EP4646793A1

EP4646793A1 - Multi-band radio frequency frontend circuit

Info

Publication number: EP4646793A1
Application number: EP23847976.0A
Authority: EP
Inventors: Loizos Loizou; Domingo Farias; Marty FAN; Woo Yong Lee; Stephen E. Richard; Nadim Khlat
Original assignee: Qorvo US Inc
Current assignee: Qorvo US Inc
Priority date: 2023-01-05
Filing date: 2023-12-18
Publication date: 2025-11-12
Also published as: CN120359710A; KR20250129760A; TW202437712A; WO2024147909A1

Abstract

A multi-band radio frequency (RF) frontend circuit is provided. In an embodiment, the multi-band RF frontend circuit can be configured to include only five highly integrated frontend modules (FEMs) each configured to transmit and/or receive in multiple RF bands. Specifically, the five FEMs can be flexibly configured to support a variety of transmit/receive configurations, such as multiple-input, multiple-output (MIMO), dual-connectivity (DC), and diversity receive, across a wide range of RF bands. As a result, the multi-band RF frontend circuit can support multi-technology and multi-band communications with significantly reduced complexity, build-of-material (BoM) cost, and footprint compared to a conventional RF frontend circuit.

Description

MULTI-BAND RADIO FREQUENCY FRONTEND CIRCUIT

Related Applications

[0001] This application claims the benefit of U.S. provisional patent application serial number 63/478,513 filed on January 5, 2023, and U.S. provisional patent application serial number 63/501 ,529 filed on May 1 1 , 2023, the disclosures of which are incorporated herein by reference in their entireties.

Field of the Disclosure

[0002] The technology of the disclosure relates generally to a radio frequency (RF) frontend circuit capable of supporting multiple RF bands.

Background

[0003] Mobile communication devices have become increasingly common in current society for providing wireless communication services. The prevalence of these mobile communication devices is driven in part by the many functions that are now enabled on such devices. Increased processing capabilities in such devices means that mobile communication devices have evolved from being pure communication tools into sophisticated mobile multimedia centers that enable enhanced user experiences.

[0004] A state-of-the-art mobile communication device must be able to communicate a radio frequency (RF) signal(s) in a variety of wireless communication systems, such as long-term evolution (LTE) and new radio (NR), based on a variety of transmit/receive configurations, such as multiple-input, multiple-output (MIMO), dual-connectivity (DC), and diversity receive. Moreover, the state-of-the-art mobile communication device is required to communicate the RF signal(s) across a wide range of RF spectrum that can be coarsely categorized into low band (LB), mid-high band (MHB), and ultra-high band (UHB). Conventionally, the LB refers to an RF spectrum below 1 GHz, the MHB refers to an RF spectrum between 1 and 3 GHz, and the UHB refers to an RF spectrum between 3 and 5 GHz. Among them, the MHB may be further divided into a medium band (MB) between 1 and 2 GHz and a high band (HB) between 2 and 3 GHz.

[0005] Each of the LB, MB, MHB, HB, and UHB RF spectrums can be further configured to include one or more RF bands. As an example, the LB can include RF bands 20 and 28, the MB can include RF bands 3, 25, and 66, the HB can include RF bands 40 and 41 , and the UHB can include RF bands 77 and 79. [0006] In order to transmit or receive the RF signal(s) in the LTE or the NR system, the mobile communication device is required to transmit and receive a sounding reference signal(s) (SRS) periodically. On one hand, the mobile communication device is required to transmit an uplink SRS(s) to a base station (e.g., eNB in LTE or gNB in NR), whereby the base station can figure out the quality of an uplink channel, such as a physical uplink shared channel (PUSCH), in each subcarrier section across the frequency domain. Moreover, when channel reciprocity exists, the uplink SRS(s) can also be used by the base station to estimate channel state information and eigenmodes of a downlink channel, such as a physical downlink shared channel (PDSCH). Such estimation can help the base station determine downlink and uplink channel allocation as well as beamforming configuration for the mobile communication device. On the other hand, the mobile communication device must use a downlink SRS(s) transmitted by the base station to help determine channel quality (e.g., received power) of a downlink channel, such as a physical downlink shared channel (PUSCH). In this regard, it is mandatory for the mobile communication device to transmit the uplink SRS(s) and receive the downlink SRS(s) on a periodic basis. [0007] Understandably, the variety of combinations of communication systems, transmit/receive technologies, and/or RF bands can substantially increase implementation complexity, build-of-material (BoM) cost, and footprint of an RF frontend circuit. As such, it is necessary to optimize the RF frontend circuit to support multi-technology and multi-band communications with reduced complexity, BoM cost, and footprint.

[0008] Embodiments of the disclosure relate to a multi-band radio frequency (RF) frontend circuit. In an embodiment, the multi-band RF frontend circuit can be configured to include only five highly integrated frontend modules (FEMs) each configured to transmit and/or receive in multiple RF bands. Specifically, the five FEMs can be flexibly configured to support a variety of transmit/receive configurations, such as multiple-input, multiple-output (MIMO), dual-connectivity (DC), and diversity receive, across a wide range of RF bands. As a result, the multi-band RF frontend circuit can support multi-technology and multi-band communications with significantly reduced complexity, build-of-material (BoM) cost, and footprint compared to a conventional RF frontend circuit.

[0009] In one aspect, a multi-band RF frontend circuit is provided. The multiband RF frontend circuit includes a first medium-high band (MHB) frontend module (FEM) (MHB FEM). The first MHB FEM is configured to transmit and receive at least one new-radio (NR) MHB signal in an NR MHB. The multi-band RF frontend circuit also includes a low-band (LB) FEM (LB FEM). The LB FEM is configured to transmit and receive an NR LB signal in an NR LB. The LB FEM is also configured to transmit and receive a long-term-evolution (LTE) LB signal in an LTE LB. The multi-band RF frontend circuit also includes a second MHB FEM. The second MHB FEM is configured to transmit and receive at least one LTE MHB signal in an LTE MHB. The multi-band RF frontend circuit also includes a first ultra-high-band (UHB) FEM. The first UHB FEM is configured to transmit and receive at least one UHB signal in an UHB. The multi-band RF frontend circuit also includes a second UHB FEM. The second UHB FEM is configured to transmit and receive the at least one UHB signal in the UHB.

[0010] In another aspect, a wireless device is provided. The wireless device includes a multi-band RF frontend circuit. The multi-band RF frontend circuit includes a first medium-high band (MHB) frontend module (FEM) (MHB FEM). The first MHB FEM is configured to transmit and receive at least one new-radio (NR) MHB signal in an NR MHB. The multi-band RF frontend circuit also includes a low-band (LB) FEM (LB FEM). The LB FEM is configured to transmit and receive an NR LB signal in an NR LB. The LB FEM is also configured to transmit and receive a long-term-evolution (LTE) LB signal in an LTE LB. The multi-band RF frontend circuit also includes a second MHB FEM. The second MHB FEM is configured to transmit and receive at least one LTE MHB signal in an LTE MHB. The multi-band RF frontend circuit also includes a first ultra-high- band (UHB) FEM. The first UHB FEM is configured to transmit and receive at least one UHB signal in a UHB. The multi-band RF frontend circuit also includes a second UHB FEM. The second UHB FEM is configured to transmit and receive the at least one UHB signal in the UHB.

[0011] In another aspect, a method for operating a multi-band RF frontend circuit is provided. The method includes configuring a first MHB FEM to transmit and receive at least one NR MHB signal in an NR MHB. The method also includes configuring an LB FEM to transmit and receive an NR LB signal in an NR LB and transmit and receive an LTE LB signal in an LTE LB. The method also includes configuring a second MHB FEM to transmit and receive at least one LTE MHB signal in an LTE MHB. The method also includes configuring a first UHB FEM to transmit and receive at least one UHB signal in an UHB. The method also includes configuring a second UHB FEM to transmit and receive the at least one UHB signal in the UHB.

[0012] Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.

Brief Description of the Drawing Figures

[0013] The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.

[0014] Figure 1 is a schematic diagram of an exemplary existing radio freguency (RF) frontend circuit that reguires eleven (1 1 ) discrete frontend modules (FEMs) to support multi-band communication; [0015] Figure 2 is a schematic diagram of an exemplary wireless communication circuit, wherein a multi-band RF frontend circuit is configured according to an embodiment of the present disclosure to support multi-band communication based on five (5) highly integrated FEMs;

[0016] Figure 3 is a schematic diagram of an exemplary user element wherein the wireless communication circuit of Figure 2 can be provided; and

[0017] Figure 4 is a flowchart of an exemplary process for configuring the multi-band RF frontend circuit in Figure 2.

Detailed Description

[0018] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

[0019] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. [0020] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or extending "onto" another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or extending "directly onto" another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being "over" or extending "over" another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly over" or extending "directly over" another element, there are no intervening elements present. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0021] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0022] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including" when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0023] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0024] Embodiments of the disclosure relate to a multi-band radio frequency (RF) frontend circuit. In an embodiment, the multi-band RF frontend circuit can be configured to include only five highly integrated frontend modules (FEMs) each configured to transmit and/or receive in multiple RF bands. Specifically, the five FEMs can be flexibly configured to support a variety of transmit/receive configurations, such as multiple-input, multiple-output (MIMO), dual-connectivity (DC), and diversity receive, across a wide range of RF bands. As a result, the multi-band RF frontend circuit can support multi-technology and multi-band communications with significantly reduced complexity, build-of-material (BoM) cost, and footprint compared to a conventional RF frontend circuit.

[0025] Before discussing the multi-band RF frontend circuit of the present disclosure, starting at Figure 2, a brief overview of a conventional RF frontend circuit is first provided with reference to Figure 1 to help explain the technical problems to be solved by the multi-band RF frontend circuit of the present disclosure.

[0026] Figure 1 is a schematic diagram of an exemplary existing RF frontend circuit 10 that requires eleven (1 1 ) discrete frontend modules (FEMs) 12(1 )- 12(1 1 ) to support multi-band communication. Specifically, the FEM 12(1 ) is configured to transmit and receive in long-term evolution (LTE) mid-high band (MHB), the FEM 12(2) is configured to transmit and receive in LTE low band (LB), the FEM 12(3) is configured to transmit and receive in new radio (NR) MHB, the FEM 12(4) is configured to provide diversity receive in LTE MHB, the FEM 12(5) is configured to provide diversity receive in NR MHB, the FEM 12(6) is configured to provide diversity receive in LTE LB, the FEM 12(7) is configured to provide power amplification for NR LB, the FEMs 12(8) and 12(9) are configured to transmit and receive in ultra-high band (UHB) number 77 (n77) or UHB number 79 (n79), and the FEMs 12(10) and 12(1 1 ) are configured to transmit and receive in UHB number 79 (n79). [0027] The existing RF frontend circuit 10 can face several challenges. First of all, the FEMs 12(1 )-12(11 ) will inevitably demand a larger space on a printed circuit board (PCB). This proves to be very challenging as overall size of the PCB continues to shrink due, in part, to mobile device miniaturization. Second, as the FEMs 12(1 )-12(11 ) need to be interconnected with other active/passive components (e.g., antenna, switch, filter, etc.) on the PCB, it becomes increasingly challenging to not only lay out such complex interconnections but also provide adequate separation to help reduce interference between the interconnections. Third, each of the FEMs 12(1 )-12(1 1 ) may need to provide more physical pins to enable interconnections with other components on the PCB, thus leading to an increased complexity in the FEMs 12(1 )-12(11 ). Last but not least, by employing the FEMs 12(1 )-12(11 ), the existing RF frontend circuit 10 may be associated with a higher BoM cost, thus becoming less attractive to many original equipment manufacturers (OEMs). Hence, the technical problem that needs to be solved is to support multi-band communication with a fewer number of FEMs.

[0028] In this regard, Figure 2 is a schematic diagram of an exemplary wireless communication circuit 14, wherein a multi-band RF frontend circuit 16 is configured according to an embodiment of the present disclosure to support multi-band communication based on five (5) highly integrated FEMs 18(1 )-18(5). In context of the present disclosure, each of the FEMs 18(1 )-18(5) can be provided as a system-in-package (SiP). In an embodiment, the FEM 18(1 ) (a.k.a. “first MHB FEM”) is an integration of the FEMs 12(3), 12(5), and 12(7) in Figure 1 , the FEM 18(2) (a.k.a. “LB FEM”) is an integration of the FEMs 12(2) and 12(6) in Figure 1 , the FEM 18(3) (a.k.a. “second MHB FEM”) is an integration of the FEMs 12(1 ) and 12(4) in Figure 1 , the FEM 18(4) (a.k.a. “first UHB FEM”) is an integration of the FEMs 12(8) and 12(10) in Figure 1 , and the FEM 18(5) (a.k.a. “second UHB FEM”) is an integration of the FEMs 12(9) and 12(1 1 ) in Figure 1 .

[0029] By reducing the discrete FEMs 12(1 )-12(1 1 ) in the existing RF frontend circuit 10 of Figure 1 to the highly integrated FEMs 18(1 )-18(5) herein, the multi- band RF frontend circuit 16 can support multi-band communication with reduced footprint, complexity, and BoM cost. As a result, it is possible to effectively solve the technical problem described above.

[0030] In an embodiment, the multi-band RF frontend circuit 16 includes a first primary antenna ANTPI, a second primary antenna ANTP2, a third primary antenna ANTPS, a first secondary antenna ANTsi, a second secondary antenna ANTS2, and a third secondary antenna ANTsa. In a non-limiting example, the first primary antenna ANTPI, the second primary antenna ANTP2, and the third primary antenna ANTPS can be provided on a backside of a mobile device (e.g., a smartphone) while the first secondary antenna ANTsi, the second secondary antenna ANTss, and the third secondary antenna ANTss are provided on a frontside of the mobile device. The first primary antenna ANTPI , the second primary antenna ANTPS, the third primary antenna ANTPS, the first secondary antenna ANTsi, the second secondary antenna ANTs , and the third secondary antenna ANTss can be antennas of any type and/or shape, including but not limited to patch antennas and shorted monopole antennas.

[0031] In an embodiment, the FEMs 18(1 ) and 18(2) are coupled to the first primary antenna ANTPI via a first filter circuit 20, the FEMs 18(2) and 18(3) are coupled to the second primary antenna ANT S via a second filter circuit 22, the FEMs 18(1 ) and 18(5) are coupled to the third secondary antenna ANTss via a third filter circuit 24, the FEM 18(3) is also directly coupled to the third primary antenna ANTPS, and the FEM 18(4) is coupled directly to the first secondary antenna ANTsi and the second secondary antenna ANTs2.

[0032] According to another embodiment of the present disclosure, the first filter circuit 20 includes an MHB transmit/receive filter, an LB transmit filter, and an UHB receive filter. The second filter circuit 22 includes an LB transmit filter and an MHB receive filter. The third filter circuit 24 includes an MHB receive filter and an UHB transmit/receive filter. For the sake of simplicity, the various filters in the first filter circuit 20, the second filter circuit 22, and the third filter circuit 24 are omitted herein. [0033] The FEMs 18(1 )-18(5) can each be configured to include a respective one of multiple antenna-switching modules (ASWs) 26(1 )-26(5). More specifically, the ASW 26(1 ) can selectively couple the FEM 18(1 ) to the first primary antenna ANTPI and/or the third secondary antenna ANTss, the ASW 26(2) can selectively couple the FEM 18(2) to the first primary antenna ANTPI and/or the second primary antenna ANTP2, the ASW 26(3) can selectively couple the FEM 18(3) to the second primary antenna ANTP2 and/or the third primary antenna ANTPS, the ASW 26(4) can selectively couple the FEM 18(4) to the first secondary antenna ANTsi, the second secondary antenna ANTs2, and/or the FEM 18(5), and the ASW 26(5) can selectively couple the FEM 18(5) to the third secondary antenna ANTss and/or the FEM 18(4). Understandably, the ASWs 26(1 )-26(5) may each be configured to include any number and/or type of switches that are deemed appropriate.

[0034] The wireless communication circuit 14 can be configured to further include a transceiver circuit 28. Herein, the transceiver circuit 28 may provide an outgoing RF signal(s) 30 to be transmitted by any of the FEMs 18(1 )-18(5) and receive an incoming RF signal(s) 32 as received by any of the FEMs 18(1 )-18(5). [0035] In an embodiment, the first FEM 18(1 ) can be configured to transmit an outgoing sounding reference signal (NR SRSo) in the NR MHB via the first primary antenna ANTPI and receive a pair of incoming SRSs (NR SRSo and NR SRSi) in an NR MHB via the first primary antenna ANTPI and the third secondary antenna ANTss, respectively. In this regard, the first FEM 18(1 ) can be used to provide both primary transmission and diversity reception functionalities in the NR MHB. Notably, the FEM 18(1 ) is configured to transmit/receive the SRSs (NR SRSo and NR SRSi) without interrupting diversity receive for enhanced dualconnectivity (EN-DC) in high band (HB) 40 (n40) and HB 41 (n41 ). In an embodiment, the ASW 26(1 ) can be multi-closed such that the FEM 18(1 ) can transmit/receive in the HB n40/n41 concurrent to receiving in medium bands (MBs) 3, 25, and/or 66. To be multi-closed, the ASW 26(1 ) is so implemented to provide more than 60 dB transmit-to-receive isolation in HB 40 and HB 41 . [0036] As mentioned earlier, the FEM 1 (7) in Figure 1 is integrated into the FEM 18(1 ) herein. As such, the FEM 18(1 ) can include an LB power amplifier (not shown) to amplify an NR LB signal 34 and/or an LTE LB signal 36 and provide the amplified NR LB signal 34 and/or the amplified LTE LB signal 36 to the FEM 18(2).

[0037] The FEM 18(2), in turn, can transmit the amplified NR LB signal 34 via the first primary antenna ANTPI and/or the amplified LTE LB signal 36 via the second primary antenna ANTP2. In an embodiment, the FEM 18(2) may support EN-DC operation by simultaneously transmitting/receiving the NR LB signal 34 and the LTE LB signal 36. In this regard, the first FEM 18(2) can be used to provide both primary transmission and diversity reception functionalities in the NR and LTE LBs.

[0038] The FEM 18(3) may be configured to transmit an outgoing SRS (LTE SRSo) in an LTE MHB via the second primary antenna ANTP2 and receive a pair of incoming SRSs (LTE SRSo and LTE SRSi) in the LTE MHB via the second primary antenna ANTP2 and the third primary antenna ANTPS, respectively. In this regard, the first FEM 18(3) can be used to provide both primary transmission and diversity reception functionalities in the LTE MHB. In an embodiment, the outgoing SRS (LTE SRSo) and/or the incoming SRSs (LTE SRSo and LTE SRSi) may be communicated between the FEMs 18(1 ) and 18(3).

[0039] The FEM 18(4) can be configured to transmit an outgoing SRS (UHB SRSo) in the UHB via the first secondary antenna ANTsi and receive a pair of incoming SRSs (UHB SRSo and UHB SRSi) in the UHB via the first secondary antenna ANTsi and the second secondary antenna ANTs2, respectively.

[0040] Alternatively, the FEM 18(5) may be configured to transmit the outgoing SRS (UHB SRSo) in the LTE MHB via the third secondary antenna ANTss and receive the pair of incoming SRSs (UHB SRSo and UHB SRSi) in the LTE MHB via the third primary antenna ANTss and the first primary antenna ANTPI , respectively. [0041] Herein, the FEM 18(4) and the FEM 18(5) are provided as separate circuits. It should be appreciated that it is also possible to integrate the FEM 18(4) and the FEM 18(5) into a single SiP.

[0042] The multi-band RF frontend circuit 16, as described herein, is advantageous over the existing RF frontend circuit 10 in Figure 1 in many aspects. In one aspect, the multi-band RF frontend circuit 16 includes only five FEMs 18(1 )-18(5) compared to the 11 FEMs 12(1 )-12(1 1 ) in Figure 1 . This brings significant savings in terms of space, cost, and/or number of bus lines, such as MIPI® RF frontend (RFFE) bus lines. As a result, it is possible to simplify inventory and logistics management and shorten PCB development time. In another aspect, by sharing a respective one of the ASWs 26(1 )-26(5) between multiple transmit/receive paths in each of the FEMs 18(1 )-18(5), it is possible to implement a simpler antenna swapping and SRS configuration. In another aspect, by multi-closing the ASW 26(1 ) in the FEM 18(1 ), it is possible to enable a band 40/41 transmission current to receive in band 3/25/66, thus helping to support SRS functionality without interrupting EN-DC operation.

[0043] In another aspect, interconnectivity becomes easier as less routing is needed and will help reduce coupling issues on the PCB. In addition, the multiband RF frontend circuit 16 can also provide cost reduction related to laminate manufacturing and assembly. Further, by bringing, for example, MHB transmission and diversity receive together, it is possible to reduce BoM cost by using a common ASW as well as a low-noise amplifier (LNA) to thereby reduce the footprint of the multi-band RF frontend circuit 16.

[0044] The wireless communication circuit 14 of Figure 2 can be provided in a user element to provide beamforming phase correction. Figure 3 is a schematic diagram of an exemplary user element 100 wherein the wireless communication circuit 14 of Figure 2 can be provided.

[0045] Herein, the user element 100 can be any type of user elements, such as mobile terminals, smart watches, tablets, computers, navigation devices, access points, and like wireless communication devices that support wireless communications, such as cellular, wireless local area network (WLAN), Bluetooth, and near field communications. The user element 100 will generally include a control system 102, a baseband processor 104, transmit circuitry 106, receive circuitry 108, antenna switching circuitry 110, multiple antennas 112, and user interface circuitry 1 14. In a non-limiting example, the control system 102 can be a field-programmable gate array (FPGA), as an example. In this regard, the control system 102 can include at least a microprocessor(s), an embedded memory circuit(s), and a communication bus interface(s). The receive circuitry 108 receives radio frequency signals via the antennas 1 12 and through the antenna switching circuitry 110 from one or more base stations. A low noise amplifier and a filter cooperate to amplify and remove broadband interference from the received signal for processing. Downconversion and digitization circuitry (not shown) will then downconvert the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams using analog-to-digital converter(s) (ADC).

[0046] The baseband processor 104 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations, as will be discussed in greater detail below. The baseband processor 104 is generally implemented in one or more digital signal processors (DSPs) and application specific integrated circuits (ASICs).

[0047] For transmission, the baseband processor 104 receives digitized data, which may represent voice, data, or control information, from the control system 102, which it encodes for transmission. The encoded data is output to the transmit circuitry 106, where a digital-to-analog converter(s) (DAC) converts the digitally encoded data into an analog signal and a modulator modulates the analog signal onto a carrier signal that is at a desired transmit frequency or frequencies. A power amplifier will amplify the modulated carrier signal to a level appropriate for transmission, and deliver the modulated carrier signal to the antennas 1 12 through the antenna switching circuitry 110 to the antennas 1 12. The multiple antennas 1 12 and the replicated transmit and receive circuitries 106, 108 may provide spatial diversity. Modulation and processing details will be understood by those skilled in the art.

[0048] In an embodiment, the multi-band RF frontend circuit 16 in Figure 2 can be incorporated with antenna switching circuitry 1 10. The antennas 1 12 can include the first primary antenna ANTPI , the second primary antenna ANTP2, the third primary antenna ANT S, the first secondary antenna ANTsi, the second secondary antenna ANTs2, and the third secondary antenna ANTss.

[0049] The multi-band RF frontend circuit 16 in Figure 2 can be configured according to a process. In this regard, Figure 4 is a flowchart of an exemplary process 200 for configuring the multi-band RF frontend circuit 16 in Figure 2. [0050] Herein, the process 200 includes configuring the first MHB FEM 18(1 ) to transmit and receive at least one new-radio NR MHB signal in an NR MHB (step 202). The process 200 also includes configuring the LB FEM 18(2) to transmit and receive an NR LB signal in an NR LB and transmit and receive an LTE LB signal in an LTE LB (step 204). The process 200 also includes configuring a second MHB FEM 18(3) to transmit and receive at least one LTE MHB signal in an LTE MHB (step 206). The process 200 also includes configuring a first UHB FEM 18(4) to transmit and receive at least one UHB signal in an UHB (step 208). The process 200 also includes configuring a second UHB FEM 18(5) to transmit and receive the at least one UHB signal in the UHB (step 210).

[0051] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.

Claims

Claims What is claimed is:

1 . A multi-band radio frequency, RF, frontend circuit (16) comprising: a first medium-high band, MHB, frontend module, FEM, MHB FEM, (18(1 )) configured to transmit and receive at least one new-radio, NR, MHB signal in an NR MHB; a low-band, LB, FEM, LB FEM, (18(2)) configured to: transmit and receive an NR LB signal in an NR LB; and transmit and receive a long-term-evolution, LTE, LB signal in an LTE LB; a second MHB FEM (18(3)) configured to transmit and receive at least one LTE MHB signal in an LTE MHB; a first ultra-high-band, UHB, FEM (18(4)) configured to transmit and receive at least one UHB signal in an UHB; and a second UHB FEM (18(5)) configured to transmit and receive the at least one UHB signal in the UHB.

2. The multi-band RF frontend circuit of claim 1 , further comprising: a first primary antenna (ANTPI) coupled to the first MHB FEM (18(1 )), the LB FEM (18(2)), and the second UHB FEM (18(5)); a second primary antenna (ANTP2) coupled to the LB FEM (18)2)) and the second MHB FEM (18(3)); a third primary antenna (ANTPS) coupled to the second MHB FEM (18(3)); a first secondary antenna (ANTsi) and a second secondary antenna (ANTS2) each coupled to the first UHB FEM (18(4)); and a third secondary antenna (ANTss) coupled to the second UHB FEM (18(5)) and the first MHB FEM (18(1 )).

3. The multi-band RF frontend circuit of claim 2, wherein the first UHB FEM (18(4)) is further configured to: transmit an outgoing sounding reference signal, SRS, (UHB SRSo) in the UHB via the first secondary antenna (ANTsi); and receive a pair of incoming SRSs (UHB SRSo and UHB SRSi) in the UHB via the first secondary antenna (ANTsi) and the second secondary antenna (ANTs2), respectively.

4. The multi-band RF frontend circuit of claim 2, wherein the second UHB

FEM (18(5)) is further configured to: transmit an outgoing sounding reference signal, SRS, (UHB SRSo) in the UHB via the third secondary antenna (ANTss); and receive a pair of incoming SRSs (UHB SRSo and UHB SRSi) in the UHB via the third secondary antenna (ANTss) and the first primary antenna (ANTPI), respectively.

5. The multi-band RF frontend circuit of claim 2, wherein the first MHB FEM is further configured to: transmit an outgoing sounding reference signal, SRS, (NR SRSo) in the NR MHB via the first primary antenna (ANTPI); and receive a pair of incoming SRSs (NR SRSo and NR SRSi) in the NR MHB via the first primary antenna (ANTPI) and the third secondary antenna (ANTss), respectively.

6. The multi-band RF frontend circuit of claim 5, wherein the first MHB FEM (18(1 )) is further configured to: amplify one or more of an NR LB signal (34) and an LTE LB signal (36); and provide the one or more amplified NR LB signal (34) and the amplified LTE LB signal (36) to the LB FEM (18(2)).

7. The multi-band RF frontend circuit of claim 2, wherein the LB FEM (18(2)) is further configured to: transmit and receive the NR LB signal (34) via the first primary antenna (ANTPI); and transmit and receive the LTE LB signal (36) via the second primary antenna (ANTP2).

8. The multi-band RF frontend circuit of claim 2, wherein the second MHB

FEM (18(3)) is further configured to: transmit an outgoing sounding reference signal, SRS, (LTE SRSo) in the LTE MHB via the second primary antenna (ANT P); and receive a pair of incoming SRSs (LTE SRSo and LTE SRSi) in the LTE MHB via the second primary antenna (ANT 2) and the third primary antenna (ANT S).

9. The multi-band RF frontend circuit of claim 8, wherein the second MHB FEM (18(3)) is further configured to: receive the outgoing SRS (LTE SRSo) from the first MHB FEM (18(1 )); and provide the pair of incoming SRSs (LTE SRSo and LTE SRSi) to the first MHB FEM (18(1 )).

10. The multi-band RF frontend circuit of claim 1 , wherein the first MHB FEM is further configured to provide primary transmission and diversity reception capabilities in the NR MHB.

1 1 . The multi-band RF frontend circuit of claim 1 , wherein the LB FEM is further configured to provide primary transmission and diversity reception capabilities in the NR LB and the LTE LB.

12. The multi-band RF frontend circuit of claim 1 , wherein the second MHB FEM is further configured to provide primary transmission and diversity reception capabilities in the LTE MHB.

13. The multi-band RF frontend circuit of claim 1 , wherein the first UHB FEM and the second UHB FEM are integrated into a single system-in-package, SiP.

14. A wireless device (100) comprising: a multi-band radio frequency, RF, frontend circuit (16) comprising: a first medium-high band, MHB, frontend module, FEM, MHB FEM, (18(1 )) configured to transmit and receive at least one new- radio, NR, MHB signal in an NR MHB; a low-band, LB, FEM, LB FEM, (18(2)) configured to: transmit and receive an NR LB signal in an NR LB; and transmit and receive a long-term-evolution, LTE, LB signal in an LTE LB; a second MHB FEM (18(3)) configured to transmit and receive at least one LTE MHB signal in an LTE MHB; a first ultra-high-band, UHB, FEM (18(4)) configured to transmit and receive at least one UHB signal in an UHB; and a second UHB FEM (18(5)) configured to transmit and receive the at least one UHB signal in the UHB.

15. The wireless device of claim 14, further comprising: a first primary antenna (ANTPI), a second primary antenna (ANTP2), a third primary antenna (ANTpg), a first secondary antenna (ANTsi), a second secondary antenna (ANTs2), and a third secondary antenna (ANTS₃); antenna switching circuitry (1 10) coupled to the first primary antenna

(ANTPI), the second primary antenna (ANTP2), the third primary antenna (ANTPS), the first secondary antenna (ANTsi), the second secondary antenna (ANTs2), and the third secondary antenna (ANTss) and comprising the multi-band RF frontend circuit (16); and transmit circuitry (106) and receive circuitry (108) each coupled to the antenna switching circuitry (1 10).

16. The wireless device of claim 15 wherein: the first primary antenna (ANTPI) is coupled to the first MHB FEM (18(1 )), the LB FEM (18(2)), and the second UHB FEM (18(5)); the second primary antenna (ANTP2) is coupled to the LB FEM (18)2)) and the second MHB FEM (18(3)); the third primary antenna (ANTPS) is coupled to the second MHB FEM (18(3)); the first secondary antenna (ANTsi) and a second secondary antenna (ANTS2) are each coupled to the first UHB FEM (18(4)); and the third secondary antenna (ANTsa) is coupled to the second UHB FEM (18(5)) and the first MHB FEM (18(1 )).

17. The wireless device of claim 14, wherein the first MHB FEM is further configured to provide primary transmission and diversity reception capabilities in the NR MHB.

18. The wireless device of claim 14, wherein the LB FEM is further configured to provide primary transmission and diversity reception capabilities in the NR LB and the LTE LB.

19. The wireless device of claim 14, wherein the second MHB FEM is further configured to provide primary transmission and diversity reception capabilities in the LTE MHB.

20. The wireless device of claim 14, wherein the first UHB FEM and the second UHB FEM are integrated into a single system-in-package, SiP.

21 . A method for operating a multi-band radio frequency, RF, frontend circuit (16) comprising: configuring a first medium-high band, MHB, frontend module, FEM, MHB FEM, (18(1 )) to transmit and receive at least one new-radio, NR, MHB signal in an NR MHB; configuring a low-band, LB, FEM, LB FEM, (18(2)) to: transmit and receive an NR LB signal in an NR LB; and transmit and receive a long-term-evolution, LTE, LB signal in an

LTE LB; configuring a second MHB FEM (18(3)) to transmit and receive at least one LTE MHB signal in an LTE MHB; configuring a first ultra-high-band, UHB, FEM (18(4)) to transmit and receive at least one UHB signal in an UHB; and configuring a second UHB FEM (18(5)) to transmit and receive the at least one UHB signal in the UHB.