EP4469615A1 - Method of operating a coating system, controller for operating a coating system, electron catching apparatus, and coating system - Google Patents
Method of operating a coating system, controller for operating a coating system, electron catching apparatus, and coating systemInfo
- Publication number
- EP4469615A1 EP4469615A1 EP22708373.0A EP22708373A EP4469615A1 EP 4469615 A1 EP4469615 A1 EP 4469615A1 EP 22708373 A EP22708373 A EP 22708373A EP 4469615 A1 EP4469615 A1 EP 4469615A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- anode
- electron
- coating
- catcher
- heating current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
Definitions
- Embodiments of the present disclosure relate to the operation of a coating system in a vacuum chamber, the coating system including an electron catcher.
- the electron catcher includes an anode for collecting free electrons in the vacuum chamber.
- Electron-beam physical vapor deposition is a vacuum deposition method used to produce thin films and coatings in various technical fields. Examples include the semiconductor industry, the aerospace industry, and optics. A target of the coating material is bombarded with an electron beam, leading to evaporation of coating material. A thin film can then be formed on a substrate by condensation.
- Roll-to-roll (R2R) processing is a method where a flexible material taken from an unwinder roll is coated and subsequently re-reeled on a rewinder roll. R2R processing can be used to create electronic devices on flexible plastic, metal foil, or flexible glass substrates.
- EBPVD is applied to a film substrate.
- electrons of the electron beam and secondary electrons emitted by the coating material may fly to the film substrate from the bombarded coating material.
- the substrate thus gets electrostatically charged.
- a high charge build-up can occur for example at a rewinder roll of the coating system, particularly if the film is coated with insulating materials like for example SiOx or AlOx.
- the electric charge increases.
- a highly charged film can negatively influence the winding quality. Further, a highly charged film is prone to picking up particles and dust, leading to a decrease in product quality. A negative impact on downstream material processing can ensue.
- handling of a highly charged roll carries the danger of electrical shock to operators.
- a typical electron catcher includes a conductive wire for collecting electrons.
- the conductive wire is subjected to a bias voltage and functions as an anode.
- the collection rate of an electron catcher depends on various parameters of the electron catcher and the coating system. Setting up a coating system such that the collection rate is high requires arduous tests and adjustments. The resulting collection rate can still be lower than desired.
- the coating system includes a coating drum for transporting a substrate, at least one electron beam gun for evaporating a coating material, and an electron catcher.
- the electron catcher includes an anode for collecting free electrons in the vacuum chamber.
- the anode is heatable via a heating current.
- the electron catcher is configured such that the heating current passes through the anode or the electron catcher includes a resistive heater thermally coupled with the anode, with the electron catcher being configured such that the heating current passes through the resistive heater.
- the method includes: an automatic adjustment of at least one parameter selected from a group consisting of: the heating current, a DC bias voltage of the anode, a position of the anode, and a pressure in the vacuum chamber.
- the automatic adjustment includes a measurement of an electron collection current passing through the anode.
- a coating system includes a coating drum for transporting a substrate, at least one electron beam gun for evaporating a coating material, a controller according to aspects described herein, and an electron catcher.
- the electron catcher includes an anode configured for collecting free electrons in a vacuum chamber. The anode is heatable via a heating current. The electron catcher is configured such that the heating current passes through the anode or the electron catcher includes a resistive heater thermally coupled with the anode, with the electron catcher being configured such that the heating current passes through the resistive heater.
- Figs, la-c are schematic, cross-sectional views of electron catching apparatuses according to embodiments described herein;
- Fig. 3 is a chart illustrating a method of operating an electron catcher placed in a vacuum chamber, according to aspects described herein.
- Figs, la-c are schematic, cross-sectional views of electron catching apparatuses, according to embodiments described herein.
- the electron catching apparatus 100 includes an electron catcher 110 and a first actuator 120.
- the electron catcher 110 includes an anode 112 configured for collecting free electrons in a vacuum chamber.
- a positive voltage can be applied to the anode for collecting free electrons in a vacuum chamber.
- the anode 112 may be for example a wire, a tube, or a rod.
- the anode includes a conductive material, particularly a metal.
- the anode may include for example tungsten or molybdenum.
- the cross-sectional planes depicted in Figs, la-c are perpendicular to a main direction of extension of the respective anode.
- the first actuator 120 is configured to move the anode 112 in a first direction, the first direction having at least a component perpendicular to a main extension direction of the anode 112.
- the anode 112 may be attached to the first actuator 120 via the anode holder 114.
- the substrate support surface of the coating drum has a coating including an electronegative polymer.
- An “electronegative polymer” may be understood as a polymer having electronegative properties.
- the coating is provided on the complete support surface.
- the coating has a constant thickness, e.g. a thickness T selected from the range of 2.5 pm ⁇ T ⁇ 15 pm. Providing a coating having a thickness T selected from the range of 2.5 pm ⁇ T ⁇ 15 pm can be beneficial to ensure sufficient capacitance to ensure a sufficient pinning force between the flexible substrate and the coated support surface of the coating drum.
- the coating provided on the support surface of the coating drum as described herein ensures that the coated coating drum is negatively charged compared to the substrate, even in the absence of an externally applied electric field. Accordingly, it is to be understood that according to embodiments which can be combined with other embodiments herein, the coating on the support surface of the coating drum can be configured to provide for a charge affinity difference ACA with respect to the flexible substrate to be guided by the coating drum.
- the charge affinity difference ACA between the coating and the substrate can be 50 nC/J ⁇ ACA ⁇ 200 nC/J, particularly 100 nC/J ⁇ ACA ⁇ 150 nC/J.
- the AC-drives of the active rolls as described herein can be synchronized. It is to be understood that the torque and/or rotational speed of the active rollers can be controllable such that variable torques and/or speeds may be provided.
- the coating drum is an active roll as described herein.
- the coating system 200 includes an electron catching apparatus 100 according to embodiments described herein, particularly as described with regard to Figs. la-c.
- the coating system may also include at least one further electron catching apparatus according to embodiments described herein.
- Exemplary components include a vacuum pump, a power supply, and a vacuum control valve.
- the at least one component may particularly include a power supply for providing a heating current to the anode or to the resistive heater of the electron catcher.
- the at least one component may include a power supply for providing a DC bias voltage to the anode of the electron catcher.
- the at least one component may include at least one of a first or a second actuator of an electron catching apparatus as described herein.
- the automatic adjustment of the at least one parameter includes measuring an electron collection current passing through the anode.
- an electron collection current may be understood as the total direct current passing through the anode as a result of a DC bias voltage applied to the anode.
- the DC bias voltage may be regulated via a power supply connected to the anode.
- the controller may include a central processing unit (CPU), a memory and, for example, support circuits.
- the CPU may be one of any form of general-purpose computer processor that can be used in an industrial setting for controlling various components and sub-processors.
- the memory is coupled to the CPU.
- the memory, or a computer readable medium may be one or more readily available memory devices such as random-access memory, read only memory, a floppy disk, a hard disk, or any other form of digital storage either local or remote.
- the support circuits may be coupled to the CPU for supporting the processor in a conventional manner. These circuits include cache, power supplies, clock circuits, input/output circuitry and related subsystems, and the like.
- Control instructions are generally stored in the memory as a software routine or program.
- the software routine or program may also be stored and/or executed by a second CPU that is remotely located from the hardware being controlled by the CPU.
- the software routine or program when executed by the CPU, transforms the general-purpose computer into a specific purpose computer (controller) that controls a system for depositing a material, according to any of the embodiments of the present disclosure.
- Methods according to the present disclosure may be implemented as a software routine or program. At least some of the method operations disclosed herein may be performed via hardware as well as by a software controller. As such, the embodiments may be implemented in software as executed upon a computer system, and hardware as an application specific integrated circuit or another type of hardware implementation, or a combination of software and hardware.
- the controller may execute or perform a method of depositing a material on a substrate, according to embodiments of the present disclosure. Methods described herein can be conducted using computer programs, software, computer software products and interrelated controllers, which can have a CPU, a memory, a user interface, and input and output devices being in communication with corresponding components of the system for depositing a material.
- the electron catcher includes an anode for collecting free electrons in the vacuum chamber.
- the anode is heatable via a heating current.
- the heating current passes through the anode or the electron catcher comprises a resistive heater thermally coupled with the anode, the heating current passing through the resistive heater.
- the heating current may be regulated via a power supply connected respectively to the anode or the resistive heater.
- the coating system may be for example a coating system as described herein, particularly with regard to Figs. 2a-b.
- the automatic adjustment of the at least one parameter may be performed via closed loop control.
- Closed loop control is particularly to be understood as a method where process outputs (influenced by process inputs) are measured and the measurement results are used as further input for the process.
- the automatic adjustment may include calculating a difference between a desired value and a measured value of the electron collection current and applying a correction to the at least one parameter.
- the correction may be based on at least one of: a proportional, an integral, or a derivative term.
- the automatic adjustment may be performed for example via a PID controller.
- a PID controller is particularly to be understood as a controller calculating a difference between a desired value and a measured value of a process variable and applying a correction based on proportional, integral, and derivative terms.
- the automatic adjustment may be performed by a computational optimization technique, particularly an optimization algorithm, an iterative method, or a heuristic algorithm.
- the position of the anode is particularly to be understood as a position of the anode relative to any of: the coating drum or the material holder.
- the position may additionally or alternatively be understood as a position relative to the substrate.
- the heating current may be an alternating current (AC).
- the heating current may be adjusted for example to a value being any of: at least 10 A or at most 80 A.
- the DC bias voltage may be regulated via a power supply connected to the anode.
- the DC bias voltage may be adjusted for example to a value being any of: at least 30 V or at most 120 V.
- the pressure may be regulated for example by a gas inlet provided on the vacuum chamber. The pressure may be adjusted for example to a value being any of: at least 5- 1 O' 6 mbar or at most 8- 1 O' 3 mbar.
- the coating material may include, particularly be, a non-metallic material.
- the coating material may include, particularly be, an electrically insulating material.
- an electrically insulating material may be understood as a material having a resistivity higher than for example 10 10 , 10 14 , or 10 16 Q-m. With electrically insulating coating materials, it is particularly beneficial to avoid impingement of electrons to prevent charge buildup.
- the coating material may include at least one of SiOx, AlOx, or SiO2.
- the automatic adjustment of the at least one parameter may include maximizing the electron collection current.
- the number of electrons reaching the substrate and causing electrostatic charging can be reduced or eliminated.
- the automatic adjustment 310 of the at least one parameter may include, in block 314, comparing the electron collection current with an electron beam gun current.
- An electron beam gun current is particularly to be understood as the quantity of electric charge per unit of time emitted as an electron beam.
- the electron beam gun current is particularly to be understood as a sum calculated with respect to all used electron beam guns.
- the electron collection current may be compared to the electron beam gun current continuously. A particularly precise adjustment of the at least one parameter may be achieved.
- the method may include adjusting the at least one parameter such that the electron collection current is at least for example 80, 90, or 95% of the electron beam gun current.
- the method may include adjusting the at least one parameter such that the electron collection current is equal to the electron beam gun current.
- Beneficial values of the at least one parameter can thus be achieved particularly efficiently.
- a part of an electron beam’s energy impinging on a coating material may be lost due to any of: secondary electron emission or production of X-rays. Under operating conditions where no secondary electrons are emitted by the coating material, the maximum number of electrons the electron catcher is able to collect is equal to the number of electrons introduced with the electron beam.
- the automatic adjustment 310 of the position may include: moving the anode in a first direction via a first actuator, the first direction having at least a component perpendicular to a main extension direction of the anode. Moving the anode via an actuator enables configuring the coating system without requiring an operator to perform arduous tests and adjustments. The method concludes in block 320.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2022/051925 WO2023143719A1 (en) | 2022-01-27 | 2022-01-27 | Method of operating a coating system, controller for operating a coating system, electron catching apparatus, and coating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4469615A1 true EP4469615A1 (en) | 2024-12-04 |
Family
ID=80682933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP22708373.0A Pending EP4469615A1 (en) | 2022-01-27 | 2022-01-27 | Method of operating a coating system, controller for operating a coating system, electron catching apparatus, and coating system |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4469615A1 (en) |
| CN (1) | CN118742668A (en) |
| WO (1) | WO2023143719A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4551844A (en) * | 1983-04-05 | 1985-11-05 | Jersey Nuclear-Avco Isotopes, Inc. | Demodulation of vapor density |
| JPS61279667A (en) * | 1985-06-04 | 1986-12-10 | Matsushita Electric Ind Co Ltd | Formation device for thin film by vacuum evaporation |
| KR20070051376A (en) * | 2005-11-07 | 2007-05-18 | 주식회사 대우일렉트로닉스 | Inorganic vapor deposition apparatus using electron beam |
| DE102019101776A1 (en) * | 2019-01-24 | 2020-07-30 | VON ARDENNE Asset GmbH & Co. KG | Coating arrangement and method |
-
2022
- 2022-01-27 CN CN202280090309.7A patent/CN118742668A/en active Pending
- 2022-01-27 WO PCT/EP2022/051925 patent/WO2023143719A1/en not_active Ceased
- 2022-01-27 EP EP22708373.0A patent/EP4469615A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN118742668A (en) | 2024-10-01 |
| WO2023143719A1 (en) | 2023-08-03 |
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Owner name: ELEVATED MATERIALS GERMANY GMBH |