EP3793819B1 - Partial coverage multilayer damping laminate - Google Patents
Partial coverage multilayer damping laminate Download PDFInfo
- Publication number
- EP3793819B1 EP3793819B1 EP19728225.4A EP19728225A EP3793819B1 EP 3793819 B1 EP3793819 B1 EP 3793819B1 EP 19728225 A EP19728225 A EP 19728225A EP 3793819 B1 EP3793819 B1 EP 3793819B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- damping
- layer
- discontinuous
- additional
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000013016 damping Methods 0.000 title claims description 446
- 239000000463 material Substances 0.000 claims description 168
- 239000002131 composite material Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000011888 foil Substances 0.000 claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 229910001369 Brass Inorganic materials 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052790 beryllium Inorganic materials 0.000 claims description 5
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010951 brass Substances 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052762 osmium Inorganic materials 0.000 claims description 5
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 252
- 239000000853 adhesive Substances 0.000 description 47
- 230000001070 adhesive effect Effects 0.000 description 47
- 239000011347 resin Substances 0.000 description 37
- 229920005989 resin Polymers 0.000 description 37
- -1 e.g. Polymers 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 24
- 229920000642 polymer Polymers 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
- 229920002633 Kraton (polymer) Polymers 0.000 description 14
- 229920001971 elastomer Polymers 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- 239000000178 monomer Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 239000005060 rubber Substances 0.000 description 11
- 239000001993 wax Substances 0.000 description 11
- 239000004971 Cross linker Substances 0.000 description 10
- 239000000654 additive Substances 0.000 description 10
- 239000004014 plasticizer Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 150000002148 esters Chemical class 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 9
- 150000004706 metal oxides Chemical class 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 229920005549 butyl rubber Polymers 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 6
- 230000012447 hatching Effects 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 229920002367 Polyisobutene Polymers 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000013464 silicone adhesive Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 235000007586 terpenes Nutrition 0.000 description 5
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229920006132 styrene block copolymer Polymers 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002174 Styrene-butadiene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000004200 microcrystalline wax Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000011115 styrene butadiene Substances 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- 239000003981 vehicle Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000005909 Kieselgur Substances 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- 239000012963 UV stabilizer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- RTACIUYXLGWTAE-UHFFFAOYSA-N buta-1,3-diene;2-methylbuta-1,3-diene;styrene Chemical compound C=CC=C.CC(=C)C=C.C=CC1=CC=CC=C1 RTACIUYXLGWTAE-UHFFFAOYSA-N 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229920005556 chlorobutyl Polymers 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000005001 laminate film Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 150000003097 polyterpenes Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000003784 tall oil Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 229940124543 ultraviolet light absorber Drugs 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- HBKBEZURJSNABK-MWJPAGEPSA-N 2,3-dihydroxypropyl (1r,4ar,4br,10ar)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylate Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(=O)OCC(O)CO HBKBEZURJSNABK-MWJPAGEPSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- IBDVWXAVKPRHCU-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCCOC(=O)C(C)=C IBDVWXAVKPRHCU-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JVOMIJYJKIUFIK-UHFFFAOYSA-N 2-(4,6,11-trioxa-1-aza-5-silabicyclo[3.3.3]undecan-5-yloxy)ethanol Chemical compound O1CCN2CCO[Si]1(OCCO)OCC2 JVOMIJYJKIUFIK-UHFFFAOYSA-N 0.000 description 1
- UWRFNCCYPBVADT-UHFFFAOYSA-N 2-(5-bicyclo[2.2.1]hept-2-enyl)ethyl-[2-(5-bicyclo[2.2.1]hept-2-enyl)ethyl-dimethylsilyl]oxy-dimethylsilane Chemical compound C1C(C=C2)CC2C1CC[Si](C)(C)O[Si](C)(C)CCC1C(C=C2)CC2C1 UWRFNCCYPBVADT-UHFFFAOYSA-N 0.000 description 1
- QALLAEJZRWYAHS-UHFFFAOYSA-N 2-(5-bicyclo[2.2.1]hept-2-enyl)ethyl-[4-[2-(5-bicyclo[2.2.1]hept-2-enyl)ethyl-dimethylsilyl]phenyl]-dimethylsilane Chemical compound C1C(C=C2)CC2C1CC[Si](C)(C)C(C=C1)=CC=C1[Si](C)(C)CCC1C(C=C2)CC2C1 QALLAEJZRWYAHS-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- BVDBXCXQMHBGQM-UHFFFAOYSA-N 4-methylpentan-2-yl prop-2-enoate Chemical compound CC(C)CC(C)OC(=O)C=C BVDBXCXQMHBGQM-UHFFFAOYSA-N 0.000 description 1
- ZCILGMFPJBRCNO-UHFFFAOYSA-N 4-phenyl-2H-benzotriazol-5-ol Chemical class OC1=CC=C2NN=NC2=C1C1=CC=CC=C1 ZCILGMFPJBRCNO-UHFFFAOYSA-N 0.000 description 1
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910017089 AlO(OH) Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical class C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000285023 Formosa Species 0.000 description 1
- 241000588731 Hafnia Species 0.000 description 1
- 241000208202 Linaceae Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920005987 OPPANOL® Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000206607 Porphyra umbilicalis Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000826860 Trapezium Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- QALVNFIIACJLRR-UHFFFAOYSA-N [cyclohexyl-[cyclohexyl-bis[(dimethyl-$l^{3}-silanyl)oxy]silyl]oxy-(dimethyl-$l^{3}-silanyl)oxysilyl]oxy-dimethylsilicon Chemical compound C1CCCCC1[Si](O[Si](C)C)(O[Si](C)C)O[Si](O[Si](C)C)(O[Si](C)C)C1CCCCC1 QALVNFIIACJLRR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ORZGJQJXBLFGRP-WAYWQWQTSA-N bis(ethenyl) (z)-but-2-enedioate Chemical compound C=COC(=O)\C=C/C(=O)OC=C ORZGJQJXBLFGRP-WAYWQWQTSA-N 0.000 description 1
- AJCHRUXIDGEWDK-UHFFFAOYSA-N bis(ethenyl) butanedioate Chemical compound C=COC(=O)CCC(=O)OC=C AJCHRUXIDGEWDK-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- IHTWATXYZJSPOM-UHFFFAOYSA-N bis(ethenyl) oxalate Chemical compound C=COC(=O)C(=O)OC=C IHTWATXYZJSPOM-UHFFFAOYSA-N 0.000 description 1
- AALXAILNCMAJFZ-UHFFFAOYSA-N bis(ethenyl) propanedioate Chemical compound C=COC(=O)CC(=O)OC=C AALXAILNCMAJFZ-UHFFFAOYSA-N 0.000 description 1
- LUJYPGDNHQYBJE-UHFFFAOYSA-N bis[[2-(3-bicyclo[2.2.1]hept-2-enyl)ethyl-dimethylsilyl]oxy]-[bis[[2-(3-bicyclo[2.2.1]hept-2-enyl)ethyl-dimethylsilyl]oxy]-cyclohexylsilyl]oxy-cyclohexylsilane Chemical compound C=1C(C2)CCC2C=1CC[Si](C)(C)O[Si](O[Si](C)(C)CCC=1C2CCC(C2)C=1)(C1CCCCC1)O[Si](O[Si](C)(C)CCC=1C2CCC(C2)C=1)(O[Si](C)(C)CCC=1C2CCC(C2)C=1)C1CCCCC1 LUJYPGDNHQYBJE-UHFFFAOYSA-N 0.000 description 1
- OJLPCKNKLYMMBA-UHFFFAOYSA-N bis[[2-(5-bicyclo[2.2.1]hept-2-enyl)ethyl-dimethylsilyl]oxy]-dimethylsilane Chemical compound C1C(C=C2)CC2C1CC[Si](C)(C)O[Si](C)(C)O[Si](C)(C)CCC1C(C=C2)CC2C1 OJLPCKNKLYMMBA-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920005557 bromobutyl Polymers 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- DSSYKIVIOFKYAU-UHFFFAOYSA-N camphor Chemical compound C1CC2(C)C(=O)CC1C2(C)C DSSYKIVIOFKYAU-UHFFFAOYSA-N 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- BWOVZCWSJFYBRM-UHFFFAOYSA-N carbononitridic isocyanate Chemical compound O=C=NC#N BWOVZCWSJFYBRM-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- DUHRTKROMQPNOO-UHFFFAOYSA-N cyclohexyl-[cyclohexyl-bis[[ethenyl(dimethyl)silyl]oxy]silyl]oxy-bis[[ethenyl(dimethyl)silyl]oxy]silane Chemical compound C1CCCCC1[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)O[Si](O[Si](C)(C)C=C)(O[Si](C)(C)C=C)C1CCCCC1 DUHRTKROMQPNOO-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- WNMORWGTPVWAIB-UHFFFAOYSA-N ethenyl 2-methylpropanoate Chemical compound CC(C)C(=O)OC=C WNMORWGTPVWAIB-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- ILHMPZFVDISGNP-UHFFFAOYSA-N ethenyl n-[3-tris(trimethylsilyloxy)silylpropyl]carbamate Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)CCCNC(=O)OC=C ILHMPZFVDISGNP-UHFFFAOYSA-N 0.000 description 1
- BLZSRIYYOIZLJL-UHFFFAOYSA-N ethenyl pentanoate Chemical compound CCCCC(=O)OC=C BLZSRIYYOIZLJL-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000004968 halobutyl group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- WTFXARWRTYJXII-UHFFFAOYSA-N iron(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+2].[Fe+3].[Fe+3] WTFXARWRTYJXII-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000891 luminescent agent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- USUBUUXHLGKOHN-UHFFFAOYSA-N methyl 2-methylidenehexanoate Chemical compound CCCCC(=C)C(=O)OC USUBUUXHLGKOHN-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229920006030 multiblock copolymer Polymers 0.000 description 1
- ZVVYXQFZOLGBKC-UHFFFAOYSA-N n'-[(4-ethenylphenyl)methyl]-n-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCNCC1=CC=C(C=C)C=C1 ZVVYXQFZOLGBKC-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- VLTOSDJJTWPWLS-UHFFFAOYSA-N pent-2-ynal Chemical compound CCC#CC=O VLTOSDJJTWPWLS-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000009260 qiming Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
- B32B9/025—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch comprising leather
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/042—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of wood
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
- B32B2307/102—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/08—Cars
Definitions
- the present disclosure relates generally to multilayer damping laminates useful for dissipating vibrations.
- the noise and vibration issues have been managed through two approaches: the stiffening of the structure geometry to be more resistant to vibration, and the damping of the structure to reduce the vibration amplitude.
- acoustic technologies can be used to absorb, reflect, and isolate sound waves from their source, for example before they reach a passenger in an automotive cabin.
- Structural damping approaches can involve the application of damping tapes or laminates that include a stiffening or constraining carrier material and a damping material. These constraining and damping materials are typically configured in a stacked arrangement that can be adhered to a structure to absorb and dissipate vibrational energy. In order to achieve desired vibration damping characteristics however, these damping tapes typically are relatively thick, include large amounts of costly adhesive, and can significantly add to the overall weight of the system to which they are applied. Accordingly, a need remains for damping laminates with improved vibrational reduction and/or a decrease in material requirements that are also cost- and weight-effective.
- the disclosure is to a multilayer damping laminate having a peak composite loss factor at about 200 Hz that is greater than about 0.05.
- the multilayer damping laminate may comprise at least one constraining layer that may have a thickness ranging from about 5 ⁇ m to about 3000 ⁇ m.
- at least one constraining layer comprises a metal.
- the multilayer damping laminate may further comprise a discontinuous damping layer that having a thickness ranging from about 2 ⁇ m to about 5000 ⁇ m.
- the discontinuous damping layer is directly adjacent to at least one constraining layer.
- the discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein a percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 99%. In many embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than 90%. In other embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 80%. In many embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 70%. In still other embodiments, the percent coverage of the by the one or more damping material regions is greater than about 50%. An average width of the one or more gap regions is less than about 0.200 cm.
- the multilayer damping laminate further comprises a liner layer connected to the first damping layer opposite at least one constraining layer.
- the discontinuous damping layer is a first discontinuous damping layer
- at least one constraining layer is an internal constraining layer
- the multilayer damping laminate further comprises at least one additional discontinuous damping layer and an external constraining layer.
- at least a portion of the internal constraining layer may be disposed between the first discontinuous damping layer and at least one additional discontinuous damping layer, and at least a portion of at least one additional discontinuous damping layer may be disposed between the internal constraining layer and the external constraining layer.
- At least one additional discontinuous damping layer comprises one or more additional discontinuous layer damping material regions and one or more additional discontinuous damping layer gap regions.
- the percent coverage of the external constraining layer by the one or more additional discontinuous damping layer damping material regions may be less than about 99%.
- the disclosure is to a system comprising a multilayer damping laminate as described above.
- the system further comprises a base substrate connected to the discontinuous damping layer of the multilayer damping laminate.
- the disclosure is to a method of reducing a vibration of a base substrate.
- the method comprises providing a base substrate that is subject to a vibration.
- the method further comprises connecting the base substrate to the discontinuous damping layer of a multilayer damping laminate as described above.
- the present disclosure generally relates to multilayer damping laminates that, when employed for example on a base substrate subject to vibration, provide advantageous improvements in stiffness and reductions in vibration while reducing the amount of damping material included in the laminates.
- it is beneficial to minimize the frequency and/or amplitude of any vibrations of the structure.
- Such vibrational reductions beneficially increase the stability of the structure, reduce fatigue and stress, lengthen operational lifetime, and decrease undesired vibration side effects, such as the generation of noise or the discomfort of vehicle passengers.
- damping treatments such as laminates or tapes include constraining elements and damping elements configured to be attached to vibrating structures. These treatments, referred to as constrained layer damping treatments, can decrease the occurrence and intensity of vibrations observed with the structure to which the treatments are attached.
- the constraining layers and the damping layers of the treatment are typically applied together in a stacked configuration wherein the stiffening and damping layers are substantially coextensive with one another.
- the layers of conventional constrained damping devices may be each substantially continuous sheets of material having uniform thickness and no intentional holes or gaps.
- discontinuous damping layers in multilayer damping laminates, advantageous improvements in damping performance can be surprisingly realized.
- the effectiveness and efficiency of constrained layer damping laminates can be enhanced if the damping layers are composed of one or more gap regions, such that one or more damping material regions of the layers do not provide complete coverage of the constraining layers of the laminate.
- the discontinuous nature of the disclosed damping layers allows them to be manufactured using less damping material. This can have a significant impact in advantageously reducing the production cost of these damping treatments.
- the decrease in materials can allow an end user to achieve an enhanced effect in damping a structure, while reducing the total damping product mass applied per unit surface area of the structure.
- a multilayer damping laminate having improved damping performance is disclosed.
- the damping performances of a damping laminate and its component damping layers can be described in terms of their composite loss factor (CLF) properties.
- CLF composite loss factor
- the composite loss factor of a material or device is a measure of its ability to convert vibrational energy to thermal energy.
- the materials or compositions of individual layers selected as being highly damping can have composite loss factors of 0.8 or larger.
- the total composite loss factor of the overall construction is generally considered effective at values of 0.05 or larger.
- the composite loss factor of the multilayer damping laminate can be determined, for example, as described in the standard protocol ASTM E756-05 (2017).
- the disclosed multilayer damping laminate described herein has a peak composite loss factor at 200 Hz that is greater than about 0.050, e.g., greater than about 0.060, greater than about 0.070, greater than about 0.080, greater than about 0.090, greater than about 0.100, greater than about 0.200, greater than about 0.300, greater than about 0.400, or greater than about 0.500.
- the multilayer damping laminate comprises at least one constraining layer and at least one discontinuous damping layer.
- the discontinuous damping layer includes one or more damping material regions and one or more gap regions.
- the damping material regions are portions of the discontinuous damping layer that each comprise one or more damping materials selected for high elasticity, anelasticity, viscosity, and/or viscoelasticity.
- the gap regions are portions of the discontinuous damping layer that each may comprise one or more materials having lower elasticity, anelasticity, viscosity, and/or viscoelasticity that those of the damping material regions.
- Each of the one or more gap regions of the damping layer may be bound by the one or more damping material regions, one or more edges of the discontinuous damping layer, or a combination thereof.
- the presence of the one or more gap regions in the damping layer causes the one or more damping material regions to provide incomplete coverage of at least one constraining layer, e.g., the damping material regions are not substantially coextensive with at least one constraining layer.
- cover and “percent coverage” refer to the fraction of the constraining layer area covered by a projection of the damping layer regions onto the plane of the constraining layer. This leads to the benefit of a reduction of materials and a resulting reduction in mass in the multilayer damping laminates.
- certain discontinuous damping laminate layer configurations also provide the advantageous benefit of increased damping performance.
- the percent coverage of the discontinuous damping layer by the damping material regions can, for example, range from about 50% to about 99%, e.g., from about 60% to about 90%, from about 70% to about 86%, from about 72% to about 90%, from about 75% to about 93%, from about 78% to about 96%, or from about 80% to about 99%.
- the percent coverage of at least one constraining layer by the damping material regions can be less than about 99%, e.g., less than about 96%, less than about 93%, less than about 90%, less than about 86%, less than about 83%, less than about 80%, less than about 78%, less than about 75%, or less than about 72%.
- the percent coverage of at least one constraining layer by the damping material regions can be greater than about 50%, e.g., greater than about 55%, greater than about 60%, greater than about 65%, greater than about 70%, greater than about 72%, greater than about 75%, greater than about 78%, greater than about 80%, greater than 83%, greater than about 86%, greater than about 90%, greater than about 93%, or greater than about 96%.
- the percent coverage of at least one constraining layer by the damping material regions may also be less than or equal to 90%. Higher percent coverages, e.g., greater than about 99%, and lower percent coverages, e.g., less than 50%, are also contemplated.
- the limits for the higher percent coverages and lower percent coverages may vary due to factors that include, but are not limited to, specific geometry, thickness, and adhesive rheology.
- the damping layer may provide a pattern or other configuration.
- the damping layer includes a single damping material region and a single gap region, that are together arranged in one more serpentine ( FIG. 1A ) or spiraling ( FIG. 1B ) configurations to maintain small region widths.
- the damping material region can have a serpentine shape within the gap region, or the gap region can have a serpentine shape within the damping region.
- the damping material region can have one or more spiral-shaped portions within the gap region, or the gap region can have one or more spiral-shaped portions within the damping material region.
- the damping layer includes a single damping material region and multiple gap regions.
- the single damping material region and multiple gap regions can, for example, be arranged in a crosshatched configuration in which the damping material region forms the borders of the hatching and the gap regions form the interiors of the hatching.
- the damping layer may alternatively lack a pattern or other configuration. In this non-pattern, there may be gaps and damping material region(s) with irregular shapes and/or spacing. In other embodiments, there may be a combination of both configurations/portions and non-patterns.
- the shape the patterns for the damping region and gap region in the discontinuous damping layer can be generalized in the following manner: 1) the damping regions can be a union of infinitely many disjoint subsets Di of the discontinuous damping layer and the gap regions are the complement of the union of infinitely many disjoint subsets Di; or 2) alternatively, the gap regions can be an union of infinitely many disjoint subsets Gi of the discontinuous damping layer and the damping region can be the complement of the union of infinitely many disjoint subsets Gi.
- i is an indexing variable ranging from 1 to infinity.
- the disjoint subsets Di (or Gi) may be closed and connected, or closed and locally connected.
- disjoint subsets Di can be the union of infinitely many non-disjoint non-empty connected subsets.
- Examples of the connected subset Di (or Gi) are the following.
- the subset Di can be any n -sided polygon that can be convex, concave, equilateral, equiangular, spherical, aperiogon, self-intersecting or the Euclidean realization of an abstract polytope.
- n is the number of sides of the polygon and it can range from 1 to infinity.
- Examples may include, but are not limited to, any regular convex polygon, regular or skewed quadrilateral that can encompass regular or skewed paralleglograms, trapeziums, rhombus, kites, self-intersecting quadrilaterals, antiparallegorrams, star polygons, crossed rectangles, Saccheri quadrilaterals, and any closed Euclidean set that can be either convex or concave.
- the subsets Di (or Gi) can be arranged in any pattern such their intersection in any manner of consideration is a null-set.
- Examples can include, but are not limited to, parallel stacking of Dis separated by a gap region (or Gis separated by a damping region), Euclidean tilings, uniform tilings, aperiodic tilings, spiral tilings, convex or concave uniform tilings to name a few.
- the damping layer includes a single gap region and multiple damping material regions.
- the single gap region and multiple damping material regions can, for example, be arranged in a crosshatched configuration ( FIG. 1C ) in which the gap material region forms the borders of the hatching and the damping material regions form the interiors of the hatching.
- the damping material region forms the borders of the hatching and the gap regions form the interiors of the hatching.
- the damping layer includes multiple damping material regions and multiple gap regions, that are together arranged in a checkerboard-like pattern ( FIG. 1D ); a series of straight ( FIG. 1E ), angled, zigzag ( FIG. 1F ), or curved lines; circles; or any combination of polygons.
- the arrangement of the one or more damping material regions and the one or more gap regions can be in a pattern of one or more repeating blocks, or can lack such a pattern.
- the damping material regions may have a substantially random configuration.
- the damping material regions and gap regions of the discontinuous damping layer have substantially rectangular shapes that are substantially parallel to one another.
- the rectangular shapes of damping material regions can have similar or different average widths.
- the rectangular shapes of the damping material regions can have similar or different lengths.
- the rectangular shapes of the gap regions can have similar or different widths.
- the rectangular shapes of the gap regions can have similar or different lengths.
- the damping material regions can, for example, be substantially parallel or substantially perpendicular to the structure or substrate.
- the damping material regions of the discontinuous damping layer of the laminate can be substantially parallel or substantially perpendicular to the beam.
- reference to the width of a region is used to denote the distance from a point on the lengthwise border of a region to the closest point on an opposite border of the region, wherein the lengthwise border is the border having the largest path length.
- reference to the average width of a region is used to denote the average of the width as measured at all points along the lengthwise border.
- reference to the average width of multiple regions is used to denote the average of the average widths of all such regions.
- average width of the one or more gap regions of the discontinuous damping layer is the average of the average widths of each gap region in the damping layer.
- the average width of the gap regions of the discontinuous damping layer can, for example, range from about 0.010 cm to about 0.124 cm, from about 0.029 cm to about 0.143 cm, from about 0.048 cm to about 0.162 cm, or from about 0.067 cm to about 0.181 cm. In terms of upper limits, the average width of the gap regions is less than about 0.200 cm, e.g., less than about 0.181 cm, less than about 0.162 cm, less than about 0.143 cm, less than about 0.124 cm, less than about 0.105 cm, less than about 0.086 cm, less than about 0.067 cm, less than about 0.048 cm, or less than about 0.029 cm.
- the average width of the gap regions can be greater than 0.010 cm, e.g., greater than about 0.029 cm, greater than about 0.048 cm, greater than about 0.067 cm, greater than about 0.086 cm, greater than about 0.105 cm, greater than about 0.124 cm, greater than about 0.143 cm, greater than about 0.162 cm, or greater than about 0.181 cm. Smaller widths, e.g., less than about 0.010 cm, are also contemplated.
- the average width of the damping material regions of the discontinuous damping layer can, for example, range from about 0.050 cm to about 1.000 cm, e.g., from about 0.050 cm to about 0.900 cm, from about 0.050 cm to about 0.800 cm, from about 0.050 cm to about 0.700 cm, from about 0.050 cm to about 0.620 cm, from about 0.145 cm to about 0.715 cm, from about 0.240 cm to about 0.810 cm, from about 0.335 cm to about 0.905 cm, or from about 0.430 cm to about 1.000 cm.
- the average width of the damping material regions can be less than about 1.000 cm, e.g., less than about 0.905 cm, less than about 0.810 cm, less than about 0.715 cm, less than about 0.620 cm, less than about 0.525 cm, less than about 0.430 cm, less than about 0.335 cm, less than about 0.240 cm, or less than about 0.145 cm.
- the average width of the damping material regions can be greater than about 0.050 cm, e.g., greater than about 0.145 cm, greater than about 0.240 cm, greater than about 0.335 cm, greater than about 0.430 cm, greater than about 0.620 cm, greater than about 0.715 cm, greater than about 0.810 cm, or greater than about 0.905 cm.
- the average width of the damping material regions of the discontinuous damping layer can, for example, be less than or equal to about 1.000 cm. Larger widths, e.g., greater than about 1.000 cm, and smaller widths, e.g., less than about 0.050 cm, are also contemplated.
- the thickness of the discontinuous damping layer can, for example, range from about 2 ⁇ m to about 5000 ⁇ m, e.g., from about 2 ⁇ m to about 220 ⁇ m, from about 4.4 ⁇ m to about 480 ⁇ m, from about 9.6 ⁇ m to about 1000 ⁇ m, from about 21 ⁇ m to about 2300 ⁇ m, or from about 46 ⁇ m to about 5000 ⁇ m.
- the thickness of the discontinuous damping layer can be less than about 5000 ⁇ m, e.g., less than about 2300 ⁇ m, less than about 1000 ⁇ m, less than about 480 ⁇ m, less than about 220 ⁇ m, less than about 100 ⁇ m, less than about 46 ⁇ m, less than about 21 ⁇ m, less than about 9.6 ⁇ m, or less than about 4.4 ⁇ m.
- the thickness of the discontinuous damping layer can be greater than about 2 ⁇ m, greater than about 4.4 ⁇ m, greater than about 9.6 ⁇ m, greater than about 21 ⁇ m, greater than about 46 ⁇ m, greater than about 100 ⁇ m, greater than about 220 ⁇ m, greater than about 480 ⁇ m, greater than about 1000 ⁇ m, or greater than about 2300 ⁇ m. Larger thicknesses, e.g., greater than about 5000 ⁇ m, and smaller thicknesses, e.g., less than about 2 ⁇ m, are also contemplated.
- the damping material of each of the damping material regions can include elastic, anelastic, viscous, and/or viscoelastic materials.
- the damping material can be compressible and can comprise a restorative force.
- the damping materials can include rubber, plastic, e.g., nylon, leather, fabric, foam, sponge, gel, or the like.
- the damping material includes one or more adhesives.
- the damping material includes one or more pressure sensitive adhesives.
- the adhesive may be acrylic, rubber, silicone, hybrid, butyl, polyurethane, olefin, polyester or a combination of these adhesives.
- the damping materials can include one or more silicone adhesives.
- the silicone adhesives can include polyorganosiloxane dispersions or gums, such as polydimethylsiloxanes, polydimethyl/methylvinyl siloxanes, polydimethyl/methylphenyl siloxanes, polydimethyl/diphenyl siloxanes, and blends thereof.
- the silicone adhesives can include silicone resins, such as MQ resins or blends of resins.
- Non-limiting examples of such silicone adhesive compositions which are commercially available include adhesives 7651, 7652, 7657, Q2-7406, Q2-7566, Q2-7735 and 7956, all available from Dow Corning (Midland, MI); SILGRIP TM PSA518, 590, 595, 610, 915, 950 and 6574 available from Momentive Performance Materials (Waterford, NY); and KRT-009 and KRT-026 available from Shin-Etsu Silicone (Akron, OH).
- damping materials can comprise one or more rubber-based adhesives.
- Rubber-based adhesive comprised of combinations of styrene block copolymers and various tackifying resins, oils, fillers, pigments and antioxidants.
- a wide array of rubber agent(s) can be used in the adhesives of the present subject matter tapes.
- Nonlimiting examples of suitable rubber agents include but are not limited to polymers or copolymers of styrene-butadiene (SB), styrene-butadiene-styrene (SBS), styrene-isoprene (SI), styrene-isoprene-styrene (SIS), random styrene-butadiene (SBR), styrene-butadiene-isoprene multi-block (SBIBS), or polyisoprene.
- SB styrene-butadiene
- SI styrene-isoprene
- SI styrene-isoprene-styrene
- SI styrene-isoprene-styrene
- SI styrene-isoprene-styrene
- SI styrene-isoprene-st
- styrene-butadine-styrene examples include KRATON D1101 and KRATON D1118 from Kraton Performance Polymers and VECTOR 2518D from Dexco Polymers.
- suitable styrene-isoprene-styrene examples include KRATON D 1107P and VECTOR 411A.
- An example of a suitable styrene-butadiene-isoprene multi-block (SBIBS) is KRATON S6455.
- Kraton GRP-6924 is an example of a hydrogenated styrene block copolymer.
- the styrene-butadiene copolymer(s) component of the adhesive compositions used in the present subject matter may be block or multi-block copolymers having the general configuration: A-B-A or A-B-A-B-A-B- wherein the non-elastomeric polymer blocks A are styrene, while the elastomeric polymer blocks B are butadiene or butadiene which is partially or substantially hydrogenated.
- the polymeric blocks may be linear or branched. Typical branched structures may contain an elastomeric portion with at least three branches which can radiate out from a central hub or can be otherwise coupled together.
- combinations of at least one silicone adhesive and at least one rubber adhesive may be used in the damping materials.
- the damping materials may comprise a wide array of solid resin(s).
- solid resin refers to any resin which is solid at room/ambient temperature (about 23 °C) and which is compatible with the other components of the adhesive.
- Nonlimiting examples of such include aliphatic hydrocarbons such as from C5 to C9, hydrogenated ester rosins, partially hydrogenated ester rosins, aromatic modified ester resins, pentaerythritol resins, hydrogenated pentaerythritol resins, terpene resins, glycerol ester rosin resins, pentaerythritol tall oil, terpene phenolics, glycerol ester rosin resin, and combinations thereof.
- suitable aliphatic hydrocarbons used as solid resin(s) include ESCOREZ 1310 and ESCOREZ 2101 available from Exxon Mobile.
- Examples of a suitable hydrogenated ester rosin is FORAL 85 available from several suppliers such as Eastman Chemical and HERCOLYN D from Pinova.
- An example of a suitable partially hydrogenated ester rosin is FORALYN from Eastman Chemical.
- An example of a suitable aromatic modified ester resin is PICCOTAC 7590 from Eastman Chemical.
- An example of a suitable pentaerythritol resin is PEXALYN 9100 from Pinova.
- An example of a suitable hydrogenated pentaerythritol resin is PENTALYN H from Eastman Chemical.
- An example of a suitable pentaerythritol tall oil resin is SYLVALITE RE 105L from Arizona Chemical.
- An example of a suitable terpene phenolic is PICCOLYTE A115 from Eastman Chemical.
- An example of a commercially available glycerol ester gum rosin resin is RESINALL 625 available from Resinall Corporation.
- the damping materials may also comprise a variety of liquid resin(s) used in the adhesive(s) of the present subject matter sealing tapes.
- liquid resin refers to any resin which is liquid at room/ambient temperature (about 23 °C) and which is compatible with the other components of the adhesive.
- a variety of liquid resin(s) can be used in the adhesives of the present subject matter sealing tapes.
- Nonlimiting examples of such liquid resin(s) include hydrogenated resin ester, terpene resins, low molecular weight hydrocarbons such as for example C5 hydrocarbons, and combinations thereof.
- An example of a suitable terpene resin is SYLVARES TR A25 available from Arizona Chemical.
- An example of a suitable C5 hydrocarbon is WINGTAC 10 available from numerous suppliers.
- An example of a suitable modified rosin resin for use in the adhesive(s) of the present subject matter sealing tapes is STAYBELITE-E ESTER 3-E which is an ester of hydrogenated rosin. STAYBELITE-E is available from Eastman Chemical.
- combinations of at least one liquid resin and at least one solid resin may be used in the damping materials.
- the damping material regions comprise a pressure sensitive adhesive.
- the damping and bonding layers can comprise a butyl rubber or polyisobutylene based pressure sensitive adhesive.
- These adhesives can be formulated from mixtures of various molecular weight butyl rubber or polyisobutylene polymers or oligomers.
- Non-limiting examples of butyl rubber grades useful for formulating these adhesives include Exxon Butyl 065, Butyl 365, Chlorobutyl 1065, Chlorobutyl 1055, Bromobutyl 2222 and Exxpro Specialty Elastomer 3433 from ExxonMobil Chemical and polyisobutylene grade Oppanol N50 from BASF.
- these polymers are often blended with a low molecular weight grade of polyisbutylene such as TPC 750, TPC 1600 or TPC 3500 from TPC Group.
- these adhesive can be formulated with a wide variety of tackifying resins including C5-C9 hydrocarbon tackifiers as well as polyterpene resins.
- Suitable hydrocarbon tackifying resins include ESCOREZ 1310 and ESCOREZ 2101 available from ExxonMobil.
- Examples of polyterpene resins include Piccolyte A115 and Piccolyte S25 available from Pinova.
- butyl rubber and polyisobutylene based adhesives may also contain additives such as, but not limited to, plasticizing oils, antioxidants, pigments and fillers.
- additives such as, but not limited to, plasticizing oils, antioxidants, pigments and fillers.
- curing agents may be added which allow for cross-linking. Examples of these cross-linkers are zinc oxide, phenol resins and others known in the art.
- the damping materials can comprise an acrylic-based or silicone-based monomer.
- the damping materials comprise one or more acrylic-based monomers selected from the group consisting of methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, isobornyl acrylate, isononyl acrylate, isodecyl acrylate, methylacrylate, methyl methacrylate, methylbutyl acrylate, 4-methyl-2-pentyl acrylate, butyl methacrylate, 2-ethylhexyl methacrylate, and isooctyl methacrylate.
- Useful alkyl acrylate esters include n-butyl acrylate, 2-ethyl hexyl acrylate, isooctyl acrylate.
- the acrylic ester monomer is polymerized in the presence of a vinyl ester such as vinyl acetate, vinyl butyrate, vinyl propionate, vinyl isobutyrate, vinyl valerate, vinyl versitate, and the like.
- the vinyl ester can be present in a total amount of up to about 35 wt%, based on total weight of the monomers forming the acrylate main chain.
- an acrylic ester monomer is copolymerized with an unsaturated carboxylic acid.
- the unsaturated carboxylic acid can include, among others, acrylic acid, methacrylic acid, itaconic acid, beta carboxy ethyl acrylate and the like.
- the damping materials comprise one or more silicone-based monomers selected from the group consisting of siloxanes, silane, and silatrane glycol.
- the damping materials comprise one or more silicone-based monomers selected from the group consisting of 1,4-bis[dimethyl[2-(5-norbornen-2-yl)ethyl]silyl]benzene; 1,3-dicyclohexyl-1,1,3,3-tetrakis(dimethylsilyloxy)disiloxane; 1,3-dicyclohexyl-1,1,3,3-tetrakis(dimethylvinylsilyloxy)disiloxane; 1,3-dicyclohexyl-1,1,3,3-tetrakis[(norbornen-2-yl)ethyldimethylsilyloxy]disiloxane; 1,3-divinyltetramethyldisiloxane; 1,1,3,3,5,5-hexyl-1,1,3,
- the damping materials can comprise a silicone polymer, an acrylic polymer, or a methacrylic polymer.
- Suitable acrylic polymers include, but are not limited to, S2000N, S692N, AT20N, XPE 1043, and XPE 1045, all available from Avery Dennison (Glendale, CA); and H9232 available from BASF (Florham Park, NJ).
- the acrylic polymer composition is blended with multiblock copolymers such as styreneisoprene-styrene (SIS), styrene-ethylenebutylene-styrene (SEBS) and the like in an amount of up to about 30% by dry weight of the polymer.
- SIS styreneisoprene-styrene
- SEBS styrene-ethylenebutylene-styrene
- Multiblock polymers can be useful in modifying the damping peak and other physical properties of the acrylic composition.
- Other damping materials may comprise a rubber polymer. Suitable rubber polymers include, but are not limited to, elastomers, butyl rubber, styrenic block copolymer (known as SBCs, from example, Kraton), silicone rubber, nitrile rubber, isoprene, butadiene.
- SBCs styrenic block copolymer
- the rubber polymer composition may be blended with an acrylic polymer and/or acrylic polymer.
- a wide array of functional groups can be incorporated in a polymer of the damping materials.
- the functional groups can be incorporated into the polymer formed from the acrylic-based monomer or the silicon-based monomer, for example as end segments.
- Representative functional groups include, without limitation, hydroxy, epoxy, cyano, isocyanate, amino, aryloxy, aryalkoxy, oxime, aceto, epoxyether and vinyl ether, alkoxymethylol, cyclic ethers, thiols, benzophenone, acetophenone, acyl phosphine, thioxanthone, and derivatives of benzophenone, acetophenone, acyl phosphine, and thioxanthone.
- an acrylic polymer backbone of the damping materials includes the polar comonomers vinyl pyrrolidone and acrylic acid.
- examples of other monomers with hydrogen-bonding functionality include methacrylic acid, vinyl alcohol, caprolactone, ethylene oxide, ethylene glycol, propylene glycol, 2-hydroxyethyl acrylate, N-vinyl caprolactam, acetoacetoxyethyl methacrylate and others.
- the damping materials comprise one or more co-monomers bearing a functionality that can be further crosslinked.
- crosslinkable co-monomers include (meth) acrylic acid, 2-hydroxyethyl acrylate, glycidyl methacrylate, itaconic acid, allyl glycidyl ether and the like, and mixtures thereof.
- Functional moieties such as those described above, can be used to crosslink polymer chains, to attach the high side chains to the backbone, or both.
- the damping materials can further comprise a crosslinker, which can vary widely.
- suitable crosslinkers include multifunctional acrylates and methacrylates, such as diacrylates (ethylene glycol diacrylate, propylene glycol diacrylate, polyethylene glycol diacrylate, and hexanediol diacrylate), dimethacrylates (ethylene glycol diacrylate, diethylene glycol dimethacrylate, and 1,3 butane glycol dimethacrylate), triacrylates (trimethylolpropane trimethacrylate, ethoxylated trimethylolpropane triacrylate, and pentaerythritol triacrylate), and trimethacrylates (pentaerythritol trimethacrylate and trimethylolpropane trimethacrylate), as well as divinyl esters, such as divinylbenzene, divinyl succinate, divinyl adipate, divinyl maleate, divinyl oxalate, and divinyl malonate
- crosslinkers can be employed to form crosslinks in a silicone-based matrix.
- a peroxide crosslinker such as dibenzoylperoxide
- the crosslinker is a compound that contains silicon-hydride functionality.
- Non-limiting examples of such crosslinkers include PEROXAN BP 50W, PEROXAN BIC, and PEROXAN Bu, all available from Pergan (Bocholt, Germany); LUPEROX ® A75 and A98 commercially available from Arkema (King of Prussia, PA); and PERKADOX ® CH-50 and PD 50SPS from Akzo Nobel (Chicago, IL).
- Crosslinking can be facilitated and/or promoted by heating or other techniques generally depending upon the chemical system employed.
- exemplary chemical crosslinkers that can be used in the damping materials include, but are not limited to, di-, tri- or poly-isocyanates with or without a catalyst (such as dibutyltin dilaureate); ionic crosslinkers; and di-, tri- or poly-functional aziridines.
- exemplary, non-limiting examples of commercially available chemical crosslinkers include aluminum acetyl acetonate (AAA) available from NOAH Technologies (San Antonio, T'X); TYZOR ® available from DuPont (Wilmington, DE); XAMA ® available from Bayer (Pittsburgh, PA); and PAPI TM and VORONATE TM , available from Dow Chemical.
- the damping materials can optionally comprise one or more tackifiers or resins, and these tackifiers (when employed) can vary widely.
- the tackifier of the damping materials includes a single tackifier.
- the tackifier comprises a mixture of multiple tackifier products.
- Suitable commercial tackifiers include (but are not limited to), for example, hydrogenated DCPD resins such as HD1100, HD1120 from Luhua (China), and E5400 from Exxon Mobil (Houston, TX).
- Suitable hydrogenated resins include fully hydrogenated resins such as REGALITE TM S1100, R1090, R1100, C100R, and C100W from Eastman (Kingsport, TN); and fully hydrogenated C9 resins QM-100A and QM-115A from Hebei Qiming (China).
- the damping materials can also optionally comprise one or more plasticizers, and these plasticizers (when employed) can vary widely.
- the plasticizer has a high molecular weight and/or a high viscosity.
- the plasticizer includes a single plasticizer.
- the plasticizer comprises a mixture of multiple plasticizer products.
- Suitable commercial plasticizers include (but are not limited to), for example, KN 4010 and KP 6030 from Sinopec (Beijing, China); Claire F55 from Tianjin (China); F550 from Formosa Petrochemical (China), and various polyisobutene products.
- the damping materials can optionally comprise one or more waxes, and these waxes (when employed) can vary widely.
- the wax includes a single wax.
- the wax comprises a mixture of multiple wax products.
- the wax can have a higher molecular weight so as to advantageously improve oil migration.
- Exemplary waxes include microcrystalline waxes, paraffin waxes, hydrocarbon waxes, and combinations thereof.
- Suitable commercial waxes include (but are not limited to), for example, Sasol wax 3971, 7835, 6403, 6805, and 1800 from Sasol (Houston, TX); A-C1702, A-C6702, A-C5180 from Honeywell (Morristown, NJ); and MICROWAX TM FG 7730 and MICROWAX TM FG 8113 from Paramelt (Muskegon, MI).
- the damping materials can comprise one or more powder additives selected to improve damping performance across a broader range of operating temperatures.
- the damping materials comprise one or more acrylic-based powder additives.
- Suitable commercially available acrylic-base powder additives include SPHEROMERS ® CA 6, SPHEROMERS ® CA 10, SPHEROMERS ® CA 15, KRATON ® SBS 1101 AS, KRATON ® SB 1011 AC, KRATON ® TM 1116 Polymer, KRATON ® D1101 A Polymer, KRATON ® D1114 P Polymer KRATON ® D1114 P Polymer, Zeon NIPOL ® 1052, Zeon NIPOL ® 1041, and Zeon NIPOL ® NS 612.
- the damping materials comprise one or more silicone-based powder additives.
- Suitable commercially available silicone-base powder additives include Shin-Etsu KMP 597, Shin-Etsu KMP 600, and Shin-Etsu KMP 701.
- the damping materials include one or more high surface area inorganic fillers or combinations of fillers and pigments such as carbon black, calcium carbonate, titanium dioxide, silica (hydrophilic and hydrophobic modified), mica, talc, kaolin, clay, diatomaceous earth, barium sulfate, aluminum sulfate, or mixtures of two or more thereof.
- high surface area inorganic fillers include those available from Evonik Degussa GmbH (Essen, Germany).
- Inorganic fillers including the foregoing examples can be used to modulate the damping and other physical properties of the damping patch.
- a wide variety of organic fillers could also or alternatively be used.
- a useful filler combination includes an anti-blocking agent which is chosen depending on the processing and/or use conditions.
- anti-blocking agents include, for example, silica, talc, diatomaceous earth, and any mixtures thereof.
- the filler particles can be finely divided substantially water-insoluble inorganic filler particles.
- the finely divided substantially water-insoluble inorganic filler particles can include particles of metal oxides.
- the metal oxide constituting the particles can be a simple metal oxide, i.e., the oxide of a single metal, or it can be a complex metal oxide, i.e., the oxide of two or more metals.
- the particles of metal oxide can be particles of a single metal oxide or they can be a mixture of different particles of different metal oxides. Examples of suitable metal oxides include, but are not limited to, alumina, silica, and titania. Other oxides can optionally be present in minor amount. Examples of such optional oxides include, but are not limited to, zirconia, hafnia, and yttria.
- metal oxides that can optionally be present are those that are ordinarily present as impurities such as for example, iron oxide.
- silicon is considered to be a metal.
- the particles are particles of alumina, most often the alumina is alumina monohydroxide. Particles of alumina monohydroxide, AlO(OH), and their preparation are known.
- Metallic powders can be used in the damping materials, for example, metal powders such as aluminum, copper or special steel, molybdenum disulfide, iron oxide, e.g., black iron oxide, antimony-doped titanium dioxide and nickel doped titanium dioxide.
- metal powders such as aluminum, copper or special steel, molybdenum disulfide, iron oxide, e.g., black iron oxide, antimony-doped titanium dioxide and nickel doped titanium dioxide.
- Metal alloy particulates can also be used.
- Additives such as carbon black and other pigments, ultraviolet light absorbers, ultraviolet stabilizers, antioxidants, fire retardant agents, thermally or electrically conductive agents, post curing agents, and the like can be blended into the damping materials to modify the properties of the damping patch.
- additives can also include, for example, one or more inhibitors, defoamers, colorants, luminescents, buffer agents, anti-blocking agents, wetting agents, matting agents, antistatic agents, acid scavengers, processing aids, extrusion aids, and others.
- Ultraviolet light absorbers include hydroxyphenyl benzotriazoles and hydrobenzophenones.
- Antioxidants include, for example, hindered phenols, amines, and sulfur and phosphorus hydroxide decomposers, such as Irganox 1520L.
- the fillers, pigments, plasticizers, flame retardants, UV stabilizers, and the like are optional in many embodiments and can be used at concentrations of from about 0 to about 30% or more, such as up to about 40% in particular embodiments.
- the total amount of fillers (inorganic and/or organic), pigments, plasticizers, flame retardants, UV stabilizers, and combinations thereof is from about 0.1% to about 30%, and more particularly from about 1% to about 20%.
- the damping materials can also comprise one or more solvents.
- suitable solvents include toluene, xylene, tetrahydrofuran, hexane, heptane, cyclohexane, cyclohexanone, methylene chloride, isopropanol, ethanol, ethyl acetate, butyl acetate, isopropyl acetate, and combinations thereof.
- suitable solvents include toluene, xylene, tetrahydrofuran, hexane, heptane, cyclohexane, cyclohexanone, methylene chloride, isopropanol, ethanol, ethyl acetate, butyl acetate, isopropyl acetate, and combinations thereof.
- damping materials are not limited to such solvents and can utilize a wide array of other solvents, additives, and/or viscosity adjusting agents, such as reactive d
- the disclosed multilayer damping laminates may comprise at least one constraining layer.
- the constraining layer(s) can serve to provide rigidity and stiffness to the laminate structure, and to define and differentiate multiple discontinuous damping layers, when present, of the laminate.
- the damping laminate comprises a first discontinuous damping layer and at least one additional discontinuous damping layer, wherein the first and at least one additional discontinuous damping layer are separated from one another by at least one constraining layer.
- at least one constraining layer is an internal constraining layer, and at least a portion of the internal constraining layer is disposed between the first discontinuous damping layer at least one additional discontinuous damping layer.
- One face of the internal constraining layer can be directly adjacent to the first discontinuous damping layer, or there can be one or more intervening layers disposed between the internal constraining layer and the first discontinuous damping layer.
- An opposite face of the internal constraining layer can be directly adjacent to at least one additional discontinuous damping layer, or there can be one or more intervening layers disposed between the internal constraining layer and at least one additional discontinuous damping layer.
- the percent coverage of the internal constraining layer by the damping material regions of the first discontinuous damping layer can be as described above.
- the multilayer damping laminate comprises an external constraining layer.
- An external constraining layer is a constraining layer that can provide an outer surface of the laminate, open to the external environment and opposite a substrate to which the laminate can be applied. At least a portion of at least one additional discontinuous damping layer of the laminate can be disposed between the first discontinuous damping layer and the external constraining layer. At least a portion of the second damping layer can be disposed between the internal constraining layer and the external constraining layer.
- One face of the external constraining layer can be directly adjacent to at least one additional discontinuous damping layer, or there can be one or more intervening layers between at least one additional discontinuous damping layer and the external constraining layer.
- one face of at least one additional discontinuous damping layer is directly adjacent to the internal constraining layer, and an opposite face of at least one additional discontinuous damping layer is directly adjacent to the external constraining layer.
- the percent coverage of the external constraining layer by the damping material regions of at least one additional discontinuous damping layer can be as described above.
- each constraining layer of the damping laminate can, for example, independently range from about 5 ⁇ m to about 3000 ⁇ m, e.g., from about 5 ⁇ m to about 2500 ⁇ m, from about 5 ⁇ m to about 2000 ⁇ m, from about 5 ⁇ m to about 1500 ⁇ m, from about 5 ⁇ m to about 1000 ⁇ m, from about 5 ⁇ m to about 500 ⁇ m, from about 5 ⁇ m to about 230 ⁇ m, from about 9.5 ⁇ m to about 440 ⁇ m, from about 18 ⁇ m to about 830 ⁇ m, from about 34 ⁇ m to about 1600 ⁇ m, or from about 65 ⁇ m to about 3000 ⁇ m.
- the thickness of each constraining layer can independently be less than about 3000 ⁇ m, e.g., less than about 1600 ⁇ m, less than about 830 ⁇ m, less than about 440 ⁇ m, less than about 230 ⁇ m, less than about 120 ⁇ m, less than about 65 ⁇ m, less than about 34 ⁇ m, less than about 18 ⁇ m, or less than about 9.5 ⁇ m.
- the thickness of each constraining layer can independently be greater than about 5 ⁇ m, greater than about 9.5 ⁇ m, greater than about 18 ⁇ m, greater than about 34 ⁇ m, greater than about 65 ⁇ m, greater than about 120 ⁇ m, greater than about 230 ⁇ m, greater than about 440 ⁇ m, greater than about 830 ⁇ m, or greater than about 1600 ⁇ m. Larger thicknesses, e.g., greater than about 3000 ⁇ m, and smaller thicknesses, e.g., less than about 5 ⁇ m, are also contemplated.
- Each constraining layer can independently comprise one or more stiffening materials that serve to provide a stiffened structure to each constraining layer, wherein each of the constraining layers can have a similar or different composition.
- the stiffening materials can include one or more polymeric materials.
- polymeric materials include polyvinyl chloride (PVC), polyolefins such as polyethylene (PE) and/or polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), polystyrene (PS), and combinations of these and other materials.
- At least one constraining layer comprises a metal.
- the metal of at least one constraining layer may comprise at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- the metal is a metal powder.
- the metal is a metal foil.
- at least one constraining layer comprises both a metal powder and a metal foil.
- the metals may be stiffening materials and can include one or more metals or metal alloys. Nonlimiting examples of metals include aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- the internal constraining layer and the external constraining layer are each independently a metal foil, e.g., aluminum foil.
- Metal foils may include, but are not limited to, at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- the stiffening materials can include one or more natural or manufactured woods.
- the stiffening materials can include one or more fibers.
- Nonlimiting examples of fibers include hemp fibers, flax fibers, glass fibers, and carbon fibers.
- the stiffening materials can include one or more carbon based materials, including carbon nanotubes, graphene, diamond, carbine, or combinations thereof. Composite materials and combinations of these materials could also be used.
- the multilayer laminate film further comprises a liner layer connected to the discontinuous damping layer.
- the discontinuous damping layer may be first discontinuous damping layer.
- One face of the liner layer can be directly adjacent to the discontinuous damping layer, or there can be one or more intervening layers between the discontinuous damping layer and the liner layer.
- one face of the discontinuous damping layer is directly adjacent to at least one constraining layer, and an opposite face of the discontinuous damping layer is directly adjacent to the liner layer.
- the multilayer laminate film further comprises a liner layer connected to the first discontinuous damping layer opposite at least one constraining layer.
- the releasable liner can function as a protective cover such that the release liner remains in place until the multilayer damping laminate is ready for attachment to an object or surface.
- a liner or release liner is included in the laminate, a wide array of materials and configurations can be used for the liner.
- the liner is a paper or paper-based material.
- the liner is a polymeric film of one or more polymeric materials.
- at least one face of the liner is coated with a release material such as a silicone or silicone-based material.
- the release coated face of the liner is placed in contact with the otherwise exposed face of the outer discontinuous damping layer.
- the liner Prior to application of the label to a surface of interest, the liner is removed to thereby expose the discontinuous damping layer of the laminate.
- the liner can be in the form of a single sheet. Alternatively, the liner can be in the form of multiple sections or panels.
- a sheet of adhesive transfer tape HPA 1905 commercially available from Avery Dennison, was cut into rectangular strips having widths of 0.500 inches (1.270 cm) to serve as damping material. These strips were then applied to sheets of aluminum foil backing having a thickness of 5 mil (125 ⁇ m), forming damping material regions of a discontinuous damping layer on the aluminum foil constraining layer. The strips were applied to the foil with two different gap region widths between adjacent strips. In one arrangement, gap regions having a 0.25-inch width were used such that approximately 75% of the surface area of the foil was covered by the adhesive strips. In a second arrangement, gap regions having 0.500-inch widths were used such that approximately 50% of the surface area of the foil was covered by the adhesive strips.
- FIG. 1 illustrates side views of the two prepared laminate structures (Comparative Examples A and B), as well as of a conventional control laminate structure control having continuous damping adhesive layers providing total coverage of its constraining aluminum foil layers.
- FIG. 2 shows the composite loss factor versus temperature for each of Comparative Examples A and B and the control laminate. From the graph it can be seen that the peak composite loss factors of the laminates having discontinuous damping layers (Comparative Examples A and B) were lower than that of the continuous damping layer control.
- Example 1 A laser cutter was then used to obtain narrower strips of the 4.9-mil HPA 1905 adhesive transfer tape damping material.
- the rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example C), 0.500 cm (Example 1), and 0.250 cm (Example 2).
- the damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures having the configurations shown in FIGS. 4-6 .
- the Comparative Example D damping layer configuration shown in FIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths.
- the multilayer constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%.
- Comparative Example D and Examples 1 and 2 laminates were tested as described above using Vibration Beam Technique equipment and the SAE J1637_201306 protocol, with results of using the HPA 1905 adhesive shown in FIG. 7 . From the composite loss factor trends of the graph it can be seen that the Comparative Example D multilayer laminate showed a decrease in peak damping as compared to the continuous damping layer control. In contrast, the Example 1 and Example 2 multilayer laminates ( FIG. 5 and FIG. 6 ) showed a significant increase in peak composite loss factor compared to the control. These results demonstrated that decreasing the widths of the damping material regions and the gap regions of the discontinuous damping layer resulted in an advantageous increase in damping performance.
- the laser cutter was then used to obtain narrower strips of the 2.4-mil HPA 1902 adhesive transfer tape damping material, also available from Avery Dennison.
- the rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example E), 0.50 cm (Example 3), and 0.250 cm (Example 4).
- the damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures also having the configurations shown in FIGS. 3-5 , but with smaller 2.4-mil damping layer thicknesses.
- the Comparative Example D damping layer configuration shown in FIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths.
- the constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%.
- FIG. 7 depicts a graph with results of Vibration Beam Technique testing of the Comparative Example D and Examples 1 and 2 laminates (the laminates of FIGS. 4-6 ) each having at least one discontinuous damping layer thickness of 5 mil.
- the composite loss factor trends of FIG. 7 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 4 and 5 caused an increase in peak damping.
- FIG. 8 is a graph of composite loss factors of the laminates of FIGS. 4-6 each having at least one discontinuous damping layer thickness of 2 mil.
- the composite loss factor trends of FIG. 8 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 1 and 2 caused an increase in peak damping.
- a sheet of adhesive transfer tape HPA 1905 commercially available from Avery Dennison, was cut into rectangular strips having widths of 0.500 inches (1.270 cm) to serve as damping material. These strips were then applied to sheets of aluminum foil backing having a thickness of 5 mil (125 ⁇ m), forming damping material regions of a discontinuous damping layer on the aluminum foil constraining layer. The strips were applied to the foil with two different gap region widths between adjacent strips. In one arrangement, gap regions having a 0.25-inch width were used such that approximately 75% of the surface area of the foil was covered by the adhesive strips. In a second arrangement, gap regions having 0.500-inch widths were used such that approximately 50% of the surface area of the foil was covered by the adhesive strips.
- FIG. 1 illustrates side views of the two prepared laminate structures (Comparative Examples A and B), as well as of a conventional control laminate structure control having continuous damping adhesive layers providing total coverage of its constraining aluminum foil layers.
- FIG. 2 shows the composite loss factor versus temperature for each of Comparative Examples A and B and the control laminate. From the graph it can be seen that the peak composite loss factors of the laminates having discontinuous damping layers (Comparative Examples A and B) were lower than that of the continuous damping layer control.
- Example 1 A laser cutter was then used to obtain narrower strips of the 4.9-mil HPA 1905 adhesive transfer tape damping material.
- the rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example C), 0.500 cm (Example 1), and 0.250 cm (Example 2).
- the damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures having the configurations shown in FIGS. 4-6 .
- the Comparative Example D damping layer configuration shown in FIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths.
- the multilayer constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%.
- Comparative Example D and Examples 1 and 2 laminates were tested as described above using Vibration Beam Technique equipment and the SAE J1637_201306 protocol, with results of using the HPA 1905 adhesive shown in FIG. 7 . From the composite loss factor trends of the graph it can be seen that the Comparative Example D multilayer laminate showed a decrease in peak damping as compared to the continuous damping layer control. In contrast, the Example 1 and Example 2 multilayer laminates ( FIG. 5 and FIG. 6 ) showed a significant increase in peak composite loss factor compared to the control. These results demonstrated that decreasing the widths of the damping material regions and the gap regions of the discontinuous damping layer resulted in an advantageous increase in damping performance.
- the laser cutter was then used to obtain narrower strips of the 2.4-mil HPA 1902 adhesive transfer tape damping material, also available from Avery Dennison.
- the rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example E), 0.50 cm (Example 3), and 0.250 cm (Example 4).
- the damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures also having the configurations shown in FIGS. 3-5 , but with smaller 2.4-mil damping layer thicknesses.
- the Comparative Example D damping layer configuration shown in FIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths.
- the constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%.
- FIG. 7 depicts a graph with results of Vibration Beam Technique testing of the Comparative Example D and Examples 1 and 21aminates (the laminates of FIGS. 4-6 ) each having at least one discontinuous damping layer thickness of 5 mil.
- the composite loss factor trends of FIG. 7 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 4 and 5 caused an increase in peak damping.
- FIG. 8 is a graph of composite loss factors of the laminates of FIGS. 4-6 each having at least one discontinuous damping layer thickness of 2 mil.
- the composite loss factor trends of FIG. 8 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 1 and 2 caused an increase in peak damping.
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Description
- The present disclosure relates generally to multilayer damping laminates useful for dissipating vibrations.
- There is a need in many markets, e.g., the automotive market, the home appliance market, and the electronics market, for the reduction of undesired vibrations and associated noise generation. As an example, the automotive industry is trending towards an increased adoption of lighter weight vehicles. As such, there has been an increased use of lighter weight aluminum and polymer materials. The use of these designs and materials, however, leads to additional issues relating to vehicle vibration and vibration-related noise.
- Generally, the noise and vibration issues have been managed through two approaches: the stiffening of the structure geometry to be more resistant to vibration, and the damping of the structure to reduce the vibration amplitude. Along with these solutions, acoustic technologies can be used to absorb, reflect, and isolate sound waves from their source, for example before they reach a passenger in an automotive cabin.
- Structural damping approaches can involve the application of damping tapes or laminates that include a stiffening or constraining carrier material and a damping material. These constraining and damping materials are typically configured in a stacked arrangement that can be adhered to a structure to absorb and dissipate vibrational energy. In order to achieve desired vibration damping characteristics however, these damping tapes typically are relatively thick, include large amounts of costly adhesive, and can significantly add to the overall weight of the system to which they are applied. Accordingly, a need remains for damping laminates with improved vibrational reduction and/or a decrease in material requirements that are also cost- and weight-effective.
- In one embodiment, the disclosure is to a multilayer damping laminate having a peak composite loss factor at about 200 Hz that is greater than about 0.05. The multilayer damping laminate may comprise at least one constraining layer that may have a thickness ranging from about 5 µm to about 3000 µm. In many embodiments, at least one constraining layer comprises a metal. The multilayer damping laminate may further comprise a discontinuous damping layer that having a thickness ranging from about 2 µm to about 5000 µm. In many embodiments, the discontinuous damping layer is directly adjacent to at least one constraining layer. The discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein a percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 99%. In many embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than 90%. In other embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 80%. In many embodiments, the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 70%. In still other embodiments, the percent coverage of the by the one or more damping material regions is greater than about 50%. An average width of the one or more gap regions is less than about 0.200 cm. In many embodiments, the multilayer damping laminate further comprises a liner layer connected to the first damping layer opposite at least one constraining layer. In many embodiments, the discontinuous damping layer is a first discontinuous damping layer, at least one constraining layer is an internal constraining layer, and the multilayer damping laminate further comprises at least one additional discontinuous damping layer and an external constraining layer. In some embodiments, at least a portion of the internal constraining layer may be disposed between the first discontinuous damping layer and at least one additional discontinuous damping layer, and at least a portion of at least one additional discontinuous damping layer may be disposed between the internal constraining layer and the external constraining layer. In many embodiments, at least one additional discontinuous damping layer comprises one or more additional discontinuous layer damping material regions and one or more additional discontinuous damping layer gap regions. The percent coverage of the external constraining layer by the one or more additional discontinuous damping layer damping material regions may be less than about 99%.
- In another embodiment, the disclosure is to a system comprising a multilayer damping laminate as described above. The system further comprises a base substrate connected to the discontinuous damping layer of the multilayer damping laminate.
- In another embodiment, the disclosure is to a method of reducing a vibration of a base substrate. The method comprises providing a base substrate that is subject to a vibration. The method further comprises connecting the base substrate to the discontinuous damping layer of a multilayer damping laminate as described above.
- The disclosure references the appended drawings, wherein like numerals designate similar parts.
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FIG. 1 illustrates exemplary configurations of one or more damping material regions and one or more gap regions in the discontinuous damping layers of disclosed multilayer damping laminate. -
FIG. 2 presents side view illustrations of a conventional multilayer constrained layer damping laminate and two multilayer constrained layer damping laminates having discontinuous damping layers. -
FIG. 3 is a graph of composite loss factors of the laminates ofFIG. 1 . -
FIG. 4 presents a top view illustration of at least one discontinuous damping layer having 1.000-cm damping region widths and 0.200-cm gap region widths. -
FIG. 5 presents a top view illustration of at least one discontinuous damping layer having 0.50-cm damping region widths and 0.100-cm gap region widths. -
FIG. 6 presents a top view illustration of at least one discontinuous damping layer having 0.250-cm damping region widths and 0.05-cm gap region widths. -
FIG. 7 is a graph of composite loss factors of the laminates ofFIGS. 3-5 each having at least one discontinuous damping layer thickness of 5 mil. -
FIG. 8 is a graph of composite loss factors of the laminates ofFIGS. 3-5 each having at least one discontinuous damping layer thickness of 2 mil. - The present disclosure generally relates to multilayer damping laminates that, when employed for example on a base substrate subject to vibration, provide advantageous improvements in stiffness and reductions in vibration while reducing the amount of damping material included in the laminates. For example, for a flexible or non-rigid structure, it is beneficial to minimize the frequency and/or amplitude of any vibrations of the structure. Such vibrational reductions beneficially increase the stability of the structure, reduce fatigue and stress, lengthen operational lifetime, and decrease undesired vibration side effects, such as the generation of noise or the discomfort of vehicle passengers.
- Conventionally, damping treatments such as laminates or tapes include constraining elements and damping elements configured to be attached to vibrating structures. These treatments, referred to as constrained layer damping treatments, can decrease the occurrence and intensity of vibrations observed with the structure to which the treatments are attached. In these conventional laminates however, the constraining layers and the damping layers of the treatment are typically applied together in a stacked configuration wherein the stiffening and damping layers are substantially coextensive with one another. In other words, the layers of conventional constrained damping devices may be each substantially continuous sheets of material having uniform thickness and no intentional holes or gaps.
- Through the use of discontinuous damping layers in multilayer damping laminates, advantageous improvements in damping performance can be surprisingly realized. In particular, it has been found that the effectiveness and efficiency of constrained layer damping laminates can be enhanced if the damping layers are composed of one or more gap regions, such that one or more damping material regions of the layers do not provide complete coverage of the constraining layers of the laminate. Furthermore, the discontinuous nature of the disclosed damping layers allows them to be manufactured using less damping material. This can have a significant impact in advantageously reducing the production cost of these damping treatments. The decrease in materials can allow an end user to achieve an enhanced effect in damping a structure, while reducing the total damping product mass applied per unit surface area of the structure.
- In one embodiment, a multilayer damping laminate having improved damping performance is disclosed. The damping performances of a damping laminate and its component damping layers can be described in terms of their composite loss factor (CLF) properties. The composite loss factor of a material or device is a measure of its ability to convert vibrational energy to thermal energy. As a general practice, the materials or compositions of individual layers selected as being highly damping can have composite loss factors of 0.8 or larger. In a layered construction, the total composite loss factor of the overall construction is generally considered effective at values of 0.05 or larger. The composite loss factor of the multilayer damping laminate can be determined, for example, as described in the standard protocol ASTM E756-05 (2017). The disclosed multilayer damping laminate described herein has a peak composite loss factor at 200 Hz that is greater than about 0.050, e.g., greater than about 0.060, greater than about 0.070, greater than about 0.080, greater than about 0.090, greater than about 0.100, greater than about 0.200, greater than about 0.300, greater than about 0.400, or greater than about 0.500.
- In many embodiments, the multilayer damping laminate comprises at least one constraining layer and at least one discontinuous damping layer. The discontinuous damping layer includes one or more damping material regions and one or more gap regions. The damping material regions are portions of the discontinuous damping layer that each comprise one or more damping materials selected for high elasticity, anelasticity, viscosity, and/or viscoelasticity. The gap regions are portions of the discontinuous damping layer that each may comprise one or more materials having lower elasticity, anelasticity, viscosity, and/or viscoelasticity that those of the damping material regions. Each of the one or more gap regions of the damping layer may be bound by the one or more damping material regions, one or more edges of the discontinuous damping layer, or a combination thereof. The presence of the one or more gap regions in the damping layer causes the one or more damping material regions to provide incomplete coverage of at least one constraining layer, e.g., the damping material regions are not substantially coextensive with at least one constraining layer. As used herein, the terms "coverage" and "percent coverage" refer to the fraction of the constraining layer area covered by a projection of the damping layer regions onto the plane of the constraining layer. This leads to the benefit of a reduction of materials and a resulting reduction in mass in the multilayer damping laminates. Surprisingly, certain discontinuous damping laminate layer configurations also provide the advantageous benefit of increased damping performance.
- The percent coverage of the discontinuous damping layer by the damping material regions can, for example, range from about 50% to about 99%, e.g., from about 60% to about 90%, from about 70% to about 86%, from about 72% to about 90%, from about 75% to about 93%, from about 78% to about 96%, or from about 80% to about 99%. In terms of upper limits, the percent coverage of at least one constraining layer by the damping material regions can be less than about 99%, e.g., less than about 96%, less than about 93%, less than about 90%, less than about 86%, less than about 83%, less than about 80%, less than about 78%, less than about 75%, or less than about 72%. In terms of lower limits, the percent coverage of at least one constraining layer by the damping material regions can be greater than about 50%, e.g., greater than about 55%, greater than about 60%, greater than about 65%, greater than about 70%, greater than about 72%, greater than about 75%, greater than about 78%, greater than about 80%, greater than 83%, greater than about 86%, greater than about 90%, greater than about 93%, or greater than about 96%. The percent coverage of at least one constraining layer by the damping material regions may also be less than or equal to 90%. Higher percent coverages, e.g., greater than about 99%, and lower percent coverages, e.g., less than 50%, are also contemplated. The limits for the higher percent coverages and lower percent coverages may vary due to factors that include, but are not limited to, specific geometry, thickness, and adhesive rheology.
- The number and shape of the damping material regions and gap regions of the discontinuous damping layer can vary widely. In some aspects, the damping layer may provide a pattern or other configuration. In certain aspects, the damping layer includes a single damping material region and a single gap region, that are together arranged in one more serpentine (
FIG. 1A ) or spiraling (FIG. 1B ) configurations to maintain small region widths. For example, the damping material region can have a serpentine shape within the gap region, or the gap region can have a serpentine shape within the damping region. In other examples, the damping material region can have one or more spiral-shaped portions within the gap region, or the gap region can have one or more spiral-shaped portions within the damping material region. In certain aspects, the damping layer includes a single damping material region and multiple gap regions. The single damping material region and multiple gap regions can, for example, be arranged in a crosshatched configuration in which the damping material region forms the borders of the hatching and the gap regions form the interiors of the hatching. In other aspects, the damping layer may alternatively lack a pattern or other configuration. In this non-pattern, there may be gaps and damping material region(s) with irregular shapes and/or spacing. In other embodiments, there may be a combination of both configurations/portions and non-patterns. Alternatively, the shape the patterns for the damping region and gap region in the discontinuous damping layer can be generalized in the following manner: 1) the damping regions can be a union of infinitely many disjoint subsets Di of the discontinuous damping layer and the gap regions are the complement of the union of infinitely many disjoint subsets Di; or 2) alternatively, the gap regions can be an union of infinitely many disjoint subsets Gi of the discontinuous damping layer and the damping region can be the complement of the union of infinitely many disjoint subsets Gi. For these scenarios, i is an indexing variable ranging from 1 to infinity. Further, the disjoint subsets Di (or Gi) may be closed and connected, or closed and locally connected. Additionally, the disjoint subsets Di (or Gi) can be the union of infinitely many non-disjoint non-empty connected subsets. Examples of the connected subset Di (or Gi) are the following. The subset Di can be any n-sided polygon that can be convex, concave, equilateral, equiangular, spherical, aperiogon, self-intersecting or the Euclidean realization of an abstract polytope. Here, n is the number of sides of the polygon and it can range from 1 to infinity. Examples may include, but are not limited to, any regular convex polygon, regular or skewed quadrilateral that can encompass regular or skewed paralleglograms, trapeziums, rhombus, kites, self-intersecting quadrilaterals, antiparallegorrams, star polygons, crossed rectangles, Saccheri quadrilaterals, and any closed Euclidean set that can be either convex or concave. The subsets Di (or Gi) can be arranged in any pattern such their intersection in any manner of consideration is a null-set. Examples can include, but are not limited to, parallel stacking of Dis separated by a gap region (or Gis separated by a damping region), Euclidean tilings, uniform tilings, aperiodic tilings, spiral tilings, convex or concave uniform tilings to name a few. - In certain aspects, the damping layer includes a single gap region and multiple damping material regions. The single gap region and multiple damping material regions can, for example, be arranged in a crosshatched configuration (
FIG. 1C ) in which the gap material region forms the borders of the hatching and the damping material regions form the interiors of the hatching. In other examples, the damping material region forms the borders of the hatching and the gap regions form the interiors of the hatching. In certain aspects, the damping layer includes multiple damping material regions and multiple gap regions, that are together arranged in a checkerboard-like pattern (FIG. 1D ); a series of straight (FIG. 1E ), angled, zigzag (FIG. 1F ), or curved lines; circles; or any combination of polygons. The arrangement of the one or more damping material regions and the one or more gap regions can be in a pattern of one or more repeating blocks, or can lack such a pattern. In some embodiments, the damping material regions may have a substantially random configuration. - In some embodiments, and as shown in
FIG. 1E , the damping material regions and gap regions of the discontinuous damping layer have substantially rectangular shapes that are substantially parallel to one another. The rectangular shapes of damping material regions can have similar or different average widths. The rectangular shapes of the damping material regions can have similar or different lengths. The rectangular shapes of the gap regions can have similar or different widths. The rectangular shapes of the gap regions can have similar or different lengths. When applied to the surface of a structure or substrate that is subject to vibrations, the damping material regions can, for example, be substantially parallel or substantially perpendicular to the structure or substrate. As an example, when a disclosed damping laminate is applied to a vibrating beam, the damping material regions of the discontinuous damping layer of the laminate can be substantially parallel or substantially perpendicular to the beam. - As used herein, reference to the width of a region is used to denote the distance from a point on the lengthwise border of a region to the closest point on an opposite border of the region, wherein the lengthwise border is the border having the largest path length. As used herein, reference to the average width of a region is used to denote the average of the width as measured at all points along the lengthwise border. As used herein, reference to the average width of multiple regions is used to denote the average of the average widths of all such regions. For example, average width of the one or more gap regions of the discontinuous damping layer is the average of the average widths of each gap region in the damping layer.
- The average width of the gap regions of the discontinuous damping layer can, for example, range from about 0.010 cm to about 0.124 cm, from about 0.029 cm to about 0.143 cm, from about 0.048 cm to about 0.162 cm, or from about 0.067 cm to about 0.181 cm. In terms of upper limits, the average width of the gap regions is less than about 0.200 cm, e.g., less than about 0.181 cm, less than about 0.162 cm, less than about 0.143 cm, less than about 0.124 cm, less than about 0.105 cm, less than about 0.086 cm, less than about 0.067 cm, less than about 0.048 cm, or less than about 0.029 cm. In terms of lower limits, the average width of the gap regions can be greater than 0.010 cm, e.g., greater than about 0.029 cm, greater than about 0.048 cm, greater than about 0.067 cm, greater than about 0.086 cm, greater than about 0.105 cm, greater than about 0.124 cm, greater than about 0.143 cm, greater than about 0.162 cm, or greater than about 0.181 cm. Smaller widths, e.g., less than about 0.010 cm, are also contemplated.
- The average width of the damping material regions of the discontinuous damping layer can, for example, range from about 0.050 cm to about 1.000 cm, e.g., from about 0.050 cm to about 0.900 cm, from about 0.050 cm to about 0.800 cm, from about 0.050 cm to about 0.700 cm, from about 0.050 cm to about 0.620 cm, from about 0.145 cm to about 0.715 cm, from about 0.240 cm to about 0.810 cm, from about 0.335 cm to about 0.905 cm, or from about 0.430 cm to about 1.000 cm. In terms of upper limits, the average width of the damping material regions can be less than about 1.000 cm, e.g., less than about 0.905 cm, less than about 0.810 cm, less than about 0.715 cm, less than about 0.620 cm, less than about 0.525 cm, less than about 0.430 cm, less than about 0.335 cm, less than about 0.240 cm, or less than about 0.145 cm. In terms of lower limits, the average width of the damping material regions can be greater than about 0.050 cm, e.g., greater than about 0.145 cm, greater than about 0.240 cm, greater than about 0.335 cm, greater than about 0.430 cm, greater than about 0.620 cm, greater than about 0.715 cm, greater than about 0.810 cm, or greater than about 0.905 cm. The average width of the damping material regions of the discontinuous damping layer can, for example, be less than or equal to about 1.000 cm. Larger widths, e.g., greater than about 1.000 cm, and smaller widths, e.g., less than about 0.050 cm, are also contemplated.
- The thickness of the discontinuous damping layer can, for example, range from about 2 µm to about 5000 µm, e.g., from about 2 µm to about 220 µm, from about 4.4 µm to about 480 µm, from about 9.6 µm to about 1000 µm, from about 21 µm to about 2300 µm, or from about 46 µm to about 5000 µm. In terms of upper limits, the thickness of the discontinuous damping layer can be less than about 5000 µm, e.g., less than about 2300 µm, less than about 1000 µm, less than about 480 µm, less than about 220 µm, less than about 100 µm, less than about 46 µm, less than about 21 µm, less than about 9.6 µm, or less than about 4.4 µm. In terms of lower limits, the thickness of the discontinuous damping layer can be greater than about 2 µm, greater than about 4.4 µm, greater than about 9.6 µm, greater than about 21 µm, greater than about 46 µm, greater than about 100 µm, greater than about 220 µm, greater than about 480 µm, greater than about 1000 µm, or greater than about 2300 µm. Larger thicknesses, e.g., greater than about 5000 µm, and smaller thicknesses, e.g., less than about 2 µm, are also contemplated.
- In some embodiments, the damping material of each of the damping material regions can include elastic, anelastic, viscous, and/or viscoelastic materials. For instance, the damping material can be compressible and can comprise a restorative force. In an aspect, the damping materials can include rubber, plastic, e.g., nylon, leather, fabric, foam, sponge, gel, or the like. In some embodiments, the damping material includes one or more adhesives. In some embodiments, the damping material includes one or more pressure sensitive adhesives. In many embodiments, the adhesive may be acrylic, rubber, silicone, hybrid, butyl, polyurethane, olefin, polyester or a combination of these adhesives.
- In some embodiments, the damping materials can include one or more silicone adhesives. The silicone adhesives can include polyorganosiloxane dispersions or gums, such as polydimethylsiloxanes, polydimethyl/methylvinyl siloxanes, polydimethyl/methylphenyl siloxanes, polydimethyl/diphenyl siloxanes, and blends thereof. The silicone adhesives can include silicone resins, such as MQ resins or blends of resins. Non-limiting examples of such silicone adhesive compositions which are commercially available include adhesives 7651, 7652, 7657, Q2-7406, Q2-7566, Q2-7735 and 7956, all available from Dow Corning (Midland, MI); SILGRIP™ PSA518, 590, 595, 610, 915, 950 and 6574 available from Momentive Performance Materials (Waterford, NY); and KRT-009 and KRT-026 available from Shin-Etsu Silicone (Akron, OH).
- In other embodiments, damping materials can comprise one or more rubber-based adhesives. Rubber-based adhesive comprised of combinations of styrene block copolymers and various tackifying resins, oils, fillers, pigments and antioxidants. A wide array of rubber agent(s) can be used in the adhesives of the present subject matter tapes. Nonlimiting examples of suitable rubber agents include but are not limited to polymers or copolymers of styrene-butadiene (SB), styrene-butadiene-styrene (SBS), styrene-isoprene (SI), styrene-isoprene-styrene (SIS), random styrene-butadiene (SBR), styrene-butadiene-isoprene multi-block (SBIBS), or polyisoprene. In some embodiments, fully and partially hydrogenated rubber agents can be used. Combinations of these agents described above can also be used. Examples of suitable styrene-butadine-styrene (SBS) which are commercially available include KRATON D1101 and KRATON D1118 from Kraton Performance Polymers and VECTOR 2518D from Dexco Polymers. Examples of suitable styrene-isoprene-styrene (SIS) include KRATON D 1107P and VECTOR 411A. An example of a suitable styrene-butadiene-isoprene multi-block (SBIBS) is KRATON S6455. Kraton GRP-6924 is an example of a hydrogenated styrene block copolymer. The styrene-butadiene copolymer(s) component of the adhesive compositions used in the present subject matter may be block or multi-block copolymers having the general configuration: A-B-A or A-B-A-B-A-B- wherein the non-elastomeric polymer blocks A are styrene, while the elastomeric polymer blocks B are butadiene or butadiene which is partially or substantially hydrogenated. The polymeric blocks may be linear or branched. Typical branched structures may contain an elastomeric portion with at least three branches which can radiate out from a central hub or can be otherwise coupled together.
- Further, combinations of at least one silicone adhesive and at least one rubber adhesive may be used in the damping materials.
- In other embodiments, the damping materials may comprise a wide array of solid resin(s). The term "solid resin" as used herein refers to any resin which is solid at room/ambient temperature (about 23 °C) and which is compatible with the other components of the adhesive. Nonlimiting examples of such include aliphatic hydrocarbons such as from C5 to C9, hydrogenated ester rosins, partially hydrogenated ester rosins, aromatic modified ester resins, pentaerythritol resins, hydrogenated pentaerythritol resins, terpene resins, glycerol ester rosin resins, pentaerythritol tall oil, terpene phenolics, glycerol ester rosin resin, and combinations thereof. Nonlimiting examples of suitable aliphatic hydrocarbons used as solid resin(s) include ESCOREZ 1310 and ESCOREZ 2101 available from Exxon Mobile. Examples of a suitable hydrogenated ester rosin is FORAL 85 available from several suppliers such as Eastman Chemical and HERCOLYN D from Pinova. An example of a suitable partially hydrogenated ester rosin is FORALYN from Eastman Chemical. An example of a suitable aromatic modified ester resin is PICCOTAC 7590 from Eastman Chemical. An example of a suitable pentaerythritol resin is PEXALYN 9100 from Pinova. An example of a suitable hydrogenated pentaerythritol resin is PENTALYN H from Eastman Chemical. An example of a suitable pentaerythritol tall oil resin is SYLVALITE RE 105L from Arizona Chemical. An example of a suitable terpene phenolic is PICCOLYTE A115 from Eastman Chemical. An example of a commercially available glycerol ester gum rosin resin is RESINALL 625 available from Resinall Corporation.
- In yet other embodiments, the damping materials may also comprise a variety of liquid resin(s) used in the adhesive(s) of the present subject matter sealing tapes. The term "liquid resin" as used herein refers to any resin which is liquid at room/ambient temperature (about 23 °C) and which is compatible with the other components of the adhesive. A variety of liquid resin(s) can be used in the adhesives of the present subject matter sealing tapes. Nonlimiting examples of such liquid resin(s) include hydrogenated resin ester, terpene resins, low molecular weight hydrocarbons such as for example C5 hydrocarbons, and combinations thereof. An example of a suitable terpene resin is SYLVARES TR A25 available from Arizona Chemical. An example of a suitable C5 hydrocarbon is WINGTAC 10 available from numerous suppliers. An example of a suitable modified rosin resin for use in the adhesive(s) of the present subject matter sealing tapes is STAYBELITE-E ESTER 3-E which is an ester of hydrogenated rosin. STAYBELITE-E is available from Eastman Chemical.
- Further, combinations of at least one liquid resin and at least one solid resin may be used in the damping materials.
- In many embodiments, the damping material regions comprise a pressure sensitive adhesive. In some embodiments, the damping and bonding layers can comprise a butyl rubber or polyisobutylene based pressure sensitive adhesive. These adhesives can be formulated from mixtures of various molecular weight butyl rubber or polyisobutylene polymers or oligomers. Non-limiting examples of butyl rubber grades useful for formulating these adhesives include Exxon Butyl 065, Butyl 365, Chlorobutyl 1065, Chlorobutyl 1055, Bromobutyl 2222 and Exxpro Specialty Elastomer 3433 from ExxonMobil Chemical and polyisobutylene grade Oppanol N50 from BASF. These polymers are often blended with a low molecular weight grade of polyisbutylene such as TPC 750, TPC 1600 or TPC 3500 from TPC Group. Additionally, these adhesive can be formulated with a wide variety of tackifying resins including C5-C9 hydrocarbon tackifiers as well as polyterpene resins. Suitable hydrocarbon tackifying resins include ESCOREZ 1310 and ESCOREZ 2101 available from ExxonMobil. Examples of polyterpene resins include Piccolyte A115 and Piccolyte S25 available from Pinova. In addition to the above listed components, butyl rubber and polyisobutylene based adhesives may also contain additives such as, but not limited to, plasticizing oils, antioxidants, pigments and fillers. In the case of butyl and halo-butyl rubber based adhesives, curing agents may be added which allow for cross-linking. Examples of these cross-linkers are zinc oxide, phenol resins and others known in the art. These and other examples of additives are available in "Handbook of Pressure Sensitive Adhesive Technology" Chapter 14, Higgins, J.J. et al.
- The damping materials, in some cases, can comprise an acrylic-based or silicone-based monomer. In some embodiments, the damping materials comprise one or more acrylic-based monomers selected from the group consisting of methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, isobornyl acrylate, isononyl acrylate, isodecyl acrylate, methylacrylate, methyl methacrylate, methylbutyl acrylate, 4-methyl-2-pentyl acrylate, butyl methacrylate, 2-ethylhexyl methacrylate, and isooctyl methacrylate. Useful alkyl acrylate esters include n-butyl acrylate, 2-ethyl hexyl acrylate, isooctyl acrylate. In one embodiment, the acrylic ester monomer is polymerized in the presence of a vinyl ester such as vinyl acetate, vinyl butyrate, vinyl propionate, vinyl isobutyrate, vinyl valerate, vinyl versitate, and the like. The vinyl ester can be present in a total amount of up to about 35 wt%, based on total weight of the monomers forming the acrylate main chain. In one embodiment, an acrylic ester monomer is copolymerized with an unsaturated carboxylic acid. The unsaturated carboxylic acid can include, among others, acrylic acid, methacrylic acid, itaconic acid, beta carboxy ethyl acrylate and the like.
- In some embodiments, the damping materials comprise one or more silicone-based monomers selected from the group consisting of siloxanes, silane, and silatrane glycol. In some embodiments, the damping materials comprise one or more silicone-based monomers selected from the group consisting of 1,4-bis[dimethyl[2-(5-norbornen-2-yl)ethyl]silyl]benzene; 1,3-dicyclohexyl-1,1,3,3-tetrakis(dimethylsilyloxy)disiloxane; 1,3-dicyclohexyl-1,1,3,3-tetrakis(dimethylvinylsilyloxy)disiloxane; 1,3-dicyclohexyl-1,1,3,3-tetrakis[(norbornen-2-yl)ethyldimethylsilyloxy]disiloxane; 1,3-divinyltetramethyldisiloxane; 1,1,3,3,5,5-hexamethyl-1,5-bis[2-(5-norbornen-2-yl)ethyl]trisiloxane; 1,1,3,3-tetramethyl-1,3-bis[2-(5-norbornen-2-yl)ethyl]disiloxane; 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane; N-[3-(trimethoxysilyl)propyl]-N'-(4-vinylbenzyl)ethylenediamine; and 3-[tris(trimethylsiloxy)silyl]propyl vinyl carbamate.
- The damping materials, in some cases, can comprise a silicone polymer, an acrylic polymer, or a methacrylic polymer. Suitable acrylic polymers include, but are not limited to, S2000N, S692N, AT20N, XPE 1043, and XPE 1045, all available from Avery Dennison (Glendale, CA); and H9232 available from BASF (Florham Park, NJ). In one embodiment, the acrylic polymer composition is blended with multiblock copolymers such as styreneisoprene-styrene (SIS), styrene-ethylenebutylene-styrene (SEBS) and the like in an amount of up to about 30% by dry weight of the polymer. Examples of useful triblocks are available from Kraton Polymer Inc. (Houston, TX). Multiblock polymers can be useful in modifying the damping peak and other physical properties of the acrylic composition. Other damping materials may comprise a rubber polymer. Suitable rubber polymers include, but are not limited to, elastomers, butyl rubber, styrenic block copolymer (known as SBCs, from example, Kraton), silicone rubber, nitrile rubber, isoprene, butadiene. In some embodiments, the rubber polymer composition may be blended with an acrylic polymer and/or acrylic polymer.
- A wide array of functional groups can be incorporated in a polymer of the damping materials. The functional groups can be incorporated into the polymer formed from the acrylic-based monomer or the silicon-based monomer, for example as end segments. Representative functional groups include, without limitation, hydroxy, epoxy, cyano, isocyanate, amino, aryloxy, aryalkoxy, oxime, aceto, epoxyether and vinyl ether, alkoxymethylol, cyclic ethers, thiols, benzophenone, acetophenone, acyl phosphine, thioxanthone, and derivatives of benzophenone, acetophenone, acyl phosphine, and thioxanthone.
- Functional groups that have hydrogen-bonding capability are well known and include carboxyl, amide, hydroxyl, amino, pyridyl, oxy, carbamoyl and mixtures thereof. In some embodiments, an acrylic polymer backbone of the damping materials includes the polar comonomers vinyl pyrrolidone and acrylic acid. Examples of other monomers with hydrogen-bonding functionality include methacrylic acid, vinyl alcohol, caprolactone, ethylene oxide, ethylene glycol, propylene glycol, 2-hydroxyethyl acrylate, N-vinyl caprolactam, acetoacetoxyethyl methacrylate and others.
- In some embodiments, the damping materials comprise one or more co-monomers bearing a functionality that can be further crosslinked. Examples of crosslinkable co-monomers include (meth) acrylic acid, 2-hydroxyethyl acrylate, glycidyl methacrylate, itaconic acid, allyl glycidyl ether and the like, and mixtures thereof. Functional moieties, such as those described above, can be used to crosslink polymer chains, to attach the high side chains to the backbone, or both.
- The damping materials can further comprise a crosslinker, which can vary widely. Examples of suitable crosslinkers include multifunctional acrylates and methacrylates, such as diacrylates (ethylene glycol diacrylate, propylene glycol diacrylate, polyethylene glycol diacrylate, and hexanediol diacrylate), dimethacrylates (ethylene glycol diacrylate, diethylene glycol dimethacrylate, and 1,3 butane glycol dimethacrylate), triacrylates (trimethylolpropane trimethacrylate, ethoxylated trimethylolpropane triacrylate, and pentaerythritol triacrylate), and trimethacrylates (pentaerythritol trimethacrylate and trimethylolpropane trimethacrylate), as well as divinyl esters, such as divinylbenzene, divinyl succinate, divinyl adipate, divinyl maleate, divinyl oxalate, and divinyl malonate.
- Additional crosslinkers can be employed to form crosslinks in a silicone-based matrix. In some embodiments, a peroxide crosslinker, such as dibenzoylperoxide, is suitable. In some embodiments, the crosslinker is a compound that contains silicon-hydride functionality. Non-limiting examples of such crosslinkers include PEROXAN BP 50W, PEROXAN BIC, and PEROXAN Bu, all available from Pergan (Bocholt, Germany); LUPEROX® A75 and A98 commercially available from Arkema (King of Prussia, PA); and PERKADOX® CH-50 and PD 50SPS from Akzo Nobel (Chicago, IL). Crosslinking can be facilitated and/or promoted by heating or other techniques generally depending upon the chemical system employed.
- Other exemplary chemical crosslinkers that can be used in the damping materials include, but are not limited to, di-, tri- or poly-isocyanates with or without a catalyst (such as dibutyltin dilaureate); ionic crosslinkers; and di-, tri- or poly-functional aziridines. Illustrative, non-limiting examples of commercially available chemical crosslinkers include aluminum acetyl acetonate (AAA) available from NOAH Technologies (San Antonio, T'X); TYZOR® available from DuPont (Wilmington, DE); XAMA® available from Bayer (Pittsburgh, PA); and PAPI™ and VORONATE™, available from Dow Chemical.
- The damping materials can optionally comprise one or more tackifiers or resins, and these tackifiers (when employed) can vary widely. In some cases, the tackifier of the damping materials includes a single tackifier. In other cases, the tackifier comprises a mixture of multiple tackifier products. Suitable commercial tackifiers include (but are not limited to), for example, hydrogenated DCPD resins such as HD1100, HD1120 from Luhua (China), and E5400 from Exxon Mobil (Houston, TX). Other suitable hydrogenated resins include fully hydrogenated resins such as REGALITE™ S1100, R1090, R1100, C100R, and C100W from Eastman (Kingsport, TN); and fully hydrogenated C9 resins QM-100A and QM-115A from Hebei Qiming (China).
- The damping materials can also optionally comprise one or more plasticizers, and these plasticizers (when employed) can vary widely. In some embodiments, the plasticizer has a high molecular weight and/or a high viscosity. In some cases, the plasticizer includes a single plasticizer. In other cases, the plasticizer comprises a mixture of multiple plasticizer products. Suitable commercial plasticizers include (but are not limited to), for example, KN 4010 and KP 6030 from Sinopec (Beijing, China); Claire F55 from Tianjin (China); F550 from Formosa Petrochemical (China), and various polyisobutene products.
- The damping materials can optionally comprise one or more waxes, and these waxes (when employed) can vary widely. In some cases, the wax includes a single wax. In other cases, the wax comprises a mixture of multiple wax products. The wax can have a higher molecular weight so as to advantageously improve oil migration. Exemplary waxes include microcrystalline waxes, paraffin waxes, hydrocarbon waxes, and combinations thereof. Suitable commercial waxes include (but are not limited to), for example, Sasol wax 3971, 7835, 6403, 6805, and 1800 from Sasol (Houston, TX); A-C1702, A-C6702, A-C5180 from Honeywell (Morristown, NJ); and MICROWAX™ FG 7730 and MICROWAX™ FG 8113 from Paramelt (Muskegon, MI).
- The damping materials can comprise one or more powder additives selected to improve damping performance across a broader range of operating temperatures. In some embodiments, the damping materials comprise one or more acrylic-based powder additives. Suitable commercially available acrylic-base powder additives include SPHEROMERS® CA 6, SPHEROMERS® CA 10, SPHEROMERS® CA 15, KRATON® SBS 1101 AS, KRATON® SB 1011 AC, KRATON® TM 1116 Polymer, KRATON® D1101 A Polymer, KRATON® D1114 P Polymer KRATON® D1114 P Polymer, Zeon NIPOL® 1052, Zeon NIPOL®1041, and Zeon NIPOL®NS 612. In some embodiments, the damping materials comprise one or more silicone-based powder additives. Suitable commercially available silicone-base powder additives include Shin-Etsu KMP 597, Shin-Etsu KMP 600, and Shin-Etsu KMP 701.
- In some embodiments, the damping materials include one or more high surface area inorganic fillers or combinations of fillers and pigments such as carbon black, calcium carbonate, titanium dioxide, silica (hydrophilic and hydrophobic modified), mica, talc, kaolin, clay, diatomaceous earth, barium sulfate, aluminum sulfate, or mixtures of two or more thereof. Examples of commercially available high surface area inorganic fillers include those available from Evonik Degussa GmbH (Essen, Germany). Inorganic fillers including the foregoing examples can be used to modulate the damping and other physical properties of the damping patch. A wide variety of organic fillers could also or alternatively be used.
- In another embodiment, a useful filler combination includes an anti-blocking agent which is chosen depending on the processing and/or use conditions. Examples of such agents include, for example, silica, talc, diatomaceous earth, and any mixtures thereof. The filler particles can be finely divided substantially water-insoluble inorganic filler particles.
- The finely divided substantially water-insoluble inorganic filler particles can include particles of metal oxides. The metal oxide constituting the particles can be a simple metal oxide, i.e., the oxide of a single metal, or it can be a complex metal oxide, i.e., the oxide of two or more metals. The particles of metal oxide can be particles of a single metal oxide or they can be a mixture of different particles of different metal oxides. Examples of suitable metal oxides include, but are not limited to, alumina, silica, and titania. Other oxides can optionally be present in minor amount. Examples of such optional oxides include, but are not limited to, zirconia, hafnia, and yttria. Other metal oxides that can optionally be present are those that are ordinarily present as impurities such as for example, iron oxide. For purposes of the present specification and claims, silicon is considered to be a metal. When the particles are particles of alumina, most often the alumina is alumina monohydroxide. Particles of alumina monohydroxide, AlO(OH), and their preparation are known.
- Metallic powders can be used in the damping materials, for example, metal powders such as aluminum, copper or special steel, molybdenum disulfide, iron oxide, e.g., black iron oxide, antimony-doped titanium dioxide and nickel doped titanium dioxide. Metal alloy particulates can also be used.
- Additives, such as carbon black and other pigments, ultraviolet light absorbers, ultraviolet stabilizers, antioxidants, fire retardant agents, thermally or electrically conductive agents, post curing agents, and the like can be blended into the damping materials to modify the properties of the damping patch. These additives can also include, for example, one or more inhibitors, defoamers, colorants, luminescents, buffer agents, anti-blocking agents, wetting agents, matting agents, antistatic agents, acid scavengers, processing aids, extrusion aids, and others. Ultraviolet light absorbers include hydroxyphenyl benzotriazoles and hydrobenzophenones. Antioxidants include, for example, hindered phenols, amines, and sulfur and phosphorus hydroxide decomposers, such as Irganox 1520L. The fillers, pigments, plasticizers, flame retardants, UV stabilizers, and the like are optional in many embodiments and can be used at concentrations of from about 0 to about 30% or more, such as up to about 40% in particular embodiments. In certain embodiments, the total amount of fillers (inorganic and/or organic), pigments, plasticizers, flame retardants, UV stabilizers, and combinations thereof is from about 0.1% to about 30%, and more particularly from about 1% to about 20%.
- The damping materials can also comprise one or more solvents. Nonlimiting examples of suitable solvents include toluene, xylene, tetrahydrofuran, hexane, heptane, cyclohexane, cyclohexanone, methylene chloride, isopropanol, ethanol, ethyl acetate, butyl acetate, isopropyl acetate, and combinations thereof. It will be appreciated that the present subject matter damping materials are not limited to such solvents and can utilize a wide array of other solvents, additives, and/or viscosity adjusting agents, such as reactive diluents.
- The disclosed multilayer damping laminates may comprise at least one constraining layer. The constraining layer(s) can serve to provide rigidity and stiffness to the laminate structure, and to define and differentiate multiple discontinuous damping layers, when present, of the laminate. In some cases, the damping laminate comprises a first discontinuous damping layer and at least one additional discontinuous damping layer, wherein the first and at least one additional discontinuous damping layer are separated from one another by at least one constraining layer. In some embodiments, at least one constraining layer is an internal constraining layer, and at least a portion of the internal constraining layer is disposed between the first discontinuous damping layer at least one additional discontinuous damping layer. One face of the internal constraining layer can be directly adjacent to the first discontinuous damping layer, or there can be one or more intervening layers disposed between the internal constraining layer and the first discontinuous damping layer. An opposite face of the internal constraining layer can be directly adjacent to at least one additional discontinuous damping layer, or there can be one or more intervening layers disposed between the internal constraining layer and at least one additional discontinuous damping layer. The percent coverage of the internal constraining layer by the damping material regions of the first discontinuous damping layer can be as described above.
- In some cases, the multilayer damping laminate comprises an external constraining layer. An external constraining layer is a constraining layer that can provide an outer surface of the laminate, open to the external environment and opposite a substrate to which the laminate can be applied. At least a portion of at least one additional discontinuous damping layer of the laminate can be disposed between the first discontinuous damping layer and the external constraining layer. At least a portion of the second damping layer can be disposed between the internal constraining layer and the external constraining layer. One face of the external constraining layer can be directly adjacent to at least one additional discontinuous damping layer, or there can be one or more intervening layers between at least one additional discontinuous damping layer and the external constraining layer. In some cases, one face of at least one additional discontinuous damping layer is directly adjacent to the internal constraining layer, and an opposite face of at least one additional discontinuous damping layer is directly adjacent to the external constraining layer. The percent coverage of the external constraining layer by the damping material regions of at least one additional discontinuous damping layer can be as described above.
- The thickness of each constraining layer of the damping laminate can, for example, independently range from about 5 µm to about 3000 µm, e.g., from about 5 µm to about 2500 µm, from about 5 µm to about 2000 µm, from about 5 µm to about 1500 µm, from about 5 µm to about 1000 µm, from about 5 µm to about 500 µm, from about 5 µm to about 230 µm, from about 9.5 µm to about 440 µm, from about 18 µm to about 830 µm, from about 34 µm to about 1600 µm, or from about 65 µm to about 3000 µm. In terms of upper limits, the thickness of each constraining layer can independently be less than about 3000 µm, e.g., less than about 1600 µm, less than about 830 µm, less than about 440 µm, less than about 230 µm, less than about 120 µm, less than about 65 µm, less than about 34 µm, less than about 18 µm, or less than about 9.5 µm. In terms of lower limits, the thickness of each constraining layer can independently be greater than about 5 µm, greater than about 9.5 µm, greater than about 18 µm, greater than about 34 µm, greater than about 65 µm, greater than about 120 µm, greater than about 230 µm, greater than about 440 µm, greater than about 830 µm, or greater than about 1600 µm. Larger thicknesses, e.g., greater than about 3000 µm, and smaller thicknesses, e.g., less than about 5 µm, are also contemplated.
- Each constraining layer can independently comprise one or more stiffening materials that serve to provide a stiffened structure to each constraining layer, wherein each of the constraining layers can have a similar or different composition. The stiffening materials can include one or more polymeric materials. Nonlimiting examples of polymeric materials include polyvinyl chloride (PVC), polyolefins such as polyethylene (PE) and/or polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), polystyrene (PS), and combinations of these and other materials.
- In many embodiments, at least one constraining layer comprises a metal. The metal of at least one constraining layer may comprise at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium. In some embodiments, the metal is a metal powder. In other embodiments, the metal is a metal foil. In yet other embodiments, at least one constraining layer comprises both a metal powder and a metal foil. The metals may be stiffening materials and can include one or more metals or metal alloys. Nonlimiting examples of metals include aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium. In some embodiments, the internal constraining layer and the external constraining layer are each independently a metal foil, e.g., aluminum foil. Metal foils may include, but are not limited to, at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- The stiffening materials can include one or more natural or manufactured woods. The stiffening materials can include one or more fibers. Nonlimiting examples of fibers include hemp fibers, flax fibers, glass fibers, and carbon fibers. The stiffening materials can include one or more carbon based materials, including carbon nanotubes, graphene, diamond, carbine, or combinations thereof. Composite materials and combinations of these materials could also be used.
- In some cases, the multilayer laminate film further comprises a liner layer connected to the discontinuous damping layer. In one embodiment, the discontinuous damping layer may be first discontinuous damping layer. One face of the liner layer can be directly adjacent to the discontinuous damping layer, or there can be one or more intervening layers between the discontinuous damping layer and the liner layer. In some cases, one face of the discontinuous damping layer is directly adjacent to at least one constraining layer, and an opposite face of the discontinuous damping layer is directly adjacent to the liner layer. In one embodiment, the multilayer laminate film further comprises a liner layer connected to the first discontinuous damping layer opposite at least one constraining layer.
- The releasable liner can function as a protective cover such that the release liner remains in place until the multilayer damping laminate is ready for attachment to an object or surface. If a liner or release liner is included in the laminate, a wide array of materials and configurations can be used for the liner. In many embodiments, the liner is a paper or paper-based material. In many other embodiments, the liner is a polymeric film of one or more polymeric materials. Typically, at least one face of the liner is coated with a release material such as a silicone or silicone-based material. As will be appreciated, the release coated face of the liner is placed in contact with the otherwise exposed face of the outer discontinuous damping layer. Prior to application of the label to a surface of interest, the liner is removed to thereby expose the discontinuous damping layer of the laminate. The liner can be in the form of a single sheet. Alternatively, the liner can be in the form of multiple sections or panels.
- The present disclosure will be better understood in view of the following non-limiting examples.
- A sheet of adhesive transfer tape HPA 1905, commercially available from Avery Dennison, was cut into rectangular strips having widths of 0.500 inches (1.270 cm) to serve as damping material. These strips were then applied to sheets of aluminum foil backing having a thickness of 5 mil (125 µm), forming damping material regions of a discontinuous damping layer on the aluminum foil constraining layer. The strips were applied to the foil with two different gap region widths between adjacent strips. In one arrangement, gap regions having a 0.25-inch width were used such that approximately 75% of the surface area of the foil was covered by the adhesive strips. In a second arrangement, gap regions having 0.500-inch widths were used such that approximately 50% of the surface area of the foil was covered by the adhesive strips. One sheet having each adhesive strip arrangement was then laminated to another having an identical adhesive strip arrangement to create multilayer constrained layer damping structures, each having two discontinuous damping layers and two constraining layers.
FIG. 1 illustrates side views of the two prepared laminate structures (Comparative Examples A and B), as well as of a conventional control laminate structure control having continuous damping adhesive layers providing total coverage of its constraining aluminum foil layers. - Samples of each of the three above damping laminate structures were cut perpendicular to the adhesive strips, and tested using a Vibration Beam Technique apparatus according to the standard protocol SAE J1637_201306 to determine composite loss factors.
FIG. 2 shows the composite loss factor versus temperature for each of Comparative Examples A and B and the control laminate. From the graph it can be seen that the peak composite loss factors of the laminates having discontinuous damping layers (Comparative Examples A and B) were lower than that of the continuous damping layer control. These results demonstrate that some damping properties can be negatively impacted by the use of some discontinuous or patterned adhesive damping layers. - A laser cutter was then used to obtain narrower strips of the 4.9-mil HPA 1905 adhesive transfer tape damping material. The rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example C), 0.500 cm (Example 1), and 0.250 cm (Example 2). The damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures having the configurations shown in
FIGS. 4-6 . The Comparative Example D damping layer configuration shown inFIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths. The Example 1 damping layer configuration shown inFIG. 5 arranged damping material regions having 0.500-cm widths in parallel separated by gap regions having 0.100-cm widths. The Example 2 damping layer configuration shown inFIG. 6 arranged damping material regions having 0.250-cm widths in parallel separated by gap regions having 0.050-cm widths. In each case, the multilayer constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%. - The Comparative Example D and Examples 1 and 2 laminates were tested as described above using Vibration Beam Technique equipment and the SAE J1637_201306 protocol, with results of using the HPA 1905 adhesive shown in
FIG. 7 . From the composite loss factor trends of the graph it can be seen that the Comparative Example D multilayer laminate showed a decrease in peak damping as compared to the continuous damping layer control. In contrast, the Example 1 and Example 2 multilayer laminates (FIG. 5 and FIG. 6 ) showed a significant increase in peak composite loss factor compared to the control. These results demonstrated that decreasing the widths of the damping material regions and the gap regions of the discontinuous damping layer resulted in an advantageous increase in damping performance. - The laser cutter was then used to obtain narrower strips of the 2.4-mil HPA 1902 adhesive transfer tape damping material, also available from Avery Dennison. The rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example E), 0.50 cm (Example 3), and 0.250 cm (Example 4). The damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures also having the configurations shown in
FIGS. 3-5 , but with smaller 2.4-mil damping layer thicknesses. The Comparative Example D damping layer configuration shown inFIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths. The Example 1 damping layer configuration shown inFIG. 5 arranged damping material regions having 0.50-cm widths in parallel separated by gap regions having 0.100-cm widths. The Example 2 damping layer configuration shown inFIG. 6 arranged damping material regions having 0.250-cm widths in parallel separated by gap regions having 0.050-cm widths. In each case, the constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%. -
FIG. 7 depicts a graph with results of Vibration Beam Technique testing of the Comparative Example D and Examples 1 and 2 laminates (the laminates ofFIGS. 4-6 ) each having at least one discontinuous damping layer thickness of 5 mil. As with the HPA 1905 data, the composite loss factor trends ofFIG. 7 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 4 and 5 caused an increase in peak damping. These results further demonstrate the benefits of certain discontinuous damping layers in increasing damping performance and decreasing a required amount of damping material to achieve this performance. -
FIG. 8 is a graph of composite loss factors of the laminates ofFIGS. 4-6 each having at least one discontinuous damping layer thickness of 2 mil. Like the HPA 1905 data ofFIG. 7 , the composite loss factor trends ofFIG. 8 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 1 and 2 caused an increase in peak damping. These results further demonstrate the benefits of certain discontinuous damping layers in increasing damping performance and decreasing a required amount of damping material to achieve this performance. - The above findings are summarized in Table 1 below. The results demonstrate that that some damping properties can be positively impacted by the use of particular discontinuous or patterned adhesive damping layers. In particular, improvements in the peak composite loss factor were observed with the use of discontinuous damping layers characterized by one or more of an average gap region width less than 0.200 cm, an average damping material region width less than 1.000 cm.
Table 1. Discontinuous Damping Layer Results Comp. A Comp. B Comp. C Ex. 1 Ex. 2 Comp. D Ex. 3 Ex. 4 Layer thickness (µm) 120 120 120 120 120 61 61 61 Gap width (cm) 1.27 0.634 0.200 0.100 0.050 0.200 0.100 0.050 Damping width (cm) 1.27 1.27 1.000 0.500 0.250 1.000 0.500 0.250 Damping width / Gap width 1 2 5 5 5 5 5 5 Gap width / layer thickness 110 53 17 8.3 4.2 33 16 8.2 Damping width / layer thickness 110 110 83 42 21 160 82 41 Peak CLF change (%) -25 -13 -9 21 17 -6 6 15 - The present disclosure will be better understood in view of the following non-limiting examples.
- A sheet of adhesive transfer tape HPA 1905, commercially available from Avery Dennison, was cut into rectangular strips having widths of 0.500 inches (1.270 cm) to serve as damping material. These strips were then applied to sheets of aluminum foil backing having a thickness of 5 mil (125 µm), forming damping material regions of a discontinuous damping layer on the aluminum foil constraining layer. The strips were applied to the foil with two different gap region widths between adjacent strips. In one arrangement, gap regions having a 0.25-inch width were used such that approximately 75% of the surface area of the foil was covered by the adhesive strips. In a second arrangement, gap regions having 0.500-inch widths were used such that approximately 50% of the surface area of the foil was covered by the adhesive strips. One sheet having each adhesive strip arrangement was then laminated to another having an identical adhesive strip arrangement to create multilayer constrained layer damping structures, each having two discontinuous damping layers and two constraining layers.
FIG. 1 illustrates side views of the two prepared laminate structures (Comparative Examples A and B), as well as of a conventional control laminate structure control having continuous damping adhesive layers providing total coverage of its constraining aluminum foil layers. - Samples of each of the three above damping laminate structures were cut perpendicular to the adhesive strips, and tested using a Vibration Beam Technique apparatus according to the standard protocol SAE J1637_201306 to determine composite loss factors.
FIG. 2 shows the composite loss factor versus temperature for each of Comparative Examples A and B and the control laminate. From the graph it can be seen that the peak composite loss factors of the laminates having discontinuous damping layers (Comparative Examples A and B) were lower than that of the continuous damping layer control. These results demonstrate that some damping properties can be negatively impacted by the use of some discontinuous or patterned adhesive damping layers. - A laser cutter was then used to obtain narrower strips of the 4.9-mil HPA 1905 adhesive transfer tape damping material. The rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example C), 0.500 cm (Example 1), and 0.250 cm (Example 2). The damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures having the configurations shown in
FIGS. 4-6 . The Comparative Example D damping layer configuration shown inFIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths. The Example 1 damping layer configuration shown inFIG. 5 arranged damping material regions having 0.500-cm widths in parallel separated by gap regions having 0.100-cm widths. The Example 2 damping layer configuration shown inFIG. 6 arranged damping material regions having 0.250-cm widths in parallel separated by gap regions having 0.050-cm widths. In each case, the multilayer constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%. - The Comparative Example D and Examples 1 and 2 laminates were tested as described above using Vibration Beam Technique equipment and the SAE J1637_201306 protocol, with results of using the HPA 1905 adhesive shown in
FIG. 7 . From the composite loss factor trends of the graph it can be seen that the Comparative Example D multilayer laminate showed a decrease in peak damping as compared to the continuous damping layer control. In contrast, the Example 1 and Example 2 multilayer laminates (FIG. 5 and FIG. 6 ) showed a significant increase in peak composite loss factor compared to the control. These results demonstrated that decreasing the widths of the damping material regions and the gap regions of the discontinuous damping layer resulted in an advantageous increase in damping performance. - The laser cutter was then used to obtain narrower strips of the 2.4-mil HPA 1902 adhesive transfer tape damping material, also available from Avery Dennison. The rectangular cut adhesive strips formed damping material regions having widths of 1.000 cm (Comparative Example E), 0.50 cm (Example 3), and 0.250 cm (Example 4). The damping material regions were attached to aluminum foil constraining layers and laminated as described above to create multilayer constrained layer damping structures also having the configurations shown in
FIGS. 3-5 , but with smaller 2.4-mil damping layer thicknesses. The Comparative Example D damping layer configuration shown inFIG. 4 arranged damping material regions having 1.000-cm width in parallel separated by gap regions having 0.200-cm widths. The Example 1 damping layer configuration shown inFIG. 5 arranged damping material regions having 0.50-cm widths in parallel separated by gap regions having 0.100-cm widths. The Example 2 damping layer configuration shown inFIG. 6 arranged damping material regions having 0.250-cm widths in parallel separated by gap regions having 0.050-cm widths. In each case, the constrained layer damping structure had an overall length and width of approximately 30 cm by 10 cm, and the percent coverage of the aluminum foil constraining layers by the damping material regions of the discontinuous damping layers was approximately 83%. -
FIG. 7 depicts a graph with results of Vibration Beam Technique testing of the Comparative Example D and Examples 1 and 21aminates (the laminates ofFIGS. 4-6 ) each having at least one discontinuous damping layer thickness of 5 mil. As with the HPA 1905 data, the composite loss factor trends ofFIG. 7 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 4 and 5 caused an increase in peak damping. These results further demonstrate the benefits of certain discontinuous damping layers in increasing damping performance and decreasing a required amount of damping material to achieve this performance. -
FIG. 8 is a graph of composite loss factors of the laminates ofFIGS. 4-6 each having at least one discontinuous damping layer thickness of 2 mil. Like the HPA 1905 data ofFIG. 7 , the composite loss factor trends ofFIG. 8 show that the use of a larger discontinuous damping layer gap size as in Comparative Example D caused a decrease in peak damping, while the use of smaller discontinuous damping layer gap sizes as in Examples 1 and 2 caused an increase in peak damping. These results further demonstrate the benefits of certain discontinuous damping layers in increasing damping performance and decreasing a required amount of damping material to achieve this performance. - The above findings are summarized in Table 1 below. The results demonstrate that that some damping properties can be positively impacted by the use of particular discontinuous or patterned adhesive damping layers. In particular, improvements in the peak composite loss factor were observed with the use of discontinuous damping layers characterized by one or more of an average gap region width less than 0.200 cm, an average damping material region width less than 1.000 cm.
Table 1. Discontinuous Damping Layer Results Comp. A Comp. B Comp. C Ex. 1 Ex. 2 Comp. D Ex. 3 Ex. 4 Layer thickness (µm) 120 120 120 120 120 61 61 61 Gap width (cm) 1.27 0.634 0.200 0.100 0.050 0.200 0.100 0.050 Damping width (cm) 1.27 1.27 1.000 0.500 0.250 1.000 0.500 0.250 Damping width / Gap width 1 2 5 5 5 5 5 5 Gap width / layer thickness 110 53 17 8.3 4.2 33 16 8.2 Damping width / layer thickness 110 110 83 42 21 160 82 41 Peak CLF change (%) -25 -13 -9 21 17 -6 6 15
Claims (15)
- A multilayer damping laminate comprising:at least one constraining layer; anda discontinuous damping layer comprising one or more damping material regions and one or more gap regions,wherein a percent coverage of the discontinuous damping layer by the one or more damping material regions is less than about 99%, andwherein the multilayer damping laminate has a peak composite loss factor at about 200 Hz determined according to the standard protocol SAE J1637_201306 that is greater than about 0.05; andwherein an average width of the one or more gap regions measured according to the description is less than 0.200 cm.
- The multilayer damping laminate of claim 1, wherein any one or more of the following statements (A) to (C) applies:(A) the percent coverage of the discontinuous damping layer by the one or more damping material regions is less than or equal to about 90%;(B) the percent coverage of the discontinuous damping layer by the one or more damping material regions is greater than or equal to about 70%;(C) the percent coverage of the discontinuous damping layer by the one or more damping material regions is greater than about 50%.
- The multilayer damping laminate of claim 1 or 2, wherein either one or both of the following statements (A) and (B) applies:(A) an average width of the one or more damping material regions is less than or equal to about 1.000 cm;(B) the discontinuous damping layer is directly adjacent to at least one constraining layer.
- The multilayer damping laminate of any of claims 1-3, wherein either one or both of the following statements (A) and (B) applies:(A) a thickness of the discontinuous damping layer ranges from about 2 µm to about 5000 µm;(B) a thickness of at least one constraining layer ranges from about 5 µm to about 3000 µm.
- The multilayer damping laminate of any of claims 1-4, wherein each of the one or more damping material regions comprises a pressure sensitive adhesive.
- The multilayer damping laminate of any of claims 1-5, wherein at least one constraining layer comprises a metal.
- The multilayer damping laminate of claim 6, wherein either one of the following statements (A) and (B) applies:(A) the metal is a metal foil;(B) the metal comprises at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- The multilayer damping laminate of any of claims 1-7, further comprising:
a liner layer connected to the discontinuous damping layer opposite at least one constraining layer. - The multilayer damping laminate of any of claims 1-8, wherein the discontinuous damping layer is a first discontinuous damping layer, wherein at least one constraining layer is an internal constraining layer, and wherein the multilayer damping laminate further comprises:at least one additional discontinuous damping layer comprising one or more additional discontinuous layer damping material regions and one or more additional discontinuous damping layer gap regions, wherein at least a portion of the internal constraining layer is disposed between the first discontinuous damping layer and at least one additional discontinuous damping layer; andan external constraining layer, wherein at least a portion of at least one additional discontinuous damping layer is disposed between the internal constraining layer and the external constraining layer, and wherein the percent coverage of at least one additional discontinuous damping layer by the one or more additional discontinuous layer damping material regions is less than about 99%.
- The multilayer damping laminate of claim 9, wherein any one or more of the following statements (A) to (C) applies:(A) the percent coverage of at least one additional discontinuous damping layer by the one or more additional discontinuous layer damping material regions is less than or equal to about 90%;(B) the percent coverage of at least one additional discontinuous damping layer by the one or more additional discontinuous layer damping material regions is greater than about 70%;(C) the percent coverage of at least one additional discontinuous damping layer by the one or more additional discontinuous layer damping material regions is greater than about 50%.
- The multilayer damping laminate of any of claims 9-10, wherein any one or more of the following statements (A) to (F) applies:(A) the average width of the one or more additional damping layer gap regions is less than about 0.200 cm;(B) the average width of the one or more additional discontinuous damping layer damping material regions is less than about 1.000 cm;(C) at least one additional discontinuous damping layer is directly adjacent to the external constraining layer;(D) the thickness of at least one additional discontinuous damping layer ranges from about 2 µm to about 5000 µm;(E) the thickness of the external constraining layer ranges from about 5 µm to about 3000 µm;(F) one or more additional discontinuous damping layer damping material regions comprises a pressure sensitive adhesive.
- The multilayer damping laminate of any of claims 9-11, wherein the external constraining layer comprises metal;optionally wherein the metal is a metal foil;and further optionally wherein the metal comprises at least one metal of aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or osmium.
- The multilayer damping laminate of any of claims 1-8, wherein the discontinuous damping layer is a first discontinuous damping layer, wherein at least one constraining layer is a first internal constraining layer, and wherein the multilayer damping laminate further comprises:N additional discontinuous damping layers, wherein N is an integer greater than or equal to 2, wherein each additional discontinuous damping layer comprises one or more additional damping material regions and one or more additional gap regions, and wherein at least a portion of the first internal constraining layer is disposed between the first discontinuous damping layer and the first additional discontinuous damping layer; andM additional internal constraining layers, wherein M is an integer ranging from 1 to N-1, wherein at least a portion of each Mth additional internal constraining layer is disposed between the Mth additional discontinuous damping layer and the (M+1)th additional discontinuous damping layer, and wherein the percent coverage of the N additional discontinuous damping layers by the one or more additional damping material regions is less than about 99%; andan external constraining layer, wherein at least a portion of the Nth additional discontinuous damping layer is disposed between the (N-1)th additional internal constraining layer and the external constraining layer, and wherein the percent coverage of the N additional discontinuous damping layers by the one or more additional damping material regions is less than about 99%.
- A system comprising:a base substrate; andthe multilayer damping laminate of any of claims 1-13, wherein the discontinuous damping layer is connected to the base substrate.
- A method of reducing a vibration to a base substrate, the method comprising:
providing a base substrate that is subject to a vibration; and
connecting the discontinuous damping layer of the multilayer damping laminate of any of claims 1-14 to the base substrate, thereby reducing the vibration of the base substrate.
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US11701863B2 (en) | 2023-07-18 |
CA3100502A1 (en) | 2019-11-21 |
PL3793819T3 (en) | 2024-02-26 |
CN112423977B (en) | 2023-09-19 |
HUE063771T2 (en) | 2024-01-28 |
MX2020012326A (en) | 2021-06-15 |
US20210229400A1 (en) | 2021-07-29 |
EP3793819A1 (en) | 2021-03-24 |
JP2021524393A (en) | 2021-09-13 |
WO2019222352A1 (en) | 2019-11-21 |
CN112423977A (en) | 2021-02-26 |
DK3793819T3 (en) | 2023-11-27 |
KR20210010534A (en) | 2021-01-27 |
ES2960026T3 (en) | 2024-02-29 |
JP7344224B2 (en) | 2023-09-13 |
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