EP2581932A4 - Verbundenes fördersystem - Google Patents

Verbundenes fördersystem

Info

Publication number
EP2581932A4
EP2581932A4 EP11792313.6A EP11792313A EP2581932A4 EP 2581932 A4 EP2581932 A4 EP 2581932A4 EP 11792313 A EP11792313 A EP 11792313A EP 2581932 A4 EP2581932 A4 EP 2581932A4
Authority
EP
European Patent Office
Prior art keywords
conveyance system
connected conveyance
conveyance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11792313.6A
Other languages
English (en)
French (fr)
Other versions
EP2581932A1 (de
EP2581932B1 (de
Inventor
Shiro Hara
Hitoshi Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Institute of Advanced Industrial Science and Technology AIST filed Critical National Institute of Advanced Industrial Science and Technology AIST
Publication of EP2581932A1 publication Critical patent/EP2581932A1/de
Publication of EP2581932A4 publication Critical patent/EP2581932A4/de
Application granted granted Critical
Publication of EP2581932B1 publication Critical patent/EP2581932B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B47/00—Cabinets, racks or shelf units, characterised by features related to dismountability or building-up from elements
    • A47B47/0091—Modular arrangements of similar assemblies of elements
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B81/00—Cabinets or racks specially adapted for other particular purposes, e.g. for storing guns or skis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D45/00—Clamping or other pressure-applying devices for securing or retaining closure members
    • B65D45/02—Clamping or other pressure-applying devices for securing or retaining closure members for applying axial pressure to engage closure with sealing surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/24—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes
    • B65D51/28—Closures not otherwise provided for combined or co-operating with auxiliary devices for non-closing purposes with auxiliary containers for additional articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2313/00—Connecting or fastening means
    • B65D2313/04—Connecting or fastening means of magnetic type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Closures For Containers (AREA)
  • Packaging Frangible Articles (AREA)
  • Non-Mechanical Conveyors (AREA)
EP11792313.6A 2010-06-08 2011-05-30 Verbundenes fördersystem Active EP2581932B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010131471A JP5516968B2 (ja) 2010-06-08 2010-06-08 連結搬送システム
PCT/JP2011/062332 WO2011155356A1 (ja) 2010-06-08 2011-05-30 連結搬送システム

Publications (3)

Publication Number Publication Date
EP2581932A1 EP2581932A1 (de) 2013-04-17
EP2581932A4 true EP2581932A4 (de) 2015-04-01
EP2581932B1 EP2581932B1 (de) 2019-10-09

Family

ID=45097964

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11792313.6A Active EP2581932B1 (de) 2010-06-08 2011-05-30 Verbundenes fördersystem

Country Status (8)

Country Link
US (2) US9016501B2 (de)
EP (1) EP2581932B1 (de)
JP (1) JP5516968B2 (de)
KR (2) KR101532822B1 (de)
CN (1) CN103038873B (de)
SG (1) SG186457A1 (de)
TW (1) TWI531021B (de)
WO (1) WO2011155356A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5794497B2 (ja) * 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム
JP6061269B2 (ja) * 2012-11-30 2017-01-18 国立研究開発法人産業技術総合研究所 搬送容器の開閉装置
US9016998B2 (en) * 2013-03-14 2015-04-28 Varian Semiconductor Equipment Associates, Inc. High throughput, low volume clamshell load lock
DE102013104030A1 (de) * 2013-04-22 2014-10-23 Aixtron Se Transportmodul für eine Halbleiterfertigungseinrichtung
CN103299916A (zh) * 2013-06-20 2013-09-18 苏州大学 隔离器的封闭传递装置
TWI629744B (zh) * 2013-11-11 2018-07-11 昕芙旎雅股份有限公司 Surrounding gas replacement device, substrate transfer device, substrate transfer system, and EFEM
US10240350B2 (en) 2013-12-03 2019-03-26 National Institute Of Advanced Industrial Science And Technology Free access floor structure, and manufacturing apparatus and carrier apparatus adapted for floor structure
JP6253089B2 (ja) * 2013-12-10 2017-12-27 株式会社ディスコ 研削装置
JP6020511B2 (ja) * 2014-05-08 2016-11-02 トヨタ自動車株式会社 ウエハキャリア
US10883168B2 (en) 2014-09-11 2021-01-05 Massachusetts Institute Of Technology Processing system for small substrates
JP6434050B2 (ja) * 2014-11-27 2018-12-05 国立研究開発法人産業技術総合研究所 前工程−後工程一体化システム
FR3030006B1 (fr) * 2014-12-12 2017-06-16 Commissariat Energie Atomique Ensemble de transfert
CN107636243A (zh) * 2015-05-22 2018-01-26 应用材料公司 包括磁性门密封件的基板载体门组件、基板载体和方法
FI127190B (en) * 2016-06-06 2018-01-15 Iot Instr Oy A method for administering a user medication
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane
TW201912537A (zh) * 2017-09-07 2019-04-01 張璞稜 物料置放裝置
JP7054107B2 (ja) 2017-11-30 2022-04-13 国立研究開発法人産業技術総合研究所 搬送容器オートクランプ機構
JP6975373B2 (ja) * 2017-12-27 2021-12-01 澁谷工業株式会社 無菌作業システム
EP3553814A1 (de) 2018-04-10 2019-10-16 VAT Holding AG Positioniervorrichtung, be- und/oder entladesystem und verfahren zum betrieb einer positioniervorrichtung
USD921297S1 (en) * 2018-08-21 2021-06-01 Dimitrios Papadopoulos Wall-mountable back scrubbing pad assembly
US11469124B2 (en) 2019-03-05 2022-10-11 Applied Materials, Inc. Contactless latch and coupling for vacuum wafer transfer cassette
TWI779844B (zh) * 2021-09-23 2022-10-01 捷拓科技股份有限公司 取置治具
CN114684556B (zh) * 2022-03-02 2024-05-31 中国核电工程有限公司 垂直密封转运装置
JP2024072578A (ja) * 2022-11-16 2024-05-28 株式会社デザインネットワーク 搬送容器受渡し受取り装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6152669A (en) * 1995-11-13 2000-11-28 Shinko Electric Co., Ltd. Mechanical interface apparatus
JP2004140278A (ja) * 2002-10-21 2004-05-13 Ulvac Japan Ltd 移動式収納装置及び基板搬入装置
US20070201967A1 (en) * 2005-11-07 2007-08-30 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US4674939A (en) 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
US4724874A (en) 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5169272A (en) 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
JP3163675B2 (ja) * 1991-09-20 2001-05-08 神鋼電機株式会社 機械式インターフェース装置
JPH0582623A (ja) 1991-09-20 1993-04-02 Shinko Electric Co Ltd 機械式インターフエース装置
JPH05109863A (ja) 1991-10-17 1993-04-30 Shinko Electric Co Ltd 機械式インターフエース装置
JPH05109864A (ja) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd 機械式インターフエース装置
JPH0637175A (ja) 1992-05-19 1994-02-10 Ebara Corp 保管箱のキャップ開閉装置
US5451131A (en) * 1992-06-19 1995-09-19 International Business Machines Corporation Dockable interface airlock between process enclosure and interprocess transfer container
US5343181A (en) * 1993-01-07 1994-08-30 Lisle Corporation Magnetic socket holder
CN2151354Y (zh) * 1993-02-11 1993-12-29 沈国林 检修工作灯
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP2850279B2 (ja) 1994-02-22 1999-01-27 ティーディーケイ株式会社 クリーン搬送方法及び装置
JPH08172120A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd 半導体装置の製造方法および搬送インターフェース装置
ES2229247T3 (es) 1995-03-28 2005-04-16 Brooks Automation Gmbh Estacion de carga y descarga para instalaciones de tratamiento de semiconductores.
DE69836425T2 (de) * 1998-04-06 2007-09-27 Dainichi Shoji K.K. Behälter
JP2000216175A (ja) 1999-01-26 2000-08-04 Sony Corp 密閉コンテナ及び雰囲気置換装置並びにこれらの製造方法
US6753945B2 (en) * 2002-03-01 2004-06-22 Asml Netherlands B.V. Transfer method for a mask or substrate, storage box, apparatus adapted for use in such method, and device manufacturing method including such a transfer method
JP2004039986A (ja) 2002-07-05 2004-02-05 Tokyo Seimitsu Co Ltd 露光マスク収容器、露光マスク入出力機構及び収容器内気圧調整装置
JP2006303246A (ja) * 2005-04-21 2006-11-02 Miraial Kk 枚葉収納容器
US7607430B2 (en) * 2007-04-18 2009-10-27 Hana Consulting, Inc. Magnetically coupled humidifier container components
CN201381160Y (zh) * 2009-02-16 2010-01-13 任杰 永磁吸吊器
CN101544337A (zh) * 2009-04-14 2009-09-30 岳阳鸿升电磁科技有限公司 电控永磁吸盘
TWI365836B (en) * 2009-05-08 2012-06-11 Gudeng Prec Industral Co Ltd Wafer container with the magnetic latch
JP5794497B2 (ja) 2010-06-08 2015-10-14 国立研究開発法人産業技術総合研究所 連結システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6152669A (en) * 1995-11-13 2000-11-28 Shinko Electric Co., Ltd. Mechanical interface apparatus
JP2004140278A (ja) * 2002-10-21 2004-05-13 Ulvac Japan Ltd 移動式収納装置及び基板搬入装置
US20070201967A1 (en) * 2005-11-07 2007-08-30 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011155356A1 *

Also Published As

Publication number Publication date
US9016501B2 (en) 2015-04-28
EP2581932A1 (de) 2013-04-17
JP5516968B2 (ja) 2014-06-11
EP2581932B1 (de) 2019-10-09
SG186457A1 (en) 2013-01-30
TWI531021B (zh) 2016-04-21
CN103038873A (zh) 2013-04-10
CN103038873B (zh) 2017-11-10
TW201207985A (en) 2012-02-16
US20130162117A1 (en) 2013-06-27
WO2011155356A1 (ja) 2011-12-15
KR101617599B1 (ko) 2016-05-02
US10115619B2 (en) 2018-10-30
JP2011258722A (ja) 2011-12-22
KR101532822B1 (ko) 2015-06-30
KR20130045864A (ko) 2013-05-06
KR20150064231A (ko) 2015-06-10
US20150170948A1 (en) 2015-06-18

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