EP2636001A2 - Sim card and manufacturing method - Google Patents

Sim card and manufacturing method

Info

Publication number
EP2636001A2
EP2636001A2 EP11837644.1A EP11837644A EP2636001A2 EP 2636001 A2 EP2636001 A2 EP 2636001A2 EP 11837644 A EP11837644 A EP 11837644A EP 2636001 A2 EP2636001 A2 EP 2636001A2
Authority
EP
European Patent Office
Prior art keywords
substrate
ic chip
surface
module
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11837644.1A
Other languages
German (de)
French (fr)
Other versions
EP2636001A4 (en
Inventor
Yean Wei Yeap
Wai Ping Mok
Bertrand Hoveman
Jean Jacques Mischler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to MYPI2010005182 priority Critical
Application filed by Linxens Holding filed Critical Linxens Holding
Priority to PCT/IB2011/002825 priority patent/WO2012059813A2/en
Publication of EP2636001A2 publication Critical patent/EP2636001A2/en
Publication of EP2636001A4 publication Critical patent/EP2636001A4/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Abstract

The present invention provides a method for manufacturing a SIM card without using a carrier card. An array of conductive modules is formed onto a first surface of a substrate. These conductive modules are spaced apart from each other with spacing configured to provide peripheral portions surrounding each conductive module. The peripheral portions are sized to provide sufficient substrate parts to form the SIM card body based on the industry standard. The substrate is then trimmed to form SIM card bodies and an IC chip is bonded to a second side of the substrate. The IC chip is then encapsulated and thereafter, a molding process is carried out to supply and form a molding part to cover the encapsulated IC chip and also flatten the bottom side of the substrate. The molding part together with the substrate forms a SIM card with the thickness conforming to the industry standard.

Description

SIM CARD AND MANUFACTURING METHOD

Field of the Invention

5 The present invention relates to a method for manufacturing Subscriber Identity

Module (SIM) cards and SIM cards made by such method.

Background of the Invention o SIM cards contain unique information to identify a user or subscriber of the card, and are widely used in electronic devices such as mobile phones. An example of SIM card which conforms to industrial standards is of a generally rectangular shape with an external dimension of about 25mm x 15mm. Such a SIM card is manufactured by attaching electronic components such as IC chip and conductive contact circuits to, and supplied to5 the user together with, a bigger carrier card, e.g. one of about a 86mm x 54mm rectangular shape. Once a SIM card is removed from the carrier card and installed to an electronic device, the carrier card is disposed off.

Notwithstanding the material wastage, additional cost incurred and environmental o concerns with respect to the carrier card disposal, carrier cards remain necessary during the manufacturing process of conventional SIM cards. The present invention aims to address the above-mentioned issues by providing a method of manufacturing SIM cards without the need to use carrier cards. 5 Summary of the Invention

The present invention provides a method for manufacturing a SIM card without using a bigger carrier card. According to one embodiment, an array of conductive modules is formed onto a first surface of a substrate. These conductive modules are positioned spaced apart from each other with spacing configured to provide peripheral portions surrounding each conductive module. The peripheral portions are sized to provide sufficient substrate parts to form the SIM card body with a profile based on the industry standard. The substrate is then trimmed surrounding each conductive module, to form SIM card bodies with desired final dimensions and shape and an IC chip is bonded to a second side of the substrate. The IC chip is then encapsulated and thereafter, a molding process is carried out to supply and form a molding material to cover the encapsulated IC chip and flatten the bottom side of the substrate. The molding material together with the substrate forms a SIM card with a thickness conforming to the industry standard. No bigger carrier card is necessary according to the present invention.

In another embodiment, an array of conductive modules is formed onto a first surface of a substrate and a spacer layer is laminated to the substrate to form the SIM card body. Both the substrate and the spacer layer are trimmed separately to a size and shape conforming to the SIM card standard. In an alternative embodiment, a substrate with conductive modules formed thereon is laminated with a spacer layer and then the laminated substrate and spacers are together trimmed to a size and shape conforming to the SIM card standard. The spacer layer has recesses each positioned corresponding to a conductive module area. Each recess receives an IC chip which is then bonded to the substrate and connected to the conductive module. Thereafter recesses are filled with molding compound to flatten the bottom surface of the SIM card body and form the SIM card.

For a better understanding of the present invention and its purpose and preferred embodiments, further description accompanied by figures is provided in detail below. Brief description of the drawings

Fig. 1 is a schematic plan view showing a layout of SIM conductive contact modules arranged on a substrate in a method for manufacturing a Subscriber Identity 5 Module (SIM) card according to one embodiment of the present invention;

Fig. 2 is an enlarged partial cross sectional view of Fig. 1 along A- A;

Fig. 3 is a an enlarged partial cross sectional view of Fig. 1 along A- A and to be o trimmed;

Fig. 4 is a schematic plan view showing SIM contact module bodies formed;

Fig. 5 is an enlarged partial cross sectional view showing an IC chip attached to a5 SIM contact module;

Fig. 6 is an enlarged partial cross sectional view showing encapsulation of the IC chip shown in Fig. 5; o Fig. 7 is an enlarged partial cross sectional view showing molding of the

encapsulated IC chip;

Fig. 8 is a schematic plan view showing a spacer layer for manufacturing a SIM card according to another embodiment of the present invention;

5

Figs. 9 is a perspective cross sectional view showing lamination of the substrate and spacer layer shown in Fig. 8 after trimming according to another embodiment of the present invention; 0 Fig. 10 is a perspective view showing a substrate and a spacer layer according to a further embodiment of the present invention; Fig. 11 is a perspective view showing lamination of the substrate and spacer layer shown in Fig. 10;

Fig. 12 is a perspective view showing a bottom side the lamination shown 11 after trimming;

Figs 13 to 15 are schematic plan views showing subsequent SIM card

manufacturing method according to the present invention.

Detailed Description Of Preferred Embodiments

As shown in Figs. 1 and 2, an array of electrically conductive modules such as metal contact pad modules 120 is formed on a substrate 110. Contact pad modules 120 are spaced apart from each other with spacing 134 and 136 which are configured to provide peripheral portions 118 of substrate 110 surrounding each contact pad module 120. The peripheral portions 118 are sized to provide sufficient substrate parts, for the purpose of forming SIM card body based on SIM card industry standards. Apertures 112 in the form of through holes, windows, openings or the like, are formed on substrate 110 between a first surface 110a and a second surface 110b opposite to first surface 110a, prior to formation of contact pad modules 120. Each contact pad module 120 includes contact pads 130 in the form of a thin electrically conductive layer made of, e.g. copper, attached to first surface 110a, and covers apertures 112. Apertures 112 therefore form passages between contact pads 130 and second surface 110b.

As shown in Figs. 3 and 4, after apertures 112 are formed and with contact pads 130 attached to substrate 110, substrate 110 is trimmed along edges 114 and 116 at predetermined locations, to form an array of module bodies 102 which are connected to each other by carrier rails 104. In the present embodiment, each module body 102 is sized and shaped to conform to SIM card industry standard, e.g. each module has a

predetermined profile of a 25 mm x 15 mm rectangle shape with an orientation chamfer formed at one corner. Such a SIM card is suitable for use in e.g. a mobile phone.

In a subsequent process as shown in Figs. 5, 6 and 7 according to one embodiment of the present invention, an IC chip 200 is bonded to second surface 110b of substrate 110, with conductive wires 212 passing through apertures 112 and connected to contact pads 130. Thereafter, IC chip 200 is covered by an encapsulant 300 for the purpose of protecting both the chip body and conductive wires 212. A molding process is then carried out to cover the encapsulated IC chip and flatten the bottom side with molding material 400, and form the SIM card 100 having a profile / overall dimension and a thickness 106 conforming to the SIM card standard. One would appreciate that SIM card modules can be formed without a bigger carrier card as is the case of conventional SIM card. Manufacturing process becomes better organized with higher productivity and low cost. Manufacturing material usage is not efficient. Further, operations and costs associated with carrier card disposal can be eliminated. According to another embodiment as shown in Figs. 8 and 9, an array of card module bodies 102 are provided by forming contact pads 130 onto substrate 110.

Thereafter, the substrates are trimmed to a substrate profile / external dimension according to SIM card standard, e.g. a 25 mm x 15 mm rectangle shape with an orientation chamfer formed at one corner as previously described. An array of spacer modules 502 are provided and trimmed to the same profile, dimension and shape as the card module body 102. Spacer module 502 is made of a thin sheet of dielectric material such as PVC or BMC (bulked molding compound). Each spacer module has an aperture or recess 504. Spacer modules 502 are laminated to second surface 110b of substrate 110, with each recess 504 positioned surrounding a corresponding aperture 112 underneath respective contact pads 130. Recess 504 therefore provides an appropriate space for receiving an IC chip which is to be bond to substrate 110.

Alternatively, as shown in Figs. 10, 11 and 12, contact modules 120 are formed on substrate 110. A spacer layer 512 with recesses 514 formed thereon is laminated to substrate 110. Each recess 514 is positioned in alignment with a respective contact module 120 and surrounding apertures 112. Thereafter, the laminated substrate and spacer layer is trimmed to form module body 102 with a profile, shape and dimension

conforming to SIM card standard, e.g. a 25 mm x 15 mm rectangle shape with an orientation chamfer formed at one corner as previously described. It should be

appreciated that according to this embodiment, only one trimming process is required to form the module body, comparing to the previous embodiment in which separate trimming processes are carried out to separately form each of the substrate and the spacer module.

Following the formation of the spacer module based on the above processes, as shown in Figs. 13, 14 and 15, an IC chip 200 is positioned inside recess 504 (514) and bonded to second side 110b of substrate 110. Recess 504 (514) is then filled, e.g. with molding compound 600 to form a SIM card 700. The thickness 706 of SIM card 700 is determined by the laminated substrate 100 and spacer module 502 which conforms to the SIM card standard.

Claims

1. A method for manufacturing a Subscriber Identity Module (SIM) card, the method comprising:
forming conductive modules on a first surface of a substrate;
trimming the substrate surrounding the conductive modules to a predetermined substrate profile;
attaching IC chips onto a second surface of the substrate;
connecting each conductive module with a corresponding IC chip with electrically conductive wires; and
covering the IC chip.
2. The method of claim 1 further comprising, after trimming the substrate and before attaching the IC chip onto the substrate, attaching a spacer layer onto the second surface of the substrate, wherein the spacer layer having a spacer layer profile the same as the substrate profile and having an array of recesses each for receiving a corresponding IC chip.
3. The method of claim 2 further comprising, after connecting the conductive
modules to the IC chips, filling the recess with a molding material.
4. The method of claim 1 further comprising, after forming the conductive modules on the substrate and before trimming the substrate, attaching a spacer layer onto the second substrate of the substrate, wherein trimming the substrate trims the spacer layer at the same time, and wherein the spacer layer having a plurality of recesses each for receiving a corresponding IC chip.
5. The method of claim 4 further comprising, after connecting the conductive
modules to the IC chips, filling the recess with a molding material.
6. The method of claim 1, wherein covering the IC chip comprising encapsulating the IC chip and the electrically conductive wires.
7. A Subscriber Identity Module (SIM) card comprising:
a substrate having a first surface and a second surface opposite the first surface; a conductive module attached to the first surface of the substrate;
5 an IC chip attached to the second surface of the substrate;
electrically conductive wires connecting the conductive module and the IC chip; and
an encapusulant covering the IC chip and the electrically conductive wires at the second surface of the substrate;
0
8. The SIM card module of claim 7, further comprising a molding material covering the encapsulant.
9. A Subscriber Identity Module (SIM) card comprising:
5 a substrate having a predetermined substrate profile, a first surface and a
second surface opposite the first surface;
a conductive module attached to the first surface of the substrate;
a spacer layer attached to the second surface of the substrate, wherein the
spacer having a spacer layer profile the same as the substrate profile and a o recess positioned superimposing the conductive module;
an IC chip attached to the second surface of the substrate and positioned in the recess;
electrically conductive wires connecting the conductive module and the IC chip.
5
10. The SIM card module of claim 9, further comprising a molding material filled in the recess covering the IC chip and the electrically conductive wires..
EP11837644.1A 2010-11-02 2011-10-04 Sim card and manufacturing method Withdrawn EP2636001A4 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
MYPI2010005182 2010-11-02
PCT/IB2011/002825 WO2012059813A2 (en) 2010-11-02 2011-10-04 Sim card and manufacturing method

Publications (2)

Publication Number Publication Date
EP2636001A2 true EP2636001A2 (en) 2013-09-11
EP2636001A4 EP2636001A4 (en) 2014-09-03

Family

ID=46024888

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11837644.1A Withdrawn EP2636001A4 (en) 2010-11-02 2011-10-04 Sim card and manufacturing method

Country Status (3)

Country Link
EP (1) EP2636001A4 (en)
TW (1) TW201229916A (en)
WO (1) WO2012059813A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494861B (en) * 2013-04-12 2015-08-01 A Men Technology Corp

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1785916A1 (en) * 2005-11-14 2007-05-16 Tyco Electronics France SAS Smartcard body, smart card and method of manufacturing
WO2008081224A1 (en) * 2006-12-28 2008-07-10 Fci Flat substrates for identification cards and manufacturing methods of the same
DE102008005320A1 (en) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh A card-shaped data carrier

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922355A (en) * 1982-07-29 1984-02-04 Dainippon Printing Co Ltd Integrated circuit card
JP2005149360A (en) * 2003-11-19 2005-06-09 Dainippon Printing Co Ltd Ic card for sim
CN101228539A (en) * 2004-06-30 2008-07-23 Nxp股份有限公司 Chip card for insertion into a holder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1785916A1 (en) * 2005-11-14 2007-05-16 Tyco Electronics France SAS Smartcard body, smart card and method of manufacturing
WO2008081224A1 (en) * 2006-12-28 2008-07-10 Fci Flat substrates for identification cards and manufacturing methods of the same
DE102008005320A1 (en) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh A card-shaped data carrier

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012059813A2 *

Also Published As

Publication number Publication date
TW201229916A (en) 2012-07-16
EP2636001A4 (en) 2014-09-03
WO2012059813A3 (en) 2012-07-19
WO2012059813A9 (en) 2012-11-15
WO2012059813A2 (en) 2012-05-10

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