EP3763177A1 - Elektrogeräteanordnung, aufweisend eine an einem tragelement, insbesondere wand, befestigbares elektrogerät - Google Patents
Elektrogeräteanordnung, aufweisend eine an einem tragelement, insbesondere wand, befestigbares elektrogerätInfo
- Publication number
- EP3763177A1 EP3763177A1 EP19705928.0A EP19705928A EP3763177A1 EP 3763177 A1 EP3763177 A1 EP 3763177A1 EP 19705928 A EP19705928 A EP 19705928A EP 3763177 A1 EP3763177 A1 EP 3763177A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- electrical appliance
- heat sink
- base plate
- dome
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Definitions
- Electrical appliance arrangement comprising a to a support member, in particular wall, attachable electrical appliance
- the invention relates to an electrical appliance arrangement, comprising a to a support member, in particular wall, attachable electrical appliance.
- the invention is therefore the object of developing an electrical appliance, with a particularly simple production should be achievable.
- the object is achieved in the electrical appliance assembly according to the features indicated in claim 1.
- Supporting element in particular wall, attachable electrical appliance, are that the electrical appliance has a heat sink, printed circuit boards and a housing, wherein the circuit boards are each attached to the heat sink and the heat sink can be fastened or fastened to the support member, in particular wherein the housing surrounds the circuit boards forming the housing and attached to the heat sink.
- the heat sink carries the circuit boards and the housing and thus acts as a central support element of the device.
- the heat sink can be fastened to a support element of a machine or installation, for example on a wall. By attachment to this support member and the circuit boards and the housing are held. The weight of the respective circuit board is thus derived via the heat sink to the wall.
- the weight of the housing is derived via the heat sink to the wall.
- the heat sink also has a connection for electrical ground and thus acts as a drain to electrical ground.
- the electrical appliance has a power module, which has pulse width modulated controlled semiconductor switch, in particular wherein the power module is arranged on the first of the circuit boards.
- the clocked with high currents and / or voltage operated components are arranged on the first circuit board, which is thus arranged only on one side of the heat sink.
- a third circuit board is providable, which has an electronic circuit. This electronic circuit is operated undisturbed by interference signals of the first circuit board, since the heat sink is made of metal, in particular of aluminum, and thus acts as a shield.
- the power module is connected to the heat sink at a contact surface of the heat sink, in particular for heat dissipation.
- the advantage here is that the heat sink spreads the incoming heat flow.
- Heatsink arranged.
- the advantage here is that the contact surface is disposed at a portion of the heat sink with greater wall thickness.
- cooling fins are formed on the opposite side of the contact surface of the base plate on the heat sink.
- a plate-shaped, parallel to the base plate arranged support portion is integrally formed on a first of the cooling fins, wherein a plate-shaped, arranged perpendicular to the base plate wall portion is integrally formed on the base plate, wherein the base plate between the support portion and the wall portion is arranged, in particular wherein the electrical appliance by means of the wall portion attachable to the wall and / or fixed.
- Supporting portion is further removed from the first circuit board than the base plate of the first circuit board, in the area covered by the support portion of the first circuit board larger components on the support portion facing side of the first circuit board can be equipped as on the covered by the base plate portion of the first circuit board.
- the wall section, base plate, cooling fins and support section are integral, that is, one-piece, designed as a heat sink, in particular as an aluminum casting.
- the advantage here is that a stable attachment is possible.
- the support section has an offset to the base plate, in particular so that the plane of the support section to the plane of the base plate is indeed parallel but spaced.
- the advantage here is that larger components on the first circuit board in the support section adjacent area can be equipped as in the area adjacent to the base plate area.
- a receiving pocket is arranged on the carrying section, one side of the receiving pocket being formed by means of a region of the first cooling rib, wherein a heat-generating component, in particular power component, in particular
- Semiconductor switch is arranged in the receiving pocket, wherein between the component and the receiving pocket an electrically insulating, heat-conducting material is arranged, in particular its elasticity is greater than aluminum and as the carrier material of the first of the printed circuit boards and its specific thermal conductivity is at least one tenth of aluminum.
- the advantage here is that the power component is surrounded on several sides of the material of the receiving pocket, ie from the heat sink, and in the
- Recording pocket is recorded without play. Thus, mechanical vibrations are relatively prevented between the component and receiving pocket.
- the power component is in a heat-conducting
- Plastic sleeve especially rubber grommet, introduced and added to this in the receiving pocket play.
- the advantage here is that the plastic sheath acts electrically insulating and still a good heat conducting contact from the component to the heat sink can be achieved.
- the plastic is an addition of electrically insulating particles, but which are very good heat conductors executed.
- Particularly suitable here are ceramic particles, in particular with a particle size of less than 10 micrometers.
- a connection for PE connection in particular therefore connection to electrical ground, is arranged on the wall section of the heat sink.
- the heat sink is not only used for cooling and for holding the device but also for electrical grounding or electrical grounding. This can be carried out particularly advantageously if the wall connected to the wall section or a supporting part itself is made of metal and is electrically earthed.
- the heat sink functions together with the wall or the supporting part as
- dome portions and on the opposite side of the cooling plates of the base plate also dome sections are formed on the support portion, wherein a first circuit board at first Domabroughen, in particular by means of screws, wherein the first Domabroughe rise from the support portion, and second Dome portions is fixed, wherein the second dome portions rise from the cooling fins opposite side of the base plate, wherein a third circuit board to third dome portions, in particular by means of screws, is fixed, wherein the third dome portions of the first circuit board
- Heat sink are durable.
- a threaded bore is arranged for fastening the respective printed circuit board to the respective dome section in the respective dome section, wherein a screw head of a respective screw screwed into the respective threaded hole presses the respective printed circuit board against the respective dome section.
- Heat spreading is improved executable.
- each of the cooling fins on thickening in particular regularly spaced from each other thickening on.
- the advantage here is that the stability of the cooling fins and their function of heat dissipation is executed executable.
- the heat sink acts as a shield.
- FIG. 1 shows a side view of an electrical appliance with the housing removed, printed circuit boards (3, 4, 5) being fastened to a heat sink 1.
- the electrical device is shown with the housing removed in an oblique view.
- the heat sink 1 is shown in an oblique view from a first viewing direction.
- the heat sink 1 is shown in an oblique view from a second viewing direction.
- the heat sink 1 is shown in an oblique view from a third viewing direction.
- the electrical appliance in particular a converter provided for supplying an electric motor, has the heat sink 1 on the sides of which
- Printed circuit boards (3, 4, 5) are attached.
- a first 3 of the three circuit boards is aligned perpendicular to a second 4 of the three circuit boards, wherein the second 4 of the three circuit boards is aligned perpendicular to the third 5 of the three circuit boards.
- the first circuit board 3 is aligned parallel to the third circuit board 5.
- the circuit boards (3, 4, 5) thus form a broken U.
- the third circuit board 5 is equipped or electrically connected to a power module 6, which is pressed by a spring element against a formed on the heat sink 1 contact surface 30.
- a fan On the heat sink 1, a fan is arranged, wherein the cooling air flow conveyed by it flows along cooling fins formed in parallel on the heat sink 1.
- dome portions (32, 33, 34, 35, 41) are formed, which protrude laterally.
- the thickness of the dome sections (32, 33, 34, 35, 41) is selected such that at the outer end portion of the respective dome section (32, 33, 34, 35, 41) a threaded hole is made, into which a screw can be screwed, whose widened screw head presses a respective printed circuit board (2, 4, 5) towards the respective dome section (32, 33, 34, 35, 41).
- the dome sections (36, 37) protrude at the front side and the other dome sections (32, 33, 34, 35, 41) protrude from both sides.
- the dome portions (36, 37) extend perpendicular to the other dome portions (32, 33, 34, 35, 41).
- the heat sink 1 is in one piece, that is, in one piece, designed, wherein the cooling fins 7 rise from a first side of the base plate of the heat sink 1 from.
- the cooling fins 7 are aligned in parallel and preferably spaced from each other regularly.
- the dome sections 35 and 36 rise.
- this other side is a finely machined, in particular ground,
- the base plate acts as a holding means for a 5 of the three printed circuit board (3, 4, 5) and for the cooling fins 7 and for the power module. 6
- Wall section 9 formed on the base plate. At this support portion and a connection 10 is provided for PE connection.
- the electrical device can be fastened to a DIN rail or to a wall of a control cabinet.
- the holding forces for this purpose are therefore entered via the wall section 9.
- the protective housing not shown in the figures is attached to the heat sink 1.
- the heat sink 1 is held by the heat sink 1, which in turn is held by its wall portion 9 on a wall or a machine.
- the cooling fins 7 are arranged only on one side of the base plate.
- the wall section 9 comprises the vertical projection of the entire remaining heat sink 1 on the
- Wall section 9 is thus extended further than the vertical projection, in particular wherein the wall portion 9 for this purpose as a plate-shaped, ie flat part, is executed.
- the wall portion 9 extends on both sides of the base plate of the heat sink 1.
- the base plate is in the Beriech the contact surface 30 with a larger one
- dome portions 34 and 35 are formed freestanding.
- the dome portion 34 is connected to the wall portion 9 by means of a connecting wall, so that not only the stability of the heat sink 1 and especially the dome portion 34 is improved, but also the heat capacity is increased.
- the base plate of the heat sink 1 opens approximately centrally in the wall section. 9
- a plate-shaped support section 8 is formed on the heat sink 1.
- the support portion 8 opens in that cooling fin 7, which is located farthest from the wall portion 9.
- Dom portions 32 for fastening the printed circuit board 5 also rise on the support section 8.
- a power component in particular a controllable semiconductor switch, such as
- the power component is surrounded with a heat-conducting rubber grommet inserted into a formed on the heat sink 1 receiving pocket 31.
- the power component is electrically insulated and thermally conductively connected to the receiving pocket 31.
- a rubber grommet and another electrically insulating but good heat conducting material would be used, which is arranged between the receiving pocket 31 and the power device.
- a dome portion 32 is arranged, which is arranged on the same side of the support portion 8 as the receiving pocket 31st
- dome portion 32 protrudes a further dome portion 36 in the transverse direction, in particular so transversely to the normal direction of the substantially one plane performing support section 8. It introduced into the other dome portion 36 threaded bore is thus perpendicular to that threaded hole, which is introduced into the dome portion 32 ,
- the receiving pocket 31 is arranged on the support section 8. It is this
- Receiving pocket 31 made with side walls that rise from the support section 8 from. As a result of the rubber grommet, the power component is accommodated without play in the receiving pocket 31.
- One of the side walls of the receiving pocket 31 is integrally formed on that cooling rib into which the door section 8 opens.
- the cooling ribs 7 have thickenings 43 which are regularly spaced apart from one another in the extension direction of the cooling ribs 7, in particular in the direction of the cooling air flow flowing between the cooling ribs.
- the power module has power switches, such as IGBT or MOSFET. These circuit breakers are arranged in half bridges, which are supplied with DC voltage from a mains-powered rectifier. On the output side, the power module provides a three-phase voltage system for supplying a three-phase motor.
- power switches such as IGBT or MOSFET.
- the power switches are operated pulse width modulated.
- the heat sink 1 is made of metal, in particular aluminum, the acts
- Support section 8 of the heat sink 1 as a shield on the circuit board.
- Printed circuit board 5 arranged control of the power module.
- Carrying section 8 arranged components of the circuit board 3 achievable.
- a simple cup-shaped housing made of plastic from the wall section 9 opposite side of the support section 8 coming forth überstülpbar on the heat sink 1 and the attached circuit boards (3, 4, 5).
- the housing can be fastened by means of a screw on the heat sink, wherein the screw can be screwed into a threaded bore of the heat sink.
- a locking of the housing on the wall portion 9 executable.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cookers (AREA)
- Switch Cases, Indication, And Locking (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018001687 | 2018-03-05 | ||
| PCT/EP2019/025044 WO2019170290A1 (de) | 2018-03-05 | 2019-02-15 | Elektrogeräteanordnung, aufweisend eine an einem tragelement, insbesondere wand, befestigbares elektrogerät |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP3763177A1 true EP3763177A1 (de) | 2021-01-13 |
| EP3763177C0 EP3763177C0 (de) | 2023-06-07 |
| EP3763177B1 EP3763177B1 (de) | 2023-06-07 |
Family
ID=65494095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19705928.0A Active EP3763177B1 (de) | 2018-03-05 | 2019-02-15 | Elektrogeräteanordnung, aufweisend ein an einem tragelement, insbesondere einer wand, befestigbares elektrogerät |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11991868B2 (de) |
| EP (1) | EP3763177B1 (de) |
| CN (1) | CN111819914B (de) |
| AU (2) | AU2019230922B2 (de) |
| CA (1) | CA3091748A1 (de) |
| DE (1) | DE102019001113A1 (de) |
| WO (1) | WO2019170290A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114424683B (zh) | 2019-09-12 | 2025-08-26 | 索尤若驱动有限及两合公司 | 电子设备和用于由组合部件制造第一和第二电子设备的方法 |
| BE1028433B1 (de) * | 2020-06-25 | 2022-01-31 | Phoenix Contact Gmbh & Co | Baugruppe mit einem eine Tragstruktur ausbildenden Kühlkörperkernelement |
| WO2022093402A1 (en) * | 2020-10-28 | 2022-05-05 | Arris Enterprises Llc | Pass-through latching heat sink |
| JP2022147498A (ja) * | 2021-03-23 | 2022-10-06 | パナソニックIpマネジメント株式会社 | 電子機器用筐体 |
| JP2022147499A (ja) * | 2021-03-23 | 2022-10-06 | パナソニックIpマネジメント株式会社 | 電子機器用筐体 |
| JP7611051B2 (ja) * | 2021-03-31 | 2025-01-09 | ニデックインスツルメンツ株式会社 | モータ制御装置 |
| DE102023103638B4 (de) | 2023-02-15 | 2026-04-23 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Baugruppe mit einem Kühlkörper sowie deren Herstellung und Verwendung |
| EP4510789A1 (de) * | 2023-08-17 | 2025-02-19 | Siemens Aktiengesellschaft | Automatisierungsgerät mit kühlkörper |
| EP4730940A1 (de) * | 2024-10-18 | 2026-04-22 | Marelli Europe S.p.A. | Elektronikeinheit für ein fahrzeug und zugehöriges montageverfahren |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE0003189D0 (sv) * | 2000-09-08 | 2000-09-08 | Emerson Energy Systems Ab | A spring device for pressing an electronic component towards a heat sink body |
| DE10058574B4 (de) * | 2000-11-24 | 2005-09-15 | Danfoss Drives A/S | Kühlgerät für Leistungshalbleiter |
| US6411514B1 (en) * | 2001-03-08 | 2002-06-25 | Rally Manufacturing, Inc. | Power inverter with heat dissipating assembly |
| DE10129788B4 (de) * | 2001-06-20 | 2005-11-10 | Siemens Ag | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts |
| JP3086611U (ja) * | 2001-11-09 | 2002-06-28 | 鴻海精密工業股▲ふん▼有限公司 | 放熱装置 |
| KR100488518B1 (ko) * | 2002-11-14 | 2005-05-11 | 삼성전자주식회사 | 반도체 장치의 방열 시스템 |
| US20080017174A1 (en) * | 2003-12-17 | 2008-01-24 | Continental Teves Ag & Co. Ohg | Electronic Control Unit for Motor Vehicle Braking Systems |
| DE102004018471B4 (de) * | 2004-04-16 | 2009-04-16 | Infineon Technologies Ag | Leistungshalbleiterschaltung und Verfahren zum Herstellen einer Leistungshalbleiterschaltung |
| JP2008140803A (ja) * | 2006-11-30 | 2008-06-19 | Fuji Electric Fa Components & Systems Co Ltd | ヒートシンク |
| CN101202528B (zh) * | 2006-12-11 | 2012-10-10 | 丹佛斯传动有限公司 | 电子装置及电动机变频器 |
| DE102007014789B3 (de) * | 2007-03-28 | 2008-11-06 | Ixys Ch Gmbh | Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul |
| JP4580997B2 (ja) * | 2008-03-11 | 2010-11-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| EP2671434B1 (de) | 2011-02-04 | 2017-05-17 | Sew-Eurodrive GmbH & Co. KG | Elektrisches gerät |
| EP2736311B1 (de) | 2012-11-27 | 2017-08-16 | Siemens Aktiengesellschaft | Automatisierungsgerät mit Kühlkörper |
| DE102013010843A1 (de) | 2013-06-28 | 2014-12-31 | Wabco Gmbh | Elektrisches Steuergerät |
| DE112013007473T5 (de) | 2013-09-30 | 2016-06-16 | Aavid Thermalloy, Llc. | Kühleraufbau mit Rahmenclip für vollständig zusammengesetzte Anbringung an einer Wärme erzeugenden Komponente |
| DE102015200375B4 (de) * | 2015-01-13 | 2022-12-08 | Lenze Swiss Ag | Frequenzumrichter |
| US10278305B2 (en) * | 2017-03-24 | 2019-04-30 | Deere & Company | Electronic assembly with phase-change cooling of a semiconductor device |
| DE112018000105T5 (de) * | 2017-04-27 | 2019-05-29 | Fuji Electric Co., Ltd. | Elektronisches bauelement und leistungsumwandlungseinrichtung |
| US11085977B2 (en) * | 2017-05-15 | 2021-08-10 | Wisconsin Alumni Research Foundation | Method and apparatus for integrating current sensors in a power semiconductor module |
| CN109428497B (zh) * | 2017-08-23 | 2020-09-18 | 台达电子企业管理(上海)有限公司 | 电源模块的组装结构及其组装方法 |
-
2019
- 2019-02-15 CN CN201980017486.0A patent/CN111819914B/zh active Active
- 2019-02-15 US US16/979,015 patent/US11991868B2/en active Active
- 2019-02-15 WO PCT/EP2019/025044 patent/WO2019170290A1/de not_active Ceased
- 2019-02-15 EP EP19705928.0A patent/EP3763177B1/de active Active
- 2019-02-15 DE DE102019001113.9A patent/DE102019001113A1/de active Pending
- 2019-02-15 AU AU2019230922A patent/AU2019230922B2/en active Active
- 2019-02-15 CA CA3091748A patent/CA3091748A1/en active Pending
-
2022
- 2022-01-18 AU AU2022200317A patent/AU2022200317B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3763177C0 (de) | 2023-06-07 |
| WO2019170290A1 (de) | 2019-09-12 |
| US11991868B2 (en) | 2024-05-21 |
| AU2022200317B2 (en) | 2023-07-06 |
| CN111819914A (zh) | 2020-10-23 |
| EP3763177B1 (de) | 2023-06-07 |
| CN111819914B (zh) | 2023-11-10 |
| CA3091748A1 (en) | 2019-09-12 |
| AU2019230922A1 (en) | 2020-09-24 |
| AU2022200317A1 (en) | 2022-02-10 |
| BR112020016443A2 (pt) | 2020-12-15 |
| US20200413564A1 (en) | 2020-12-31 |
| DE102019001113A1 (de) | 2019-09-05 |
| AU2019230922B2 (en) | 2021-10-21 |
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