EP2777368A1 - Moulded part for pressing into a circuit board - Google Patents

Moulded part for pressing into a circuit board

Info

Publication number
EP2777368A1
EP2777368A1 EP20120737203 EP12737203A EP2777368A1 EP 2777368 A1 EP2777368 A1 EP 2777368A1 EP 20120737203 EP20120737203 EP 20120737203 EP 12737203 A EP12737203 A EP 12737203A EP 2777368 A1 EP2777368 A1 EP 2777368A1
Authority
EP
Grant status
Application
Patent type
Prior art keywords
ribs
circuit board
according
molding
characterized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20120737203
Other languages
German (de)
French (fr)
Inventor
Thomas Zwick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHOELLER-ELECTRONICS GmbH
SCHOELLER ELECTRONICS GmbH
Original Assignee
SCHOELLER ELECTRONICS GMBH
Schoeller-Electronics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion

Abstract

The invention relates to a plate-shaped moulded part (1) for pressing into a planar circuit board (2) in a vertical pressing direction perpendicular to the circuit board, wherein the moulded part (1) has an upper flat face (3) and a lower flat face (4), wherein a plurality of ribs (6) extending between the two flat faces (3, 4) are formed on the external circumferential surface (5), said ribs being capable of fastening the moulded part (1) in an opening (7) in the circuit board (2). According to the invention, the extent of at least one rib (6) deviates from a vertical extent (V) and/or the ribs (6) are distributed irregularly when viewed over the external periphery.

Description

Mold part for pressing into a printed circuit board

The invention relates to a molded part for pressing into a printed circuit board according to the preamble of claim 1 and a printed circuit board with such a molded article according to the preamble of claim 1. 1

In the prior art printed electrical circuits are known in which rigid circuit boards are equipped with electronic components. Such circuit boards may consist of one or more individual layers of glass fiber reinforced cured epoxy resin plates one for forming conductor tracks or are copper-clad on both sides.

A printed circuit board because of the relatively high power dissipation of the electronic components arranged thereon a high heat development worfen lower. There are known circuit boards, in which heat-conducting elements in the form of metal bodies are provided which are arranged in recesses of the printed circuit board or attached. Such metal bodies are usually made of copper or a similar material having good thermal conductivity. The fixed in the printed circuit board thermally conductive element ensures a sufficient dissipation of the heat loss of the electronic components and thus prevents a critical temperature range for the components and the circuit board.

In the prior art, printed circuit boards, as explained above, a heat having meleitelement such. For example, from DE 10 2004 036 960 Al or EP 1276357 A2. Here, the heat conducting element is fixed in a space formed in the circuit board aperture, z. Example, by bonding, or pressing.

From DE 102 14 31 1 AI a further printed circuit board is known, in which comprises a heat-conducting element on its outer peripheral surface axially parallel ribs. When pressing the heat conducting element into the circuit board these ribs result in a form-fitting and force-fitting tightness of the heat conduction member.

For certain applications, printed circuit boards are required which have special features for high-frequency or microwave signals. Such printed circuit boards are made of materials that are specific for such

are developed BESTÄTfGUNGSKOPIE high-frequency signal types. The mechanical properties of these materials are not comparable to those of conventional board materials often because they are often softer and more brittle and may also have cold flow properties if necessary.

The invention is based on the problem of creating a thermally conductive molding for circuit boards that can be mounted in printed circuit boards reliably with low mechanical strength and with simple means. The above problem is solved by a mold part having the features of claim. 1 Advantageous developments of the invention are defined in the dependent claims.

An inventive mold part is plate-shaped and is used for pressing into a planar printed circuit board in a vertical pressing direction perpendicular to the printed circuit board plane.

The molded part has an upper and a lower flat surface, which are preferably oriented substantially parallel to each other. Here, the term meant "flat side" far, as far as the site in question is flat in the first approximation. Accordingly, a flat side can also be different topologies as trough-shaped formations o. The like. Encompass.

On the outer peripheral surface connecting the two flat sides to one another, a plurality, is formed between the two flat sides extending ribs, over which the molding can be fixed in an opening or an opening in the circuit board. The term "fin" is herein to be understood broadly and includes any elongate elevation, which extends between the two flat sides.

The extension of at least one rib deviates from a vertical extent. Alternatively or additionally, that the ribs are seen on the outer periphery of irregularly distributed is proposed. The invention is based on the realization that the deviation from the use of vertically aligned and possibly also uniformly arranged ribs can bring an improvement of the strength and form fit between mold part and the printed circuit board with it.

Specifically, an improvement in the uptake of ejection forces in the vertical direction is given by the deviation from a vertical extent. Seen beyond the outer peripheral surface of irregular arrangement of the ribs of the shaped part is for example particularly advantageous when the circuit board is subjected to vibrations which lead to a chaotic distribution of amount and direction of ejection forces.

The deviation of the ribs from one over the outer peripheral surface seen regular arrangement relative can be implemented in many different ways to each other. The ribs may be in a plane parallel to the flat sides of the molded part have non-uniform distances from one another, preferably such that these non-uniform distances are not periodically to each other. Additionally or alternatively, the ribs may have different height fins. This has the result that the penetration depth of the respective ribs is correspondingly vary in size in a wall of the opening of the circuit board, which circuit boards with soft materials leads in particular to a stable anchoring of the molding.

In an advantageous development of the invention, the irregular arrangement of the ribs may be established relative to each other by a different configuration of the ribs themselves. Thus, the ridges may each have two flanks, which together enclose an angle, so that the contour of the respective rib is not symmetrical. In this regard, it is pointed out that various ribs in the comparison, a different contour can have with respect to their two lateral edges to each other.

According to a further advantageous embodiment of the invention, at least one rib in a cross sectional plane can also be formed parallel to the flat sides wavy. With the term "corrugated" is meant in the sense of the invention that the edges of such a fin extend not linearly but in a curved arc, so that no "buckling" results in a transition into the planar area of ​​the outer circumferential surface. In this way, voltage spikes in the circuit board can be effectively prevented.

The deviation of the ribs from the vertical extension may be realized by, that at least one rib extends obliquely with respect to the vertical extent. A rib may have such inclined extension relative to the vertical extension of either a part of its length or over its entire length. In addition and alternatively, it is also possible that at least one rib along its entire length with respect to the vertical extension includes two different angles, z. B., may be selected such that the ridge forms an arrow contour parallel to the outer circumferential surface in one plane. The above embodiments at least obliquely perform a rib with a gradient to the vertical advantageously cause an automatic Ausknüpfen of the molding 1 is effectively prevented from the opening of the circuit board, resulting in a more reliable seating of the molded article results in the circuit board.

A further improvement of the fastening of the molded part, in particular in soft PCB materials can be achieved in that the molded part has a tapered profile. Here, the molded part is tapered along the vertical extension in at least a partial area, so that the outer peripheral surface includes in the tapered part of the molding with respect to the vertical extent of an angle. In this connection it may be advantageous that the contour of the opening which is formed in the circuit board is adapted to the rejuvenation of the molding, in order to avoid damage to the circuit board by the molding.

Regarding its basic design the molding can be configured as desired, eg. As round, oval, triangular or rectangular. In any case, the shape of the molded part is adapted to the circuit design of a respective circuit board.

The control of the pressing force with which the mold is pressed into the opening of the printed circuit board takes place in dependence on the configuration of the respective ribs along the outer peripheral surface of the molding. For example, the described taper of the mold part or an oblique course of one or more ribs may require a greater extent relative to the vertical pressing force.

In view of a greater variability for the attachment of devices or semiconductor dies on the circuit board, the molded part may have a cavity at its upper and / or lower flat side, in such a device or semiconductor die can be mounted. Thus, the arrangement of such components or semiconductor dice is not limited to the circuit board by the assembly of molded parts in the circuit board. Furthermore, the selection of materials for the inventive molding made so may be that direct mounting of electronic components or semiconductor This is possible on a flat side of the molding.

In order to achieve good heat conducting properties as possible, the molded part may be at least partially made of copper or a copper alloy. it is also possible alternatively, the molding of a composite material, for. prepare as tungsten, copper or molybdenum-copper. In yet a further modification, it is possible to at least partially produce the molding ceramic or carbon material basis. The molded part can be either partially or completely, that is integrally made of the above materials.

The above variants of the molded part according to the invention can be industrially produced simply and inexpensively, eg. For example, by stamping, milling, eroding or pressing of suitable materials. During the press-in process of the molded part in an opening of the circuit board of the circuit board can be avoided as explained material damage. The molded part is designed optimized for printed circuit boards for the field of radio frequency and microwave technology, and ensures a sufficiently high press fit to withstand the high thermal and mechanical stresses during further processing of the printed circuit board and its operation and long service life. Thus, no impairment of the quality and reliability of the circuit board under load tests and during operation results.

The invention is further directed to a printed circuit board with an opening into which a molded part is press-fitted as described above. In adaptation to high-frequency or microwave signals, the circuit board may be made of a material which is specifically designed for such high frequency signal types, z. As polytetrafluoroethylene (PTFE). In an advantageous embodiment, the material of such a circuit board may contain fillers such. As ceramics.

The invention is illustrated below with reference to preferred embodiments in the drawings schematically and will be described in detail with reference to the drawings. Show it:

Fig. 1 is a plan view of an inventive mold part when it is pressed into a printed circuit board,

FIG. 2a is a perspective view of a molding according to a first

embodiment,

FIG. 2b shows the detail view of Figure 2a in a plan view,

Fig. 3a shows a perspective view of a molding according to a second

embodiment,

FIG. 3b shows the detail view of Figure 3a in a top view,

FIG. 4a is a perspective view of a molding according to a third

embodiment,

FIG. 4b shows the detail view of Figure 4a in a side view;

FIG. 5a is a perspective view of a molding according to a fourth

embodiment,

Fig. 5b, the detailed representation of Figure 5a in a side view;

FIG. 6a is a perspective view of a molding according to a fifth

Disclosed embodiment,

Fig. 6b, the detail view of Figure 6a in a side view, Fig. 7a is a perspective view of a molding according to a sixth embodiment,

Fig. 7b shows the detail view of figure 7a in a side view;

Fig. 8a is a perspective view of a molding according to a seventh

embodiment,

Fig. 8b is a perspective view of a molding according to the seventh

Embodiment, in a modification,

Figure 9a - e. Top plan views of various embodiments of a molded part according to the invention.

Fig. 1 shows a plan view of an inventive mold part 1, which is secured in a planar printed circuit board 2. The mold part 1 is used to discharge waste heat from electronic components which are mounted on the circuit board. 2 Accordingly, the molded part 1 is made of a material with good thermal conductivity, for example. Example, of copper or copper alloys.

The mold part 1 is rectangular and has the form of a plate having an upper flat surface 3 and a (not visible in FIG 1) lower flat side 4. On the outer peripheral surface 5 of the molding 1, which are the two flat sides 3, 4 to one another, a plurality of ribs 6 are formed. In the circuit board 2 has an opening 7 is provided in the form of an opening. The mold part 1 is pressed into this opening 7 in a vertical pressing direction perpendicular to the circuit board plane, whereby the tips of the ribs come into contact with an inner peripheral surface of the opening. 7 The vertical extent of which is indicated in the drawing by the reference numeral V.

each electrical terminals 8 are provided at an edge portion of the circuit board 2, with which the circuit board 2 can be contacted. According to the illustration of FIG. 1, only a single mold part 1 is pressed into the circuit board 2. it is also possible deviation from this, to press-fit a plurality of mold parts 1 in the printed circuit board. 2 According to the number of mold parts 1 and a plurality of openings 7 are formed in this case in the circuit board. 2

The ribs 6 of the molding 1 are such arranged on the outer circumferential surface 5 so as to vary at least in part by a vertical extension of V and / or seen on the outer periphery are distributed irregularly.

In the drawings different embodiments of an inventive mold 1 are shown which illustrate the possibilities for the illustrated irregular profile of the outer circumferential surface 5 of the mold part 1.

Fig. 2a shows a perspective view of the molded article 1 according to a first embodiment. In this case the ribs 6 are formed at the outer circumferential surface 5, so as to extend substantially parallel to the vertical extension of V.

FIG. 2b shows a portion of the outer circumferential surface 5 of the molding 1 according to the above first embodiment. It can be seen that the ribs 6 to each other a different distance. FIG. 2b shows as an example three routes a, b, c, each representing a distance from the adjacent ribs 6 to each other, namely in a plane parallel to the flat sides 3, 4. In this case, the following relationship applies: a> b> c, after which all of the are different spaced shown in Fig. 2b ribs 6 far apart. It should be pointed out that the other ribs 6, which are formed along the not shown in Fig. 2b side edges of the molded article 1, may also have a non-uniform distance from each other. This irregularity of spacing is characterized in that the distances of successive adjacent ribs 6 are not subject to regularity, and in particular to each other are not periodic. The perspective view of FIG. 2a shows that the ribs 6 are provided circumferentially on all four side edges of this mold part 1, which is formed in a cross-sectional profile orthogonal to the vertical V rectangular. Basically, the irregularity 5 may be provided in the arrangement, only a portion of the outer peripheral surface. The plan view of FIG. 2b also illustrates a wave-shaped design of the ribs 6. This means that the ribs 6 in a plan view of the mold part 1 does not linearly extending edges, but to a certain extent pass wavy each other. This avoids stress peaks during pressing of the mold part 1 in the printed circuit board. 2

Fig. 3a shows a second disclosed embodiment of the molded article 1 in a perspective view. In the second embodiment, at least two fins 6 each have a different fin height. This is shown in Fig. 3b illustrates that shows a plan view of the detail view of Fig. 3a. The rib located at the lower right edge 6 of the mold part 1, referred to in Fig. 3b with A, has with respect to a base plane of the outer circumferential surface 5 a height hi. The adjacent thereto rib 6 are designated in Fig. 3b with B, however, has a greater height than the rib A, namely h2.

In Fig. 3b, the relationship with respect to the different heights of the ribs 6 is shown for simplicity only four ribs and explained. In this regard, it is understood that the molded article 1 according to the second embodiment along its not shown in Fig. 3a side edges further ribs 6, the respective rib heights are different. In this context it is possible that the molding 1 includes a plurality of ribs 6, which are each assigned to a group of ribs with a predetermined fin height. Thus, there may be a first group of ribs 6 having a first predetermined level, further wherein a second group of ribs 6 having a second height less than or greater than the first height is provided. The first or second group of ribs may, for. B. be a specific side flank of the rectangular molding 1 assigned. Alternatively, it is possible that the ribs 6 each having a different height according to the first group or the second group are provided alternately on the outer peripheral surface of at least one side edge of the mold part 1. According to yet another modification, it is possible that all the ribs 6 orthogonal to the outer peripheral surface of the molding 1 each have a different height in comparison to one another. Fig. 4a shows a third embodiment of the molding 1 in a perspective view. The detailed illustration of Fig. 4a illustrates that the ribs relative 6 are each formed obliquely on the outer circumferential surface 5 to the vertical extent of V, that is, with the vertical extension V enclose an angle α. This is shown in Fig. 4b particularly clearly illustrating a side view of a portion of the outer circumferential surface 5.

With regard to the third embodiment, it may be advantageous that all the ribs 6 along the longitudinal sides of the molding 1 can be parallel to each other, that in each case the same angle α with the vertical extent include V. In contrast, the ribs 6 may be oriented substantially parallel to the vertical V to the transverse sides of the mold part 1. In the detailed view of FIG. 4 only the front transverse side of the molding 1 can be seen by way of example adjacent the front longitudinal side. It should be pointed out that the ribs 6 are oriented towards the not visible in Fig. 4a side edges in the same manner as at the front longitudinal or transverse side.

In a modification of the third embodiment shown in FIG. 4 the ribs 6, which extend obliquely relative to the vertical extension of V, each also have a non-uniform distance, analogous to the first embodiment of FIG. 2 can.

Fig. 5a shows a fourth embodiment of the molding 1 in a perspective view. The detail view of Fig. 5a illustrates that the ribs 6 extend in a right area of ​​the front longitudinal side obliquely relative to the vertical extent of V, that is with its longitudinal axis from bottom left to top right. 6 In contrast, the ribs in a left area of ​​the front longitudinal side of the bottom right to top left. In Fig. 5b, which shows a side view of the outer circumferential surface 5, this relationship is illustrated again.

For the sake of simplification 5 are for the fourth disclosed embodiment in FIG. At the front longitudinal side of the mold part 1 only six ribs 6 is shown, it being understood that more or fewer ribs 6 may be provided. At the front transverse side of the mold part 1, the ribs 6 are also formed to extend obliquely with respect to the vertical extent of V. Similarly, the ribs 6 can also extend obliquely to the rear (in Fig. 5a is not recognizable) lateral side of the molding 1. FIG. 6a shows a fifth embodiment of the molded article 1 in a perspective view. The detail view of Fig. 6a shows that the ribs 6 are formed on the front end side of the molding 1, an arrow shape. This is due to the fact that the ribs 6 in a side view of the molded article 1, two flanks 9, 10 have, which together enclose an angle ß. This is illustrated in Fig. 6b shows a corresponding side view. The two flanks 9, 10 are substantially the same length selected so that the above arrow shape for the respective ribs 6 results.

With regard to the fourth and fifth embodiments may be noted that the oblique course of the ribs on each side edge, ie it can be provided on the two longitudinal sides and / or at the two transverse sides of the molding 1. 6 It is also possible that extend at an angle in the range of at least one longitudinal side and / or at least one transverse side of the mold part 1, only one rib 6, or some ribs 6 with respect to the vertical extent of V, with the remaining ribs 6 on the outer circumferential surface 5 of the molded part 1 is substantially aligned parallel to the vertical V. Fig. 7a shows a sixth embodiment of the molding 1 in a perspective view. The detailed illustration of Fig. 7a illustrates that the mold part 1 tapers along the vertical extension of V. Preferably, the Außenumfangsilächen 5 are in any case tapered in the region of the longitudinal sides of the molding 1 so that they include γ with the vertical extension of a V angle. This is shown in Fig. 7b shows, showing a side view of the detail view of Fig. 7a and constitutes a longitudinal side of the molding 1. An above-mentioned inclination or taper of the mold part 1 may be provided on one or more side edges of the molded article 1, with either coinciding or different angles relative to the vertical extent of V. In general, a molded article 1 with a tapered profile in printed circuit boards made of a soft material is of advantage, an opening in the printed circuit board is adapted in correspondence with the taper.

Fig. 8a shows a seventh embodiment of the molding 1 in a perspective view. In this embodiment, in the upper flat side 3 a avität or recess 1 1 is formed. In this avität 1 1 can be mounted to an electronic component or a semiconductor die (not shown). In that regard, any spatial arrangement of a component on the circuit board 2 is not limited by the molding. 1 Also at the (in Fig. 10 can not be seen) lower flat side 4, a cavity can also be formed therein to mount a component.

In the seventh embodiment, two through holes 12 are formed in the mold 1, which extend parallel to the vertical and completely through the mold part 1 in its height. These through-openings 12 facilitate handling of the molded article 1 and a pressing of the mold part 1 in the circuit board. 2

Fig. 8b shows a modification of the seventh embodiment in a perspective view. Here, the inner circumferential surface 13 is - formed profiled, whereby a better fixing of a semiconductor device in the cavity 1 1 is possible - in the same way as the outer peripheral surface. 5

are with respect to the above-explained respective embodiments of the molding 1 noted that the different variants of ribs 6 may be combined in any desired manner. This means that along the outer circumferential surface 5 of a mold part 1, at least a variant of the above types of ribs 6 or more of these variants may be combined. For example, a mold part 1 is possible, in which the ribs 6 along the outer circumferential surface 5 have mutually a nonuniform pitch in a direction orthogonal to have the outer peripheral surface of a different "fin height", and / or extend with respect to the vertical extension obliquely, either along its entire length or with two flanks, which together enclose an angle.

Fig. 9 shows the detailed views according to the letters ae respectively plan views of various shapes of the mold part 1. The fins 6 are for the purpose of simplification at the outer circumferential surface 5 of the molding 1 not shown in the plan views of Fig. 9. In the order of presentation of the letters ad of Fig. 9, the mold 1 is formed round, square, triangular or oval. The shaping in accordance with the display of point e corresponding to a "bone", ie a combination of a rectangular shape at their ends in each case a half-circle is formed. The shape of the molded part 1 is always adapted to the particular circuit design of a printed circuit board 2.

The configuration of the ribs 6 on the outer circumferential surface 5 is always carried out in adaptation to the material of a respective circuit board. 2 For example, the "fin height" of the ribs is selected the greater, the softer the material of a printed circuit board. Through the appropriate choice of the surface pressure between the tips of the ribs 6 and the wall of an opening of the printed circuit board 2, the size of the frictional connection can be set, the respective exists between a mold part and the opening of the printed circuit board. 2 By choosing an appropriate "fin height" of the ribs 6 can be set a predetermined gap width, which is present in a pressed mold part 1 between the outer circumferential surface 5 and the inner circumferential surface of the opening. 7 This gap width is sufficiently large to be dimensioned so that when a treatment of the circuit board 2 with liquids such. Example when plating or metallizing at a wet chemical process, a through-flow of liquid through this gap is readily possible. By a suitable plating or electroplating the inner peripheral surface of the opening 7 and a corresponding contact with the tips of the ribs 6, a defined thermal or electrical transition between the mold 1 and the circuit board 2 can be adjusted in a pressed molding. 1

Claims

claims
1. Plattenformiges molding (1) for pressing into a planar circuit board (2) in a vertical pressing direction perpendicular to the circuit board plane, wherein the molded part (1) has an upper flat side (3) and a lower flat side (4), wherein on the outer peripheral surface (5) several, located between the two flat sides (3, 4) extending ribs (6) are formed on the molding (1) in an opening (7) of the circuit board (2) can be fastened,
characterized,
that the extent of which is at least one rib (6) by a vertical extension (V) and / or that the ribs (6) are seen on the outer periphery unevenly distributed.
2. mold part (1) according to claim 1, characterized in that at least two ribs (6) each having a different fin height, preferably, that a first group of ribs (6) a greater fin height as a second group of ribs (6) , more preferably that all the ribs (6) have a different fin height.
3. molding (1) according to claim 1 or 2, characterized in that at least one rib (6) in a cross sectional plane parallel to the flat sides (3, 4) is designed wave-shaped.
4. molded part (1) according to one of the preceding claims, characterized in that all the ribs (6) (V) extending obliquely relative to the vertical extent.
5. molding (1) according to claim 4, characterized in that at least one rib (6) over its entire length with respect to the vertical extent (V) at the same angle (a) extends obliquely.
6. molded part (1) according to one of the preceding claims, characterized in that at least one rib (6) in a plan view of the outer circumferential surface (5) has two flanks (9, 10) which include with one another an angle (ß), preferably that the angle (ß) between the flanks (9, 10) is selected so that the rib (6) forms a wedge shape in a plan view of the outer circumferential surface (5).
7. molding (1) according to one of the preceding claims, characterized in that the shaped part (1) along the vertical extension (V) at least one tapered portion.
8. molding (1) according to one of the preceding claims, characterized in that the molded part (1) in a plan view of one of the flat sides (3, 4) is round, oval triangular, rectangular, or formed by a combination of at least two of these geometries ,
9. molding (1) according to one of the preceding claims, characterized in that the molded part (1) has at least one cavity (1 1) on at least one flat side (3, 4) in which an electronic component is mounted.
10. A shaped part (1) according to any one of the preceding claims, characterized in that the molded part (1) at least partially made of copper or a copper alloy, a composite material such as in particular tungsten copper (W-Cu), or molybdenum-copper (Mo-Cu), is made or ceramic or carbon-based.
1 1. printed circuit board (2) is in the form of a part (1) is pressed according to one of claims 1 to 10 with an opening (7).
12, printed circuit board (2) according to claim 1 1, characterized in that the circuit board (2) is made of a material which is adapted to high-frequency and / or microwave signals, preferably in that the circuit board (2) polytetrafluoroethylene (PTFE) having , more preferably, that the conductor plate (2) contains fillers such as ceramics.
EP20120737203 2011-11-11 2012-06-29 Moulded part for pressing into a circuit board Pending EP2777368A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE202011107731 2011-11-11
PCT/EP2012/002751 WO2013068055A1 (en) 2011-11-11 2012-06-29 Moulded part for pressing into a circuit board

Publications (1)

Publication Number Publication Date
EP2777368A1 true true EP2777368A1 (en) 2014-09-17

Family

ID=46545318

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20120737203 Pending EP2777368A1 (en) 2011-11-11 2012-06-29 Moulded part for pressing into a circuit board

Country Status (2)

Country Link
EP (1) EP2777368A1 (en)
WO (1) WO2013068055A1 (en)

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See references of WO2013068055A1 *

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