EP2619349A4 - Non-permeable substrate carrier for electroplating - Google Patents

Non-permeable substrate carrier for electroplating

Info

Publication number
EP2619349A4
EP2619349A4 EP11827131.1A EP11827131A EP2619349A4 EP 2619349 A4 EP2619349 A4 EP 2619349A4 EP 11827131 A EP11827131 A EP 11827131A EP 2619349 A4 EP2619349 A4 EP 2619349A4
Authority
EP
European Patent Office
Prior art keywords
electroplating
substrate carrier
permeable substrate
permeable
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11827131.1A
Other languages
German (de)
French (fr)
Other versions
EP2619349A1 (en
EP2619349B1 (en
Inventor
Emmanuel Chua Abas
Chen-An Chen
Diana Xiaobing Ma
Kalyana Bhargava Ganti
Edmundo Anida Divino
Jake Randal G Ermita
José Francisco S Capulong
Arnold Villamor Castillo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunPower Corp
Original Assignee
SunPower Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/889,219 external-priority patent/US8317987B2/en
Priority claimed from US12/889,228 external-priority patent/US8221600B2/en
Priority claimed from US12/889,232 external-priority patent/US8221601B2/en
Application filed by SunPower Corp filed Critical SunPower Corp
Priority to EP16197330.0A priority Critical patent/EP3150748B1/en
Publication of EP2619349A1 publication Critical patent/EP2619349A1/en
Publication of EP2619349A4 publication Critical patent/EP2619349A4/en
Application granted granted Critical
Publication of EP2619349B1 publication Critical patent/EP2619349B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP11827131.1A 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating Active EP2619349B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16197330.0A EP3150748B1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/889,219 US8317987B2 (en) 2010-09-23 2010-09-23 Non-permeable substrate carrier for electroplating
US12/889,228 US8221600B2 (en) 2010-09-23 2010-09-23 Sealed substrate carrier for electroplating
US12/889,232 US8221601B2 (en) 2010-09-23 2010-09-23 Maintainable substrate carrier for electroplating
PCT/US2011/043571 WO2012039816A1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP16197330.0A Division EP3150748B1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Publications (3)

Publication Number Publication Date
EP2619349A1 EP2619349A1 (en) 2013-07-31
EP2619349A4 true EP2619349A4 (en) 2016-01-27
EP2619349B1 EP2619349B1 (en) 2016-11-09

Family

ID=45874099

Family Applications (2)

Application Number Title Priority Date Filing Date
EP11827131.1A Active EP2619349B1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating
EP16197330.0A Active EP3150748B1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP16197330.0A Active EP3150748B1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Country Status (6)

Country Link
EP (2) EP2619349B1 (en)
JP (2) JP5792820B2 (en)
KR (2) KR101828394B1 (en)
CN (2) CN203307439U (en)
ES (1) ES2605805T3 (en)
WO (3) WO2012039818A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US20050061665A1 (en) * 2003-08-06 2005-03-24 Sunpower Corporation Substrate carrier for electroplating solar cells
DE102005039100A1 (en) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Device for holding or holding a plurality of substrates and electroplating device
US20070151599A1 (en) * 2005-12-30 2007-07-05 Sunpower Corporation Solar cell having polymer heterojunction contacts
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US6261433B1 (en) * 1998-04-21 2001-07-17 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
JP2001234397A (en) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd Electroplating jig
JP3413185B2 (en) * 2000-11-15 2003-06-03 古河電気工業株式会社 Jig for plating
US7930006B2 (en) * 2004-09-08 2011-04-19 Belkin International, Inc. Holder, electrical supply, and RF transmitter unit for electronic devices
EP1717351A1 (en) * 2005-04-27 2006-11-02 Enthone Inc. Galvanic bath
WO2009042669A1 (en) * 2007-09-24 2009-04-02 Chemical Specialties Manufacturing Corp. Cleaning device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US20050061665A1 (en) * 2003-08-06 2005-03-24 Sunpower Corporation Substrate carrier for electroplating solar cells
DE102005039100A1 (en) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Device for holding or holding a plurality of substrates and electroplating device
US20070151599A1 (en) * 2005-12-30 2007-07-05 Sunpower Corporation Solar cell having polymer heterojunction contacts
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012039816A1 *

Also Published As

Publication number Publication date
EP2619349A1 (en) 2013-07-31
CN203307439U (en) 2013-11-27
JP2013537941A (en) 2013-10-07
ES2605805T3 (en) 2017-03-16
WO2012039817A3 (en) 2014-03-20
KR20170091755A (en) 2017-08-09
WO2012039817A2 (en) 2012-03-29
KR101828394B1 (en) 2018-02-12
JP2016014192A (en) 2016-01-28
WO2012039816A1 (en) 2012-03-29
EP3150748A1 (en) 2017-04-05
EP2619349B1 (en) 2016-11-09
JP5792820B2 (en) 2015-10-14
CN203795007U (en) 2014-08-27
EP3150748B1 (en) 2018-05-09
KR101764275B1 (en) 2017-08-03
JP6080320B2 (en) 2017-02-15
WO2012039818A1 (en) 2012-03-29
KR20130121704A (en) 2013-11-06

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