EP2405194A1 - Plateforme d'éclairage doté de diodes électroluminescentes - Google Patents

Plateforme d'éclairage doté de diodes électroluminescentes Download PDF

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Publication number
EP2405194A1
EP2405194A1 EP10006922A EP10006922A EP2405194A1 EP 2405194 A1 EP2405194 A1 EP 2405194A1 EP 10006922 A EP10006922 A EP 10006922A EP 10006922 A EP10006922 A EP 10006922A EP 2405194 A1 EP2405194 A1 EP 2405194A1
Authority
EP
European Patent Office
Prior art keywords
led illumination
heat
illumination platform
leds
dissipating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10006922A
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German (de)
English (en)
Inventor
Jen-Shyan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NeoBulb Technologies Inc
Original Assignee
NeoBulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NeoBulb Technologies Inc filed Critical NeoBulb Technologies Inc
Priority to EP10006922A priority Critical patent/EP2405194A1/fr
Publication of EP2405194A1 publication Critical patent/EP2405194A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light-emitting diode (LED) illumination platform, and more particularly, to a LED illumination platform having a fixed form factor, wherein the LED illumination platform can further comprise LEDs with various amounts and various luminous efficiencies.
  • LED light-emitting diode
  • a light-emitting diode which has several advantages such as power save, seismic resistance, quick reaction, and so on, becomes a new light source.
  • high-power LED has been used as the light source in many illumination products.
  • high-power LED can provide stronger light, it may also cause other problems related to heat dissipation. For example, if the heat generated by the LED cannot be dissipated in time, the LED will suffer from "heat shock" which may affect the luminous efficiency and reduce the work life of the LED.
  • the size of heat-dissipating component is usually relevant to the power of the corresponding LED. Therefore, when users want to replace low-power LEDs with high-power LEDs, it may have problems with engaging device for fixing the LEDs and the heat-dissipating component. For example, replacing the low-power LEDs with the high-power LEDs may very probably have interference problems; on the other hand, replacing the high-power LEDs with the low-power LEDs may not be firmly fixed where it should be.
  • a scope of the invention is to provide a light-emitting diode illumination platform has a fixed form factor with a plurality of LEDs, and the LEDs comprise several types of luminous efficiency for providing different scales of illumination.
  • the LED illumination platform when the LED illumination platform has a form factor and is powered by a driving current, the LED illumination platform generates light within the range of X ⁇ 10% lumens while driven by the drive current if the LED illumination platform comprises n units of first LEDs and the LED illumination platform generates light within the range of Y ⁇ 10% lumens while driven by the drive current if the LED illumination platform comprises m units of the first LEDs; wherein if the LED illumination platform comprises n units of second LEDs the LED illumination platform generates light within the range of Y ⁇ 10% lumens while driven by the drive current, and if the LED illumination platform comprises m units of the second LEDs the LED illumination platform generates light within the range of Z ⁇ 10% lumens while driven by the drive current; wherein m>n, Z>Y, Y>X, and the luminous efficiency of the second LED is higher than that of the first LED.
  • the form factor of the LED illumination platform comprises a heat-pipe, a first heat-dissipating component, a second heat-dissipating component and an energy converter.
  • the heat-pipe has a flat portion and a contact portion, and the contact portion extending along a direction.
  • the first heat-dissipating component has a plurality of first fins, and the first fins are substantially parallel to the direction.
  • the second heat-dissipating component is engaged with the first heat-dissipating component for forming a containing space, the contact portion is contained inside the containing space and contacted with the first heat-dissipating component and the second heat-dissipating component simultaneously.
  • the energy converter is contacted with the flat portion, and comprises the first LEDs or the second LEDs, wherein the first heat-dissipating component comprises a first half cavity along the direction, and the second heat-dissipating component comprises a second half cavity along the direction, and the containing space is formed by the first half cavity and the second half cavity.
  • the form factor comprises a heat-pipe, a carrier, a first heat-dissipating component and an energy converter.
  • the heat-pipe has a flat portion and a contact portion, and the contact portion extends along a direction.
  • the carrier connected to the heat-pipe, has a first surface which is coplanar with the surface of the flat portion of the heat-pipe.
  • the first heat-dissipating component has a plurality of first fins, and the first heat-dissipating component is coupled the contact portion of the heat-pipe.
  • the energy converter is contacted with the flat portion and is capable to accommodate the first LEDs or the second LEDs, and the energy converter is fixed on the carrier to contact with the flat portion.
  • the heat generated by the energy converter can be transmitted to the heat-pipe through the flat portion. Therefore, the heat in the heat-pipe can be dissipated by the first heat-dissipating component and the second heat-dissipating component.
  • the heat-dissipating efficiency can also be enhanced by providing the first fins comprised in the first heat-dissipating component.
  • the LED illumination platform has a form factor and is powered by a driving current, the LED illumination platform generates light within the range of X ⁇ 10% lumens while driven by the drive current if the LED illumination platform comprises n units of first LEDs and the LED illumination platform generates light within the range of Y ⁇ 10% lumens while driven by the drive current if the LED illumination platform comprises m units of the first LEDs; wherein if the LED illumination platform comprises n units of second LEDs the LED illumination platform generates light within the range of Y ⁇ 10% lumens while driven by the drive current, and if the LED illumination platform comprises m units of the second LEDs the LED illumination platform generates light within the range of Z ⁇ 10% lumens while driven by the drive current; wherein m>n, Z>Y, Y>X, and the luminous efficiency of the second LED is higher than that of the first LED.
  • the form factor comprises a heat-pipe, a carrier, a heat-dissipating component, an energy converter and a panel.
  • the heat-pipe has a flat portion and a contact portion.
  • the carrier with a opening accommodates the heat-pipe, the carrier has a first surface which is coplanar with the surface of the flat portion of the heat-pipe.
  • the heat-dissipating component has a plurality of fins, and the heat-dissipating component is coupled to the contact portion of the heat-pipe.
  • the energy converter is contacted with the flat portion and accommodates the first LEDs or the second LEDs, the energy converter is fixed on the carrier to contact with the flat portion.
  • the panel with a hole corresponds to the energy converter, the heat pipe and the heat-dissipating component are disposed in one side of the panel, and the light emitted from the energy converter projects toward the other side of the panel.
  • FIG. 1 illustrates a schematic of a LED illumination platform according to a first preferred embodiment of the invention.
  • FIG. 2 illustrates a cross section view of the LED illumination platform 1 according to FIG. 1 . Specifically, the viewpoint of FIG. 2 is defined as direction X in FIG. 1 .
  • the control module circuit 24 and the connector 26 are not drawn in the cross section view, and the energy converter 18 has also been simplified.
  • the LED illumination platform 1 When the LED illumination platform 1 has a form factor and is powered by a driving current, the LED illumination platform 1 generates light within the range of X ⁇ 10% lumens while driven by the drive current if the LED illumination platform 1 comprises n units of first LEDs and the LED illumination platform 1 generates light within the range of Y ⁇ 10% lumens while driven by the drive current if the LED illumination platform 1 comprises m units of the first LEDs; wherein if the LED illumination platform 1 comprises n units of second LEDs the LED illumination platform 1 generates light within the range of Y ⁇ 10% lumens while driven by the drive current, and if the LED illumination platform 1 comprises m units of the second LEDs the LED illumination platform 1 generates light within the range of Z ⁇ 10% lumens while driven by the drive current; wherein m>n, Z>Y, Y>X, and the luminous efficiency of the second LED is higher than that of the first LED.
  • the LED illumination platform 1 could includes a certain quantity of LEDs to be driven by the driving current to light, and if the LED illumination platform 1 alternatively includes more LEDs, the LED illumination platform 1 could be driven by the same driving current to light in higher illumination. Similarly, the LED illumination platform 1 could alternatively include LEDs with high luminous efficiency. Thereby, the LED illumination platform 1 of the invention with fixed structure size has the advantage of providing different illumination by equipping with different quantities of LEDs or with LEDs with different luminous efficiency
  • the driven current shall tally with specifications of LEDs, the factors are not limited to those examples mentioned above.
  • the LED illumination platform 1 is not necessary to be redesigned for providing different scales of illumination, that is, the LED illumination platform 1 can be improved under the fixed form factor.
  • the form factor of the LED illumination platform 1 includes a first heat-dissipating component 12, a second heat-dissipating component 14, a heat-pipe 16, an energy converter18, a carrier 20, an optical modulator 22, a control module circuit 24, and a connector 26.
  • the first heat-dissipating component 12 includes a plate body 122 and several fins 124 extending from the plate body 122.
  • the second heat-dissipating component 14 includes a tube body 142, a front lid 144, and a back lid 146. The front lid 144 and the back lid 146 are engaged to two openings of the tube body 142 to form a circuit housing S2.
  • the circuit housing S2 accommodates the control module circuit 24 and a part of the connector 26.
  • the control module circuit 24 is disposed on a protrusion 142a of the tube body 142(please refer to FIG. 3B ). Additionally, if the protrusion 142a is formed to be a slide, it is helpful to mounting the control module circuit 24.
  • the first heat-dissipating component 12 and the second heat-dissipating component 14 are engaged together and form a containing space S1.
  • the shape of the containing space S1 is a cylinder nearly for accommodating the heat-pipe 16.
  • the heat-pipe 16 includes a contact portion 162 and a flat portion 164.
  • the contact portion 162 is disposed in the containing space S1 and contacts with the first heat-dissipating component 12 and the second heat-dissipating component 14. Additionally, other substances with high thermal conductivity could replace the heat-pipe 16.
  • the carrier 20 is mounted at an end of the heat-pipe 16.
  • the carrier 20 and the flat portion 164 of the heat-pipe 16 are coplanar but not limited to it.
  • the energy converter18 is mounted on the carrier 20 and contacts with the flat portion 164, so that the heat generated in operation by the energy converter18 could be conducted through the flat portion 164 to the heat-pipe 16, then conducted through the contact portion 162 of the heat-pipe 16 to the first heat-dissipating component 12 (including the fins 124 thereof) and the second heat-dissipating component 14, and dissipated outside.
  • the optical modulator 22 includes a ring body 222, a lens structure 224, and a fixed ring 226.
  • the ring body 222 is connected to the carrier 20, the lens structure 224 is disposed right opposite to the energy converter18, and the fixed ring 226 is mounted on the ring body 222.
  • control module circuit 24 includes a circuit board and other related electronic devices.
  • the control module circuit 24 is electrically connected to the energy converter18 by a wire L1 (represented by a bold-faced dotted line in FIG. 2 ) which is electrically connected to a connector 24a.
  • the carrier 20 thereon forms holes 202 for the wire to pass through.
  • the control module circuit 24 is electrically connected to the connector 26 (e.g. terminal blocks) through a wire L2 (represented by a bold-faced dotted line in FIG. 2 ) which is electrically connected to a connector 24b.
  • the connector 26 is connected to a power source through a wire 26a to obtain the required electricity for controlling the operation of the energy converter18 by the control module circuit 24; for example, the conversion mode is to transduce electricity into photo energy (e.g. the energy transduction of LEDs).
  • the connector 26 could alternatively provide electricity to other devices via the wire 26a; for example, the conversion mode is to transduce photo energy into electricity (e.g. the energy transduction of a solar cell).
  • FIG. 3A illustrates the first heat-dissipating component 12. Relative to the LED illumination platform 1 in FIG. 1 , the first heat-dissipating component 12 illustrated in FIG. 3A has been turned over for explaining conveniently.
  • FIG. 3B illustrates the tube body 142 of the second heat-dissipating component 14. As shown in FIG. 3A and FIG.
  • the plate body 122 of the first heat-dissipating component 12 includes a first half cavity 122b which is a semicircle and extends along Y direction; the tube body 142 of the second heat-dissipating component 12 correspondingly includes a second half cavity 142b which is a semicircle and extends along Y direction.
  • the first heat-dissipating component 12 is connected to the second heat-dissipating component 14
  • the first half cavity 122b and the second half cavity 142b therefore form the containing space S1.
  • the heat-pipe 16 could be disposed in the first half cavity 122b or the second half cavity 142b. Then, the plate body 122 and the tube body 142 are connected by screwing screws through holes 122a into threaded holes 142c, and the first heat-dissipating component 12 and the second heat-dissipating component 14 are therefore connected.
  • the heat-pipe 16 is also accommodated in the containing space S1 formed by the first half cavity 122b and the second half cavity 142b.
  • the mounting method for the invention is not limited to the above-mentioned method. Therefore, they (the plate body 122 and the tube body 142) could also be mounted together by welding or a C-shaped buckle.
  • the contact portion 162 of the heat-pipe 16 will be compressed to paste on the first heat-dissipating component 12 and the second heat-dissipating component 14 tightly.
  • the heat-pipe 16 will be deformed, which could not only enhance the connection strength of the heat-pipe 14 to both the first heat-dissipating component 12 and the second heat-dissipating component 14 but also increase the contact area of the contact portion 162 to both the first half cavity 122b and the second half cavity 142b, so as to increase the thermal conduction efficiency.
  • both the first half cavity 122b and the second half cavity 142b do not have to occupy the containing space S1 equally.
  • the first half cavity 122b could occupy most of the containing space S1.
  • the cross-section of the heat-pipe 16 is a rectangle, the appearance of the second half cavity 142b presents a plane substantially (i.e. the second heat-dissipating component 12 has the unobvious second half cavity 142b) and the second half cavity 142b still could form the containing space S1 together with the first half cavity 122b. Therefore, it is enough that the first heat-dissipating component 12 is engaged to the second heat-dissipating component 14 to form the containing space S1. It is not necessary that both the first heat-dissipating component 12 and the second heat-dissipating component 14 have a concave and protrusive structure.
  • the direction Y is a linear direction, it is not limited to this. It could also be a curve.
  • a connection plane of the first heat-dissipating component 12 and the second heat-dissipating component 14 is a parting plane of the containing space S1 for dividing the containing space S1 into the first half cavity 122b and the second half cavity 142b.
  • the fins 124 are parallel to the direction Y.
  • the LED illumination platform 1 or the heat-pipe 16
  • each of the fins 124 could also be arranged radially.
  • FIG. 4A illustrates that the optical modulator 22 is screwed on the carrier 20 by a thread structure.
  • FIG. 4B illustrates that the optical modulator 22 hooks the carrier 20 by a hook structure.
  • the thread structure primarily consists of an inner thread 228 formed in the ring body 222 and an outer thread 204 formed on a side of the carrier 20.
  • the ring body 222 of the optical modulator 22 could be screwed on the carrier 20.
  • the thickness of the wall of the thread structure in the carrier 20 is different form that shown in FIG. 2 , because the modification for the different connection structure is required.
  • the hook structure could consists of a hook 230 formed on the ring body 222.
  • the optical modulator 22 could be connected to the carrier 20 by hooking the carrier 20 with the hook 230. If a hook slot 206 is formed on the carrier 20 correspondingly, the hook structure consists of the hook 230 and the hook slot 206.
  • the hook slot 206 is able to mount the hook 230 thereon.
  • FIG. 5 illustrates that the carrier 20 is screwed on the heat-pipe 16 through a thread structure.
  • the thread structure primarily consists of an inner thread 208 formed in a hole of the carrier 20 and an outer thread 166 formed on the heat-pipe 16.
  • the carrier 20 could be screwed at an end of the heat-pipe 16.
  • FIG. 4A, FIG. 4B, FIG. 4C, and FIG. 5 only illustrate a sketch drawing of the energy converter18 and the details of the energy converter18 are not shown in these figures.
  • FIG. 6 illustrates a plane view of the energy converter 18 and the carrier 20 of the LED illumination platform 1.
  • FIG. 6B illustrates a cross section of the energy converter 18, the carrier 20, and a part of the heat-pipe 16 along line Z-Z in FIG. 6A .
  • the energy converter 18 includes energy transducing semiconductor structures 182, a substrate 184 and a base 186.
  • the energy transducing semiconductor structures 182 are disposed on the substrate 184.
  • the base 186 includes a first sunken portion 186a and a second sunken portion 186b connected to the first sunken portion 186a.
  • the substrate 184 contacts the flat portion 164 and is connected to the second sunken portion 186b, and the energy transducing semiconductor structure 182 are exposed out of the first sunken portion 186a.
  • the energy transducing semiconductor structure 182 is an independent chip and it is mounted on the substrate 184.
  • the energy transducing semiconductor structure 182 is wired to inner electrodes of the base 186 with metal wires 192 and then the energy transducing semiconductor structure 182 is electrically connected to the control module circuit 24 through wires L1 welded to outer electrodes 186c which is connected to the inner electrodes on the base 186 (please also refer to FIG. 2 ).
  • the energy transducing semiconductor structure 182 and metal wires 192 are mounted or sealed on the substrate 184 by a packing material 188.
  • the base 186 is mounted on the carrier 20 by screwing screws through holes 186d to the carrier 20.
  • the packing material 188 is also able to adjust light. If the contour of the packing material 188 is protrusive as shown in FIG. 6B , the packing material 188 is able to converge light.
  • the energy converter 18 includes a lens 190 disposed on the base 186.
  • the lens 190 is able to converge light, but not limited to it. With a proper design on the curvatures of two sides of the lens 190, the lens 190 is able to converge or scatter light for satisfying different optical adjustment requirements.
  • the optical adjustment effect of the LED illumination platform 1 also need to consider optical characters of a lens structure 224 of the optical adjusting member 22. What is remarkable is that the lens structure 224 of the optical adjusting member 22 is not limited to a convex lens. Please refer to FIG. 4A , there is a recess at the middle of the lens structure 224 and thus light is converged to become a ring shape roughly by the lens structure 224.
  • the base 186 could be formed by imbedding a lead frame of metal into a mold and then injecting liquid crystal plastic into the mold. Therein, the inner electrodes defined on the lead frame are exposed out of the first sunken portion 186a, and the outer electrodes 186c are exposed out of the base 186. Additionally, the energy transducing semiconductors 182 could be connected in serial by wiring as shown by the dotted line in FIG. 6B . Meantime, the energy transducing semiconductor structure 182 in FIG. 6B only retains one metal wire 192 to be connected to the base 186.
  • the energy transducing semiconductor structure 182 could be wired to the substrate 184 and then electrically connected to the base 186 through the substrate 184. If the substrate 184 is designed not to be a medium for electrical connection, the substrate 184 could be made of a metal material or other materials with high thermal conductivity for raising the thermal conduction efficiency of conducting the heat generated by the energy transducing semiconductor structure 182 to the flat portion 164.
  • FIG. 7 illustrates a cross section of the energy converter 18, the carrier 20, and a part of heat-pipe 16 according to an embodiment.
  • the difference between the FIG. 7 and FIG. 6 is that the substrate 184 in FIG. 7 is disposed in the second sunken potion 186b entirely. Therefore, the bottom surface 186e of the base 186 slightly protrudes out of the bottom surface 184a (for contacting with the flat portion 164) of the substrate 184.
  • the flat portion 164 protrudes out of the carrier 20 and the protrusive height of the flat portion 164 is slightly greater than the concave depth of the bottom surface 184a of the substrate 184 for ensuring that the substrate 184 is stuck on the flat portion 164 tightly.
  • the flat portion 164 could slightly protrude out of the carrier 20 and the bottom surface 186e of the base 186 and the bottom surface 184a of the substrate 184 are coplanar. The above purpose for ensuring sticking tightly could also be achieved.
  • a thermal conductive glue could be coated on the bottom surface of the base 186 or the flat portion 164 to be filled with the gap.
  • the thermal conductive glue could be coated on the bottom surface 186e of the base 186 or the flat portion 164 to be filled with the gap formed due to surface roughness of the bottom surface 186e or the flat portion 164.
  • FIG. 8 illustrates a cross section of the energy converter 18, the carrier 20, and a part of the heat-pipe 16 according to another embodiment.
  • the energy transducing semiconductor 182 in FIG. 8 is formed on the substrate 184 directly; for example, the substrate 184 itself is a semiconductor substrate (a silicon substrate). Therefore, the energy transducing semiconductor 182 could be integrated to form on the substrate 184 easily in a semiconductor process. Additionally, the electrodes of the energy transducing semiconductor structure 182 formed on the semi-substrate 184 could be integrated on the substrate 184 in advance, so that only two times of wiring are required to the energy transducing semiconductor structure 182. The stability of the fabrication could increase thereby.
  • FIG. 9 illustrates a cross section of the energy converter 18, the carrier 20, and a part of the heat-pipe 16 according to another embodiment.
  • the difference between FIG. 9 and FIG. 6B is that the energy transducing semiconductor structure 182 in FIG. 9 is disposed directly on a base 186' having a recess 186f rather than on the substrate 184 as shown in FIG. 6B .
  • the base 186' could be a plate where the energy transducing semiconductor 182 is disposed directly.
  • the description about the energy converter 18 in FIG. 6B is also applied here, and it will no longer be explained.
  • FIG. 10 illustrates a cross section of the energy converter 18, the carrier 20 and a part of the heat-pipe 16 according to another embodiment.
  • the difference between FIG. 6B and FIG. 10 is that the energy transducing semiconductor structure 182 in FIG. 10 is formed directly on a base 186'.
  • the base 186' could be a plate.
  • the description about the energy converter 18 in FIG. 8 is also applied here, and it will no longer be explained.
  • FIG. 11 illustrates an LED illumination platform 3 according to a second preferred embodiment.
  • the difference between the LED illumination platform 1 shown in FIG. 1 and the LED illumination platform 3 is that the second heat-dissipating component 14 and the first heat-dissipating component 12 (including a plate 142' and fins 148 extended from the plate 142') of the LED illumination platform 3 are symmetrical. Because the second heat-dissipating component 14 of the LED illumination platform 3 does not include the circuit housing S2 (as shown in FIG. 2 ) for accommodating the control module circuit 24, the LED illumination platform 3 does not include the control module circuit 24 and the connector 26 in principle.
  • the LED illumination platform 3 could be connected to an electrical box at a rear end (relative to the front end where the optical adjusting member 22 is disposed) of the first heat-dissipating component 12 and the second heat-dissipating component 14 for accommodating the control module circuit 24 and the connector 26.
  • FIG. 12A and FIG. 12B illustrates the first heat-dissipating component 12 and the second heat-dissipating component 14 respectively.
  • the second heat-dissipating component 14 does not include the circuit housing S2 of the LED illumination platform 1
  • the first heat-dissipating component 12 and the second heat-dissipating component 14 of the LED illumination platform 3 include semi-channels 122c and 142d respectively.
  • two channels are formed thereby for wires electrically connected to the energy converter 18 to pass through. If any description about devices with same names in the above-mentioned embodiments could be applied to the second preferred embodiment, the description is also applied here. It is no longer to be explained.
  • FIG. 13A illustrates an energy transducing equipment 5 according to a third preferred embodiment.
  • FIG. 13B illustrates a partial cross section of the energy transducing equipment 5 and it only illustrates the relative structure of the LED illumination platform 3 and a panel 54.
  • the energy transducing equipment 5 includes a frame 52 and several LED illumination platforms 3 fixed on the frame 52. In other words, the energy transducing equipment 5 is a group of the LED illumination platforms.
  • the frame 52 includes a panel 54 which includes several holes 542 corresponding to the several LED illumination platforms 3. An outer thread 204 of the carrier 20 of each of the LED illumination platforms 3 is exposed out of the corresponding hole 542. Thus, the inner thread 228 of the optical adjusting member 22 of each of the LED illumination platforms 3 could be engaged with the outer thread 204 from the outside of the panel 54.
  • the LED illumination platform 5 includes a control module circuit 56 which is mounted on the frame 52 and is electrically connected to the LED illumination platforms 3 through wires 32. Therefore, the LED illumination platforms 3 share the same circuit control circuit 56.
  • the control module circuit 56 is electrically connected to an outer power supply through a wire 58 for obtaining required electricity or providing electricity to other apparatuses. Additionally, the frame 52 could be mounted on other mounts through a mounting portion 60.
  • the energy transducing equipment 5 includes a control module circuit 56
  • the framework of the energy transducing equipment 5 also suits for the LED illumination platform 1 (Please refer to FIG. 1 ). Because the LED illumination platform 1 has the individual control module circuit 24, the control functions of the control module circuit 56 could be simplified thereby.
  • the energy transducing equipment 5 could include some LED illumination platforms 3 with higher illumination and some LED illumination platforms 3 with lower illumination which are disposed in certain patterns for providing various luminous effects.
  • the claimed form factor of this invention shows the characteristic that the LED illumination platforms 3 with different luminous efficiencies can be disposed, adjusted or replaced randomly on the holes 542 of the panel 54.
EP10006922A 2010-07-05 2010-07-05 Plateforme d'éclairage doté de diodes électroluminescentes Withdrawn EP2405194A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10006922A EP2405194A1 (fr) 2010-07-05 2010-07-05 Plateforme d'éclairage doté de diodes électroluminescentes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10006922A EP2405194A1 (fr) 2010-07-05 2010-07-05 Plateforme d'éclairage doté de diodes électroluminescentes

Publications (1)

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EP2405194A1 true EP2405194A1 (fr) 2012-01-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246366A (zh) * 2012-04-19 2014-12-24 欧司朗股份有限公司 Led模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1895227A1 (fr) * 2005-06-03 2008-03-05 NeoBulb Technologies, Inc. Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur
EP1916648A1 (fr) * 2005-07-21 2008-04-30 NeoBulb Technologies, Inc. Panneau d affichage lumineux
EP1933085A1 (fr) * 2005-05-25 2008-06-18 NeoBulb Technologies, Inc. Lampe a groupe de diodes electroluminescentes
EP1970967A1 (fr) * 2005-11-28 2008-09-17 NeoBulb Technologies, Inc. Structure d'emballage de diode electroluminescente

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1933085A1 (fr) * 2005-05-25 2008-06-18 NeoBulb Technologies, Inc. Lampe a groupe de diodes electroluminescentes
EP1895227A1 (fr) * 2005-06-03 2008-03-05 NeoBulb Technologies, Inc. Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur
EP1916648A1 (fr) * 2005-07-21 2008-04-30 NeoBulb Technologies, Inc. Panneau d affichage lumineux
EP1970967A1 (fr) * 2005-11-28 2008-09-17 NeoBulb Technologies, Inc. Structure d'emballage de diode electroluminescente

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246366A (zh) * 2012-04-19 2014-12-24 欧司朗股份有限公司 Led模块
EP2839211A1 (fr) * 2012-04-19 2015-02-25 OSRAM GmbH Module de diodes électroluminescentes

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