EP2489246A2 - Dispositif de protection contre les interférences électromagnétiques - Google Patents

Dispositif de protection contre les interférences électromagnétiques

Info

Publication number
EP2489246A2
EP2489246A2 EP10766268A EP10766268A EP2489246A2 EP 2489246 A2 EP2489246 A2 EP 2489246A2 EP 10766268 A EP10766268 A EP 10766268A EP 10766268 A EP10766268 A EP 10766268A EP 2489246 A2 EP2489246 A2 EP 2489246A2
Authority
EP
European Patent Office
Prior art keywords
circuit
structures
protection
protection device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10766268A
Other languages
German (de)
English (en)
Inventor
Christian Spratler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2489246A2 publication Critical patent/EP2489246A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander

Definitions

  • the invention relates to a protective device for reducing conducted interference, which has a protective circuit as an input filter of an electronic circuit, wherein the electronic circuit is mounted on or at least partially integrated in a multi-layer printed circuit board, wherein individual components of the circuit are implemented as embedded structures in the multi-layer printed circuit board ,
  • ESD electrostatic discharges
  • varistors, voltage-dependent resistors, or spark gaps which are arranged at the beginning of the Einkoppelpfades the circuit to be protected. These are usually expensive and sometimes have a lot of space.
  • SMD capacitors which are placed at the input of the circuit to be protected, which derive a portion of the coupling pulses to ground. The dimensioning of the capacitance is based on empirical values, which in practice often leads to a non-optimal design of the protective circuit.
  • a certain Degrations ie a reduction in capacity by repeated impulse loading and concomitant loss of Abblockrati observed.
  • a parasitic, serial inductance can cause a rapid outflow of the charge coupled to the pulse edge. prevent carrier, whereby the filter characteristics of the arrangement are deteriorated. In particular, high-frequency components of the pulse can still penetrate into the circuit to be protected.
  • an ESD protection device which has an input terminal and an output terminal, between which various protective filters are arranged.
  • embedded component structures are now known, in which the components are integrated on and inside the printed circuit board.
  • embedded capacitor structures can be formed.
  • Some ⁇ publications describe i.a. Such embedded capacitor structures (e.g., "AC coupled backplane communication using embedded capacitor”, Bruce Su et al or "Power Bus decoupling with embedded capacitance in printed circuit board design", Minjia Xu et al).
  • US Pat. No. 6,351,880 B1 describes a method for producing a capacitor element integrated in a multilayered substrate.
  • the above-mentioned disadvantages of conventional protective circuits should also be avoided.
  • the protective circuit is formed from a cascade of at least two capacitances which are coupled to one another with low-inductance conductor track structures, wherein the capacitances are formed as embedded capacitance structures on or within the multi-layer printed circuit board.
  • This arrangement is advantageous over discretely populated protective circuits, since hereby a better filter quality can be achieved, in particular at higher frequencies, so that Also high-frequency interference components beyond a frequency of 1 GHz can be blocked.
  • this is particularly possible because a particularly low-inductive coupling can be achieved by the execution of the capacitances as embedded components.
  • Another advantage over conventional protective circuits results from the fact that no degradation is recorded with multiple impulse loading.
  • the protection circuit is formed from three series-connected capacitances, the low-inductance conductor track structures each having a simulation-optimized line length. In this way, an optimum filter characteristic can be achieved in comparison to a large number of different types of interference pulse shapes. It is achieved a transmission frequency response, which is above a cut-off frequency in the two-digit MHz range to well within the range of several GHz well below -10 dB.
  • the filter structure of the input filter is formed from a surface-optimized arrangement of capacitive surface elements and interconnects.
  • the capacitor structures embedded in the multilayer printed circuit board for forming the capacitances in their layer construction can be formed from a first and a second electrode, each spaced apart by a dielectric, to a grounded one arranged between the electrodes Conductor layer are arranged isolated.
  • the aspired minimum space requirement can be achieved in particular if the dielectric between the electrodes and the grounded conductor layer is formed from a material with high dielectric values and high insulation strength and in each case has a layer thickness of less than 150 ⁇ m.
  • the use of such particularly thin layers allows comparatively large capacitance values.
  • ceramic-PTFE composite materials eg Ro3010 from Rogers Corp.
  • ⁇ ⁇ dielectric constant ⁇ ⁇ of about 10 and in particular in the HF range has very good material properties are suitable.
  • such a material has a good processability for the production of printed circuit boards.
  • the dimensioning of the filter structure of the protection circuit is advantageously formed by means of a network model, in which an input is an ideal transfer function for a transmission path, first by means of a standardized interference source, for example a man-made electrostatic discharge (eg according to the human body model HBM) to an interference sink, in this case, for example, to be protected MOS-FET circuit, the output side determined and in a next step, an analytically estimated filter structure is determined as a model of embedded capacitances by means of simulation.
  • a network model in which an input is an ideal transfer function for a transmission path, first by means of a standardized interference source, for example a man-made electrostatic discharge (eg according to the human body model HBM) to an interference sink, in this case, for example, to be protected MOS-FET circuit, the output side determined and in a next step, an analytically estimated filter structure is determined as a model of embedded capacitances by means of simulation.
  • a standardized interference source for example a man-made electrostatic
  • a particularly surface-optimized arrangement of the filter structure can be achieved if the dimensioning of the filter structure of the protective circuit is determined by a space-saving arrangement of the capacitance structures and by using a plurality of layers and a small layer thickness.
  • This optimized arrangement can be modified depending on the material used and the immunity of the circuit to be protected against the overcoupled portions, since the transfer function of the protection circuit by means of dimensional adaptation of capacity structures with respect to a Grenzfrequenzverschiebung and / or a bandwidth adjustment is adaptable, the dimensional adjustment by means of a length and / or width adjustment of individual capacitors and / or by scaling the side length of the entire filter structure is feasible.
  • a scaling of the side length of the filter structure to smaller side lengths, for example, causes an increase in the cutoff frequency and vice versa, with a reduction of the side length by a factor of 2 corresponds approximately to a doubling of the cutoff frequency.
  • certain band filter sections can be varied in the transfer function.
  • a preferred use of the protective device as described above provides for use in a motor vehicle for reducing electrostatic disturbances and / or damping of high-frequency interference components on sensor, control and / or data lines or drive trains in electric motor vehicles ,
  • problems with electrostatic disturbances can occur, which can be solved or at least significantly reduced with the use of the proposed protection device.
  • power electronics can be made more compact in terms of overall height and interference-proof by integration of such protection circuits.
  • FIG. 1 shows a plan view of a protective device with capacitance and induction structures
  • FIG. 2 shows a protective circuit corresponding to the protective device shown in FIG. 1,
  • FIG. 3 is a schematic representation of the structure of a multilayer printed circuit board with an embedded capacitor
  • Figure 4 is a transfer function of the protective device
  • Figure 5 and Figure 6 are each a schematic representation of the effect of dimensional adjustments of the protective device on the transfer function.
  • FIG. 1 shows a plan view of a protective device 1 with capacitance and induction structures 30, 20, which forms a protective circuit 40, wherein the capacitance structure 30 is shown as an embedded component in a printed circuit board according to the invention.
  • the capacitance structure 30 is shown as an embedded component in a printed circuit board according to the invention.
  • the conductor tracks form inductance structures 20.
  • corresponding counterelectrodes or shields and insulator or dielectric layers are located as additional layers not visible below and / or above the shown location.
  • a first capacitance 31 which, viewed directly in the signal direction, is arranged behind the input 41 of the protection circuit 40 and assumes a comparatively large value in accordance with the area of the structure.
  • This first capacitor 31 has two equal areas in the example shown.
  • This first capacitor 31 is coupled via a conductor meander, which is designed as a first inductor 21, with a likewise double-winged second capacitor 32.
  • the value of this capacitor 32 is correspondingly smaller than that of the first capacitor 31, corresponding to the surface of the electrodes 1 1, 12 in this filtering network.
  • the coupling of this second capacitance 32 with a third capacitance 33 likewise takes place via a conductor track structure which forms the second inductance 22.
  • This third capacitance is also once again smaller, corresponding to the area of its electrodes 1 1, 12, than the second capacitance 32.
  • a third inductance 23 in the form of a further conductor meander is provided at the output 42 of the protection circuit 40.
  • the layout of the protective device 1 or the protective circuit 40 is designed in such a way that the low-inductance conductor track structures each have a simulationsoptimier- te line length wherein the filter structure of this input filter is formed from a surface-optimized arrangement of the capacitive surface elements and the conductor tracks.
  • FIG. 2 shows a protective circuit 40 corresponding to the protective device 1 shown in FIG. 1 between the input 41 and the output 42 of the protective circuit 40.
  • the respective other electrodes of the three capacitors are grounded (earthing 16).
  • the interconnects form the low-inductance inductances 21, 22, 23. These can be very accurately predetermined by the layout of the protection device 1.
  • FIG. 3 shows by way of example a sectional view of a multilayer printed circuit board 10 in which a capacitor structure is embedded.
  • the multilayer printed circuit board 10 initially has an approximately 75 ⁇ m thick layer of FR4 substrate 14, which has an approximately 35 ⁇ m thick copper layer 13 on both sides.
  • the upper copper layer 13 is grounded (ground 16).
  • the lower copper layer forms the first electrode 1 1 of the capacitor structure.
  • From this first electrode 1 1 through a dielectric made of a ceramic-PTFE composite material 15th isolated eg Ro3010, 125 ⁇ thick
  • a dielectric layer of the ceramic-PTFE composite material 15 connects again, which isolates the copper layer 13 formed as a second electrode 12 from the grounded copper layer 13 in the middle of the multilayer printed circuit board 10.
  • the formed as a second electrode 12 copper layer 13 is part of a lower layer of FR4 substrate 14, which also has a double-sided copper layer 13 with 35 ⁇ layer thickness, wherein the lowest layer layer structure in the copper layer 13 is connected to the ground (ground 16).
  • FIG. 4 shows, by way of example, in a progression diagram, a transfer function 50 of the filter arrangement from FIG. 1 or the protection circuit 40 from FIG. 2.
  • Shown is a transmission frequency profile 51, in which an output signal intensity 52 is shown as a function of the frequency 53.
  • the output signal strength 52 is given in dB.
  • the scaling of the frequency 53 is also represented logarithmically.
  • a transmission frequency profile 51 is achieved, which runs well above -10 dB above a cutoff frequency of approximately 20 MHz into the range of approximately 10 GHz, which ensures broadband suppression of high-frequency interference pulses.
  • the quality of the filtering is significantly improved, in particular in the case of high-frequency frequency components.
  • FIGS. 5 and 6 show schematically how the transfer function 50 of the protective device 1 illustrated in FIG. 4 can be adapted by means of dimensional adaptation 60 of the capacitance structures with respect to a limit frequency shift 54 (FIG. 5) and / or a bandwidth adjustment 55 (FIG. 6).
  • a limit frequency shift 54 FIG. 5
  • a bandwidth adjustment 55 FIG. 6
  • FIG. 6 schematically shows that by means of a length and / or width adjustment 61, 62 of individual capacitor structures, the protective field Device 1 within the transfer function 50 make band adjustment 55 within individual frequency ranges.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Filters And Equalizers (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un dispositif de protection pour réduire des interférences de ligne, comportant un circuit de protection en tant que filtre d'entrée d'un circuit électronique, le circuit électronique étant appliqué sur une carte de circuit imprimé multicouche ou étant au moins partiellement intégré dans celle-ci, des composants individuels du circuit étant conçus comme structures intégrées dans la carte de circuit imprimé multicouche. Selon l'invention, le circuit de protection est constitué d'une cascade d'au moins deux condensateurs connectés l'un à l'autre au moyen de structures de pistes conductrices à faible inductance, les condensateurs étant conçus comme structures de condensateurs intégrées sur ou dans la carte de circuit imprimé multicouche. Ce dispositif de protection permet d'obtenir un comportement de filtrage amélioré notamment pour les fréquences élevées, par rapport à des filtres de protection équipés discrètement, ce qui améliore la protection contre les interférences électrostatiques. Par ailleurs, la structure de filtrage peut être très bien adaptée par simulation à la résistance aux interférences nécessaire du circuit à protéger d'une part, et le comportement de vieillissement peut être amélioré d'autre part.
EP10766268A 2009-10-14 2010-10-11 Dispositif de protection contre les interférences électromagnétiques Withdrawn EP2489246A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009045684A DE102009045684A1 (de) 2009-10-14 2009-10-14 Schutzvorrichtung gegen elektromagnetische Störungen
PCT/EP2010/065173 WO2011045264A2 (fr) 2009-10-14 2010-10-11 Dispositif de protection contre les interférences électromagnétiques

Publications (1)

Publication Number Publication Date
EP2489246A2 true EP2489246A2 (fr) 2012-08-22

Family

ID=43357948

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10766268A Withdrawn EP2489246A2 (fr) 2009-10-14 2010-10-11 Dispositif de protection contre les interférences électromagnétiques

Country Status (5)

Country Link
US (1) US20120262829A1 (fr)
EP (1) EP2489246A2 (fr)
CN (1) CN102550134A (fr)
DE (1) DE102009045684A1 (fr)
WO (1) WO2011045264A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9584964B2 (en) 2014-12-22 2017-02-28 Airwatch Llc Enforcement of proximity based policies

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6061228A (en) 1998-04-28 2000-05-09 Harris Corporation Multi-chip module having an integral capacitor element
JP3232562B2 (ja) * 1999-10-22 2001-11-26 日本電気株式会社 電磁干渉抑制部品および電磁干渉抑制回路
JP2005217043A (ja) 2004-01-28 2005-08-11 Toshiba Corp 静電破壊保護回路
US7810577B2 (en) * 2005-08-30 2010-10-12 Federal Express Corporation Fire sensor, fire detection system, fire suppression system, and combinations thereof
KR100955948B1 (ko) * 2007-12-21 2010-05-03 삼성전기주식회사 다중대역 송신단 모듈 및 이의 제조 방법
US7724117B2 (en) * 2008-01-11 2010-05-25 Northrop Grumman Systems Corporation Multilayer passive circuit topology

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2011045264A2 *

Also Published As

Publication number Publication date
CN102550134A (zh) 2012-07-04
WO2011045264A2 (fr) 2011-04-21
US20120262829A1 (en) 2012-10-18
WO2011045264A3 (fr) 2011-06-23
DE102009045684A1 (de) 2011-04-21

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