjacent secondary windings 122 to a breakdown voltage of the flat insulation component between the two adjacent secondary windings 122 is less than 1/3.
In the embodiments of the present disclosure, the magnitude of the current between two adjacent PCBs may be adjusted by adjusting the magnitude of the resistance value of the resistor in series connection, so as to regulate the dielectric loss of the medium between the PCBs in the electric field, and to improve the working efficiency of the high-voltage transformer 120.
It should be noted that in the above-described adjacent PCBs, adjacent secondary windings, and adjacent coils, the “adjacent” refers to being adjacent in the stacking direction. For example, two adjacent PCBs are two PCBs that are adjacent in the stacking direction. For more information on the stacking direction, please refer to the following description.
The stacking setting may refer to the plurality of secondary windings 122 having a hierarchical relationship, each level including at least one secondary winding 122, and secondary windings 122 of different levels may partially or fully overlap with each other in a certain direction in space. In some embodiments, the stacking setting may include at least one of a vertical stacking, a diagonal stacking, a staggered stacking, etc.
The vertical stacking refers to taking a vertical direction of a reference surface (e.g., a bottom surface, a top surface, etc. ) of the high-voltage transformer device as the stacking direction, and projections of the plurality of secondary windings 122 in the stacking direction overlap each other. The diagonal stacking refers to taking a direction with a certain inclination angle from the vertical direction of the reference surface of the high-voltage transformer device as the stacking direction, and the projections of the plurality of secondary windings 122 in the stacking direction overlap each other. The staggered stacking refers to that at least one of the plurality of secondary windings 122 is moderately offset in a direction normal to the stacking direction when different levels of the plurality of secondary windings 122 are stacked on top of each other along a certain stacking direction.
In some embodiments, when stacked, a certain amount of leaving space may be left between the different secondary windings 122, and the leaving space may include at least one of spacing leaving space, staggered leaving space, inclined leaving space, etc. The spacing leaving space may be a gap of a certain height between two adjacent secondary windings 122. The staggered leaving space may be that a minimum coil radius of one of the two adjacent secondary windings 122 is larger than a maximum coil radius of the other secondary winding 122, such that a gap of a certain distance is provided between the adjacent secondary windings 122 in a reference projection plane (e.g., a plane vertical to the stacking direction) . The inclined leaving space may be a certain space between the two adjacent secondary windings 122 by way of inclination, e.g., if one of the plurality of secondary windings 122 has an angle of inclination of 5° with respect to the stacking direction, and the other secondary winding 122 has an angle of inclination of 20° with respect to the stacking direction, the two may be left with a certain space by a difference of inclination of 15° (i.e., 20°) .
Among the plurality of secondary windings 122 disposed in a stacked manner, a count of coil turns of the plurality of secondary windings 122 disposed in different layers, insulation distances between the plurality of secondary windings 122 disposed in different layers and the at least one primary winding 121, and insulation distances between the plurality of secondary windings 122 and the magnetic columns 123, etc., may be disposed in a variety of ways, as described in more detail in FIG. 12 to FIG. 17 and their related descriptions.
The liquid insulation medium 110 is a liquid having an insulation function, for example, at least one of an aromatic synthetic oil, a silicone oil, an ester oil, etc. In some embodiments, the liquid insulation medium 110 may be distributed between different secondary windings 122, providing an insulation environment for the different secondary windings 122, electrically isolating the different secondary windings 122, and thereby insulating adjacent secondary windings 122 from each other.
In some embodiments, the liquid insulation medium 110 may flow between the different secondary windings 122 in various ways, for example, at least one of a wrap-around flow, a gap flow, a permeable flow, etc. The wrap-around flow may refer to the liquid insulation medium 110 flowing around the plurality of secondary windings 122, e.g., along an outer edge or surface of the plurality of secondary windings 122 as a whole, to realize the flow between the different secondary windings 122. The gap flow may refer to the liquid insulation medium 110 filling and flowing in spaces left between the different secondary windings 122, realizing the flow between the different secondary windings 122. The permeable flow may refer to the liquid insulation medium 110 flowing through gaps between coils of each of the plurality of secondary windings 122, realizing the flow between the different secondary windings 122.
In some embodiments, when a primary voltage of the high-voltage transformer 120, a count of coil turns of the at least one primary winding 121, a count of secondary windings 122, and a count of coil turns of the secondary winding 122 are determined, a distance between adjacent secondary windings 122 may be determined based on the liquid insulation medium 110 and/or other insulation medium between adjacent secondary windings 122. For example, the distance between the adjacent secondary windings 122 is not less than a breakdown distance of the liquid insulation medium 110 between the adjacent secondary windings 122. The distance between the adjacent secondary windings 122 is a flow width of the liquid insulation medium 110 provided between the adjacent secondary windings 122, such as an oil channel width, a liquid conduit width, etc. The breakdown distance is a minimum flow width required for the liquid insulation medium 110 to perform insulation.
Since an output voltage of the plurality of secondary windings 122 of the transformer is related to a turns ratio of the transformer, a decrease in the count of coil turns of the plurality of secondary windings 122 results in a decrease in the output voltage of the plurality of secondary windings 122. In some embodiments, if a total count of coil turns of the plurality of secondary windings 122 remains unchanged, the count of coil turns of a single secondary winding 122 may be reduced by increasing the count of the plurality of secondary windings 122, so that an output voltage of a single secondary winding 122 is smaller, and thus a voltage difference between adjacent secondary windings 122 is smaller, which in turn may simplify the insulation design of the plurality of secondary windings 122.
FIG. 2 is a curve diagram illustrating a relationship between a width of an oil channel and a strength of an initial local discharge field according to some embodiments of the present disclosure. As shown in FIG. 2, taking the liquid insulation medium 110 to be an insulation oil as an example, the slopes of the curves 1-4 may reflect a correspondence between the width of the oil channel and the strength of the initial local discharge field in a scenario in which degassed oil or gas-saturated oil is provided in an insulated electrode or an uninsulated electrode. The strength of the initial local discharge field is a voltage difference between two adjacent secondary windings 122 at a unit distance. As shown in FIG. 2, if only two secondary windings 122 are used, when the width of the oil channel is 10 mm, the strength of the initial local discharge field of the plurality of secondary windings 122 is about 5 kV/mm, and then the voltage difference between these two secondary windings 122 is 50 kV. In other words, when the voltage difference between the two secondary windings 122 is 50kV, at least 10mm of width of the oil channel needs to be reserved for the insulation oil, otherwise the insulation oil is punctured.
If six secondary windings 122 are used to replace the above two secondary windings 122, in the case where the total count of coil turns remains unchanged, the voltage difference between two adjacent secondary windings 122 among the six secondary windings 122 is 10kV. As shown in FIG. 2, when the voltage difference between two adjacent secondary windings 122 is 10 kV, a 1 mm width of the oil channel for the insulation oil between the two secondary windings 122 may meet the insulation requirements, and a total of 5 mm width of the oil channel between the six secondary windings 122 disposed in a stacked manner is sufficient.
It can be seen that the use of the six secondary windings 122 saves space by reducing the use of insulation oil compared to the use of only two secondary windings 122.
In the device for generating a high voltage provided in the embodiments, a plurality of secondary windings 122 are disposed in a stacked manner, so that different secondary windings 122 form a stacked insulation structure. The liquid insulation medium 110 inside the device for generating a high voltage may flow between the different secondary windings 122, which is conducive to exhausting the air when injecting the liquid insulation medium 110, avoiding residual air bubbles leading to a breakdown of the insulation structure, and also bringing out the heat generated inside the device for generating a high voltage in a timely manner, which improves the heat dissipation efficiency and the reliability of the prolonged working time.
Moreover, for the insulation between the PCBs, the plurality of secondary windings 122, the at least one primary winding 121, and the magnetic core, there is no need to arrange for insulation components of a complex structure, and instead, the insulation may be realized by using an insulation liquid medium through the stacking of the plurality of secondary windings 122, which may save the occupied space of the high-voltage transformer 120 while reducing the cost.
It should be noted that, in the case of a constant output voltage, the more the count of secondary windings 122 corresponding to the at least one primary winding 121, the fewer the count of coil turns of each secondary winding 122, and the smaller the voltage difference between the upper and lower layers of two adjacent secondary windings 122, at which time the use of the liquid insulation medium 110 may be reduced, which in turn may save space. In a specific implementation, the above liquid insulation medium 110 may be an insulation oil, or may be other liquid medium having an insulation function.
In some embodiments, between different secondary windings 122, a flow area of the liquid insulation medium 110 is not less than 25 mm².
In some embodiments, a flat insulation component may be provided between adjacent secondary windings 122.
The flat insulation component is an insulation object having a flat surface in the main body part or the overall structure. For example, the flat insulation component may include at least one of porcelain insulating spacer, silicone rubber insulating plate, plastic insulating plate, mica plate, etc.
In some embodiments of this specification, by arranging a plurality of secondary windings 122 in a stacked manner, a voltage difference between an upper and lower secondary winding 122 may be reduced, and an alternating current component may be reduced, even being approximated as a direct current. Therefore, flat insulation components disposed between the different secondary windings 122 may be selected to be simple and of low insulation strength, which not only saves costs but also does not affect the heat dissipation performance of the high-voltage transformer 120.
In some embodiments, the flat insulation component is an insulation layer of a PCB. That is, the insulation layer in the PCB may fulfill the role of the flat insulation component for electrically isolating two adjacent secondary windings 122.
In the embodiments of the present disclosure, without the need for an additional flat insulation component, the insulation between the two adjacent secondary windings 122 may be realized by using the PCB on which the plurality of secondary windings 122 and the rectification circuits are located, thus reducing the production cost of the high-voltage transformer 120.
In some embodiments, the voltage difference between the two adjacent secondary windings 122 is not greater than a breakdown voltage of the flat insulation component between the two adjacent secondary windings 122. Further, to more efficiently achieve insulation between the two adjacent secondary windings 122, a ratio of the voltage difference between the two adjacent secondary windings 122 to the breakdown voltage of the flat insulation component between the two adjacent secondary windings 122 is less than 1/3.
The breakdown voltage is a critical voltage that causes the dielectric to lose its dielectric properties. In this embodiment, after determining the count of the secondary windings 122, a flat plate insulation component may be selected based on a voltage difference between two adjacent secondary windings 122. For example, a flat plate insulation component with a breakdown voltage greater than the voltage difference is selected, thereby realizing the insulation between the two adjacent secondary windings 122. Correspondingly, a voltage difference between two adjacent secondary windings 122 may also be controlled to be not greater than the breakdown voltage based on the breakdown voltage of the flat plate insulation component.
In the embodiment of the present disclosure, by arranging that the voltage difference between the two adjacent secondary windings 122 is not greater than the breakdown voltage of the flat insulation component, the failure of the dielectric properties of the flat insulation component may be avoided, and thus the insulation between the two adjacent secondary windings 122 may be realized without the need to provide other complex insulation components.
It should be understood that the device for generating a high voltage and its modules shown in FIG. 1 may be implemented utilizing a variety of approaches. For example, in some embodiments, the liquid insulation medium 110 may utilize other types of insulation media that may flow through the secondary windings 122, such as a gaseous insulation medium (e.g., nitrogen, sulfur hexafluoride gas, etc. ) , an insulation gel, etc.
It should be noted that the above description of the device for generating a high voltage and the modules thereof is for descriptive convenience only, and does not limit the present disclosure to the scope of the cited embodiments. It can be understood that for those skilled in the art, after understanding the principle of the device, it may be possible to make any combination of the individual modules, or to constitute a sub-unit to be connected to other modules, without departing from this principle.
FIG. 3 is a schematic diagram illustrating an internal structure of a device for generating a high voltage according to some embodiments of the present disclosure. FIG. 4 is a schematic diagram illustrating a circuit connection of a device for generating a high voltage according to some embodiments of the present disclosure.
In some embodiments, each of the plurality of secondary windings 122 may be separately connected to a corresponding rectification circuit, and rectification circuits corresponding to two adjacent of the plurality of secondary windings 122 are in series connection.
The rectification circuit is a circuit that converts an alternating current electrical energy into a direct current electrical energy. In some embodiments, the rectification circuit may include one or more circuit configurations such as a full bridge rectification circuit, a half bridge rectification circuit, a double voltage rectification circuit, a multiple voltage rectification circuit, etc.
In some embodiments, the rectification circuits may be provided in a variety of ways within the device for generating a high voltage. For example, insulation between adjacent rectification circuits may also be realized by the flat insulation components. As shown in FIG. 3, the rectification circuits may be disposed between same flat insulation component as corresponding secondary windings 122, thereby realizing insulation between adjacent rectification circuits. As another example, each rectification circuit may also be disposed on a same PCB as its corresponding secondary winding 122. As another example, when a plurality of layers of secondary windings 122 are disposed in a stacked manner, the rectification circuits may also be disposed in a stacked manner, and a voltage output from each rectification circuit may be increased step by step from bottom to top, so that a voltage difference between outputs of two adjacent layers of rectification circuits may be reduced, reducing the insulation requirements for the insulation components between the adjacent secondary windings 122.
In some embodiments, the plurality of secondary windings 122 may each output rectified voltages through respective corresponding rectification circuits. A direct current high voltage is then output by connecting the rectified voltages output by the respective rectification circuits in series.
In some embodiments, the plurality of secondary windings 122 may correspond to the rectification circuits one by one. The voltage output from each of the plurality of secondary windings 122 is an alternating current voltage, which may be rectified by the corresponding rectification circuit to obtain a direct current voltage, and a plurality of direct current voltages may be in series connection by connecting the rectification circuits corresponding to every two adjacent secondary windings 122, and the device for generating a high voltage may ultimately output a higher direct current voltage by the accumulation of the plurality of direct current voltages. Exemplarily, as shown in FIG. 4, n rectification circuits corresponding to n secondary windings 122 are in series connection, assuming that a rectification circuit corresponding to one secondary winding 122 may output a direct current voltage of 5kV, the rectification circuits corresponding to n secondary windings 122 may be in series connection to obtain a direct current voltage HV of 5nkV.
In the embodiments of the present disclosure, by arranging the secondary windings 122 to be connected to the corresponding rectification circuits, and by connecting the rectification circuits in series, the plurality of secondary windings 122 are capable of outputting the direct current high voltage, so that the output efficiency of the high-voltage transformer 120 may be improved.
In some embodiments, the output voltage of each secondary winding 122 may be lower than a rated voltage of diodes in the rectification circuit corresponding to the secondary winding 122.
The rated voltage of the diodes is a maximum reverse voltage allowed for the diodes. When a voltage at two ends of the diodes is lower than the rated voltage of the diodes, the diodes may operate normally and realize the rectification function by controlling a direction of the current. In some embodiments, the plurality of secondary windings 122 are disposed so that a count of coil turns of a single secondary winding 122 may be sufficiently small, so that an output voltage of each secondary winding 122 may be lower than a rated voltage of diodes in the rectification circuit corresponding to the secondary winding 122, and thus the rectification circuits corresponding to the plurality of secondary windings 122 may be capable of realizing the rectification of the plurality of secondary windings 122 by utilizing a very small count, for example, a single diode, to rectify the output voltage of each secondary winding 122.
In the embodiments of the present disclosure, by arranging the output voltage of the plurality of secondary windings 122 to be lower than the rated voltage of the diodes, there is no need to arrange a complex rectification component (such as, a chopper circuit, a bridge circuit, etc. ) , and the rectification of the output voltage of the plurality of secondary windings 122 may be realized by utilizing only a small number of diodes, so that the circuit structure of the high-voltage transformer 120 may be simplified.
In some embodiments, as shown in FIG. 7, a rectification circuit 130 may include at least one diode unit 140 and a capacitor unit 150. The at least one diode unit 140 may include a plurality of diodes in series connection. All the diodes in series connection may be divided into multiple diode groups 141, and at least one capacitor is provided between two ends of a diode group 141. The capacitor unit 150 may include a count of at least two capacitors, and the capacitors are in series connection. In some embodiments, one rectification circuit 130 may be connected with a secondary winding 122 and rectify the secondary winding 122.
It should be noted that for scenarios where the output voltage of the plurality of secondary windings 122 is higher than the rated voltage of a single diode, the diodes connected in series may withstand a larger output voltage compared to a single diode, and thus, the plurality of diodes connected in series may operate normally in scenarios where the output voltage of the plurality of secondary windings 122 is higher than the rated voltage of a single diode.
In some embodiments, the capacitor unit 150 may include at least one first capacitor, the at least one first capacitor being disposed side by side with the at least one diode unit 140 with an interval.
In some embodiments, the at least one first capacitor may be provided at an output end of the at least one diode unit 140. As shown in FIG. 7, the at least one first capacitor may include a capacitor C1 and a capacitor C2, one end of the capacitor C1 may be connected to a first output end a1 of the at least one diode unit 140, another end of the capacitor C1 may be connected to an end of the capacitor C2, and another end of the capacitor C2 may be connected to a second output end a2 of the at least one diode unit 140. A connection point of the capacitor C1 and the capacitor C2 may be connected to a first output end b1 of the plurality of secondary windings, and a second output end b2 of the plurality of secondary windings may be connected to an input end of the at least one diode unit 140. The rectification circuit 130 may output a direct current voltage through the first output end a1 and the second output end a2 of the at least one diode unit 140.
The at least one first capacitor may filter the alternating current component of the voltage output from the at least one diode unit 140 to output a smooth direct current voltage. That is, the at least one first capacitor may be combined with the at least one diode unit 140 as a filter capacitor to function as a rectification circuit.
In some embodiments, the at least one first capacitor may be provided in a variety of ways. For example, the at least one first capacitor may be provided in a same plane as the at least one diode unit 140, or the at least one first capacitor may be provided in a stack manner with respect to the at least one diode unit 140. In some embodiments, the first capacitor and the at least one diode unit 140 may be disposed side by side with an interval. In some embodiments, a count of the first capacitors may be more than one, the plurality of first capacitors may be disposed side by side on one side of the at least one diode unit 140, and the multiple diode groups 141 in the at least one diode unit 140 may be disposed side by side on the same plane. As shown in FIG. 8, the multiple diode groups 141 in the at least one diode unit 140 may be disposed in a row, and two first capacitors, the capacitor C11 and the capacitor C21, may be disposed side by side on one side of the at least one diode unit 140, and are disposed side by side with the at least one diode unit 140 with a certain interval, so that the capacitor C11 and the capacitor C21 may fulfill the function of the at least one first capacitor.
Furthermore, due to the existence of a junction capacitance of the diode itself and a parasitic capacitance in the surrounding space, which often results in the diode withstanding an inconsistent reverse voltage during the dynamic process, the diodes that withstand a high voltage have a high temperature rise, which is only applicable to the case of short-time pulse operation, and if they work for a long period of time, they are subjected to the risk of damage, and their reliability is reduced.
In some embodiments, at least one compensation capacitor may compensate by providing one or more of voltage compensation, current compensation, phase compensation, etc. In some embodiments, the at least one compensation capacitor may compensate for a parasitic capacitance borne with the at least one of the multiple diode groups 141. In some embodiments, a dynamic voltage equalization of the diodes in series connection in the rectification circuit 130 may be achieved by segmental compensation of the diodes in series connection in the rectification circuit 130.
The parasitic capacitance is an equivalent capacitance corresponding to capacitive properties exhibited by the at least one of the multiple diode groups 141 with respect to a high voltage side and a low voltage side during operation of the device for generating a high voltage. In some embodiments, the parasitic capacitances to which different diode groups 141 are subjected may be different. For example, in the rectification circuit 130 disposed in a stacked manner, the parasitic capacitance borne with the at least one of the multiple diode groups 141 at the two ends may be greater than parasitic capacitances borne with the multiple diode groups 141 in the middle.
In the embodiments of the present disclosure, by arranging at least one compensation capacitor at two ends of the at least one of the multiple diode groups 141, the parasitic capacitance endured by the at least one of the multiple diode groups 141 due to the high voltage may be compensated to equalize a diode voltage, thereby preventing the diode from enduring an excessively high voltage that leads to diode damage.
In some embodiments, the compensation capacitance is greater than the parasitic capacitance of the at least one of the multiple diode groups 141. When performing compensation of the at least one of the multiple diode groups 141, that the compensation capacitance is greater than the parasitic capacitance of the at least one of the multiple diode groups 141 allows the compensation capacitance to be a dominant factor in the circuit in which the at least one of the multiple diode groups 141 is located, and thus allows for compensation of the parasitic capacitance.
In the embodiments of the present disclosure, by arranging the compensation capacitance to be larger than the parasitic capacitance of the at least one of the multiple diode groups 141, the compensation capacitance is made to be a dominant factor in the circuit to ensure that the parasitic capacitance is able to be supplemented, thereby preventing the diode from enduring an excessively high voltage that leads to diode damage.
It should be noted that when the at least one first capacitor and the at least one diode unit 140 are provided side by side with an interval as shown in FIG. 8, a conductive part of the capacitor itself and a conductive part of the diode may be equivalent to two poles of a capacitor, respectively, so that the space between the at least one first capacitor and the at least one diode unit 140 may be equivalent to a capacitor to further complement the function of compensation.
In the embodiment of the present disclosure, a rectification filtering process for the voltage output from the plurality of secondary windings 122 is realized by arranging the at least one first capacitor to combine with the at least one diode unit 140, and by arranging the at least one first capacitor to be disposed side by side with the at least one diode unit 140 with an interval, so that the space between the at least one first capacitor and the at least one diode unit 140 may be equivalent to another capacitor, in order to complement the above-described function of compensating the capacitor. At this time, no additional other capacitors need to be disposed, so that the circuit structure of the rectification filtering circuit may be simplified and costs may be saved.
In some embodiments, the at least one first capacitor includes a metal part, the metal part of the at least one first capacitor and at least one solder pad of the multiple diode groups 141 may form at least one compensation capacitor.
In some embodiments, the metal part of the at least one first capacitor and at least one metal part of the multiple diode groups 141 (e.g., a pin, a pad, etc. ) may be equivalent to two pole plates of a capacitor, and this equivalent capacitor may fulfill the function of the at least one compensation capacitor as described above. As shown in FIG. 8, the space between the capacitor C11 and the at least one diode unit 140 may be equivalent to one compensation capacitor.
In some embodiments, a capacitance value of the at least one compensation capacitor may be adjusted in a variety of ways, such as by adjusting the dielectric between the metal part of the at least one first capacitor and the at least one metal part of the multiple diode groups, or by varying a distance between the two in a variety of ways.
In the embodiments of the present disclosure, utilizing the metal part of the at least one first capacitor and the at least one solder pad of the multiple diode groups 141 equivalently to form a compensation capacitor, no additional capacitor components may be disposed to compensate for the parasitic capacitance of the multiple diode groups 141, and thereby simplifying the circuit structure of the rectification circuit.
In some embodiments, the plurality of capacitor units 150 may include at least one first capacitor and at least one second capacitor connected in parallel, with the at least one first capacitor, the at least one diode unit 140, and the at least one second capacitor disposed side by side with an interval.
In some embodiments, the multiple diode groups 141 in the at least one diode unit 140 may be disposed in a row. As shown in FIG. 8, the capacitor C11 and the capacitor C21 may be provided in a row; the capacitor C12 and the capacitor C22 may be provided in a row. The capacitor C11 and the capacitor C21 may be equivalent to the at least one first capacitor disposed side by side on one side of the corresponding diode unit 140, and the capacitor C12 and the capacitor C22 may be equivalent to the at least one second capacitor disposed side by side on the other side of the corresponding diode unit 140, and both the at least one first capacitor and the at least one second capacitor may be disposed side by side with an interval from the at least one diode unit 140.
In some embodiments, the voltage rectified by the at least one diode unit 140 may be filtered using the at least one first capacitor and the at least one second capacitor connected in parallel, which may filter out a high frequency part of the rectified voltage to reduce the ripple of the output of the high-voltage transformer 120.
In the embodiments of the present disclosure, compared to arranging the at least one first capacitor alone, by arranging the at least one first capacitor and the at least one second capacitor in parallel for filtering, the high frequency part of the rectified voltage may be filtered out more efficiently, and the ripple of the output of the high-voltage transformer 120 may be reduced, so as to ensure that the voltage output of the high-voltage transformer 120 is stabilized.
In some embodiments, the metal parts of both the at least one first capacitor and the at least one second capacitor may form the compensation capacitors with the at least one solder pad of the multiple diode groups 141.
As shown in FIG. 8, the capacitor C11 and the capacitor C21 are both first capacitors, and the space between the capacitor C11 and the at least one diode unit 140 may form a first compensation capacitor, and the space between the capacitor C21 and the at least one diode unit 140 may form a second compensation capacitor; the capacitor C12 and the capacitor C22 are both second capacitors, the space between the capacitor C12 and the at least one diode unit 140 may form a third compensation capacitor between the capacitor C12 and the at least one diode unit 140, and the space between the capacitor C22 and the at least one diode unit 140 may form a fourth compensation capacitor between the capacitor C22 and the at least one diode unit 140. For more information on the compensation capacitance, please refer to its related description above.
In the embodiments of the present disclosure, utilizing the metal part of the capacitor (e.g., the first capacitor and the second capacitor) and the at least one solder pad of the multiple diode groups to form at least one compensation capacitor may simplify the circuit structure of the rectification circuit without the need to have additional capacitor components.
In some embodiments, a connection point between rectification circuits corresponding to two of the plurality of secondary windings 122 may be grounded.
The connection point is a point at which the two rectification circuits are connected to each other. In some embodiments, with this connection point grounded, the direction of the current output from the output of the high-voltage transformer 120 is related to a relative position of the rectification circuits to this connection point. For example, using FIG. 33 as an example, if the connection point of the two rectification circuits (e.g., the ports on the connection plate shown) between the two output ends (e.g., output end HV+ and output end HV-) of the high-voltage transformer 120 is grounded, one of the output ends outputs a positive direct current high voltage, HV+, and the other output end outputs a negative direct current high voltage HV-, with the corresponding device for generating a high voltage being bi-polar.
That is, all rectification circuits form two output ends after being connected in series, and if one of the output ends is connected to a grounding end, the other output end outputs the positive direct current high voltage or the negative direct current high voltage, and the corresponding device for generating a high voltage is unipolar. If the two rectification circuits between the two output ends are connected to the grounding end, one of the output ends outputs the positive direct current high voltage and the other output end outputs the negative direct current high voltage, and the corresponding device for generating a high voltage is bipolar.
In the embodiments of the present disclosure, the grounding design of the connection point between the rectification circuits may be used to enable the high-voltage transformer 120 to output both the positive direct current voltage and the negative direct current voltage, thereby expanding the application scenarios of the high-voltage transformer 120.
In some embodiments, the series connection of the rectification circuits may include a U- shaped connection or a Z-shaped connection.
The U-shaped connection means that a high-voltage output point of one of two adjacent circuit structures and a low-voltage output point of the other circuit structure are set on the same side and connected correspondingly, so that a connection line of the two circuits in series is in the form of a U shape. The Z-shaped connection means that a high-voltage output point of one circuit structure and a high-voltage output point of the other circuit structure are set on the same side of the two adjacent circuit structures, and the high-voltage output point of one of two adjacent circuit structures and a low-voltage output point of the other circuit structure are connected so that a connection line of the two circuits in series is in the form of a Z shape.
In the embodiments of the present disclosure, by designing the series connection of the rectification circuits, the circuit structure of the series connection may be utilized to regulate the voltage difference between adjacent rectification circuits to ensure the stable operation of the high-voltage transformer 120.
In some embodiments, the U-shaped connection includes that a low-voltage output point of a first rectification circuit and a high-voltage output point of a second rectification circuit are disposed opposite to each other along a stacking direction of the plurality of secondary windings 122, and a high-voltage output point of the first rectification circuit and a low-voltage output point of the second rectification circuit are disposed opposite to each other along a stacking direction of the plurality of secondary windings 122; the first rectification circuit and the second rectification circuit are rectification circuits corresponding to two adjacent secondary windings 122.
Exemplarily, as shown in FIG. 5, the low-voltage output point L of the first rectification circuit may be disposed on a same side as the high-voltage output point H of the second rectification circuit (e.g., both are disposed near a right boundary of the rectification circuit, opposite to each other along a stacking direction of the plurality of secondary windings 122) ; the high-voltage output point H of the first rectification circuit may be disposed on a same side as the low-voltage output point L of the second rectification circuit (e.g., both are disposed near a left boundary of the rectification circuit, opposite each other along a stacking direction of the plurality of secondar windings 122) , the high-voltage output point H of the first rectification circuit may be connected to the low-voltage output point L of the second rectification circuit, and the high-voltage output point H of the second rectification circuit may be connected to the high-voltage output point H of the third rectification circuit, so that the connection line of the series rectification circuit is in the form of a U shape. The stacking direction of the plurality of secondary windings 122 may be referred to FIG. 1 above and its related description.
It should be noted that in the U-shaped connection, the low-voltage output point of the first rectification circuit is connected to the high-voltage output point of the second rectification circuit such that the potentials of the two are equal.
In the embodiments of the present disclosure, by arranging the high-voltage output points of two adjacent rectification circuits to be opposite to the low-voltage output points, a U-shaped connection between the rectification circuits is possible, thereby simplifying the series circuit structure and saving the series connection lines.
In some embodiments, the Z-shaped connection includes, a low-voltage output point of the first rectification circuit and a low-voltage output point of the second rectification circuit are disposed opposite to each other along a stacking direction of the plurality of secondary windings 122, and a high-voltage output point of the first rectification circuit and a high-voltage output point of the second rectification circuit are disposed opposite to each other along a stacking direction of the plurality of secondary windings 122; the first rectification circuit and the second rectification circuit are rectification circuits corresponding to two adjacent secondary windings 122.
Exemplarily, as shown in FIG. 6, the low-voltage output point of the first rectification circuit may be disposed on a same side as the low-voltage output point of the second rectification circuit (e.g., both are disposed near a right boundary of the rectification circuit, opposite each other along a stacking direction of the plurality of secondary windings 122) , the high-voltage output point of the first rectification circuit may be disposed on a same side as the high-voltage output point of the second rectification circuit, and the low-voltage output point L of the first rectification circuit may be connected to the high-voltage output point H of the second rectification circuit, the low-voltage output point L of the second rectification circuit may be connected to the high-voltage output point H of the second rectification circuit, so that the connection line of the series rectification circuit is in the form of a Z shape.
It should be noted that the low-voltage output point of the first rectification circuit is connected to the high-voltage output point of the second rectification circuit such that the potentials of the two are equal, which are disposed in the stacking direction in the Z-shaped connection, whereby a voltage difference between the two adjacent rectification circuits on both sides of the Z-shaped connection is smaller as compared to the U-shaped connection.
Exemplarily, assuming that a potential difference between the low-voltage output point and the high-voltage output point of the first rectification circuit is 10 V, and that a potential difference between the low-voltage output point and the high-voltage output point of the second rectification circuit is also 10 V, a voltage difference between the same side of the two adjacent rectification circuits in the U-shaped connection shown in FIG. 5 has a maximum of 20 V, and a voltage difference between the same side of the two adjacent rectification circuits in the Z-shaped connection shown in FIG. 6 has a maximum of 10 V.
In the embodiments of the present description, by arranging the respective high-voltage output points of two adjacent rectification circuits to be disposed correspondingly and the respective low-voltage output points to be disposed relative to each other, the rectification circuits may be connected to each other in the Z-shape, so that the voltage difference between the same side of the two adjacent rectification circuits may be lowered to reduce the risk of being pierced by the high-voltage, and to ensure the stable operation of the high-voltage transformer 120.
FIG. 9 is a schematic diagram illustrating an internal structure of a device for generating a high voltage, according to some other embodiments of the present disclosure. In some embodiments, the high-voltage transformer 120 is placed in insulation oil of the device for generating a high voltage, and the high-voltage transformer 120 includes two primary windings 121 and n secondary windings 122, one of the two primary windings 121 and the corresponding n/2 secondary windings 122 are disposed on one magnetic column 123 of a magnetic core, and the other primary winding 121 and the corresponding n/2 secondary windings 122 are disposed on the other magnetic column 123 of the magnetic core. Output ends of each secondary winding 122 are connected to a rectification circuit, different secondary windings 122 are disposed on a same magnetic column 123, and corresponding rectification circuits are stacked on top of each other. And each layer is divided by the flat insulation component, and a smooth oil channel is formed between each layer of the flat insulation member, so that the insulation oil in the entire device for generating a high voltage may be circulated, so that the heat generated by the high-voltage transformer 120 and the rectification circuits may be brought out in a timely manner. Two secondary windings 122 and their corresponding rectification circuits may be disposed in the same layer but on different magnetic columns 123, and the rectification circuits disposed in the same layer are connected in series. The rectification circuits between different layers may be connected in the U-shape, as shown in FIG. 10. The rectification circuits between different layers may also be connected in the Z-shape, as shown in FIG. 11.
In some embodiments, the magnetic core may be provided with a plurality of magnetic columns 123, and the at least one primary winding 121 may be provided with the plurality of magnetic columns 123 in a variety of ways. For example, when there is a plurality of primary windings 121, each primary winding 121 may be disposed around a magnetic column 123 respectively, as shown in FIG. 9. As another example, the at least one primary winding 121 may be disposed around some of the plurality of magnetic columns 123, as shown in FIGs. 13 to 15 below.
In some embodiments, a secondary winding 122 and its corresponding rectification circuit may be disposed on the same PCB, and different secondary windings 122 are disposed on different PCBs. As shown in FIG. 9, each PCB is provided with a secondary winding 122 and a corresponding rectification circuit, and the stacking of different secondary windings 122 may be realized by arranging the different PCBs in a stack. In some embodiments, different PCBs may be conveniently stacked and secured by providing perforations around each PCB, and by installing studs on the perforations.
In some embodiments, the flat insulation component may be a PCB on which the secondary winding 122 and the corresponding rectification circuit are located. In some embodiments of the present disclosure, the insulation between two adjacent secondary windings 122 may be realized by using the PCBs on which the secondary windings 122 and the rectification circuits are located without the need to additionally provide the flat insulation component, which may simplify the structure.
In some embodiments, the plurality of secondary windings 122 may be disposed on a plurality of magnetic columns 123 when the magnetic columns 123 is plural, and a count of coil turns of each secondary winding 122 may be related to a ratio of a total count of coil turns of the plurality of secondary windings 122 to a count of the plurality of secondary windings 122.
In some embodiments, the plurality of secondary windings 122 on different magnetic columns 123 may be connected to corresponding rectification circuits respectively, the rectification circuits corresponding to the secondary windings 122 at the same layer may be connected in series, and the series connection between the rectification circuits corresponding to the secondary windings 122 at different layers may include a U-shaped connection or a Z-shaped connection.
For example, as shown in FIG. 10 and FIG. 11, the rectification circuit 1, the rectification circuit 2, the rectification circuit 3, and the rectification circuit 4 are rectification circuits corresponding to four adjacent secondary windings 122. The rectification circuit 1 and the rectification circuit 2 are located at a same layer, and the rectification circuit 3 and the rectification circuit 4 are located at a same layer. A low-voltage output point of the rectification circuit 1 may be disposed opposite to a high-voltage output point of the rectification circuit 2, along a direction perpendicular to the stacking direction of the secondary windings 122, to realize series connection between the rectification circuits corresponding to the secondary windings 122 at the same layer.
As shown in FIG. 10, the low-voltage output point of the rectification circuit 1 may be disposed opposite to the high-voltage output point of the rectification circuit 3 along the stacking direction of the secondary winding 122, and the high-voltage output point of the rectification circuit 1 may be disposed opposite to the low-voltage output point of the rectification circuit 3 along the stacking direction of the secondary winding 122. The rectification circuit 2 and the rectification circuit 4 are provided in the same manner as the rectification circuit 1 and the rectification circuit 3. The high-voltage output point of the rectification circuit 1 may be connected to the low-voltage output point of the rectification circuit 3, and the high-voltage output point of the rectification circuit 4 may be connected to the low-voltage output point of the rectification circuit of the next layer, to realize the U-shaped connection of the rectification circuits. For more information on the U-shaped connection, please refer to FIG. 5 and its related descriptions described above.
As shown in FIG. 11, the low-voltage output point of the rectification circuit 1 may be disposed relative to the low-voltage output point of the rectification circuit 3 along the stacking direction of the secondary winding 122, and the high-voltage output point of the rectification circuit 1 may be disposed opposite to the high-voltage output point of the rectification circuit 3 along the stacking direction of the secondary winding 122. The rectification circuit 2 and the rectification circuit 4 are provided in the same manner as the rectification circuit 1 and the rectification circuit 3. The high-voltage output point of the rectification circuit 1 may be connected to the low-voltage output point of the rectification circuit 4, and the high-voltage output point of the rectification circuit 3 may be connected to the low-voltage output point of the rectification circuit of the next layer to realize the Z-shaped connection of the rectification circuits. For more information on the Z-shaped connection, please refer to FIG. 6 and its related descriptions described above.
In some embodiments, a count of coil turns of the plurality of secondary windings 122 located at different layers may gradually decrease along a direction away from the grounding end. Voltages between output ends of the plurality of secondary windings 122 of the different layers and the grounding end gradually increase along the direction away from the grounding end, and by arranging the count of turns of coils of the plurality of secondary windings 122 disposed in the different layers to gradually decrease along the direction away from the wiring, the strength of the electric field between the plurality of secondary windings 122 may be made more uniform.
The direction away from the grounding end is a direction from the grounding end to the output ends (i.e., the output ends for outputting a positive direct current voltage or a negative direct current voltage formed by all the rectification circuits after connecting them in series) , e.g., the direction X as shown in FIGs. 12 to 17 below. It should be noted that the count of coil turns of the plurality of secondary windings 122 gradually decreases along the direction away from the grounding end does not mean that the count of coil turns of each secondary winding 122 between the output end and the grounding end has to be different, some of the plurality of secondary windings 122 may still have the same count of coil turns. For more information on the reduction in the count of coil turns of the plurality of secondary windings 122, please refer to FIGs. 12 to 17 below and their related descriptions.
In the embodiments of the present disclosure, since the voltages between the output ends of the different layers of the plurality of secondary windings 122 and the grounding end gradually increase along the direction away from the grounding end, by arranging the count of coil turns of the plurality of secondary windings 122 located in the different layers in such a way that the count of coil turns is set to gradually decrease along the direction away from the wiring, the strength of the electric field between the plurality of secondary windings 122 may be made more uniform, and thus the operating stability of the high-voltage transformer 120 may be improved.
In some embodiments, insulation distances between the plurality of secondary windings 122 located at different layers and the at least one primary winding 121 may gradually increase along the direction away from the grounding end. The voltages between the output ends of the different layers of the plurality of secondary windings 122 and the grounding end gradually increase along the direction away from the grounding end. By setting the insulation distances (such as the insulation distances d shown in FIGs. 12 to 16) between the plurality of secondary windings 122 located at different layers and the at least one primary winding 121 to gradually increase along the direction away from the grounding end, for example, the insulation distances between the plurality of secondary windings 122 and the at least one primary winding 121 are disposed in a gradient arrangement from small to large, voltage differences between the primary and secondary windings may be made more uniform, thereby making the electric field strength between the primary and secondary windings more uniform. Besides, by doing so, the size of the insulation space may be fully utilized, which is conducive to the reduction in the size of the high-voltage transformer 120, thereby realizing the miniaturization of the device for generating a high voltage. Meanwhile, in the case where the voltages between the output ends of the plurality of secondary windings 122 and the grounding end gradually increase along the direction away from the grounding end, the insulation distances between the plurality of secondary windings 122 and the at least one primary winding 121 grows from small to large along the direction away from the grounding end, so that the insulation ability between the plurality of secondary windings 122 and the at least one primary winding 121 may be increased, and the components in the primary and secondary windings may be avoided from being broken by the high voltages.
It should be noted that the gradual increase of the insulation distances between the plurality of secondary windings 122 and the at least one primary winding 121 along the direction away from the grounding end does not mean that an insulation distance between each secondary winding 122 and the primary winding 121 between the output ends and the grounding end has to be different, some of the plurality of secondary windings 122 may still have the same insulation distances from the at least one primary winding 121. For more information on the increased insulation distances, please refer to FIGs. 12 to 17 below and their respective descriptions.
In the embodiments of the present disclosure, the voltages between the output ends of the different layers of the plurality of secondary windings 122 and the grounding end gradually increase along the direction away from the grounding end. By setting the insulation distances between the plurality of secondary windings 122 located at different layers and the at least one primary winding 121 to gradually increase along the direction away from the wiring, the electric field strength between the plurality of secondary windings 122 may be made more uniform, which may improve the operating stability of the high-voltage transformer 120. At the same time, the larger the voltage is, the larger the insulation distance between the secondary winding 122 and the primary winding 121 is, which may further enhance the insulation ability between the plurality of secondary windings 122 and the at least one primary winding 121, avoiding large voltages from piercing the components of the at least one primary winding 121 and the plurality of secondary windings 122, and ensuring the stable operation of the high-voltage transformer 120.
In some embodiments, the insulation distances between the plurality of secondary windings 122 located in different layers and the at least one primary winding 121 may be determined based on a preset field strength, a winding radius of the at least one primary winding, and voltage differences between the plurality of secondary windings 122 located in different layers and the at least one primary winding 121.
The preset field strength is a field strength between the primary and secondary windings. The winding radius of the at least one primary winding is a radius of an annulus in which the at least one primary winding 121, and the secondary windings 122 are centered on the iron column. In some embodiments, a preset formula may be utilized to determine the insulation distances between the plurality of secondary windings 122 and the at least one primary winding 121 based on the preset field strength, the winding radius of the at least one primary winding, and the voltage differences between the plurality of secondary windings 122 and the at least one primary winding 121 located at different layers. Exemplarily, the preset formula may be expressed as the following formula (1) :
E=V/ [r*Ln (R/r) ] (1)
wherein E is the preset field strength, V is the voltage differences between the plurality of secondary windings 122 located in different layers and the at least one primary winding 121, R is the radius of the plurality of secondary windings 122, and r is the radius of the at least one primary winding 121. In some embodiments, when the field strength between the primary and secondary windings is uniform, the above preset formula may be utilized to quantitatively determine the insulation distance between each secondary winding 122 located in a different layer and the corresponding primary winding 121.
In the embodiments of the present disclosure, utilizing the preset field strength, the winding radius of the at least one primary winding, and the voltage differences between the plurality of secondary windings 122 located in different layers and the at least one primary winding 121, the insulation distances between the plurality of secondary windings 122 located in different layers and the at least one primary winding 121 may be quickly determined in the presence of uniform field strengths, thereby improving the efficiency of fabricating the high-voltage transformer 120.
In some embodiments, the at least one primary winding 121 and the plurality of secondary windings 122 may be disposed around different magnetic columns 123, with insulation distances between the plurality of secondary windings 122 and the magnetic columns 123 progressively increasing along a direction away from the grounding end.
For example, the magnetic core may include a plurality of magnetic columns 123, the at least one primary winding 121 may be disposed around one of the magnetic columns 123, and the plurality of secondary windings 122 may be spacedly disposed on another one or more of the plurality of magnetic columns 123. Exemplarily, the core formed by the combination of two U-shaped cores includes two magnetic columns 123, the at least one primary winding 121 being disposed around one of the magnetic columns 123, and the plurality of secondary windings 122 being spacedly disposed on the other one of the magnetic columns 123. Assuming that the grounding end is at the lowermost part, the insulation distances between the plurality of secondary windings 122 and the magnetic columns 123 may be gradually increased from the bottom to the top.
A variety of exemplary devices for generating a high voltage are provided below, specifying the manner in which the count of turns and the insulation distances are realized.
FIGs. 12 to 17 are schematic diagrams illustrating cross-sections of high-voltage transformers according to some embodiments of the present disclosure.
In the example shown in FIG. 12, the device for generating a high voltage includes two primary windings 121 and a plurality of secondary windings 122, and two U-shaped cores are combined to form a magnetic core includes two magnetic columns 123, one of the primary windings 121 and the corresponding secondary windings 122 are disposed around one magnetic column 123, and the other primary winding 121 and the corresponding secondary windings 122 are disposed around the other magnetic column 123. Assuming that the grounding end is at the lowermost part, the count of coil turns of the plurality of secondary windings 122 gradually decreases in the direction X from bottom to top, and the insulation distances d between the plurality of secondary windings 122 and the at least one primary winding 121 gradually increases in the direction X from bottom to top. As shown in FIG. 12, when the voltages between the output ends of the different layers of the plurality of secondary windings 122 and the grounding end gradually increase along the bottom-up direction, the voltage differences between the at least one primary winding and the plurality of secondary windings may be made more uniform.
In the example shown in FIG. 13, the device for generating a high voltage includes at least one primary winding 121 and a plurality of secondary windings 122, and a magnetic core formed by combining two U-shaped magnetic cores includes two magnetic columns 123, and the at least one primary winding 121 and the plurality of secondary windings 122 are disposed around one of the magnetic columns 123. Assuming that the grounding end is at the lowermost part, the count of coil turns of the different layers of the plurality of secondary windings 122 gradually decreases along the direction X from the bottom-up direction, and the insulation distances d between the different layers of the plurality of secondary windings 122 and the at least one primary winding 121 gradually increases in the direction X from the bottom-up direction. As shown in FIG. 13, when the voltages between the output ends of the different layers of the plurality of secondary windings 122 and the grounding end are gradually increased along the bottom-up direction, the voltage differences between the at least one primary winding and the plurality of secondary windings may be made more uniform.
In the example shown in FIG. 14, the device for generating a high voltage includes at least one primary winding 121 and a plurality of secondary windings 122, and a magnetic core formed by combining two U-shaped magnetic cores includes two magnetic columns 123, and the at least one primary winding 121 and the plurality of secondary windings 122 are disposed around one of the magnetic columns 123. Assuming that the grounding end is at the lowermost part, the count of coil turns of the plurality of secondary windings 122 gradually decreases along the direction X from bottom to top, and the insulation distances d between the plurality of secondary windings 122 and the at least one primary winding 121 gradually increases along the direction X from bottom to top as shown in FIG. 14, the voltage differences between the at least one primary winding and the plurality of secondary windings may be made more uniform.
In the example shown in FIG. 15, the device for generating a high voltage includes at least one primary winding 121 and a plurality of secondary windings 122, a magnetic core formed by combining four U-shaped magnetic cores includes three magnetic columns 123, and the at least one primary winding 121 and the plurality of secondary windings 122 are disposed around a middle magnetic column 123. Assuming that the grounding end is at the lowermost part, the count of coil turns of the plurality of secondary windings 122 gradually decreases along the direction X from bottom to top, and the insulation distances d between the plurality of secondary windings 122 and the at least one primary winding 121 gradually increases along the direction X from bottom to top as shown in FIG. 15, the voltage differences between the at least one primary winding and the plurality of secondary windings may be made more uniform.
In the example shown in FIG. 16, the device for generating a high voltage includes three primary windings 121 and a plurality of secondary windings 122, and a magnetic core formed by combining two E-shaped magnetic cores includes three magnetic columns 123, one of the primary windings 121 and corresponding secondary windings 122 are disposed around a magnetic column 123 on the left side, a second primary winding 121 and corresponding secondary windings 122 are disposed around a magnetic column 123 on the center side, and a third primary winding 121 and corresponding secondary winding 122 are disposed around a magnetic column 123 on the right side. Assuming that the grounding end is at the lowermost part, the count of coil turns of the plurality of secondary windings 122 gradually decreases along the direction X from bottom to top, and the insulation distances d between the plurality of secondary windings 122 and the at least one magnetic column 123 gradually increase along the direction X from bottom to top, as shown in FIG. 16, the voltage differences between the at least one primary winding and the plurality of secondary windings may be made more uniform.
In the example shown in FIG. 17, the device for generating a high voltage includes at least one primary winding 121 and a plurality of secondary windings 122, and a magnetic core formed by combining two U-shaped magnetic cores includes two magnetic columns 123, with the at least one primary winding 121 being disposed around one of the magnetic columns 123, and the plurality of secondary windings 122 being spacedly disposed on the other one of the magnetic columns 123. Assuming that the grounding end is at the lowermost part, the insulation distances between the plurality of secondary windings 122 and the at least one magnetic column 123 gradually increase from bottom to top, as shown in FIG. 17, the voltage differences between the plurality of secondary windings may be made more uniform.
In some embodiments, a medical device may include a device for generating a high voltage as shown in FIGs. 1 to 17 above, wherein the device for generating a high voltage may provide a stabilized direct current high voltage for powering the medical device.
The medical device may be a computed tomography (CT) device, a digital subtraction angiography (DSA) device, a digital radiography (DR) device, etc.
In the medical device provided in the embodiments of the present disclosure, by providing a plurality of secondary windings 122 within the device for generating a high voltage and arranging them in a stack, the different secondary windings 122 may form a stacked insulation structure, allowing the liquid insulation medium 110 inside the device for generating a high voltage to flow between the different secondary windings 122, which is conducive to exhausting the air when injecting the liquid insulation medium 110, avoiding residual air bubbles from causing a breakdown of the insulation structure. Such design may also bring out the heat generated inside the device for generating a high voltage in a timely manner, which improves the heat dissipation efficiency and the reliability of the prolonged operation, and thus improves the reliability of the medical device.
As shown in FIG. 18, in some embodiments, the high-voltage transformer 120 may include at least one primary winding 121, a plurality of secondary windings 122 corresponding to the at least one primary winding 121, and at least one magnetic column 123. The at least one primary winding 121 is disposed around the at least one magnetic column 123 and the plurality of secondary windings 122 are spacedly disposed on the at least one magnetic column 123, the plurality of secondary windings 122 corresponding to the at least one primary winding 121 are disposed in a stacked manner between the plurality of secondary windings 122, the plurality of secondary windings 122 are disposed on at least one PCB, and each secondary winding 122 may include at least one coil.
For more information on the magnet column 123, please refer to FIG. 1 and its related descriptions, described above.
For more information on the at least one primary winding 121, the plurality of secondary windings 122, and the way they are disposed on the PCB, please refer to FIG. 1 and FIG. 30, and their related descriptions thereof.
Since the output voltages of the plurality of secondary windings 122 of the transformer are related to the turns ratio of the transformer, a decrease in the count of coil turns of the plurality of secondary windings 122 decreases the output voltages of the plurality of secondary windings 122. In some embodiments, the secondary windings 122, which generates the high voltage alternating current, may be divided into a plurality of secondary windings 122 by increasing the count of secondary windings 122 and decreasing the count of coil turns of a single secondary winding 122, with the total count of coil turns of the secondary windings 122 remaining unchanged. This makes the output voltage of a single secondary winding 122 smaller, so that the voltage difference between adjacent secondary windings 122 is smaller, which in turn simplifies the insulation design of the plurality of secondary windings 122.
In some embodiments, a secondary winding 122 may include one coil or may include at least two coils. For more information on the manner in which the shape, count, and winding direction of the coils may be set up, please refer to FIGs. 21 to 23 below and their related descriptions.
In some embodiments, when a secondary winding 122 includes at least two coils, different coils may be disposed at different layers of a PCB. For more information on the position of the coils, please refer to FIG. 20 and its related description below.
In some embodiments, the high-voltage transformer 120 may be disposed in the liquid insulation medium 110 within the device for generating a high voltage, with a count of at least two PCBs, with the at least two PCBs disposed in a stacked manner to allow the liquid insulation medium 110 to flow between the at least two PCBs.
For more information on the liquid insulation medium 110, please refer to FIG. 1 and FIG. 2 and their related descriptions above.
In the embodiments of the present disclosure, by arranging a plurality of PCBs in the device for generating a high voltage and arranging them in a stack, so that the different PCBs constitute an open-ended stacked insulation structure, the liquid insulation medium 110 within the device for generating a high voltage may flow between the different PCBs, which is conducive to exhausting the air when injecting the liquid insulation medium 110, avoiding residual air bubbles leading to a breakdown of the insulation structure, and also bringing the heat generated within the device for generating a high voltage out in a timely manner, which improves the heat dissipation efficiency and the reliability of the prolonged operating time.
In some embodiments, a voltage difference between two adjacent secondary windings 122 may be no greater than a breakdown voltage of the PCB or the insulation layer of the PCB between the two adjacent secondary windings 122. For more information on the breakdown voltage, please refer to FIG. 1 and its related description above.
In some embodiments, a count of magnetic columns 123 may be at least two, and each magnetic column 123 is sleeved with same positions and same count of secondary windings 122, and the secondary windings 122 spacedly disposed on different magnetic columns 123 at the same stacking layer may be provided on the same PCB. That is to say, each layer of the PCB may be provided with at least two secondary windings 122, the same stacking layer meaning that the stacking layers of the secondary windings 122 are spatially corresponding, such as both of them are at the same spatial height from a certain position in the stacking direction.
In the embodiments of the present disclosure, by arranging the plurality of secondary windings 122, which are spacedly disposed on different magnetic columns 123 and located at the same stacking layer, on the same PCB, the efficiency of space utilization of the PCB may be improved, and the space used for the high-voltage transformer 120 may be reduced.
FIG. 19 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage, according to some embodiments of the present disclosure.
In some embodiments, each of the plurality of secondary windings 122 may be separately connected to a corresponding rectification circuit, and rectification circuits corresponding to two adjacent secondary windings 122 are in series connection. As shown in FIG. 19, the high-voltage transformer 120 may include at least one primary winding 121 and n secondary windings 122, output ends of each secondary winding 122 are connected to a rectification circuit, with a total of n rectification circuits. The rectification circuits corresponding to the two adjacent secondary windings 122 are in series connection, and the n rectification circuits are in series connection to form two output ends, HV+ and HV-.
In some embodiments, the voltage output from each of the plurality of secondary windings 122 is an alternating current voltage, which is further rectified by the corresponding rectification circuit to obtain a direct current voltage. By connecting rectification circuits corresponding to two adjacent secondary windings 122 in series, a plurality of output direct current voltages may be connected in series, and after the accumulation of a plurality of direct current voltages, a higher direct current voltage may be ultimately output. Exemplarily, as shown in FIG. 19, a rectification circuit corresponding to one secondary winding 122 outputs a direct current voltage of 5 kV, and rectification circuits corresponding to ten secondary windings 122 may be connected in series to obtain a direct current voltage of 50 kV. For more examples of the rectification circuits, please refer to FIG. 3 and its related description above.
In the embodiments of the present disclosure, by arranging the plurality of secondary windings 122 to be connected to the corresponding rectification circuits and by connecting the rectification circuits in series, the plurality of secondary windings 122 is capable of outputting the direct current high voltage, so that the output efficiency of the high-voltage transformer 120 may be improved.
In some embodiments, capacitors are connected in parallel between the output ends of the rectification circuits. As shown in FIG. 19, the output ends of each rectification circuit may be connected to each other by a capacitor CX. An output end e₁ of each stage of the rectification circuit is connected to one end of the capacitor CX in the current stage of the rectification circuit and is connected to one end of the capacitor CX in the previous stage of the rectification circuit; an output end e₂ of each stage of the rectification circuit is connected to the other end of the capacitor CX of the current stage of the rectification circuit, and is also connected to one end of the capacitor CX in the next stage of the rectification circuit, so as to realize a parallel connection of the capacitor CX with the output end.
The capacitor is used to filter the direct current voltage obtained by rectifying the rectification circuit. Since the capacitor has the function of energy storage, a voltage on the capacitor may not change abruptly, so arranging the capacitor in parallel between the output ends of the rectification circuit may make the waveform of the output voltage smoother.
In the embodiments of the present disclosure, the capacitors may be connected in parallel between the output ends of the rectification circuits, so that the voltage output from the rectification circuits may be smoother, thereby improving the output stability of the high-voltage transformer 120.
In some embodiments, the rectification circuit may be a full-bridge rectification circuit, a double voltage rectification circuit, or a half-bridge rectification circuit, or other types of circuits. For specific implementations of the full-bridge rectification circuit or the double voltage rectification circuit, please refer to FIGs. 21 to 24 and their related descriptions below.
In the embodiments of the present disclosure, by arranging the full-bridge rectification circuit or the double voltage rectification circuit, the rectification circuit is not provided with series-connected diodes, so that reliability may be improved, and the rectification circuit may be ensured to operate normally.
In some embodiments, an output voltage of each secondary winding 122 may be lower than a rated voltage of the diodes in the rectification circuit corresponding to the secondary winding 122.
In some embodiments, the plurality of secondary windings 122 are provided such that a count of coil turns of a single secondary winding 122 may be sufficiently small, thereby, the output voltage of the single secondary winding 122 may be lower than the rated voltage of the diodes in the rectification circuit corresponding to the single secondary winding 122, thereby eliminating the need to provide a complex rectification component (e.g., a chopper circuit, a bridge circuit, etc. ) , and the rectification circuits corresponding to the plurality of secondary windings 122 may be utilized in a very small count of diodes, for example, one diode, to rectify the output voltage of the plurality of secondary windings 122, and thus the circuit structure of the high-voltage transformer 120 may be simplified.
In some embodiments, a connection point between rectification circuits corresponding to two of the plurality of secondary windings 122 that are adjacent to each other is grounded.
In the embodiments of the present disclosure, the grounding of the connection point between the rectification circuits may be used to make the high-voltage transformer 120 capable of outputting a positive direct current voltage and a negative direct current voltage at the same time, and the corresponding high-voltage transformer 120 may be bipolar, thereby expanding the application scenarios of the high-voltage transformer 120. For more information on the grounding of the connection point between the rectification circuits, please refer to FIG. 5, FIG. 6, and FIG. 31 and their related descriptions.
In some embodiments, the count of PCBs is at least two and rectification circuits on two adjacent PCBs are connected in series. For more information on the connection of the PCBs, please refer to FIG. 28 and its related descriptions below.
FIG. 20 is a schematic diagram illustrating a cross-section of a device for generating a high voltage according to some embodiments of the present disclosure.
Exemplarily, as shown in FIG. 20, the high-voltage transformer 120 includes m secondary windings, each of which includes two coils disposed in different layers of a PCB, i.e., 2m coils of the m secondary windings are disposed in 2m layers of m PCBs. As can be seen in FIG. 20, the secondary winding m-1 and the secondary winding m are two adjacent secondary windings, and the two adjacent coils are staggered in the secondary winding m-1 and the secondary winding m, that is, the coils located in layer 2m-2 and layer 2m-1 of the PCB are radially staggered. The staggered setting means that the positions of the wires of the two coils are staggered in the radial direction, and for more information on the staggered setting, please refer to FIG. 1 and its related description above.
In the embodiments of the present disclosure, by staggering two adjacent coils in two adjacent secondary windings 122, an effective overlap area between the two adjacent secondary windings 122 may be reduced, and thus a parasitic capacitance between the two adjacent secondary windings 122 may be reduced.
As shown in FIG. 20, two coils belonging to the same secondary winding are staggered. For example, two coils located in layers 1 and 2 of the PCB are staggered, two coils located in the same secondary winding 2, i.e., coils located in layers 3 and 4 of the PCB, are staggered.
In this implementation, by staggering two adjacent coils in the secondary windings 122, the effective overlap area between the coils in the same secondary winding 122 may be reduced, and thus the parasitic capacitance within the secondary winding 122 may be reduced, which is applicable to the scenario of high frequency operation of the high-voltage transformer 120. For more information on the staggered setting, please refer to FIG. 1 and its related description above.
FIG. 21 is an exemplary structural block diagram illustrating a device for generating a high voltage according to some embodiments of the present disclosure.
In some embodiments, a flow direction of current in the third coil and a flow direction of current in the fourth coil is the same, the third coil and the fourth coil belong to two adjacent secondary windings 122, and the third coil is adjacent to the fourth coil.
For example, as shown in FIG. 21, in adjacent secondary winding a and secondary winding b, coil 1 of the secondary winding a is adjacent to coil 2 of the secondary winding b, a wiring direction of the coil 1 in the secondary winding a is in a clockwise direction, and a wiring direction of the coil 1 in the secondary winding b is in a counterclockwise direction, so that currents generated by the coil 1 and the coil 2 flow in the same direction, and a voltage difference Vab between the secondary winding a and the secondary winding b may be a direct current voltage, so as to reduce the dielectric loss due to the difference in the direction of polarization.
In the embodiments of the present disclosure, for the adjacent secondary windings 122, by controlling the current flows in the adjacent two coils to flow in the same direction, the voltage between the adjacent two coils in the two adjacent secondary windings 122 may be made to be the direct current voltage, so that the dielectric loss brought about by the high-frequency alternating current may be reduced, and the boosting efficiency may be improved.
FIG. 22 is an exemplary internal structure block diagram illustrating a device for generating a high voltage according to some embodiments of the present disclosure. As shown in FIG. 22, the high-voltage transformer 120 includes m secondary windings 122, each of which is connected to a corresponding rectification circuit, respectively. Each of the m secondary windings 122 includes two coils, which may be separately disposed in different layers of a PCB. m rectification circuits corresponding to the m secondary windings 122 are connected in series to realize boosting, forming output ends HV1+ and HV1-.
In some embodiments, at least one of the plurality of secondary windings 122 includes at least two coils that are electrically connected to each other and distributed across different layers of the PCB, and magnetic fields generated by the currents in the at least two coils are in a same direction.
Exemplarily, as shown in FIG. 23, the coil 1 in the secondary winding a is wired counterclockwise from outside to inside, and the coil 2 in the same secondary winding a is wired clockwise from outside to inside. When the coil 1 and the coil 2 receive a same alternating magnetic field, the coil 1 and the coil 2 may generate currents in a same direction, such that magnetic fields generated by the currents in the coil 1 and the coil 2 are in the same direction, such that a voltage difference Vab between the adjacent secondary winding a and the secondary winding b is a direct current voltage. For more information on the same direction of the magnetic fields generated by the currents in at least two coils of the same secondary winding, please refer to FIGs. 22 to 24 and their related descriptions below.
In the embodiments of the present disclosure, for the at least two coils of the same secondary winding 122, the different coils may be set up with the same direction of current, so as to make the different coils produce the same direction of the magnetic fields, to avoid the magnetic fields canceling each other out, and thus to increase the current in the same winding.
FIG. 24 is an exemplary block diagram illustrating an internal structure of a device for generating a high voltage, according to some embodiments of the present disclosure.
In some embodiments, the rectification circuit may be a double voltage rectification circuit.
Exemplarily, as shown in FIG. 24, the high-voltage transformer 120 includes m/2 secondary windings 122, each of which is connected to a corresponding rectification circuit. Since the rectification circuits are all double voltage rectification circuits, output ends HV1+ and HV1-formed after m/2 rectification circuits are connected in series may output the same voltage as the output ends HV1+and HV1-formed after m rectification circuits are connected in series in FIG. 22.
In the embodiments of the present disclosure, by arranging the double voltage rectification circuit, the count of the secondary windings 122 may be reduced while the output voltage remains unchanged, so as to simplify the circuit structure and reduce the space occupied by the high-voltage transformer 120.
FIG. 25 and FIG. 26 are top perspective diagrams illustrating a connection structure between a high-voltage transformer 120 and a plurality of rectification circuits according to some embodiments of the present disclosure.
In some embodiments, each of the plurality of secondary windings 122 and its corresponding rectification circuit may be disposed on a same PCB. As shown in FIG. 25, the m rectification circuits corresponding to the m secondary windings 122 may be disposed on a same PCB. In some embodiments, the m rectification circuits may be disposed on a same layer of the PCB, such as on a top layer, a bottom layer, or other layers of the PCB, and disposed in a circular row. In this case, the soldered components in the plurality of rectification circuits are all disposed on the top layer of the PCB, and the plurality of rectification circuits are connected to the plurality of secondary windings 122 by means of punched holes (e.g., through-holes 152) , and the m rectification circuits are connected in series to realize boosting and form output ends HV1+ and HV1-. In some embodiments, the m rectification circuits may also be disposed in different layers of the PCB, such as one part of the m rectification circuits are disposed in the top layer of the PCB and another part of the m rectification circuits are disposed in the bottom layer of the PCB. For more information on the arrangement of the rectification circuits, please refer to FIG. 3 and its related description above.
As shown in FIG. 26, the m rectification circuits corresponding to the m secondary windings 122 are all disposed on the same PCB, such as on the top layer, the bottom layer, or other layers of the PCB, and are disposed in the circular row, and the soldered components in each rectification circuit are disposed on the top layer, and each rectification circuit and its corresponding secondary winding 122 may be connected by means of a connection wire 151. The m rectification circuits are connected in series to realize the voltage boosting and form the output ends HV1+ and HV1-.
FIG. 27 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 according to some embodiments of the present disclosure. FIG. 28 is a schematic diagram illustrating a plurality of rectification circuits connected in series through resistors, according to some embodiments of the present disclosure.
In some embodiments, a count of PCBs is at least two, and rectification circuits of two adjacent PCBs are connected in series.
Exemplarily, as shown in FIG. 27, the high-voltage transformer 120 includes at least one primary winding 121 and n secondary windings 122, each PCB is disposed with m secondary windings 122, the n/m PCBs are disposed in a stacked manner, and the at least one primary winding 121 and all the secondary windings 122 are disposed around at least one magnetic column 123. The rectification circuits in the two adjacent PCBs are connected to each other by a connection plate. For more information on the series connection between the rectification circuits in the two adjacent PCBs, please refer to FIG. 1 and its related descriptions above.
In the embodiments of the present disclosure, by arranging the plurality of secondary windings 122 on a plurality of PCBs and connecting in series between rectification circuits in two adjacent PCBs, the insulation between adjacent secondary windings 122 and rectification circuits may be realized through at least one PCB, so that there is no need for additional flat insulation components, and the production cost of the high-voltage transformer 120 may be reduced by streamlining the devices.
In some embodiments, the series connection between the rectification circuits of the two adjacent PCBs may include a U-shaped connection or a Z-shaped connection. For more information on the U-shaped connection or the Z-shaped connection, please refer to the above-described FIG. 5 and FIG. 6 and their related descriptions.
FIG. 28 is an exemplary block diagram illustrating an internal structure of a connection plate according to some embodiments of the present disclosure.
In some embodiments, the rectification circuits of the two adjacent PCBs are in series connection through a resistor.
As shown in FIG. 28, the rectification circuits in the n/m PCBs may be connected in series. Specifically, the rectification circuits in the two adjacent PCBs are connected through resistors provided on the connection plate. For more information on the series connection between the rectification circuits through the resistors, please refer to FIG. 1 and its related descriptions above.
In the embodiments of the present disclosure, a magnitude of current between two adjacent PCBs may be adjusted by adjusting a magnitude of a resistance value of a resistor connected in series between two adjacent PCBs, so that the energy on the capacitance of the rectification circuits is avoided from being released to the back-end load, and damage to the loads and the rectification circuits is reduced.
FIG. 29 is a schematic diagram illustrating a cross-section of a high-voltage transformer 120 including a plurality of PCBs, according to some embodiments of the present disclosure.
In some embodiments, a count of magnetic columns 123 may be at least two, and a same count of secondary windings 122 may be spacedly disposed on each of the magnetic columns 123. Optionally, a part of the secondary windings 122 spacedly disposed on different magnetic columns 123 and located at a same stacking layer may be disposed on a same PCB.
As shown in FIG. 29, the high-voltage transformer 120 may include 2 primary windings 121 and 2n secondary windings 122, and the magnetic core may include two magnetic columns 123, wherein one of the primary windings 121 and its corresponding secondary windings 122 (n secondary windings 122) are disposed around one of the magnetic columns 123, and the other of the primary windings 121 and its corresponding secondary windings 122 (n secondary windings 122) are disposed around the other of the magnetic columns 123. Positions and counts of the secondary windings 122 spacedly disposed on the two magnetic columns 123 are the same, and the secondary windings 122 are spacedly disposed on the two magnetic columns 123 at the same stacking layer are disposed on the same PCB, and each PCB board is disposed with 2m secondary windings 122 and 2m rectification circuits, for a total of n/m PCBs.
In the embodiments of the present disclosure, by arranging a plurality of PCBs to arrange the plurality of secondary windings 122, and by connecting rectification circuits in two adjacent PCBs in series, the insulation between adjacent secondary windings may be realized, so that there is no need for additional flat insulation components, and the production cost of the high-voltage transformer 120 may be reduced by streamlining the devices.
FIG. 30 is a top perspective diagram illustrating a high-voltage transformer 120 including a plurality of PCBs, according to some embodiments of the present disclosure.
As shown in FIG. 30, m rectification circuits are disposed in a top layer of a topmost PCB, wherein m/2 rectification circuits are disposed in a circular arrangement around a magnetic column 123, and another m/2 rectification circuits are disposed in a circular arrangement around another magnetic column 123, and the m rectification circuits are connected in series to realize boosting to form output ends HV1+ and HV1-.
FIG. 31 is a schematic diagram illustrating another connection between a high-voltage transformer 120 and a plurality of rectification circuits according to some other embodiments of the present disclosure.
In some embodiments, a connection point between rectification circuits corresponding to two adjacent secondary windings 122 of the plurality of secondary windings 122 is grounded.
As shown in FIG. 31, the high-voltage transformer 120 includes a plurality of primary windings 121, n secondary windings 122, and n rectification circuits. Rectification circuits corresponding to two adjacent secondary windings 122 are connected in series. Connection ends of two adjacent rectification circuits are connected to the grounding end GND, and the n/2 rectification circuits on one side of the ground end GND are connected in series to form an output end HV+ for outputting a positive direct current voltage, and the other n/2 rectification circuits on the other side of the ground end GND are connected in series to form an output end HV-for outputting a negative direct current voltage.
In the embodiments of the present disclosure, the high-voltage transformer 120 may be designed by grounding the connection points between the rectification circuits so that the high-voltage transformer 120 may output both a positive DC voltage and a negative DC voltage, so that the high-voltage transformer 120 may realize a bipolar output, thereby expanding the application scenarios of the high-voltage transformer 120.
FIG. 32 and FIG. 33 are schematic diagrams illustrating cross-sections of a high-voltage transformer 120 including a plurality of PCBs, according to some other embodiments of the present disclosure.
As shown in FIG. 32, the high-voltage transformer 120 may include 2 primary windings 121 and n secondary windings 122, and the magnetic core includes two magnetic columns 123. One primary winding 121 and its corresponding secondary windings 122 are disposed around one magnetic column 123, and the other primary winding 121 and its corresponding secondary windings 122 are disposed around the other magnetic column 123. Each PCB is disposed with m secondary windings 122 and m rectification circuits, for a total of n/m PCBs. A connection end between two adjacent PCBs located in the center region is connected to the grounding end GND, and a negative high voltage output by the output end HV-is located on an upper side of the magnetic core, and a positive high voltage output by the output end HV+ is located on a lower side of the magnetic core.
Compared to the high-voltage transformer 120 shown in FIG. 32, in the high-voltage transformer 120 illustrated in FIG. 33, the output ends of the rectification circuits in the PCBs located at the topmost and the bottommost parts of the PCBs are connected to the grounding end GND, respectively. A negative high voltage output from the output end HV-is located on an upper right side of the magnetic core, and a positive high voltage output from the output end HV+ is located on a lower left side of the magnetic core.
The basic concepts have been described above, apparently, in detail, as will be described above, and does not constitute limitations of the disclosure. Although there is no clear explanation here, those skilled in the art may make various modifications, improvements, and modifications of present disclosure. This type of modification, improvement, and corrections are recommended in present disclosure, so the modification, improvement, and the amendment remain in the spirit and scope of the exemplary embodiment of the present disclosure.
At the same time, present disclosure uses specific words to describe the embodiments of the present disclosure. As "one embodiment" , "an embodiment" , and/or "some embodiments" means a certain feature, structure, or characteristic of at least one embodiment of the present disclosure. Therefore, it is emphasized and should be appreciated that two or more references to “an embodiment” or “one embodiment” or “an alternative embodiment” in various parts of present disclosure are not necessarily all referring to the same embodiment. Further, certain features, structures, or features of one or more embodiments of the present disclosure may be combined.
In addition, unless clearly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or the use of other names in the present disclosure are not used to limit the order of the procedures and methods of the present disclosure. Although the above disclosure discusses through various examples what is currently considered to be a variety of useful embodiments of the disclosure, it is to be understood that such detail is solely for that purpose, and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover modifications and equivalent arrangements that are within the spirit and scope of the disclosed embodiments. For example, although the implementation of various components described above may be embodied in a hardware device, it may also be implemented as a software only solution, e.g., an installation on an existing server or mobile device.
Similarly, it should be appreciated that in the foregoing description of embodiments of the present disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the various embodiments. However, this disclosure does not mean that the present disclosure object requires more features than the features mentioned in the claims. Rather, claimed subject matter may lie in less than all features of a single foregoing disclosed embodiment.
In some embodiments, the numbers expressing quantities of ingredients, properties, and so forth, used to describe and claim certain embodiments of the application are to be understood as being modified in some instances by the term “about, ” “approximate, ” or “substantially” . Unless otherwise stated, “about, ” “approximate, ” or “substantially” may indicate ±20%variation of the value it describes. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and the approximation may change according to the characteristics required by the individual embodiments. In some embodiments, the numerical parameter should consider the prescribed effective digits and adopt a general digit retention method. Although in some embodiments, the numerical fields and parameters used to confirm the breadth of its range are approximate values, in specific embodiments, such numerical values are set as accurately as possible within the feasible range.
With respect to each patent, patent application, patent application disclosure, and other material cited in the present disclosure, such as articles, books, manuals, publications, documents, etc., the entire contents thereof are hereby incorporated by reference into the present disclosure. Application history documents that are inconsistent with the contents of the present disclosure or that create conflicts are excluded, as are documents (currently or hereafter appended to the present disclosure) that limit the broadest scope of the claims of the present disclosure. It should be noted that in the event of any inconsistency or conflict between the descriptions, definitions, and/or use of terms in the materials appended to the present disclosure and those described in the present disclosure, the descriptions, definitions, and/or use of terms in the present disclosure shall prevail.
At last, it should be understood that the embodiments described in the present disclosure are merely illustrative of the principles of the embodiments of the present disclosure. Other modifications that may be employed may be within the scope of the present disclosure. Thus, by way of example, but not of limitation, alternative configurations of the embodiments of the present disclosure may be utilized in accordance with the teachings herein. Accordingly, embodiments of the present disclosure are not limited to that precisely as shown and described.

Claims

A device for generating a high voltage, comprising:

a high-voltage transformer disposed in a liquid insulation medium, the high-voltage transformer including at least one primary winding, a plurality of secondary windings, and at least one magnetic column, wherein

the at least one primary winding is disposed around the at least one magnetic column and the plurality of secondary windings are spacedly disposed on the at least one of the magnetic column to allow the liquid insulation medium to flow between different secondary windings.
The device of claim 1, wherein a flat insulation component is disposed between two adjacent secondary windings of the plurality of secondary windings.
The device of claim 2, wherein each of the plurality of secondary windings is connected to a corresponding rectification circuit, and rectification circuits corresponding to the two adjacent secondary windings are in series connection.
The device of claim 3, wherein a connection point between the rectification circuits corresponding to the two adjacent secondary windings is grounded.
The device of claim 3, wherein the series connection includes a U-shaped series connection or a Z-shaped series connection.
The device of claim 5, wherein the U-shaped series connection includes:

a low-voltage output point of a first rectification circuit and a high-voltage output point of a second rectification circuit being disposed opposite to each other along a stacking direction of the plurality of secondary windings; and

a high-voltage output point of the first rectification circuit and a low-voltage output point of the second rectification circuit being disposed opposite to each other along the stacking direction of the plurality of secondary windings, wherein

the first rectification circuit and the second rectification circuit are the rectification circuits corresponding to the two adjacent secondary windings.
The device of claim 5, wherein the Z-shaped series connection includes:

a low-voltage output point of the first rectification circuit and a low-voltage output point of the second rectification circuit being disposed opposite to each other along a stacking direction of the plurality of secondary windings; and

a high-voltage output point of the first rectification circuit and a high-voltage output point of the second rectification circuit being disposed opposite to each other along a stacking direction of the plurality of secondary windings, wherein

the first rectification circuit and the second rectification circuit are the rectification circuits corresponding to the two adjacent secondary windings.
The device of claim 3, wherein each of the plurality of rectification circuits includes at least one diode unit and a plurality of capacitor units, wherein

the at least one diode unit includes a plurality of diodes being in series connection, and the plurality of diodes being divided into multiple diode groups,

at least one compensation capacitor is disposed between two ends of at least one of the multiple diode groups, and

a count of the plurality of capacitor units is at least two, and the plurality of capacitor units being in series connection.
The device of claim 8, wherein a capacitance of the at least one compensation capacitor is greater than a capacitance of a parasitic capacitor of the at least one of the multiple diode groups.
The device of claim 8, wherein the plurality of capacitor units includes at least one first capacitor, and the at least one first capacity being disposed side by side with the at least one diode unit with an interval.
The device of claim 10, wherein the at least one first capacitor includes a metal part, and the metal part of the at least one first capacitor and at least one solder pad of the multiple diode groups form one of the at least one compensation capacitor.
The device of claim 8, wherein the plurality of capacitor units include at least one first capacitor and at least one second capacitor connected in parallel, and the at least one first capacitor, the at least one diode unit, and the at least one second capacitor are disposed side by side with an interval.
The device of claim 12, wherein a metal part of the at least one first capacitor forms one of the at least one compensation capacitor with at least one solder pad of the multiple diode groups, or a metal part of the at least one second capacitor forms one of the at least one compensation capacitor with the at least one solder pad of the multiple diode groups.
The device of claim 3, wherein an output voltage of the plurality of secondary windings is lower than a rated voltage of diodes in the plurality of rectification circuits corresponding to the plurality of secondary windings.
The device of any one of claims 1 or 2, wherein the plurality of secondary windings are disposed on at least one printed circuit board (PCB) .
The device of claim 15, wherein the flat insulation component is an insulation layer of the at least one PCB.
The device of claim 16, wherein the at least one PCB includes a plurality of PCBs, two adjacent secondary windings are respectively disposed on the plurality of the PCBs, a first coil and a second coil, which belong to the two adjacent secondary windings, respectively, are positioned adjacent to each other, and the first coil and the second coil are staggered.
The device of claim 16, wherein a flow direction of current in a first coil and a flow direction of current in a second coil are the same, wherein the first coil and the second coil belong to two adjacent secondary windings of the plurality of secondary windings, respectively, and the first coil is adjacent to the second coil, the at least one PCB includes at least two PCBs, and the two adjacent secondary windings are disposed on two adjacent PCBs.
The device of claim 16, wherein at least one of the plurality of secondary windings includes at least two coils, and the at least two coils are electrically connected, the at least one PCB including at least two layers, the at least two coils are distributed in different layers of the at least two layers of the at least one PCB, and directions of magnetic fields generated by current in the at least two coils are the same.
The device of claim 19, wherein two adjacent coils of the at least two coils of the at least one of the plurality of secondary windings are disposed in a staggered manner.
The device of claim 15, wherein each of the plurality of secondary windings is connected to a corresponding rectification circuit, each of the plurality of secondary windings and its corresponding rectification circuit are disposed on a same PCB, a count of the at least one PCB is at least two, and rectification circuits of two adjacent PCBs are in series connection.
The device of claim 2, wherein a count of the plurality of secondary windings is not less than 2.
The device of claim 2, wherein a ratio of a voltage difference between the two adjacent secondary windings to a breakdown voltage of the flat insulation component between the two adjacent secondary windings is less than 1/3.
The device of claim 2, wherein counts of coil turns of the plurality of secondary windings located in different layers gradually decrease in a direction away from a grounding end.
The device of claim 2, wherein insulation distances between the plurality of secondary windings located in different layers and the at least one primary winding gradually increase in a direction away from a grounding end.
The device of claim 25, wherein the insulation distances between the plurality of secondary windings located in different layers and the at least one primary winding are determined based on a preset field strength, winding radiuses of the at least one primary winding, and voltage differences between the plurality of secondary windings located in different layers and the at least one primary winding.
The device of claim 2, wherein the at least one primary winding and the plurality of secondary windings are disposed around different magnetic columns of the at least one magnetic column, and insulation distances between the plurality of secondary windings and their corresponding magnetic column gradually increases in a direction away from a grounding end.
The device of claim 1, wherein a flow area of the liquid insulation medium between different secondary windings of the plurality of secondary windings is not less than 25 mm².
A medical device, comprising a device for generating a high voltage according to any one of claims 1-29.
A high-voltage transformer, comprising:

at least one magnetic column;

at least one primary winding; and

a plurality of secondary windings corresponding to the at least one primary winding, wherein

the at least one primary winding is disposed around the at least one magnetic column and the plurality of secondary windings are spacedly disposed on the at least one of the magnetic column,

the plurality of secondary windings corresponding to the at least one primary winding are stacked, and the plurality secondary windings are disposed on at least one printed circuit board (PCB) , and each of the plurality of secondary windings includes at least one coil.
The high-voltage transformer of claim 30, wherein the at least one PCB includes a plurality of PCBs, two adjacent secondary windings are respectively disposed on the plurality of the PCBs, a first coil and a second coil, which belong to the two adjacent secondary windings, respectively, are positioned adjacent to each other, and the first coil and the second coil are staggered.
The high-voltage transformer of claim 30, wherein a flow direction of current in a first coil and a flow direction of current in a second coil are the same, wherein the first coil and the second coil belong to two adjacent secondary windings of the plurality of secondary windings, respectively, and the first coil is adjacent to the second coil, the at least one PCB includes at least two PCBs, and the two adjacent secondary windings are disposed on two adjacent PCBs.
The high-voltage transformer of claim 30, wherein at least one of the plurality of secondary windings includes at least two coils, and the at least two coils are electrically connected, the at least one PCB including at least two layers, the at least two coils are distributed in different layers of the at least two layers of the at least one PCB, and directions of magnetic fields generated by current in the at least two coils are the same.
The high-voltage transformer of claim 33, wherein two adjacent coils of the at least two coils of the at least one of the plurality of secondary windings are disposed in a staggered manner.
The high-voltage transformer of claim 30, wherein the each of the plurality of secondary windings is connected to a corresponding rectification circuit, and rectification circuits corresponding to two adjacent secondary windings are in series connection.
The high-voltage transformer of claim 35, wherein a capacitor is in parallel connection with an output end of one of the plurality of rectification circuits corresponding to the plurality of secondary windings.
The high-voltage transformer of claim 35, wherein one of the plurality of rectification circuits corresponding to the plurality of secondary windings is a full bridge rectification circuit or a double voltage rectification circuit.
The high-voltage transformer of claim 35, wherein a connection point between the rectification circuits corresponding to the two adjacent secondary windings is grounded.
The high-voltage transformer of claim 35, wherein a count of the at least one PCB is at least two, and rectification circuits of the two adjacent PCBs are in series connection.
The high-voltage transformer of claim 39, wherein the series connection between the rectification circuits of the two adjacent PCBs includes a U-shaped series connection or a Z-shaped series connection.
The high-voltage transformer of claim 40, wherein the U-shaped series connection includes:

a low-voltage output point of a third rectification circuit and a high-voltage output point of a fourth rectification circuit being disposed opposite to each other along a stacking direction of the plurality of secondary windings; and

a high-voltage output point of the third rectification circuit and a low-voltage output point of the fourth rectification circuit being disposed opposite to each other along the stacking direction of the plurality of secondary winding, wherein

the third rectification circuit and the fourth rectification circuit are the rectification circuits of the two adjacent PCBs.
The high-voltage transformer of claim 40, wherein the Z-shaped series connection includes:

a low-voltage output point of a third rectification circuit and a low-voltage output point of a fourth rectification circuit being disposed opposite to each other along a stacking direction of the plurality of secondary windings; and

a high-voltage output point of the third rectification circuit and a high-voltage output point of the fourth rectification circuit being disposed opposite to each other along the stacking direction of the plurality of secondary windings, wherein

the third rectification circuit and the fourth rectification circuit are the rectification circuits of the two adjacent PCBs.
The high-voltage transformer of claim 36, wherein each of the plurality of rectification circuits corresponding to the plurality of secondary windings includes at least one diode unit and a plurality of capacitor units, wherein

the at least one diode unit includes a plurality of diodes being in series connection, and the plurality of diodes being divided into multiple diode groups,

at least one compensation capacitor is disposed between two ends of at least one of the multiple diode groups, and

a count of the plurality of capacitor units is at least two, and the plurality of capacitor units being in series connection.
The device of claim 43, wherein a capacitance of the at least one compensation capacitor is greater than a capacitance of a parasitic capacitor of the at least one of the multiple diode groups.
The device of claim 35, wherein an output voltage of the plurality of secondary windings is lower than a rated voltage of a diodes in the plurality of rectification circuits corresponding to the plurality of secondary windings.
The high-voltage transformer of claim 30, wherein the high-voltage transformer is disposed in a liquid insulation medium inside a device for generating a high voltage, and a count of the at least one PCB is at least two, which are stacked to allow the liquid insulation medium to flow between the at least two PCBs.
The high-voltage transformer of claim 46, wherein a count of the plurality of secondary windings is not less than 2.
The high-voltage transformer of claim 46, wherein a ratio of a voltage difference between two adjacent secondary windings to a breakdown voltage of a PCB or an insulation layer of a PCB between the two adjacent secondary windings is less than 1/3.
The high-voltage transformer of claim 30, wherein counts of coil turns of the plurality of secondary windings gradually decrease in a direction away from a grounding end.
The high-voltage transformer of claim 30, wherein insulation distances between the plurality of secondary windings and the at least one primary winding gradually increase in a direction away from a grounding end.
The high-voltage transformer of claim 50, wherein the insulation distances between the plurality of secondary windings and the at least one primary winding are determined based on a preset field strength, a winding radius of the at least one primary winding, and voltage differences between the plurality of secondary windings located in different layers and the at least one primary winding.
The high-voltage transformer of claim 30, wherein the at least one primary winding and the plurality of secondary windings are disposed around different magnetic columns, and insulation distances between the plurality of secondary windings and their corresponding magnetic columns gradually increase in a direction away from a grounding end.
The high-voltage transformer of claim 30, wherein the high-voltage transformer comprises a composite magnetic core composed of at least two magnetic cores, and the composite magnetic core includes at least one magnetic column.
The high-voltage transformer of claim 30, wherein a count of the at least one magnetic column is at least two, and each of the at least two magnetic columns is sleeved by secondary windings on a same position and a same count, and the secondary windings spacedly disposed on the same position of the at least two magnetic columns are disposed on a same PCB.
A medical device, comprising a high-voltage transformer according to any one of claims 30-55.