EP2606329B1 - Sensormodul zur aufnahme eines drucksensorchips und zur montage in einem sensorgehäuse - Google Patents
Sensormodul zur aufnahme eines drucksensorchips und zur montage in einem sensorgehäuse Download PDFInfo
- Publication number
- EP2606329B1 EP2606329B1 EP11739032.8A EP11739032A EP2606329B1 EP 2606329 B1 EP2606329 B1 EP 2606329B1 EP 11739032 A EP11739032 A EP 11739032A EP 2606329 B1 EP2606329 B1 EP 2606329B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- module
- sensor
- connection elements
- sensor module
- sensor housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 18
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000007423 decrease Effects 0.000 claims 1
- 238000005266 casting Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000009530 blood pressure measurement Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010016807 Fluid retention Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Definitions
- the subject matter of the present invention is furthermore a system comprising such a sensor module and at least two sensor housings.
- a sensor module which is mountable in a sensor housing.
- the sensor housing has two separate internal spaces and is provided with electrical conductors embedded therein.
- One of the interiors is provided with at least one capacitor, wherein the sensor module is arranged in the other interior.
- a functioning as a semiconductor pressure transducer silicon chip is mounted, are arranged on the pressure-sensitive elements.
- the sensor module is an open-top, box-shaped shell, which is formed from a bottom and a wall surrounding the sensor chip.
- a sensor module in which the module base and the module wall are monolithically cast and in the outer region between the connection elements is also casting material.
- connection elements there is in the outer region, over at least 80% of the length of the connection elements in the outer region, between the connection elements casting material. This leads to a further improvement of the advantages mentioned in the previous paragraph.
- connection elements in the outer region, over the entire length of the connection elements in the outer region, there is casting material between the connection elements.
- a system with such a sensor module and at least two sensor housings is provided, the at least two sensor housings having a recess on their inside, wherein the outwardly facing side of the module base is geometrically adapted to the recess of the one sensor housing, and the in the opposite direction facing region of the module wall is geometrically adapted to the recess of the other sensor housing.
- FIGS. 1a to 1d show sectional views through the center of the opening explained below in the bottom of the sensor module and parallel to the longitudinal direction of the connecting elements.
- FIG. 1a shows a first embodiment of the sensor module 101 in a Saugrohrdruck sensor housing 102. It is a pressure sensor that measures a Saugrohr absolute pressure in internal combustion engines.
- the sensor module 101 is a box-shaped shell with a square module bottom 103.
- a pressure sensor chip 104 is mounted on the inwardly facing side of the module base 103 on the inwardly facing side of the module base 103 on the inwardly facing side of the module base 103.
- the pressure sensor chip 104 is preferably a porous silicon chip.
- a module wall 105 which extends monolithically and surrounds the pressure sensor chip 104 extends.
- the sensor module 101 is designed as a shell open on one side with a square base surface.
- Side surfaces 109 of the sensor module 101 are inclined with respect to a normal to the module bottom 103 (ie the vertical in FIG Fig. 1a ) is formed so that the circumference of the sensor module 101 within a plane parallel to the module bottom 103, starting from the bottom of the module 103 initially increased and then reduced.
- In the region of the largest circumference connecting elements 106 are provided, which extend from the hollow interior of the sensor module 101 through the module wall 105 to the outside.
- the connecting elements 106 run straight (without bending and without kinks), preferably parallel to the module bottom 103.
- the connecting elements are made of electrically conductive material, such as copper.
- the inside end The connecting elements 106 leads to the inner cavity of the sensor module 101 and is exposed in the region of the interior floor.
- the pressure sensor chip 104 is connected by means of bonding wires 107 either directly or via an ASIC chip (not shown) to the connection elements 106. After making this connection, the interior of the sensor module 101 is at least partially filled with gel 108, so that the bonding wires 107 and the pressure sensor chip 104 are embedded in the gel.
- the sensor housing 102 is provided with a recess 110, which is adapted to the shape of the sensor module 101, in the region of the module bottom 103 facing away from the side.
- the depression 110 has a depth which corresponds to the distance from the connection elements 106 to the side facing away from the module bottom 103 (along the normal).
- the inclination of the side flanks of the recess 110 corresponds to that of the located in the recess 110 (in the inserted state) side surfaces 109 of the sensor module 101.
- the bottom surface of the recess 110 corresponds in terms of area and shape in about the module bottom 103 side facing away. In the center of the bottom of the recess 110 opens a measuring channel 111 in which the pressure to be measured prevails.
- the sensor module 101 is inserted with the open side to the recess (to the bottom of the recess) turned into the recess.
- the cross section of the measuring channel (ie perpendicular to its longitudinal direction) corresponds approximately to the cross section of the open interior of the sensor module 101, so that the interior of the sensor module 101 is flush with the measuring channel 111 in the inserted state of the sensor module 101.
- the voltage applied to the inside of the recess 110 surface of the sensor module 101 forms an adhesive surface, which is glued with an adhesive 112, preferably silicone adhesive in the recess.
- capacitors 113 are applied as preferred electrical components, wherein a connection of the capacitor 113 is electrically connected to a connection element and the other terminal of the same capacitor 113 is electrically connected to an adjacent connection element 106.
- the connection elements 106 are electrically connected to the sensor housing side, electrical contacts 115 and thus electrically integrated into the sensor housing 102.
- These housing-side, electrical contacts 115 are continued in the sensor housing 102 to other electronic elements or sensor housing external elements.
- FIG. 1b shows the first embodiment of the sensor module 101 in an absolute pressure sensor housing with cap chip (sensor element with reference vacuum under a cap and effective pressure from below).
- the sensor module 101 with reversed orientation, ie with its open side of a recess 116 of a sensor housing 117 facing away inserted into the recess.
- the sensor housing 117 differs from the sensor housing 102 in that the depression is adapted to the shape of the sensor module 101, in the region of the module base 103.
- the depression 116 has a depth which corresponds to the distance (along the normal to the module bottom) from the connection elements 106 to the outside of the module base 103.
- FIG. 1a includes the sensor module 101 in FIG. 1b an opening 118, which opens in the sensor chip mounting area in the interior of the sensor module 101.
- the sensor modules 101 correspond FIGS. 1a and 1b each other so that the same mold can be used for both.
- the sensor module is made of plastic.
- FIG. 1a be closed with a stick or with adhesive.
- FIG. 1b is on the pressure sensor chip 104 (ie, on the side facing away from the opening 118 of the chip) applied to a cap 119 with a reference vacuum.
- a pressure prevailing in the measurement channel can be applied to the pressure sensor chip 104 via the opening 118 and measured.
- the advantage of this measurement via the opening 118 is that the fluid to be measured can be completely separated from the electronics in the interior of the sensor housing 117 and the electrical contacts 106, 114, 115 therein.
- the capacitors 113 are also applied on the side facing away from the adhesive surface of the connecting elements 106 on this and electrically connected thereto.
- Figure 1c shows the first embodiment of the sensor module in a brake booster sensor housing.
- the orientation is the same as in FIG. 1a described.
- opening 118 is provided in the sensor module 101 in Figure 1c in the FIG. 1b described opening 118 is provided.
- the atmospheric pressure can be conducted via a housing opening 121 of the sensor housing 102 into an inner space 120 of the sensor housing 102 surrounding the module bottom 103.
- a corresponding pressure sensor chip 122 is provided for differential pressure measurement.
- FIG. 2 shows a three-dimensional representation of the sensor module 101 according to the first embodiment of the invention.
- the capacitors 113 applied to the connection elements 106 are easily recognizable.
- the module bottom 103 there are two slots 125, which arise due to the production.
- the slots 125 serve to receive potting compound to hold and protect an underlying conductor comb.
- FIG. 4 shows a three-dimensional representation of a sensor module 201 according to a second embodiment of the invention.
- the above description of the sensor module 101 applies and only the differences will be described.
- ASIC application-specific integrated circuit
- the ASIC chip 226, in turn, is connected to the connection elements 206, which correspond to the connection elements 106 described above, with bonding wires 207.
- capacitors 213 are placed, as described in connection with the capacitors 113.
- the second embodiment differs essentially from the first embodiment of the invention in that the connecting elements 206 are largely encapsulated with the same casting material as the module bottom and the module wall, that is formed monolithically with the module bottom and the module wall. More precisely, this means that casting dimensions are present between the connection elements 206 and only an outwardly directed end region of the connection elements 206 over a length (in the longitudinal direction of the connection elements 206) of 0.5 to 2 mm is not surrounded by casting material. Over a subsequent further inner region with a length of 0.5 to 2 mm casting material is provided between the connecting elements 206, but exposed the top and bottom. In this area, the casting material located between the connection elements 206 has the same height as in the subsequent area in which the connection elements are completely surrounded.
- FIG. 5 shows a three-dimensional representation of a sensor housing 202 with built-sensor module 201 according to the second embodiment of the invention.
- the description of the sensor housing 102 applies.
- FIG. 5 shows the sensor module 201 in the installed position, in which the open side of the sensor module 201 in the recess of the sensor housing 202 shows.
- the connecting elements 206 are connected via the described bonding wires 214 with the housing-side, electrical contacts 227.
- FIG. 6 shows a three-dimensional representation of a sensor housing 217 with built-sensor module 201 according to the second embodiment of the invention.
- the description of the sensor housing 117 applies.
- FIG. 6 shows the sensor module 201 in the installed position, in which the open side of the sensor module 201 facing away from the recess of the sensor housing 217.
- the connecting elements 206 are connected via the described bonding wires 214 with the housing-side, electrical contacts 227.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201010039599 DE102010039599A1 (de) | 2010-08-20 | 2010-08-20 | Sensormodul zur Aufnahme eines Drucksensorchips und zur Montage in einem Sensorgehäuse |
PCT/EP2011/062423 WO2012022572A1 (de) | 2010-08-20 | 2011-07-20 | Sensormodul zur aufnahme eines drucksensorchips und zur montage in einem sensorgehäuse |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2606329A1 EP2606329A1 (de) | 2013-06-26 |
EP2606329B1 true EP2606329B1 (de) | 2018-09-12 |
Family
ID=44629542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11739032.8A Active EP2606329B1 (de) | 2010-08-20 | 2011-07-20 | Sensormodul zur aufnahme eines drucksensorchips und zur montage in einem sensorgehäuse |
Country Status (6)
Country | Link |
---|---|
US (1) | US9006847B2 (zh) |
EP (1) | EP2606329B1 (zh) |
JP (1) | JP2013534320A (zh) |
CN (1) | CN103052871B (zh) |
DE (1) | DE102010039599A1 (zh) |
WO (1) | WO2012022572A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014118769B4 (de) | 2014-12-16 | 2017-11-23 | Infineon Technologies Ag | Drucksensor-Modul mit einem Sensor-Chip und passiven Bauelementen innerhalb eines gemeinsamen Gehäuses |
DE102016003658A1 (de) | 2016-03-30 | 2017-10-05 | Hella Kgaa Hueck & Co. | Elektronikbauteil mit einem Bauteilgehäuse |
DE102016003657A1 (de) | 2016-03-30 | 2017-10-05 | Hella Kgaa Hueck & Co. | Vorrichtung zum Messen eines Füllstands einer Flüssigkeit |
US10281314B2 (en) | 2016-03-30 | 2019-05-07 | Hella Kgaa Hueck & Co. | Device for measuring a fill level of a liquid |
JP6471118B2 (ja) * | 2016-05-24 | 2019-02-13 | 日本電産トーソク株式会社 | 圧力検出装置、および圧力検出装置を格納した電動油圧ポンプ |
DE102017209650A1 (de) * | 2017-06-08 | 2018-12-13 | Robert Bosch Gmbh | Mikromechanische Drucksensoranordnung und Verfahren zum Herstellen einer mikromechanischen Drucksensoranordnung |
US10890502B2 (en) * | 2017-09-08 | 2021-01-12 | Fuji Electric Co., Ltd. | Pressure sensor device |
DE102017219986A1 (de) | 2017-11-09 | 2019-05-09 | Robert Bosch Gmbh | Drucksensormodul und Drucksensorvorrichtung mit einem Drucksensormodul |
NL2020901B1 (en) * | 2018-05-09 | 2019-11-18 | Sencio B V | A sensor package and a method of manufacturing a sensor package |
DE102018220542A1 (de) * | 2018-11-29 | 2020-06-04 | Robert Bosch Gmbh | Tankvorrichtung zur Speicherung von verdichteten Fluiden mit einer Sensormodulanordnung |
DE102022206883A1 (de) * | 2022-07-06 | 2024-01-11 | Robert Bosch Gesellschaft mit beschränkter Haftung | Sensorvorrichtung mit einem auf einer Leiterplatte angeordneten Drucksensor und einem Gehäuse sowie eine Baugruppe mit solch einer Sensorvorrichtung sowie ein Verfahren zur Herstellung solch einer Sensorvorrichtung |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245377A (ja) * | 1994-03-07 | 1995-09-19 | Omron Corp | 電子部品及びその製造方法 |
US5859759A (en) * | 1996-10-02 | 1999-01-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor module |
JP2004165525A (ja) * | 2002-11-15 | 2004-06-10 | Sony Corp | 半導体装置及びその製造方法 |
US20060213276A1 (en) * | 2004-08-26 | 2006-09-28 | Fuji Electric Device Technology Co., Ltd. | Pressure sensor device and pressure sensor cell thereof |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5915944A (ja) | 1982-07-20 | 1984-01-27 | Hitachi Metals Ltd | ヒ−トロ−ル定着用磁性トナ− |
JPS5915944U (ja) * | 1982-07-21 | 1984-01-31 | 株式会社日立製作所 | 差圧検出器 |
JPS61222273A (ja) | 1985-03-28 | 1986-10-02 | Toshiba Corp | 半導体圧力変換器 |
JP2794972B2 (ja) | 1991-03-12 | 1998-09-10 | イビデン株式会社 | リードレスチップキャリア |
JP2639232B2 (ja) | 1991-03-25 | 1997-08-06 | 三菱電機株式会社 | 中空型樹脂封止半導体圧力センサ |
DE19703206C2 (de) | 1997-01-29 | 2002-01-24 | Infineon Technologies Ag | Drucksensor-Bauteil mit Schlauchanschluß |
EP1096241A1 (en) | 1999-11-01 | 2001-05-02 | Delphi Technologies, Inc. | Integrated pressure and temperature sensor for high pressure fluid |
JP3752444B2 (ja) | 2001-11-16 | 2006-03-08 | 株式会社日立製作所 | 圧力検出装置 |
US7024947B2 (en) * | 2002-03-07 | 2006-04-11 | Alps Electric Co., Ltd. | Detection device including circuit component |
JP3901005B2 (ja) | 2002-04-25 | 2007-04-04 | 富士電機デバイステクノロジー株式会社 | 半導体圧力センサ |
DE102004012593A1 (de) * | 2004-03-12 | 2005-09-29 | Robert Bosch Gmbh | Sensormodul |
JP4238779B2 (ja) | 2004-05-28 | 2009-03-18 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
JP4742706B2 (ja) | 2005-07-06 | 2011-08-10 | ヤマハ株式会社 | 半導体装置及びその製造方法 |
US7468556B2 (en) * | 2006-06-19 | 2008-12-23 | Lv Sensors, Inc. | Packaging of hybrid integrated circuits |
JP5010395B2 (ja) | 2007-08-24 | 2012-08-29 | パナソニック株式会社 | 圧力センサ |
DE102008005153A1 (de) * | 2008-01-18 | 2009-07-23 | Robert Bosch Gmbh | Druckmessmodul |
CN101498612B (zh) | 2009-03-13 | 2011-01-12 | 上海海华传感器有限公司 | 局部密封的压力温度传感器及其制造工艺 |
DE102010012042A1 (de) * | 2010-03-19 | 2011-09-22 | Epcos Ag | Bauelement mit einem Chip in einem Hohlraum und einer spannungsreduzierten Befestigung |
-
2010
- 2010-08-20 DE DE201010039599 patent/DE102010039599A1/de not_active Withdrawn
-
2011
- 2011-07-20 CN CN201180040181.5A patent/CN103052871B/zh active Active
- 2011-07-20 EP EP11739032.8A patent/EP2606329B1/de active Active
- 2011-07-20 JP JP2013524396A patent/JP2013534320A/ja active Pending
- 2011-07-20 WO PCT/EP2011/062423 patent/WO2012022572A1/de active Application Filing
- 2011-07-20 US US13/817,698 patent/US9006847B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07245377A (ja) * | 1994-03-07 | 1995-09-19 | Omron Corp | 電子部品及びその製造方法 |
US5859759A (en) * | 1996-10-02 | 1999-01-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor module |
JP2004165525A (ja) * | 2002-11-15 | 2004-06-10 | Sony Corp | 半導体装置及びその製造方法 |
US20060213276A1 (en) * | 2004-08-26 | 2006-09-28 | Fuji Electric Device Technology Co., Ltd. | Pressure sensor device and pressure sensor cell thereof |
Also Published As
Publication number | Publication date |
---|---|
DE102010039599A1 (de) | 2012-02-23 |
US9006847B2 (en) | 2015-04-14 |
CN103052871A (zh) | 2013-04-17 |
EP2606329A1 (de) | 2013-06-26 |
US20130221458A1 (en) | 2013-08-29 |
JP2013534320A (ja) | 2013-09-02 |
WO2012022572A1 (de) | 2012-02-23 |
CN103052871B (zh) | 2015-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2606329B1 (de) | Sensormodul zur aufnahme eines drucksensorchips und zur montage in einem sensorgehäuse | |
DE19936300B4 (de) | Druckerkennungsvorrichtung und Druckerkennungsvorrichtung-Anordnung hiermit | |
DE19703206C2 (de) | Drucksensor-Bauteil mit Schlauchanschluß | |
EP1728060B1 (de) | Sensormodul mit einem kondensator emv- und esd-schutz | |
DE69804254T2 (de) | Verkaselungspackung und verfahren zum verpacken von einem elektronisches schaltungsmodul | |
WO2009089956A1 (de) | Druckmessmodul | |
EP3144656A1 (de) | Drucksensorsystem | |
AT12838U1 (de) | Sensoradapterschaltungsgehäuseaufbau und verfahren zu dessen herstellung | |
DE102014118769B4 (de) | Drucksensor-Modul mit einem Sensor-Chip und passiven Bauelementen innerhalb eines gemeinsamen Gehäuses | |
DE102014219030B4 (de) | Steckermodul | |
DE102004026210B4 (de) | Vorrichtung zur Erfassung einer physikalischen Größe und Gehäuse für eine Anordnung zur Messung einer physikalischen Größe | |
DE102011053434A1 (de) | Bauteil zur Verwendung als doppelseitiges Sensorgehäuse | |
WO2011113770A1 (de) | Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug | |
EP2548424B1 (de) | Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug | |
DE102017207682A1 (de) | Elektronikmodul und Fertigungsverfahren | |
DE102004019428A1 (de) | Halbleiterbauteil mit einem Hohlraumgehäuse und Verfahren zur Herstellung desselben | |
EP2052409A2 (de) | Moldgehäuse in einpresstechnik | |
DE102011083576A1 (de) | Vorrichtung zur Außenkontaktierung eines Schaltungsmoduls, korrespondierendes Schaltungsmodul, Schaltungsanordnung und zugehöriges Verfahren zur Herstellung einer Schaltungsanordnung | |
DE102019126526A1 (de) | Drucksensor mit platine zu platine verbindung | |
DE102018207210A1 (de) | Sensoreinheit für ein Fahrzeug | |
DE10059813A1 (de) | Vorrichtung zur Erfassung eines Fluiddrucks | |
DE102013013960C5 (de) | Sensorgehäuse für einen kabelgebundenen Sensor und kabelgebundener Sensor | |
DE102013224119B4 (de) | Anordnung zum elektrischen Verbinden eines Schaltungsträgers | |
WO2009000611A2 (de) | Baugruppe mit einem asic und einem gehäuse für den asic | |
DE102017219986A1 (de) | Drucksensormodul und Drucksensorvorrichtung mit einem Drucksensormodul |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20130320 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20170914 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 502011014723 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: G01L0009000000 Ipc: G01L0019000000 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 29/84 20060101ALI20180411BHEP Ipc: G01L 19/06 20060101ALI20180411BHEP Ipc: G01L 19/00 20060101AFI20180411BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
INTG | Intention to grant announced |
Effective date: 20180523 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502011014723 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 1041182 Country of ref document: AT Kind code of ref document: T Effective date: 20181015 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20180912 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181212 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181213 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181212 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190112 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190112 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502011014723 Country of ref document: DE |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
26N | No opposition filed |
Effective date: 20190613 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20190720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20190731 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190720 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190731 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190720 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MM01 Ref document number: 1041182 Country of ref document: AT Kind code of ref document: T Effective date: 20190720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20110720 Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20180912 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20230724 Year of fee payment: 13 Ref country code: DE Payment date: 20230922 Year of fee payment: 13 |