EP2716147A4 - Thermal transfer device with reduced vertical profile - Google Patents

Thermal transfer device with reduced vertical profile

Info

Publication number
EP2716147A4
EP2716147A4 EP11867056.1A EP11867056A EP2716147A4 EP 2716147 A4 EP2716147 A4 EP 2716147A4 EP 11867056 A EP11867056 A EP 11867056A EP 2716147 A4 EP2716147 A4 EP 2716147A4
Authority
EP
European Patent Office
Prior art keywords
transfer device
thermal transfer
vertical profile
reduced vertical
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP11867056.1A
Other languages
German (de)
French (fr)
Other versions
EP2716147A1 (en
Inventor
Sukhvinder Singh Kang
John Ralph Cennamo
Bradley Robert Whitney
Randolph S Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Publication of EP2716147A1 publication Critical patent/EP2716147A1/en
Publication of EP2716147A4 publication Critical patent/EP2716147A4/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP11867056.1A 2011-05-27 2011-05-27 Thermal transfer device with reduced vertical profile Ceased EP2716147A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038299 WO2012166086A1 (en) 2011-05-27 2011-05-27 Thermal transfer device with reduced vertical profile

Publications (2)

Publication Number Publication Date
EP2716147A1 EP2716147A1 (en) 2014-04-09
EP2716147A4 true EP2716147A4 (en) 2015-08-26

Family

ID=47259642

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11867056.1A Ceased EP2716147A4 (en) 2011-05-27 2011-05-27 Thermal transfer device with reduced vertical profile

Country Status (5)

Country Link
US (1) US20140345829A1 (en)
EP (1) EP2716147A4 (en)
JP (1) JP6078054B2 (en)
CN (1) CN103733746B (en)
WO (1) WO2012166086A1 (en)

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JP6269478B2 (en) * 2012-03-22 2018-01-31 日本電気株式会社 Electronic substrate cooling structure and electronic device using the same
JP6179145B2 (en) * 2013-03-18 2017-08-16 富士通株式会社 Electronic equipment system
JP5986064B2 (en) 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 Cooling system and electronic equipment
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
KR102424963B1 (en) 2015-07-30 2022-07-25 삼성전자주식회사 Integrated circuit device and method of manufacturing the same
JP6309928B2 (en) * 2015-09-24 2018-04-11 Ｎｅｃプラットフォームズ株式会社 Cooling system and electronic equipment
US10349561B2 (en) * 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN106231871B (en) * 2016-08-23 2018-04-20 山东时风（集团）有限责任公司 A kind of radiator of electric vehicle controller
CN113784599A (en) * 2016-08-24 2021-12-10 台达电子工业股份有限公司 Heat radiation assembly
US11236948B2 (en) 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
ES2910103T3 (en) 2017-03-12 2022-05-11 Zuta Core Ltd Refrigeration systems and procedures
CN107339900A (en) * 2017-08-22 2017-11-10 无锡马山永红换热器有限公司 New strip-fin oil cooler
CN109714931B (en) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 Electronic equipment applying heat dissipation structure
EP3742101B1 (en) * 2018-01-19 2023-10-25 Sumitomo Precision Products Co., Ltd. Ebullient cooler
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
TWI690686B (en) * 2018-10-31 2020-04-11 英業達股份有限公司 Cooling device
CN113163683B (en) * 2021-04-02 2023-05-30 西安易朴通讯技术有限公司 Liquid cooling heat dissipation equipment, cabinet and system
US20240032185A1 (en) * 2022-07-20 2024-01-25 KYOCERA AVX Components Corporation Heat Sink Component Terminations

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20070006992A1 (en) * 2005-07-08 2007-01-11 Tay-Jian Liu Loop-type heat exchange module

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JPS5150448Y2 (en) * 1972-05-19 1976-12-04
JPS53139274U (en) * 1977-04-08 1978-11-04
JPS57204156A (en) * 1981-06-09 1982-12-14 Mitsubishi Electric Corp Ebullition type cooling device
JPH0351697A (en) * 1989-07-19 1991-03-06 Showa Alum Corp Heat pipe
JP2743022B2 (en) * 1989-09-29 1998-04-22 昭和アルミニウム株式会社 heat pipe
JPH11130410A (en) * 1997-10-31 1999-05-18 Koa Corporation:Kk Cooling device for ozonizer
JP2002048447A (en) * 2000-08-07 2002-02-15 Hitachi Ltd Cooling device for vehicle
JP2002246782A (en) * 2001-02-15 2002-08-30 Calsonic Kansei Corp Evaporation cooling device
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
JP3909520B2 (en) * 2002-08-29 2007-04-25 三菱電機株式会社 Cooling system
JP4391351B2 (en) * 2004-07-29 2009-12-24 古河電気工業株式会社 Cooling system
JP3977378B2 (en) * 2004-03-11 2007-09-19 古河電気工業株式会社 Module for cooling semiconductor elements
JP2007533944A (en) * 2004-03-31 2007-11-22 ベリッツ コンピューター システムズ， インコーポレイテッド Thermosyphon-based thin cooling system for computers and other electronic equipment
JP2006125718A (en) * 2004-10-28 2006-05-18 Sony Corp Heat transport device, and electronic device
JP2007010211A (en) * 2005-06-30 2007-01-18 Hitachi Ltd Cooling device of electronics device
US7686071B2 (en) * 2005-07-30 2010-03-30 Articchoke Enterprises Llc Blade-thru condenser having reeds and heat dissipation system thereof
CN101283177A (en) * 2005-07-30 2008-10-08 艾提丘克事业有限责任公司 Blade-thru condenser and heat dissipation system thereof
JP2007103748A (en) * 2005-10-06 2007-04-19 Seiko Epson Corp Heat exchanger, liquid-cooling system, light source equipment, projector, electronic device unit, and electronic equipment
US7422052B2 (en) * 2006-04-20 2008-09-09 Delphi Technologies, Inc. Low profile thermosiphon
CN103298320A (en) * 2007-12-19 2013-09-11 集群系统公司 Cooling system for contact cooled electronic modules

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20070006992A1 (en) * 2005-07-08 2007-01-11 Tay-Jian Liu Loop-type heat exchange module

Also Published As

Publication number Publication date
US20140345829A1 (en) 2014-11-27
CN103733746B (en) 2017-05-03
CN103733746A (en) 2014-04-16
JP6078054B2 (en) 2017-02-08
JP2014517906A (en) 2014-07-24
EP2716147A1 (en) 2014-04-09
WO2012166086A1 (en) 2012-12-06

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: WHITNEY, BRADLEY, ROBERT

Inventor name: COOL, RANDOLPH H.

Inventor name: CENNAMO, JOHN, RALPH

Inventor name: KANG, SUKHVINDER, SINGH

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CENNAMO, JOHN, RALPH

Inventor name: KANG, SUKHVINDER, SINGH

Inventor name: COOL, RANDOLPH S.

Inventor name: WHITNEY, BRADLEY, ROBERT

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CENNAMO, JOHN, RALPH

Inventor name: WHITNEY, BRADLEY, ROBERT

Inventor name: KANG, SUKHVINDER, SINGH

Inventor name: COOK, RANDOLPH S.

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150724

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Ipc: H01L 23/427 20060101ALI20150720BHEP

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