EP3782189A1 - Precision positioning device - Google Patents

Precision positioning device

Info

Publication number
EP3782189A1
EP3782189A1 EP19717309.9A EP19717309A EP3782189A1 EP 3782189 A1 EP3782189 A1 EP 3782189A1 EP 19717309 A EP19717309 A EP 19717309A EP 3782189 A1 EP3782189 A1 EP 3782189A1
Authority
EP
European Patent Office
Prior art keywords
chamber
precision positioning
substrate
positioning device
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19717309.9A
Other languages
German (de)
French (fr)
Inventor
Philippe Roquiny
José FERNANDES
Adrien ORLEANS
Philippe Bellet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Glass Europe SA
AGC Vidros do Brasil Ltda
AGC Inc
AGC Flat Glass North America Inc
Original Assignee
AGC Glass Europe SA
AGC Vidros do Brasil Ltda
Asahi Glass Co Ltd
AGC Flat Glass North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Glass Europe SA, AGC Vidros do Brasil Ltda, Asahi Glass Co Ltd, AGC Flat Glass North America Inc filed Critical AGC Glass Europe SA
Publication of EP3782189A1 publication Critical patent/EP3782189A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Definitions

  • the present invention relates to a precision positioning device, and a processing chamberwhich includes said precision positioning device, and methods using the same.
  • the processing chamber may be useful for the treatment of the surface of a substrate.
  • substrates of which surfaces have been subject to treatment using claimed processing chamber which includes said precision positioning device are substrates of which surfaces have been subject to treatment using claimed processing chamber which includes said precision positioning device.
  • the present precision positioning device is particularly useful for operations carried out in vacuum conditions or low pressure conditions and where environment cleanliness is of critical importance.
  • a processing chamber may be included in a multi-chamber system.
  • a multi-chamber system, or cluster tool is a modular system comprising multiple processing chambers.
  • a processing chamber may perform various functions including any one or more functions chosen among substrate center-finding, movement, and orientation, pressure modulation, ion implantation, deposition, annealing, capping and/or etching.
  • a processing chamber may be a load lock chamber, a transfer chamber or a substrate buffer chamber.
  • Precision positioning devices are useful to carry at least one substrate and precisely position said at least one substrate in a processing chamber.
  • the conditions in these processing chambers are low pressure or vacuum conditions, which may impact materials within the chamber and processes performed therein.
  • equipment, pieces of equipment, greases or lubricants present in and part of the processing chamber may be subject to outgassing, decomposition or chemical modification, which all may lead to pollutants being released and subsequently interfere with a process, for example be re-deposited on the substrate to process.
  • pollutants may also reduce the quality of the processed substrates and may render the process unreliable, together with requirements for frequent equipment clean up or replacement of said pieces of equipment.
  • Such impacted pieces include bearings, masks, belts, among others.
  • positioning devices useful in vacuum processing conditions call for specific materials, which may be expensive, and which may require frequent replacement. Such pieces frequently include plastic driving screws and nuts, plastic linear guiding system (with balls or rollers). Although they require little or no lubrication, they wear rapidly and require frequent replacement. In some instances, positioning devices useful in vacuum processing conditions comprise electrical motors used under vacuum. These are however difficult to cool and more prone to overheat or degrade, requiring costly replacement.
  • the present invention relates to a precision positioning device, provided with two chain drives.
  • the present invention also relates to a processing chamber which includes said precision positioning device.
  • the present invention relates to a method to process a substrate, carried by said precision positioning device as well as to the resulting processed substrate.
  • the present invention also relates to the use of a chain drive, in a precision positioning device.
  • the design and constituents of the present precision positioning device in particular provide for a device useful in vacuum or low pressure conditions, which can operate with limited outgassing or decomposition of materials, in particular in absence of carbon-containing species, which may be found in lubricants or in plastic components.
  • the present chain drive elements allow for smooth movement of the precision positioning device and for the reliable positioning of the at least one substrate in the at least one processing chamber of the multi-chamber system.
  • Figure 1 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
  • Figure 2 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
  • Figure 3 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
  • Figure 4 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
  • Figures 5a to 5d are schematic perspective views of substrate support frames for a precision positioning device according to an embodiment of the present invention.
  • Figure 6 is a schematic side view of a processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
  • Figure 7 is a schematic perspective view of a processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
  • Figure 8 is a schematic perspective view of a multi-chamber system comprising one processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
  • Figure 9 is a schematic perspective view of a multi-chamber system comprising one processing chamber comprising the precision positioning device, according to an embodiment of the present invention. Detailed description
  • the precision positioning device of the present invention providing at least two movements to a substrate or a substrate support frame, a first movement and a second movement transversal to the first movement, comprises
  • a first chain drive providing the first movement comprising one or more first contact elements for contacting the substrate or substrate support frame
  • a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, wherein the second movement provides movement to the first chain drive.
  • the first movement and the second movement are essentially linear movements, and perpendicular to one another.
  • the second movement moves the first chain drive, whereby this second movement is transferred to the substrate or substrate support frame which is in contact with the first chain drive.
  • the second movement induces a movement of the first chain drive, in a perpendicular direction to the first movement of said first chain drive. That is, when the second movement is effected, the first chain drive is consequently displaced.
  • the second chain drive is not in contact with the substrate or substrate support frame.
  • the first and second chain drives each comprise at least one chain.
  • the chains may be made of metal, ceramic or a mixture thereof.
  • the first one or more contact elements may be rotational contact elements, such as rollers or disks.
  • the first chain drive provides the first one or more rotational contact elements with rotational movement. This rotational movement is transferred by frictional contact to the substrate or substrate support frame, thereby generating the first movement thereof.
  • at least two rollers or disks may maintain the substrate or substrate support frame in a horizontal position.
  • the weight of the substrate or substrate support frame provides for sufficient frictional contact with the rollers or disks whose rotational movement, in the manner of a roller conveyor, generates the first movement.
  • the precision positioning device may be incorporated into a processing chamber, for example mounted to the bottom wall of said processing chamber. The two movements essentially move the substrate or substrate support frame along a two-dimensional plane.
  • the precision positioning device is configured to be suitable in vacuum atmosphere, where pressure may range of from 10 1 to 10 8 Pa. Alternative vacuum pressures may be reached, according to the required function of the processing chamber hosting the device, as will be outlined hereafter.
  • the precision positioning device of the present invention comprises:
  • a first chain drive providing the first movement, comprising one or more first contact elements for contacting the substrate or substrate support frame, and
  • a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, wherein the second movement provides movement to the first chain drive, and c. parallel to the direction of the second movement and spaced apart in the direction of the first movement,
  • the at least one guiding rail maintains the linearity of the second movement and supports part of the weight of the first chain drive.
  • the at least one support rail also supports part of the weight of the first chain drive.
  • the first chain drive comprises guiding contact elements and supporting contact elements that are in contact with the guiding rails and support rails respectively. Guiding and supporting contact elements preferably comprise wheels to roll along the guiding rails and support rails.
  • the first and/or second chain drives may comprise more than one chain.
  • the chain drive When there is only one chain, the chain drive may be referred to as a simplex chain drive.
  • the chain drive When there are two parallel chains, the chain drive may be referred to as a duplex chain drive.
  • the chain drive When there are three parallel chains, the chain drive may be referred to a triplex chain drive.
  • the precision positioning device of the present invention providing at least two movements to a substrate or a substrate support frame, a first movement and a second movement transversal to the first movement, comprises:
  • a first chain drive providing the first movement, comprising one or more first contact elements for contacting the substrate or substrate support frame, comprising guiding contact elements and supporting contact elements and b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, and at least one chain fixed to the one or more second contact elements, wherein the second movement provides movement to the first chain drive, c. parallel to the direction of the second movement and spaced apart in the direction of the first movement,
  • the first chain drive comprises a first support frame.
  • the one or more second contact elements are fixed to the first support frame which also rotably supports the at least one driving wheel and at least one driven wheel of the first chain drive.
  • the one or more second contact elements are directly fixed to the at least one chain of the second chain drive.
  • the second chain drive is not in contact with the substrate or substrate support frame.
  • the chain drives may be connected to motorization shafts.
  • the first chain drive may be connected to a first motorization shaft to operate the first movement, while the second chain drive may also be connected to a second motorization shaft to operate the second movement.
  • the first and/or second motors moving the first and second motorization shafts respectively are surrounded by air or an inert gas at atmospheric pressure.
  • the first and/or second motors are placed outside of the processing chamber enclosure, surrounded by air at atmospheric pressure. That is, the motors moving one or both of the motorization shafts are not under the low pressure or vacuum conditions imposed on the precision positioning device. Vacuum conditions may have an impact on the design, construction and wear of motors, and as such, motorization of the precision positioning device under atmospheric condition is a critical advantage in terms of cost saving, and resistance.
  • the weight of the chains used in the chain drives may impose larger loads on the motors, resulting in heating of the motors that is more easily dissipated under atmospheric pressure.
  • the first and second chain drives each comprises at least one chain and for every chain in a chain drive, at least 1 chain driving wheel and at least 1 chain driven wheel.
  • the chain may in particular be a roller chain.
  • the driving and driven wheels may be sprocket-wheels, or toothed wheels.
  • the driving wheel of the chain drive makes the connection to a motorization shaft.
  • the rotational motion of the driving wheel is directly induced by the motorization shaft.
  • the rotational motion of the driving wheel is transferred to the driven wheel through the chain.
  • the driving wheel of the first chain is slidably keyed on a first drive shaft allowing the first driving wheel to slide along the first drive shaft when moved by the second chain drive.
  • any one or more parts constituting the first and/or second chain drive may typically comprise or consist of a metallic or ceramic material or a mixture thereof, and may alternatively consist of metallic material. That is, the chain drive comprises as parts at least one chain, at least one driving wheel and at least one driven wheel, wherein any part may be made of metal or ceramic, or a combination of both.
  • the term metal includes metal as well as mixtures and alloys of metals, optionally comprising minor additional chemical elements. Examples of metals thus include iron, copper, zinc, tin, aluminium, tungsten, nickel, self-lubricating metals, steel, stainless steels, carbon or alloy steel, brass, bronze, and mixtures or alloys thereof.
  • ceramic include alumina, steatite. Ceramic parts may be useful when working at temperatures > 250°C.
  • the first chain drive comprises
  • the first chain contacts one first chain driving wheel and one or more first chain driven wheels and
  • the first parallel chain contacts at one first parallel chain driving wheel and one or more first parallel chain driven wheels.
  • the second chain drive comprises a. a second chain and a second parallel chain
  • the second chain contacts one second chain driving wheel and one or more second chain driven wheels and
  • the second parallel chain contacts at one second parallel chain driving wheel and one or more second parallel chain driven wheels.
  • the first chain driving wheel and first parallel chain driving wheel are axially slidably keyed to a first drive shaft. They thus rotate in a synchronous fashion and are able to slide along the first drive shaft when moved by the second chain drive.
  • the second chain drive thus induces movement to the first chain drive, and is in contact with said first chain drive via one or more second contact elements.
  • the one or more first driven wheel and one or more first parallel driven wheel are keyed to one or more driven shafts.
  • the first support frame rotably supports the first and first parallel driving wheels and drive shaft, and also supports the one or more first and first parallel driven wheels and driven shaft.
  • the driving shaft and/or one or more driven shafts are formed as rollers that are the first contacting elements for contacting the substrate or substrate support frame.
  • rollers or disks are keyed on the driving shaft and/or on the one or more driven shafts forming contacting elements for contacting the substrate or substrate support frame.
  • the second chain drive is not in direct contact with the substrate or substrate support frame.
  • the second movement induced to the substrate or substrate support frame is induced via the movement induced by the second chain drive to the first chain drive in contact with the substrate or substrate support frame.
  • a chain driving wheel may be connected to a motorization shaft, via a drive shaft, and thus transmit the rotational movement to the roller chain.
  • further tension rollers, or guides or idler wheels may be provided. Specific arrangements may be provided, as long as there are at least 1 chain driving wheel and at least 1 chain driven wheel to provoke rotation of the chain imparting the first and/or second movements to the precision positioning device.
  • the dimensions of the chains are defined according to ISO R606, where specific measurements for the pitch, width and roller diameter are defined, together with the dimensions of the sideplates (height and thickness).
  • Other standards for chain dimensions include ANSI B29.1 , JIS B1801 or ISO 1395C.
  • the chain may have a pitch having a size ranging of from 5 to 100 mm; the chain may have a width having a size ranging of from 3 to 60 mm; the chain may have a roller diameter having a size ranging of from 3 to 60 mm; the sideplates may have a height of from 5 to 90 mm and a thickness ranging of from 0.5 to 20 mm.
  • Lubrication of the chain drives may be provided. In this case any lubricated parts are preferably protected from any surface treatment processes performed on the substrate being moved. In some instances, lubrication of the chain drives may also be avoided. This will allow for absence of any release of carbon-containing species which may affect the quality of the treatment of the substrates.
  • the parts of the chain drive may be surface treated to reduce wear or friction. Such surface treatments include coating or surface implantation with ions. Coating may include polytetrafluoroethylene-based coatings.
  • Lubrication means include oils, waxes, graphite, tungsten disulfide and other known lubrication means. These lubrication products may tend to produce by- products when operated in certain conditions, such as vacuum conditions, conditions of temperatures > 100°C or radiation or plasma environments.
  • the precision positioning device of the present invention may additionally comprise a belt as part of a driving means, specifically a belt designed for processing under vacuum, that is, benefiting from limited outgassing.
  • the speed of the precision positioning device may range of from 0.05 m/min to 80 m/min, alternatively of from 0.05 m/min to 50 m/min, alternatively of from 0.1 m/min to 40 m/min, alternatively of from 0.2 m/min to 20 m/min.
  • Acceleration of the precision positioning device may range of from 0.01 to 10 m/s 2 , alternatively of from 0.1 to 5 m/s 2 .
  • the precision positioning device may allow for a high precision positioning of the substrate in the processing chamber.
  • the repeatability of the positioning of the precision positioning device is typically ⁇ 3 mm, alternatively ⁇ 1.5 mm.
  • the present invention also provides for a precision positioning table comprising a precision positioning device of the present invention and a substrate support frame.
  • the substrate support frame may be suitable for supporting one single substrate or more than one substrate.
  • the substrate support frame or the substrate will be in contact with the first contacting elements of the first chain drive.
  • Such substrate support frame may be designed to support substrates of varying shapes and sizes.
  • the outer perimeter of the substrate support frame will be larger than the total perimeter of the base of the precision positioning device. That is, when operated, the substrate support frame will typically be covering the operating surface of the chain drives, guiding rails, support rails of the movement mechanism of the precision positioning device. This will allow for protection of the movement mechanism during operations, as will be described later herein.
  • the substrate support frame is typically positioned on top of the precision positioning device and may be an open frame, with an opening of any shape (for example, square, rectangular or circular opening, among others), or a partial frame or a full plate, or a plate with voids or holes.
  • Non-limiting examples of support frames are provided in Figure 5.
  • the substrate support frame may be provided with blocking elements, in the form of either holes, extensions or fingers, or with any other means, to ensure the substrate(s) is (are) not displaced during movement of the precision positioning device or during treatment.
  • the substrate support frame may itself support a substrate support plate or container. That is, certain substrates (powders, or pieces smaller than 1 m 2 ) may be disposed on a tray or plate or container, disposed on the substrate support frame. Said tray or plate or container may then remain on the substrate support frame or be transferred upon processing, while carrying the substrates.
  • the substrate support frame is typically made of metal, glass, ceramic or mixtures thereof, or generally more rigid material which will be capable of undergoing the specific vacuum conditions or radiation environments during treatments discussed herein, while not generating by-products or pollutants.
  • the precision positioning device may be used in absence of the substrate support frame.
  • the substrate support frame is not mandatory for the proper functioning of the device, in particular for substrates having a size that is larger than the perimeter of the base of the precision positioning device, and/or rigid types of substrates and/or self-sustained substrates.
  • Figure 1 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 101.
  • the substrate support frame 101 is a plain flat plate, capable of movement in a first direction imparted by a first chain 102 driven by driving wheel 103, according to the drive shaft 104.
  • Several driven wheels 105 (105a, 105b and 105c indicated) are set up to have appropriate tension along the chain 102. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 106, along second guiding rail 107, with second support rail 108.
  • Figure 2 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 201.
  • the substrate support frame 201 is a plain flat plate, capable of movement in a first direction imparted by a chain 202 driven by driving wheel 203, according to the drive shaft 204, and first parallel chain 209.
  • Several driven wheels 205 (205a, 205b and 205i indicated) are set up to have appropriate tension along the first chain 202. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 206, along second guiding rail 207, with second support rails 208a and 208b.
  • Figure 3 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 301.
  • the substrate support frame 301 is a plain flat plate, capable of movement in a first direction imparted by a first chain 302 driven by first driving wheel 303, according to the drive shaft 304, and first parallel chain 308.
  • Several driven wheels 305 (305a, 305b and 305i indicated) are set up to have appropriate tension along the first chain 302. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 306, along second guiding rails 307a, 307b and 307c.
  • Figure 4 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 401.
  • the substrate support frame 401 is a plain flat plate, in contact with the first contacting element 410, capable of movement in a first direction (indicated by arrow X) imparted by a first chain drive comprising first chain 402 driven by first driving wheel 403, according to the drive shaft 404.
  • first driven wheels 405 (405a, 405b and 405i indicated) are set up to have appropriate tension along the first chain 402.
  • the second movement (indicated by arrow Y), perpendicular to the first movement, is imparted by a second chain 406, along second guiding rail 407 and second support rail 408.
  • a second contact element 409 for the second chain 406 is indicated.
  • Figure 5 represents various substrate support frames suitable for the present precision positioning device, such as Fig. 5a, a plain flat substrate support frame; Fig. 5b, a substrate support frame with a rectangular opening; Fig. 5c, a substrate support frame with an alternative rectangular opening; Fig. 5d, a substrate support frame with multiple pin holes opening.
  • the substrates may be processed within a processing chamber comprising a precision positioning device of the present invention.
  • the present invention further provides for a processing chamber comprising the present precision positioning device.
  • the present invention also provides for a processing chamber comprising the present precision positioning table.
  • the processing chamber is defining an inner space by means of at least 4 walls and upper roof and lower bottom, wherein at least one of said walls comprises an opening or slit to provide for transfer of substrates.
  • the precision positioning device is typically fixed on the bottom of the inner space of a processing chamber, and fastened to it through fastening means typically provided on the support rails and/or guiding rails and/or alternative fixing rails of the second chain drive.
  • Said processing chamber is selected from a surface treatment chamber, a load lock chamber, or a combination of such chambers.
  • a surface treatment chamber as provided herein is a chamber in which the surface of a substrate is modified, for example by way of element deposition, coating deposition, structure modification, cleaning, etching, implantation, irradiation, activation, or any other surface modification.
  • Examples of surface treatment chambers among which the processing chamber may be selected include physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, hot wire chemical vapor deposition (HWCVD) chamber, ion implantation chamber, ion doping chamber, plasma nitridation chamber, atomic layer deposition (ALD) chamber, evaporation chamber, plasma or vapor chemical etching chamber, laser annealing chamber, rapid thermal oxidation (RTO) chamber, rapid thermal nitridation (RTN) chamber, rapid thermal annealing (RTA) chamber, vapor etching chamber, plasma cleaning chamber, or a combination of such chambers.
  • PVD physical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • LPCVD low pressure chemical vapor deposition
  • HWCVD hot wire chemical vapor deposition
  • ion implantation chamber ion implantation chamber
  • a load lock chamber as provided herein is a chamber in which a substrate is temporarily hosted but not necessarily modified in its structure or composition, apart from optional modifications of the host conditions, such as pressure, temperature, by-products removal, or degassing.
  • load lock chambers among which the processing chamber may be selected include pressure modification chamber, alignment chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, heating chamber, cooling chamber, or a combination of such chambers.
  • the processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, ion doping chamber, plasma or vapor chemical etching chamber, pressure modification chamber, plasma cleaning, pressure modification chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
  • PVD physical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • LPCVD low pressure chemical vapor deposition
  • ion implantation chamber ion implantation chamber
  • ion doping chamber ion doping chamber
  • plasma or vapor chemical etching chamber plasma cleaning, pressure modification chamber, substrate reorientation chamber
  • transfer chamber transfer chamber
  • buffer chamber storage chamber
  • storage chamber storage chamber
  • loading chamber annealing chamber
  • measurement chamber measurement chamber
  • analysis chamber or
  • the processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, pressure modification chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
  • PVD physical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • LPCVD low pressure chemical vapor deposition
  • the processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, ion implantation chamber, pressure modification chamber, loading chamber, measurement chamber, analysis chamber, or a combination of such chambers.
  • PVD physical vapor deposition
  • PECVD plasma enhanced chemical vapor deposition
  • Pressure may be reduced to vacuum in a processing chamber comprising the precision positioning device.
  • the processing chamber may thus be pumped down to create a vacuum therein, or vented to provide an ambient condition therein. Venting may take place before removal or withdrawal of the device, in case a first load lock chamber is also used as“exit chamber”.
  • the pressure in the present process chamber will usually depend on the process being carried out within said process chamber, or be adjusted to satisfy the necessary conditions required.
  • the starting point may typically be atmospheric pressure, that is, 101 ,325 Pa (about 1.01 x 10 5 Pa).
  • the pressure may range of from 10- 1 to 10 8 Pa, alternatively of from 10 3 to 10 8 Pa, alternatively of from 10 3 to 10 6 Pa.
  • pressure in a PVD chamber or in an ion implantation chamber may range of from 10 3 to 10 6 Pa; pressure in an X-ray photoelectron spectroscopy chamber may range of from 10 8 to 10 9 Pa; pressure in an Auger electron spectroscopy chamber may range of from 10 7 to 10 8 Pa; pressure in a secondary ion mass spectroscopy chamber may range of from 1 CH to 10 6 Pa.
  • Vacuum in the processing chamber is effected by use of at least one standard main (or primary) pump or turbo pump, or any other pump type allowing to reach the process pressure. More than 1 standard or turbo pump may be used to provide for vacuum conditions in reduced amount of time. In some instances, more than one pump may be used, that is, 2, 3 or more, either type of standard or turbo pump.
  • vacuum conditions may be provided within less than 120 minutes, alternatively less than 60 minutes, alternatively less than 30 minutes.
  • the motor, or motors, operating the one or more motorization shaft of the precision positioning device are typically outside of the processing chamber, that is, the motor, or motors, are not in the vicinity of the precision positioning device within the pressure or vacuum conditions of the processing chamber comprising the precision positioning device, as discussed previously.
  • FIG. 6 is a schematic side view of a processing chamber comprising the precision positioning device, according to the present invention.
  • the precision positioning device 601 is disposed within the processing chamber 602, with a substrate support frame 603 on the top, underneath the processing source 604.
  • a conveyor 605, at atmospheric pressure may bring in support tray 606 within an optional load lock chamber 607, placed upstream of the processing chamber 602.
  • Said optional load lock chamber 607 may comprise one or more of substrate trays 608.
  • a sealing gate 609 may be present between the optional load lock chamber 607 and the processing chamber 602. Vacuum may be applied either within the optional load lock chamber 607 and/or within the processing chamber 602.
  • FIG. 7 is a schematic side view of a processing chamber comprising the precision positioning device, according to the present invention.
  • the precision positioning device 701 is disposed within the processing chamber 702, with a substrate support frame 703 on the top, underneath the multiple processing sources 704.
  • a conveyor 705, at atmospheric pressure may bring in support tray 706, through an optional sealing gate 710, within an optional load lock chamber 707, placed upstream of the processing chamber 702.
  • Said optional load lock chamber 707 may comprise one or more of substrate trays 708.
  • a sealing gate 709 may be present between the optional load lock chamber 707 and the processing chamber 702. Vacuum may be applied either within the optional load lock chamber 707 and/or within the processing chamber 702.
  • the present processing chamber may be an ion implantation processing chamber.
  • Such a chamber is designed such that the occupied room is minimized.
  • at least one ion beam generator is positioned above the surface of the substrate, that is, positioned on top of the processing chamber.
  • the ion beam is directed in a descending direction towards the substrate surface.
  • the ion beam may reach the surface from the perpendicular angle, but may also be redirected within the chamber such that is reaches the surface of the substrate in an angle of at least 5°, viewing from the horizontal plane surface of the substrate support frame.
  • the ion implantation process allows for modification and tuning of the various parameters such as ion type, dosage (10 11 to 10 18 cm- 2 ), ion energy (1 to 400 keV), ion flux (10 12 to 10 17 cnr 2 s- 1 ) among others, as required.
  • the ion beam diameter may range of from 5 mm to 1200 mm, alternatively of from 10 mm to 800 mm, alternatively of from 50 mm to 300 mm.
  • the ion implantation processing chamber may be equipped with at least one viewing window. Such a viewing window may be a view port from the top with an angular incidence (for example, an angle of 45°), allowing for a direct view on the treatment surface.
  • the ion implantation processing chamber may comprise more than one ion implantation source, such as, for example, 2, 3 or more.
  • the present precision positioning device may be also provided within an existing processing chamber, without impacting original set up and design of said existing processing chamber.
  • the present invention further provides for a multi-chamber system comprising at least one chamber comprising a precision positioning device, as discussed previously.
  • Typical multi-chamber systems or cluster tools include one or more of the processing chambers discussed above.
  • the various chambers may be organized in a linear sequence, or may be arranged in nonlinear sequence.
  • the substrate will typically evolve from one chamber to the next in a longitudinal pathway, the substrate being transferred from one chamber to the next in a longitudinal path.
  • multiple substrates may be hosted by the different chambers and progress along the path in respective order.
  • the parameters of the evolution of the substrates through the multiple chambers are modulated such that there is typically only one speed of progression of the substrates in the multi-chamber system organized in a linear sequence. This typically requires to adapt residence times or treatment efficiency of the different chambers to ensure steady speed.
  • the substrate will typically evolve from one chamber to the next in a non-longitudinal pathway. That is, the substrate will be transferred from one chamber to the next in a sequence defined by the treatment steps required and the timing required for each said treatments.
  • multiple substrates may be hosted by the different chambers and progress through the different chambers in respective order, or as required by the treatment steps. This allows for the substrates to each have respective residence times in the various chambers as required, while not blocking the line to one single speed of progression.
  • substrates While one or more substrates are hosted in processing chambers, other substrates may be hosted in transfer or load lock chambers and positions be exchanged and substrates possibly return to a chamber in which they were previously hosted. This allows for more flexibility in the assignments of the possible multiple treatment steps required.
  • a multi-chamber system thus generally comprises a plurality of chambers and robots and may be equipped with a microprocessor controller programmed to carry out the various processing methods performed in the multiple chambers and to operate the transfers between the various chambers.
  • multiple chambers may be mounted to a central transfer chamber which houses a robot adapted to shuttle substrates between the chambers.
  • some chambers may be aligned in linear arrangement and some other chambers may be mounted around a central transfer chamber.
  • Such a transfer chamber is typically maintained at a vacuum condition and provides an intermediate stage for shuttling substrates from one chamber to another and/or to a load lock chamber positioned at a front end of the milt-chamber system.
  • a loader is typically disposed in the front-end environment and capable of linear and/or rotational movement to shuttle trays of substrates between the load lock and processing chambers.
  • loaders may include carriages, trays, shuffles, among others.
  • a first chamber is typically disposed between the frond-end environment and a first processing chamber to facilitate substrate transfer between a generally ambient environment within the frond-end environment and a vacuum environment within a first processing chamber, such a pressure modification chamber .
  • the vacuum conditions may be provided within 15 minutes or less, alternatively 2 minutes or less, when more than one load lock chamber is used to reduce the pressure, that is, when pressure reduction is divided between several chambers.
  • the present precision positioning device provides for the advantage that the substrate support frame or the substrate may independently be transferred from one chamber to another, without requiring to off-load the carried substrates from the substrate support frame.
  • a lift or multiple cassette storage may be present in a chamber of the multi-chamber system.
  • the pressure modification may be more effectively applied, in that several substrate support frames may be set under vacuum conditions, prior or after any treatment.
  • An optional second or further processing chambers may also perform any number of processes such as discussed previously.
  • the multi-chamber system may comprise any robot or processor to effect transfer and movement of the substrates from one chamber to another.
  • the multi-chamber system may include a controller, which generally comprises a central processing unit (CPU), a memory, and support circuits and is coupled to and controls the multi-chamber system and its support systems, directly or, alternatively, via computers (or controllers) associated with the process chambers and/or the support systems.
  • a controller which generally comprises a central processing unit (CPU), a memory, and support circuits and is coupled to and controls the multi-chamber system and its support systems, directly or, alternatively, via computers (or controllers) associated with the process chambers and/or the support systems.
  • the controller may contain a computer-readable medium having instruction stored thereon for performing the methods described above in accordance with the embodiments of the invention.
  • the multi-chamber system according to the invention may be organized in a linear sequence or in a non-linear sequence.
  • a first non-limiting example of a multi-chamber system according to the present invention comprises, in any sequential order:
  • At least one load lock chamber a) At least one load lock chamber; b) At least one processing chamber comprising a precision positioning device as described previously.
  • a second non-limiting example of a multi-chamber system according to the present invention comprises, in any sequential order
  • a first processing chamber comprising a precision positioning device as described previously;
  • a second processing chamber optionally comprising a precision positioning device as described previously.
  • a third non-limiting example of a multi-chamber system according to the present invention may include, in any sequential order:
  • a first processing chamber comprising a precision positioning device as described previously;
  • a second processing chamber optionally comprising a precision positioning device as described previously
  • Optional further processing chambers each optionally comprising a precision positioning device as described previously.
  • any multi-chamber system may thus be considered, provided at least one of the processing chamber comprises the present precision positioning device, where the processing chamber may also be a load lock chamber or any chamber, as discussed previously.
  • FIG 8 is a schematic side view of a multi-chamber system comprising one processing chamber comprising the precision positioning device, according to the present invention.
  • the precision positioning device 801 is disposed within the processing chamber 802.
  • a first conveyor 803, at atmospheric pressure, is set up to bring in the support tray 804 within a first storage chamber 805, through an opening slit 806.
  • the first storage chamber 805, placed upstream from the processing chamber 802, may comprise one or more of substrate trays 807.
  • a sealing gate 808 may be present between the first storage chamber 805 and the processing chamber 802.
  • a second storage chamber 809 may be located downstream of the processing chamber 802, separted from it by way of a second sealing gate 810.
  • Pressure or vacuum regulation may take place either within the storage chambers 805 and/or 809, and/or within the processing chamber 802.
  • a second conveyor 81 1 at atmospheric pressure, is set up to receive the support tray 812 from the second storage chamber 809, through an opening slit 813.
  • FIG. 9 is a schematic upper view of an alternative multi-chamber system comprising one processing chamber comprising the precision positioning device, according to the present invention.
  • one precision positioning device 900 is disposed within processing chamber 901 , while processing chambers 902 and 903 and the central chamber 904 may each include a same or different precision positioing device.
  • a conveyor 905, at atmospheric pressure, is set up to bring in the support tray 906 within a first storage chamber 907, through an opening slit 908.
  • the first storage chamber 907, placed upstream from the central chamber 904, may comprise one or more of substrate trays 909.
  • a sealing gate 910 may be present between the first storage chamber 907 and the central chamber 904.
  • a method for processing a substrate comprising the steps of
  • a first non-limiting example of method of processing a substrate includes the steps of
  • the present invention also provides for a substrate having been subject to treatment within the processing chamber as described herein.
  • substrates include those substrates comprising glass; sapphire; polymers; elastomers; resins; metals, metal oxides or metal alloys; composite materials; or mixtures of these or other material.
  • polymers include polymethylmethacrylate, polyurethane, plastic, polyethylene, polypropylene, and mixtures or composites thereof.
  • the substrate may have varying shape, from planar to non-planar surfaces.
  • Planar surfaces include flat and/or convex and/or concave surfaces.
  • planar substrates include glass pieces, watch glasses, metal sheets, polymer sheets, or else.
  • Non-planar surfaces include those with holes, with indents.
  • Non-limiting examples of non-planar substrates include jewellery accessories (such as jewels and stones), engineering accessories (such as pistons, valves, bolts, nails, screws, needles, pins, links, balls, or else), electronic accessories (such as chips, electronic connectors, or else), polymeric accessories (such as phone covers, keyboard keys, computer covers, or else), and others.
  • the planar or non-planar substrates may have sizes ranging of from 1 x 10 6 m 2 to 25 m 2 .
  • Examples include wafers, electronic accessories having a surface as of 1 x 10- 6 m 2 ; watch glasses or polymeric pieces having a surface as of 1 x 10 4 m 2 ; or glass pieces having surfaces of from 1 to 25 m 2 , or pieces of from 0.05 to 1 m 2 , alternatively of from 0.05 to 0.4 m 2 .
  • the substrate may be a batch substrate in opposition to the above individual planar or non-planar substrates.
  • Such batch substrates include powders, grains, fibres, or the like.
  • powders include sand, glass powders, metal powders, metal oxide powders, polymeric powders, ceramic powders, and the like. Particle sizes of such powder may range of from 0.01 micron to 5 mm.
  • fibres include glass fibres, carbon fibres, polymeric fibres and the like.
  • An entirety of the surface of the substrate may be treated. In some situations, only a section or portion of the surface may be treated. In such instances, patterned masking may be provided to selectively uncover the portions of the surface to be treated. Such patterned masking are known in the art, and may be selected from photoresists, aluminium hard masks or polymeric masks.
  • the surface of the substrate may already have been processed by any of the above or other processes, prior to being processed in the present method. That is, the surface of the substrate may not be homogeneous throughout, before being subject to the present processing method. It may be composed of different materials, but also made of the same material having been subject to prior surface modifications.
  • Examples of processing operations performed on the substrate may include metal deposition, coating deposition, surface modification, surface treatment, and others. Modifications of characteristics of the substrates may be generated, such as modification of color, hydrophilicity/hydrophobicity, antibacterial character, porosity, adhesion, magnetic character, among others.
  • Last provided is the use of at least one chain drive comprising a metallic chain in a precision positioning device.
  • the chain drives allow for use of the precision positioning device in vacuum conditions. Examples
  • Comparative precision positioning device 1 has movement imparted by a plastic drive screw.
  • Comparative precision positioning device 2 has movement imparted by a belt made of acetal thermoplastic material.
  • Comparative precision positioning device 3 has movement imparted by crossed roller guides.
  • the present precision positioning device was thus incorporated in an ion implantation chamber, and process was carried out as outlined above for the comparative precision positioning devices. Analysis of the ion implanted samples did not allow to detect elements which were not intentionally implanted, even when the ion implantation beam came into contact with parts of the precision positioning device.
  • the present precision positioning device successfully provides for less sources of polluting species, such as carbon.

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a precision positioning device, and a processing chamber which includes said precision positioning device, and methods using the same. The processing chamber may be useful for the treatment of the surface of a substrate. Also provided are substrates of which surfaces have been subject to treatment using claimed processing chamber which includes said precision positioning device. The present precision positioning device is particularly useful for operations carried out in vacuum conditions or low pressure conditions and where environment cleanliness is of critical importance.

Description

Precision positioning device
Field of the invention
[0001] The present invention relates to a precision positioning device, and a processing chamberwhich includes said precision positioning device, and methods using the same. The processing chamber may be useful for the treatment of the surface of a substrate. Also provided are substrates of which surfaces have been subject to treatment using claimed processing chamber which includes said precision positioning device. The present precision positioning device is particularly useful for operations carried out in vacuum conditions or low pressure conditions and where environment cleanliness is of critical importance.
Background of the invention
[0002] Generally, a processing chamber may be included in a multi-chamber system. A multi-chamber system, or cluster tool, is a modular system comprising multiple processing chambers. A processing chamber may perform various functions including any one or more functions chosen among substrate center-finding, movement, and orientation, pressure modulation, ion implantation, deposition, annealing, capping and/or etching. A processing chamber may be a load lock chamber, a transfer chamber or a substrate buffer chamber.
[0003] Precision positioning devices are useful to carry at least one substrate and precisely position said at least one substrate in a processing chamber. In some instances, the conditions in these processing chambers are low pressure or vacuum conditions, which may impact materials within the chamber and processes performed therein. In those instances, equipment, pieces of equipment, greases or lubricants present in and part of the processing chamber may be subject to outgassing, decomposition or chemical modification, which all may lead to pollutants being released and subsequently interfere with a process, for example be re-deposited on the substrate to process. Such pollutants may also reduce the quality of the processed substrates and may render the process unreliable, together with requirements for frequent equipment clean up or replacement of said pieces of equipment. Such impacted pieces include bearings, masks, belts, among others.
[0004] As such, positioning devices useful in vacuum processing conditions call for specific materials, which may be expensive, and which may require frequent replacement. Such pieces frequently include plastic driving screws and nuts, plastic linear guiding system (with balls or rollers). Although they require little or no lubrication, they wear rapidly and require frequent replacement. In some instances, positioning devices useful in vacuum processing conditions comprise electrical motors used under vacuum. These are however difficult to cool and more prone to overheat or degrade, requiring costly replacement.
[0005] There is thus still a need for reliable precision positioning devices, which do not have the disadvantages of the prior art, and as such, are able to withstand processing under vacuum conditions and, additionally, require reduced maintenance.
Summary of the invention
[0006] The present invention relates to a precision positioning device, provided with two chain drives.
[0007] The present invention also relates to a processing chamber which includes said precision positioning device.
[0008] Further the present invention relates to a method to process a substrate, carried by said precision positioning device as well as to the resulting processed substrate.
[0009] The present invention also relates to the use of a chain drive, in a precision positioning device.
[0010] The design and constituents of the present precision positioning device in particular provide for a device useful in vacuum or low pressure conditions, which can operate with limited outgassing or decomposition of materials, in particular in absence of carbon-containing species, which may be found in lubricants or in plastic components. [001 1] The present chain drive elements allow for smooth movement of the precision positioning device and for the reliable positioning of the at least one substrate in the at least one processing chamber of the multi-chamber system.
Brief description of the drawings
[0012] Figure 1 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
[0013] Figure 2 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
[0014] Figure 3 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
[0015] Figure 4 is a schematic perspective view of a precision positioning device according to an embodiment of the present invention, with a substrate support frame.
[0016] Figures 5a to 5d are schematic perspective views of substrate support frames for a precision positioning device according to an embodiment of the present invention.
[0017] Figure 6 is a schematic side view of a processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
[0018] Figure 7 is a schematic perspective view of a processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
[0019] Figure 8 is a schematic perspective view of a multi-chamber system comprising one processing chamber comprising a precision positioning device, according to an embodiment of the present invention.
[0020] Figure 9 is a schematic perspective view of a multi-chamber system comprising one processing chamber comprising the precision positioning device, according to an embodiment of the present invention. Detailed description
[0021] The precision positioning device of the present invention providing at least two movements to a substrate or a substrate support frame, a first movement and a second movement transversal to the first movement, comprises
a. a first chain drive providing the first movement comprising one or more first contact elements for contacting the substrate or substrate support frame, and
b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, wherein the second movement provides movement to the first chain drive.
[0022] The first movement and the second movement are essentially linear movements, and perpendicular to one another. The second movement moves the first chain drive, whereby this second movement is transferred to the substrate or substrate support frame which is in contact with the first chain drive. The second movement induces a movement of the first chain drive, in a perpendicular direction to the first movement of said first chain drive. That is, when the second movement is effected, the first chain drive is consequently displaced. The second chain drive is not in contact with the substrate or substrate support frame.
[0023] The first and second chain drives each comprise at least one chain. The chains may be made of metal, ceramic or a mixture thereof.
[0024] The first one or more contact elements may be rotational contact elements, such as rollers or disks. The first chain drive provides the first one or more rotational contact elements with rotational movement. This rotational movement is transferred by frictional contact to the substrate or substrate support frame, thereby generating the first movement thereof. Typically at least two rollers or disks may maintain the substrate or substrate support frame in a horizontal position. The weight of the substrate or substrate support frame provides for sufficient frictional contact with the rollers or disks whose rotational movement, in the manner of a roller conveyor, generates the first movement. [0025] The precision positioning device may be incorporated into a processing chamber, for example mounted to the bottom wall of said processing chamber. The two movements essentially move the substrate or substrate support frame along a two-dimensional plane.
[0026] The precision positioning device is configured to be suitable in vacuum atmosphere, where pressure may range of from 10 1 to 10 8 Pa. Alternative vacuum pressures may be reached, according to the required function of the processing chamber hosting the device, as will be outlined hereafter.
[0027] In an embodiment of the present invention, the precision positioning device of the present invention comprises:
a. a first chain drive providing the first movement, comprising one or more first contact elements for contacting the substrate or substrate support frame, and
b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, wherein the second movement provides movement to the first chain drive, and c. parallel to the direction of the second movement and spaced apart in the direction of the first movement,
i. at least one guiding rail and
ii. at least one support rail.
[0028] The at least one guiding rail maintains the linearity of the second movement and supports part of the weight of the first chain drive. The at least one support rail also supports part of the weight of the first chain drive. In certain embodiments of the present invention the first chain drive comprises guiding contact elements and supporting contact elements that are in contact with the guiding rails and support rails respectively. Guiding and supporting contact elements preferably comprise wheels to roll along the guiding rails and support rails.
[0029] According to an embodiment of the present invention the first and/or second chain drives may comprise more than one chain. When there is only one chain, the chain drive may be referred to as a simplex chain drive. When there are two parallel chains, the chain drive may be referred to as a duplex chain drive. When there are three parallel chains, the chain drive may be referred to a triplex chain drive.
[0030] According to another embodiment, the precision positioning device of the present invention providing at least two movements to a substrate or a substrate support frame, a first movement and a second movement transversal to the first movement, comprises:
a. a first chain drive providing the first movement, comprising one or more first contact elements for contacting the substrate or substrate support frame, comprising guiding contact elements and supporting contact elements and b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, and at least one chain fixed to the one or more second contact elements, wherein the second movement provides movement to the first chain drive, c. parallel to the direction of the second movement and spaced apart in the direction of the first movement,
i. at least one guiding rail and
ii. at least one support rail.
d. wherein the one or more second contact elements are attached to the first chain drive.
[0031] According to an embodiment of the present precision positioning device, the first chain drive comprises a first support frame. In particular the one or more second contact elements are fixed to the first support frame which also rotably supports the at least one driving wheel and at least one driven wheel of the first chain drive. In particular the one or more second contact elements are directly fixed to the at least one chain of the second chain drive. The second chain drive is not in contact with the substrate or substrate support frame.
[0032] The chain drives may be connected to motorization shafts. The first chain drive may be connected to a first motorization shaft to operate the first movement, while the second chain drive may also be connected to a second motorization shaft to operate the second movement.
[0033] In a particular embodiment of the processing chamber of the present invention, the first and/or second motors moving the first and second motorization shafts respectively are surrounded by air or an inert gas at atmospheric pressure. In particular, when the processing chamber is operated under reduced pressure or vacuum, the first and/or second motors are placed outside of the processing chamber enclosure, surrounded by air at atmospheric pressure. That is, the motors moving one or both of the motorization shafts are not under the low pressure or vacuum conditions imposed on the precision positioning device. Vacuum conditions may have an impact on the design, construction and wear of motors, and as such, motorization of the precision positioning device under atmospheric condition is a critical advantage in terms of cost saving, and resistance. Furthermore it was found that the weight of the chains used in the chain drives may impose larger loads on the motors, resulting in heating of the motors that is more easily dissipated under atmospheric pressure.
[0034] In a typical embodiment of the present invention, the first and second chain drives each comprises at least one chain and for every chain in a chain drive, at least 1 chain driving wheel and at least 1 chain driven wheel. The chain may in particular be a roller chain. The driving and driven wheels may be sprocket-wheels, or toothed wheels. The driving wheel of the chain drive makes the connection to a motorization shaft. The rotational motion of the driving wheel is directly induced by the motorization shaft. The rotational motion of the driving wheel is transferred to the driven wheel through the chain. The driving wheel of the first chain is slidably keyed on a first drive shaft allowing the first driving wheel to slide along the first drive shaft when moved by the second chain drive.
[0035] In the present precision positioning device, any one or more parts constituting the first and/or second chain drive may typically comprise or consist of a metallic or ceramic material or a mixture thereof, and may alternatively consist of metallic material. That is, the chain drive comprises as parts at least one chain, at least one driving wheel and at least one driven wheel, wherein any part may be made of metal or ceramic, or a combination of both. In the present scope, the term metal includes metal as well as mixtures and alloys of metals, optionally comprising minor additional chemical elements. Examples of metals thus include iron, copper, zinc, tin, aluminium, tungsten, nickel, self-lubricating metals, steel, stainless steels, carbon or alloy steel, brass, bronze, and mixtures or alloys thereof. Examples of ceramic include alumina, steatite. Ceramic parts may be useful when working at temperatures > 250°C.
[0036] In an embodiment of the present invention the first chain drive comprises
a. a first chain and a first parallel chain,
i. the first chain contacts one first chain driving wheel and one or more first chain driven wheels and
ii. the first parallel chain contacts at one first parallel chain driving wheel and one or more first parallel chain driven wheels.
[0037] In an embodiment of the present invention the second chain drive comprises a. a second chain and a second parallel chain,
i. the second chain contacts one second chain driving wheel and one or more second chain driven wheels and
ii. the second parallel chain contacts at one second parallel chain driving wheel and one or more second parallel chain driven wheels.
[0038] The first chain driving wheel and first parallel chain driving wheel are axially slidably keyed to a first drive shaft. They thus rotate in a synchronous fashion and are able to slide along the first drive shaft when moved by the second chain drive. The second chain drive thus induces movement to the first chain drive, and is in contact with said first chain drive via one or more second contact elements.
[0039] The one or more first driven wheel and one or more first parallel driven wheel are keyed to one or more driven shafts.
[0040] The first support frame rotably supports the first and first parallel driving wheels and drive shaft, and also supports the one or more first and first parallel driven wheels and driven shaft. [0041] In an embodiment of the present invention, the driving shaft and/or one or more driven shafts are formed as rollers that are the first contacting elements for contacting the substrate or substrate support frame. In an alternate embodiment of the present invention, rollers or disks are keyed on the driving shaft and/or on the one or more driven shafts forming contacting elements for contacting the substrate or substrate support frame. In such a configuration, the second chain drive is not in direct contact with the substrate or substrate support frame. The second movement induced to the substrate or substrate support frame is induced via the movement induced by the second chain drive to the first chain drive in contact with the substrate or substrate support frame.
[0042] According to the present invention a chain driving wheel may be connected to a motorization shaft, via a drive shaft, and thus transmit the rotational movement to the roller chain. In order to support the chain and regulate its length and tension, further tension rollers, or guides or idler wheels may be provided. Specific arrangements may be provided, as long as there are at least 1 chain driving wheel and at least 1 chain driven wheel to provoke rotation of the chain imparting the first and/or second movements to the precision positioning device.
[0043] The dimensions of the chains are defined according to ISO R606, where specific measurements for the pitch, width and roller diameter are defined, together with the dimensions of the sideplates (height and thickness). Other standards for chain dimensions include ANSI B29.1 , JIS B1801 or ISO 1395C. As such, the chain may have a pitch having a size ranging of from 5 to 100 mm; the chain may have a width having a size ranging of from 3 to 60 mm; the chain may have a roller diameter having a size ranging of from 3 to 60 mm; the sideplates may have a height of from 5 to 90 mm and a thickness ranging of from 0.5 to 20 mm.
[0044] Lubrication of the chain drives may be provided. In this case any lubricated parts are preferably protected from any surface treatment processes performed on the substrate being moved. In some instances, lubrication of the chain drives may also be avoided. This will allow for absence of any release of carbon-containing species which may affect the quality of the treatment of the substrates. [0045] The parts of the chain drive may be surface treated to reduce wear or friction. Such surface treatments include coating or surface implantation with ions. Coating may include polytetrafluoroethylene-based coatings.
[0046] Lubrication means include oils, waxes, graphite, tungsten disulfide and other known lubrication means. These lubrication products may tend to produce by- products when operated in certain conditions, such as vacuum conditions, conditions of temperatures > 100°C or radiation or plasma environments.
[0047] In some instances, the precision positioning device of the present invention may additionally comprise a belt as part of a driving means, specifically a belt designed for processing under vacuum, that is, benefiting from limited outgassing.
[0048] Further advantages of the chain drives in the present precision positioning device are the’’smooth” movement, and regular speed. The speed of the precision positioning device may range of from 0.05 m/min to 80 m/min, alternatively of from 0.05 m/min to 50 m/min, alternatively of from 0.1 m/min to 40 m/min, alternatively of from 0.2 m/min to 20 m/min. Acceleration of the precision positioning device may range of from 0.01 to 10 m/s2, alternatively of from 0.1 to 5 m/s2. These values allow for a movement which limits shocks due to movement inertia or potential chain malfunction, and which also limits secondary movement of the substrates on the precision positioning device.
[0049] The precision positioning device may allow for a high precision positioning of the substrate in the processing chamber. The repeatability of the positioning of the precision positioning device is typically < 3 mm, alternatively < 1.5 mm.
[0050] The present invention also provides for a precision positioning table comprising a precision positioning device of the present invention and a substrate support frame. The substrate support frame may be suitable for supporting one single substrate or more than one substrate. The substrate support frame or the substrate will be in contact with the first contacting elements of the first chain drive.
[0051] Such substrate support frame may be designed to support substrates of varying shapes and sizes. Typically, the outer perimeter of the substrate support frame will be larger than the total perimeter of the base of the precision positioning device. That is, when operated, the substrate support frame will typically be covering the operating surface of the chain drives, guiding rails, support rails of the movement mechanism of the precision positioning device. This will allow for protection of the movement mechanism during operations, as will be described later herein.
[0052] With the precision positioning device of the present invention positioned so the substrates are typically positioned on the first contacting elements, or on top of the substrate support frame which contacts the first contacting elements, with the substrate surface to be treated facing upwards. The substrate support frame is typically positioned on top of the precision positioning device and may be an open frame, with an opening of any shape (for example, square, rectangular or circular opening, among others), or a partial frame or a full plate, or a plate with voids or holes. Non-limiting examples of support frames are provided in Figure 5.
[0053] The substrate support frame may be provided with blocking elements, in the form of either holes, extensions or fingers, or with any other means, to ensure the substrate(s) is (are) not displaced during movement of the precision positioning device or during treatment.
[0054] The substrate support frame may itself support a substrate support plate or container. That is, certain substrates (powders, or pieces smaller than 1 m2) may be disposed on a tray or plate or container, disposed on the substrate support frame. Said tray or plate or container may then remain on the substrate support frame or be transferred upon processing, while carrying the substrates.
[0055] The substrate support frame is typically made of metal, glass, ceramic or mixtures thereof, or generally more rigid material which will be capable of undergoing the specific vacuum conditions or radiation environments during treatments discussed herein, while not generating by-products or pollutants.
[0056] The precision positioning device may be used in absence of the substrate support frame. The substrate support frame is not mandatory for the proper functioning of the device, in particular for substrates having a size that is larger than the perimeter of the base of the precision positioning device, and/or rigid types of substrates and/or self-sustained substrates.
[0057] Figure 1 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 101. The substrate support frame 101 is a plain flat plate, capable of movement in a first direction imparted by a first chain 102 driven by driving wheel 103, according to the drive shaft 104. Several driven wheels 105 (105a, 105b and 105c indicated) are set up to have appropriate tension along the chain 102. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 106, along second guiding rail 107, with second support rail 108.
[0058] Figure 2 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 201. The substrate support frame 201 is a plain flat plate, capable of movement in a first direction imparted by a chain 202 driven by driving wheel 203, according to the drive shaft 204, and first parallel chain 209. Several driven wheels 205 (205a, 205b and 205i indicated) are set up to have appropriate tension along the first chain 202. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 206, along second guiding rail 207, with second support rails 208a and 208b.
[0059] Figure 3 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 301. The substrate support frame 301 is a plain flat plate, capable of movement in a first direction imparted by a first chain 302 driven by first driving wheel 303, according to the drive shaft 304, and first parallel chain 308. Several driven wheels 305 (305a, 305b and 305i indicated) are set up to have appropriate tension along the first chain 302. Movement in the second direction, perpendicular to the first movement, is imparted by a second chain 306, along second guiding rails 307a, 307b and 307c. [0060] Figure 4 represents a precision positioning table comprising a precision positioning device according to the present invention, with a substrate support frame 401. The substrate support frame 401 is a plain flat plate, in contact with the first contacting element 410, capable of movement in a first direction (indicated by arrow X) imparted by a first chain drive comprising first chain 402 driven by first driving wheel 403, according to the drive shaft 404. Several first driven wheels 405 (405a, 405b and 405i indicated) are set up to have appropriate tension along the first chain 402. The second movement (indicated by arrow Y), perpendicular to the first movement, is imparted by a second chain 406, along second guiding rail 407 and second support rail 408. A second contact element 409 for the second chain 406 is indicated.
[0061] In each of Figures 1 to 4, the precision positioning device is fixed on the bottom wall of the inner space of a processing chamber, not shown, as will be discussed herein further.
[0062] Figure 5 represents various substrate support frames suitable for the present precision positioning device, such as Fig. 5a, a plain flat substrate support frame; Fig. 5b, a substrate support frame with a rectangular opening; Fig. 5c, a substrate support frame with an alternative rectangular opening; Fig. 5d, a substrate support frame with multiple pin holes opening.
[0063] Once positioned, the substrates may be processed within a processing chamber comprising a precision positioning device of the present invention.
[0064] The present invention further provides for a processing chamber comprising the present precision positioning device.
[0065] The present invention also provides for a processing chamber comprising the present precision positioning table.
[0066] The processing chamber is defining an inner space by means of at least 4 walls and upper roof and lower bottom, wherein at least one of said walls comprises an opening or slit to provide for transfer of substrates. The precision positioning device is typically fixed on the bottom of the inner space of a processing chamber, and fastened to it through fastening means typically provided on the support rails and/or guiding rails and/or alternative fixing rails of the second chain drive.
[0067] Said processing chamber is selected from a surface treatment chamber, a load lock chamber, or a combination of such chambers.
[0068] A surface treatment chamber as provided herein is a chamber in which the surface of a substrate is modified, for example by way of element deposition, coating deposition, structure modification, cleaning, etching, implantation, irradiation, activation, or any other surface modification. Examples of surface treatment chambers among which the processing chamber may be selected, include physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, hot wire chemical vapor deposition (HWCVD) chamber, ion implantation chamber, ion doping chamber, plasma nitridation chamber, atomic layer deposition (ALD) chamber, evaporation chamber, plasma or vapor chemical etching chamber, laser annealing chamber, rapid thermal oxidation (RTO) chamber, rapid thermal nitridation (RTN) chamber, rapid thermal annealing (RTA) chamber, vapor etching chamber, plasma cleaning chamber, or a combination of such chambers.
[0069] A load lock chamber as provided herein is a chamber in which a substrate is temporarily hosted but not necessarily modified in its structure or composition, apart from optional modifications of the host conditions, such as pressure, temperature, by-products removal, or degassing. Examples of load lock chambers among which the processing chamber may be selected, include pressure modification chamber, alignment chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, heating chamber, cooling chamber, or a combination of such chambers.
[0070] The processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, ion doping chamber, plasma or vapor chemical etching chamber, pressure modification chamber, plasma cleaning, pressure modification chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
[0071] The processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, pressure modification chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
[0072] The processing chamber may alternatively be selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, ion implantation chamber, pressure modification chamber, loading chamber, measurement chamber, analysis chamber, or a combination of such chambers.
[0073] Pressure may be reduced to vacuum in a processing chamber comprising the precision positioning device. The processing chamber may thus be pumped down to create a vacuum therein, or vented to provide an ambient condition therein. Venting may take place before removal or withdrawal of the device, in case a first load lock chamber is also used as“exit chamber”.
[0074] Vacuum may typically be classified in rough vacuum, having a pressure ranging of from atmospheric pressure to 10 1 Pa (= 10 3 mbar); high vacuum, having a pressure ranging of from 10 1 to 10 6 Pa (= 10 3 to 10 8 mbar); and ultrahigh vacuum having a pressure ranging of from 106 to 10 10 Pa (= 10 8 to 10 12 mbar).
[0075] The pressure in the present process chamber will usually depend on the process being carried out within said process chamber, or be adjusted to satisfy the necessary conditions required. The starting point may typically be atmospheric pressure, that is, 101 ,325 Pa (about 1.01 x 105 Pa).
[0076] When vacuum is set in the present processing chamber, that is, when the pressure is no longer atmospheric pressure, the pressure may range of from 10- 1 to 10 8 Pa, alternatively of from 10 3 to 10 8 Pa, alternatively of from 10 3 to 10 6 Pa.
[0077] For example, pressure in a PVD chamber or in an ion implantation chamber may range of from 10 3 to 10 6 Pa; pressure in an X-ray photoelectron spectroscopy chamber may range of from 10 8 to 10 9 Pa; pressure in an Auger electron spectroscopy chamber may range of from 10 7 to 10 8 Pa; pressure in a secondary ion mass spectroscopy chamber may range of from 1 CH to 10 6 Pa.
[0078] Vacuum in the processing chamber is effected by use of at least one standard main (or primary) pump or turbo pump, or any other pump type allowing to reach the process pressure. More than 1 standard or turbo pump may be used to provide for vacuum conditions in reduced amount of time. In some instances, more than one pump may be used, that is, 2, 3 or more, either type of standard or turbo pump.
[0079] Typically, vacuum conditions may be provided within less than 120 minutes, alternatively less than 60 minutes, alternatively less than 30 minutes.
[0080] The motor, or motors, operating the one or more motorization shaft of the precision positioning device are typically outside of the processing chamber, that is, the motor, or motors, are not in the vicinity of the precision positioning device within the pressure or vacuum conditions of the processing chamber comprising the precision positioning device, as discussed previously.
[0081] Figure 6 is a schematic side view of a processing chamber comprising the precision positioning device, according to the present invention. The precision positioning device 601 is disposed within the processing chamber 602, with a substrate support frame 603 on the top, underneath the processing source 604. Optionally, a conveyor 605, at atmospheric pressure, may bring in support tray 606 within an optional load lock chamber 607, placed upstream of the processing chamber 602. Said optional load lock chamber 607 may comprise one or more of substrate trays 608. A sealing gate 609 may be present between the optional load lock chamber 607 and the processing chamber 602. Vacuum may be applied either within the optional load lock chamber 607 and/or within the processing chamber 602.
[0082] Figure 7 is a schematic side view of a processing chamber comprising the precision positioning device, according to the present invention. The precision positioning device 701 is disposed within the processing chamber 702, with a substrate support frame 703 on the top, underneath the multiple processing sources 704. Optionally, a conveyor 705, at atmospheric pressure, may bring in support tray 706, through an optional sealing gate 710, within an optional load lock chamber 707, placed upstream of the processing chamber 702. Said optional load lock chamber 707 may comprise one or more of substrate trays 708. A sealing gate 709 may be present between the optional load lock chamber 707 and the processing chamber 702. Vacuum may be applied either within the optional load lock chamber 707 and/or within the processing chamber 702.
[0083] The present processing chamber may be an ion implantation processing chamber.
Such a chamber is designed such that the occupied room is minimized. Indeed at least one ion beam generator is positioned above the surface of the substrate, that is, positioned on top of the processing chamber. In such a design, the ion beam is directed in a descending direction towards the substrate surface. The ion beam may reach the surface from the perpendicular angle, but may also be redirected within the chamber such that is reaches the surface of the substrate in an angle of at least 5°, viewing from the horizontal plane surface of the substrate support frame.
[0084] The ion implantation process allows for modification and tuning of the various parameters such as ion type, dosage (1011 to 1018 cm-2), ion energy (1 to 400 keV), ion flux (1012 to 1017 cnr2s-1) among others, as required. The ion beam diameter may range of from 5 mm to 1200 mm, alternatively of from 10 mm to 800 mm, alternatively of from 50 mm to 300 mm. [0085] The ion implantation processing chamber may be equipped with at least one viewing window. Such a viewing window may be a view port from the top with an angular incidence (for example, an angle of 45°), allowing for a direct view on the treatment surface.
[0086] In some instances, the ion implantation processing chamber may comprise more than one ion implantation source, such as, for example, 2, 3 or more.
[0087] The present precision positioning device may be also provided within an existing processing chamber, without impacting original set up and design of said existing processing chamber.
[0088] The present invention further provides for a multi-chamber system comprising at least one chamber comprising a precision positioning device, as discussed previously.
[0089] Typical multi-chamber systems or cluster tools include one or more of the processing chambers discussed above. The various chambers may be organized in a linear sequence, or may be arranged in nonlinear sequence.
[0090] In a multi-chamber system organized in a linear sequence, the substrate will typically evolve from one chamber to the next in a longitudinal pathway, the substrate being transferred from one chamber to the next in a longitudinal path. In such instances, multiple substrates may be hosted by the different chambers and progress along the path in respective order. The parameters of the evolution of the substrates through the multiple chambers are modulated such that there is typically only one speed of progression of the substrates in the multi-chamber system organized in a linear sequence. This typically requires to adapt residence times or treatment efficiency of the different chambers to ensure steady speed.
[0091] In a multi-chamber system organized in a nonlinear sequence, the substrate will typically evolve from one chamber to the next in a non-longitudinal pathway. That is, the substrate will be transferred from one chamber to the next in a sequence defined by the treatment steps required and the timing required for each said treatments. In such instances, multiple substrates may be hosted by the different chambers and progress through the different chambers in respective order, or as required by the treatment steps. This allows for the substrates to each have respective residence times in the various chambers as required, while not blocking the line to one single speed of progression. In such instances, while one or more substrates are hosted in processing chambers, other substrates may be hosted in transfer or load lock chambers and positions be exchanged and substrates possibly return to a chamber in which they were previously hosted. This allows for more flexibility in the assignments of the possible multiple treatment steps required.
[0092] A multi-chamber system thus generally comprises a plurality of chambers and robots and may be equipped with a microprocessor controller programmed to carry out the various processing methods performed in the multiple chambers and to operate the transfers between the various chambers.
[0093] In some instances, multiple chambers may be mounted to a central transfer chamber which houses a robot adapted to shuttle substrates between the chambers. In some instances, some chambers may be aligned in linear arrangement and some other chambers may be mounted around a central transfer chamber. Such a transfer chamber is typically maintained at a vacuum condition and provides an intermediate stage for shuttling substrates from one chamber to another and/or to a load lock chamber positioned at a front end of the milt-chamber system.
[0094] A loader is typically disposed in the front-end environment and capable of linear and/or rotational movement to shuttle trays of substrates between the load lock and processing chambers. Such loaders may include carriages, trays, shuffles, among others.
[0095] A first chamber is typically disposed between the frond-end environment and a first processing chamber to facilitate substrate transfer between a generally ambient environment within the frond-end environment and a vacuum environment within a first processing chamber, such a pressure modification chamber . [0096] In some instances, the vacuum conditions may be provided within 15 minutes or less, alternatively 2 minutes or less, when more than one load lock chamber is used to reduce the pressure, that is, when pressure reduction is divided between several chambers.
[0097] The present precision positioning device provides for the advantage that the substrate support frame or the substrate may independently be transferred from one chamber to another, without requiring to off-load the carried substrates from the substrate support frame.
[0098] In some instance, a lift or multiple cassette storage may be present in a chamber of the multi-chamber system. In those instances, the pressure modification may be more effectively applied, in that several substrate support frames may be set under vacuum conditions, prior or after any treatment.
[0099] An optional second or further processing chambers may also perform any number of processes such as discussed previously.
[0100] The multi-chamber system according to the invention may comprise any robot or processor to effect transfer and movement of the substrates from one chamber to another.
[0101] The multi-chamber system may include a controller, which generally comprises a central processing unit (CPU), a memory, and support circuits and is coupled to and controls the multi-chamber system and its support systems, directly or, alternatively, via computers (or controllers) associated with the process chambers and/or the support systems.
[0102] The controller may contain a computer-readable medium having instruction stored thereon for performing the methods described above in accordance with the embodiments of the invention.
[0103] The multi-chamber system according to the invention may be organized in a linear sequence or in a non-linear sequence.
[0104] A first non-limiting example of a multi-chamber system according to the present invention comprises, in any sequential order:
a) At least one load lock chamber; b) At least one processing chamber comprising a precision positioning device as described previously.
[0105] A second non-limiting example of a multi-chamber system according to the present invention comprises, in any sequential order
a) A loading conveyor;
b) At least one load lock chamber;
c) An optional first buffer chamber;
d) A first processing chamber comprising a precision positioning device as described previously;
e) A second processing chamber optionally comprising a precision positioning device as described previously.
[0106] A third non-limiting example of a multi-chamber system according to the present invention may include, in any sequential order:
a) A loading conveyor;
b) At least one load lock chamber;
c) An optional first buffer chamber;
d) A first processing chamber comprising a precision positioning device as described previously;
e) An optional transfer chamber;
f) A second processing chamber optionally comprising a precision positioning device as described previously
g) Optional further processing chambers, each optionally comprising a precision positioning device as described previously.
[0107] Any multi-chamber system may thus be considered, provided at least one of the processing chamber comprises the present precision positioning device, where the processing chamber may also be a load lock chamber or any chamber, as discussed previously.
[0108] Figure 8 is a schematic side view of a multi-chamber system comprising one processing chamber comprising the precision positioning device, according to the present invention. In such a potential configuration, the precision positioning device 801 is disposed within the processing chamber 802. A first conveyor 803, at atmospheric pressure, is set up to bring in the support tray 804 within a first storage chamber 805, through an opening slit 806. The first storage chamber 805, placed upstream from the processing chamber 802, may comprise one or more of substrate trays 807. A sealing gate 808 may be present between the first storage chamber 805 and the processing chamber 802. A second storage chamber 809 may be located downstream of the processing chamber 802, separted from it by way of a second sealing gate 810. Pressure or vacuum regulation may take place either within the storage chambers 805 and/or 809, and/or within the processing chamber 802. A second conveyor 81 1 , at atmospheric pressure, is set up to receive the support tray 812 from the second storage chamber 809, through an opening slit 813.
[0109] Figure 9 is a schematic upper view of an alternative multi-chamber system comprising one processing chamber comprising the precision positioning device, according to the present invention. In such a configuration, one precision positioning device 900 is disposed within processing chamber 901 , while processing chambers 902 and 903 and the central chamber 904 may each include a same or different precision positioing device. A conveyor 905, at atmospheric pressure, is set up to bring in the support tray 906 within a first storage chamber 907, through an opening slit 908. The first storage chamber 907, placed upstream from the central chamber 904, may comprise one or more of substrate trays 909. A sealing gate 910 may be present between the first storage chamber 907 and the central chamber 904.
[01 10] A method for processing a substrate is provided herein, comprising the steps of
1 ) Providing for at least one substrate,
2) Providing for a precision positioning device as provided herein,
3) Disposing said at least one substrate on said precision positioning device,
4) Disposing the precision positioning device comprising the substrate of step 3) in a processing chamber,
5) Processing the at least one substrate in the processing chamber. [01 1 1] A first non-limiting example of method of processing a substrate includes the steps of
1 ) Providing for at least one substrate,
2) Providing for a precision positioning device as provided herein,
3) Disposing said at least one substrate on said precision positioning device,
4) Disposing the precision positioning device comprising the substrate of step 3) in a processing chamber,
5) Applying vacuum;
6) Processing the at least one substrate in at least one processing chamber comprising the present precision positioning device.
[01 12] The present invention also provides for a substrate having been subject to treatment within the processing chamber as described herein.
[01 13] Examples of substrates include those substrates comprising glass; sapphire; polymers; elastomers; resins; metals, metal oxides or metal alloys; composite materials; or mixtures of these or other material.
[01 14] Examples of polymers include polymethylmethacrylate, polyurethane, plastic, polyethylene, polypropylene, and mixtures or composites thereof.
[01 15] The substrate may have varying shape, from planar to non-planar surfaces.
Planar surfaces include flat and/or convex and/or concave surfaces. Non-limiting examples of planar substrates include glass pieces, watch glasses, metal sheets, polymer sheets, or else.
[01 16] Non-planar surfaces include those with holes, with indents. Non-limiting examples of non-planar substrates include jewellery accessories (such as jewels and stones), engineering accessories (such as pistons, valves, bolts, nails, screws, needles, pins, links, balls, or else), electronic accessories (such as chips, electronic connectors, or else), polymeric accessories (such as phone covers, keyboard keys, computer covers, or else), and others.
[01 17] The planar or non-planar substrates may have sizes ranging of from 1 x 106 m2 to 25 m2. Examples include wafers, electronic accessories having a surface as of 1 x 10-6 m2; watch glasses or polymeric pieces having a surface as of 1 x 104 m2; or glass pieces having surfaces of from 1 to 25 m2, or pieces of from 0.05 to 1 m2, alternatively of from 0.05 to 0.4 m2.
[01 18] In some instances, the substrate may be a batch substrate in opposition to the above individual planar or non-planar substrates. Such batch substrates include powders, grains, fibres, or the like. Examples of powders include sand, glass powders, metal powders, metal oxide powders, polymeric powders, ceramic powders, and the like. Particle sizes of such powder may range of from 0.01 micron to 5 mm.
[01 19] Examples of fibres include glass fibres, carbon fibres, polymeric fibres and the like.
[0120] An entirety of the surface of the substrate may be treated. In some situations, only a section or portion of the surface may be treated. In such instances, patterned masking may be provided to selectively uncover the portions of the surface to be treated. Such patterned masking are known in the art, and may be selected from photoresists, aluminium hard masks or polymeric masks.
[0121] The surface of the substrate may already have been processed by any of the above or other processes, prior to being processed in the present method. That is, the surface of the substrate may not be homogeneous throughout, before being subject to the present processing method. It may be composed of different materials, but also made of the same material having been subject to prior surface modifications.
[0122] Examples of processing operations performed on the substrate may include metal deposition, coating deposition, surface modification, surface treatment, and others. Modifications of characteristics of the substrates may be generated, such as modification of color, hydrophilicity/hydrophobicity, antibacterial character, porosity, adhesion, magnetic character, among others.
[0123] Last provided is the use of at least one chain drive comprising a metallic chain in a precision positioning device. The chain drives allow for use of the precision positioning device in vacuum conditions. Examples
[0124] Commercial precision positioning devices have been initially used in a processing chamber for ion implantation process on glass substrates having a surface area of 30 x 30 cm. The process was carried out a pressure of 5 x 104 Pa (= 5 x 10 6 mbar).
[0125] Comparative precision positioning device 1 has movement imparted by a plastic drive screw. Comparative precision positioning device 2 has movement imparted by a belt made of acetal thermoplastic material. Comparative precision positioning device 3 has movement imparted by crossed roller guides.
[0126] While the implantation of ions such as N, O, He, Ar, itself was successfully carried out, analysis of the samples evidenced presence of elements which were not intentionally implanted, such as carbon.
[0127] Working on identifying the sources of such carbon species, the construction elements of the processing chamber and the precision positioning devices were evaluated and evidence was made that the transfer belts, nuts, screws and lubricants were outgassing in a first step when vacuum was applied in view of carrying out the ion implantation. In a second step, significant outgassing occurred when, upon moving the substrate, the ion implantation beam came into contact with various parts of the precision positioning device.
[0128] The present precision positioning device was thus incorporated in an ion implantation chamber, and process was carried out as outlined above for the comparative precision positioning devices. Analysis of the ion implanted samples did not allow to detect elements which were not intentionally implanted, even when the ion implantation beam came into contact with parts of the precision positioning device.
[0129] The present precision positioning device successfully provides for less sources of polluting species, such as carbon.

Claims

1 . A precision positioning device, providing at least two movements to a substrate or a substrate support frame, a first movement and a second movement transversal to the first movement, comprising
a. a first chain drive providing the first movement comprising one or more first contact elements for contacting the substrate or substrate support frame, and b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive,
wherein the second movement provides movement to the first chain drive.
2. The precision positioning device according to claim 1 , comprising
a. a first chain drive providing the first movement, comprising one or more first contact elements for contacting the substrate or substrate support frame, and b. a second chain drive providing the second movement comprising one or more second contact elements for contacting the first chain drive, wherein the second movement provides movement to the first chain drive, and
c. parallel to the direction of the second movement and spaced apart in the direction of the first movement,
i. at least one guiding rail and
ii. at least one support rail.
3. The precision positioning device according to any preceding claim, wherein each chain drive comprises a chain, at least one chain driving wheel and at least one chain driven wheel.
4. The precision positioning device of claim 3, wherein the chain, the at least one driving wheel and the at least one driven wheel may be made of metal or ceramic, or a combination of both.
5. The precision positioning device of any preceding claim, configured to be suitable in vacuum atmosphere, where pressure may range of from 10 1 to 10 8 Pa.
6. A precision positioning table comprising the precision positioning device of any of claims 1 to 5, and a substrate support frame.
7. A processing chamber comprising the precision positioning device according to any of claims 1 to 5 or the precision positioning table according to claim 6.
8. The processing chamber according to claim 7, wherein the processing chamber is selected from a surface treatment chamber, a load lock chamber, or a combination of such chambers.
9. The processing chamber according to claim 8, wherein the surface treatment chamber is selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, hot wire chemical vapor deposition (HWCVD) chamber, ion implantation chamber, ion doping chamber, plasma nitridation chamber, atomic layer deposition (ALD) chamber, evaporation chamber, plasma or vapor chemical etching chamber, laser annealing chamber, rapid thermal oxidation (RTO) chamber, rapid thermal nitridation (RTN) chamber, rapid thermal annealing (RTA) chamber, vapor etching chamber, plasma cleaning chamber, or a combination of such chambers.
10. The processing chamber according to claim 8, wherein the load lock chamber is selected from pressure modification chamber, alignment chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, heating chamber, cooling chamber, or a combination of such chambers.
1 1. The processing chamber according to any of claims 7 to 10, wherein the processing chamber is selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, ion doping chamber, plasma or vapor chemical etching chamber, pressure modification chamber, plasma cleaning, pressure modification chamber, substrate reorientation chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
12. The processing chamber according to any of claims 7 to 1 1 , wherein the processing chamber is selected from physical vapor deposition (PVD) or sputtering chamber, plasma enhanced chemical vapor deposition (PECVD) chamber, low pressure chemical vapor deposition (LPCVD) chamber, ion implantation chamber, pressure modification chamber, transfer chamber, buffer chamber, storage chamber, loading chamber, annealing chamber, measurement chamber, analysis chamber, or a combination of such chambers.
13. The processing chamber according to any one of claims 7 to 12, wherein the non- atmospheric pressure ranges of from 10 3 to 10 6 Pa.
14. A multi-chamber system comprising at least one processing chamber according to any one of claims 7 to 13.
15. The multi-chamber system of claim 14, arranged in linear or non-linear sequence.
16. A method for processing a substrate, comprising:
1 ) Providing for at least one substrate,
2) Providing for a precision positioning device of any of claims 1 to 5,
3) Disposing said at least one substrate on said precision positioning device,
4) Disposing the precision positioning device comprising the substrate of step 3) in a processing chamber,
5) Processing the at least one substrate in the processing chamber.
17. The method according to claim 16, wherein the substrate is selected from glass; sapphire; polymers; elastomers; resins; metals, metal oxides or metal alloys; composite materials; or mixtures of these or other material.
18. A substrate having been subject to the method of any one of claim 16 or 17.
19. Use of a chain drive in a precision positioning device.
EP19717309.9A 2018-04-20 2019-04-10 Precision positioning device Withdrawn EP3782189A1 (en)

Applications Claiming Priority (2)

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PCT/EP2019/059116 WO2019201709A1 (en) 2018-04-20 2019-04-10 Precision positioning device

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US8899408B2 (en) * 2012-08-03 2014-12-02 Applied Materials, Inc. Temperature actuated tensioning mechanism
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