EP2351087A1 - Nonodrähte auf substratoberflächen, verfahren zu deren herstellung sowie deren verwendung - Google Patents
Nonodrähte auf substratoberflächen, verfahren zu deren herstellung sowie deren verwendungInfo
- Publication number
- EP2351087A1 EP2351087A1 EP09763848A EP09763848A EP2351087A1 EP 2351087 A1 EP2351087 A1 EP 2351087A1 EP 09763848 A EP09763848 A EP 09763848A EP 09763848 A EP09763848 A EP 09763848A EP 2351087 A1 EP2351087 A1 EP 2351087A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- nanowires
- nanoparticles
- nanoclusters
- solution
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002070 nanowire Substances 0.000 title claims abstract description 63
- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title abstract description 13
- 239000002105 nanoparticle Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 7
- 229910004613 CdTe Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 claims description 3
- 229910005540 GaP Inorganic materials 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 3
- 229910002665 PbTe Inorganic materials 0.000 claims description 3
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000001947 vapour-phase growth Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000002159 nanocrystal Substances 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 238000005329 nanolithography Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 239000011669 selenium Substances 0.000 description 3
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 2
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011244 liquid electrolyte Substances 0.000 description 2
- 239000000693 micelle Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- -1 Bismuth Amides Chemical class 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 240000000581 Triticum monococcum Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- GWOWVOYJLHSRJJ-UHFFFAOYSA-L cadmium stearate Chemical compound [Cd+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O GWOWVOYJLHSRJJ-UHFFFAOYSA-L 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- FTMKAMVLFVRZQX-UHFFFAOYSA-N octadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCCCP(O)(O)=O FTMKAMVLFVRZQX-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- MJNSMKHQBIVKHV-UHFFFAOYSA-N selenium;trioctylphosphane Chemical compound [Se].CCCCCCCCP(CCCCCCCC)CCCCCCCC MJNSMKHQBIVKHV-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/10—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising heterojunctions between organic semiconductors and inorganic semiconductors
- H10K30/15—Sensitised wide-bandgap semiconductor devices, e.g. dye-sensitised TiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
- H10K30/35—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains comprising inorganic nanostructures, e.g. CdSe nanoparticles
- H10K30/352—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains comprising inorganic nanostructures, e.g. CdSe nanoparticles the inorganic nanostructures being nanotubes or nanowires, e.g. CdTe nanotubes in P3HT polymer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/50—Photovoltaic [PV] devices
Definitions
- Nanowires and methods for their preparation are used in many technical fields, for example in the Halbleitertechnk, optics and photovoltaic, of great interest and were ei ⁇ ne number of different approaches to sol ⁇ che nanowires, that is fine wire or filament-like structures a typical diameter of 1-100 nm and lengths up to the micrometer range, different from Ma ⁇ terialien, usually made of metals, semi-metals and metal alloys ⁇ , but also from organic compounds to manufacture.
- the method according to the invention for the production of anchored nanowires on a substrate according to claim 1 does not include any deposition steps from the gas phase and comprises at least the following steps: a) providing a substrate surface with a given two-dimensional geometric arrangement of nanoparticles or nanoclusters; b) contacting the substrate surface with the nanoparticles or nanoclusters with at least one solution of the material forming the nanowires, wherein the material forming the nanowires selectively deposits on the nanoparticles or nanoclusters and continues to grow there.
- the inventive method further comprises that in step a) the application of a seed material on the nanoparticles or nanoclusters by contacting the substrate surface with a solution of the seed material takes place such that the seed material selectively deposited on the nanoparticles or nanoclusters and that in step b ) selectively deposits the material forming the nanowires on the nanoparticles or nanoclusters provided with seed material and continues to grow there.
- the substrate surface is basically not particularly limited and may include any material as long as it is stable under the conditions of the process of the present invention and does not interfere with or interfere with the reactions taking place.
- the substrate can be selected, for example, from glass, silicon, metals, polymers, etc. For certain applications, transparent substrates such as glass or ITO on glass are preferred.
- the predetermined two-dimensional geometric arrangement of the nanoparticles on the substrate surface has as a characteristic predetermined minimum or average particle spacings, wherein these predetermined particle spacings may be the same in all regions of the substrate surface or different regions may have different predetermined particle spacings.
- Such a geometric arrangement can in principle be realized with any suitable method of the prior art.
- the two-dimensional array of nanoparticles or nanoclusters be produced by a micelle-diblock copolymer nanolithography technique as described, for example, in EP 1 027 157 Bl and DE 197 47 815 A1.
- micellar nanolithography a micellar solution of a block copolymer is deposited onto a substrate, for example by dip coating, and forms an ordered film structure of chemically distinct polymer domains under appropriate conditions on the surface, which depends, inter alia, on the type, molecular weight and concentration of the block copolymer.
- the micelles in the solution can be loaded with inorganic salts, which can be oxidized or reduced to inorganic nanoparticles after deposition with the polymer film.
- a substrate surface with a specific geometric arrangement of nanoparticles, including predetermined particle spacings, and a predetermined particle size is an essential framework condition for the method according to the invention.
- the material of the nanoparticles or nanoclusters is not particularly limited and may include any material known in the art for such nanoparticles.
- the material is selected from the group consisting of Au, Pt, Pd, Ag, In, Fe, Zr, Al, Co, Ni, Ga, Sn, Zn, Ti, Si, and Ge, and more preferably gold.
- the nanoparticles are coated in step a) with a seed material, which mediates the adhesion and growth of the actual nanowire material on these nanoparticles.
- This seed material is preferably selected from the group consisting of Bi, In and alloys of these metals, with Bi being particularly preferred.
- the seed material may also be dispensable.
- the coating is typically carried out by immersing the substrate with the nanoparticles, preferably gold nanoparticles, in a hot solution of a salt of the seed material, for example Bi (III) 2-ethylhexanoate for Bi, in a suitable solvent at a temperature in the range of 13O 0 C to 200 0 C, preferably from 160 0 C to 170 0 C.
- a salt of the seed material for example Bi (III) 2-ethylhexanoate for Bi
- a suitable solvent at a temperature in the range of 13O 0 C to 200 0 C, preferably from 160 0 C to 170 0 C.
- the bismuth is selectively deposited on the nanoparticles.
- the residence time determines the diameter of the bismuth layer on the nanoparticles.
- the growth process is stopped by withdrawing the substrate from the solution and washing the substrate, for example with isopropanol.
- the material forming the nanowires is a semiconductor material.
- the nanowire material is selected from the group consisting of CdSe, CdTe, CdS, PbSe, PbTe, PbS, InP, InAs, GaP, GaAs, ZnO, (ZnMg) O, Si, and doped Si.
- the substrate with the optionally coated nanoparticles is immersed in at least one solution of the material intended for forming the nanowires.
- this material is a metal / metalloid or an alloy of metals / semimetals and the solution of this material used in step b) of the invention comprises a solution of one or more salts of this metal / metal or these metals / semimetals.
- a solution used is, for example, a solution of cadmium stearate in tri-n-octylphosphine oxide (TOPO) or cadmium oxide in TOPO and a phosphorus-containing acid with a longer alkyl chain (eg "octadecylphosphonic acid”) or cadmium oxide in Olive oil (according to Sapra et al., Journal of Materials Chemistry, 2006.
- the temperature for the growth of the nanowires can be adjusted as needed and depending on the components used.
- the temperature is typically in a range of 150 ° - 250 0 C.
- the concentration of the components, such as Cd and Se / Te the temperature and reaction time, the length of the nanowires can be varied.
- nanowires with a length of about 10 nanometers to several micrometers are produced by the method according to the invention.
- the production method according to the invention can be carried out in a very material-saving manner by minimizing the amount of solutions used, which flows over the substrates.
- Another procedural advantage over many known production methods for nanowires is that the inventive method can be performed in parallel with many samples / batches.
- the inventive method provides substrates with a defined arrangement of anchored nanowires at predetermined intervals, wherein the nanowires have a fixed epitaxial connection with the nanoparticles of the substrate surface. From Fig. Ic and Id it can be seen that a nanoparticle the starting point for more than one nanowire. The production of branched nanowires is also possible in principle.
- the products of the method according to the invention offer wide application possibilities in the fields of electronics and piezoelectronics, in particular nanopiezoelectronics, semiconductor technology, optics, sensor technology, photovoltaics and generally chemical storage elements.
- Some non-limiting examples thereof are use in solar cells, transistors, diodes, chemical storage elements or sensors.
- a particularly preferred application relates to use in solar cells.
- Semiconductor nanowires and nanocrystals are known to efficiently absorb light in the visible spectrum.
- a mixture of colloidal nanocrystals with a conductive polymer Kel and Scholes, Microchimica Acta 2008, Vol.
- the surface is conductive, the charges generated in the absorption process can be stored directly.
- Such an assembly with ZnO-based anchored nanowires immersed in a liquid electrolyte has been proposed by Law et al., Nature Materials 2005, 4, 455-459.
- the synthetic method described therein is not transferable to other nanowire materials such as CdSe and CdTe, and no substrate surface having a given two-dimensional geometric arrangement is used for the growth of the nanowires.
- Fig. 1 shows SEM images of samples at various stages of the manufacturing process of the invention.
- FIG. 2 schematically shows the structure of an electrode arrangement using the nanowires anchored on a substrate according to the invention as an element of a solar cell.
- a substrate surface eg glass or ITO on glass
- micellar nanolithography with gold dots / gold nanoparticles.
- one of the protocols described in EP 1 027 157 Bl, DE 197 47 815 A1 or DE 10 2007 017 032 A1 can be followed.
- the method involves depositing a micellar solution of a block copolymer (eg, polystyrene (n) -b-poly (2-vinylpyridine (m)) on the substrate, eg, by dip coating, thereby forming an ordered film structure of polymer domains on the surface becomes.
- a block copolymer eg, polystyrene (n) -b-poly (2-vinylpyridine (m)
- the micelles in the solution are loaded with a gold salt, preferably HAuCl 4 , which is reduced to the gold nanoparticles after deposition with the polymer film.
- the reduction may be chemically effected, for example with hydrazine, or by means of ener ⁇ yaw Eicher radiation such as electron beam radiation or light.
- the polymer film is removed (eg by plasma etching with Ar, H or O ions).
- the solution is heated to 100-150 0 C and evacuated several times and then purged with nitrogen.
- the solution is further heated to 210 ° C under nitrogen and the samples are suspended in the solution.
- Se-TOP 200mg selenium-powder selenium solution injected: 400mg TOP (tri-n-octylphosphine from Sigma-Aldrich dissolved in 800mg TOP)
- reaction is allowed to proceed for about 30 minutes and then the substrates are withdrawn from the solution.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Silicon Compounds (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008058400A DE102008058400A1 (de) | 2008-11-21 | 2008-11-21 | Nanodrähte auf Substratoberflächen, Verfahren zu deren Herstellung sowie deren Verwendung |
PCT/EP2009/008277 WO2010057652A1 (de) | 2008-11-21 | 2009-11-20 | Nonodrähte auf substratoberflächen, verfahren zu deren herstellung sowie deren verwendung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2351087A1 true EP2351087A1 (de) | 2011-08-03 |
Family
ID=41600430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09763848A Withdrawn EP2351087A1 (de) | 2008-11-21 | 2009-11-20 | Nonodrähte auf substratoberflächen, verfahren zu deren herstellung sowie deren verwendung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110284820A1 (de) |
EP (1) | EP2351087A1 (de) |
KR (1) | KR20110099005A (de) |
CN (1) | CN102301479B (de) |
DE (1) | DE102008058400A1 (de) |
WO (1) | WO2010057652A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569034A (zh) * | 2012-02-15 | 2012-07-11 | 中国科学院半导体研究所 | 在自然氧化的Si衬底上生长InAs纳米线的方法 |
CN102618269B (zh) * | 2012-03-13 | 2016-06-29 | 浙江理工大学 | 一种CdS/Sn异质结构纳米发光材料的制备方法 |
CN103794474A (zh) * | 2014-01-29 | 2014-05-14 | 中国科学院半导体研究所 | 硅衬底上生长纳米线的衬底处理方法 |
US9953989B2 (en) | 2014-03-31 | 2018-04-24 | Taiwan Semiconductor Manufacturing Company Limited and National Taiwan University | Antifuse array and method of forming antifuse using anodic oxidation |
US9528194B2 (en) | 2014-03-31 | 2016-12-27 | Taiwan Semiconductor Manufacturing Company Limited & National Taiwan University | Systems and methods for forming nanowires using anodic oxidation |
CN104070178A (zh) * | 2014-07-01 | 2014-10-01 | 扬州大学 | 一种粒径可控的单分散铋纳米粒子的制备方法 |
US10160906B2 (en) | 2015-02-24 | 2018-12-25 | Fondazione Istituto Italiano Di Tecnologia | Masked cation exchange lithography |
DE102017104906A1 (de) * | 2017-03-08 | 2018-09-13 | Olav Birlem | Anordnung und Verfahren zum Bereitstellen einer Vielzahl von Nanodrähten |
CN114520266B (zh) * | 2021-10-22 | 2024-07-12 | 中国科学院重庆绿色智能技术研究院 | 一种硫化铅光电导探测器及其制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59809228D1 (de) * | 1997-10-29 | 2003-09-11 | Univ Ulm | Nanostrukturen |
DE19747815A1 (de) | 1997-10-29 | 1999-05-06 | Univ Ulm | Nanostrukturierung von Oberflächen |
US20110039690A1 (en) * | 2004-02-02 | 2011-02-17 | Nanosys, Inc. | Porous substrates, articles, systems and compositions comprising nanofibers and methods of their use and production |
JP4813775B2 (ja) * | 2004-06-18 | 2011-11-09 | 日本電信電話株式会社 | 多孔構造体及びその製造方法 |
WO2008054378A2 (en) | 2005-10-25 | 2008-05-08 | Massachusetts Institute Of Technology | Apparatus and methods for controlled growth and assembly of nanostructures |
JP5032823B2 (ja) * | 2006-10-20 | 2012-09-26 | 日本電信電話株式会社 | ナノ構造およびナノ構造の作製方法 |
DE102007017032B4 (de) | 2007-04-11 | 2011-09-22 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen |
CN101255603B (zh) * | 2007-12-06 | 2011-11-23 | 上海大学 | 模板电沉积法制备ⅱ-ⅵ族半导体纳米线的方法 |
-
2008
- 2008-11-21 DE DE102008058400A patent/DE102008058400A1/de not_active Withdrawn
-
2009
- 2009-11-20 EP EP09763848A patent/EP2351087A1/de not_active Withdrawn
- 2009-11-20 CN CN200980146632.6A patent/CN102301479B/zh not_active Expired - Fee Related
- 2009-11-20 US US13/130,234 patent/US20110284820A1/en not_active Abandoned
- 2009-11-20 WO PCT/EP2009/008277 patent/WO2010057652A1/de active Application Filing
- 2009-11-20 KR KR1020117012545A patent/KR20110099005A/ko not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO2010057652A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102301479B (zh) | 2014-08-27 |
US20110284820A1 (en) | 2011-11-24 |
CN102301479A (zh) | 2011-12-28 |
DE102008058400A1 (de) | 2010-05-27 |
WO2010057652A1 (de) | 2010-05-27 |
KR20110099005A (ko) | 2011-09-05 |
WO2010057652A8 (de) | 2011-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2351087A1 (de) | Nonodrähte auf substratoberflächen, verfahren zu deren herstellung sowie deren verwendung | |
Dick et al. | Synthesis of branched'nanotrees' by controlled seeding of multiple branching events | |
Nozik et al. | Semiconductor quantum dots and quantum dot arrays and applications of multiple exciton generation to third-generation photovoltaic solar cells | |
DE102006060366B4 (de) | Verfahren zur Herstellung von von einer Matrix abgedeckten Quantenpunkten | |
US7663057B2 (en) | Solution-based fabrication of photovoltaic cell | |
DE69319784T2 (de) | Verfahren zur Herstellung einer feinen Struktur | |
O’Sullivan et al. | Spontaneous room temperature elongation of CdS and Ag2S nanorods via oriented attachment | |
AbouZeid et al. | Hybrid Au–CdSe and Ag–CdSe Nanoflowers and Core–Shell Nanocrystals via One‐Pot Heterogeneous Nucleation and Growth | |
DE102006053953A1 (de) | Fotovoltaische Struktur mit einer Elektrode aus einem Array leitender Nanodrähte sowie Verfahren zum Herstellen der Struktur | |
DE112009002124T5 (de) | Quantenpunkt-Photovoltaikvorrichtung und deren Herstellungsverfahren | |
DE112008000581T5 (de) | Verfahren zum Bilden von Nanostrukturen auf Metallsilizidkristallen und resultierende Strukturen und Bauelemente | |
US20130032767A1 (en) | Octapod shaped nanocrystals and use thereof | |
Chun et al. | Various synthetic methods for one‐dimensional semiconductor nanowires/nanorods and their applications in photovoltaic devices | |
DE112008000514T5 (de) | Heterokristallines Halbleiterbauelement und Verfahren zum Herstellen desselben | |
EP2909867B1 (de) | Verfahren zum abscheiden von thermoelektrischem material | |
DE112016002978T5 (de) | Thermoelektrisches Material, thermoelektrisches Element, optischer Sensor und Verfahren zur Herstellung eines thermoelektrischen Materials | |
EP1960309B1 (de) | Verfahren zur herstellung von nanostrukturen auf einem substrat | |
WO2007076843A1 (de) | Kompositzusammensetzung für eine solarzelle, p-i-n-halbleiterstruktur, enthaltend diese zusammensetzung, solarzelle und verfahren zur herstellung von kompositzusammensetzungen | |
EP2190033A1 (de) | Tandemsolarzelle aus kristallinem Silizium und kristallinem Siliziumcarbid sowie Verfahren zu dessen Herstellung | |
EP2748653A1 (de) | Verfahren zur herstellung periodischer kristalliner silizium-nanostrukturen | |
DE102008062283B4 (de) | Verfahren zur Herstellung großflächig emittierender Lichtemitterdioden | |
KR101401924B1 (ko) | 나노와이어/양자점 이종구조 및 이의 제조방법 | |
DE10026911B4 (de) | Verfahren zur Herstellung eines Halbleiter-Superatoms und eines Aggregats davon | |
DE102005029162B4 (de) | Solarzelle mit einer Whisker-Struktur und Verfahren zu deren Hestellung | |
DE10339824B4 (de) | Beschichtungsverfahren zur Deposition und Fixierung von Partikeln auf einer Substratoberfläche und Solarzellen mit funkionellem Schichtenaufbau |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110516 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BOCK, EVA Inventor name: SPATZ, JOACHIM, P. Inventor name: KUDERA, STEFAN Inventor name: MANNA, LIBERATO |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SPATZ, JOACHIM, P. Inventor name: BOCK, EVA Inventor name: KUDERA, STEFAN Inventor name: MANNA, LIBERATO |
|
DAX | Request for extension of the european patent (deleted) | ||
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150602 |