EP3607851A1 - Verfahren zum bilden eines crimp-futters auf einem nicht-leitenden substrat, und mit diesem verfahren erhaltenes objekt - Google Patents
Verfahren zum bilden eines crimp-futters auf einem nicht-leitenden substrat, und mit diesem verfahren erhaltenes objekt Download PDFInfo
- Publication number
- EP3607851A1 EP3607851A1 EP19188365.1A EP19188365A EP3607851A1 EP 3607851 A1 EP3607851 A1 EP 3607851A1 EP 19188365 A EP19188365 A EP 19188365A EP 3607851 A1 EP3607851 A1 EP 3607851A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- belt
- wires
- substrate
- claws
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 90
- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000002788 crimping Methods 0.000 title claims abstract description 37
- 210000000078 claw Anatomy 0.000 claims abstract description 50
- 238000000151 deposition Methods 0.000 claims abstract description 14
- 238000001465 metallisation Methods 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 26
- 229910052737 gold Inorganic materials 0.000 claims description 25
- 239000010931 gold Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 230000008021 deposition Effects 0.000 claims description 11
- 238000000206 photolithography Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 description 31
- 229910003460 diamond Inorganic materials 0.000 description 27
- 239000010437 gem Substances 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 9
- 229910001751 gemstone Inorganic materials 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000004575 stone Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- OANVFVBYPNXRLD-UHFFFAOYSA-M propyromazine bromide Chemical compound [Br-].C12=CC=CC=C2SC2=CC=CC=C2N1C(=O)C(C)[N+]1(C)CCCC1 OANVFVBYPNXRLD-UHFFFAOYSA-M 0.000 description 5
- 239000010970 precious metal Substances 0.000 description 4
- 229910001020 Au alloy Inorganic materials 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 235000014161 Caesalpinia gilliesii Nutrition 0.000 description 1
- 244000003240 Caesalpinia gilliesii Species 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 101100460147 Sarcophaga bullata NEMS gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000011472 cat’s claw Nutrition 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- -1 diamonds Chemical compound 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C17/00—Gems or the like
- A44C17/04—Setting gems in jewellery; Setting-tools
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/06—Dials
- G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/06—Dials
- G04B19/18—Graduations on the crystal or glass, on the bezel, or on the rim
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B29/00—Frameworks
- G04B29/02—Plates; Bridges; Cocks
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B29/00—Frameworks
- G04B29/02—Plates; Bridges; Cocks
- G04B29/027—Materials and manufacturing
Definitions
- the invention relates to the processing and setting of objects such as precious or semi-precious stones on substrates formed from non-ductile materials such as in particular glass, ceramic, hard machinable and / or photocurable polymers (epoxy , PEEK) or else monocrystalline or polycrystalline silicon.
- non-ductile materials such as in particular glass, ceramic, hard machinable and / or photocurable polymers (epoxy , PEEK) or else monocrystalline or polycrystalline silicon.
- the invention relates more particularly according to a first object a method of producing crimping pins on substrates formed of non-ductile materials.
- the invention also relates to a method of crimping an object such as a precious or semi-precious stone on a non-ductile substrate using a châton obtained according to the method of the invention.
- the invention relates to a timepiece or a piece of jewelry comprising a non-ductile substrate provided with a crimping plug obtained according to the inventive method.
- the invention will find particular applications in watchmaking and jewelry, in particular for making dials or other watch hands set with precious stones as well as jewelry.
- precious and semi-precious stones have always been used to adorn, dress and decorate pieces of all kinds such as rings, brooches, pendants, bracelets, boxes, dials, etc. .. and thus give them a refined, luxurious and luminous aesthetic rendering, purposely using the properties of reflection and light transmission of stones.
- these precious stones are positioned and set on precious metal substrates (gold, silver, platinum, palladium), these metals having a ductility specific to their shaping by shaping and / or deposit and manual welding of the claws and crimping pins of each of the stones.
- the applicant proposed in the request EP 3291024 A1 a new type of monolithic display module providing a mysterious and animated display of great simplicity and compactness of construction, such a display module comprising display members movable relative to each other to form a said pattern by by means of elastic deformable connections of the flexible blade type.
- These display modules are obtained by methods from microtechnology and microelectronics, by deep etching methods of silicon wafers.
- Such a display module has the advantage by the fineness of its constituent elements, of the order of a few micrometers, of providing very diverse aesthetic effects depending on the shape of the mobile elements as well as the colors of the dial background with which they are associated with.
- precious stones according to conventional methods on such a piece of silicon, just as it is not possible to set stones on ceramic or glass pieces, without irreversibly damage said parts.
- An object of the invention is especially to provide a technique for crimping objects such as precious or semi-precious stones on non-ductile substrates such as silicon, ceramics or glass and timepieces or jewelry comprising such substrates provided with set stones.
- Another object of the invention is to provide timepieces or jewelry comprising a non-ductile substrate and a crimping stud provided with metal claws integral with said substrate without resorting to bonding.
- non-ductile substrate means any material whose Young's modulus is greater than 2.3 GPa, also commonly known as rigid material.
- a non-ductile substrate within the meaning of the invention can in particular, but not exclusively, consist of silicon, monocrystalline or polycrystalline, ceramic, or even glass.
- the embodiment of the belt comprises the formation of an orifice in the non-ductile substrate.
- an orifice can be produced by various techniques depending on the nature of the substrate. Without limitation, mention may in particular be made of deep etching processes for silicon substrates (in particular DRIE processes - for Deep Reactive-ion Etching in English) or sintering processes for ceramics.
- the production of the claws comprises the individual deposition of metal wires at the periphery of the belt according to a method of wire bossing, known as “stud bumping” in English.
- the production of the claws comprises the simultaneous deposition of metal wires at the periphery of the belt by thermocompression on the surface of the substrate previously metallized from a support plate on which the wires have previously been formed.
- thermocompression technique developed by the Applicant and described in the patent. EP 2579104 B1 .
- This embodiment is related to techniques for manufacturing integrated circuits and other components in the field of microelectronics and microsystems, well known to those skilled in the art in these fields. These techniques will therefore not be described in more detail here.
- the production of the claws may also consist in molding the metal wires at the periphery of the belt in suitable orifices arranged in a layer of photosensitive resin by photolithography and galvanic growth.
- This alternative embodiment according to the method of the invention advantageously makes it possible to produce a plurality of catkins provided with a base supporting the belt and prongs of the catkin, the whole forming an assembly made of material on a first substrate, then separating the case where appropriate, said base of said first substrate in order to then secure the kitten to the non-ductile final support substrate. It is thus possible to produce compositions of very complex and original crimped objects on a non-ductile substrate, such as for example timepieces made of ceramic or silicon as proposed in the patent application. EP 3291024 A1 in the name of the Applicant.
- the metal wires forming the claws of the kitten are preferably made of an alloy of gold and / or other precious metals such as in particular silver and / or palladium.
- the metallization step preferably comprises the deposition of a thin layer of gold by a gas phase deposition process.
- the invention also relates, according to a second object, to a method of crimping an object on a surface of a non-ductile substrate as defined above.
- This crimping process comprises in a particular mode the steps defined in claim 14, or in an alternative the steps defined in claim 15.
- a final object of the invention relates to a timepiece or a piece of jewelry, comprising a non-ductile substrate and a crimping stud of an object arranged on a surface of said substrate, said stud comprising a belt forming a support seat. of said object and a plurality of deformable metal claws distributed at the periphery of the belt and having a length such that at least one free end of each claw can be folded against the object once the latter is located in the belt.
- the crimping plug is formed on the non-ductile substrate according to one of the variants of the method for producing a crimping plug of the invention as defined above.
- an orthonormal reference frame XYZ will be considered, each figure being a sectional representation along a vertical plane YZ of a non-ductile substrate 2 on which a gold crimping kitten 1 is formed.
- the Figures 1a to 1f represent a first method of forming a gold kitten 1 on a non-ductile substrate 2 formed of silicon.
- This first method can be said to transfer wires or bands of gold onto the substrate 2 to produce the claws 12 of the kitten 1 at the periphery of a belt 11 of said kitten 1 formed by an orifice 3 formed in the substrate 2, in particular by deep etching, as is well known in the field of microelectronics and microsystems (MEMS, NEMS, MOEMS, etc.).
- a deposit of gold wires or bands 4 is first carried out on a support substrate 5 by photolithography and galvanic growth, according to techniques well known to the microtechnician.
- the receiving substrate 2 is prepared by producing a metallic layer of gold 21 on a surface of the receiving substrate 2, for example by physical vapor deposition, followed by deep etching to form one or more orifices 3 intended to form a belt 11 of a crimping kitten 1.
- the diameter of the orifices 3 is chosen such that it is less than the largest dimension of the rondist of a diamond O to be crimped, said diamond O thus being able to be positioned stably on its cylinder head on the flange of orifice 3, as will appear more particularly from figures1f and 1g later.
- Fig. 1b the transfer of gold wires or bands 4 onto the receiving substrate 1 by thermocompression, according to the principles defined in particular in the patent EP 2579104 B1 in the name of the Applicant.
- the support substrate 5 is then removed to reveal the wires or bands of gold 4 secured to the previously metallized edges of the orifice 3 forming the belt 11 of the kitten 1, the wires bands 4 forming once raised ( Fig. 1d ) the claws 12 of the kitten 1.
- the number of claws 12 of the kitten 1 depends on the size of the diamond O (or other crimped object), on its shape and on the desired rendering for the final piece carrying the substrate and the crimped diamond.
- the minimum number of claws 12, therefore of wires or bands of gold 4 deposited on the periphery of the orifice (s) forming the belt 11 of the kitty 1 must however be two to ensure a real setting, but preferably three or four regularly distributed around of the belt 11 to ensure a balanced setting of a diamond O or equivalent.
- the receiver substrate 2 is prepared in a first step as in the first variant by producing a metallic layer of gold 21 on a surface of the receiver substrate 2, for example by chemical vapor deposition , followed by deep etching to form one or more orifices 3 intended to form the belt 11 of a crimping kitten 1.
- the diameter of the orifices 3 is chosen such that it is less than the largest dimension of the rondist of a diamond O to be set.
- the orifice (s) 3 are filled with sacrificial material 22 so as to produce a mixed substrate 2 of homogeneous thickness, on which a layer of photosensitive resin 23 is deposited ( Fig.
- FIG. 1 Another alternative embodiment of a crimping plug 1 on a non-ductile silicon substrate 2 is proposed to figures 2a to 2d .
- the receiving substrate 2 is prepared in a first step as in the first variant by producing a metallic layer of gold 21 on a surface of the receiving substrate 2, for example by physical vapor deposition, followed by 'A deep etching to form one or more orifices 3 intended to form the belt 11 of a crimping kitten 1.
- the diameter of the orifices 3 is chosen such that it is less than the largest dimension of the rondist of a diamond O to be crimped, said diamond O thus being able to be positioned stably on its cylinder head on the flange of orifice 3.
- the claws 12 of the kitten 1 are then produced ( Fig. 2b ) directly on the metallized surface 21 of the substrate 2 by a technique called "wire bossing", more commonly known by the English name of "stud bumping".
- wire bossing more commonly known by the English name of "stud bumping”.
- gold wires 4 are directly deposited in exact positions around the orifice 3 forming the belt 11 of the kitten 1, the diameter of the claws at their embossed anchoring base (bump in English) can be between 30 and 150 microns, for wire heights 4, therefore claws 12 from 0.5 to several millimeters, at very high deposition rates, of the order of 10 to 20 wires deposited per second at least.
- This process therefore allows a very high yield of formation of chatons 1 in situ on a silicon substrate 2, according to various configurations and adapted to the desired final aesthetic results as a function of the arrangement of the elements (diamonds D) to be crimped.
- a gold washer is first formed forming a base 13 of a kitten 1 on a support plate 5, for example made of silicon, possibly covered with a sacrificial material (not shown) such as a layer of copper, by photolithography and galvanic growth ( Fig. 3a ).
- This washer 13 preferably has a central orifice 14 at its geometrical center, suitable for subsequently allowing the centering of a diamond O by aligning its collar in said orifice 14. We then come ( Fig.
- a first plurality of gold wires 111 deposit by the “stud bumping” technique previously described in relation to the figure 2 , a first plurality of gold wires 111, said wires 111 having a height h1 and being distributed uniformly at a distance d1 from the geometric center of the base 13.
- This first plurality of wires 111 is intended to form the belt 11 of the kitten 1.
- a second plurality of metallic wires 121 are also deposited by “stud bumping”, these second wires 121 having a height h2 greater than the height h1 of the wires of the first plurality of wires 111 and being distributed uniformly at a distance d2 from the geometric center of the base 13, the distance d2 being greater than the distance d1.
- These second wires 121 are thus intended to form the claws proper of the kitten 1.
- a diamond O is thus obtained set on its gold châton 1, said châton 1 then being detachable from the support plate 5 by tearing off or by dissolution of the support plate 5, or even if necessary by selective dissolution of the sacrificial layer when that -it is present.
- This embodiment has the advantage of providing an indirect embodiment of a crimping kitten 1. It is thus possible to envisage making complete plates of catkins 1, on which are set as many diamonds as necessary, then detaching each catkin and its diamond to assemble them one by one on a suitable receiving substrate 2, according to the desired arrangement. It is also conceivable to detach the chatons 1 once formed on the support plate 5 to fix them by their base 13 on a receiving substrate 2 before setting diamonds D or other objects to be set there.
- the method of the invention thus advantageously provides a method of manufacturing crimping pins 1, with high efficiency, and providing great versatility in creating objects such as jewelry or timepieces combining technical non-ductile substrates.
- such as silicon or ceramic with precious metals such as gold and precious and semi-precious stones, such as diamonds, rubies, emeralds, sapphires and others.
- precious metals such as gold and precious and semi-precious stones, such as diamonds, rubies, emeralds, sapphires and others.
- a stabilizing element such as a temporary glue
Landscapes
- Micromachines (AREA)
- Adornments (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH00970/18A CH715238A1 (fr) | 2018-08-08 | 2018-08-08 | Procédé de formation d’un châton de sertissage sur un substrat non-ductile et objet obtenu selon ce procédé. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3607851A1 true EP3607851A1 (de) | 2020-02-12 |
EP3607851B1 EP3607851B1 (de) | 2021-03-31 |
Family
ID=63490118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19188365.1A Active EP3607851B1 (de) | 2018-08-08 | 2019-07-25 | Verfahren zum bilden eines crimp-futters auf einem nicht-leitenden substrat, und mit diesem verfahren erhaltenes objekt |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3607851B1 (de) |
CH (1) | CH715238A1 (de) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3544429A1 (de) * | 1985-12-16 | 1987-06-19 | Juwedor Gmbh | Verfahren zur galvanoplastischen herstellung von schmuckwaren |
JP3136526U (ja) * | 2007-07-27 | 2007-11-01 | 株式会社 フォー・クリエイターズ | 宝石類保持構造体、時計バンドおよび腕時計ならびに装身具 |
JP2009247484A (ja) * | 2008-04-03 | 2009-10-29 | Angelly Japan:Kk | 宝石埋込人工爪およびその製造方法 |
EP2579104A2 (de) | 2011-10-07 | 2013-04-10 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Herstellungsverfahren eines Verbunduhrwerks |
EP2796297A1 (de) * | 2013-04-26 | 2014-10-29 | Omega SA | Dekorteil, das durch Bördelung auf amorphem Metall erstellt wird |
EP3291024A1 (de) | 2016-09-05 | 2018-03-07 | CSEM Centre Suisse D'electronique Et De Microtechnique SA | Anzeigemodul, das bewegliche elemente um verformbare verbindungen umfasst, entsprechendes anzeigesystem und uhr, die ein solches anzeigesystem umfasst |
-
2018
- 2018-08-08 CH CH00970/18A patent/CH715238A1/fr not_active Application Discontinuation
-
2019
- 2019-07-25 EP EP19188365.1A patent/EP3607851B1/de active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3544429A1 (de) * | 1985-12-16 | 1987-06-19 | Juwedor Gmbh | Verfahren zur galvanoplastischen herstellung von schmuckwaren |
JP3136526U (ja) * | 2007-07-27 | 2007-11-01 | 株式会社 フォー・クリエイターズ | 宝石類保持構造体、時計バンドおよび腕時計ならびに装身具 |
JP2009247484A (ja) * | 2008-04-03 | 2009-10-29 | Angelly Japan:Kk | 宝石埋込人工爪およびその製造方法 |
EP2579104A2 (de) | 2011-10-07 | 2013-04-10 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Herstellungsverfahren eines Verbunduhrwerks |
EP2796297A1 (de) * | 2013-04-26 | 2014-10-29 | Omega SA | Dekorteil, das durch Bördelung auf amorphem Metall erstellt wird |
EP3291024A1 (de) | 2016-09-05 | 2018-03-07 | CSEM Centre Suisse D'electronique Et De Microtechnique SA | Anzeigemodul, das bewegliche elemente um verformbare verbindungen umfasst, entsprechendes anzeigesystem und uhr, die ein solches anzeigesystem umfasst |
Also Published As
Publication number | Publication date |
---|---|
CH715238A1 (fr) | 2020-02-14 |
EP3607851B1 (de) | 2021-03-31 |
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