EP4630198A1

EP4630198A1 - Systems and methods to detect rotation of a vibratory polisher

Info

Publication number: EP4630198A1
Application number: EP23840847.0A
Authority: EP
Inventors: Douglas A. Ceckowski; Timothy P. WEBER; Heber I. CASTANON
Original assignee: Illinois Tool Works Inc
Current assignee: Illinois Tool Works Inc
Priority date: 2022-12-07
Filing date: 2023-12-06
Publication date: 2025-10-15
Also published as: US20240189958A1; WO2024123863A1; JP2025539511A; CN120659692A

Abstract

Example systems and methods for detecting movement of a sample subject to a polishing operation in a vibratory polisher. The system includes a sample holder to secure the sample to be polished. A housing supports a platen upon which the sample holder is placed. The platen allows for movement of the sample holder during a polishing operation as the sample holder traverses a polishing fluid distributed about the platen. One or more sensors are arranged about the housing, operable to monitor movement of the sample holder on the platen relative to the housing.

Description

SYSTEMS AND METHODS TO DETECT ROTATION OF A VIBRATORY POLISHER

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a Non-Provisional Patent Application of U.S. Provisional Patent Application No. 63/430,722 entitled “Systems And Methods To Detect Rotation Of A Vibratory Polisher” filed December 7, 2022, which is herein incorporated by reference in its entirety.

BACKGROUND

[0002] Grinding and polishing operations are performed on specimens for numerous purposes and across a vast array of sectors and industries. In some applications, surface preparation of a specimen by grinding/poli shing operations are performed by grinding/polishing devices. For instance, a specimen can be contained in a sample holder, and be polished by traveling through a polishing fluid. An amount of polishing on the specimen is determined on an amount of time the sample holder is being polished. However, timing is an often unreliable proxy for an amount of polishing on the specimen. Thus, a more reliable measure of an amount of polishing on the specimen is desirable.

SUMMARY

[0003] Systems and methods are disclosed of a system to detect rotation of a sample being polished in a vibratory polisher, substantially as illustrated by and described in connection with at least one of the figures, as set forth more completely in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] FIG. 1 illustrates an example system for polishing a specimen in a sample holder, in accordance with aspects of this disclosure.

[0005] FIG. 2 illustrates a top view of the example system of FIG. 1. [0006] FIG. 3 provides an example method for detecting rotation of a sample being polished in a vibratory polisher, in accordance with aspects of this disclosure.

[0007] The figures are not necessarily to scale. Wherever appropriate, similar or identical reference numerals are used to refer to similar or identical components.

DETAILED DESCRIPTION

[0008] Disclosed are systems and methods to detect movement of a sample subject to a polishing operation in a vibratory polisher. In particular, the system includes a sample holder to secure the sample to be polished. A housing supports a platen upon which the sample holder is placed. The platen allows for movement of the sample holder during a polishing operation as the sample holder traverses a polishing fluid distributed about the platen. One or more sensors are arranged about the housing, operable to monitor movement of the sample holder on the platen relative to the housing.

[0009] The disclosed polishing systems and methods employ a polishing system to perform a polishing operation on one or more samples. The polishing system may be a vibratory polishing system that includes a platen on which a sample, a set of samples, and/or a sample holder (e.g., a puck) are placed. During a polishing operation, the platen holds a polishing fluid and serves as a polishing surface upon which the samples move.

[0010] For example, a vibratory device, such as a vibrating bowl, supports or is otherwise connected to the platen, causing the samples to traverse the polishing fluid (e.g., an abrasive fluid) on the vibrating polishing surface. The samples tend to rotate about an inner circumference of the platen (enclosed by one or more bumpers), thereby polishing the samples.

[0011] Conventionally, a timer would provide a duration of time the sample is on the polishing surface, with the amount of polishing performed on the sample correlating to an experimentally correlated amount of time. However, the timer does not take the speed of movement into account, resulting in an imprecise determination of the amount of polishing on the sample.

[0012] In disclosed examples, one or more sensors are arranged within, about, and/or in communication with the polishing system, such that movement, speed, and/or position of the samples is monitored during a polishing operation. In other words, the number of rotations is used as a proxy for an amount of polishing performed on the sample. As a result, the amount of polishing on a sample is more closely correlated to movement of the sample, and therefore action of the polishing

[0013] In some examples, the sensors are in electrical communication with a control system operable to monitor location and/or relative movement of the sensors. Specifically, the system is operable to track the number of rotations and/or the periodic rate of rotation of the sample(s) as they travel within the polishing system (e.g., around a circular path, counted in rotations per unit time, such as rotations per minute (RPM)). In this manner, sensor data provides an accurate way of calculating and/or otherwise determining a distance travelled of the samples along the polishing surface over a given amount time. Accordingly, the disclosed systems and methods can determine a total (e.g., rotational) distanced travelled, rate of travel, and/or number of full rotations about the platen during a polishing operation by employing sensors and/or a timer to indicate an end cycle notification.

[0014] In the disclosed systems and methods, the one or more sensor(s) to detect the sample holder can be arranged at predetermined fixed locations around the travel surface. These sensors could be integrated into the bowl surrounding the vibrating circular polishing surface, along a border of the polishing surface, and/or external to the housing, as a list of non-limiting examples. The sensors would detect the movement of the sample holder pucks as they circulate. [0015] In some examples, one or more of the sensors can be specially designed to collect data corresponding to a particular sample, sample holder, and/or application. For instance, one or more of the sensors can be mounted differently from another sensor, such as in a different horizontal and/or vertical orientation to monitor specific data. This unique orientation allows a given sensor to identify pucks of special interest, such as the lead or trailing puck, and/or other interesting aspects of multiple sample holders (e.g., size, speed relative to another sample holder, physical characteristic of the sample or sample holder, etc.). Using the sensor data, the computer or controller will algorithmically determine various aspects of the sample holders as they travel, and in real-time adjust the frequency and/or amplitude (e.g., power to control the vibratory rate, and therefore movement of the samples) while providing cycle progress notifications to the operator. [0016] Advantages of the disclosed systems and methods include, but are not limited to, providing a dynamic determination as to the completion of a polishing operation based on distance travelled and/or rate. Also, monitoring actual movement about the polishing surface (rather than time alone) provides a more predictable and/or repeatable polishing operation for a given sample and/or system, by employing travel distance monitoring.

[0017] In some examples, detection of travel rate/speed changes offer can provide other enhancements to the operator and/or polishing operation. As a list of non-limiting examples, determination of the movement of the samples can be used to determine a low polishing liquid level (and provide a corresponding notification); automatic polishing rate optimization of power and frequency (e.g., to control system vibration and sample speed); and/or identify sample holder performance issues.

[0018] In disclosed examples, a system to perform a polishing operation on a sample includes a sample holder to secure a sample to be polished; a housing to support a platen, the platen operable to allow movement of the sample holder during a polishing operation; and one or more sensors to monitor movement of the sample holder relative to the housing.

[0019] In some examples, a controller operable to receive data from the one or more sensors. In examples, the controller counts a number of rotations of the sample holder relative to the housing; and determines an amount of polishing of the sample based on the number of rotations. In examples, the controller determines a distance the sample has traveled based on the number of rotations. In examples, the controller controls one or more operational parameters of the system based on the number of rotations.

[0020] In some examples, the one or more operational parameters is rotational speed of the sample.

[0021] In some examples, an actuator is included to control movement of the sample holder. In examples, the controller is operable to control the actuator to adjust the rotational speed of the sample holder based on the measurements from the one or more sensors. In some examples, a bowl is connected to the actuator, the actuator to cause vibration of the bowl to move the sample holder. [0022] In some examples, the one or more sensors comprises a magnetic sensor, a Hall effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

[0023] In some examples, the one or more sensors are arranged in a fixed position relative to the housing or the platen, each of the one or more sensors operable to detect movement of the sample holder as they move about the platen.

[0024] In some examples, a user interface is mounted on the housing, the user interface to provide information or instructions to an operator, or receive commands from the operator.

[0025] In some examples, the one or more sensors are arranged within the system, including one or more of the housing, a cover, or the platen. [0026] In some disclosed examples, a system to perform a polishing operation on a sample includes a sample holder to secure a sample to be polished; a bowl to vibrate the sample holder; and one or more sensors to monitor movement of the sample holders relative to the bowl.

[0027] In some examples, an actuator to control a rate of vibration of the bowl and thereby a rate of movement of the sample holder.

[0028] In some examples, a controller is operable to receive data from the one or more sensors; count a number of rotations of the sample holder relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

[0029] In examples, the controller compares the number of rotations of the sample holder to a list of rotations corresponding to amounts of polishing; and determines an amount of polishing of the sample based on the number of rotations.

[0030] In some examples, the sample holder includes a sensor tag operable to be read by the one or more sensors. In some examples, the sample holder includes a material operable to trigger the one or more sensors. In examples, the material is a ferrous metal.

[0031] In some disclosed examples, a system to perform a polishing operation on a sample includes a sample to be polished; a housing to support a platen, the platen operable to allow movement of the sample during a polishing operation; and one or more sensors to monitor movement of the sample relative to the housing.

[0032] In some examples, a controller operable to receive data from the one or more sensors; count a number of rotations of the sample relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

[0033] In some examples, a controller operable to receive data from the one or more sensors; and determine one or more characteristics of the sample based on the data. [0034] In some examples, the one or more characteristics include a type of sample, a color of the sample, a temperature of the sample, a consistency of the sample, or a material characteristic of the sample.

[0035] As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” The embodiments described herein are not limiting, but rather are exemplary only. It should be understood that the described embodiments are not necessarily to be construed as preferred or advantageous over other embodiments. Moreover, the term “embodiments” does not require that all disclosed embodiments include the discussed feature, advantage, or mode of operation.

[0036] As utilized herein, “and/or” means any one or more of the items in the list joined by “and/or”. As an example, “x and/or y” means any element of the three-element set {(x), (y), (x, y)} . In other words, “x and/or y” means “one or both of x and y”. As another example, “x, y, and/or z” means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, “x, y and/or z” means “one or more of x, y and z”. As utilized herein, the term “exemplary” means serving as a non-limiting example, instance, or illustration. As utilized herein, the terms “e.g.” and “for example” set off lists of one or more non-limiting examples, instances, or illustrations.

[0037] For the purpose of promoting an understanding of the principles of the claimed technology and presenting its currently understood, best mode of operation, reference will be now made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the claimed technology is thereby intended, with such alterations and further modifications in the illustrated device and such further applications of the principles of the claimed technology as illustrated therein being contemplated as would typically occur to one skilled in the art to which the claimed technology relates.

[0038] FIG. 1 shows an example polishing system 100 includes a sample holder 104 to support a sample 101 to be subject to a treatment operation, such as polishing and/or grinding. A housing 106 can receive the sample holder 104 and/or the sample 101 itself, and is operable to move the sample holder 104. In some examples, a motor or other actuator 108 (e.g., an electromechanical magnetic actuator, a solenoid, etc.) is arranged in the housing 106 and operable to vibrate, rotate, and/or otherwise cause rotational movement of the sample 101 and/or sample holder 104. In some examples, the sample holder 104 is mounted onto or otherwise secured by a bowl 103, configured to rotate, vibrate, or otherwise move the sample holder 104.

[0039] In an example, during a polishing operation one or more sensors 110 are arranged about the sample holder 104. In some examples, the sensors 110 communicate with a controller or control circuitry 114 via a sensor connection 120. For instance, the sensors 110 is triggered each time a sample holder 104 travels past the sensor 110. This trigger generates a response, such as a signal, which can be transmitted through the sensor connection 120. Each such signal is received at a controller 114 to increment a counter value, which can be used to determine an amount of polishing of the sample.

[0040] In some examples, an interface 112 provides a connection between the sensors 110 and the controller 114, which may be located within the housing 106. For instance, the interface 112 may be one or more of a contact and/or non-contact interface, which may include a physical connection (e.g., conduit, traces, circuit elements, etc.) and/or an electrical connection (e.g., a wireless transceiver, an inductive switch, etc.). The interface 112 allows signals containing data (corresponding to sensor measurements) to be transferred to the controller 114 for analysis. A user interface 116 may be mounted on the housing 106, providing information and/or instruction to the operator, as well as operable to receive commands.

[0041] In some examples, the controller 114 is operable to control one or more parameters of the polishing operation in response to the movement data. For example, the controller 114 can increase and/or decrease a speed of the sample holders 104 about the platen 102 (e.g., by controlling the actuator 108). This can include stopping movement altogether.

[0042] The controller 114 is further operable to cause the user interface 116 to display information regarding a duration, number of rotations, and/or an estimate of polishing progress during the polishing operation. In some examples, the controller 114 is connected to a remote device (e.g., a tablet, a smartphone, a network, remote computer, etc.), and information can be transmitted (via wires or wirelessly) to such a device.

[0043] FIG. 2 illustrates a top view of the example system of FIG. 1. As shown, the sensors 110 are arranged around a circumference of the platen 102, such that rotational movement of the sample holders 104 (according to arrow 105) causes the sample holders 104 to traverse the platen 102 (e.g., in direction 107) by contact with a support, wall, or border 109 about the platen 102.

[0044] The sensors 110 can be electrical sensors, contact sensors, and/or non-contact sensors (e.g., a magnetic sensor, a Hall Effect sensor, an optical sensor, an inductive sensor, a mechanical sensor, an imaging device, etc.) and can be integrated within the border 109 and/or other locations about the housing 106. In some examples, the border 109 serves as a support surrounding the vibrating polishing surface of the platen 102 to direct movement of the sample holder.

[0045] In some examples, one or more sensors 110A could be mounted within the housing 106, such as below the platen 102. Advantageously, sensors within the housing 106 would be connected to the controller 114 without the use of external sensors or cables. Thus, the sensors and/or cabling would not exposed to the polishing environment (such as to chemicals), and may not be in contact with any moving, vibrating and/or rotating parts.

[0046] In some examples, multiple sensors, including multiple types of sensors, can be arranged in the system 100. For instance, a sensor 110 may be a sensor of a first type, whereas sensor 110A may be a second, different type. As shown in FIG. 2A, another sensor 110B may be arranged in a cover 122.

[0047] These sensors would be in electrical communication (e.g., via wires and/or wirelessly) to transfer sensor data to controller 114. In some examples, the sensors 110 would themselves have wires, traces, conduits and/or other communication interfaces connecting directly with the controller 114, whereas in other examples the sensors 110 would channel signals to the controller 114 via the connector 120. In examples, one or more of the sensors, connectors, traces, wires, trace, conductors, etc., are not be exposed and therefore unseen by an operator. In some examples, the sensors and/or associated connections are shielded from environmental contaminants by a cover, surface treatment, the housing, etc., thereby ensuring the sensors and connections are not subject to corrosive chemicals.

[0048] In some examples, the imaging device can be employed to capture images of the sample holders during a polishing operation. Such images may capture multiple parameters of sample holder, such as color, size, shape, temperature, as well capture indications corresponding to information of the sample or sample holder, such as a bar code, a quick release code, text, images, etc. The image and/or information drawn from the image can be transmitted to the controller 114 to determine one or more characteristics of the sample or sample holder, including speed, type of sample or sample holder, as a list of non-limiting examples. [0049] In some examples, the platen 102, border 109, bowl 103, and/or sensors 110 themselves are configured to be removed from the housing 106. In such an example, an electrical connector may be arranged on one or more of the above-mentioned components, such that connection can be made between the sensors 110 and the controller 114 (e.g., via connector 120).

[0050] In some examples, the sample holders 104 (or pucks) may include one or more features and/or characteristics to facilitate sensor operation and measurement. For example, the features/characteristics include one or more of an optical target, metallic composition, height of the sample holder, shaped feature, radio frequency tag (e.g., RFID), as a list of non-limiting examples. In particular, the features/characteristics may trigger a response (e.g., transmit a signal, increment a counter, etc.) as the sample holder passes a corresponding sensor.

[0051] Although three sensors 110 are illustrated in some examples, a single sensor may be used, as well as four or more sensors to suit any particular application.

[0052] FIG. 3 shows a flowchart representative of example instructions 300, which may be executed by an operator and/or controller/control circuitry 114 of FIG. 1 for detecting rotation of a sample being polished in a vibratory polisher, as disclosed herein. In block 302, a sample is placed in a sample holder. In block 304, the sample holder is placed on a platen, which may be coated with a polishing fluid. In block 306, the vibratory polisher is activated, causing the sample holder to move across the platen. In block 308, one or more sensors monitor movement of the sample holder relative to a housing of the vibratory polisher.

[0053] In block 3010, movement information from the sensors is transmitted to and received at control circuitry. In block 312, the control circuitry counts a number of rotations and/or frequency of the sensor moving past a sensor, based on the received movement information. In block 314, the control circuitry determines (e.g., calculates) one or more parameters associated with the sample holder movement based on the number of rotations. For example, the parameters can include one or more of an amount of distance travelled, a speed of travel, or a number of rotations around the platen, as a list of non-limiting examples.

[0054] In block 316, the control circuitry compares the determined or calculated parameter associated with the sample holder to a list of parameters corresponding to amounts of polishing. The list may be stored in a memory in the system 100 (e.g., with the control circuitry), and/or in a remote device. In block 318, the amount of polishing is determined based on the comparison. In some examples, the control circuitry can calculate the amount of polishing based on an equation and relevant variables without requiring access to a list. In block 320, the amount of polishing is transmitted, displayed, and/or otherwise made available to an operator or other system.

[0055] In some additional or alternative examples, the control circuitry is operable to control the motor to adjust the rotational speed of the sample holder based on the determined or calculated parameters to adjust the amount or rate of polishing in block 322.

[0056] The present methods and systems may be realized in hardware, software, and/or a combination of hardware and software. Example implementations include an application specific integrated circuit and/or a programmable control circuit.

[0057] The foregoing description and accompanying figures illustrate the principles, preferred embodiments, and modes of operation. However, the disclosure should not be construed as being limited to the particular embodiments discussed above. Additional variations of the embodiments discussed above will be appreciated by those skilled in the art.

[0058] While the present method and/or system has been described with reference to certain implementations, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the present method and/or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from its scope. For example, block and/or components of disclosed examples may be combined, divided, re-arranged, and/or otherwise modified. Therefore, the present method and/or system are not limited to the particular implementations disclosed. Instead, the present method and/or system will include all implementations falling within the scope of the appended claims, both literally and under the doctrine of equivalents. While the controllers and methods are described as being employed in connection with a grinding/poli shing and/or hardness/density testing systems, the teachings may be similarly applied to other systems and operations.

[0059] All documents cited herein, including journal articles or abstracts, published or corresponding U.S. or foreign patent applications, issued or foreign patents, or any other documents are each entirely incorporated by reference herein, including all data, tables, figures, and text presented in the cited documents.

Claims

CLAIMS What is claimed is:

1. A system to perform a polishing operation on a sample, comprising: a sample holder to secure a sample to be polished; a housing to support a platen, the platen operable to allow movement of the sample holder during a polishing operation; and one or more sensors to monitor movement of the sample holder relative to the housing.

2. The system of claim 1, further comprising a controller operable to receive data from the one or more sensors.

3. The system of claim 2, wherein the controller is further operable to: count a number of rotations of the sample holder relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

4. The system of claim 2, wherein the controller is further configured to control one or more operational parameters of the system based on the number of rotations.

5. The system of claim 4, wherein the one or more operational parameters is rotational speed of the sample.

6. The system of claim 2, further comprising an actuator to control movement of the sample holder.

7. The system of claim 6, wherein the controller is operable to control the actuator to adjust the rotational speed of the sample holder based on the measurements from the one or more sensors.

8. The system of claim 6, further comprising a bowl connected to the actuator, the actuator to cause vibration of the bowl to move the sample holder.

9. The system of claim 1, wherein the one or more sensors comprises a magnetic sensor, a Hall effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

10. The system of claim 1, wherein the one or more sensors are arranged in a fixed position relative to the housing or the platen, each of the one or more sensors operable to detect movement of the sample holder as they move about the platen, wherein the one or more sensors are arranged within the system, including one or more of the housing, a cover, or the platen.

11. A system to perform a polishing operation on a sample, comprising: a sample holder to secure a sample to be polished; a bowl to vibrate the sample holder; and one or more sensors to monitor movement of the sample holders relative to the bowl.

12. The system of claim 11, further comprising an actuator to control a rate of vibration of the bowl and thereby a rate of movement of the sample holder.

13. The system of claim 11, further comprising a controller operable to: receive data from the one or more sensors; count a number of rotations of the sample holder relative to the bowl; and determine an amount of polishing of the sample based on the number of rotations.

14. The system of claim 13, wherein the controller is further operable to: compare the number of rotations of the sample holder to a list of rotations corresponding to amounts of polishing; and determine an amount of polishing of the sample based on the number of rotations.

15. The system of claim 11, wherein the sample holder includes a sensor tag operable to be read by the one or more sensors.

16. The system of claim 11, wherein the sample holder includes a material operable to trigger the one or more sensors.

17. The system of claim 16, wherein the material is a ferrous metal.

18. A system to perform a polishing operation on a sample, comprising: a sample to be polished; a housing to support a platen, the platen operable to allow movement of the sample during a polishing operation; and one or more sensors to monitor movement of the sample relative to the housing.

19. The system of claim 18, further comprising a controller operable to: receive data from the one or more sensors; count a number of rotations of the sample relative to the housing; and determine an amount of polishing of the sample based on the number of rotations.

20. The system of claim 18, further comprising a controller operable to: receive data from the one or more sensors; and determine one or more characteristics of the sample based on the data, wherein the one or more characteristics include a type of sample, a color of the sample, a temperature of the sample, a consistency of the sample, or a material characteristic of the sample.