EP2720368A4 - Power module and power conversion apparatus using same - Google Patents

Power module and power conversion apparatus using same

Info

Publication number
EP2720368A4
EP2720368A4 EP12797538.1A EP12797538A EP2720368A4 EP 2720368 A4 EP2720368 A4 EP 2720368A4 EP 12797538 A EP12797538 A EP 12797538A EP 2720368 A4 EP2720368 A4 EP 2720368A4
Authority
EP
European Patent Office
Prior art keywords
same
power
conversion apparatus
power module
power conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12797538.1A
Other languages
German (de)
French (fr)
Other versions
EP2720368A1 (en
EP2720368B1 (en
Inventor
Yujiro Kaneko
Tokihito Suwa
Shinji Hiramitsu
Takahiro Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of EP2720368A1 publication Critical patent/EP2720368A1/en
Publication of EP2720368A4 publication Critical patent/EP2720368A4/en
Application granted granted Critical
Publication of EP2720368B1 publication Critical patent/EP2720368B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L50/00—Electric propulsion with power supplied within the vehicle
    • B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
    • B60L50/16—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines with provision for separate direct mechanical propulsion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using dc to ac converters or inverters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P29/00—Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
    • H02P29/60—Controlling or determining the temperature of the motor or of the drive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2200/00—Type of vehicles
    • B60L2200/26—Rail vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2210/00—Converter types
    • B60L2210/40—DC to AC converters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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EP12797538.1A 2011-06-08 2012-05-22 Power module and power conversion apparatus using same Active EP2720368B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011128304A JP5502805B2 (en) 2011-06-08 2011-06-08 Power module and power converter using the same
PCT/JP2012/063065 WO2012169342A1 (en) 2011-06-08 2012-05-22 Power module and power conversion apparatus using same

Publications (3)

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Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581131B2 (en) * 2010-06-30 2014-08-27 日立オートモティブシステムズ株式会社 Power module and power conversion device using the same
US9290101B2 (en) * 2010-11-22 2016-03-22 Honda Motor Co., Ltd. Power control unit for electric vehicle with converters cooled by surfaces of a cooling unit
US9057569B2 (en) * 2010-11-22 2015-06-16 Kabushiki Kaisha Toshiba Ceramic heat sink material for pressure contact structure and semiconductor module using the same
JP5508357B2 (en) * 2011-07-29 2014-05-28 日立オートモティブシステムズ株式会社 Power converter
JP5567530B2 (en) 2011-08-19 2014-08-06 日立オートモティブシステムズ株式会社 Friction stir welding structure and power semiconductor device
CN103023279B (en) * 2011-09-27 2015-05-13 株式会社京浜 Semiconductor control device
US9048721B2 (en) * 2011-09-27 2015-06-02 Keihin Corporation Semiconductor device
WO2013140502A1 (en) * 2012-03-19 2013-09-26 三菱電機株式会社 Power conversion apparatus
US20150138734A1 (en) * 2013-11-18 2015-05-21 Magna Electronics Inc. 360 degree direct cooled power module
JP5805838B1 (en) 2014-09-29 2015-11-10 株式会社日立製作所 Heating element cooling structure, power converter unit and power converter
US9504191B2 (en) 2014-03-28 2016-11-22 Deere & Company Electronic assembly for an inverter
JP6192585B2 (en) * 2014-04-25 2017-09-06 日立オートモティブシステムズ株式会社 Power semiconductor module and power converter using the same
US10037930B2 (en) 2014-06-26 2018-07-31 Hitachi Automotive Systems, Ltd. Power semiconductor module and manufacturing method of power semiconductor module
CN106664030B (en) * 2014-07-29 2018-10-30 日立汽车系统株式会社 Power-converting device
DE102014217938B4 (en) * 2014-09-08 2022-11-03 Robert Bosch Gmbh electronic component
JP6429889B2 (en) * 2014-09-25 2018-11-28 日立オートモティブシステムズ株式会社 Power converter
DE102015200868A1 (en) * 2015-01-20 2016-07-21 Zf Friedrichshafen Ag control electronics
WO2016186102A1 (en) * 2015-05-18 2016-11-24 カルソニックカンセイ株式会社 Power conversion device
US10298145B2 (en) * 2015-05-18 2019-05-21 Calsonic Kansei Corporation Power converter capable of converting direct-current electric power or three-phase alternating-current power
FR3043880B1 (en) * 2015-11-13 2017-12-29 Valeo Systemes De Controle Moteur HOUSING FOR ELECTRICAL EQUIPMENT
DE102015226023A1 (en) * 2015-12-18 2017-06-22 Siemens Aktiengesellschaft Liquid-cooled, electric drive component, powertrain, vehicle and process
US9781867B2 (en) * 2016-02-19 2017-10-03 Ford Global Technologies, Llc Power module assembly for a vehicle power inverter
USD811437S1 (en) * 2016-03-30 2018-02-27 Siemens Aktiengesellschaft Motor controller
CN109247016A (en) * 2016-04-27 2019-01-18 康奈可关精株式会社 Power inverter
US10411486B2 (en) 2016-09-09 2019-09-10 Delta Electronics (Thailand) Public Company Limited Power conversion device
JP6710163B2 (en) * 2017-01-12 2020-06-17 日立オートモティブシステムズ株式会社 Power semiconductor device
JP6948855B2 (en) * 2017-06-30 2021-10-13 日立Astemo株式会社 Power semiconductor device and power conversion device using it
CN107453617B (en) * 2017-08-15 2020-04-28 中车永济电机有限公司 Quick high-voltage electrical connection device of train power unit
JP6847013B2 (en) * 2017-09-29 2021-03-24 日立Astemo株式会社 Power semiconductor device
US11368031B2 (en) 2017-11-08 2022-06-21 Eaton Intelligent Power Limited Power distribution and circuit protection for a mobile application having a high efficiency inverter
CN116742575A (en) 2017-11-08 2023-09-12 伊顿智能动力有限公司 Power distribution unit and fuse management for electric mobile applications
US11070049B2 (en) 2017-11-08 2021-07-20 Eaton Intelligent Power Limited System, method, and apparatus for power distribution in an electric mobile application using a combined breaker and relay
CN109861555A (en) * 2018-02-06 2019-06-07 台达电子企业管理（上海）有限公司 Power supply change-over device
JP6906709B2 (en) * 2018-09-14 2021-07-21 三菱電機株式会社 Power converter
US10447170B1 (en) * 2018-11-09 2019-10-15 Sf Motors, Inc. Inverter module for drivetrain of an electric vehicle
JP7153538B2 (en) * 2018-11-16 2022-10-14 日立Astemo株式会社 Power semiconductor module, power converter, and method for manufacturing power semiconductor module
US10910683B2 (en) 2018-11-19 2021-02-02 Ford Global Technologies, Llc Heat exchanger plate assembles for electrified vehicle battery packs
WO2020105556A1 (en) * 2018-11-21 2020-05-28 三菱電機株式会社 Semiconductor device, power conversion device, and method for manufacturing semiconductor device
JP7141316B2 (en) 2018-11-21 2022-09-22 日立Astemo株式会社 power semiconductor equipment
US11682895B2 (en) 2019-02-22 2023-06-20 Eaton Intelligent Power Limited Inverter assembly with integrated coolant coupling port
JP2021019487A (en) * 2019-07-24 2021-02-15 株式会社デンソー Semiconductor module structure
JP2022188312A (en) * 2019-11-27 2022-12-21 日立Astemo株式会社 Power module and method for manufacturing power module
US11758692B2 (en) * 2020-06-12 2023-09-12 Auras Technology Co., Ltd. Heat dissipation module
JP7318591B2 (en) * 2020-06-15 2023-08-01 株式会社デンソー power converter
CN113488445A (en) * 2021-07-05 2021-10-08 合肥巨一动力系统有限公司 IGBT packaging heat radiation structure and motor controller using same
US11950398B2 (en) * 2022-01-20 2024-04-02 Borgwarner Luxembourg Automotive Systems Sa Systems and methods for cooling electronic components of a vehicle
US11943903B2 (en) 2022-01-20 2024-03-26 Borgwarner Luxembourg Automotive Systems Sa Systems and methods for cooling electronic components of a vehicle
US11785737B2 (en) 2022-01-20 2023-10-10 Borg Warner Luxembourg Automotive Systems SA Systems and methods for cooling electronic components of a vehicle
DE102022116921A1 (en) 2022-07-07 2024-01-18 Eberspächer Catem Gmbh & Co. Kg Component of an electric heater and electric heater
WO2024041017A1 (en) * 2022-08-24 2024-02-29 北京嘉楠捷思信息技术有限公司 Electronic device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4147987B2 (en) * 2003-03-17 2008-09-10 株式会社日立製作所 Multi-phase AC rotating electric machine
JP2005175163A (en) * 2003-12-10 2005-06-30 Toyota Motor Corp Cooling structure of semiconductor module
JP4979909B2 (en) * 2005-08-19 2012-07-18 株式会社日立製作所 Power converter
JP2007335663A (en) * 2006-06-15 2007-12-27 Toyota Motor Corp Semiconductor module
JP2008010761A (en) * 2006-06-30 2008-01-17 Fanuc Ltd Heat sink of electronic component
JP4436843B2 (en) * 2007-02-07 2010-03-24 株式会社日立製作所 Power converter
JP5227532B2 (en) * 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 Semiconductor module for inverter circuit
JP4580997B2 (en) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 Power converter
WO2009150875A1 (en) * 2008-06-12 2009-12-17 株式会社安川電機 Power module and control method therefore
JP4988665B2 (en) * 2008-08-06 2012-08-01 日立オートモティブシステムズ株式会社 Semiconductor device and power conversion device using the semiconductor device
JP5557441B2 (en) * 2008-10-31 2014-07-23 日立オートモティブシステムズ株式会社 Power converter and electric vehicle
JP2010225720A (en) * 2009-03-23 2010-10-07 Mitsubishi Electric Corp Power module
JP5492447B2 (en) * 2009-04-28 2014-05-14 日立オートモティブシステムズ株式会社 Power module
JP5481148B2 (en) * 2009-10-02 2014-04-23 日立オートモティブシステムズ株式会社 Semiconductor device, power semiconductor module, and power conversion device including power semiconductor module
JP5557585B2 (en) 2010-04-26 2014-07-23 日立オートモティブシステムズ株式会社 Power module
JP5380376B2 (en) 2010-06-21 2014-01-08 日立オートモティブシステムズ株式会社 Power semiconductor device
JP5581131B2 (en) 2010-06-30 2014-08-27 日立オートモティブシステムズ株式会社 Power module and power conversion device using the same
JP5588895B2 (en) 2011-02-28 2014-09-10 日立オートモティブシステムズ株式会社 Power semiconductor module, power semiconductor module manufacturing method, and power conversion device
JP5567530B2 (en) 2011-08-19 2014-08-06 日立オートモティブシステムズ株式会社 Friction stir welding structure and power semiconductor device
JP5542765B2 (en) 2011-09-26 2014-07-09 日立オートモティブシステムズ株式会社 Power module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

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US9241429B2 (en) 2016-01-19
CN103597729A (en) 2014-02-19
WO2012169342A1 (en) 2012-12-13
US20140098588A1 (en) 2014-04-10
JP5502805B2 (en) 2014-05-28
EP2720368A1 (en) 2014-04-16
EP2720368B1 (en) 2017-02-08
US20160095264A1 (en) 2016-03-31
JP2012257369A (en) 2012-12-27
CN103597729B (en) 2016-03-16

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