EP4619473A1 - Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components - Google Patents

Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

Info

Publication number
EP4619473A1
EP4619473A1 EP23960362.4A EP23960362A EP4619473A1 EP 4619473 A1 EP4619473 A1 EP 4619473A1 EP 23960362 A EP23960362 A EP 23960362A EP 4619473 A1 EP4619473 A1 EP 4619473A1
Authority
EP
European Patent Office
Prior art keywords
halogenated
encapsulation
solvent
free
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23960362.4A
Other languages
German (de)
French (fr)
Inventor
Thanikaivelan Tindivanam VEERARAGHAVAN
Karthikeyan SENGOTAIYAN
Senthilkumar VEERARAGHAVAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uniseal Inc
Original Assignee
Uniseal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uniseal Inc filed Critical Uniseal Inc
Publication of EP4619473A1 publication Critical patent/EP4619473A1/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C08K5/1345—Carboxylic esters of phenolcarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers

Definitions

  • O 7 7 a 1 O 6 7 O 2 1,3-dione O 7 7 a 1 O O 2 1,3-dione O 4 2 1-methyl-4- 8-ene-3,5-dione O 1 2 O O .- , , , , , , , , , , , , , , , , , . , , – ,, " . , , , , , . , ., , , , . . ,- ,- ..., ,- . .,- , . ..,- , . ..,- .

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)

Abstract

A storage stable, one-component, solvent-free, non-halogenated, heat curable composition which cures to form a cured product for use in encapsulation of electrical components, including: (a) an epoxy resin; (b) a non-halogenated flame retardant based on phosphorus containing epoxy resin; (c) a cyclic anhydride hardening agent; (d) a catalyst; (e) a rheology modifier; (f) a heat stabilizing agent; and (g) wherein the composition is fast gelling/curing and exhibits a high glass transition temperature, and excellent mechanical, electrical, and flame-retardant properties.

Description

.- - ,,- , - , - . . . . .., ,, ,, , ,, ,, -,,-,, , , , - ,- ., , ,: , , .,.,g , .., , , , .,., , . . , , , , : ,, .- ,, " " ," " ," ," ,,,, , , " ," ,, " ,, " ," ," ,, " , ," , ," ,, " ," " , , " – " .,, , , , , . ,, ... . . . . . , .- ,, . . .. . . . , , . ,, . : , , . , , , ,, >, , > =,1 . , ,, . , , , , .. . , . .. ,, : ,- - , .- . : ,,, ., - , .- . - ,, , , - , - . , . , . , , - ,: - - . . , - °., , °. , - . . , , <= <= , . .- , °.*, - -<=. , - ,,- ,, -,- - , ,- , , . , , , . , . . ,. -,- , - , , : , , - , , - . , ,. °° ,. ., .-.. , ,, .. .14,.., , ., . ,.. °, .. °,°,°, . °. ., .. , - , , . , , , ,,- ,,- -, , . , , - . , , , , .- . , , , . , , , ,- ,.,- ,--- , . ., , . . . . .. , . ° °. , , -,- , , - , : , , - ,. : .- OH O O . . . - - : – - .., - -. , . , , ,. , . ,- , , .-,-, , , , , .- , , - . , , , , - .., ,, , ,, ,, , , . , : , - ,- , . , -,.- , , , ,, , ,, , , ,, ,- , ,,,- . ,,- . , , - . - , ,, , , , , , , , , , ,, ,, ,, - , . .- , : OH O ..,- , , ..,- ..,- . ..,- . , . , , O : 4- 2- .- ..,- , ..,-. , . ..,- . , O 7 7a 1 : O 6 7 O 2 1,3-dione O 7 7a 1 O O 2 1,3-dione O 4 2 1-methyl-4- 8-ene-3,5-dione O 1 2 O O .- , , , , , , . , , , , , , , , , , , ., , – ,, " . , , , , , , . , ., , , , . ,. .. ,- ,- .., ..,- , . ..,- . , , , , , , , , - ,, , . .- : - 5 1 HN - , - -- -,- ,-, ,,- ,- ,- -- ,- -- , ,- -- ’ ..,- - , -- ,- -- , -- ---- ,’ - --′ -′--- ..,,- -- ,,- --′--′-,,- --′--′--- -′-- -,,- , ,- ,,- -- ’-.-.,- -,,- , - -- -- ,-,- ,..,- ---,,- ,,- -- ,- , - ,,- --′-,,- -′--- - . , - . , , .- - . ,,-, , ,,,- , ,. ..,-. ., ..,- .- ..,-... ..,- , . , . - - - . .., , ..,-. -. . ..,-. . , . ..,-. - .. , --- -- ---- -- - -- -- -- . , , , ., - : methylphenyl)propanoate) .- C ..,-. ., ..,-. ..,-. . ,-. . .., . ., ° ° ° : -° °, . ° °. . . . .- . . . . , . . –-° . - .° - . . st . nd . st , nd . . . , . , .- N1o. Ku om Noa m Ym e De rc 1a 2 Bs em - en c o a re A se ns u cr e to o n x Ex 441 Ex 2 Ex Ex 474 Ex 47 E 47 Ex 477 , -, . - - , , . ,. , , , -, , , , , °-°° , , , - .- ° , . ° . , , . ,- - ,- , ,. , , , , , . , -, , , , , , °-°° , , - ° , . ° , , . . , . - , -, , , , , , . - ,, , . , , , °-° , , , .- ° , - ° , . , , , . ° . - - , . , , . , , -,, , , , °-° , , , ° . - ,. , ° , . , , . ° - - , , , , , . , . -, , , , °- , , °° ., .- . ,,, ° , . , , . ° - - , , , , , . , . -, , , , °- , , °° . , - , ° , ., , , . ° . - - , . , , , , . , -, , , , °- , , °° , --- . – .- . ,,, ° , . , , . ° T Vess °ctosr Pota e a s rtt 2es R m e T e oe t ms o t – eter E 1x 1 E 1x 2 Ex E 2x414 E 2x E 2x4 E 2x27 sc 14 s .28 1425 .- –. °° °° . ., .... .. .... , . . . .. - . , , . . - . , , .. – . , , . .- , . , . . , , , , , , - , . , , , " .," " , ,," " ," , , , " " . . . " " . . , , , . , . ., , ., .- ,, . , . , , , .. - , , , , , , , ",, . , " " ," " ," " ," , . , , , . , , , , . . .

Claims

.-. , - , -, - , -, : - - - - - - -, , , - . . . . , °°. . ,.,.. , . , .. , . , ., .14.., , ...
.-. °, . ., °, °,°, . °. . , . . .., . , . - . , , , ,- ,,- ,,- , , . , . , - . . , , , , , , , .
.-. . , , , ,- , ,- ,- . -- ,. . , . . . . , . . . . , .. ° . °. , . , - , -, - , -, : - - - - - - .
.- . , : OH O O . . . , - , , .- , . , . . , , , .
EP23960362.4A 2023-11-29 2023-11-29 Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components Pending EP4619473A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2023/081574 WO2025116899A1 (en) 2023-11-29 2023-11-29 Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

Publications (1)

Publication Number Publication Date
EP4619473A1 true EP4619473A1 (en) 2025-09-24

Family

ID=95897322

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23960362.4A Pending EP4619473A1 (en) 2023-11-29 2023-11-29 Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

Country Status (2)

Country Link
EP (1) EP4619473A1 (en)
WO (1) WO2025116899A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002012743A (en) * 2000-06-28 2002-01-15 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing optical semiconductor, and optical semiconductor device sealed with its cured material
EP2534189B1 (en) * 2010-02-12 2015-05-06 Dow Global Technologies LLC Phosphorus-containing epoxy resin
EP2957584B1 (en) * 2014-06-17 2017-03-01 3M Innovative Properties Company Rapid curing epoxy adhesive compositions
KR102587599B1 (en) * 2016-02-24 2023-10-12 주식회사 신아티앤씨 Phosphorus epoxy compound and method for preparing the same, epoxy composition comprising the same
JP2021502370A (en) * 2017-11-09 2021-01-28 ブルー キューブ アイピー エルエルシー Epoxy resin containing phosphorylated anhydride

Also Published As

Publication number Publication date
WO2025116899A1 (en) 2025-06-05

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