EP3847466A1 - Procédé de positionnement d'un substrat d'essai, de sondes et d'une unité d'inspection l'un par rapport à l'autre, et appareil de test pour la mise en ?uvre de ce procédé - Google Patents

Procédé de positionnement d'un substrat d'essai, de sondes et d'une unité d'inspection l'un par rapport à l'autre, et appareil de test pour la mise en ?uvre de ce procédé

Info

Publication number
EP3847466A1
EP3847466A1 EP19780142.6A EP19780142A EP3847466A1 EP 3847466 A1 EP3847466 A1 EP 3847466A1 EP 19780142 A EP19780142 A EP 19780142A EP 3847466 A1 EP3847466 A1 EP 3847466A1
Authority
EP
European Patent Office
Prior art keywords
movement
inspection unit
test substrate
chuck
manipulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19780142.6A
Other languages
German (de)
English (en)
Inventor
Anthony James LORD
Peter Douglas Andrews
Frank Thiele
Jens KLATTENHOFF
Gavin Fisher
Ralf Keller
Peter Schneider
Enrico Herz
Hans-Jürgen FLEISCHER
Jörg KIESEWETTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor GmbH
Original Assignee
FormFactor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor GmbH filed Critical FormFactor GmbH
Publication of EP3847466A1 publication Critical patent/EP3847466A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Definitions

  • the invention relates generally to a method for
  • the invention also relates to a prober for carrying out the method
  • test substrates It is known that a wide variety of electronic components, generally referred to as test substrates, are tested for different properties or are subjected to special tests.
  • the test substrates can be used in various manufacturing and integration stages
  • Hybrid components, micromechanical and micro-optical components and the like are carried out, which are still in the wafer composite or isolated or are already integrated in more or less complex circuits.
  • probers Test stations, commonly referred to as probers
  • the chuck is a holding device that is matched to the holder of the test substrate, to its contacting and to the test conditions and is usually in X-, Y- and Z- by means of a movement unit. Movable direction.
  • the Prober also includes several probes that are held by a probe holder. Depending on the test substrate and test status, individual probes or probe cards with a large number of probe tips, so-called probe cards, can be used as probes.
  • the probe holder includes
  • probe holder plate which is arranged above the chuck and carries the individual probes, held by probe heads, or the probe card. Also the probe holder plate
  • the probe holder plate and / or the probe heads can have movement units by means of which the probes can be moved together or individually at least in the Z direction.
  • the Prober also has an inspection unit, which serves to depict the test substrate and the probe tips.
  • the inspection unit comprises a microscope and / or a camera with which the surface of the test substrate can be viewed in the Z direction.
  • the inspection unit often also has a movement unit in order to bring the objective for inspection in the Z direction to the test substrate, so that the focus of the inspection unit is on a specific one
  • Observation point of the test substrate is set, d. H. this observation point can be depicted sharply, and in order to establish a sufficient distance again, for example when the probes are to be replaced.
  • the movement units regularly leave each other
  • Movement units are also regularly equipped with drives for motorized movement of the chuck and / or the probe holder plate or the individual probes and / or the inspection unit.
  • the motor movements of the components mentioned are configured using a
  • the focus of the observation point must be repeated several times in the course of a test sequence, which includes repeated contacting of one or more points on the test substrate and thus the necessary infeed movements in the X, Y and Z directions. Because of this, the time required increases with each new delivery movement.
  • probes and the test substrate are used
  • At least one of the movement units is positioned relative to one another in the X-Y plane, so that they are at a distance from one another.
  • the contact is established in a subsequent infeed movement in the Z direction (hereinafter referred to as Z infeed movement). This Z position is called the contact position.
  • Z infeed movement This Z position is called the contact position.
  • the contact is released by moving in the Z direction and the next contact position in the X-Y plane is approached.
  • the Z infeed movement into the contact position can be done using a movement of the probes or by means of a movement of the test substrate.
  • the delivery of the probes has the advantage that the relative positions of
  • the probe tip in the X-Y direction which takes place when the probe tip is attached and is desired for establishing a safe electrical contact, can be continuously observed.
  • the intermediate position is a sufficiently large distance between the probe tips and the test substrate, so that, for. B. Corrections in the X-Y plane are possible without the risk of
  • Inspection unit must be tracked in order, for. B. to recognize the contact surfaces of the test substrate. If the intermediate position also has to be approached, the time required for this, due to the necessary intermediate corrections on both components, the chuck and the inspection unit, adds up to a measure that corresponds to the constant requirement
  • outgoing can also be done by manual operation.
  • Test substrate for example a contact surface on the surface of the test substrate, is set that
  • Test substrate and the inspection unit are moved synchronously in the Z direction in order to set the desired end position of the test substrate relative to the probe tips, for example the contact position.
  • This synchronous movement takes place in such a way that the focal plane is maintained at least during a Z feed movement, possibly also during the release of the contact, so that the observation point on the test substrate is sharp remains mapped, as is known from the movement of the probes from the prior art.
  • Such a procedure can be regarded as a virtual movement of the probe holder plate and is also possible in those applications where the probe holder plate is immobile or its movement interferes disproportionately in the test sequence.
  • a movement in the Z direction encompasses both the entire movement sequence that is to be carried out by a required distance in the Z direction, for example the distance up to the contact of the probe tips on the
  • Such a section can, for example, the
  • a synchronous movement while maintaining the focus level includes both the length of movement in the Z direction and the temporal component.
  • synchronous here also refers to simultaneous movements and includes such delays caused by the control unit is conditional and / or can be implemented with the currently customary computing technology if the focus is also shifted by means of the common algorithms, too
  • Compensating movement is triggered.
  • Inspection unit of 300 ms are still sufficient to be able to recognize a shift in the focal plane in time.
  • the latency should be less than 200 ms, preferably less than 100 ms, more preferably less than 50 ms, more preferably less than 40 ms, more preferably less than 30 ms, more preferably less than 20 ms, more preferably less than 10 ms, more preferably less than 5 ms increasing scaling of the
  • Inspection unit can be implemented, for example, by means of synchronous control signals for executing the movements of the chuck and inspection unit, with reference also to the time intervals of the control signals the above latencies are applicable.
  • the movements of the test substrate and inspection unit in the Z direction can be initiated by a manipulator body, which is part of a manipulator of the prober used.
  • the manipulator body is moved in such a way that the movement is clearly determined by a
  • Direction of movement and a measure of the movement is determined.
  • the movement of the manipulator body is measured in terms of direction and dimension by means of a suitable movement sensor, so that from this sense of direction, from the direction of movement of the manipulator body, and length of the movement, from the
  • Control signals are the movements of Chuck or
  • the inspection unit and the other prober component follow this initial movement synchronously on the basis of a mathematical coupling of the two movement units by means of the control unit.
  • other methods of connecting the two movements can also be considered, provided that these permit the synchronous movement.
  • the initial movement can, for example be carried out by the chuck, whereupon the inspection unit follows.
  • the other order or the movement of both components on the basis of the control signals generated from the measured values are also possible.
  • the manipulator can be coupled to both movement units, so that the manipulator drives both when the motor is moving
  • Control signals are generated which are used to control the
  • the manipulator can be directly related to only one of the two movement units.
  • the second movement unit carries out a compensating movement in the Z direction.
  • Manipulator body moved manually.
  • movements of the manipulator body carried out by means of a suitable manipulator control are also possible.
  • a movement of the manipulator body can be a rotation of the manipulator body about an axis of rotation.
  • the direction of rotation clockwise or counterclockwise, gives the direction of direction in the Z direction, up or down, and the angle of rotation gives the value of the positive or negative stroke, i. H. the length of the movement in the Z direction.
  • the manipulator body can be moved by a Stop or more of them can be limited.
  • the stop limits the amount of movement and can by the
  • End positions such as a minimum distance position, can be defined using a stop.
  • Inspection unit determines the deviation as a result of a Z movement and compensates for it using its movement unit. For this, too, are the above for synchronous movement
  • Designated linear compensation can be carried out by an additional movement of at least one of the two components in the X-Y direction.
  • the compensation during the movement and before the probe tips are placed on the test substrate is preferred in order to avoid damage to the contact surface as a result of the subsequent compensation.
  • the compensation can take place after the Z movement. If the inspection unit is moved for this purpose, the relative position between the test substrate and Probe holder unaffected.
  • the determination of the deviations is based on the distance still existing between the two contact partners during the Z movement, which leads to a displacement of the image field relative to the test substrate in the case of Z movements which do not run parallel. Such a deviation is in the
  • the position of the Z axes can be known
  • the prober for example from previous delivery movements or an analysis of the prober. In all cases, the
  • Linear compensation can be compensated for by countermoving movements during or after the Z movement
  • a prober which can be used to carry out the method has a positioning device which comprises movement units, at least one for the chuck and one for the
  • Inspection unit for executing movements of the chuck and inspection unit at least in the Z direction.
  • control unit for controlling both
  • Movement units configured such that movements of the chuck and the inspection unit can be carried out synchronously as described above.
  • each of the movement units can have its own control unit which is used to carry out the synchronous movement
  • the synchronous movement takes place in such a way that the focal plane is maintained, so that the observation point remains in focus on the test substrate.
  • Positioning device of the Prober a manipulator, which serves to move the chuck or the inspection unit.
  • the manipulator comprises a manipulator body, one
  • Control element for moving the manipulator body and a motion sensor. Objects that can be moved in such a way that one can measure clearly from your movement are considered as manipulator bodies
  • a clear direction of movement is guaranteed if the manipulator has exactly one degree of freedom in its movement.
  • the manipulator body can be a rotating body which is arranged rotatable about its axis of rotation.
  • the manipulator is operated by means of a suitable control element, which is based on the type of
  • Movement, for example rotation or displacement, of the manipulator body is coordinated.
  • Direction of movement and measure of movement are determined by means of a manipulator motion sensor which is configured accordingly.
  • a manipulator motion sensor which is configured accordingly.
  • Movement is the movement value generator relative to
  • Body of rotation is the motion encoder
  • Rotary value encoder which detects the direction of rotation and angle of rotation and is arranged, for example, axially to the rotating body.
  • more than one motion sensor can be used to determine the required measurement values.
  • the measured values are, if necessary preprocessed, transmitted to the at least one control unit.
  • Control signals are generated on the basis of the measured values, which control the movement of Chuck or
  • Movement value transmitter communicatively connected to the control unit.
  • the manipulator has at least one stop for limiting the movement of the manipulator body. It is advantageous if this stop is variable and / or adjustable for a defined distance in the Z direction. By the stop is adjustable, different end or
  • the at least one stop can be on the hardware side on the manipulator or on the software side, for example by means of the
  • Control unit can be realized.
  • both components can also be connected to such a movement unit.
  • the control unit is also set up on the hardware and software side, the corresponding, at least one
  • the invention is based on
  • FIGS. 2A and 2B show detailed views of an embodiment of a manipulator in perspective, as a view and in section, and
  • Fig. 3 shows a manipulator body with an adjustable stop.
  • the 1 comprises a chuck 2 with a movement unit 3 of the chuck.
  • the Chuck 2 can be moved in the X, Y and Z directions. The directions are through one
  • Coordinate system shown On the upper, horizontal receiving surface 4 there is a test substrate 5, for example a Wafer.
  • the wafer is contacted by means of probes 6, which are held by probe heads 7.
  • the probe heads are arranged on a probe holder plate 8.
  • an inspection unit 9 for example a camera, looks at the test substrate 5, specifically at the contact point, so that it can be depicted sharply.
  • the inspection unit 9 also has a
  • Movement unit 10 with which the inspection unit 9 can also be moved for example, in the X, Y and Z directions, but at least in the Z direction.
  • Movement units or brackets in the present case these are the chuck 2 and the inspection unit 9 with their
  • Movement units 3, 10 and the probe heads 7 with their probe holder plate 8 are fixed to the frame and thus statically determined to a common reference system
  • both movement units 3, 10 are communicatively connected, for example, but not by way of limitation, to a common control unit 11, which is configured for this in terms of hardware and software.
  • the probe 6 is in contact with the test substrate 5 by the chuck 2 in a
  • Inspection unit 9 is in its contact position Ki. In this, the focus of the inspection unit 9 is set on the surface of the wafer 5 and thus also on the tips of the probes 6 lying thereon. If the contact is to be released, the Chuck 2 is moved downwards (represented by an arrow). At the same time, the inspection unit 9 is also moved downward with the same distance in the Z direction (represented by the same arrow length). The movements can be up to an intermediate position Zc, Zi (each represented by a dashed line for the receiving surface 4 of the chuck 2 and the lower edge of the inspection unit 9) or an end position Ec, Ei (each represented by a dash-dot line for the receiving surface 4 of the chuck 2 and the lower edge of the inspection unit 9) take place. Due to the synchronous movement of chuck 2 and inspection unit 9, the set observation point 12 remains on the
  • Test substrate 5 in the exemplary embodiment that is one of the contact surfaces of the wafer, which is or was contacted by a probe tip, is always clearly visible during the movement of the chuck 2 into one of the lower positions.
  • the chuck 2 can be moved in the X and / or Y direction in order to approach another electronic component of the wafer and subsequently contact it by means of the probes 6.
  • the wafer 5 is raised by means of a chuck 2, for example, into an intermediate position Z c .
  • This intermediate position Z c can be in its Z coordinate with the previous and the
  • control unit 11 In the control unit 11 are synchronized with the
  • Control signals for moving the chuck 2 control signals for Movement of the inspection unit 10 first in the intermediate position Zi and analog for the inspection unit
  • the manipulator 13 itself is operated manually and controls a motor movement of the chuck 2.
  • the manipulator 13 comprises a manipulator body 20 which is designed as a cylindrical rotating body.
  • the manipulator body 20 is rotatable in a housing 21
  • a suitable connector 22 (Fig. 2B), an operating element 23, which in
  • Embodiment is designed as a lever 23, mounted so that the manipulator body 20 manually
  • Such a lever 23 is also for other movements
  • the lever 23 is guided in a frame 25 in that its contour corresponds to that contour of the frame 25.
  • Manipulator body 20 and thus its sensitivity can be varied by means of brakes 24.
  • brakes 24 In the exemplary embodiment, two brakes 24 are arranged, which apply an adjustable force to the lateral surface of the cylindrical manipulator body 20 to press .
  • Rotary encoder 26 which measures the direction of rotation and the angle of rotation. The measured values are optionally transmitted to the control unit 11 (FIG. 1) via a signal conductor 28 after preprocessing.
  • the manipulator body 20 and the rotary encoder 26 are protected from external influences by means of a cladding 27 and can be mounted on the prober (FIG. 1).
  • Manipulator body 30 is designed as a rotary knob 31 and can be locked in defined angular positions.
  • the rotary knob 31 is rotatable about its axis 32.
  • the pin 35 is guided through a guide slot 37 of a guide plate 36 arranged concentrically to the rotary knob 31 into one of the recesses 34 and in this way limits the executable rotary movement of the rotary knob 31 to the length of the guide slot 37. If another recess 34 is used, another one is different Rotational movement executable, whereby the executable by means of the movement units 3, 10
  • Movement length is modified.
  • Manipulators with different functions can support a haptic distinction via the design become .

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

L'invention concerne un procédé et un appareil de test (1) de la positionnement d'un substrat d'essai (5), de sondes (6) et d'une unité d'inspection (9) l'une par rapport à l'autre, dans lequel le substrat d'essai (5) et les sondes (6) sont orientés au moins dans le plan X-Y dans une position relative souhaitée et l'unité d'inspection (9) est déplacée dans une telle position Z sur la position relative, dans laquelle la focalisation de l'unité d'inspection (9) est réglée sur un point d'observation du substrat d'essai (5). Afin de simplifier et d'accélérer la poursuite de l'unité d'inspection (9), à partir de cette position de départ, le substrat d'essai (5) et l'unité d'inspection (9) sont déplacés vers la position Z de manière synchrone, de sorte que le niveau de focalisation soit maintenu.
EP19780142.6A 2018-09-07 2019-09-04 Procédé de positionnement d'un substrat d'essai, de sondes et d'une unité d'inspection l'un par rapport à l'autre, et appareil de test pour la mise en ?uvre de ce procédé Pending EP3847466A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018121911.3A DE102018121911A1 (de) 2018-09-07 2018-09-07 Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung
PCT/DE2019/100794 WO2020048567A1 (fr) 2018-09-07 2019-09-04 Procédé de positionnement d'un substrat d'essai, de sondes et d'une unité d'inspection l'un par rapport à l'autre, et appareil de test pour la mise en œuvre de ce procédé

Publications (1)

Publication Number Publication Date
EP3847466A1 true EP3847466A1 (fr) 2021-07-14

Family

ID=68109075

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19780142.6A Pending EP3847466A1 (fr) 2018-09-07 2019-09-04 Procédé de positionnement d'un substrat d'essai, de sondes et d'une unité d'inspection l'un par rapport à l'autre, et appareil de test pour la mise en ?uvre de ce procédé

Country Status (6)

Country Link
EP (1) EP3847466A1 (fr)
KR (1) KR20210055708A (fr)
CN (1) CN112585485A (fr)
DE (1) DE102018121911A1 (fr)
TW (1) TW202027227A (fr)
WO (1) WO2020048567A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111575A (ja) * 2022-01-31 2023-08-10 ヤマハファインテック株式会社 電気検査装置及び電気検査方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1211812B (de) * 1963-10-18 1966-03-03 Zeiss Carl Fa Optisches Beobachtungsinstrument, insbesondere Mikroskop, mit Einstrahlphotometer
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
AU2003218348A1 (en) * 2002-03-22 2003-10-13 Electro Scientific Industries, Inc. Test probe alignment apparatus
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Ｏｋｉセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
US8279451B2 (en) * 2010-06-09 2012-10-02 Star Technologies Inc. Probing apparatus with on-probe device-mapping function
DE102010040242B4 (de) * 2010-09-03 2014-02-13 Cascade Microtech Dresden Gmbh Modularer Prober und Verfahren zu dessen Betrieb
EP3034991B2 (fr) * 2014-12-19 2022-08-24 Hexagon Technology Center GmbH Procédé et dispositif de compensation des forces de déplacement avec une unité de sonde

Also Published As

Publication number Publication date
WO2020048567A1 (fr) 2020-03-12
KR20210055708A (ko) 2021-05-17
TW202027227A (zh) 2020-07-16
CN112585485A (zh) 2021-03-30
DE102018121911A1 (de) 2020-03-12

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