EP4642828A2 - Curable compositions - Google Patents

Abstract

The present disclosure is directed to compositions comprising a first component comprising a thiol-containing compound, an amine-containing compound, or a combination thereof; and a furan-containing compound; and a second component comprising a maleimide-containing compound. The present disclosure is also directed to substrates comprising a surface coated with or embedded in any of the compositions disclosed herein. The present disclosure is also directed to coatings, films, and 3D-printed structural articles formed from any of the compositions disclosed herein. The present disclosure is also directed to methods for forming coatings comprising mixing any of the first components and second components disclosed herein to form the composition; and applying the composition to a surface of the substrate. The present disclosure is also directed to methods for forming a film comprising mixing any of the first components and second components disclosed herein to form the composition; and casting the film.

Description

CURABLE COMPOSITIONS GOVERNMENT CONTRACT [0001] This material is based upon work supported by the CCDC Ground Vehicle Systems Center under Government Contract No. 201830-140914 entitled “Reversible Adhesives Phase II.” The United States Government has certain rights in this invention. CROSS-REFERENCE [0002] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63/477,568 filed on December 29, 2022, which is incorporated herein by reference. FIELD [0003] The present disclosure relates to curable compositions including those formulated as adhesive compositions, sealants and the like. BACKGROUND [0004] Curable compositions, including adhesive compositions, are utilized in a wide variety of applications to treat a variety of substrates or to bond together two or more substrate materials. SUMMARY [0005] Disclosed herein are compositions comprising: a first component comprising a thiol-containing compound, an amine-containing compound, or a combination thereof; and a furan-containing compound; and a second component comprising a maleimide-containing compound. [0006] Also disclosed herein are substrates comprising a surface coated with or embedded in any of the compositions disclosed herein. [0007] Also disclosed herein are coatings formed from any of the compositions disclosed herein. [0008] Also disclosed herein are methods for forming a coating on a surface of a substrate comprising mixing any of the first components and the second components disclosed herein to form the composition; and applying the composition to the surface of the substrate. [0009] Also disclosed herein are methods of forming a film comprising mixing any of the first components and the second components disclosed herein to form the composition; and casting the film. [0010] Also disclosed herein are 3D-printed structural articles comprising any of the compositions disclosed herein. BRIEF DESCRIPTION OF THE FIGURES [0011] FIG.1 is a schematic of a top-down view of cylindrical battery cells. [0012] FIG.2 is a schematic of an exploded isometric view of an array of prismatic battery cells. [0013] FIG.3 is a schematic of a front view of an array of pouch battery cells. [0014] FIG.4 is a schematic of an isometric view of cylindrical cells positioned in a battery module. [0015] FIG.5 is a schematic of an exploded perspective view of a battery pack comprising multiple battery cells. [0016] FIG.6 is a schematic of an isometric view of (A) a battery cell, (B) a battery module, and (C) a battery pack. [0017] FIG.7 is a schematic of a perspective view of a battery pack. [0018] FIG.8 is a schematic of a cell to battery pack configuration. [0019] FIG.9 is a schematic of an isometric cut-out view of a cell to chassis battery assembly. [0020] FIG.10 is a bar graph showing lap shear strength of compositions at room temperature, 71ºC, and 150ºC. [0021] FIG.11 is a bar graph showing lap shear strength of compositions tested by 2K, Film, and 2K repaired. [0022] FIG.12 is a plot of dynamic mechanical analysis of Composition X, displaying the reflow onset temperature of the composition. DETAILED DESCRIPTION [0023] For purposes of this detailed description, it is to be understood that the disclosure may assume alternative variations and step sequences, except where expressly specified to the contrary. Moreover, other than in any operating examples, or where otherwise indicated, all numbers expressing, for example, quantities of ingredients used in the specification and claims are to be understood as being modified in all instances by the term “about.” Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that may vary depending upon the desired properties to be obtained by the present disclosure. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. [0024] Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard variation found in their respective testing measurements. [0025] Also, it should be understood that any numerical range recited herein is intended to include all sub-ranges subsumed therein. For example, a range of “1 to 10” is intended to include all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value of equal to or less than 10. [0026] As used herein, “including,” “containing” and like terms are understood in the context of this application to be synonymous with “comprising” and are therefore open-ended and do not exclude the presence of additional undescribed or unrecited elements, materials, ingredients or method steps. As used herein, “consisting of” is understood in the context of this application to exclude the presence of any unspecified element, ingredient, or method step. As used herein, “consisting essentially of” is understood in the context of this application to include the specified elements, materials, or ingredients or method steps “and those that do not materially affect the basic and novel characteristic(s)” of what is being described. As used herein, open- ended terms include closed terms such as consisting essentially of and consisting of. [0027] In this application, the use of the singular includes the plural and the plural encompasses the singular, unless specifically stated otherwise. For example, although reference is made herein to “an” amine-containing compound or “a” furan-containing compound, a combination (i.e., a plurality) of these components may be used. [0028] In addition, in this application, the use of “or” means “and/or” unless specifically stated otherwise, even though “and/or” may be explicitly used in certain instances. [0029] As used herein, the terms “on,” “onto,” “applied on,” “applied onto,” “formed on,” “deposited on,” “deposited onto,” and the like mean formed, overlaid, deposited, or provided on, but not necessarily in contact with, a substrate surface. For example, a composition “applied onto” a substrate surface does not preclude the presence of one or more other intervening coating layers or films of the same or different composition located between the composition and the substrate surface. [0030] As used herein, a “Diels-Alder reaction” means a [4 + 2] cycloaddition reaction between a conjugated diene and a dienophile to form a substituted cyclohexene derivative. This may include hetero-Diels-Alder reactions wherein the diene and/or dienophile comprise heteroatoms such as oxygen, nitrogen, or sulfur. [0031] As used herein, a “conjugated diene” means an organic molecule containing two double bonds separated by a single bond. The double bonds are typically among carbon atoms, but the double bonds may comprise heteroatoms, such as nitrogen, oxygen, or sulfur. [0032] As used herein, a “dienophile” means a compound that reacts with the conjugated diene in a cycloaddition reaction, such as an alkene, alkyne, or other compound comprising a functional group comprising at least one double bond or triple bond. [0033] As used herein, a “Michael addition reaction” means a reaction between an electrophile and a nucleophile, wherein the nucleophile undergoes conjugate addition to a double bond of a conjugated system. [0034] As used herein, a “liquid” means a material having a viscosity less than 100,000 Pa*s at 25°C as measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s^-1. [0035] As used herein, a “solid” means a material having a viscosity of at least 100,000 Pa*s at 25°C as measured by parallel plate rheology with a plate diameter of 25 mm, a gap of 0.5 mm, and a shear rate of 1 s^-1. [0036] As used herein, a “curable composition” refers to a composition, e.g., a solution, mixture, or a dispersion, that is capable of curing to form a coating. [0037] As used herein, “coating” refers to a cured coating composition and includes adhesives, sealants, free-standing films, pottants, gap fillers, liquid shims, composites formed from pre-pregs, an embedding material, an encapsulated material, a hot melt, or combinations thereof. The adhesive may be a structural adhesive. A free-standing film refers to a sheet comprising a cured composition that may be formed independent of a substrate surface. [0038] As used herein, a “film” refers to a sheet comprising a cured composition that may be formed independent of a substrate surface. [0039] As used herein, a “sealant composition” refers to a curable composition, e.g., a solution, mixture, or a dispersion that, when cured, has the ability to resist atmospheric conditions such as temperature and moisture gradients and particulate matter, such as moisture and temperature, and block the transmission of materials, such as particulates, water, fuel, and other liquids and gasses. [0040] As used herein, an “adhesive composition” refers to a curable composition that, when cured, forms an adhesive or a structural adhesive. [0041] As used herein, an “adhesive” refers to a cured coating that produces a load- bearing joint, such as a load-bearing joint having a lap shear strength of at least 0.5 MPa and less than 5 MPa, as determined according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0042] As used herein, a “structural adhesive” refers to a cured coating that produces a load-bearing joint, such as a load-bearing joint having a lap shear strength of at least 5 MPa measured according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0043] As further defined herein, ambient conditions generally refer to room temperature (e.g., 23ºC) and humidity conditions or temperature and humidity conditions that are typically found in the area in which the composition is applied to a substrate, e.g., at 10ºC to 40ºC and 5% to 80% relative humidity, while slightly thermal conditions are temperatures that are slightly above ambient temperature, such as greater than 40ºC to 60ºC. [0044] As used herein, the term “two-component” or “2K” refers to a composition in which a portion of the reactive components readily associate to form an interaction or react to form a bond (physically or chemically), i.e., cure, without activation from an external energy source, such as at ambient or slightly thermal conditions, when mixed. One of skill in the art understands that the two components of the composition may be stored separately from each other and mixed just prior to application of the composition. The components may be premixed and frozen and stored (“pre-mixed frozen” or “PMF” as described below). When prepared as a PMF, the components cure upon thawing. Two-component compositions may optionally be heated or baked, as described below. [0045] As used herein, the term “hot melt composition” refers to a curable composition comprising two co-reactive components. A hot melt composition cures to form a solid (i.e., a hot melt) at temperatures less than 30ºC, flows when heated to a hot melt composition, and, upon cooling, returns to a solid-state hot melt. [0046] As used herein, the term “hot melt application” means application of a curable composition of the present disclosure to a substrate surface under thermal conditions. As used herein, “thermal conditions” include (i) heat extrusion, (ii) heating of the curable composition to a temperature greater than the melt or flow temperature of the curable composition, and/or (iii) heating of the substrate comprising the curable composition to a temperature greater than the melt or flow temperature of the curable composition. [0047] As used herein, the terms “cure” or “curing,” means that the components that form the composition are crosslinked (i.e., interact and/or react) to form a coating or a bond. The composition begins to cure when the components of the composition are mixed resulting in the reaction of the reactive functional groups of the components of the composition. The curable composition may also be subjected to curing conditions such that a substantially complete cure is attained and wherein further curing results in no significant further improvement in the coating properties such as, for example, increased lap shear performance. [0048] As used herein, “Mn” refers to the number average molecular weight as determined by Gel Permeation Chromatography using Waters 2695 separation module with a Waters 410 differential refractometer (RI detector), polystyrene standards, using tetrahydrofuran (THF) used as the eluent at a flow rate of 1 ml min^-1 and two PL Gel Mixed C columns for separation. [0049] As used herein, the “thiol equivalent weight” is the total weight of the thiol- containing component divided by the molar equivalents of thiol functionality. The value may be determined theoretically by dividing the theoretical molecular weight of the thiol-containing component by the theoretical molar equivalents of thiol functional groups, or may be determined experimentally, for example, by titrating a sample with alcoholic silver nitrate using pyridine as a solvent and THF, isopropyl alcohol, acetone, glycol ethers, or hydrocarbons as co-solvents. [0050] As used herein, the “amine equivalent weight” is the total weight of the amine- containing component divided by the molar equivalents of amine functionality. The value may be determined theoretically by dividing the theoretical molecular weight of the amine-containing component by the theoretical molar equivalents of amine functional groups or may be determined experimentally by a variety of titration methods, for example, ASTM D2073 or ASTM D2896. [0051] As used herein, the “furan equivalent weight” is the total weight of the furan- containing component divided by the molar equivalents of furan functionality. The value may be determined theoretically by dividing the theoretical molecular weight of the furan-containing component by the theoretical molar equivalents of furan functional groups. [0052] As used herein, the “maleimide equivalent weight” is the total weight of the maleimide-containing component divided by the molar equivalents of maleimide functionality. The value may be determined theoretically by dividing the theoretical molecular weight of the maleimide-containing component by the theoretical molar equivalents of maleimide functional groups. [0053] As used herein, the term “accelerator” means a substance that increases the rate or decreases the activation energy of a chemical reaction in comparison to the same reaction in the absence of the accelerator. An accelerator may be either a “catalyst,” that is, without itself undergoing any permanent chemical change, or may be reactive, that is, capable of chemical reactions and includes any level of reaction from partial to complete reaction of a reactant. [0054] As used herein, the terms “latent,” “blocked,” or “encapsulated,” when used with respect to an accelerator, means a molecule or a compound that is activated by an external stimulus or energy source prior to reacting (i.e., crosslinking) or having a catalytic effect, as the case may be. For example, an accelerator may be in the form of a solid at room temperature and have no catalytic effect until it is heated and melts or dissolves in the composition, or the latent accelerator may be reversibly reacted with a second compound that prevents any catalytic effect until the reversible reaction is reversed by the application of heat and the second compound is removed, freeing the accelerator to catalyze reactions, or the latent accelerator may be encapsulated within a thermoplastic material which melts upon heating, releasing the accelerator to catalyze reactions. [0055] As used herein, unless indicated otherwise, the term “substantially free” means that a particular material is not purposefully added to a mixture or composition, respectively, and is present only as an impurity in a trace amount of less than 5 percent by weight based on a total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, the term “essentially free” means that a particular material is not purposefully added to a mixture or composition and is present only as an impurity in a trace amount of less than 2 percent by weight based on a total weight of the mixture or composition, respectively. As used herein, unless indicated otherwise, the term “completely free” means that a mixture or composition, respectively, does not comprise a particular material, i.e., the mixture or composition comprises 0 percent by weight of such material. [0056] The present disclosure is directed to a composition comprising, or consisting essentially of, or consisting of, a first component and a second component. The first component may comprise, consist essentially of, or consist of, a thiol-containing compound, an amine- containing compound, or a combination thereof, and a furan-containing compound. The second component may comprise, consist essentially of, or consist of, a maleimide-containing compound comprising one maleimide group. [0057] The first component and/or the second component may be liquid. [0058] The composition may comprise the first component and the second component in a weight ratio of at least 1:25, such as at least 1:20, such as at least 1:10, such as at least 1:5. The composition may comprise the first component and the second component in a weight ratio of no more than 25:1, such as no more than 20:1, such as no more than 10:1, such as no more than 5:1. The composition may comprise the first component and the second component in a weight ratio of 1:25 to 25:1, such as 1:20 to 20:1, such as 1:10 to 10:1, such as 1:5 to 5:1. [0059] The compositions of the present disclosure may be provided as pre-mixed frozen compositions (PMF). In examples, the PMF may be stored at temperatures between and including -100ºC and -15ºC, such as -100ºC to -25ºC, to retard curing, such as at a minimum of - 75ºC, such as at a maximum of -40ºC. PMFs may be packaged, for example, in a cartridge, a cartridge and plunger, a syringe, or may be supplied as a tape, a cap, or any pre-formed geometry. [0060] The first component may comprise a thiol-containing compound. As used herein, the term “thiol-containing compound” means a compound comprising a thiol functional group and having a general structure: (VI) wherein R10 may comprise an alkyl, a (cyclo)alkyl, an aromatic, or a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). Examples of suitable thiol-containing compounds include monfunctional thiols or polythiols. The polythiol compound may comprise a dithiol, trithiol, tetrathiol, pentathiol, hexathiol or higher functional polythiol compound. A polythiol compound may comprise a dithiol compound such as 3,6- dioxa-1,8-octanedithiol (DMDO), 3-oxa-1,5-pentanedithiol, 1,2-ethanedithiol, 1,3- propanedithiol, 1,2-propanedithiol, 1,4-butanedithiol, 1,3-butanedithiol, 2,3-butanedithiol, 1,5- pentanedithiol, 1,3-pentanedithiol, 1,6-hexanedithiol, 1,3-dithio-3-methylbutane, ethylcyclohexyldithiol (ECHDT), methylcyclohexyldithiol, methyl-substituted dimercaptodiethyl sulfide, dimethyl-substituted dimercaptodiethyl sulfide, 2,3-dimercapto-1-propanol, bis-(4- mercaptomethylphenyl) ether, 2,2′-thiodiethanethiol, and glycol dimercaptoacetate (commercially available as THIOCURE® GDMA from BRUNO BOCK Chemische Fabrik GmbH & Co. KG). The polythiol compound may comprise a trithiol compound such as trimethylolpropane trimercaptoacetate (commercially available as THIOCURE® TMPMA from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), trimethylopropane tris-3- mercaptopropionate (commercially available as THIOCURE® TMPMP from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), ethoxylated trimethylpropane tris-3-mercaptopropionate polymer (commercially available as THIOCURE® ETTMP from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate (commercially available as THIOCURE® TEMPIC from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), or combinations thereof. The polythiol compound may comprise a tetrathiol compound such as pentaerythritol tetramercaptoacetate (commercially available as THIOCURE® PETMA from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), pentaerythritol tetra-3- mercaptopropionate (commercially available as THIOCURE® PETMP from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), and polycaprolactone tetra(3-mercaptopropionate) (commercially available as THIOCURE® PCL4MP 1350 from BRUNO BOCK Chemische Fabrik GmbH & Co. KG), or combinations thereof. Higher functional polythiol compounds may comprise dipentaerythritol hexakis-3-mercaptopropionate (commercially available as THIOCURE® DiPETMP from BRUNO BOCK Chemische Fabrik GmbH & Co. KG). Combinations of polythiol molecules or compounds, such as those disclosed herein, may also be used. [0061] The polythiol molecule or compound may comprise a mercaptan terminated polysulfide. Commercially available mercaptan terminated polysulfides include those sold under the trade name THIOKOL® LP from Toray Fine Chemicals Co., Ltd., including, but not limited to, LP-3, LP-33, LP-23, LP-980, LP-2, LP-32, LP-12, LP-31, LP-55 and LP-56. The THIOKOL LP mercaptan terminated polysulfides have the general structure HS-(C2H4-O-CH2-O-C2H4-S- S)nC2H4-O-CH2-O-C2H4-SH, wherein n is an integer of 5 to 50. Other suitable commercially available mercaptan terminated polysulfides include those sold under the trade name THIOPLAST® G™ fromNouryon, including, but not limited to, G 10, G 112, G 131, G 1, G 12, G 21, G 22, G 44 and G 4. The polythiol molecule or compound may comprise a mercaptan terminated polyether. Commercially available mercaptan terminated polyether include POLYTHIOL QE-340M available from Toray Fine Chemicals Co., Ltd. [0062] The thiol-containing compound may comprise a thiol equivalent weight of at least 45 g/eq, such as at least 75 g/eq, such as at least 100 g/eq. The thiol-containing compound may comprise a thiol equivalent weight of no more than 2,000 g/eq, such as no more than 500 g/eq, such as no more than 250 g/eq. The thiol-containing compound may comprise a thiol equivalent weight of 45 g/eq to 2,000 g/eq, such as 75 g/eq to 500 g/eq, such as 100 g/eq to 250 g/eq. [0063] The first component may comprise an amine-containing compound. As used herein, “amine-containing compound” means a compound comprising at least one amine group and has a general structure: wherein R11 is hydrogen and R12 and R13 each independently may comprise a hydrogen, an alkyl, an alkylene, a (cyclo)alkyl, an aromatic, or a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). The amine-containing compounds may comprise diamines and/or polyamines. As used herein, “diamine” means a compound comprising two primary or secondary amine groups. As used herein, “polyamine” means a compound comprising more than two primary or secondary amine groups. Examples of suitable diamines include, but are not limited to, ethylenediamine, tetramethylenediamine, hexamethylenediamine, 2-methylpentamethylenediamine (available as Dytek A from Invista), isophorone diamine, 4,4-diaminodicyclohexylmethane, diaminocyclohexane, bis(aminomethyl)norbornane, bis(aminomethyl)cyclohexane, piperazine, aminoethylpiperazine, bis(aminopropyl)piperazine, xylylenediamine, methylenedianiline, polyether diamines such as those of the Jeffamine D, ED, or EDR series available from Huntsman. Examples of polyamines that may be used in the present disclosure include, but are not limited to, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, tris(2-aminoethyl)amine, tris(3- aminopropyl)amine, and trifunctional polyether amines such as the Jeffamine T-403, Jeffamine T-3000, and Jeffamine T-5000 available from Huntsman. Other polyfunctional amines that may be used include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, or higher molecular weight ethyleneamines. Other examples of amines that may be used include curing agents which comprise amine functional groups, such as phenalkamines, Mannich bases, amidoamines, or other amine-functional adducts. [0064] The amine-containing compound may comprise an amine equivalent weight of at least 17 g/eq, such as at least 25 g/eq, such as at least 40 g/eq. The amine-containing compound may comprise an amine equivalent weight of no more than 10,000 g/eq, such as no more than 5,000 g/eq, such as no more than 1,000 g/eq. The amine-containing compound may comprise an amine equivalent weight of 17 g/eq to 10,000 g/eq, such as 25 g/eq to 5,000 g/eq, such as 40 g/eq to 5,000 g/eq, such as 25 g/eq to 1,000 g/eq, such as 40 g/eq to 1,000 g/eq. [0065] The first component may comprise a furan-containing compound. As used herein, “furan-containing compound” means a compound comprising the general structure: ( ) wherein R14, R15, R16, and R17 each independently may comprise a hydrogen, an alkyl, a (cyclo)alkyl, an aromatic, or a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). [0066] Examples of suitable furan-containing compounds comprise compounds containing one or more furan functional groups. Suitable furan-containing compounds include the reaction products of furfuryl alcohol with compounds containing isocyanate functional groups to yield furan-containing compounds further comprising a urethane linkage. Furfuryl alcohol may also be reacted with compounds comprising carboxylic acid or anhydride functional groups to generate furan-containing compounds further comprising ester linkages. Furan- containing compounds further comprising additional reactive functional groups may also be used to generate polyfunctional furan-containing compounds. Suitable furan-containing compounds include reaction products of furfuryl amine with compounds containing isocyanate, epoxy, acrylate, methacrylate, aldehyde, or other amine-reactive functional groups. Further suitable furan-containing compounds include reaction products of furfuryl mercaptan with isocyanate, epoxy, acrylate, methacrylate, maleimide, alkene, or other thiol-reactive functional groups. Further suitable furan-containing compounds include the reaction products of furfuryl glycidyl ether with amine, thiol, carboxylic acid, or other epoxy-reactive functional groups. Further suitable furan-containing compounds include reaction products of furfuryl (meth)acrylate with amine, thiol, or other (meth)acrylate reactive functional groups or (meth)acrylic polymers comprising furfuryl (meth)acrylate. Other polyfunctional furan-containing compounds such as difurfuryl disulfide may be used. [0067] The furan-containing compound may further comprise a urethane linkage or a urea linkage. As used herein, “urethane linkage” means a bond formed between two molecules forming the linkage RNHCOOR, wherein R may comprise an alkyl, an alkylene, a (cyclo)alkyl, an aromatic, or a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). As used herein, “urea linkage” means a bond formed between two molecules forming the linkage RNHCONRR, wherein R may comprise an alkyl, an alkylene, a (cyclo)alkyl, an aromatic, or a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). [0068] The furan-containing compound may comprise a furan equivalent weight of at least 65 g/eq, such as at least 150 g/eq, such as at least 250 g/eq. The furan-containing compound may comprise a furan equivalent weight of no more than 2,000 g/eq, such as no more than 1,000 g/eq, such as no more than 500 g/eq. The furan-containing compound may comprise a furan equivalent weight of 65 g/eq to 2,000 g/eq, such as 150 g/eq to 1,000 g/eq, such as 250 g/eq to 500 g/eq. [0069] The second component may comprise, consist essentially of, or consist of a maleimide-containing compound. As used herein, “maleimide-containing compound” means a compound having the general structure: wherein R18 may comprise a hydrogen, an alkyl, a (cyclo)alkyl, an aromatic, a polymeric structure (including a polyester, a polyurethane, a polyether, an acrylic, or a siloxane). The maleimide-containing compound may comprise, consist essentially of, or consist of a maleimide group. [0070] Suitable maleimide-containing compounds can be prepared by the reaction of maleic anhydride with di- or polyfunctional amine-containing compounds. In preferred embodiments, the amines are selected such that the maleimide-containing compound or mixture of maleimide-containing compounds does not crystallize. Exemplary maleimide-containing compounds include the reaction products of maleic anhydride with dimer fatty acid diamines, such as those commercially available at BMI-689 from Designer Molecules, Inc. Additional maleimide-containing compounds include the reaction products of amine-terminated polyethers or polysiloxanes with maleic anhydride. Further suitable maleimide-containing compounds include maleimide-terminated polyimides, available from Designer Molecules, Inc., or reaction products of maleimide-functional carboxylic acids with epoxy, hydroxyl, or other carboxylic acid-reactive functional groups. [0071] The maleimide-containing compound may comprise a maleimide equivalent weight of at least 95 g/eq, such as at least 200 g/eq, such as at least 250 g/eq. The maleimide- containing compound may comprise a maleimide equivalent weight of no more than 5,000 g/eq, such as no more than 2,000 g/eq, such as no more than 1,000 g/eq. The maleimide-containing compound may comprise a maleimide equivalent weight of 95 g/eq to 5,000 g/eq, such as 200 g/eq to 2,000 g/eq, such as 250 g/eq to 1,000 g/eq. [0072] The first component may comprise the thiol-containing compound and/or the amine-containing compound and the furan-containing compound in a molar ratio of at least 50:1, such as at least 10:1, such as at least 3:1, such as at least 3:8. The first component may comprise the thiol-containing compound and/or the amine-containing compound and the furan-containing compound in a molar ratio of no more than 1:50, such as no more than 1:10, such as no more than 1:3, such as no more than 1:1. The first component may comprise the thiol-containing compound and/or amine-containing compound and the furan-containing compound in a molar ratio of 50:1 to 1:50, such as 10:1 to 1:10, such as 3:1 to 1:3, such as 3:8 to 1:1. [0073] The composition may comprise the thiol-containing compound and/or amine- containing compound and the maleimide-containing compound in a molar ratio of at least 1:5, such as at least 1:3, such as at least 2:5. The composition may comprise the thiol-containing compound and/or amine-containing compound and the maleimide-containing compound in a molar ratio of no more than 5:1, such as no more than 3:1, such as no more than 5:2. The composition may comprise the thiol-containing compound and/or the amine-containing compound and the maleimide-containing compound in a molar ratio of 1:5 to 5:1, such as 1:3 to 3:1, such as 2:5 to 5:2. [0074] The composition may further comprise an epoxy-containing compound and/or an acrylate-functional compound. The epoxy-containing compound and/or the acrylate-functional compound may be present in the first component, the second component, or a third component. [0075] Suitable epoxy-containing compounds that may be used in the disclosed compositions may comprise monoepoxides, diepoxides, and/or polyepoxides. [0076] Suitable monoepoxides that may be used include monoglycidyl ethers of alcohols and phenols, such as phenyl glycidyl ether, n-butyl glycidyl ether, cresyl glycidyl ether, isopropyl glycidyl ether, glycidyl versatate, for example, CARDURA E available from Hexion., and glycidyl esters of monocarboxylic acids such as glycidyl neodecanoate, Epodil 741 available from Evonik, Epodil 746 available from Evonik, ERISYS ® GE-7 available from Huntsman, and mixtures of any of the foregoing. [0077] Suitable polyepoxides include polyglycidyl ethers of Bisphenol A, such as Epon® 828 and 1001 epoxy resins, and Bisphenol F diepoxides, such as Epon® 862, which are commercially available from Hexion Specialty Chemicals, Inc. Other suitable polyepoxides include polyglycidyl ethers of polyhydric alcohols, polyglycidyl esters of polycarboxylic acids, polyepoxides that are derived from the epoxidation of an olefinically unsaturated alicyclic compound, polyepoxides that are derived from the epoxidation of an olefinically unsaturated nonaromatic cyclic compound, polyepoxides containing oxyalkylene groups in the epoxy molecule, and epoxy novolac resins. Still other suitable epoxy-containing compounds include epoxidized Bisphenol A novolacs, epoxidized phenolic novolacs, epoxidized cresylic novolac, and triglycidyl p-aminophenol bismaleimide. The epoxy-containing compound may also comprise an epoxy-dimer acid adduct. The epoxy-dimer acid adduct may be formed as the reaction product of reactants comprising a diepoxide compound (such as a polyglycidyl ether of Bisphenol A) and a dimer acid (such as a C36 dimer acid). The epoxy-containing compound may also comprise a carboxyl-terminated butadiene-acrylonitrile copolymer modified epoxy- containing compound. The epoxy-containing compound may also comprise epoxidized castor oil. The epoxy-containing compound may also comprise an epoxy-containing acrylic, such as glycidyl methacrylate. The epoxy-containing compound may also comprise an epoxy-containing polymer such as epoxy-containing polyacrylate. [0078] The epoxy-containing compound may comprise an epoxy-adduct. The composition may comprise one or more epoxy-adducts. As used herein, the term “epoxy- adduct” refers to a reaction product comprising the residue of an epoxy and one other compound that does not include an epoxide functional group. For example, the epoxy-adduct may comprise the reaction product of reactants comprising (1) an epoxy, a polyol, and an anhydride; (2) an epoxy compound, a polyol, and a diacid; or (3) an epoxy compound, a polyol, an anhydride, and a diacid. [0079] The epoxy used to form the epoxy-adduct may comprise any of the epoxy- containing compounds listed above that may be included in the composition. [0080] The polyol used to form the epoxy-adduct may include diols, triols, tetraols and higher functional polyols, i.e., compounds comprising five or more hydroxyl groups per molecule. Combinations of such polyols may also be used. The polyols may be based on a polyether chain derived from ethylene glycol, propylene glycol, butylene glycol, hexylene glycol and the like as well as mixtures thereof. The polyol may also be based on a polyester chain derived from ring opening polymerization of caprolactone (referred to as polycaprolactone-based polyols hereinafter). Suitable polyols may also include polyether polyols, polyurethane polyols, polyurea polyols, acrylic polyols, polyester polyols, polybutadiene polyols, hydrogenated polybutadiene polyols, polycarbonate polyols, polysiloxane polyols, and combinations thereof. Polyamines corresponding to polyols may also be used, and in this case, amides instead of carboxylic esters will be formed with the diacids and anhydrides. [0081] The polyol may comprise a polycaprolactone-based polyol. The polycaprolactone-based polyols may comprise diols, triols or tetraols terminated with primary hydroxyl groups. Commercially available polycaprolactone-based polyols include those sold under the trade name Capa™ from Perstorp Group, such as, for example, Capa 2054, Capa 2077A, Capa 2085, Capa 2205, Capa 3031, Capa 3050, Capa 3091 and Capa 4101. [0082] The polyol may comprise a polytetrahydrofuran-based polyol. The polytetrahydrofuran-based polyols may comprise diols, triols or tetraols terminated with primary hydroxyl groups. Commercially available polytetrahydrofuran-based polyols include those sold under the trade name Terathane®, such as Terathane® PTMEG 250 and Terathane® PTMEG 650 which are blends of linear diols in which the hydroxyl groups are separated by repeating tetramethylene ether groups, available from Invista. In addition, polyols based on dimer diols sold under the trade names Pripol®, Solvermol™ and Empol®, available from Cognis Corporation, or bio-based polyols, such as the tetrafunctional polyol Agrol 4.0, available from BioBased Technologies, may also be utilized. [0083] The anhydride that may be used to form the epoxy-adduct may comprise any suitable acid anhydride known in the art. For example, the anhydride may comprise hexahydrophthalic anhydride and its derivatives (e.g., methyl hexahydrophthalic anhydride); phthalic anhydride and its derivatives (e.g., methyl phthalic anhydride); maleic anhydride; succinic anhydride; trimelletic anhydride; pyromelletic dianhydride (PMDA); 3,3′,4,4′- oxydiphthalic dianhydride (ODPA); 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA); and 4,4′-diphthalic (hexafluoroisopropylidene) anhydride (6FDA). [0084] The diacid used to form the epoxy-adduct may comprise any suitable diacid known in the art. For example, the diacids may comprise phthalic acid and its derivatives (e.g., methyl phthalic acid), hexahydrophthalic acid and its derivatives (e.g., methyl hexahydrophthalic acid), maleic acid, succinic acid, adipic acid, and the like. [0085] The epoxy-adduct may comprise a diol, a monoanhydride or a diacid, and a diepoxy compound, wherein the mole ratio of diol, monoanhydride (or diacid), and diepoxy compounds in the epoxy-adduct may vary from 0.5:0.8:1.0 to 0.5:1.0:6.0. [0086] The epoxy-adduct may comprise a triol, a monoanhydride or a diacid, and a diepoxy compound, wherein the mole ratio of triol, monoanhydride (or diacid), and diepoxy compounds in the epoxy-adduct may vary from 0.5:0.8:1.0 to 0.5:1.0:6.0. [0087] The epoxy-adduct may comprise a tetraol, a monoanhydride or diacid, and a diepoxy compound, wherein the mole ratio of tetraol, monoanhydride (or diacid), and diepoxy compounds in the epoxy-adduct may vary from 0.5:0.8:1.0 to 0.5:1.0:6.0. [0088] The epoxy compound may have an epoxy equivalent weight of at least 90 g/eq, such as at least 140 g/eq, such as at least 188 g/eq, and may have an epoxy equivalent weight of no more than 2,000 g/eq, such as no more than 1,000 g/eq, such as no more than 500 g/eq. The epoxy compound may have an epoxy equivalent weight of 90 g/eq to 2,000 g/eq, such as 140 g/eq to 1,000 g/eq, such as 188 g/eq to 500 g/eq. As used herein, “epoxy equivalent weight” is determined by dividing the Mnof the epoxy compound by the average number of epoxide groups present in the epoxy compound. [0089] The composition may comprise (a) the thiol-containing compound and/or the amine-containing compound and (b) the epoxy compound in a molar ratio of at least 50:1, such as at least 25:1. The composition may comprise (a) the thiol-containing compound and/or the amine-containing compound and (b) the epoxy compound in a molar ratio of no more than 2:1, such as no more than 1.3:1. The composition may comprise (a) the thiol-containing compound and/or the amine-containing compound and (b) the epoxy compound in a molar ratio of 50:1 to 2:1, such as 25:1 to 1.3:1. [0090] The composition may optionally further comprise an acrylate-functional compound. As used herein, the term “acrylate-functional” is understood to mean both substituted and non-substituted acrylate functional ingredients. [0091] Suitable acrylate-functional compounds include trimethylolpropane triacrylate, tripropyleneglycol diacrylate, dipropylene glycol diacrylate, cyclohexanedimethanol diacrylate, hexanediol diacrylate, pentaerythritol tetraacrylate, di-trimethylolpropane triacrylate, neopentylglycol propoxylate diacrylate, ethoxylated trimethylolpropane triacrylate, urethane acrylate oligomer, propoxylated glyceryl triacrylate, and aliphatic tetrafunctional polyester acrylate oligomer. [0092] Suitable acrylate-functional oligomers and polymers include those having an acrylic, polyester, polyether, epoxy, siloxane, melamine, or urethane chemical backbone. Suitable acrylate functional oligomers and polymers include Miramer products commercially available from Miwon Specialty Chemical Co., Sartomer products commercially available from Arkema S.A., and Photomer products commercially available from IGM Resins. [0093] The composition may comprise (a) the thiol-containing compound and/or the amine-containing compound and (b) the acrylate-functional compound in a molar ratio of at least 50:1, such as at least 25:1. The composition may comprise (a) the thiol-containing compound and/or the amine-containing compound and (b) the acrylate-functional compound in a molar ratio of no more than 2:1, such as no more than 1.3:1. The composition may comprise (a) the thiol- containing compound and/or the amine-containing compound and (b) the acrylate-functional compound in a molar ratio of 50:1 to 2:1, such as 25:1 to 1.3:1. [0094] The components of the composition according to the present disclosure may be substantially free, essentially free, or completely free of disulfide linkages. The thiol-containing compound and/or the amine-containing compound, the maleimide-containing compound, and/or the furan-containing compound may be free of disulfide linkages. Filler [0095] The composition may further comprise a filler. [0096] The filler may be electrically insulative. The electrically insulative filler may be thermally conductive filler or non-thermally conductive filler. As used herein, the term “electrically insulative filler” means a pigment, filler, or inorganic powder that has a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193). For example, the electrically insulative filler may have a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193), such as at least 20 Ω^.m, such as at least 30 Ω^.m, such as at least 40 Ω^.m, such as at least 50 Ω^.m, such as at least 60 Ω^.m, such as at least 60 Ω^.m, such as at least 70 Ω^.m, such as at least 80 Ω^.m, such as at least 80 Ω^.m, such as at least 90 Ω^.m, such as at least 100 Ω^.m. [0097] The electrically insulative filler may comprise a thermally conductive, electrically insulative filler material. As used herein, the term “thermally conductive, electrically insulative filler” or “TC/EI filler” means a pigment, filler, or inorganic powder that has a thermal conductivity of at least 5 W/m^.K at 25^oC (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193). The TC/EI filler material may comprise organic or inorganic material and may comprise particles of a single type of filler material or may comprise particles of two or more types of TC/EI filler materials. That is, the TC/EI filler material may comprise particles of a first TC/EI filler material and may further comprise particles of at least a second (i.e., a second, a third, a fourth, etc.) TC/EI filler material that is different from the first TC/EI filler material. As used herein with respect to types of filler material, reference to “first,” “second”, etc. is for convenience only and does not refer to order of addition or the like. [0098] The TC/EI filler material may have a thermal conductivity of at least 5 W/m^.K at 25^oC (measured according to ASTM D7984), such as at least 18 W/m^.K, such as at least 55 W/m^.K. The TC/EI filler material may have a thermal conductivity of no more than 3,000 W/m^.K at 25^oC (measured according to ASTM D7984), such as no more than 1,400 W/m^.K, such as no more than 450 W/m^.K. The TC/EI filler material may have a thermal conductivity of 5 W/m^.K to 3,000 W/m^.K at 25^oC (measured according to ASTM D7984), such as 18 W/m^.K to 1,400 W/m^.K, such as 55 W/m^.K to 450 W/m^.K. [0099] The TC/EI filler material may have a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193), such as at least 20 Ω^.m, such as at least 30 Ω^.m, such as at least 40 Ω^.m, such as at least 50 Ω^.m, such as at least 60 Ω^.m, such as at least 60 Ω^.m, such as at least 70 Ω^.m, such as at least 80 Ω^.m, such as at least 80 Ω^.m, such as at least 90 Ω^.m, such as at least 100 Ω^.m. [0100] Suitable non-limiting examples of TC/EI filler materials include nitrides, metal oxides, metalloid oxides, metal hydroxides, arsenides, carbides, minerals, ceramics, and diamond. For example, the TC/EI filler material may comprise, consist essentially of, or consist of boron nitride, silicon nitride, aluminum nitride, boron arsenide, aluminum oxide, magnesium oxide, dead burned magnesium oxide, beryllium oxide, silicon dioxide, titanium oxide, zinc oxide, nickel oxide, copper oxide, tin oxide, aluminum hydroxide (i.e., aluminum trihydrate), magnesium hydroxide, boron arsenide, silicon carbide, agate, emery, ceramic microspheres, diamond, or any combination thereof. Non-limiting examples of commercially available TC/EI filler materials of boron nitride include, for example, CarboTherm from Saint-Gobain, CoolFlow and PolarTherm from Momentive, and as hexagonal boron nitride powder available from Panadyne; of aluminum nitride, for example, aluminum nitride powder available from Micron Metals Inc., and as Toyalnite from Toyal; of aluminum oxide include, for example, Microgrit from Micro Abrasives, Nabalox from Nabaltec, Aeroxide from Evonik, and as Alodur from Imerys; of dead burned magnesium oxide include, for example, MagChem® P98 from Martin Marietta Magnesia Specialties; of aluminum hydroxide include, for example, APYRAL from Nabaltec GmbH and aluminum hydroxide from Sibelco; and of ceramic microspheres include, for example, ceramic microspheres from Zeeospheres Ceramics or 3M. These fillers can also be surface modified. For example, surface modified magnesium oxide available as PYROKISUMA 5301K available from Kyowa Chemical Industry Co., Ltd. Alternatively, the TC/EI filler materials may be free of any surface modification. [0101] As used herein, the term “dead burned magnesium oxide” refers to magnesium oxide that has been calcined at high-temperatures (e.g., ranging from 1500ºC – 2000ºC in a high temperature shaft kiln) yielding a material with very little reactivity relative to magnesium oxide that has not been calcined. [0102] The TC/EI filler material may be included as a single TC/EI filler material or may be included as a combination of two or more of the TC/EI filler materials described above. [0103] The electrically insulative filler may comprise a non-thermally conductive, electrically insulative filler material. As used herein, the term “non-thermally conductive, electrically insulative filler” or “NTC/EI filler” means a pigment, filler, or inorganic powder that that has a thermal conductivity of less than 5 W/m^.K at 25^oC (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193). For example, the NTC/EI filler may have a thermal conductivity of less than 5 W/m^.K at 25^oC (measured according to ASTM D7984, such no more than 3 W/m^.K , such as no more than 1 W/mK, such as no more than 0.1 W/mK, such as no more than 0.05 W/mK. For example, the NTC/EI filler may have a volume resistivity of at least 10 Ω^.m (measured according to ASTM D257, C611, or B193), such as at least 20 Ω^.m, such as at least 30 Ω^.m, such as at least 40 Ω^.m, such as at least 50 Ω^.m, such as at least 60 Ω^.m, such as at least 60 Ω^.m, such as at least 70 Ω^.m, such as at least 80 Ω^.m, such as at least 80 Ω^.m, such as at least 90 Ω^.m, such as at least 100 Ω^.m. The NTC/EI filler material may be organic or inorganic. [0104] Suitable non-limiting examples of NTC/EI filler materials include but are not limited to mica, silica, wollastonite, barium sulfate, calcium carbonate, glass microspheres, clay, or any combination thereof. [0105] As used herein, the term “mica” generally refers to sheet silicate (phyllosilicate) minerals. The mica may comprise muscovite mica. Muscovite mica comprises a phyllosilicate mineral of aluminum and potassium with the formula KAl2(AlSi3O10)(F,OH)2 or (KF)₂(Al₂O₃)₃(SiO₂)₆(H₂O). Exemplary non-limiting commercially available muscovite mica include products sold under the trade name DakotaPURE™, such as DakotaPURE™ 700, DakotaPURE™ 1500, DakotaPURE™ 2400, DakotaPURE™ 3000, DakotaPURE™ 3500 and DakotaPURE™ 4000, available from Pacer Minerals. [0106] The silica (SiO2) may comprise fumed silica which comprises silica that has been treated with a flame to form a three-dimensional structure. The fumed silica may be untreated or surface treated with a siloxane, such as, for example, polydimethylsiloxane. Exemplary non- limiting commercially available fumed silica includes products solder under the trade name AEROSIL®, such as AEROSIL® R 104, AEROSIL® R 106, AEROSIL® R 202, AEROSIL® R 208, AEROSIL® R 972 commercially available from Evonik Industries and products sold under the trade name HDK® such as HDK® H17 and HDK® H18 commercially available from Wacker Chemie AG. [0107] Wollastonite comprises a calcium inosilicate mineral (CaSiO₃) that may contain small amounts of iron, aluminum, magnesium, manganese, titanium and/or potassium. For example, the wollastonite may have a B.E.T. surface area of 1.5 to 2.1 m²/g, such as 1.8 m²/g and a median particle size of 6 microns to 10 microns, such as 8 microns. Non-limiting examples of commercially available wollastonite include NYAD 400 available from NYCO Minerals, Inc. [0108] The calcium carbonate (CaCO3) may comprise a precipitated calcium carbonate or a ground calcium carbonate. The calcium carbonate may or may not be surface treated with stearic acid. Non-limiting examples of commercially available precipitated calcium carbonate include Ultra-Pflex®, Albafil®, and Albacar HO® available from Specialty Minerals and Winnofil® SPT available from Solvay. Non-limiting examples of commercially available ground calcium carbonate include Duramite^TM available from IMERYS and Marblewhite® available from Specialty Minerals. [0109] Useful clay minerals include a non-ionic platy filler such as talc, pyrophyllite, chlorite, vermiculite, or combinations thereof. [0110] The glass microspheres may be hollow borosilicate glass. Non-limiting examples of commercially available glass microspheres include 3M Glass bubbles type VS, K series, and S series available from 3M. [0111] The electrically insulative filler material may have any particle shape or geometry. For example, the electrically insulative filler material may be a regular or irregular shape and may be spherical, ellipsoidal, cubical, platy, acicular (elongated or fibrous), rod- shaped, disk-shaped, prism-shaped, flake-shaped, rock-like, etc., agglomerates thereof, and any combination thereof. [0112] Particles of electrically insulative filler material may have a reported average particle size in at least one dimension of at least 0.01 microns, as reported by the manufacturer, such as at least 2 microns, such as at least 10 microns. Particles of electrically insulative filler material may have a reported average particle size in at least one dimension of no more than 500 microns as reported by the manufacturer, such as no more than 300 microns, such as no more than 200 microns, such as no more than 150 microns. The particles of electrically insulative filler material may have a reported average particle size in at least one dimension of 0.01 microns to 500 microns as reported by the manufacturer, such as 0.1 microns to 300 microns, such as 2 microns to 200 microns, such as 10 microns to 150 microns. Suitable methods of measuring average particle size include measurement using an instrument such as the Quanta 250 FEG SEM or an equivalent instrument. [0113] Particles of electrically insulative filler material may have a reported Mohs hardness of at least 1 (based on the Mohs Hardness Scale), such as at least 2, such as at least 3. Particles of electrically insulative filler material may have a reported Mohs hardness of no more than 10, such as no more than 8, such as no more than 7. Particles of electrically insulative filler material may have a reported Mohs hardness of 1 to 10, such as 2 to 8, such as 3 to 7. [0114] Coating compositions can comprise a flame retardant or combination of flame retardants. Certain TC materials described above such as aluminum hydroxide and magnesium hydroxide, for example, also may be flame retardants. As used herein, “flame retardant” refers to a material that slows down or stops the spread of fire or reduces its intensity. Flame retardants may be available as a powder that may be mixed with a composition, a foam, or a gel. In examples, when the coating compositions include a flame retardant, such compositions may form a coating on a substrate surface and such coating may function as a flame retardant. [0115] As set forth in more detail below, a flame retardant can include a mineral, an organic compound, an organohalogen compound, an organophosphorous compound, or a combination thereof. Suitable examples of minerals include huntite, hydromagnesite, various hydrates, red phosphorous, boron compounds such as borates, carbonates such as calcium carbonate and magnesium carbonate, and combinations thereof. Suitable examples of organohalogen compounds include organochlorines such as chlorendic acid derivatives and chlorinated paraffins; organobromines such as decabromodiphenyl ether (decaBDE), decabromodiphenyl ethane (a replacement for decaBDE), polymeric brominated compounds such as brominated polystyrenes, brominated carbonate oligomers (BCOs), brominated epoxy oligomers (BEOs), tetrabromophthalic anyhydride, tetrabromobisphenol A (TBBPA) and hexabromocyclododecane (HBCD). Such halogenated flame retardants may be used in conjunction with a synergist to enhance their efficiency. Other suitable examples include antimony trioxide, antimony pentaoxide, and sodium antimonate. Suitable examples of organophosphorous compounds include triphenyl phosphate (TPP), resorcinol bis(diphenylphosphate) (RDP), bisphenol A diphenyl phosphate (BADP), and tricresyl phosphate (TCP); phosphonates such as dimethyl methylphosphonate (DMMP); and phosphinates such as aluminum diethyl phosphinate. In one class of flame retardants, compounds contain both phosphorus and a halogen. Such compounds include tris(2,3- dibromopropyl) phosphate (brominated tris) and chlorinated organophosphates such as tris(1,3- dichloro-2-propyl)phosphate (chlorinated tris or TDCPP) and tetrakis(2- chlorethyl)dichloroisopentyldiphosphate (V6). Suitable examples of organic compounds include carboxylic acid, dicarboxylic acid, melamine, and organonitrogen compounds. Other suitable flame retardants include ammonium polyphosphate and barium sulfate. [0116] The filler may comprise lightweight fillers. Lightweight fillers may be organic, inorganic, or combinations thereof. As used herein, the term “lightweight” when used with reference to particles of the present disclosure means that the particles have a specific gravity of no more than 1.0 when measured according to ASTM D5965, with “specific gravity” being the ratio of a mass of a solid or liquid (e.g., a mass of particles) to a mass of an equal volume of distilled water at the same temperature (e.g., 25ºC). The lightweight fillers may have a specific gravity of at least 0.01 measured according to ASTM D5965, such as at least 0.02, such as at least 0.1. The lightweight fillers may have a specific gravity of no more than 1.0 measured according to ASTM D5965, such as no more than 0.7. The lightweight fillers may have a specific gravity of 0.01 to 1.0 measured according to ASTM D5965, such as 0.02 to 0.7. [0117] Suitable lightweight fillers may comprise microspheres. Useful examples of lightweight fillers include polystyrene foam, microspheres of polyacrylates and polyolefins, and silica microspheres having particle sizes of 5 to 100 microns and a specific gravity of 0.25 (ECCOSPHERES®, Trelleborg Applied Technologies). Other examples include alumina/silica microspheres having particle sizes 5 to 300 microns and a specific gravity of 0.7 (FILLITE®, Pluess-Stauffer International), aluminum silicate microspheres having a specific gravity of 0.45 to 0.7 (Z-LIGHT®), and calcium carbonate-coated polyvinylidene copolymer microspheres having a specific gravity of 0.13 (DUALITE 6001AE®, Pierce & Stevens Corp.). Other suitable lightweight fillers include, for example, hollow microspheres such as Expancel® microspheres (available from Nouryon) or Dualite® low density polymer microspheres (available from Henkel) or hollow borosilicate glass, such as 3M Glass bubbles type VS, K series and S series available from 3M. Compositions provided by the present disclosure include lightweight filler particles comprising an exterior surface coated with a thin coating, such as those described in U.S. Publication No.2010/0041839 at paragraphs [0016]-[0052], the cited portion of which is incorporated herein by reference. [0118] Suitable lightweight fillers include, for example, those described in: U.S. Pat. No. 6,525,168, column 4, lines 14-55, incorporated herein by reference; and U.S. Pat. No. 8,816,023, column 3, line 18 to column 9, line 44, incorporated herein by reference. [0119] The composition may comprise filler in an amount of at least 1 percent by weight based on total weight of the composition, such as at least 2 percent by weight, such as at least 5 percent by weight. The composition may comprise filler in an amount of no more than 80 percent by weight based on total weight of the composition, such as no more than 50 percent by weight, such as no more than 40 percent by weight. The composition may comprise filler in an amount of 1 percent by weight to 80 percent by weight based on total weight of the composition, such as 2 percent by weight to 50 percent by weight, such as 5 percent by weight to 40 percent by weight. Additive [0120] The composition may optionally comprise an additive. As used herein, an “additive” refers to a rheology modifier, a tackifier, a thermoplastic polymer, a surfactant, a flame retardant, a corrosion inhibitor, a UV stabilizer, a colorant, a tint, a solvent, a plasticizer, an adhesion promoter, an antioxidant, a silane, a stabilizer, an oil, a moisture scavenger and/or a blowing agent. [0121] Rheology modifiers optionally may include thixotropes. Thixotropes may be sag control agents. Useful thixotropes and/or sag control agents that may be used include wax, fumed silica, castor wax, clay, organo clay, fibers such as Aramid® fibers and Kevlar® fibers, ceramic fibers, and/or engineered cellulose fibers. Waxes useful in the composition disclosed herein are not particularly limited provided the wax has properties suitable for thixotropy and/or sag control. Generally, the wax may have a weight-average molecular weight of less than 10,000. Examples of suitable waxes useful in the compositions disclosed herein include microcrystalline waxes, polyethylene waxes, Fischer-Tropsch waxes, paraffin waxes, Castor wax, polypropylene waxes, amide derivatives of the former, or combinations thereof. Further examples of suitable thixotropes and/or sag control agents include organic resins or solids comprising chemical linkages with hydrogen bonding capability, such as polyurethane, polyurea, polyester, polyaramid, polyimide, carbodiimide, and combinations thereof. Such polyureas may include those disclosed in U.S. Patent No.4,965,317 at col. 5, line 10 to col.6, line 24, incorporated herein by reference. The organic resins or solids may optionally comprise reactive functional groups such as epoxide, isocyanate, ethylenic unsaturation, amine, thiol, furan, or maleimide. Combinations of thixotropes may be used to achieve sag control. [0122] Examples of suitable corrosion inhibitors include, for example, zinc phosphate- based corrosion inhibitors, for example, micronized Halox® SZ-391, Halox® 430 calcium phosphate, Halox® ZP zinc phosphate, Halox® SW-111 strontium phosphosilicate, Halox® 720 mixed metal phosphor-carbonate, and Halox® 550 and 650 proprietary organic corrosion inhibitors commercially available from Halox. Other suitable corrosion inhibitors include Heucophos® ZPA zinc aluminum phosphate and Heucophos® ZMP zinc molybdenum phosphate, commercially available from Heucotech Ltd. [0123] A corrosion inhibitor can comprise a lithium silicate such as lithium orthosilicate (Li4SiO4) and lithium metasilicate (Li2SiO3), MgO, an azole, or a combination of any of the foregoing. The corrosion inhibiting component may further comprise at least one of magnesium oxide (MgO) and/or an azole. [0124] Useful colorants or tints may include phthalocyanine blue, ultramarine blue, red iron pigment, titanium dioxide, calcium carbonate, and combinations thereof. [0125] Compositions provided by the present disclosure can comprise a flame retardant or combination of flame retardants. Certain thermally conductive materials such as aluminum hydroxide and magnesium hydroxide, for example, also may be flame retardants. As used herein, “flame retardant” refers to a material that slows down or stops the spread of fire or reduces its intensity. Flame retardants may be available as a powder that may be mixed with a composition, a foam, or a gel. In examples, when the compositions disclosed herein include a flame retardant, such compositions may form a coating on a substrate surface and such coating may function as a flame retardant. [0126] As set forth in more detail below, a flame retardant can include a mineral, an organic compound, an organohalogen compound, an organophosphorous compound, or a combination thereof. [0127] Suitable examples of minerals include huntite, hydromagnesite, various hydrates, red phosphorous, boron compounds such as borates, carbonates such as calcium carbonate and magnesium carbonate, and combinations thereof. [0128] Suitable examples of organohalogen compounds include organochlorines such as chlorendic acid derivatives and chlorinated paraffins; organobromines such as decabromodiphenyl ether (decaBDE), decabromodiphenyl ethane (a replacement for decaBDE), polymeric brominated compounds such as brominated polystyrenes, brominated carbonate oligomers (BCOs), brominated epoxy oligomers (BEOs), tetrabromophthalic anhydride, tetrabromobisphenol A (TBBPA) and hexabromocyclododecane (HBCD). Such halogenated flame retardants may be used in conjunction with a synergist to enhance their efficiency. Other suitable examples include antimony trioxide, antimony pentaoxide, and sodium antimonate. [0129] Suitable examples of organophosphorous compounds include triphenyl phosphate (TPP), resorcinol bis(diphenylphosphate) (RDP), bisphenol A diphenyl phosphate (BADP), and tricresyl phosphate (TCP); phosphonates such as dimethyl methylphosphonate (DMMP); and phosphinates such as aluminium diethyl phosphinate. In one class of flame retardants, compounds contain both phosphorus and a halogen. Such compounds include tris(2,3- dibromopropyl) phosphate (brominated tris) and chlorinated organophosphates such as tris(1,3- dichloro-2-propyl)phosphate (chlorinated tris or TDCPP) and tetrakis(2- chlorethyl)dichloroisopentyldiphosphate (V6). [0130] Suitable examples of organic compounds include carboxylic acid, dicarboxylic acid, melamine, and organonitrogen compounds. [0131] Other suitable flame retardants include ammonium polyphosphate and barium phosphate. [0132] Useful plasticizers that may be used include polymers, trimellitates, sebacates, esters, phthalates, citrates, adipates, benzoates, and the like. Non-limiting examples of such plasticizers include diisononylphthalate (JayFlex™ DINP available from Exxon Mobil), dioctylphthalate (Cereplas DOA^TM available from Valtris), diisodecylphthalate (Jayflex^TM DIDP available from Exxon Mobil), and alkyl benzyl phthalate (Santicizer 278 available from Valtris); benzoate-based plasticizers such as dipropylene glycol dibenzoate (K-Flex® available from Emerald Performance Materials); and other plasticizers including terephthalate-based dioctyl terephthalate (DEHT available from Eastman Chemical Company), alkylsulfonic acid ester of phenol (Mesamoll available from Borchers), epoxidized soybean oil (Plaschek 775 from Valtris), citric acid esters (Citroflex available from Morflex), phenylphophates (Santicizer 148 from Solutia), and 1,2-cyclohexane dicarboxylic acid diisononyl ester (Hexamoll DINCH available from BASF). [0133] Stabilizers may be blended to prevent reduction of molecular weight by heating, gelation, coloration, generation of an odor and the like in the composition to improve the stability of the composition. Stabilizers that may be used in the compositions disclosed herein are not particularly limited. Examples of stabilizers useful in the compositions disclosed herein include an antioxidant, an ultraviolet absorbing agent, or combinations thereof. The stabilizer optionally may be lactone-based. The antioxidant may be used to prevent oxidative degradation of the disclosed compositions. Examples of the antioxidant include phenol-based antioxidants, sulfur-based antioxidants, and phosphorous- based antioxidants. The ultraviolet absorbing agent may be used to improve the light resistance of the disclosed compositions. Examples of the ultraviolet absorbing agent include benzotriazole-based ultraviolet absorbing agents and benzophenone-based ultraviolet absorbing agents. Specific examples of suitable stabilizers include SUMILIZER GM (trade name), SUMILIZER TPD (trade name) and SUMILIZER TPS (trade name) manufactured by Sumitomo Chemical Co., Ltd., IRGANOX 1010 (trade name), IRGANOX HP2225FF (trade name), IRGAFOS 168 (trade name), IRGANOX 1520 (trade name) and TINUVIN P manufactured by Ciba Specialty Chemicals, JF77 (trade name) manufactured by Johoku Chemical Co., Ltd., TOMINOX TT (trade name) manufactured by API Corporation and AO- 4125 (trade name) manufactured by ADEKA CORPORATION. [0134] Oils useful in the compositions disclosed herein may include unsaturated renewable oils such as sunflower oil, safflower oil, soybean oil, linseed oil, castor oil, orange oil, rapeseed oil, tall oil, vegetable processing oil, vulcanized vegetable oil, high oleic acid sunflower oil, cottonseed oil, nut oils, and combinations thereof. Useful oils may include mineral oils such as Novadex B111 or Catenex T129 (available from Shell). [0135] The composition may be substantially free, essentially free, or completely free of solvent. [0136] Blowing agents useful in the compositions include chemical blowing agents, physical blowing agents or combinations thereof. As used herein, “blowing agent” refers to any agent which produces voids in the polyurethane matrix during polymerization. [0137] Suitable physical blowing agents include compounds with boiling points of -80^oC to 50^oC and which are vaporized during the exothermic polymerization reaction. Physical blowing agents typically do not decompose or react during the polymerization reaction. Suitable examples of physical blowing agents include carbon dioxide, hydrocarbons, chlorofluorocarbons (CFCs), hydrofluorocarbons (HFCs) such as Genetron® 245 fa (a 1,1,1,3,3,3-pentafluoropropane commercially available from Honeywell) and Opteon^TM 1100 or Formacel®1100 (each a 1,2-bis(trifluoromethyl)ethene commercially available from Honeywell and The Chemours Company, respectively), hydrochlorofluorocarbons (HCFCs) such as Solstice ® LBA (a trans-1-chloro-3,3,3-trifluoropropene commercially available from Honeywell), fluoroolefins (FOs), chlorofluoroolefins (CFOs), hydrofluoroolefins (HFOs), hydrochlorfluoroolefins (HCFOs), acetone, and low-boiling hydrocarbons such as cyclopentane, isopentane, n-pentane, and their mixtures. [0138] Suitable chemical blowing agents include compounds, for example water, that react with isocyanate compounds to produce a gas. [0139] As noted above, the composition may comprise an additive. Such additives, if present at all, may be present in the composition in a combined positive amount, such as at least 0.01 percent by weight based on total weight of the composition, such as at least 0.1 percent by weight, such as at least 0.25 percent by weight. Such additives, if present at all, may be present in the composition in a combined amount of no more than 20 percent by weight based on total weight of the composition, such as no more than 15 percent by weight, such as no more than 10 percent by weight. Such additives, if present at all, may be present in the composition in a combined positive amount up to 20 percent by weight based on total weight of the composition, such as at least 0.01 percent by weight to 20 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 15 percent by weight, such as 0.25 percent by weight to 10 percent by weight. Elastomeric Particles [0140] The composition of the present disclosure may further comprise elastomeric particles. As used herein, “elastomeric particles” refers to particles comprising one or more materials having at least one glass transition temperature (Tg) of greater than -150ºC and less than 30ºC, calculated, for example, using the Fox Equation. As used herein, the term “glass transition temperature” (“Tg”) refers to the temperature at which an amorphous material, such as glass or a polymer, changes from a brittle vitreous state to a plastic state or from a plastic state to a brittle vitreous state. [0141] The elastomeric particles may have a core/shell structure. Suitable core-shell elastomeric particles may be comprised of an acrylic shell and an elastomeric core. The core may comprise natural or synthetic rubbers, polybutadiene, styrene-butadiene, polyisoprene, chloroprene, acrylonitrile butadiene, butyl rubber, polysiloxane, polysulfide, ethylene-vinyl acetate, fluoroelastomer, polyolefin, or combinations thereof. The elastomeric particles e.g., may comprise a polybutadiene core, a styrene butadiene core, and/or a polysiloxane core. [0142] According to the present disclosure, the elastomeric particles may optionally be included in an epoxy carrier resin for introduction into the coating composition. Suitable finely dispersed core-shell elastomeric particles in an average particle size ranging from 20 nm to 400 nm may be master-batched in epoxy resin such as aromatic epoxides, phenolic novolac epoxy resin, bisphenol A, bisphenol F diepoxide, and/or aliphatic epoxides, which include cyclo- aliphatic epoxides, at concentrations ranging from 1% to 80% by weight based on total weight of the elastomeric dispersion, such as from 5% to 50% by weight, such as from 15% to 35% by weight. Suitable epoxy resins may also include a mixture of epoxy resins. When utilized, the epoxy carrier resin may be an epoxy-containing component of the present disclosure such that the weight of the epoxy-containing component present in the coating composition includes the weight of the epoxy carrier resin. [0143] Exemplary non-limiting commercial core-shell elastomeric particle products using poly(butadiene) rubber particles that may be utilized in the coating composition of the present disclosure include core-shell poly(butadiene) rubber powder (commercially available as PARALOID™ EXL 2650A from Dow Chemical), a core-shell poly(butadiene) rubber dispersion (25% core-shell rubber by weight) in bisphenol F diglycidyl ether (commercially available as Kane Ace MX 136), a core-shell poly(butadiene) rubber dispersion (33% core-shell rubber by weight) in Epon^® 828 (commercially available as Kane Ace MX 153), a core-shell poly(butadiene) rubber dispersion (33% core-shell rubber by weight) in Epiclon^® EXA-835LV (commercially available as Kane Ace MX 139), a core-shell poly(butadiene) rubber dispersion (37% core-shell rubber by weight) in bisphenol A diglycidyl ether (commercially available as Kane Ace MX 257), and a core-shell poly(butadiene) rubber dispersion (37% core-shell rubber by weight) in Epon^® 863 (commercially available as Kane Ace MX 267), each available from Kaneka Texas Corporation. [0144] Exemplary non-limiting commercial core-shell elastomeric particle products using styrene-butadiene rubber particles that may be utilized in the coating composition include a core-shell styrene-butadiene rubber powder (commercially available as CLEARSTRENGTH^® XT100 from Arkema), an MMA-Styrene-Butadiene core shell rubber (commercially available as Clearstrength XT 100 from Arkema), a core-shell styrene-butadiene rubber powder (commercially available as PARALOID™ EXL 2650J), a core-shell styrene-butadiene rubber dispersion (33% core-shell rubber by weight) in bisphenol A diglycidyl ether (commercially available as Fortegra™ 352 from Olin™), a core-shell styrene-butadiene rubber dispersion (33% rubber by weight) in low viscosity bisphenol A diglycidyl ether (commercially available as Kane Ace MX 113), a core-shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in bisphenol A diglycidyl ether (commercially available as Kane Ace MX 125), a core- shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in bisphenol F diglycidyl ether (commercially available as Kane Ace MX 135), a core-shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in D.E.N.^TM-438 phenolic novolac epoxy (commercially available as Kane Ace MX 215), a core-shell styrene-butadiene rubber dispersed in bisphenol A epoxy resin (such as KDAD-710135% core shell rubber by weight) (commercially available from Kukdo Chemical), a core-shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in Araldite® MY-721 multi-functional epoxy (commercially available as Kane Ace MX 416), a core-shell styrene-butadiene rubber dispersion (25% core- shell rubber by weight) in MY-0510 multi-functional epoxy (commercially available as Kane Ace MX 451), a core-shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in Syna Epoxy 21 Cyclo-aliphatic Epoxy from Synasia (commercially available as Kane Ace MX 551), and a core-shell styrene-butadiene rubber dispersion (25% core-shell rubber by weight) in polypropylene glycol (MW 400) (commercially available as Kane Ace MX 715), each available from Kaneka Texas Corporation. [0145] Exemplary non-limiting commercial core-shell elastomeric particle products using polysiloxane rubber particles that may be utilized in the coating composition of the present disclosure include a core-shell polysiloxane rubber powder (commercially available as GENIOPERL^® P52 from Wacker), a core-shell polysiloxane rubber dispersion (40% core-shell rubber by weight) in bisphenol A diglycidyl ether (commercially available as ALBIDUR^® EP2240A from Evonik), a core-shell polysiloxane rubber dispersion (25% core-shell rubber by weight) in Epon^® 828 (commercially available as Kane Ace MX 960), a core-shell polysiloxane rubber dispersion (25% core-shell rubber by weight) in Epon^® 863 (commercially available as Kane Ace MX 965) each available from Kaneka Texas Corporation. [0146] The elastomeric particles, if present at all, may be present in the composition in a positive amount, such as at least 0.1 percent by weight based on total weight of the composition, such as at least 1 percent by weight, such as at least 2 percent by weight. The elastomeric particles, if present at all, may be present in the composition in an amount of no more than 50 percent by weight based on total weight of the composition, such as no more than 20 percent by weight, such as no more than 10 percent by weight. The elastomeric particles, if present at all, may be present in the composition in a positive amount up to 50 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 50 percent by weight, such as 1 percent by weight to 20 percent by weight, such as 2 percent by weight to 10 percent by weight. Accelerator [0147] The composition of the present disclosure may further comprise an accelerator. The accelerator may be active or latent, such as a blocked and/or an encapsulated accelerator. [0148] For example, the accelerator may comprise an amine-based catalyst. For example, the accelerator may comprise a guanidine, a substituted guanidine, a substituted urea, a melamine resin, a guanamine derivative, a cyclic tertiary amine, an aromatic tertiary amine, or combinations thereof. It will be understood that “guanidine,” as used herein, refers to guanidine and derivatives thereof. [0149] Useful accelerators include trimethylamine; tributylamine; N,N-bis(N,N- dimethyl-2-aminoethyl)methylamine; N,N-dimethylcyclohexylamine; N-methylmorpholine; N- ethylmorpholine; 1,2-dimethyl-1,4,5,6-tetrahydropyrimidine; 1,4,5,6-tetrahydropyrimidine; 1,8- diazabicyclo[5.4.0]undec-7-ene; 1,5,7-triazabicyclo[4.4.0]dec-5-ene; 7-methyl-1,5,7- triazabicyclo[4.4.0]dec-5-ene; 1,5-diazabicyclo[4.3.0]non-5-ene; 6-(dibutylamino)-1,8- diazabicyclo(5,4,0)undec-7-ene; 1,4-diazabicyclo[2.2.2]octane; 7-azabicyclo[2.2.1]heptane; N, N-dimethylphenylamine; 4,5-dihydro-1H-imidazole; and guanidine-based catalysts such as guanidine, methylguanidine, dimethylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, methylisobiguanidine, dimethylisobiguanidine, tetramethylisobiguanidine, hexamethylisobiguanidine, heptamethylisobiguanidine, phenylguanidine, diphenylguanidine, butylbiguanide, 1-o-tolylbiguanide, 1-phenylbiguanide, 1- methyl-3-nitroguanidine, 1,8-bis(tetramethylguanidino)-naphthalene, and N,N,N',N'-tetramethyl- N''-[4-morpholinyl(phenylimino)methyl]guanidine, and cyanoguanidine. Representatives of suitable guanamine derivatives which may be mentioned are alkylated benzoguanamine resins, benzoguanamine resins or methoxymethylethoxymethylbenzoguanamine. [0150] The accelerator may comprise azoles, diazoles, triazoles, higher functional azoles, and combinations thereof. Suitable alkaloid compounds include pyrrolidine, tropane, pyrrolizidine, piperidine, quinolizidine, indolizidine, pyridine, isoquinoline, oxazole, isoxazole, thiazole, quinazoline, acridine, quinoline, indole, imidazole, purine, phenethylamine, muscarine, benzylamines, derivatives of these alkaloid compounds, or combinations thereof, e.g., the accelerator may comprise a guanidine, a guanidine derivative and/or an imidazole. [0151] Additional suitable accelerators include Lewis acids, such as metal complexes. Suitable exemplary Lewis acids include zinc chloride, boron trifluoride, tin tetrachloride, and aluminum chloride. [0152] The accelerator, if present at all, may be present in the composition in an amount of no more than 25 percent by weight based on total weight of the composition, such as no more than 10 percent by weight, such as no more than 5 percent by weight. The accelerator, if present at all, may be present in the composition in a positive amount, such as at least 0.01 percent by weight based on total weight of the composition, such as at least 0.1 percent by weight, such as at least 0.5 percent by weight. The accelerator, if present at all, may be present in the composition in a positive amount up to 25 percent by weight based on total weight of the composition, such as 0.01 percent by weight to 25 percent by weight, such as 0.1 percent by weight to 10 percent by weight, such as 0.5 percent by weight to 5 percent by weight. Compositions, Methods and Systems [0153] The curable compositions may be provided as multi-component compositions. [0154] A first component may comprise, or consist essentially of, or consist of, a thiol- containing compound, an amine-containing compound, or a combination thereof, and a furan- containing compound. The first component optionally may comprise, an additive, an accelerator, filler and/or elastomeric particles. A second component may comprise, consist essentially of, or consist of, a maleimide-containing compound comprising one maleimide group. The second component optionally may comprise, an additive, an accelerator, filler and/or elastomeric particles. Additional components (i.e., third components, fourth components, etc.) may comprise an additive, an accelerator, filler and/or elastomeric particles. [0155] The composition according to the present disclosure may comprise a curable composition. The curable composition may comprise a film-forming composition, an adhesive composition, a sealant composition, a pottant composition, a gap filler composition, a pre-preg composition, an embedding composition, an encapsulating composition, a hot melt composition, or the like. The adhesive composition may be a structural adhesive. The composition may be a film, an embedding material, an encapsulating material, a potting material, a hot melt, or the like, or combinations thereof, wherein the composition may be heated above its reflow onset temperature and may be used to surround a substrate or assembly in order to substantially exclude air, water, and/or moisture from the substrate and/or to add strength or stiffness to the substrate or assembly. The composition optionally may be cured by an external energy source following the embedding, encapsulating, or potting processes. Additionally, the composition may be brought into contact with a surface or assembly as a solid film, and the system may be heated above the reflow onset temperature of the composition, then cooled to yield a bonded or embedded system. [0156] The compositions disclosed herein may be applied alone or as part of a coating system. Compositions disclosed herein may be applied directly onto the surface of a substrate or over an underlayer by any suitable coating process. Compositions can be deposited on substrates in a number of different ways, non-limiting examples of which include brushes, rollers, films, pellets, pressure injectors, spray guns and applicator guns. The system may comprise a number of the same or different layers and may further comprise other coating compositions such as pretreatment compositions, primers, and the like. A coating, film, layer or the like is typically formed when a composition that is deposited onto the substrate is at least partially cured by methods known to those of ordinary skill in the art (e.g., under ambient conditions and may further cure by through the use of an external energy source such as an oven or other thermal means or through the use of actinic radiation) to form a coating, layer or film. A multi- component composition may at least partially cure at ambient temperature. Compositions may be cured at a temperature of 0 to 40°C, such as 10°C to 25°C, and atmospheric humidity. A composition may be cured at a higher temperature such as at least 30°C., at least 40°C., or at least 50°C. When cured at room temperature a coating provided by the present disclosure can cure to a tack free surface, for example, within 24 hours, within 20 hours, within 16 hours, within 12 hours, within 6 hours, or within 3 hours, from the time of mixing. The skilled person understands, however, that the time of curing varies with temperature. [0157] The present disclosure is also directed to a method for forming a bond between two substrates for a wide variety of potential applications in which the bond between the substrates provides particular mechanical properties, such as lap shear strength. The method may comprise, consist essentially of, or consist of mixing the first component and the second component to form one of the compositions described herein; applying the composition to a first substrate; contacting a second substrate to the composition such that the composition is located between the first substrate and the second substrate; and applying sufficient pressure for the composition to intimately contact both substrates. For example, the composition may be applied to either or both of the substrate materials being bonded to form an adhesive bond there between and the substrates may be aligned and pressure and/or spacers may be added to control bond thickness. The composition may be applied to cleaned or uncleaned (i.e., including oily or oiled) substrate surfaces. The composition also may be applied to a substrate that has been pretreated, coated with an electrodepositable coating, and/or coated with additional layers such as a primer, basecoat, or topcoat. The composition can be applied to the surface of a substrate in any number of different ways, non-limiting examples of which include brushes, rollers, films, pellets, pressure injectors, spray guns and applicator guns, including hot melt guns. [0158] A coating may be formed when a composition that is deposited onto the substrate is cured, e.g., by mixing the two components and/or by using an external energy source. Such external energy sources include energy sources known to those of ordinary skill in the art, such as by thermal heating (such as an oven) or through the use of actinic radiation. For example, the composition can be cured by baking and/or curing at elevated temperature, such as at a temperature of at least 40^oC, such as at least 60^oC, such as at least 80^oC, such as at least 100^oC, such as at least 120^oC, such as at least 125^oC, such as at least 130^oC, and in some cases at a temperature of no more than 250^oC, such as no more than 210^oC, such as no more than 205^oC, such as no more than 200^oC, such as no more than 195^oC, and in some cases at a temperature of from 40^oC to 250^oC, such as 60^oC to 250^oC such as 80^oC to 250^oC, from 100^oC to 210^oC, from 120^oC to 205^oC, from 125^oC to 200^oC, from 130^oC to 195^oC, and for any desired time period (e.g., from 1 minute to 5 hours) sufficient to cure the coating composition on the substrate(s). The skilled person understands, however, that the time of curing varies with temperature. [0159] The present disclosure is also directed to a method of forming a coating on a surface of a substrate comprising: mixing a first component and a second component to form any of the compositions disclosed herein; and applying the composition to the surface of the substrate, wherein a portion of the substrate is coated with the composition following the applying. [0160] The present disclosure is also directed to a method for forming a coating on a surface of a substrate comprising mixing a first component and a second component to form any of the compositions disclosed herein; casting a film, which is then cured; and contacting a portion of a substrate surface with the film. [0161] The system may then be heated above the reflow onset temperature of the composition then cooled to yield the composition bonded to the surface. The film may have a thickness of at least 1 mil, such as at least 2 mil, such as at least 4 mil. The film may have a thickness of no more than 100 mil, such as no more than 50 mil, such as no more than 25 mil. The film may have a thickness of 1 mil to 100 mil, such as 2 mil to 50 mil, such as 4 mil to 25 mil. The film may be applied to a portion of a surface of a substrate. The film may be used to form a bond between two substrates, wherein a second substrate is contacted with the film on the surface of the first substrate, and the system is heated above the reflow onset temperature of the composition, then cooled to yield a bonded assembly. [0162] The curing of the composition, whether applied as a composition or a cured film, may be reversible. An external energy source, such as heat, may be applied to the cured composition, which may reverse the crosslinking and allow for separation of the bonded substrates. The curing composition may have a reduction in lap shear strength from >5 MPa at ambient temperature to <0.5 MPa at a temperature greater than 50ºC, such as greater than 60ºC, such as greater than 70ºC. [0163] The composition may have a reflow onset temperature of at least 50ºC, such as at least 60ºC, such as at least 70ºC. The composition may have a reflow onset temperature of less than 250ºC, such as less than 200ºC, such as less than 175ºC. As used herein, the term “reflow onset temperature” means the temperature at which the storage modulus of the composition drops below 1,000,000 Pa as may be determined by performing dynamic mechanical analysis at a frequency of 1.0 Hz and a temperature ramp rate of 3ºC/min. [0164] The present disclosure is also directed to a method of repairing a joint upon failure or damage to the joint, wherein the bond between the two substrates is broken. The bond between the two substrates may be reformed by the method of bonding two substrates described herein above, heating the assembly above the reflow onset temperature of the composition, then cooling the assembly, as described herein above. [0165] The present disclosure is also directed to a method of repairing an article, coating, or film formed from one of the compositions disclosed herein. [0166] The present disclosure is further directed to a method of forming an article comprising extruding any of the compositions disclosed herein. The extruding may comprise three-dimensional printing. [0167] It has been surprisingly discovered that the compositions disclosed herein demonstrate a combination of both high lap shear strength at ambient temperature and low lap shear strength at elevated temperatures. It has also been surprisingly discovered that the composition may be applied as a curable composition or as a free-standing film. It has also been surprisingly discovered that a coating formed from any of the curable compositions disclosed herein can be directly repaired after failure or damage of the coating. It has also been surprisingly discovered that a joint formed from the coating can be directly repaired after failure or damage of the joint. [0168] Without intending to be bound by theory, it is believed that the first component and the second component may be crosslinked by (1) a Diels-Alder reaction between the furan- containing compound and the maleimide-containing compound and (2) a Michael addition reaction between the thiol-containing compound, amine-containing compound, or combination thereof and at least one of the maleimide groups of the maleimide-containing compound. 3-D Printing [0169] Compositions of the present disclosure may be applied or deposited using any suitable method, including those aforementioned. Alternatively, the composition may be casted, extruded, molded, or machined to form a part or a member. [0170] The compositions disclosed herein may be used in any suitable additive manufacturing technology, such as three-dimensional (3D) printing, extrusion, jetting, and binder jetting. Additive manufacturing refers to a process of producing a part or member by constructing it in layers, such as one layer at a time. [0171] The present disclosure is also directed to the production of structural articles, such as by way of a non-limiting example, sound damping pads, using an additive manufacturing process, such as 3D printing.3D printing refers to a computerized process, optionally including artificial intelligence modulation, by which materials are printed or deposited in successive layers to produce a 3D part or member, such as, by way of a non-limiting example, sound damping pads in a battery assembly. A 3D part or member may be produced by depositing successive portions or layers over a base of any spatial configuration and thereafter depositing additional portions or layers over the underlying deposited portion or layer and/or adjacent to the previously deposited portion or layer to produce the 3D printed part or member. [0172] It will be appreciated that the configuration of the 3D printing process, including the selection of suitable deposition equipment, depends on a number of factors such as the deposition volume, the viscosity of the composition and the complexity of the part being fabricated. Any suitable mixing, delivery, and 3D printing equipment as known to those skilled in the art, may be used. Compositions may be printed or deposited in any size and/or shape of droplets or extrudate, and in any patterns to produce the 3D structure. [0173] Compositions as disclosed herein may be applied or deposited by any suitable 3D printing method as known to those skilled in the art. First and second components of 2K compositions may be mixed and then deposited, or the first and second components may be deposited separately, such as simultaneously and/or sequentially. [0174] First and second components may be premixed, i.e., mixed together, prior to application, and then deposited. The mixture may be reacted or thermoset when the material is deposited; the deposited reaction mixture may react in part after deposition and may also react with previously deposited portions and/or subsequently deposited portions of the article such as underlying layers or overlying layers of the article. [0175] In a non-limiting example, the first and two components may be released from their individual storage containers and pushed, such as pumped through conduits, such as hoses, to a mixer, such as a static or dynamic mixer, wherein the composition may be mixed for a time sufficient to homogenize the composition, wherein the composition may then be released through an outlet. The outlet may be a deposition device, such as a printing head, and/or the materials may exit the mixing unit and be pushed, such as by a pump, through a conduit, such as a hose, to the printing head. The printing head may optionally be mounted on a 3D rotational robotic arm to allow delivery of 3D print compositions to any base in any spatial configuration and/or the base may be manipulated in any spatial configuration during the 3D printing process. [0176] Alternatively, first and second components may be deposited independently from different printing heads. The first component may be deposited from one printing head and the second component may be deposited from a second printing head. The first and second components may be deposited in any pattern such that the first and second components comprising any deposited layer can react together as well as react with underlying and/or overlying layers to produce the 3D printed part or member. [0177] Methods provided by the present disclosure include printing the composition on a fabricated part. Methods provided by the present disclosure include directly printing parts. [0178] Using the methods provided by the present disclosure parts can be fabricated. The entire part can be formed from one of the compositions disclosed herein, one or more portions of a part can be formed from one of the compositions disclosed herein, one or more different portions of a part can be formed using the compositions disclosed herein, and/or one or more surfaces of a part can be formed from a composition provided by the present disclosure. In addition, internal regions of a part can be formed from a composition provided by the present disclosure. Substrates [0179] Compositions described herein may be coated or deposited on, or otherwise contacted with, any substrate or surface, such as, but not limited to metals or metal alloys, polymeric materials, such as plastics including filled and unfilled thermoplastic or thermoset materials, and/or composite materials. Other suitable substrates include, but are not limited to, glass or natural materials such as wood. Substrates may include two or more of any different materials in any combination, such as, but not limited to, two different metals, or a metal and a metal alloy, or a metal and a metal alloy and one or more composite materials. [0180] Suitable substrates may include, but are not limited to, both flexible and rigid metal substrates such as ferrous metals, aluminum, aluminum alloys, magnesium, titanium, copper, and other metal and alloy substrates. The ferrous metal substrates may include, for example, iron, steel, and alloys thereof. Non-limiting examples of useful steel materials include cold rolled steel, nickel plated cold rolled steel, galvanized (zinc coated) steel, electrogalvanized steel, stainless steel, pickled steel, zinc-iron alloy such as GALVANNEAL, and combinations thereof. Aluminum alloys, such as those, for example, of the 1XXX, 2XXX, 3XXX, 4XXX, 5XXX, 6XXX, 7XXX, or 8XXX series as well as clad aluminum alloys and cast aluminum alloys, such as those, for example, of the A356, 1XX.X, 2XX.X, 3XX.X, 4XX.X, 5XX.X, 6XX.X, 7XX.X, or 8XX.X series also may be used as the substrate. The substrate also may comprise, for example, magnesium, such as magnesium alloys of the AZ31B, AZ91C, AM60B, or EV31A series, titanium and/or titanium alloys, such as those of grades 1-36 including H grade variants, copper and copper alloys, or other non-ferrous metals, as well as alloys of these materials. The substrate may comprise a composite material such as a plastic, fiberglass and/or carbon fiber composite. [0181] It will also be understood that the substrate may comprise a bare substrate or the substrate may be pretreated or pre-coated with one or more layers. Suitable pretreatment solutions may include but are not limited to a zinc phosphate pretreatment solution such as, for example, those described in U.S. Pat. Nos. 4,793,867 and 5,588,989, or a zirconium containing pretreatment solution such as, for example, those described in U.S. Pat. Nos.7,749,368 and 8,673,091. [0182] The substrate may be in any form, such as, without limitation, a sheet, a foil, a laminate foil, a pad, a fabricated part, a component, or an article. Compositions comprising the materials disclosed herein may be used to coat a substrate, such as by depositing, applying or contacting the compositions on a substrate surface. The compositions, when cured, may be used in any form, such as but not limited to, a coating, a sealant, an adhesive, a pottant or an encapsulant, such as a solid, gel or foam, a pad, such as a pad formed in-situ or a discrete pre- manufactured or pre-formed pad. [0183] In examples, the substrate may be a multi-metal article. As used herein, the term “multi-metal article” refers to (1) an article that has a surface comprised of a first metal and a surface comprised of a second metal that is different from the first metal, (2) a first article that has a surface comprised of a first metal and a second article that has a surface comprised of a second metal that is different from the first metal, or (3) both (1) and (2). [0184] The compositions disclosed herein are not limited and may be particularly suitable for use in various industrial or transportation applications including automotive applications, commercial applications, rail locomotive, marine applications and/or aerospace applications. Suitable substrates for use in the present disclosure include those that are used in the assembly of vehicular bodies (for example., without limitation, door, body panel, trunk deck lid, roof panel, hood, roof and/or stringers, rivets, landing gear components, and/or skins used on an aircraft), vehicular frames, vehicular parts, motorcycles, wheels, and industrial structures and components. As used herein, “vehicle” or variations thereof includes, but is not limited to, civilian, commercial,and military aircraft and/or land vehicles such as cars, motorcycles, bicycles, including electric bicycles, and/or trucks. [0185] FIGS.1 to 9 illustrate non-limiting examples of battery assembly components and constructions as well as non-limiting applications or use of compositions as disclosed herein in said battery assemblies. Although FIGS.1 to 9 illustrate specific examples of cell shapes and cell arrangements, cells may be arranged in any configuration known to those skilled in the art. Additionally, the compositions disclosed herein, when cured, may be used to form pads, adhesives, coatings, pottants and the like, to provide thermal protection between battery cells, within battery modules and/or within battery packs. These materials may be used on any surface or in any space within such battery assemblies. For example, compositions disclosed herein also may be useful in battery assemblies including, but not limited to, cell to module (FIGS. 3, 4, 6B), module to pack (FIGS.6C, 7), cell to pack (FIGS. 8), and cell to chassis battery assemblies (FIG. 9). Such battery assemblies may be used in, but not limited to, any aforementioned application. [0186] Battery assemblies may be any combination of one or more battery cells, the interconnects which provide electrical conductivity between them, as well as ancillary components such as, in non-limiting examples, control electronics and components that ensure the necessary structural mechanical and environmental requirements for the operation of a specific battery (for example, without limitation, cell interconnectors such as wires, battery pack enclosures including trays and lids, module enclosures, module frames and frame plates, module racking, cooling and heating components including cooling plates, cooling fins, and cooling tubes, electrical busbars, battery management systems, battery thermal management systems, chargers, inverters and converters). [0187] Battery cells 10 are generally single unit energy storage containers that may be connected in series or in parallel. Battery cells may be any suitable size or shape known to those skilled in the art, such as but not limited to, cylindrical (FIGS.1, 4 and 9), prismatic (FIGS. 2, 5- 8) and/or pouch (FIG. 3). Battery cells 10 are enclosed to provide desired mechanical protection and environmental isolation of the cell. For example, cylindrical and prismatic cells may be encased in metal cans, cases, and lids, while pouch cells may be enclosed in multilayer laminate foils. Battery terminals 1 connect the electrodes inside the battery cell to the electrical circuit outside the battery cell, with one being a positive terminal and the other being a negative terminal. As illustrated in FIG.4, battery cells 10 may be connected by interconnector wires 5 with other battery cells 10 in series or in parallel to enable an electric current to flow between cells 10. [0188] As illustrated in FIGS.3 and 4, battery cells 10 may be arranged in modules 100 comprising multiple cells 10 connected in series or in parallel. The modules 100 may include an at least partial enclosure of the arranged cells 10. Ancillary components, such as those aforementioned, may be included. Spaces of any dimensions may be located between the plurality of cells, ancillary components, base, and/or any interior surface of the module wall or other enclosure 120. [0189] FIG.1 illustrates a top-down view of cylindrical battery cells 10 having terminals 1. As shown, the cells are arranged in rows with either cooling tubes 3 or dielectric insulation paper (e-paper) 4 between them. As shown, materials, such as adhesive 6 and/or pottants 7 optionally formed from the compositions disclosed herein, may be positioned between the cells 10, cooling tubes 3 and/or e-paper 4. [0190] FIG.2 illustrates an exploded isometric view of an array of prismatic battery cells 10. As shown, each prismatic cell 10 may comprise a top 11, a bottom, and walls 13 positioned between the top and bottom and each having a surface. As shown, materials, such as pads 8 formed from the compositions disclosed herein, may be positioned between surfaces of cell walls 13 of adjacent cells 10. [0191] FIG.3 illustrates a cut-out front view of an array of pouch battery cells 10 in a module 100. The module walls 120 at least partially encase the cells 10. As shown, materials, such as pads 8 formed from the compositions disclosed, may be positioned between surfaces of cells 10. [0192] FIG.4 illustrates an isometric view of cylindrical cells 10 in a battery module 100. Each cell may comprise a top 11, a bottom 12, and walls 13 positioned between the top and bottom and each having a surface. The top 11 and the bottom 12 may be oppositely charged terminals with one being a positive terminal 1 and the other being a negative terminal (not shown). The battery cells may be connected at their terminals by interconnectors such as wires 5 and the like to enable an electric current to flow between the electric cells. The module 100 or module walls 120 may form a space having a volume. The cells 10 may be positioned within the space to consume a portion of the volume. The material, such as a pottant 7 formed from the compositions disclosed herein, may be positioned, formed from the coating compositions disclosed herein may be positioned within the space to consume a portion of the volume such that the material is adjacent to a surface of a cell wall 13 and/or an interior surface of at least one of the walls 120 of the module 100. [0193] FIG.5 illustrates an exploded perspective view of a battery module 100 comprised of one or more arrays of battery cells 10, a cooling fin 230, and a cooling plate 240. Materials, such as pads 8 formed from the compositions disclosed herein, may be positioned between cells 10. Additional pads 8 may be positioned between the cells 10, the cooling fin 230, the cooling plate 240, and/or an interior surface of walls 120. Other pads 8 may be positioned adjacent to an exterior surface of the walls 120. [0194] FIG.6 illustrates an isometric view of a battery cell 10 (FIG. 6A) to battery module 100 (FIG. 6B) to battery pack 200 (FIG.6C) battery assembly. The battery module 100 comprises a plurality of battery cells 10 and the battery pack 200 comprises a plurality of battery modules 100. [0195] FIG.7 illustrates a perspective view of a battery pack 200 cutout. The battery pack includes a plurality of battery modules 100 and cells 10 within each module 100. The base of the battery pack 200 comprises a cooling plate 240. Materials, such as adhesives, 9 formed from the compositions disclosed herein, may be positioned between the cooling plate 240 and interior surface of a wall of the battery pack 200. Materials, such as pads 8 formed from the compositions disclosed herein, may be positioned between cells 10 within modules 100. [0196] FIG.8 illustrates an isometric view of a cell 10 to pack battery 200 assembly. Cells 10 are arranged within the pack 200 (without being in separate modules). [0197] In other cases, the battery cells may be arranged on or within an article such as, but not limited to, a cell to chassis battery assembly, as illustrated in FIG. 9, wherein one or more cells is used to construct the battery assembly without prior assembly of the cells into modules and/or packs. FIG.9 illustrates an isometric cut-out view of a cell to chassis battery assembly 300. Cells 10 are arranged on a base comprising the undercarriage 55 and supported by the vehicle frame 45 and under the vehicle interior floor 35. [0198] Any battery assembly may further comprise a thermal management system comprising air or fluid circuits which may be liquid based (for example glycol solutions) or direct refrigerant based. [0199] The substrate may comprise a film formed by one of the compositions disclosed herein on a portion of the surface of the substrate that, when cured, has a lap shear strength of at least 4 MPa at failure, such as at least 8 MPa, such as at least 12 MPa, wherein the lap shear displacement and the lap shear strength are measured according to ASTM D1002-10 using 4130 CRS substrate of 0.063 in. thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0200] The present disclosure is further directed to a part comprising any of the compositions disclosed herein coated on a portion of the surface of the substrate. [0201] The present disclosure is further directed to an article comprising a first substrate, a second substrate, and any of the of the compositions disclosed herein positioned between the first substrate and the second substrate. [0202] Whereas aspects of the disclosure have been described in detail, it will be appreciated by those skilled in the art that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limited as to the scope of the disclosure which is to be given the full breadth of the claims and aspects appended and any and all equivalents thereof. Aspects [0203] 1. A composition comprising: (a) a first component comprising: (i) a thiol-containing compound, an amine-containing compound, or a combination thereof; and (ii) a furan-containing compound; and (b) a second component comprising a maleimide-containing compound. [0204] 2. The composition of aspect 1, wherein the first component and the second component are crosslinked by: (i) a Diels-Alder reaction between the furan-containing compound and the maleimide-containing compound; and (ii) a Michael addition reaction between the maleimide group and the thiol- containing compound, the amine-containing compound, or the combination thereof. [0205] 3. The composition of aspect 1 or aspect 2, wherein the composition comprises a reduction in lap shear strength from >5 MPa at ambient temperature to <0.5 MPa at a temperature greater than 75ºC as determined according to ASTM D1002-10 using an Instron 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0206] 4. The composition of any of the preceding aspects, wherein the thiol- containing compound comprises a thiol equivalent weight of at least 45 g/eq, such as at least 75 g/eq, such as at least 100 g/eq, such as no more than 2,000 g/eq, such as no more than 500 g/eq, such as no more than 250 g/eq. [0207] 5. The composition of aspect 4, wherein the thiol equivalent weight comprises 45 g/eq to 2,000 g/eq, such as 75 g/eq to 500 g/eq, such as 100 g/eq to 250 g/eq. [0208] 6. The composition of any of the preceding aspects, wherein the thiol- containing compound comprises dipentaerythritol hexakis(3-mercaptoprionate), trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptoproprionate), or a combination thereof. [0209] 7. The composition of any of the preceding aspects, wherein the amine- containing compound comprises an amine equivalent weight of at least 17 g/eq, such as at least 25 g/eq, such as at least 40 g/eq and/or no more than 10,000 g/eq, such as no more than 5,000 g/eq, such as no more than 1,000 g/eq. [0210] 8. The composition of aspect 7, wherein the amine equivalent weight comprises 17 g/eq to 10,000 g/eq, such as 25 g/eq to 5,000 g/eq, such as 40 g/eq to 5,000 g/eq, such as 25 g/eq to 1,000 g/eq, such as 40 g/eq to 1,000 g/eq. [0211] 9. The composition of any of the preceding aspects, wherein the amine- containing compound comprises m-xylylenediamine, diethylene glycol bis(3-aminopropyl) ether, ethylene glycol bis(2-aminoethyl) ether, or a combination thereof. [0212] 10. The composition of any of the preceding aspects, wherein the furan- containing compound comprises a furan equivalent weight of at least 65 g/eq, such as at least 150 g/eq, such as at least 250 g/eq, and/or no more than 2,000 g/eq, such as no more than 1,000 g/eq, such as no more than 500 g/eq. [0213] 11. The composition of any of the preceding aspects, wherein the furan- containing compound comprises a furan equivalent weight comprises 65 g/eq to 2,000 g/eq, such as 150 g/eq to 1,000 g/eq, such as 250 g/eq to 500 g/eq. [0214] 12. The composition of any of the preceding aspects, wherein the furan- containing compound comprises a urethane linkage or a urea linkage. [0215] 13. The composition of any of the preceding aspects, wherein the maleimide- containing compound comprises a maleimide equivalent weight of at least 95 g/eq, such as at least 200 g/eq, such as at least 250 g/eq, and/or no more than 5,000 g/eq, such as no more than 2,000 g/eq, such as no more than 1,000 g/eq. [0216] 14. The composition of aspect 13, wherein the maleimide equivalent weight comprises 95 g/eq to 5,000 g/eq, such as 200 g/eq to 2,000 g/eq, such as 250 g/eq to 1,000 g/eq. [0217] 15. The composition of any of the preceding aspects, wherein (a) the thiol- containing compound, the amine-containing compound, or combination thereof and (b) the furan-containing compound may be present in the first component in a molar ratio of at least 50:1, such as at least 10:1, such as at least 3:1, such as 3:8, such no more than 1:50, such as no more than 1:10, such as no more than 1:3, such as no more than 1:1. [0218] 16. The composition of any of the preceding aspects, wherein (a) the thiol- containing compound and/or the amine-containing compound and (b) the furan-containing compound are present in a molar ratio of 50:1 to 1:50, such as 10:1 to 1:10, such as 3:1 to 1:3, such as 3:8 to 1:1. [0219] 17. The composition of any of the preceding aspects, wherein (a) the thiol- containing compound and/or the amine-containing compound and (b) the maleimide-containing compound is present in a molar ratio of at least 1:5, such as at least 1:3, such as at least 2:5 and/or no more than 5:1, such as no more than 3:1, such as no more than 5:2. [0220] 18. The composition of any of the preceding aspects, wherein (a) the thiol- containing compound and/or the amine-containing compound and (b) the maleimide-containing compound are present in a molar ratio of 1:5 to 5:1, such as 1:3 to 3:1, such as 2:5 to 5:2. [0221] 19. The composition of any of the preceding aspects, wherein the first component and the second component are present in a weight ratio of at least 1:25, such as at least 1:20, such as at least 1:10, such as at least 1:5 and/or no more than 25:1, such as no more than 20:1, such as no more than 10:1, such as no more than 5:1. [0222] 20. The composition of any of the preceding aspects, wherein the first component and the second component are present in a weight ratio of 1:25 to 25:1, such as 1:20 to 20:1, such as 1:10 to 10:1, such as 1:5 to 5:1. [0223] 21. The composition of any of the preceding aspects, wherein the first component and the second component are liquid at ambient conditions. [0224] 22. The composition of any of the preceding aspects, wherein the composition is substantially free of solvent. [0225] 23. The composition of any of the preceding aspects, further comprising a filler. [0226] 24. The composition of claim 23, wherein the first component, the second component, and/or the component comprise the filler. [0227] 25. The composition of aspect 23 or aspect 24, wherein the composition comprises the filler in an amount of no more than 90 percent by weight, such as no more than 50 percent by weight, such as no more than 30 percent by weight and/or at least 0.5 percent by weight, such as at least 1 percent by weight, based on total weight of the composition. [0228] 26. The composition of any of aspects 23 to 25, wherein the composition comprises the filler in an amount of 0.5 percent by weight to 50 percent by weight, such as 1 percent by weight to 30 percent by weight. [0229] 27. The composition of any of aspects 23 to 26, wherein the filler comprises a non-thermally conductive filler. [0230] 28. The composition of aspect 27, wherein the non-thermally conductive filler has a thermal conductivity of less than 5 W/m‧K (measured according to ASTM D7984). [0231] 29. The composition of aspect 27 or aspect 28, wherein the non-thermally conductive filler comprises fumed silica, wollastonite, carbon fibers, or combinations thereof. [0232] 30. The composition of any of aspects 23 to 29, wherein the filler comprises a thermally conductive filler. [0233] 31. T3e composition of aspect 30, wherein the thermally conductive filler has a thermal conductivity of least 5 W/m‧K (measured according to ASTM D7984). [0234] 32. The composition of aspect 30 or aspect 31, wherein the thermally conductive filler comprises thermally stable filler particles and/or thermally unstable filler particles. [0235] 33. The composition of any of aspects 23 to 32, wherein the filler comprises an electrically conductive filler. [0236] 34. The composition of aspect 33, wherein the electrically conductive filler comprises a volume resistivity of no more than 1 Ω‧m (measured according to ASTM D257). [0237] 35. The composition of any of aspects 23 to 34, wherein the filler comprises an electrically insulative filler. [0238] 36. The composition of aspect 35, wherein the electrically insulate filler comprises a volume resistivity of at least 1 Ω‧m (measured according to ASTM D257). [0239] 37. The composition of any of the preceding aspects, further comprising an additive. [0240] 38. The composition of aspect 37, wherein the additive comprises a rheology modifier, a tackifier, a thermoplastic polymer, a surface-active agent, a flame retardant, a corrosion inhibitor, a UV stabilizer, a colorant, a tint, a solvent, a plasticizer, an adhesion promoter, an antioxidant, a silane, a moisture scavenger, a thixotrope, a blowing agent and/or a sag control agent. [0241] 39. The composition of aspect 37 or aspect 38, wherein the additive is present in an amount of at least 0.01 percent by weight based on total weight of the composition, such as at least 0.1 percent by weight, such as at least 0.25 percent by weight and/or no more than 20 percent by weight, such as no more than 15 percent by weight, such as no more than 10 percent by weight. [0242] 40. The composition of any of aspects 37 to 39, wherein the additive is present in an amount of 0.01 percent by weight to 20 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 15 percent by weight, such as 0.25 percent by weight to 10 percent by weight. [0243] 41. The composition of any of the preceding aspects, further comprising elastomeric particles. [0244] 42. The composition of aspect 41, wherein the elastomeric particles comprise a core-shell structure. [0245] 43. The composition of aspect 42, wherein the core-shell structure comprises an acrylic shell and an elastomeric core. [0246] 44. The composition of any of the preceding aspects, wherein the composition further comprises an epoxy-containing compound and/or an acrylate-functional compound. [0247] 45. The composition of aspect 44, wherein first component and/or the second component and/or a third component comprise the epoxy-containing compound and/or the acrylate-functional compound. [0248] 46. The composition of aspect 44 or aspect 45, wherein the epoxy-containing compound comprises an epoxy equivalent weight of at least 90 g/eq, such as at least 140 g/eq, such as at least 188 g/eq, and such as no more than 2,000 g/eq, such as no more than 1,000 g/eq, such as no more than 500 g/eq, such as 90 g/eq to 2,000 g/eq, such as 140 g/eq to 1,000 g/eq, such as 188 g/eq to 500 g/eq. [0249] 47. The composition of any of aspects 44 to 46, wherein the composition comprises (a) the thiol-containing compound and/or the amine-containing compound and (b) the epoxy compound in a molar ratio of at least 50:1, such as at least 25:1, such as no more than 2:1, such as no more than 1.3:1, such as 50:1 to 2:1, such as 25:1 to 1.3:1. [0250] 48. The composition of any of aspects 44 to 47, wherein the composition comprises (a) the thiol-containing compound and/or the amine-containing compound and (b) the acrylate-functional compound in a molar ratio of at least 50:1, such as at least 25:1, such as no more than 2:1, such as no more than 1.3:1, such as 50:1 to 2:1, such as 25:1 to 1.3:1. [0251] 49. The composition of any of the preceding aspects, wherein the composition is formulated as a coating composition, an adhesive composition, a sealant, an encapsulated composition, a pottant, a foam, or a pad. [0252] 50. The composition of any of the preceding aspects, further comprising an accelerator. [0253] 51. The composition of aspect 50 wherein the accelerator is present in an amount of no more than 25 percent by weight based on total weight of the composition, such as no more than 10 percent by weight, such as no more than 5 percent by weight and/or at least 0.01 percent by weight, such as at least 0.1 percent by weight, such as at least 0.5 percent by weight. [0254] 52. The composition of aspect 50 or aspect 51, wherein the accelerator is present in an amount of 0.01 percent by weight to 25 percent by weight based on total weight of the composition, such as 0.1 percent by weight to 10 percent by weight, such as 0.5 percent by weight to 5 percent by weight. [0255] 53. The composition of any of the preceding aspects, wherein the composition is formulated as a two-component composition. [0256] 54. The composition of any of the preceding aspects, wherein the composition comprises a reflow onset temperature of 50ºC to 250ºC, as measured by Dynamic Mechanical Analysis (DMA). [0257] 55. A film comprising the composition of any of the preceding aspects. [0258] 56. A hot melt comprising the composition of any of aspects 1 to 54. [0259] 57. A substrate comprising a surface, a portion of which is coated with or embedded in the composition of any of aspects 1 to 54. [0260] 58. The substrate of aspect 57, positioned between a second substrate and a third substrate. [0261] 59. The substrate of aspect 57 or aspect 58, wherein the substrate comprises a vehicle, a part, an article, an appliance, a personal electronic device, a circuit board, a battery cell, a battery component, a multi-metal article, or combinations thereof. [0262] 60. The substrate of aspect 59, wherein the vehicle comprises an automobile or an aircraft. [0263] 61. A part comprising a surface, a portion of which is coated with the composition of any of aspects 1 to 54. [0264] 62. An article comprising: a first substrate; a second substrate; and the composition of any of aspects 1 to 54 positioned therebetween. [0265] 63. The film of aspect 55, the hot melt of aspect 56, the substrate of any of aspects 57 to 60, the part of aspect 61 and/or the article of aspect 62, wherein the composition comprises a lap shear strength of at least 4 MPa at failure, wherein the lap shear strength is measured according to ASTM D1002-10 using 4130 CRS substrate of 0.063 inch thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0266] 64. A method for forming a coating on a surface of a substrate comprising: applying the composition of any of aspects 1 to 54 to the surface of the substrate. [0267] 65. A method for forming a film comprising: casting the film comprising the composition of any of aspects 1 to 54. [0268] 66. A method of forming a bond between two substrates comprising: applying the composition of any of aspects 1 to 54 to a first substrate; and contacting a second substrate to the coating composition such that the coating composition is located between the first substrate and the second substrate. [0269] 67. The method of aspect 66, wherein a joint between the first substrate and the second substrate is at least partially broken prior to the contacting and wherein the contacting forms a repair joint. [0270] 68. A method of forming an article comprising extruding or molding the composition of any of aspects 1 to 54. [0271] 69. The method of aspect 68, wherein the extruding comprises three- dimensional printing. [0272] 70. The article formed by the method of aspect 68 or aspect 69. [0273] 71. A use of the composition of any of aspects 1 to 54 for repairing a joint between a first substrate and a second substrate. [0274] 72. A use of the composition of any of aspects 1 to 54 for providing an adhesive bond having a lap shear strength of at least 4 MPa at failure, wherein the lap shear displacement and the lap shear strength are measured according to ASTM D1002-10 using 4130 CRS substrate of 0.063 in. thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0275] 73. A use of a coating formed from the composition of any of aspects 1 to 54 to provide a coating comprising a lap shear strength of at least 4 MPa at failure, wherein the lap shear displacement and the lap shear strength are measured according to ASTM D1002-10 using 4130 CRS substrate of 0.063 in. thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0276] 74. A battery, comprising a battery cell and the composition of any of aspects 1 to 54 in a cured state. [0277] 75. The battery of aspect 74, wherein the battery cell and the composition are housed in a module. [0278] 76. The battery of aspect 74, wherein the battery and the composition are housed in a pack. [0279] 77. The battery of aspect 74, wherein the module is housed in a pack. [0280] 78. The battery of aspect 74, wherein the battery and the composition are adjacent to a vehicle chassis. [0281] 79. The battery of any of aspects 74 to 78, further comprising a battery component. [0282] 80. The battery of any of aspects 74 to 79, wherein the composition comprises a lap shear strength of at least 4 MPa at failure, wherein the composition comprises a lap shear strength of at least 4 MPa at failure, wherein the lap shear displacement and the lap shear strength are measured according to ASTM D1002-10 using 4130 CRS substrate of 0.063 in. thickness, as measured by an INSTRON 5567 machine in tensile mode with a pull rate of 1.3 mm per minute. [0283] 81. The battery of any of aspects 74 to 80, wherein the composition comprises a pottant, a pad, a foam, a coating, or combinations thereof. [0284] 82. A 3D-printed structural article comprising the composition of any of aspects 1 to 54. [0285] Illustrating the disclosed subject matter are the following examples that are not to be considered as limiting the disclosure to their details. All parts and percentages in the examples, as well as throughout the specification, are by weight unless otherwise indicated. Examples [0286] All quantities in the following tables, unless otherwise noted, are measured in terms of weight in grams. Example 1 [0287] A furan-functional polyurethane prepolymer was prepared using the components in Table 1 below in the amounts indicated. Furfuryl alcohol was charged to an appropriately sized flask and blanketed with nitrogen to avoid interaction with moisture. Dibutyltin dilaurate was added as a catalyst and this mixture was heated to 60°C. Desmodur N3600 was then added at a rate such that the temperature did not exceed 80°C. After all of the isocyanate had been added, the reaction was held at 60°C for half an hour, and measured to confirm all isocyanate had been consumed. The reaction product was then poured into an appropriately sized container. [0288] Compositions II and III in Tables 2 and 3 below were prepared by blending the components listed in their indicated amounts in a DAC cup and mixing for 4 minutes at 2350 RPM using a FlackTek SpeedMixer®. It should be noted that Composition I required heating to ~90°C (hold time dependent upon scale) to reflow before mixing to form Composition II. [0289] Composition III was then formed by blending the components in Table 3 in a DAC cup at the ratios described and mixed for 2 minutes at 2350 RPM using a SpeedMixer®. Specimens of Composition III were then prepared and tested as described prior to Table 4. [0290] Lap shear specimens were prepared according to ASTM D1002-10 using 0.063” 4130 CRS ordered from Grainger. The panels were cleaned of all oils and treated with Zircobond 4200. [0291] Samples of Elvamide 8061 were prepared by pressing the samples into a slightly greater than 10 mil film thickness using a heated Carver Press at approximately 175°C and sprinkling 10 mil spacer beads into the molten film. The film was allowed to cool overnight to room temperature, then cut into 1” x ½” pieces. These pieces were then sandwiched between two of the zirconium treated pieces of steel in the desired overlap dimensions and held together using small binder clips to form a bonded dimension of 1” x ½”. These samples were then placed to bake in an oven at 175°C for one hour. [0292] Samples of the Sikaflex 255FC were prepared in accordance with manufacturer’s instructions. The adhesive was extruded from the container directly onto the zirconium treated steel, 10 mil spacer beads were sprinkled onto the adhesive, and the two pieces were sandwiched together at the desired overlap and held together using small binder clips. Excess adhesive was removed from the joint using a metal spatula. These samples were allowed to cure at ambient conditions for at least 7 days. [0293] Samples of Composition III were prepared by mixing the components in the manner and amounts as described in Table 3 above and applied using a metal spatula onto the zirconium treated steel. These specimens were then sandwiched together at the desired overlap and held together using small binder clips. Excess adhesive was removed from the joint using a metal spatula. These specimens were then allowed to cure at 70°C for approximately 12 hours. [0294] Each of the baked lap joint specimens were tested using an INSTRON 5567 Machine in tensile mode with 25.4 mm of substrate in each grip and at a pull rate of 1.3 mm/minute in accordance with ASTM D1002-10. [0295] The lapshear test results of all these specimens can be found in Table 4 below. A graphical representation of the data can be seen in FIG. 10. [0296] The results in Table 4 demonstrate that the composition according to the present disclosure has a very high lap shear strength at room temperature but a negligible lap shear strength at 150ºC compared to the comparative compositions. These data indicate that less force is required for disassembly when a composition according to the present disclosure is utilized compared to compositions known in the art. Example 2 [0297] Compositions IV – VI in Tables 5 below were prepared by blending the components listed in their indicated amounts in a DAC cup and mixing for 4 minutes at 2350 RPM using a SpeedMixer®. [0298] Compositions IV – VI in Tables 5 above were then taken and blended with the components prescribed in Table 6 below for 2 minutes at 2350 RPM using a SpeedMixer®. Test specimens were then prepared on 0.032” thick CRS from ACT, which were treated with Zircobond 4200 as described in the earlier example. Test specimens were prepared in three different manners: 2K, Film, and 2K repaired. [0299] The 2K specimen was prepared by mixing the components in the manner and amounts listed in Table 5, above, and applying to a piece of the zirconium treated steel. The two pieces were sandwiched together at the desired overlap and held together using small binder clips. The specimens were then allowed to cure at 70°C for approximately 12 hours. [0300] The Film specimens were prepared by mixing the components in the manner and amounts listed in Table 5, above, and casting a film of the material at a thickness of slightly >10 mil and allowing to cure at ambient temperature for 1 week. The cured films were then cut into 1” x ½” dimensions, sandwiched between two pieces of the zirconium treated steel and held together using small binder clips. The specimens were then baked at 150°C for 1 hour. [0301] The 2K repaired specimens were prepared by taking the tested specimens from the 2K application method and clipping them back together into their desired dimensions using small binder clips. These specimens were then baked at 150°C for 1 hour. [0302] The lapshear test results of all these specimens can be found in Table 6 below. A graphical representation of the data can be seen in FIG. 11. [0303] The results shown in Table 6 demonstrate that the composition of the present disclosure may be used as a two-component system, a film adhesive, or a repaired joint. An increase in the functionality of the thiol-containing compound increases lap shear strength. Example 3 [0304] Samples of Composition X were prepared for lap shear testing and dynamic mechanical analysis (DMA). Lap shear specimens were prepared on 0.032” thick CRS from ACT, which were treated with Zircobond 4200 as described in the earlier examples. DMA samples were prepared by drawing down material at a thickness of 0.45 mm. DMA was used to determine storage modulus, as shown in FIG.12. Material was cured under ambient conditions for 1 week before cutting 4.5 mm x 25 mm strips from the cured film. Samples were tested using a TA Instruments RS3 dynamic mechanical analyzer in tension mode with a gap of 15 mm at a frequency of 1.0 Hz and a temperature ramp rate of 3°C/min from -55 to 130°C. [0305] The results shown in FIG.12 show the dynamic mechanical analysis, which demonstrates the reflow onset temperature of the composition as indicated by the temperature at which the storage modulus drops below 1,000,000 Pa. [0306] Samples of Compositions XI-XIV were prepared for lapshear and thermal conductivity measurements. Compositions XI-XIV in Table 8, below, were prepared by blending all components except Composition II for 4 minutes at 2350 RPM using a SpeedMixer®. The specified amount of Composition II was then added to each Compositions XI-XIV and mixed for 2 minutes at 2350 RPM. Test specimens were then prepared on 0.032” thick CRS from ACT, which were treated with Zircobond 4200 as described in the earlier examples. Materials were cured at 70°C for approximately 12 hours, then tested using the lap shear method described in prior examples. Thermal conductivity samples were prepared by casting discs on the material in an aluminum weighing dish of approximate dimensions: 2” diameter by ¼” thickness. Thermal conductivity was measured using a C-Therm instrument with a TCi™ Thermal Conductivity Analyzer based on the modified transient plane source (MTPS) technique and calibrated with a ceramic reference standard. Calibration and testing were performed using water as the sensor contact agent and a 500 g weight placed on top of the sample. [0307] The data in Table 8 demonstrates that increasing concentrations of boron nitride, a thermally conductive filler, give compositions with high lap shear strength and high thermal conductivity.

Claims

We claim: 1. A composition comprising: (a) a first component comprising: (i) a thiol-containing compound, an amine-containing compound, or a combination thereof; and (ii) a furan-containing compound; and (b) a second component comprising a maleimide-containing compound.

2. The composition of claim 1, wherein the thiol-containing compound comprises a thiol- equivalent weight of 46 g/eq to 2,000 g/eq.

3. The composition of claim 1 or claim 2, wherein the amine-containing compound comprises an amine equivalent weight comprises 17 g/eq to 10,000 g/eq.

4. The composition of any of the preceding claims, wherein the furan-containing compound comprises a furan equivalent weight comprises 65 g/eq to 2,000 g/eq.

5. The composition of any of the preceding claims, wherein the furan-containing compound comprises a urethane linkage or a urea linkage.

6. The composition of any of the preceding claims, wherein the maleimide-containing compound comprises a maleimide equivalent weight of 95 g/eq to 5,000 g/eq.

7. The composition of any of the preceding claims, wherein (a) the thiol-containing compound and/or the amine-containing compound and (b)the furan-containing compound are present in a molar ratio of 50:1 to 1:50.

8. The composition of any of the preceding claims, wherein (a) the thiol-containing compound and/or the amine-containing compound and (b) the maleimide-containing compound are present in a molar ratio of 1:5 to 5:1.

9. The composition of any of the preceding claims, wherein the composition comprises the first component and the second component in a weight ratio of 1:25 to 25:1.

10. The composition of any of the preceding claims, further comprising a filler, elastomeric particles, and/or an accelerator.

11. The composition of claim 10, comprising: the filler in an amount of 0.5 percent by weight to 50 percent by weight based on total weight of the composition; the elastomeric particles in an amount of 0.1 percent by weight to 50 percent by weight based on total weight of the composition; and/or the accelerator in an amount of 0.01 percent by weight to 25 percent by weight based on total weight of the composition.

12. The composition of any of the preceding claims, wherein the composition further comprises an epoxy-containing compound and/or an acrylate-functional compound.

13. The composition of any of the preceding claims, formulated as an adhesive composition, a sealant composition, an encapsulant composition, a pottant composition, a foam composition, and/or a pad.

14. The composition of any of the preceding claims, wherein the composition is substantially free of solvent.

15. A substrate comprising a surface coated with or embedded in the composition of any of the preceding claims.

16. A coating formed from the composition of any of claims 1 to 14.

17. The coating of claim 16, wherein the coating comprises a reflow onset temperature of 50ºC to 250ºC, as measured by Dynamic Mechanical Analysis (DMA).

18. A method for forming a coating on a surface of a substrate comprising: mixing the first component and the second component of any of claims 1 to 14 to form the composition; and applying the composition to the surface of the substrate.

19. A method for forming a film comprising: mixing the first component and the second component of any of claims 1 to 14 to form the composition; and casting the film.

20. A 3D-printed structural article comprising the composition of any of claims 1 to 14.