EP4643076A1 - Architecture d'ailette favorisant l'echange thermique - Google Patents
Architecture d'ailette favorisant l'echange thermiqueInfo
- Publication number
- EP4643076A1 EP4643076A1 EP23821612.1A EP23821612A EP4643076A1 EP 4643076 A1 EP4643076 A1 EP 4643076A1 EP 23821612 A EP23821612 A EP 23821612A EP 4643076 A1 EP4643076 A1 EP 4643076A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat
- heat exchanger
- exchange surface
- wall
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/06—Hollow fins; fins with internal circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
Definitions
- the invention relates to the cooling of a heat-producing element.
- the invention finds application in the field of electrical machines and power electronics. Indeed, it is known that electronic equipment, computers, and electronics in general generate losses which result in the production of heat which must be evacuated. The evacuation of this heat, guaranteeing proper functioning of the elements mentioned above, therefore becomes a priority.
- the invention finds a particular application in the field of on-board electronics where the trend is to increase the number of electrical equipment and therefore the on-board electrical power.
- the invention relates more particularly to a cooling fin architecture for such a heat exchanger.
- Heat exchangers are now known comprising a set of fins arranged in an axis of movement of a heat transfer flow for which heat exchange with a second fluid or the thermal element itself is desired, for example straight fins in the direction of an air flow passing through the heat exchanger using the fins to extract thermal energy to a fluid at a lower temperature, or a fluid using the fins to extract thermal energy generated by a electronic component.
- the function of the fins is to allow heat exchange between two fluids, or a fluid and a solid heat-conducting element, these two elements being at different temperatures. More precisely, the fins are then interfaces used to improve the efficiency of exchanges between the elements mentioned, namely the two heat transfer fluids or the fluid and the solid element.
- the main processes for producing such fins are stamping or folding, which limits the shapes, and therefore the performance of heat exchanges.
- the invention aims to overcome all or part of the problems cited above by proposing fin shapes making it possible to increase the exchange surface between the thermal source, namely the solid element, and a sweeping heat transfer fluid. the heat exchanger, allowing the transfer of thermal energy.
- This geometric evolution has the advantage of increasing the heat exchange surface, making it possible to improve heat exchange, while limiting any possible loss of load of the flow or heat transfer fluid passing through the heat exchanger, inducing a reduction in heat exchange.
- the subject of the invention is a cooling device comprising at least one cooling fin, the device being configured to allow circulation of a heat transfer fluid along the at least one cooling fin according to a first direction, a heat exchange which can take place by convection between the at least one cooling fin and the heat transfer flow, the cooling fin comprising:
- a heat exchange surface configured to allow heat exchange with the heat transfer fluid
- the heat exchanger is connected to the first wall and the second wall.
- the heat exchanger is defined so as to maximize the heat exchange surface.
- the heat exchanger comprises a repetition of an elementary pattern.
- the elementary pattern comprises a largest dimension of less than 12 millimeters.
- the heat exchanger comprises an additional exchange surface, the additional exchange surface representing at least a quarter of the surface included in the cavity of the cooling fin according to the plane perpendicular to the direction of the heat transfer flow.
- the elementary pattern is a polygonal pattern.
- the polygonal pattern is open along at least one side of the polygonal pattern.
- the elementary pattern comprises a broken vertex.
- the elementary pattern comprises a folded vertex.
- the heat exchanger comprises a second elementary pattern, the second elementary pattern being of dimensions smaller than the dimensions of the elementary pattern.
- the second elementary pattern is a pattern identical to the elementary pattern.
- the dimensions of the second elementary pattern are less than half compared to the dimensions of the elementary pattern.
- the heat exchanger comprises a self-similar fractal structure.
- the invention also relates to a method of manufacturing a cooling fin of the heat exchanger comprising an additional heat exchange surface, the method comprising the following steps:
- the angular modification consisting of a creation of an isosceles triangle of large base the unit section of the additional exchange surface selected, in the first direction of modification, the isosceles triangle comprising two subdivided sides and of height equal to the length of the unit section of the selected additional exchange surface multiplied by a predefined factor k, the isosceles triangle being open on the large base,
- the second direction of modification is substantially opposite to the first direction of modification.
- Figure 1 represents a schematic sectional view of a cooling fin of a cooling device according to the invention
- Figure 2 shows a schematic sectional view of the cooling fin in a second configuration
- FIG.3 shows a schematic sectional view of the cooling fin in a third configuration
- Figure 4 shows a schematic sectional view of the cooling fin in a fourth configuration
- FIG.5B represents a schematic view of the cooling fin of Figure 4 according to a second variant
- FIG.6 shows a schematic sectional view of the cooling fin in a fifth configuration
- Figure 7 shows a schematic sectional view of the cooling fin in a sixth configuration
- Figure 8 shows a schematic sectional view of the cooling fin in a seventh configuration
- Figure 9 represents a method of producing a heat exchanger of a cooling fin of a cooling device according to the invention.
- Figure 1 represents a schematic view of a cooling fin 12 of a cooling device 1 comprising at least one cooling fin 12 as shown.
- the cooling device 1 is configured to allow circulation of a heat transfer fluid 2 along the at least one cooling fin 12 in a first direction D1 of flow of the heat transfer fluid 2.
- a heat exchange can occur. operate by convection between the cooling fin 12 and the heat transfer flow 2.
- the first direction D1 of flow of the heat transfer fluid 2 is parallel to the direction in which the cooling fin 12 develops.
- the heat transfer fluid 2 which moves parallel to the first direction D1, crosses perpendicularly the cooling fin 12 along a plane P1 perpendicular to the first direction D1 so as to exchange by convection with the cooling fin 12.
- this heat exchange is very efficient for the heat transfer fluid located near the cooling fin 12 whereas the heat exchange is less efficient, in comparison to the heat exchange by convection between the heat transfer fluid 2 located in direct proximity to the cooling fin 12 and the cooling fin 12 itself.
- the first direction D1 intersects the direction of development of the cooling fin 12. It can also be envisaged that the heat transfer fluid 2 crosses the cooling fin in the first direction D1. cooling 12 before thermally exchanging with a second fluid of lower temperature.
- the cooling fin 12 comprises a heat exchange surface 10 configured to allow heat exchange with the heat transfer fluid 2.
- the heat exchange surface 10 is thus a heat-conducting surface making it possible to distribute the heat over the entire heat exchange surface by conduction in order to allow a heat exchange zone with the heat transfer fluid 2 all along the cooling fin 12.
- the exchange surface thermal body 10 is thus a hot body which requires discharging a quantity of heat while the heat transfer fluid 2 is a cold body whose function is to exchange with the heat exchange surface 10 and to extract heat .
- the heat exchange surface 10 advantageously comprises a thermally conductive material. And, this heat is transmitted from the heat exchange surface 10 to the heat transfer fluid 2 which passes through the cooling fin 12 by convection so as to evacuate the heat from the cooling device 1, this heat exchange occurring mainly along the heat exchange surface 10 and near the heat exchange surface 10.
- the cooling fin also comprises a first wall 120 and a second wall 122 extending substantially parallel to the first direction D1 and in a plane substantially parallel to the first direction D1 and substantially perpendicular to the surface of heat exchange 10.
- the first wall 120 and the second wall 122 are thus the supporting structure of the cooling fin 12.
- the cooling fin comprises a cavity 124 between the first wall 120 and the second wall 122 in which the heat transfer fluid 2 circulates.
- the heat transfer fluid 2 which exchanges thermally with the heat exchange surface 10, passes through the cooling fin 2 between the first wall 120 and the second wall 122 substantially parallel to the first direction D1.
- first wall 120 and the second wall 122 so as to define a closed cavity 124 between the first wall 120 and the second wall 122 as shown in Figure 1. Therefore, the first wall 120 is connected to the second wall 122 via the heat exchange surface 10 but also by another upper connection 123.
- the first wall 120 is connected to the second wall 122 only via the heat exchange surface 10. From then on, the upper connection 123 is no longer shown and the cavity communicates with a medium outside the cooling fin 12.
- the heat exchange between the hot body, namely the heat exchange surface 10, and the cold body, namely the fluid heat carrier 2 is done efficiently along the heat exchange surface 10 and near the heat exchange surface 10. And, this efficiency of the heat exchange between the heat exchange surface 10 and the heat transfer fluid 2 decreases proportionally with respect to the distance between the heat transfer fluid 2 and the heat exchange surface 10.
- the cooling fin 12 comprises a heat exchanger 14 included in the cavity 124 and connected to the heat exchange surface 10.
- the heat exchanger 14 comprises a fractal structure represented in the plane P1 perpendicular to the first direction D1 of the heat transfer fluid 2.
- the heat exchanger 14 is defined as a structure capable of increasing the heat exchange surface 10 or even maximizing the heat exchange surface 10.
- the heat exchanger 14 is a heat exchange surface additional relative to the heat exchange surface 10 so as to also allow heat exchange by convection between the heat transfer fluid 2 and the heat exchanger 14.
- the heat exchanger 14 also has a good conduction capacity of so that the heat included in the heat exchange surface 10 can be conducted into the heat exchanger 14. From then on, the exchange by convection no longer takes place only between the heat transfer fluid 2 and the heat exchange surface 10 but also between the heat transfer fluid 2 and the heat exchanger 14. Heat exchange by convection is thus improved.
- the heat exchanger 14 includes within its structure a repetition of a simple elementary pattern 140.
- this elementary pattern 140 is a diamond connected to the heat exchange surface 10.
- fractal is therefore to be understood as a structure comprising only a repetition of a simple elementary pattern 140 extending into the cavity 124.
- the fractal structure of the heat exchanger 14 is a structure fragmented by means of the elementary pattern 140.
- the heat exchanger 14 also has the advantage, in addition to increasing the heat exchange surface with the heat transfer fluid 2 and improving the heat exchange with the heat transfer fluid 2, of not impact the heat transfer fluid 2 passing through the cooling fin. Indeed, positioning an object so as to face the movement of the heat transfer fluid 2 in the first direction D1 generally leads to a deviation in the movement of the heat transfer fluid 2, a loss of the flow speed of the heat transfer fluid 2 in the fin cooling and overall load loss. On a macroscopic scale, this reduction in the charge of the heat transfer fluid 2 passing through the cooling fin 12 and the heat exchanger 14 then results in a reduction in the flow rate of the heat transfer fluid 2 passing through the cavity 124 in particular.
- the heat exchange between the heat exchange surface 10 or the heat exchanger 14 and the heat transfer fluid 2 is negatively impacted.
- the fractal structure of the heat exchanger 14 has the advantage of improving the heat exchange without impacting, or only slightly impacting, the load linked to the heat transfer fluid 2 passing through the cooling fin.
- the wall forming the fractal structure of the heat exchanger 14 is relatively weak so as not to deflect the movement of the heat transfer fluid 2 in the cavity 124. And, this fractal structure ensures good rigidity of the heat exchanger, in addition to its multiple attachment with the heat exchange surface 10.
- the cooling fin according to the invention makes it possible, via the heat exchanger 14, to increase the overall heat exchange surface by limiting the pressure loss of the heat transfer fluid 2 passing through the cooling device. cooling 1.
- connection upper 123 it can be envisaged to connect the heat exchanger 14 to the first wall 120 and to the second wall 122 by means of, for example, the connection upper 123.
- the heat exchanger 14 can also be directly connected to the first wall 120 and to the second wall 122. This configuration more uniformly distributes the fixings of the heat exchanger 14 in the cavity 124 of the cooling fin 12 and improves the rigidity of the heat exchanger 14.
- the first wall 120 and/or the second wall 122 conduct heat from the exchange surface thermal 10. Therefore, the overall heat exchange surface in the cooling fin consists of the heat exchange surface 10, the first wall 120, the second wall 122 and the heat exchanger 14. And , the heat exchanger 14 then allows better distribution of heat in the heat exchange surface 10, of the first wall 120, of the second wall 122 and of the heat exchanger 14 and particularly in the first wall 120 and in the second wall 122 or even in the upper connection 123.
- the only thermal path allowing heat to be conducted from the heat exchange surface 10 to the upper connection 123 or even one end of the first wall 120 or the second wall 122 not directly connected to the heat exchange surface 10 is the thermal path passing through the end 120' of the first wall 120 and the end 122' of the second wall 122 connected directly to the heat exchange surface 10 and then passing through the entirety of the first wall 120 or the second wall 122.
- the heat is then not fully transmitted and the upper connection 123 or the end of the first wall 120 or the second wall 122 not directly connected to the heat exchange surface 10 is relatively colder than the heat exchange surface 10, which degrades the heat exchange by convection with the heat transfer fluid 2 since the temperature differential is reduced.
- the heat exchanger 14 makes it possible, through its fractal structure, to generate several thermal paths between different points of the heat exchange surface 10 and these same zones where the heat exchange is degraded, namely the connection upper 123 or the end of the first wall 120 or the second wall 122 not directly connected to the heat exchange surface 10, so as to be able to conduct more heat and therefore to improve the heat exchange between these zones and the heat transfer fluid 2 by convection.
- the elementary pattern 140 is a diamond-type polygon.
- This diamond shape has the advantage of being the most easily reproducible polygonal shape while increasing the total heat exchange surface in the cooling fin 12 in the available volume defined by the cavity 124.
- the heat exchanger 14 is connected only to the first wall 120 or only to the second wall 122.
- the elementary pattern 140 is an open polygonal pattern, that is to say that the polygon is open along one of its sides, as shown in Figure 3, where the elementary pattern 140 is a triangle of which one of its sides is not connected.
- This configuration has the advantage of making it possible to increase the density of elementary elements 140 in the cavity 124 and to increase the additional heat exchange surface 142 generated by the presence of the heat exchanger 14.
- the exchange surface additional heat 142 is thus the heat exchange surface with the heat transfer fluid 2 of the heat exchanger 14 only.
- the deletion of the same side of the elementary pattern 140 of triangular shape has the advantage of making it possible to compress the elementary patterns 140 in one direction of the plane P1, namely a second direction D2 according to the configuration shown in Figure 3.
- the elementary pattern 140 is hexagonal in shape.
- the hexagonal shape offers the smallest perimeter to fill space compared to other known regular polygons. Indeed, of the three regular polygons mentioned previously allowing a space to be paved, namely cavity 124, the hexagon is the one which offers the smallest perimeter. And, this dimension of the hexagonal shape has the advantage of having a surface projected in the plane P1, linked to the same wall thickness between the different shapes, the smallest, which induces a lower pressure loss compared to other types of paving.
- the hexagonal shape has the advantage of optimizing the front surface, that is to say the surface of the heat exchanger 14 in the plane P1, of the cooling fin 12 seen from the heat transfer fluid 2 entering the cooling device 1 in the predefined flow direction, relative to the contact surface of this same heat transfer fluid 2 along its path through the cavity 124 and the cooling device 1, optimizing the quantity of material used for this implementation.
- the choice of the hexagon is linked to its capacity for “paving” a predefined zone, namely the cavity 124 of the cooling fin 12.
- the zone is the front surface of the heat exchanger 14 according to the plane P1 relative to the direction of flow of the heat transfer fluid passing through the cavity 124 and the cooling fin 12.
- Paving the cavity in the plane P1 is the way of filling a predefined area using an identical elementary pattern 140 without leaving “holes” or unused space between the shapes, or overflow of one elementary form or motif onto another.
- the elementary pattern 140 can also be defined by a dimension other than its perimeter.
- the elementary pattern 140 may include a larger dimension L, as shown in Figure 4, which represents the largest length included in the elementary pattern 140 observable in the plane P1 perpendicular to the first direction D1.
- L the largest dimension included in the elementary pattern 140 observable in the plane P1 perpendicular to the first direction D1.
- the greatest length of the elementary pattern can be interpreted as the length connecting two opposite vertices of the hexagon passing through the center of the hexagon.
- the greatest length of the elementary pattern 140 is its diagonal.
- this largest dimension L is a length less than twelve millimeters.
- the greatest length of the elementary pattern 140 is between one millimeter and twelve millimeters.
- the additional exchange surface 142 of the heat exchanger 14 represents at least a quarter of the projected surface included in the cavity 124 of the heat exchanger 14. cooling fin 12 in the plane P1 perpendicular to the direction D1 of the heat transfer flow 2.
- the elementary pattern 140 can be a simple polygonal pattern like the patterns cited above or even be part of a non-exhaustive list including a heptagon, an octagon or even a decagon and other regular polygon.
- one side 141 of the elementary pattern of polygonal shape is connected to the heat exchange surface 10 so as to improve the thermal connection between the heat exchanger 14 and the heat exchange surface 10.
- each elementary pattern 140 connected to each other parallel to the heat exchange surface 10 is thermally connected via a side 141 improving the heat exchange between two adjacent elementary patterns 140 and therefore improving the thermal conductivity of the heat exchanger 14.
- the elementary pattern 140 can therefore be a polygonal pattern which therefore includes broken sides 141 and vertices 142'.
- the elementary pattern 140 includes, instead of the broken vertices 142', folded vertices 142”.
- a broken vertex 142' thus presents an acute angle or an obtuse angle in the elementary pattern 140.
- a folded vertex 142 highlights a folding angle or a fold angle.
- Figure 7 represents a preferred configuration of the cooling fin 12 comprising the heat exchanger 14 whose fractal structure has an elementary pattern of polygonal shape comprising a plurality of sides 141 and broken vertices 142'.
- the elementary pattern 140 can be compared to a snowflake type fractal pattern. More precisely, the elementary pattern 140 of the heat exchanger 14 in Figure 7 is based on a Von Koch type fractal geometry.
- the elementary pattern 140 is obtained from a segment, for example a side 141, to which an elementary modification is applied recursively.
- the total perimeter of the elementary pattern 140 is multiplied by a predefined value. As an indicative example, this value is four thirds.
- the heat exchanger 14 comprises a fractal structure of the Von Koch flake type thus has the advantage of making it possible to increase the perimeter of the elementary pattern at each elementary modification step so as to increase the exchange surface.
- additional 142 of the heat exchanger 14 and therefore improve the heat exchange capacity between the heat exchanger 14 and the heat transfer fluid 2.
- any other form of elementary pattern of the fractal type respecting a deterministic rule can be considered in the heat exchanger 14.
- deterministic rule we understand a repeated modification on the structure of the heat exchanger leading to the generation of an identical elementary pattern 140 throughout the heat exchanger 14.
- the heat exchanger 14 may include a second motive elementary 144.
- the second elementary pattern 144 is then of complementary shape and dimensions to the elementary pattern 140 included in the heat exchanger 14.
- the second elementary pattern 144 is a star pattern whose shape is complementary to the elementary pattern 140 of Von Koch snowflake, which advantageously makes it possible to position the second elementary pattern 144 in the shape of a star between three elementary patterns 140 adjacent to each other.
- the second elementary pattern 144 may be of dimensions smaller than the dimensions of the elementary pattern 140, as shown in FIG. 7.
- the perimeter of the elementary pattern 140 in the form of a Von Koch snowflake is of greater value. higher than the perimeter of the second elementary star-shaped pattern 144.
- the second elementary pattern 144 is a pattern identical to the elementary pattern 140.
- the heat exchanger 14 then comprises an elementary pattern 140 and 144 but reproduced in two dimensions different. Therefore, it can also be envisaged that the dimensions of the second elementary pattern 144 are less than half compared to the dimensions of the elementary pattern 140.
- the perimeter of the second elementary pattern 144 represents half of the perimeter of the elementary pattern 140.
- Figure 9 represents a manufacturing process 1000 of the cooling fin 12 of Figure 7. More precisely, the manufacturing process 1000 focuses on the repetitive modification of a segment or a side 141 by shape self-similarity.
- the manufacturing process 1000 by self-similarity is a repetition of geometric modification following a predefined logic at the different scales of the model, the latter being repeated on each sub-model appearing by the implementation place the geometric modification logic, repeating on the subdivisions created by the previous step, and so on.
- the general shape of the additional heat exchange surface 142 of the heat exchanger 14 is defined by a succession of mathematical and/or geometric operations applied to an original layout of said heat exchanger 14.
- the method 1000 comprises the following steps:
- This unit section 146 is a length representing in the plane P1 the additional heat exchange surface 142 projected. It can be envisaged that this unitary section 146 is one side 141 of an elementary pattern 140 serving as a basis for the manufacture of a more complex fractal structure.
- the angular modification 1004 of the unitary section 146 of the additional exchange surface 142 in a first direction of modification D3'.
- the angular modification consists of creating an isosceles triangle 148 of large base the unit section 146 of the additional exchange surface 142 selected, in the first direction of modification D3'.
- the isosceles triangle 148 then includes two subdivided sides 148’ and 148” and a height equal to the length of the unit section 146 of the selected additional exchange surface 142 multiplied by a predefined factor k. From then on, the isosceles triangle 148 is open on the large base.
- the factor k is a value defined according to the desired angle between the two subdivided sides 148’ and 148”. Furthermore, the value of the factor k can be set fixedly or can be variable.
- the second direction of modification D3 can be intersecting or parallel to the first direction of modification D3’.
- steps 1006 and 1008 a selection step 1010 of the other subdivided side 148” among the two subdivided sides 148' and 148”, and an angular modification step 1012 on the other subdivided side 148” selected in the second modification direction D3”.
- the method 1000 can also include a step of repeating the previous steps following the angular modification step 1012.
- the first direction of modification D3' and the second direction of modification D3” are intersecting with respect to each other.
- the geometric repetition of the elementary pattern and the linked geometric modification can also be considered to obtain a Mandelbrot set, a Serpihski carpet structure or a three-dimensional Serpihski cube structure or even a Julia set.
- first direction of modification D3' and the second direction of modification D3” are parallel to each other and that the second direction of modification D3” is substantially opposite to the first direction of modification D3 '.
- the number of geometric modifications of the fractal type that is to say the number of repetitions of steps 1002, 1004, 1006, 1008, 1010 and 1012, can be defined in advance, and for example included between one and six.
- the limit on the number of repetitions or number of geometric modification applications is linked to the fine resolution of the machine used. This resolution increasing with the evolution of machines, a greater number of repetitions is possible in the future.
- the example presented is linked to the current capabilities of the machines.
- the angular modification consisting of the creation of the triangle can be replaced by an angular modification consisting of the creation of a square for example or even a rectangle or even a right triangle or even a triangular folding generating a fold angle as mentioned previously.
- the heat exchange surface 10, the first wall 120, the second wall 122, the upper connection 123 or the heat exchanger 14 are obtained in a metallic material.
- any material with good thermal conductivity can be considered.
- any material having good rigidity can be considered.
- the heat transfer fluid 2 is air.
- any fluid, liquid or gas, with good thermal extraction capacity can be considered.
- any fluid can be considered.
- the invention therefore relates to a cooling device 1 comprising a plurality of cooling fins 12 exchanging by convection with a heat transfer fluid 2 so as to allow heat extraction from the cooling device towards the heat transfer fluid 2 and to a form of cooling fin comprising a heat exchanger 14 deduced from a geometric evolution of the fractal type by self-similarity of shape.
- This fractal architecture has the advantage of making it possible to increase the heat exchange surface of the cooling fin and to improve the heat exchange without impacting the load of the heat transfer fluid 2 which passes through the cooling fin 12.
- the invention solves the problem linked to increasing the heat exchange surface to optimize the heat exchange without significantly increasing the pressure losses linked to an increase in the frontal surface.
- the applications are linked to the areas of heat exchange, typically between hot air coming from electronic equipment and a water network at a lower temperature.
- the invention makes it possible to increase the efficiency of exchanges between these two fluids without constraining one or the other in terms of pressure losses. [0109] It can also be used to allow the cooling of an electronic component, by the shape of the fins used for heat dissipation towards a fluid such as water or air.
- the means of producing such a cooling fin 12 and such a heat exchanger 14 comprising the fractal structure can be 3D printing, preferably metallic.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2214520A FR3144269B1 (fr) | 2022-12-27 | 2022-12-27 | Architecture d'ailette favorisant l'échange thermique |
| PCT/EP2023/085033 WO2024141246A1 (fr) | 2022-12-27 | 2023-12-11 | Architecture d'ailette favorisant l'echange thermique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4643076A1 true EP4643076A1 (fr) | 2025-11-05 |
Family
ID=86331685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP23821612.1A Pending EP4643076A1 (fr) | 2022-12-27 | 2023-12-11 | Architecture d'ailette favorisant l'echange thermique |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4643076A1 (fr) |
| AU (1) | AU2023416284A1 (fr) |
| FR (1) | FR3144269B1 (fr) |
| WO (1) | WO2024141246A1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8499824B2 (en) * | 2005-10-04 | 2013-08-06 | Elektronische Bauelemente Gesellschaft M.B.H. | Heat sink |
| CN101394730A (zh) * | 2008-04-01 | 2009-03-25 | 北京航空航天大学 | 分形散热器 |
| US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
| US20130133859A1 (en) * | 2011-11-30 | 2013-05-30 | International Business Machines Corporation | Heat sink with heat bus and fin structure |
| US11222830B2 (en) * | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
-
2022
- 2022-12-27 FR FR2214520A patent/FR3144269B1/fr active Active
-
2023
- 2023-12-11 EP EP23821612.1A patent/EP4643076A1/fr active Pending
- 2023-12-11 AU AU2023416284A patent/AU2023416284A1/en active Pending
- 2023-12-11 WO PCT/EP2023/085033 patent/WO2024141246A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| FR3144269A1 (fr) | 2024-06-28 |
| FR3144269B1 (fr) | 2025-04-25 |
| WO2024141246A1 (fr) | 2024-07-04 |
| AU2023416284A1 (en) | 2025-06-12 |
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