EP3586364A4 - Graphene heterolayers for electronic applications - Google Patents

Graphene heterolayers for electronic applications Download PDF

Info

Publication number
EP3586364A4
EP3586364A4 EP18758505.4A EP18758505A EP3586364A4 EP 3586364 A4 EP3586364 A4 EP 3586364A4 EP 18758505 A EP18758505 A EP 18758505A EP 3586364 A4 EP3586364 A4 EP 3586364A4
Authority
EP
European Patent Office
Prior art keywords
heterolayers
graphene
electronic applications
applications
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18758505.4A
Other languages
German (de)
French (fr)
Other versions
EP3586364A1 (en
Inventor
Archana Venugopal
Benjamin Stassen Cook
Luigi Colombo
Robert Reid Doering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of EP3586364A1 publication Critical patent/EP3586364A1/en
Publication of EP3586364A4 publication Critical patent/EP3586364A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
    • H01L29/66037—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66045—Field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53276—Conductive materials containing carbon, e.g. fullerenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1606—Graphene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
    • H01L29/66037—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/8613—Mesa PN junction diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Formation Of Insulating Films (AREA)
EP18758505.4A 2017-02-21 2018-02-21 Graphene heterolayers for electronic applications Pending EP3586364A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/437,818 US10181521B2 (en) 2017-02-21 2017-02-21 Graphene heterolayers for electronic applications
PCT/US2018/019011 WO2018156622A1 (en) 2017-02-21 2018-02-21 Graphene heterolayers for electronic applications

Publications (2)

Publication Number Publication Date
EP3586364A1 EP3586364A1 (en) 2020-01-01
EP3586364A4 true EP3586364A4 (en) 2020-03-04

Family

ID=63167989

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18758505.4A Pending EP3586364A4 (en) 2017-02-21 2018-02-21 Graphene heterolayers for electronic applications

Country Status (5)

Country Link
US (1) US10181521B2 (en)
EP (1) EP3586364A4 (en)
JP (1) JP7219523B2 (en)
CN (1) CN110313065B (en)
WO (1) WO2018156622A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10455736B2 (en) * 2017-07-21 2019-10-22 Raytheon Company Reduced cost and schedule manufacturing of graphene paper based thermal straps/harnesses
JP6782211B2 (en) * 2017-09-08 2020-11-11 株式会社東芝 Transparent electrodes, devices using them, and methods for manufacturing devices
US11136666B2 (en) 2018-08-30 2021-10-05 University Of Kentucky Research Foundation Ordered nanotubes on a two-dimensional substrate consisting of different material properties
CN109638067A (en) * 2018-12-19 2019-04-16 武汉华星光电半导体显示技术有限公司 The production method and thin film transistor (TFT) of thin film transistor (TFT)
KR20210116770A (en) 2020-03-13 2021-09-28 삼성전자주식회사 Apparatus for pellicle transfer and method for pellicle transfer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110045282A1 (en) * 2009-08-18 2011-02-24 Jeffry Kelber Graphene/(multilayer) boron nitride heteroepitaxy for electronic device applications
US20110163298A1 (en) * 2010-01-04 2011-07-07 Chien-Min Sung Graphene and Hexagonal Boron Nitride Devices
EP3037382A1 (en) * 2014-12-24 2016-06-29 Nokia Technologies OY Graphene double-barrier resonant tunneling device
GB2539016A (en) * 2015-06-03 2016-12-07 Caffio Marco Novel process

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7619257B2 (en) 2006-02-16 2009-11-17 Alcatel-Lucent Usa Inc. Devices including graphene layers epitaxially grown on single crystal substrates
KR101490111B1 (en) 2008-05-29 2015-02-06 삼성전자주식회사 Stack structure comprising epitaxial graphene, method of forming the stack structure and electronic device comprising the stack structure
US20100218801A1 (en) 2008-07-08 2010-09-02 Chien-Min Sung Graphene and Hexagonal Boron Nitride Planes and Associated Methods
TWI412493B (en) * 2008-07-08 2013-10-21 Graphene and hexagonal boron nitride planes and associated methods
KR101603771B1 (en) 2009-10-21 2016-03-16 삼성전자주식회사 Electronic device using 2D sheet material and fabrication method the same
KR20110057989A (en) 2009-11-25 2011-06-01 삼성전자주식회사 Composite structure of graphene and nanostructure and method of manufacturing the same
JP2013542546A (en) 2010-03-08 2013-11-21 ウィリアム・マーシュ・ライス・ユニバーシティ Transparent electrode based on graphene / lattice hybrid structure
CN102254582B (en) 2010-05-18 2013-05-15 国家纳米科学中心 Graphite alkenyl conductive material and preparation method thereof
US9281385B2 (en) 2010-06-18 2016-03-08 Samsung Electronics Co., Ltd. Semiconducting graphene composition, and electrical device including the same
KR101680761B1 (en) 2010-09-17 2016-11-30 삼성전자주식회사 Graphene-polymer layered composite and process for preparing the same
US8361853B2 (en) 2010-10-12 2013-01-29 International Business Machines Corporation Graphene nanoribbons, method of fabrication and their use in electronic devices
WO2012064285A1 (en) 2010-11-10 2012-05-18 National University Of Singapore Transparent graphene conductor with permanent dipole layer
WO2012088334A1 (en) 2010-12-21 2012-06-28 Kenneth Shepard Electrical devices with graphene on boron nitride
GB201104824D0 (en) 2011-03-22 2011-05-04 Univ Manchester Structures and methods relating to graphene
WO2012127244A2 (en) * 2011-03-22 2012-09-27 The University Of Manchester Transistor device and materials for making
KR101813173B1 (en) 2011-03-30 2017-12-29 삼성전자주식회사 Semiconductor device, method of manufacturing the same and electronic device including semiconductor device
US8501531B2 (en) 2011-04-07 2013-08-06 The United States Of America, As Represented By The Secretary Of The Navy Method of forming graphene on a surface
KR101878732B1 (en) 2011-06-24 2018-07-16 삼성전자주식회사 Graphene substrate, and transparent electrode and transistor comprising the same
CN102849961B (en) 2011-07-01 2016-08-03 中央研究院 Growth C film or the method for inorganic material film on substrate
US8716863B2 (en) 2011-07-13 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for high performance interconnect
US8872159B2 (en) 2011-09-29 2014-10-28 The United States Of America, As Represented By The Secretary Of The Navy Graphene on semiconductor detector
US9029228B2 (en) 2011-10-19 2015-05-12 SunEdision Semiconductor Limited (UEN201334164H) Direct and sequential formation of monolayers of boron nitride and graphene on substrates
CN102392226A (en) * 2011-11-28 2012-03-28 无锡第六元素高科技发展有限公司 Preparation method of grapheme/ boron nitride heterogeneous film
EP2602821B1 (en) 2011-12-07 2014-02-12 Universität Augsburg Graphene-based nanodevices for terahertz electronics
US9314817B2 (en) 2012-02-29 2016-04-19 Georgia Tech Research Corporation Three-dimensional vertically aligned functionalized multilayer graphene
JP2013191275A (en) * 2012-03-12 2013-09-26 Ulvac Japan Ltd Method of forming transparent conductive film and method of forming transparent electrode
CN103456677A (en) * 2012-06-05 2013-12-18 中芯国际集成电路制造(上海)有限公司 Semiconductor device and manufacturing method thereof
US9331198B2 (en) 2012-07-06 2016-05-03 University Of North Texas Controlled epitaxial boron nitride growth for graphene based transistors
ES2395949B1 (en) 2012-09-18 2013-12-26 Fundació Institut De Ciències Fotòniques ELECTRONIC PLATFORM THAT INCLUDES A CRYSTAL OF TYPE ABO3 AND GRAPHENE, METHOD FOR MANUFACTURING AND CHIP THAT INCLUDES THE SAME
US9018050B2 (en) 2012-10-11 2015-04-28 The Board Of Trustees Of The University Of Illinois Rolled-up transmission line structure for a radiofrequency integrated circuit (RFIC)
US20140145332A1 (en) * 2012-11-26 2014-05-29 Globalfoundries Inc. Methods of forming graphene liners and/or cap layers on copper-based conductive structures
WO2014100723A1 (en) 2012-12-21 2014-06-26 The Regents Of The University Of California Vertically stacked heterostructures including graphene
KR102046099B1 (en) 2012-12-31 2019-11-19 삼성전자주식회사 Thermoelectric material and thermoelectric device including the same
US9680038B2 (en) 2013-03-13 2017-06-13 The Regents Of The University Of Michigan Photodetectors based on double layer heterostructures
KR102026736B1 (en) 2013-03-29 2019-11-04 삼성전자주식회사 Insulating sheet having heterogeneous laminated structure, manufacturing method thereof, and electric device including the insulating sheet
US9209136B2 (en) * 2013-04-01 2015-12-08 Intel Corporation Hybrid carbon-metal interconnect structures
US9299473B2 (en) 2013-06-11 2016-03-29 Hamilton Sundstrand Corporation Composite electrically conductive structures
US9410243B2 (en) 2013-08-06 2016-08-09 Brookhaven Science Associates, Llc Method for forming monolayer graphene-boron nitride heterostructures
WO2015021479A1 (en) 2013-08-09 2015-02-12 The Trustees Of Columbia University In The City Of New York Systems and methods for assembling two-dimensional materials
US9318323B2 (en) 2013-10-18 2016-04-19 Globalfoundries Inc. Semiconductor devices with graphene nanoribbons
WO2015102746A2 (en) 2013-11-04 2015-07-09 Massachusetts Institute Of Technology Electronics including graphene-based hybrid structures
KR102207923B1 (en) 2014-01-28 2021-01-26 삼성전자주식회사 Method of forming multilayer graphene structure
EP3404731B1 (en) 2014-01-31 2019-12-18 The Regents of The University of California Electric field control element for phonons
US10006910B2 (en) 2014-12-18 2018-06-26 Agilome, Inc. Chemically-sensitive field effect transistors, systems, and methods for manufacturing and using the same
US9484428B2 (en) 2015-01-29 2016-11-01 Globalfoundries Inc. Non-planar exciton transistor (BiSFET) and methods for making
CN104726845B (en) 2015-03-05 2018-05-01 中国科学院上海微系统与信息技术研究所 The preparation method of the upper graphene nanobelts of h-BN
EP3104414B1 (en) 2015-06-10 2020-05-06 Fundació Institut de Ciències Fotòniques Image sensor, optoelectronic system comprising said image sensor, and method for manufacturing said image sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110045282A1 (en) * 2009-08-18 2011-02-24 Jeffry Kelber Graphene/(multilayer) boron nitride heteroepitaxy for electronic device applications
US20110163298A1 (en) * 2010-01-04 2011-07-07 Chien-Min Sung Graphene and Hexagonal Boron Nitride Devices
EP3037382A1 (en) * 2014-12-24 2016-06-29 Nokia Technologies OY Graphene double-barrier resonant tunneling device
GB2539016A (en) * 2015-06-03 2016-12-07 Caffio Marco Novel process

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
LI YONG-JUN ET AL: "Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology", AIP ADVANCES, AMERICAN INSTITUTE OF PHYSICS, 2 HUNTINGTON QUADRANGLE, MELVILLE, NY 11747, vol. 2, no. 1, 28 March 2012 (2012-03-28), pages 12191-1 - 12191-5, XP012163634, ISSN: 2158-3226, [retrieved on 20120328], DOI: 10.1063/1.3701267 *
See also references of WO2018156622A1 *

Also Published As

Publication number Publication date
US10181521B2 (en) 2019-01-15
JP7219523B2 (en) 2023-02-08
JP2020509610A (en) 2020-03-26
CN110313065B (en) 2023-01-03
CN110313065A (en) 2019-10-08
WO2018156622A1 (en) 2018-08-30
US20180240886A1 (en) 2018-08-23
EP3586364A1 (en) 2020-01-01

Similar Documents

Publication Publication Date Title
EP3569044A4 (en) Electronic device
EP3312706A4 (en) Electronic device having input device
EP3247235A4 (en) Electronic vaporization devices
EP3252570A4 (en) Electronic pen
EP3161582A4 (en) Wearable electronic devices
EP3383006A4 (en) Electronic device
EP3567833A4 (en) Electronic device
EP3315060A4 (en) Electronic device
EP3338322A4 (en) Electronic device
EP3285147A4 (en) Electronic pen
EP3671721A4 (en) Electronic device
EP3341812A4 (en) Electronic device
EP3250017A4 (en) Electronic device
EP3305183A4 (en) Electronic device
EP3287880A4 (en) Electronic device
EP3691227A4 (en) Electronic device
EP3273849A4 (en) Wearable electronic device
EP3535959A4 (en) Electronic device
EP3651268A4 (en) Electronic device
EP3586364A4 (en) Graphene heterolayers for electronic applications
EP3688568A4 (en) Electronic device for operating applications
EP3121806A4 (en) Electronic device
EP3413172A4 (en) Electronic pen
EP3306954A4 (en) Electronic device
EP3674835A4 (en) Electronic device

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20190923

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602018076278

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0027130000

Ipc: H01L0021285000

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: H01L0027130000

Ipc: H01L0021285000

A4 Supplementary search report drawn up and despatched

Effective date: 20200205

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/288 20060101ALI20200130BHEP

Ipc: H01L 23/522 20060101ALI20200130BHEP

Ipc: B82Y 40/00 20110101ALI20200130BHEP

Ipc: H01L 23/532 20060101ALI20200130BHEP

Ipc: B82Y 30/00 20110101ALI20200130BHEP

Ipc: B32B 7/00 20190101ALI20200130BHEP

Ipc: H01L 29/66 20060101ALI20200130BHEP

Ipc: H01L 21/285 20060101AFI20200130BHEP

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: VENUGOPAL, ARCHANA

Inventor name: DOERING, ROBERT REID

Inventor name: COOK, BENJAMIN STASSEN

Inventor name: COLOMBO, LUIGI

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20240124

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: B32B 7/025 20190101ALI20240508BHEP

Ipc: B82Y 40/00 20110101ALI20240508BHEP

Ipc: B82Y 30/00 20110101ALI20240508BHEP

Ipc: H01L 29/49 20060101ALI20240508BHEP

Ipc: H01L 29/423 20060101ALI20240508BHEP

Ipc: H01L 23/532 20060101ALI20240508BHEP

Ipc: H01L 23/522 20060101ALI20240508BHEP

Ipc: H01L 21/288 20060101ALI20240508BHEP

Ipc: H01L 21/285 20060101AFI20240508BHEP

INTG Intention to grant announced

Effective date: 20240605

P01 Opt-out of the competence of the unified patent court (upc) registered

Free format text: CASE NUMBER: APP_40123/2024

Effective date: 20240705

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED