EP4129910A4 - Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensor - Google Patents
Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensor Download PDFInfo
- Publication number
- EP4129910A4 EP4129910A4 EP21779392.6A EP21779392A EP4129910A4 EP 4129910 A4 EP4129910 A4 EP 4129910A4 EP 21779392 A EP21779392 A EP 21779392A EP 4129910 A4 EP4129910 A4 EP 4129910A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- encapsulant
- alumina powder
- fingerprint authentication
- composition
- authentication sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title 1
- 239000008393 encapsulating agent Substances 0.000 title 1
- 239000000945 filler Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 239000000843 powder Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
- C01F7/021—After-treatment of oxides or hydroxides
- C01F7/027—Treatment involving fusion or vaporisation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
- C01F7/42—Preparation of aluminium oxide or hydroxide from metallic aluminium, e.g. by oxidation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
- C01P2006/82—Compositional purity water content
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Plasma & Fusion (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020063815 | 2020-03-31 | ||
PCT/JP2021/012293 WO2021200485A1 (en) | 2020-03-31 | 2021-03-24 | Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP4129910A1 EP4129910A1 (en) | 2023-02-08 |
EP4129910A4 true EP4129910A4 (en) | 2023-10-04 |
Family
ID=77928735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21779392.6A Pending EP4129910A4 (en) | 2020-03-31 | 2021-03-24 | Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensor |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230159725A1 (en) |
EP (1) | EP4129910A4 (en) |
JP (1) | JP7543394B2 (en) |
KR (1) | KR20220160635A (en) |
CN (1) | CN115362130B (en) |
TW (1) | TW202144290A (en) |
WO (1) | WO2021200485A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024135832A1 (en) * | 2022-12-23 | 2024-06-27 | 日鉄ケミカル&マテリアル株式会社 | Spherical alumina particles and method for producing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005061385A2 (en) * | 2003-12-20 | 2005-07-07 | Degussa Ag | Aluminium oxide powder produced by flame hydrolysis and having a large surface area |
US20110046267A1 (en) * | 2008-04-30 | 2011-02-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Alumina powder, process for its production and resin composition employing it |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1396502A (en) * | 1964-03-12 | 1965-04-23 | Du Pont | Alumina-based refractory products and their preparation |
EP0870731A4 (en) * | 1995-12-27 | 1999-02-03 | Tohkem Products Corp | Titanium dioxide reduced in volatile water content, process for producing the same, and masterbatch containing the same |
JP4431947B2 (en) | 2003-10-07 | 2010-03-17 | Tdk株式会社 | Single crystal ceramic particles, spherical oxide powder |
JP5081037B2 (en) * | 2008-03-31 | 2012-11-21 | ラピスセミコンダクタ株式会社 | Semiconductor device |
MY155608A (en) * | 2008-12-22 | 2015-11-13 | Denka Company Ltd | Powder, method for producing same, and resin composition containing same |
JP2015193493A (en) * | 2014-03-31 | 2015-11-05 | 新日鉄住金化学株式会社 | High density alumina and manufacturing method thereof |
JP6972115B2 (en) * | 2017-04-04 | 2021-11-24 | デンカ株式会社 | Powder mixture |
JP2020063815A (en) | 2018-10-18 | 2020-04-23 | トヨタ自動車株式会社 | Control device for vehicular power transmission device |
-
2021
- 2021-03-24 WO PCT/JP2021/012293 patent/WO2021200485A1/en unknown
- 2021-03-24 JP JP2022512027A patent/JP7543394B2/en active Active
- 2021-03-24 US US17/916,209 patent/US20230159725A1/en active Pending
- 2021-03-24 KR KR1020227037415A patent/KR20220160635A/en unknown
- 2021-03-24 CN CN202180026781.XA patent/CN115362130B/en active Active
- 2021-03-24 EP EP21779392.6A patent/EP4129910A4/en active Pending
- 2021-03-26 TW TW110110971A patent/TW202144290A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005061385A2 (en) * | 2003-12-20 | 2005-07-07 | Degussa Ag | Aluminium oxide powder produced by flame hydrolysis and having a large surface area |
US20110046267A1 (en) * | 2008-04-30 | 2011-02-24 | Denki Kagaku Kogyo Kabushiki Kaisha | Alumina powder, process for its production and resin composition employing it |
Non-Patent Citations (1)
Title |
---|
See also references of WO2021200485A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN115362130A (en) | 2022-11-18 |
TW202144290A (en) | 2021-12-01 |
KR20220160635A (en) | 2022-12-06 |
CN115362130B (en) | 2024-06-28 |
JP7543394B2 (en) | 2024-09-02 |
WO2021200485A1 (en) | 2021-10-07 |
JPWO2021200485A1 (en) | 2021-10-07 |
US20230159725A1 (en) | 2023-05-25 |
EP4129910A1 (en) | 2023-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3514191A4 (en) | Epoxy resin, epoxy resin composition, epoxy resin cured object, and composite material | |
EP3915939A4 (en) | Filler composition, silicone resin composition, and heat dissipation component | |
EP4129910A4 (en) | Alumina powder, filler composition, resin composition, encapsulant, and fingerprint authentication sensor | |
EP3476878A4 (en) | Gas-barrier material, resin composition, gas-barrier object, cured object, and composite material | |
EP3622075A4 (en) | Polypeptides having lysozyme activity, polynucleotides encoding same and uses and compositions thereof | |
EP4129911A4 (en) | Alumina powder, resin composition, and heat dissipation component | |
EP3733594A4 (en) | Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof | |
EP3954719A4 (en) | Copolymer, dispersant and resin composition | |
EP4023563A4 (en) | Resin composition, and molded article | |
EP3888910A4 (en) | Resin composition for sealant, layered body, packaging material and packaging body | |
EP3597687A4 (en) | Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material | |
EP3085736A4 (en) | Black titanium oxynitride powder, and semiconductor sealing resin compound using same | |
EP3632961A4 (en) | Block copolymer, method for producing same, epoxy resin composition, cured product, and semiconductor encapsulating material | |
EP3705522A4 (en) | Vinyl chloride-based resin composition for powder molding, and vinyl chloride-based resin-molded body and laminate | |
EP3854755A4 (en) | Surface treated-metal oxide particle material, method for producing same, resin composition for electronic material, and filler for silicone resin material | |
EP3854848A4 (en) | Resin composition, cured object, and laminate | |
EP3653659A4 (en) | Epoxy resin, epoxy resin composition containing same, and cured product using said epoxy resin composition | |
EP3854855A4 (en) | Resin composition, molded body, and application thereof | |
EP3904310A4 (en) | Inorganic powder for heat-dissipating resin composition, heat-dissipating resin composition using same, and methods for producing same | |
EP3825340A4 (en) | Epoxy resin composition, molding material for fiber-reinforced composite material, and fiber-reinforced composite material | |
EP3960147A4 (en) | Cosmetic composition for molding, comprising calcined layered double hydroxide and polymer | |
EP4015577A4 (en) | Epoxy resin composition, gas barrier film, and laminate | |
EP3950829A4 (en) | Resin composition for ceramic green sheet, ceramic green sheet, and layered ceramic capacitor | |
EP3757147A4 (en) | Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material | |
EP4183821A4 (en) | Thermoplastic resin composition, and modifier |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20220927 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20230905 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C08K 3/36 20060101ALI20230830BHEP Ipc: C08K 3/22 20060101ALI20230830BHEP Ipc: C08L 101/00 20060101ALI20230830BHEP Ipc: H01L 23/31 20060101ALI20230830BHEP Ipc: H01L 23/29 20060101ALI20230830BHEP Ipc: C01F 7/42 20220101ALI20230830BHEP Ipc: C01F 7/02 20220101AFI20230830BHEP |