EP3693495A4 - Electroless palladium plating solution, and electroless palladium plated coating - Google Patents

Electroless palladium plating solution, and electroless palladium plated coating Download PDF

Info

Publication number
EP3693495A4
EP3693495A4 EP18864662.4A EP18864662A EP3693495A4 EP 3693495 A4 EP3693495 A4 EP 3693495A4 EP 18864662 A EP18864662 A EP 18864662A EP 3693495 A4 EP3693495 A4 EP 3693495A4
Authority
EP
European Patent Office
Prior art keywords
electroless palladium
plating solution
plated coating
electroless
palladium plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18864662.4A
Other languages
German (de)
French (fr)
Other versions
EP3693495A1 (en
Inventor
Tsuyoshi Maeda
Katsuhisa Tanabe
Shinsuke Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Publication of EP3693495A1 publication Critical patent/EP3693495A1/en
Publication of EP3693495A4 publication Critical patent/EP3693495A4/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
EP18864662.4A 2017-10-06 2018-10-03 Electroless palladium plating solution, and electroless palladium plated coating Pending EP3693495A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017195651A JP7149061B2 (en) 2017-10-06 2017-10-06 Electroless palladium plating solution
PCT/JP2018/036970 WO2019069964A1 (en) 2017-10-06 2018-10-03 Electroless palladium plating solution, and electroless palladium plated coating

Publications (2)

Publication Number Publication Date
EP3693495A1 EP3693495A1 (en) 2020-08-12
EP3693495A4 true EP3693495A4 (en) 2021-09-29

Family

ID=65994683

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18864662.4A Pending EP3693495A4 (en) 2017-10-06 2018-10-03 Electroless palladium plating solution, and electroless palladium plated coating

Country Status (7)

Country Link
US (1) US20200248312A1 (en)
EP (1) EP3693495A4 (en)
JP (1) JP7149061B2 (en)
KR (1) KR20200062265A (en)
CN (1) CN111164236A (en)
TW (1) TWI829653B (en)
WO (1) WO2019069964A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572376B1 (en) * 2018-11-30 2019-09-11 上村工業株式会社 Electroless plating bath
CN117966140B (en) * 2024-01-31 2024-07-05 珠海斯美特电子材料有限公司 Chemical palladium plating solution and application thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120118196A1 (en) * 2009-05-08 2012-05-17 Kojima Chemicals Co., Ltd. Electroless palladium plating solution
CN106480437A (en) * 2015-08-31 2017-03-08 比亚迪股份有限公司 A kind of ionic palladium reducing solution, preparation method and a kind of method of Chemical Plating of Non metal Material

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3418143A (en) * 1967-08-15 1968-12-24 Burroughs Corp Bath for the electroless deposition of palladium
WO1987005338A1 (en) * 1986-03-04 1987-09-11 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
JP3204035B2 (en) * 1995-03-30 2001-09-04 上村工業株式会社 Electroless palladium plating solution and plating method
JP2000256866A (en) * 1999-03-10 2000-09-19 Hideo Honma Electroless nickel plating bath
JP2007009305A (en) * 2005-07-04 2007-01-18 Japan Pure Chemical Co Ltd Electroless palladium plating liquid, and three layer-plated film terminal formed using the same
US7704307B2 (en) 2005-07-20 2010-04-27 Nippon Mining & Metals Co., Ltd. Electroless palladium plating liquid
JP4974332B2 (en) * 2005-09-07 2012-07-11 一般財団法人電力中央研究所 Nanostructure and manufacturing method thereof
JP5843249B2 (en) * 2010-04-19 2016-01-13 奥野製薬工業株式会社 Activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
TWI479048B (en) * 2011-10-24 2015-04-01 Kojima Chemicals Co Ltd Eletoroless palladium plating solution
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
JP6635304B2 (en) 2016-04-18 2020-01-22 株式会社オートネットワーク技術研究所 Relay device and in-vehicle system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120118196A1 (en) * 2009-05-08 2012-05-17 Kojima Chemicals Co., Ltd. Electroless palladium plating solution
CN106480437A (en) * 2015-08-31 2017-03-08 比亚迪股份有限公司 A kind of ionic palladium reducing solution, preparation method and a kind of method of Chemical Plating of Non metal Material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019069964A1 *

Also Published As

Publication number Publication date
JP7149061B2 (en) 2022-10-06
EP3693495A1 (en) 2020-08-12
TWI829653B (en) 2024-01-21
JP2019070172A (en) 2019-05-09
TW201925531A (en) 2019-07-01
KR20200062265A (en) 2020-06-03
CN111164236A (en) 2020-05-15
WO2019069964A1 (en) 2019-04-11
US20200248312A1 (en) 2020-08-06

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