EP4011539A4 - Matériau composite de brasure/treillis métallique en et son procédé de production - Google Patents

Matériau composite de brasure/treillis métallique en et son procédé de production Download PDF

Info

Publication number
EP4011539A4
EP4011539A4 EP20850710.3A EP20850710A EP4011539A4 EP 4011539 A4 EP4011539 A4 EP 4011539A4 EP 20850710 A EP20850710 A EP 20850710A EP 4011539 A4 EP4011539 A4 EP 4011539A4
Authority
EP
European Patent Office
Prior art keywords
solder
composite material
metal mesh
producing same
mesh composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20850710.3A
Other languages
German (de)
English (en)
Other versions
EP4011539A1 (fr
Inventor
Tetsuro Nishimura
Takatoshi Nishimura
Tetsuya AKAIWA
Katsuhiko Yasu
Hikaru Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Nihon Superior Sha Co Ltd
Original Assignee
Merck Patent GmbH
Nihon Superior Sha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH, Nihon Superior Sha Co Ltd filed Critical Merck Patent GmbH
Publication of EP4011539A1 publication Critical patent/EP4011539A1/fr
Publication of EP4011539A4 publication Critical patent/EP4011539A4/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP20850710.3A 2019-08-05 2020-08-05 Matériau composite de brasure/treillis métallique en et son procédé de production Pending EP4011539A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019144049 2019-08-05
PCT/JP2020/030074 WO2021025081A1 (fr) 2019-08-05 2020-08-05 Matériau composite de brasure/treillis métallique en et son procédé de production

Publications (2)

Publication Number Publication Date
EP4011539A1 EP4011539A1 (fr) 2022-06-15
EP4011539A4 true EP4011539A4 (fr) 2023-08-09

Family

ID=74503001

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20850710.3A Pending EP4011539A4 (fr) 2019-08-05 2020-08-05 Matériau composite de brasure/treillis métallique en et son procédé de production

Country Status (7)

Country Link
US (1) US20220281035A1 (fr)
EP (1) EP4011539A4 (fr)
JP (1) JPWO2021025081A1 (fr)
KR (1) KR20220038675A (fr)
CN (1) CN114222638B (fr)
TW (1) TW202112482A (fr)
WO (1) WO2021025081A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230166143A (ko) * 2021-04-28 2023-12-06 센주긴조쿠고교 가부시키가이샤 적층 접합 재료, 반도체 패키지 및 파워 모듈
KR20220160967A (ko) * 2021-05-28 2022-12-06 (주)티에스이 이종 재질의 다층 회로기판 및 그 제조 방법
US12064827B1 (en) * 2021-06-13 2024-08-20 Garvey Holding LLC Methods, systems, and apparatus for joining metallic fabrics
CN117066752B (zh) * 2023-10-18 2023-12-19 广州汉源微电子封装材料有限公司 一种高平稳性高可靠性的限高型预成形焊片及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0985486A1 (fr) * 1998-03-26 2000-03-15 Nihon Superior Sha Co., Ltd Soudure sans plomb
JP2004174522A (ja) * 2002-11-25 2004-06-24 Hitachi Ltd 複合はんだ、その製造方法および電子機器
JP2010179313A (ja) * 2009-02-03 2010-08-19 Nhk Spring Co Ltd 二つの部材の接合方法及び該方法による接合体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694852A (en) * 1951-01-13 1954-11-23 Riley Stoker Corp Method of brazing and the product thereof
NL264072A (fr) * 1960-11-21 1900-01-01
JPS5239555A (en) * 1975-09-25 1977-03-26 Hitachi Ltd Method of manufacturing composited brazing material
US4529836A (en) * 1983-07-15 1985-07-16 Sperry Corporation Stress absorption matrix
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US6095400A (en) * 1997-12-04 2000-08-01 Ford Global Technologies, Inc. Reinforced solder preform
JP2000197988A (ja) * 1998-03-26 2000-07-18 Nihon Superior Co Ltd 無鉛はんだ合金
US6280584B1 (en) * 1998-07-29 2001-08-28 Applied Materials, Inc. Compliant bond structure for joining ceramic to metal
US6822331B2 (en) * 2001-06-14 2004-11-23 Delphi Technologies, Inc. Method of mounting a circuit component and joint structure therefor
US20110096507A1 (en) * 2009-10-24 2011-04-28 Kester, Inc. Microelectronic thermal interface
JP5178759B2 (ja) * 2010-03-12 2013-04-10 三菱電機株式会社 半導体装置
JP2014180690A (ja) * 2013-03-19 2014-09-29 Nippon Steel Sumikin Materials Co Ltd シート状高温はんだ接合材およびこれを用いたダイボンディング方法
EP3138658B1 (fr) * 2014-04-30 2020-11-04 Nihon Superior Co., Ltd. Alliage de soudure sans plomb
US20170239757A1 (en) * 2016-02-22 2017-08-24 Siemens Energy, Inc. Brazing gap spacing apparatus and method
US10952110B2 (en) * 2017-01-06 2021-03-16 Telefonaktiebolaget Lm Ericsson (Publ) Radio network nodes, wireless device, and methods performed therein for handling connections in a wireless communication network
JP7006686B2 (ja) * 2017-04-18 2022-01-24 富士電機株式会社 半導体装置および半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0985486A1 (fr) * 1998-03-26 2000-03-15 Nihon Superior Sha Co., Ltd Soudure sans plomb
JP2004174522A (ja) * 2002-11-25 2004-06-24 Hitachi Ltd 複合はんだ、その製造方法および電子機器
JP2010179313A (ja) * 2009-02-03 2010-08-19 Nhk Spring Co Ltd 二つの部材の接合方法及び該方法による接合体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2021025081A1 *

Also Published As

Publication number Publication date
TW202112482A (zh) 2021-04-01
EP4011539A1 (fr) 2022-06-15
US20220281035A1 (en) 2022-09-08
JPWO2021025081A1 (fr) 2021-02-11
CN114222638B (zh) 2024-03-12
WO2021025081A1 (fr) 2021-02-11
CN114222638A (zh) 2022-03-22
KR20220038675A (ko) 2022-03-29

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DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: UNO, HIKARU

Inventor name: YASU, KATSUHIKO

Inventor name: AKAIWA, TETSUYA

Inventor name: NISHIMURA, TAKATOSHI

Inventor name: NISHIMURA, TETSURO

P01 Opt-out of the competence of the unified patent court (upc) registered

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A4 Supplementary search report drawn up and despatched

Effective date: 20230710

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 101/42 20060101ALN20230704BHEP

Ipc: B32B 15/02 20060101ALI20230704BHEP

Ipc: B32B 15/01 20060101ALI20230704BHEP

Ipc: B23K 20/233 20060101ALI20230704BHEP

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