EP4249645A1 - Verfahren zur herstellung einer vielzahl von mikroteilen - Google Patents

Verfahren zur herstellung einer vielzahl von mikroteilen Download PDF

Info

Publication number
EP4249645A1
EP4249645A1 EP22164275.4A EP22164275A EP4249645A1 EP 4249645 A1 EP4249645 A1 EP 4249645A1 EP 22164275 A EP22164275 A EP 22164275A EP 4249645 A1 EP4249645 A1 EP 4249645A1
Authority
EP
European Patent Office
Prior art keywords
microparts
binder resin
conductive substrate
face
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22164275.4A
Other languages
English (en)
French (fr)
Inventor
Valentin Barberini
Fabien Devanthéry
Gregoire Genolet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mimotec SA
Original Assignee
Mimotec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mimotec SA filed Critical Mimotec SA
Priority to EP22164275.4A priority Critical patent/EP4249645A1/de
Publication of EP4249645A1 publication Critical patent/EP4249645A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes

Definitions

  • the present application concerns the field of manufacturing metal microcomponents by electroforming called microparts.
  • the advantage of this technique is to produce metallic microcomponents with very high precision in X and Y and with a thickness of up to several millimeters. It is also possible to apply the process in several stages to obtain a microcomponent at several levels, each level being built on the previous one.
  • the precision in X and Y is satisfactory, the precision in height (Z) will depend on several factors such as the size of the cavities, the height of the photoresist and the thickness of the metal deposited. This is why when the height of a micropart must be precisely defined, a mechanical operation will be applied to the external face of the microparts. In addition, depending on needs, a finishing step can be applied to the external face of the microparts.
  • microparts are then released from their mold and separated from the substrate. At this stage the microparts are in bulk and their internal face can also undergo a finishing or watchmaking termination stage.
  • the aim of the present invention is to propose a method of manufacturing a plurality of microparts allowing machining of both faces with improved flatness and precision.
  • the present invention allows the manufacture and production of microparts with watchmaking finishes on both sides without any unitary manipulation of the latter; this type of process which is applied to a plurality of parts is commonly called “batch process”.
  • a finished appearance of the part can be obtained by bevelling, satin finishing, hooping, blocked polishing or any other watchmaking finishing operation, this step in particular erases all the burrs from 'machining
  • THE figures 3 And 4 involve the application of a transfer film during the manufacturing process of the first and second embodiments.
  • FIG. 7 is a watch component comprising several stages of teeth. This type of multi-stage micropart can also be produced according to the method of the present invention and its variants.
  • the substrate 1 is generally a support plate of glass, metal or silicon on which is deposited a conductive layer produced by an evaporation of chromium and gold, for example.
  • the substrate is naturally conductive, it is not necessary to deposit a conductive layer.
  • the "conductive substrate” is therefore either the naturally conductive substrate, or the substrate with a conductive layer on its surface.
  • a layer of photoresist preferably of the negative type sensitive to UV ultraviolet rays, hereinafter called “photoresist”, typically from the SU-8 family of MicroChem Corporation. It is also possible to use dry photosensitive resin, that is to say without solvent or with very low levels of solvent. Alternatively, the photoresist could be of the positive type.
  • This photoresist layer is polymerized after selective irradiation.
  • the irradiated parts are polymerized while the non-irradiated parts are not polymerized. If necessary, the photoresist layer is flattened before irradiation.
  • a photoresist mold 2 is obtained. This mold is illustrated in figure 1 , step 1a and the parts of photoresist eliminated reveal cavities. On a single-level mold, these cavities reveal the conductive substrate 1.
  • the next step consists of filling the mold 2 with photoresist according to an electroforming operation, the conductivity of the conductive substrate 1 allows a metal deposition in the cavities of the mold 2 and when the level defined by the polymerized layer of the mold 2 is reached, the metallization is interrupted.
  • the figures 1b And 2b a slight overflow of the metal part. It is customary, but not necessary, to continue electroforming once the upper level of mold 2 is reached to ensure that all cavities are filled.
  • There figure 1b (also visible on the figures 2b , 3b And 4b ) illustrates the state in which the assembly finds itself at the end of these operations.
  • the electroformed metal layer forms a plurality of microparts 3 linked together by the photoresist mold 2 and secured to the conductive substrate 1.
  • the face of the microparts corresponding to the top of the metallization by electroforming is called “external face”.
  • the “internal face” is that which, during metallization, is in contact with the conductive substrate 1.
  • Metallization by electroforming creates microparts 3 with a raw external face 5a and a raw internal face 6a. They are called “raw” because they are a direct result of electroforming, either unmachined or polished. Once this face is machined, it acquires the qualifier “machined”, namely external machined face 5b and internal machined face 6b.
  • the sides of the microparts correspond to the vertical part of the microparts in contact with the mold 3 during the electroforming phase.
  • FIG. 1 A first embodiment is illustrated in figure 1 . Once the microparts 3 have been produced by electroforming, the photoresist mold 2 is eliminated. A chemical attack makes it possible to dissolve the mold 2 and reveal the microparts 3 which are integral with the conductive substrate 1. We refer to the figure 1c .
  • the next step is the application of a binder resin 4 as described above.
  • This resin will cover the raw external face 5a and the sides of the microparts 3 and fill the cavities left free by the elimination of the mold 2, that is to say be in contact with the conductive substrate 1.
  • This binder resin 4 will also exceed the height of the microparts 3 as illustrated in figure 1d .
  • microparts 3 are integral with the conductive substrate 1 and all of the microparts 3 are processed in this operation. One way to do this is by grinding or grinding.
  • the conductive substrate 1 with the plurality of microparts 3 is placed under a grinding wheel (also called grinding machine) which will reduce the height of the binder resin 4 and the microparts 3 to the desired height.
  • Other alternative methods can be implemented such as lapping or machining with a diamond chisel (“fly-cutting”).
  • the final height of the microparts 3 can be defined at this step or simply approached. In this second case, the step of machining the raw internal face 6a of the microparts 3 will define the final height of the parts.
  • a flat reference surface 8 is formed by the binder resin 4 and the machined external face 5b of the microparts 3 after the machining step. The result is visible at figure 1e .
  • the raw internal face 6a of the microparts 3, in contact with the conductive substrate 1, will also undergo a finishing step.
  • the assembly comprising the binder resin 4 and the microparts 3 is released from the conductive substrate 1 by machining the latter or any other method of releasing the conductive substrate 1 (see figure 1f ).
  • the binding resin 4 being rigid, the assembly forms a rigid whole and can be placed on a machining plate in order to eliminate the conductive substrate 1 using as reference face 8 the machined external face 5b of the microparts 3 and the resin binder 4 which were machined to the same thickness (see figure 1f ).
  • the raw internal face 6a of the microparts 3 is machined to obtain the machined internal face 6b. If the height of the microparts 3 is not at the desired height, this machining step will reduce the height of the assembly until the desired final height of the microparts is reached. The result is visible at figure 1g .
  • the binder resin 4 is removed by dissolution to obtain the microparts individually ( figure 1h ).
  • This step can be carried out during production or at a later stage, for example after delivery.
  • the microparts delivered are all integral and protected from shocks.
  • the moment of deposition of the binder resin 4 is done at a later stage in the production cycle compared to the previous embodiment.
  • the object of the figure 2a and 2b is similar to the purpose of figure 1a and 1b according to the first embodiment.
  • the plurality of microparts 3 which was formed in the photoresist mold 2 is integral with the conductive substrate 1 as illustrated in the figure 2b .
  • a first machining step is carried out on the raw external face 5a of the microparts to obtain the machined external face 5b of the microparts 3 in the desired final state.
  • the final height of the microparts 3 can be defined at this step or simply approached.
  • the step of machining the raw internal face 6a of the microparts 3 will define the final height of the microparts 3. The result is illustrated in the figure 2c allowing the machined external face 5b of the microparts 3 to be seen.
  • the next step consists of eliminating photoresist mold 2 by chemical attack. There will remain the conductive substrate 1 integral with the plurality of microparts 3, as illustrated in figure 2d .
  • the next step is the application of a binder resin 4 as described above.
  • This resin will cover the machined external face 5b and the sides of the microparts 3 and fill the cavities left free by the elimination of the mold 2, that is to say be in contact with the conductive substrate 1.
  • This binder resin 4 will also exceed the height of the microparts 3 as illustrated in figure 2e .
  • This assembly is released from the conductive substrate 1 by machining the latter or any other method of releasing the conductive substrate 1. The result is illustrated in the figure 2g .
  • the raw internal face 6a of the microparts 3 is machined to obtain the machined internal face 6b. If the height of the microparts 3 is not at the desired height, this machining step will reduce the height of the assembly until the desired final height of the microparts is reached. The result is visible at figure 2h .
  • the binder resin 4 is removed by dissolution to obtain the microparts 3 individually.
  • This step ( figure 2i ) can be carried out during production or at a later stage, for example after delivery.
  • the microparts delivered are all integral and protected from shocks.
  • a third mode which is a combination of the first mode and the second embodiment, after obtaining a set of microparts 3 in the mold 2, and the elimination of this mold 2 (see figure 1c ), we will carry out a step of machining the raw external face 5a of the microparts 3. It is machined at this moment to obtain the machined external face 5b of the microparts 3, this before the application of the binder resin 4.
  • next step is the application of the binder resin 4.
  • a flattening step is carried out in order to form the flat reference surface 8 as illustrated in Fig. figure 2f . It should be noted that the flattening of the binder resin 4 is done so that the machined external face 5b of the microparts remains covered with binder resin 4.
  • THE figures 3 And 4 illustrate variants of the first and second embodiment in which a transfer film 7 is introduced in order to maintain the position of the microparts referenced relative to each other in the horizontal plane after the elimination of the binder resin 4.
  • Steps 3a to 3e of the Figure 3 correspond to the figures 1a to 1e .
  • a transfer film 7 is applied to the machined external face 5b of the microparts 3 and the binder resin 4. This is illustrated in figure 3f .
  • the transfer film 7 is for example an adhesive film commonly used in the microelectronics industry and known under the name “tape”. This type of film is used in this industry to enable sawing, machining or thinning of wafers, for example. This film is suitable for subsequent handling of parts manually or automatically (“pick-and-place”).
  • the entire transfer film 7, microparts 3, binder resin 4 and conductive substrate 1 is placed on a machining table for the elimination of the conductive substrate 1 ( figure 3g ) and the finishing of the raw internal face 6a of the microparts 3 ( figure 3h ) to obtain the machined internal face 6b of the microparts 3.
  • the plurality of microparts can undergo aesthetic and dimensional quality controls in a simplified manner and without unit manipulation.
  • FIG 4 illustrates a variant of the second embodiment with the use of transfer film 7.
  • the steps of figures 4a to 4h are identical to the steps of figures 2a to 2h .
  • the transfer film 7 is applied to the machined internal face 6b of the microparts 3 (see figure 4i ). Once the transfer film 7 is in place, the binder resin 4 can be removed by dissolution for example.
  • the finished microparts 3 are linked together by the transfer film 7 (see figure 4j ).
  • the first step is to make a multi-level mold.
  • a first solution is to deposit a layer of photoresist, to selectively illuminate this layer, to deposit a second layer of photoresist and to illuminate it selectively. It is of course possible to repeat these operations to add one or more layers to the desired mold.
  • the unpolymerized parts of the different photoresist layers are removed to obtain a multi-level photoresist mold.
  • the horizontal faces of the mold must be conductive, in particular the horizontal faces of the intermediate layer(s) but the vertical faces of the mold are not conductive.
  • a first method is described in the application EP 18165150.6 from the same depositor.
  • step 1b, 2b, 3b or 4b which consists of depositing the metal layer in said mold by electroforming.
  • step 1b, 2b, 3b or 4b which consists of depositing the metal layer in said mold by electroforming.
  • the steps described with reference to figures 1 to 4 from the object of figures 1b , 2b 3b And 4b apply in the same way.
  • the termination on the internal face of the microparts can also reach the horizontal internal face of an intermediate level, for example by using a rotating brush.
  • microparts thus produced can be used in watchmaking, in particular for the production of microcomponents of mechanical watch movements such as toothed wheels, anchors, anchor wheels, jumpers, cams or springs.
  • MEMS Probe test tips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
EP22164275.4A 2022-03-25 2022-03-25 Verfahren zur herstellung einer vielzahl von mikroteilen Pending EP4249645A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP22164275.4A EP4249645A1 (de) 2022-03-25 2022-03-25 Verfahren zur herstellung einer vielzahl von mikroteilen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP22164275.4A EP4249645A1 (de) 2022-03-25 2022-03-25 Verfahren zur herstellung einer vielzahl von mikroteilen

Publications (1)

Publication Number Publication Date
EP4249645A1 true EP4249645A1 (de) 2023-09-27

Family

ID=80933833

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22164275.4A Pending EP4249645A1 (de) 2022-03-25 2022-03-25 Verfahren zur herstellung einer vielzahl von mikroteilen

Country Status (1)

Country Link
EP (1) EP4249645A1 (de)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170362728A1 (en) * 2014-12-12 2017-12-21 Citizen Watch Co., Ltd. Method of manufacturing electroformed components
EP3453787A1 (de) 2017-09-11 2019-03-13 Patek Philippe SA Genève Herstellungsverfahren eines loses von mehrstufigen mikromechanischen metallteilen
EP3508916A1 (de) 2018-01-05 2019-07-10 Mimotec S.A. Herstellungsmethode einer mehrstufigen mikroform für die galvanoformung, und mit dieser methode erhaltene mikroform
EP3789825A1 (de) * 2019-09-05 2021-03-10 Mimotec S.A. Verfahren zur herstellung einer vielzahl von mikroteilen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170362728A1 (en) * 2014-12-12 2017-12-21 Citizen Watch Co., Ltd. Method of manufacturing electroformed components
EP3453787A1 (de) 2017-09-11 2019-03-13 Patek Philippe SA Genève Herstellungsverfahren eines loses von mehrstufigen mikromechanischen metallteilen
EP3508916A1 (de) 2018-01-05 2019-07-10 Mimotec S.A. Herstellungsmethode einer mehrstufigen mikroform für die galvanoformung, und mit dieser methode erhaltene mikroform
EP3789825A1 (de) * 2019-09-05 2021-03-10 Mimotec S.A. Verfahren zur herstellung einer vielzahl von mikroteilen

Similar Documents

Publication Publication Date Title
EP2440690B1 (de) Verfahren zur herstellung einer metall-mikrostruktur
EP3202708B1 (de) Verfahren zur herstellung einer hybrid-uhrenkomponente
EP3066044B1 (de) Hohles mikromechanisches bauteil mit mehreren funktionsebenen, und monoblock aus einem material auf der basis eines synthetischen kohlenstoffallotrops
EP2230207A1 (de) Form für Galvanoplastik und ihr Herstellungsverfahren
EP3789825B1 (de) Verfahren zur herstellung einer vielzahl von mikroteilen
EP3839624B1 (de) Verfahren zur herstellung einer uhrkomponente
EP3986643A1 (de) Verfahren zur generativen laserstrahlfrtigung eines maschinenteils mit technischer und/oder dekorativer funktion und maschinenteil mit technischer und/oder dekorativer funktion
WO2009083487A2 (fr) Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé
EP3623437A1 (de) Vorübergehendes verklebungsverfahren mit thermoplastischem kleber und integrierter starrer krone
EP4249645A1 (de) Verfahren zur herstellung einer vielzahl von mikroteilen
EP3839626B1 (de) Verfahren zur herstellung einer uhrkomponente
EP3168058A1 (de) Herstellungsverfahren eines werkstücks aus metall mit mindestens einem motiv mit optischen täuschungselementen
EP3495894A1 (de) Verfahren zur herstellung einer uhrkomponente
EP3802920B1 (de) Herstellungsverfahren eines metalldekoreinsatzes auf einem ziffernblatt, und mit diesem verfahren erzeugtes ziffernblatt
EP3839625A1 (de) Verfahren zur herstellung einer uhrkomponente und nach diesem verfahren hergestellte komponente
EP3839627B1 (de) Herstellungsmethode einer mikroform für die galvanoformung von mikromechanischen komponenten
EP2881808A2 (de) Verfahren zur Herstellung einer Uhrkomponente
EP3839659B1 (de) Verfahren zur dekoration eines mechanischen bauteils
EP3841433B1 (de) Verfahren zur herstellung einer uhrkomponente, und nach diesem verfahren hergestellte komponente
CH716967A2 (fr) Procédé de fabrication d'un composant horloger et composant obtenu selon ce procédé.
CH716966A2 (fr) Procédé de fabrication d'un composant horloger et composant obtenu selon ce procédé.
CH716969A2 (fr) Procédé de fabrication d'un composant horloger et composant obtenu selon ce procédé.
CH716026B1 (fr) Procédé de fabrication additive par faisceau laser d'une pièce mécanique à fonction technique et/ou décorative et pièce mécanique à fonction technique et/ou décorative.
EP4381352A1 (de) Verfahren zur herstellung einer uhrkomponente
CH715954B1 (fr) Procédé de décoration d'une pièce mécanique.

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20231026

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

R17P Request for examination filed (corrected)

Effective date: 20231026