EP2318756A1 - Electrical circuit arrangement - Google Patents

Electrical circuit arrangement

Info

Publication number
EP2318756A1
EP2318756A1 EP09777475A EP09777475A EP2318756A1 EP 2318756 A1 EP2318756 A1 EP 2318756A1 EP 09777475 A EP09777475 A EP 09777475A EP 09777475 A EP09777475 A EP 09777475A EP 2318756 A1 EP2318756 A1 EP 2318756A1
Authority
EP
European Patent Office
Prior art keywords
circuit arrangement
electrical circuit
housing
arrangement according
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09777475A
Other languages
German (de)
French (fr)
Other versions
EP2318756B1 (en
Inventor
Bernhard RÖMER
Jacek BRONOWICZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FHF Funke and Huster Fernsig GmbH
Original Assignee
FHF Funke and Huster Fernsig GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FHF Funke and Huster Fernsig GmbH filed Critical FHF Funke and Huster Fernsig GmbH
Publication of EP2318756A1 publication Critical patent/EP2318756A1/en
Application granted granted Critical
Publication of EP2318756B1 publication Critical patent/EP2318756B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/12—Flameproof or explosion-proof arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an electrical circuit arrangement, in particular electrical signal circuitry, preferably signal light, for use in potentially explosive atmospheres, with at least one arranged on a printed circuit board made of a thermally conductive material electrical component, in particular bulbs, and with a standing in thermal contact with the circuit board cooling device , -
  • the addressed and arranged on the circuit board bulbs are usually one or more LEDs.
  • Signal lights are commonly used to generate one or more optical signals that serve to indicate any hazards, peculiarities, etc.
  • signal lights are used for reporting and warning, for example with regard to faults on machines.
  • Signal lights but also escape routes can show as well or under certain circumstances indicate advertising space.
  • acoustic signaling devices which are also to be qualified as electrical signal circuitry in the above sense.
  • the aforementioned problem therefore generally applies to all housings of signal lights because, owing to the usually required high luminous intensity of the luminous means, an increased amount of heat loss must often be expected. This heat loss can lead to an increased temperature in the interior of the housing relative to the ambient temperature. The increased temperature inside the housing makes the use of the signal light in the example case in potentially explosive areas problematic. Because there is a risk that partial areas of the housing heat up significantly higher than other areas. As a result, so-called "hot spots" are observed on the surface of the device, which can be sources of ignition for the surrounding atmosphere in potentially explosive atmospheres.
  • the invention aims to provide a total remedy.
  • the technical problem underlying the invention is to further develop such an electrical circuit arrangement that design limitations are no longer observed and a cost-effective embodiment is present.
  • the invention proposes in a generic electrical circuit arrangement that the cooling device is formed at least in two parts with heat sink and at least one heat pipe, wherein the heat pipe thermally connects the circuit board with the heatsink remote therefrom.
  • the heat pipe thermally connects the circuit board with the heatsink remote therefrom.
  • At least one heat pipe or a so-called “heat pipe” is used, which respectively thermally connects the printed circuit board with the electrical component arranged thereon to the heat sink.
  • the heat sink acts as a heat sink and any heat loss of the electrical component is on the thermally conductive Material manufactured circuit board and the heat pipe finally forwarded to the hereby heat-conducting connected heat sink and distributed there usually distributed over a relatively large area to the ambient air.
  • a heat exchanger which usually provides a high heat flux density available by using heat of vaporization of a heat transfer medium received in the heat pipe.
  • the heat transfer medium or working medium may be water, which is received in the interior of the mostly hermetically encapsulated heat pipes.
  • the heat transfer medium or working medium begins to evaporate.
  • the resulting vapor flows in the direction of the heat sink or the heat sink, where it condenses because of its lower temperature.
  • the previously recorded heat heat loss of the arranged on the circuit board electrical component
  • the now (again) liquid working medium usually returns by gravity or in the case of a heat pipe by capillary force back to the place of heat input or distributed in the interior of the heat pipe.
  • heat pipes or heat pipes are able to work in weightlessness and in particular regardless of the installation position.
  • the capillaries are formed in a kind of wick inside the heat pipe, whereas the space surrounding the wick and / or inside is used for steam guidance.
  • the required working fluid is introduced into the heat pipe, it is usually necessary to mechanically evacuate the heat pipe. Since in the present case the temperature range between about 0 0 C and 100 0 C is primarily covered, water is suitable as a heat transfer medium or working medium.
  • copper is usually used for the production of the heat pipe or the heat pipe, since this can be easily shaped and also has a high thermal conductivity.
  • Such heat pipes or heatpipes are commercially available today in various lengths.
  • the heat sink ultimately representing heat sink is also formed at the same time as a mounting flange for the described electrical circuit arrangement as a whole. This provides a dual benefit as it were.
  • a housing receiving the electrical circuitry is usually made of plastic, is therefore hardly suitable for immediate attachment to a wall, a ceiling a housing, etc.
  • a mounting flange heat sink is used, which provides the necessary mechanical Stability for the mounting of the electrical circuit arrangement provides.
  • the mounting flange or heat sink is equipped according to an advantageous embodiment with additional cooling fins, which at the same time increase its stability, but in any case increase the surface and thus enhance the heat transfer to the environment.
  • the heat sink may be equipped with a cold source, which may be an example of a Peltier element. This additional source of cold is usually used when the heat dissipation through the heat sink or the heat sink in the application is not sufficient.
  • the printed circuit board made of a thermally conductive material is usually carried by a housing insert, in turn, with the already addressed housing is mechanically connected.
  • the housing is made in the present case of plastic and is usually filled with a potting compound to provide the required explosion-proof design available.
  • the potting compound prevents exposed contacts from causing an ignitable mixture to explode or from sparking.
  • the potting compound is, as usual, an insulating plastic, which is filled into the housing usually in overhead division in (tough) liquid state and then cured.
  • the housing is regularly formed at least in two parts with an opaque base body and a transparent signal hood.
  • the potting compound in the area of the signal hood is designed to be regularly transparent, whereas otherwise a cloudy or opaque potting compound is used.
  • the signal hood and the main body are usually united together only by a plug connection.
  • the potting compound is filled into the housing in the overhead position and cured, it ensures that the two housing parts (main body and signal hood) are captively coupled together.
  • To further stability also contributes to the fact that the housing insert carrying the circuit board is regularly connected to the housing and of course then with the cured potting compound.
  • the invention is also a structural unit, which is composed of an electrical circuit arrangement of the type described and is additionally equipped with an adapter.
  • This adapter ensures or ensures that via a common supply line and the adapter not only an electrical circuit, but for example, two or even more can be supplied. So it is conceivable to combine a signal light with a signal speaker or two signal lights each other respectively two signal speakers. That depends on the importance of the attention signal in the warning area to be equipped.
  • an electrical circuit arrangement and a structural unit of the electrical circuit arrangement and the adapter are made available, which first of all by the almost unlimited variety of design of the housing and in particular the arrangement of the light source or of the printed circuit board carried by the electrical component and the Distinguish the associated cooling device.
  • This heat sink is advantageously arranged in a housing recess, thus in thermal contact with the environment. This also applies and in particular for the case that the housing is made entirely or predominantly of plastic. Because the heat sink also represents the mounting flange for the circuit as a whole, a practical dual benefit is provided.
  • a base can be used as an additional heat sink to which the heat sink or mounting flange is fixed.
  • this base area or base may be a (metal) machine housing or the like.
  • For an additional increase in surface area of the heat sink or mounting flange may provide additional cooling fins or an optional source of cold.
  • the described electrical circuit arrangement of the shape of the housing can be arbitrarily designed, especially since the housing is usually designed as a low-priced plastic injection molded part. Nevertheless, the required explosion-proof equipment is provided, which not only ensures the reliable dissipation of the resulting heat loss inside, but also the fact that the interior of the housing is filled with a potting compound.
  • This potting compound also has a dual function. It not only ensures that electrical cables or the electrical component accommodated on the printed circuit board are hermetically sealed, but at the same time ensures that the two housing parts (main body and signal hood) are perfectly connected to each other, without additional fastening means at this point would be required.
  • main benefits are the main benefits.
  • Fig. 3 shows a structural unit of a modified electrical circuit arrangement and an associated adapter.
  • an electrical circuit arrangement is shown, which is used for use in potentially explosive areas.
  • the electrical circuit arrangement is a signal circuit arrangement, in the present case a signal light.
  • the basic structure of the circuit arrangement or signal light includes one or more electrical components 1, each of which is LED 1. These components 1 and LED's 1 are received on a printed circuit board 2 made of a thermally conductive material.
  • the circuit board 2 is made in the embodiment of a metal, in particular aluminum.
  • the LEDs 1 are SMD LEDs L
  • the LEDs or lighting means 1 are arranged in a circle in comparison to a central axis A of a housing 3. Opposite this axis A, the housing 3 is rotationally symmetrical. In this way, the light emitted by the LEDs or light sources 1 is emitted in all spatial directions, so that an all-round light emission is ensured.
  • the respective printed circuit board 2 is supported by a housing insert 4, which in turn is mechanically connected to the housing 3.
  • the housing insert 4 is composed of an insert foot 4a and an insert head 4b, wherein the insert head 4b is equipped in cross-section as a polygon with side surfaces 4c, which each carry a printed circuit board 2.
  • the respective printed circuit board 2 is connected to the insert head 4b by means of or by resorting to a plurality of screws 5.
  • this cooling device 6, 7 is composed of a heat pipe 6 and a heat sink 7.
  • the heat pipe 6 thermally connects the respective printed circuit board 2 to the cooling body 7 arranged spatially remote therefrom.
  • the heat pipe 6 is centrally accommodated in the operating head 4b of the housing insert 4 in the exemplary embodiment.
  • the insert head 4b in question is solid and made of metal (aluminum) and equipped with a hollow bore 8 which receives one end of the heat pipe 6 in its interior. About this hollow bore 8 takes place at the beginning already described heat input into the heat pipe 6.
  • the heat sink 7 is equipped with a hollow bore 9, wherein the hollow bore 9 in conjunction with the heat sink 7 is the previously described heat sink. Consequently flows from the LEDs 1 produced heat loss via the insert head 4b, the heat pipe 6 finally to the heat sink 7, which acts as a heat sink.
  • the heat pipe 6 is equipped as a copper pipe with a heat transfer medium, in particular water, enclosed in an encapsulation, the heat pipe 6 can be easily bent and easily adapted to the topological conditions in the interior of the housing 3. Any heat loss of the LEDs 1 is received via the associated circuit board 2, because the electrical component or the LED 1 is mounted in the example on the circuit board 2 with the interposition of a thermal paste or the like. From the circuit board 2, the heat is transmitted to the insert head 4b of the housing insert 4, which is also made of a thermally conductive material (metal). With the insert head 4b is one end of the heat pipe 6 in thermal contact.
  • a thermally conductive material metal
  • the resulting heat loss is now converted into latent heat and transported to the heat sink in the form of the heat sink 7. Since the heat sink 7 is at the same time designed as a mounting flange 7 for the circuit arrangement or the housing 3 as a whole, the heat thus transported is distributed over a large area. This applies even more in the event that the heat sink 7 is equipped with supplementary and not explicitly shown cooling fins. Also, an additional source of cold in the form of a Peltier element can be used here, but this is also not shown.
  • the heat sink 7 is placed in a housing recess 10. As a result, the heat sink 7 is directly in thermal contact with the ambient atmosphere. This is of particular importance, as the housing 3 is made of plastic in the exemplary embodiment, thus has a poor thermal conductivity. In any case, the heat loss from the LED's 1 ultimately over that in the housing opening 10th placed heat sink 7 delivered to the ambient air respectively ambient atmosphere.
  • the housing 3 is formed essentially in two parts and cylindrically with an opaque main body 3a and a transparent signal hood 3b.
  • the transparent signal hood 3b As a result of the transparent signal hood 3b, the light emitted by the LEDs 1 light can be radiated all around easily and provides the desired signal effect.
  • the circumstance contributes to the fact that the housing 3 is filled with a potting compound 11a, 11b in the interior.
  • This casting compound 11a, 11b is filled in a viscous state in the overhead division of the housing 3 and, of course, when the housing insert 4 is mounted, LED's 1 mounted thereon and likewise realized cooling device 6, 7.
  • the opaque main body 3a and the transparent signal cap 3b have been coupled to each other via respective snap-in connections 12 or enter into a mutual plug connection.
  • the potting compound 11a, 11b hardens, the transparent signal cap 3b and the base body 3a are captively coupled together.
  • the potting compound 11 a is a transparent potting compound which fills the interior of the housing 3 in the region of the signal hood 3 b. Below the filled with the aid of the transparent potting compound 11 a space is the cloudy or opaque further potting compound 11 b. Both potting compounds 11a, 11b are successively filled into the housing 3, first the transparent potting compound 11a and then the opaque potting compound 11b.
  • Fig. 3 shows a structural unit of the already described electrical circuitry respectively the signal light and an adapter 13.
  • This adapter 13 is equipped with a flange 14, to which a further signal light or a signal speaker can be arranged.
  • a further signal light or a signal speaker can be arranged.
  • the adapter 13 are both electrical Circuit arrangements supplied together with the required electrical energy. It can be seen that the two electrical circuit arrangements are arranged at right angles to each other in the embodiment, which of course is not a mandatory feature.

Abstract

The present invention relates to an electrical circuit arrangement, in particular an electrical signal circuit arrangement and preferably a signal lamp which is used in hazardous areas. The circuit arrangement is equipped with at least one electrical component (1) which is arranged on a printed circuit board (2) produced from a heat-conducting material. The electrical component (1) is, in particular, a luminous means (1). A cooling device (6, 7) which is in thermal contact with the printed circuit board (2) is also realized. According to the invention, the cooling device (6, 7) is in at least two parts, with a heat sink (7) and at least one heat pipe (6). In this case, the heat pipe (6) thermally connects the printed circuit board (2) to the heat sink (7).

Description

Elektrische Schaltungsanordnung Electrical circuit arrangement
Beschreibung:Description:
Die Erfindung betrifft eine elektrische Schaltungsanordnung, insbesondere elektrische Signal-Schaltungsanordnung, vorzugsweise Signalleuchte, zum Einsatz in explosionsgefährdeten Bereichen, mit wenigstens einem auf einer aus einem wärmeleitenden Material gefertigten Leiterplatte angeordneten elektrischen Bauteil, insbesondere Leuchtmittel, und mit einer mit der Leiterplatte in Wärmekontakt stehenden Kühleinrichtung. - Bei dem angesprochenen und auf der Leiterplatte angeordneten Leuchtmittel handelt es sich in der Regel um ein oder mehrere LED's.The invention relates to an electrical circuit arrangement, in particular electrical signal circuitry, preferably signal light, for use in potentially explosive atmospheres, with at least one arranged on a printed circuit board made of a thermally conductive material electrical component, in particular bulbs, and with a standing in thermal contact with the circuit board cooling device , - The addressed and arranged on the circuit board bulbs are usually one or more LEDs.
Signalleuchten werden üblicherweise eingesetzt, um ein oder mehrere optische Signale zu erzeugen, die dazu dienen, auf etwaige Gefahren, Besonderheiten etc. hinzuweisen. So werden Signalleuchten zur Meldung und Warnung beispielsweise im Hinblick auf Fehler an Maschinen verwendet. Genauso gut können Signalleuchten aber auch Fluchtwege anzeigen oder unter Umständen auf Werbeflächen hinweisen. Vergleichbares gilt für akustische Signalgeräte, die ebenfalls als elektrische Signal-Schaltungsanordnung im obigen Sinn zu qualifizieren sind.Signal lights are commonly used to generate one or more optical signals that serve to indicate any hazards, peculiarities, etc. For example, signal lights are used for reporting and warning, for example with regard to faults on machines. Signal lights but also escape routes can show as well or under certain circumstances indicate advertising space. The same applies to acoustic signaling devices, which are also to be qualified as electrical signal circuitry in the above sense.
Sobald im Beispielfall Leuchtmittel auf der aus einem wärmeleitenden Material bestehenden Leiterplatte angebracht sind, besteht im Rahmen spezieller Anwendungen das Problem der Wärmeabfuhr. Das gilt bereits für elektrische Schaltungsanordnungen im Allgemeinen und für Signalleuchten im Speziellen, die in explosionsgefährdeten Bereichen zum Einsatz kommen, also so genannte explosionsgeschützte elektrische (Signal-)Schaltungsanordnungen respektive Signalleuchten oder auch Signallautsprecher. Denn derartige Signal- leuchten verfügen entweder über eine druckfeste Kapselung des Gehäuses, so dass die Abfuhr von im Gehäuse entstehender Verlustwärme ein Problem darstellt. Oder die Gehäuse sind ganz oder überwiegend mit einer Vergussmasse ausgefüllt, so dass sich vergleichbare Probleme einstellen, da derartige Vergussmasse üblicherweise nur über eine äußerst schlechte Wärmeleitfähigkeit verfügt.As soon as bulbs are mounted on the existing of a thermally conductive material circuit board in the example, there is the problem of heat dissipation in the context of special applications. This is already true for electrical circuit arrangements in general and for signal lights in particular, which are used in hazardous areas, so-called explosion-proof electrical (signal) circuit arrangements respectively signal lights or signal speakers. Because such signal Lights have either a flameproof enclosure of the housing, so that the removal of heat generated in the housing is a problem. Or the housings are completely or predominantly filled with a potting compound, so that settle comparable problems, since such potting compound usually has only an extremely poor thermal conductivity.
Das vorgenannte Problem gilt also generell für sämtliche Gehäuse von Signalleuchten, weil aufgrund der zumeist geforderten hohen Lichtstärke der Leucht- mittel oftmals mit einem erhöhten Anfall an Verlustwärme gerechnet werden muss. Diese Verlustwärme kann im Innern des Gehäuses zu einer erhöhten Temperatur gegenüber der Umgebungstemperatur führen. Die erhöhte Temperatur im Innern des Gehäuses macht den Einsatz der Signalleuchte im Beispielfall in explosionsgefährdeten Bereichen problematisch. Denn es besteht die Gefahr, dass sich partielle Bereiche des Gehäuses deutlich höher als andere Bereiche erhitzen. Dadurch werden so genannte "HotSpots" an der Geräteoberfläche beobachtet, die Zündquellen für die Umgebungsatmosphäre in explosionsgefährdeten Bereichen darstellen können.The aforementioned problem therefore generally applies to all housings of signal lights because, owing to the usually required high luminous intensity of the luminous means, an increased amount of heat loss must often be expected. This heat loss can lead to an increased temperature in the interior of the housing relative to the ambient temperature. The increased temperature inside the housing makes the use of the signal light in the example case in potentially explosive areas problematic. Because there is a risk that partial areas of the housing heat up significantly higher than other areas. As a result, so-called "hot spots" are observed on the surface of the device, which can be sources of ignition for the surrounding atmosphere in potentially explosive atmospheres.
Das gilt nicht nur für bestimmte Gasgemische oder das Auftreten von zündfähigen Gasen, sondern auch für beispielsweise brennbare Stäube bei der Verarbeitung von Pulvern. In diesem Zusammenhang ist ergänzend zu berücksichtigen, dass je geringer der gegebene Abstand zwischen der zugehörigen Wärmequelle und der Oberfläche bemessen ist, desto höher ist die partielle Erwärmung durch Strahlung und Konvektion. Das heißt, das Auftreten der beschriebenen "HotSpots" wird durch einen geringen Abstand zwischen der Wärmequelle und der Oberfläche und eine unzureichende Wärmeabfuhr der Oberfläche begünstigt.This applies not only to certain gas mixtures or the occurrence of flammable gases, but also to, for example, combustible dusts during the processing of powders. In this context, it should be additionally considered that the smaller the given distance between the associated heat source and the surface, the higher the partial heating by radiation and convection. That is, the occurrence of the described "HotSpots" is favored by a small distance between the heat source and the surface and an insufficient heat dissipation of the surface.
Aus diesem Grund hat man im gattungsbildenden Stand der Technik nach der GB 2,428,467 A bereits einen ausladenden Kühlkörper bei einer explosions- geschützten Signalleuchte realisiert. Der Kühlkörper bzw. Kühlblock ist mit der Umgebungsatmosphäre verbunden. Auf dem Kühlkörper bzw. Kühlblock befindet sich die Leiterplatte mit darauf angeordneten LED's. Die Leiterplatte selbst ist aus Aluminium oder einem anderen geeigneten Material mit hoher Leit- fähigkeit gefertigt.For this reason, in the generic state of the art according to GB 2,428,467 A, an expansive heat sink has already been used in an explosive protected signal light realized. The heat sink or cooling block is connected to the ambient atmosphere. On the heat sink or cooling block is the circuit board with LEDs arranged thereon. The circuit board itself is made of aluminum or other suitable material with high conductivity.
Dadurch, dass im Stand der Technik die Leiterplatte mit den darauf befindlichen LED's unmittelbar auf dem Kühlblock angeordnet ist bzw. angeordnet werden muss, sind die möglichen Ausführungsformen der Signalleuchte beschränkt. Insbesondere lassen sich hiermit kaum zylindrische respektive hoch aufragende Signalleuchten realisieren, die mit einem schlanken lang erstreckten Gehäuse ausgerüstet sind. Hier will die Erfindung insgesamt Abhilfe schaffen.Due to the fact that, in the prior art, the printed circuit board with the LEDs located thereon is or must be arranged directly on the cooling block, the possible embodiments of the signal light are limited. In particular, this hardly barely cylindrical or towering signal lights can be realized, which are equipped with a slim long extended housing. Here, the invention aims to provide a total remedy.
Der Erfindung liegt die technische Problemstellung zugrunde, eine derartige elektrische Schaltungsanordnung so weiter zu entwickeln, dass Bauartbeschränkungen nicht mehr beobachtet werden und eine kostengünstige Ausführungsform vorliegt.The technical problem underlying the invention is to further develop such an electrical circuit arrangement that design limitations are no longer observed and a cost-effective embodiment is present.
Zur Lösung dieser technischen Problemstellung schlägt die Erfindung bei einer gattungsgemäßen elektrischen Schaltungsanordnung vor, dass die Kühleinrichtung zumindest zweiteilig mit Kühlkörper und wenigstens einem Wärmerohr ausgebildet ist, wobei das Wärmerohr die Leiterplatte thermisch mit dem hieran entfernt angeordneten Kühlkörper verbindet. - Tatsächlich werden von dem wenigstens einen Wärmerohr üblicherweise Distanzen von einigen cm oder mehreren 10 cm überbrückt.To solve this technical problem, the invention proposes in a generic electrical circuit arrangement that the cooling device is formed at least in two parts with heat sink and at least one heat pipe, wherein the heat pipe thermally connects the circuit board with the heatsink remote therefrom. In fact, distances of a few cm or several tens of cm are usually bridged by the at least one heat pipe.
Erfindungsgemäß kommt also zumindest ein Wärmerohr bzw. eine so genannte "Heatpipe" zum Einsatz, welche respektive welches die Leiterplatte mit dem darauf angeordneten elektrischen Bauteil thermisch mit dem Kühlkörper verbindet. Hierdurch fungiert der Kühlkörper als Wärmesenke und etwaige Verlustwärme des elektrischen Bauteils wird über die aus wärmeleitendem Material gefertigte Leiterplatte und das Wärmerohr schließlich an den hiermit wärmeleitend verbundenen Kühlkörper weitergeleitet sowie dort meistens auf eine relativ große Fläche verteilt an die Umgebungsluft abgegeben. Bei dem eingesetzten Wärmerohr handelt es sich um einen Wärmeübertrager, welcher meistens unter Nutzung von Verdampfungswärme eines im Wärmerohr aufgenommenen Wärmeträgermediums eine hohe Wärmestromdichte zur Verfügung stellt. Bei dem Wärmeträgermedium oder auch Arbeitsmedium kann es sich um Wasser handeln, das im Innern der meistens hermetisch gekapselt ausgebildeten Wärmerohre aufgenommen wird.Thus, according to the invention, at least one heat pipe or a so-called "heat pipe" is used, which respectively thermally connects the printed circuit board with the electrical component arranged thereon to the heat sink. As a result, the heat sink acts as a heat sink and any heat loss of the electrical component is on the thermally conductive Material manufactured circuit board and the heat pipe finally forwarded to the hereby heat-conducting connected heat sink and distributed there usually distributed over a relatively large area to the ambient air. In the heat pipe used is a heat exchanger, which usually provides a high heat flux density available by using heat of vaporization of a heat transfer medium received in the heat pipe. In the heat transfer medium or working medium may be water, which is received in the interior of the mostly hermetically encapsulated heat pipes.
Kommt es nun zu einem Wärmeeintrag beispielsweise im Bereich der Leiterplatte, so beginnt das Wärmeübertragungsmedium bzw. Arbeitsmedium zu verdampfen. Der entstehende Dampf strömt in Richtung der Wärmesenke bzw. des Kühlkörpers, wo er wegen dessen niedrigerer Temperatur kondensiert. Hierbei wird die zuvor aufgenommene Wärme (Verlustwärme des auf der Leiterplatte angeordneten elektrischen Bauteils) wieder abgegeben. Das nun (erneut) flüssige Arbeitsmedium kehrt in der Regel durch Schwerkraft bzw. im Fall einer Heatpipe durch Kapillarkraft wieder zurück zum Ort des Wärmeeintrages bzw. verteilt sich im Innern des Wärmerohres.If there is now a heat input, for example in the region of the printed circuit board, then the heat transfer medium or working medium begins to evaporate. The resulting vapor flows in the direction of the heat sink or the heat sink, where it condenses because of its lower temperature. Here, the previously recorded heat (heat loss of the arranged on the circuit board electrical component) is released again. The now (again) liquid working medium usually returns by gravity or in the case of a heat pipe by capillary force back to the place of heat input or distributed in the interior of the heat pipe.
Innerhalb von Heatpipes bzw. Wärmerohren wird die Flüssigkeit oder allgemein das Arbeitsmedium mit Hilfe der bereits angesprochenen Kapillaren zum Ort des Wärmeeintrags zurückgeführt. Folglich kann das kondensierte Arbeitsmedium lagerunabhängig in der Kapillare zurückfließen. Auf diese Weise sind Wärmerohre bzw. Heatpipes in der Lage, auch in Schwerelosigkeit und insbesondere unabhängig von der Einbaulage arbeiten zu können. Meistens sind die Kapillaren in einer Art Docht im Innern des Wärmerohres ausgebildet, wohingegen der den Docht umgebene und/oder im Innern befindliche Raum für die Dampfführung genutzt wird. Bevor das erforderliche Arbeitsmedium in das Wärmerohr eingefüllt wird, ist es in der Regel erforderlich, die Heatpipe mechanisch zu evakuieren. Da vorliegend primär der Temperaturbereich zwischen ca. 0 0C und 100 0C abgedeckt wird, bietet sich Wasser als Wärmeträgermedium bzw. Arbeitsmedium an. Außerdem kommt für die Herstellung des Wärmerohres bzw. der Heatpipe meistens Kupfer zum Einsatz, da sich dieses leicht umformen lässt und zudem über eine hohe Wärmeleitfähigkeit verfügt. Solche Wärmerohre bzw. Heatpipes sind heutzutage in verschiedenen Längen kommerziell verfügbar.Within heatpipes or heat pipes, the liquid or, in general, the working medium is returned to the location of the heat input with the aid of the already mentioned capillaries. Consequently, the condensed working medium can flow back into the capillary independently of storage. In this way, heat pipes or heat pipes are able to work in weightlessness and in particular regardless of the installation position. In most cases, the capillaries are formed in a kind of wick inside the heat pipe, whereas the space surrounding the wick and / or inside is used for steam guidance. Before the required working fluid is introduced into the heat pipe, it is usually necessary to mechanically evacuate the heat pipe. Since in the present case the temperature range between about 0 0 C and 100 0 C is primarily covered, water is suitable as a heat transfer medium or working medium. In addition, copper is usually used for the production of the heat pipe or the heat pipe, since this can be easily shaped and also has a high thermal conductivity. Such heat pipes or heatpipes are commercially available today in various lengths.
Es hat sich bewährt, wenn der letztendlich die Wärmesenke darstellende Kühlkörper zugleich als Befestigungsflansch für die beschriebene elektrische Schaltungsanordnung im Ganzen ausgebildet ist. Dadurch wird ein gleichsam zweifacher Nutzen zur Verfügung gestellt. Denn ein die elektrische Schaltungsanordnung aufnehmendes Gehäuse ist in der Regel aus Kunststoff gefertigt, eignet sich folglich kaum für die unmittelbare Anbringung an einer Wand, einer Decke einem Gehäuse etc.. Hier kommt vielmehr der zugleich als Befestigungsflansch ausgestaltete Kühlkörper zum Einsatz, welcher die notwendige mechanische Stabilität für die Halterung der elektrischen Schaltungsanordnung zur Verfügung stellt.It has proven useful if the heat sink ultimately representing heat sink is also formed at the same time as a mounting flange for the described electrical circuit arrangement as a whole. This provides a dual benefit as it were. For a housing receiving the electrical circuitry is usually made of plastic, is therefore hardly suitable for immediate attachment to a wall, a ceiling a housing, etc. Here, rather, the same time designed as a mounting flange heat sink is used, which provides the necessary mechanical Stability for the mounting of the electrical circuit arrangement provides.
Dies umso mehr, als der Befestigungsflansch respektive Kühlkörper nach vorteilhafter Ausgestaltung mit zusätzlichen Kühlrippen ausgerüstet ist, die zugleich seine Stabilität erhöhen, in jedem Fall aber die Oberfläche vergrößern und damit die Wärmeübertragung an die Umgebung verstärken. Zusätzlich mag der Kühlkörper mit einer Kältequelle ausgerüstet werden, bei welcher es sich beispielhaft um ein Peltier-Element handeln kann. Diese ergänzende Kältequelle kommt meistens dann zum Einsatz, wenn die Wärmeabfuhr durch die Wärmesenke bzw. den Kühlkörper im Anwendungsfall nicht ausreichend ist.All the more so, since the mounting flange or heat sink is equipped according to an advantageous embodiment with additional cooling fins, which at the same time increase its stability, but in any case increase the surface and thus enhance the heat transfer to the environment. In addition, the heat sink may be equipped with a cold source, which may be an example of a Peltier element. This additional source of cold is usually used when the heat dissipation through the heat sink or the heat sink in the application is not sufficient.
Die aus einem wärmeleitenden Material hergestellte Leiterplatte wird in der Regel von einem Gehäuseeinsatz getragen, der seinerseits mit dem bereits angesprochenen Gehäuse mechanisch verbunden ist. Aus Kostengründen ist das Gehäuse vorliegend aus Kunststoff hergestellt und wird meistens mit einer Vergussmasse gefüllt, um die erforderliche explosionsgeschützte Ausgestaltung zur Verfügung zu stellen. Tatsächlich verhindert die Vergussmasse unter anderem, dass frei liegende Kontakte ein zündfähiges Gemisch zur Explosion bringen oder eine solche durch Funkenbildung entsteht. Bei der Vergussmasse handelt es sich wie üblich um einen isolierenden Kunststoff, welcher in das Gehäuse in der Regel in Überkopfsteilung in (zäh)flüssigem Zustand eingefüllt wird und danach aushärtet.The printed circuit board made of a thermally conductive material is usually carried by a housing insert, in turn, with the already addressed housing is mechanically connected. For cost reasons, the housing is made in the present case of plastic and is usually filled with a potting compound to provide the required explosion-proof design available. In fact, among other things, the potting compound prevents exposed contacts from causing an ignitable mixture to explode or from sparking. The potting compound is, as usual, an insulating plastic, which is filled into the housing usually in overhead division in (tough) liquid state and then cured.
Dabei wird man meistens mit unterschiedlichen Vergussmassen arbeiten. Dies lässt sich darauf zurückführen, dass das Gehäuse regelmäßig wenigstens zweiteilig mit opakem Grundkörper und durchsichtiger Signalhaube ausgebildet ist. Als Folge hiervon ist die Vergussmasse im Bereich der Signalhaube regel- mäßig transparent gestaltet, wohingegen ansonsten eine trübe oder undurchsichtige Vergussmasse zum Einsatz kommt.You will usually work with different potting compounds. This can be attributed to the fact that the housing is regularly formed at least in two parts with an opaque base body and a transparent signal hood. As a result, the potting compound in the area of the signal hood is designed to be regularly transparent, whereas otherwise a cloudy or opaque potting compound is used.
Die Signalhaube und der Grundkörper sind meistens lediglich durch eine Steckverbindung miteinander vereinigt. Sobald nun die Vergussmasse in Überkopf- Stellung in das Gehäuse eingefüllt wird und ausgehärtet ist, sorgt sie dafür, dass die beiden Gehäuseteile (Grundkörper und Signalhaube) unverlierbar miteinander gekoppelt sind. Zur weiteren Stabilität trägt auch der Umstand bei, dass der die Leiterplatte tragende Gehäuseeinsatz regelmäßig mit dem Gehäuse verbunden ist und selbstverständlich dann auch mit der ausgehärteten Vergussmasse.The signal hood and the main body are usually united together only by a plug connection. As soon as the potting compound is filled into the housing in the overhead position and cured, it ensures that the two housing parts (main body and signal hood) are captively coupled together. To further stability also contributes to the fact that the housing insert carrying the circuit board is regularly connected to the housing and of course then with the cured potting compound.
Gegenstand der Erfindung ist auch eine Baueinheit, die sich aus einer elektrischen Schaltungsanordnung der beschriebenen Art zusammensetzt und zusätzlich mit einem Adapter ausgerüstet ist. Dieser Adapter sorgt dafür bzw. stellt sicher, dass über eine gemeinsame Zuleitung und den Adapter nicht nur eine elektrische Schaltungsanordnung, sondern beispielsweise auch zwei oder noch mehr versorgt werden können. So ist es denkbar, eine Signalleuchte mit einem Signallautsprecher zu kombinieren oder auch zwei Signalleuchten untereinander respektive zwei Signallautsprecher. Das hängt davon ab, welche Wichtigkeit dem Aufmerksamkeitssignal im auszurüstenden Warnbereich zukommt.The invention is also a structural unit, which is composed of an electrical circuit arrangement of the type described and is additionally equipped with an adapter. This adapter ensures or ensures that via a common supply line and the adapter not only an electrical circuit, but for example, two or even more can be supplied. So it is conceivable to combine a signal light with a signal speaker or two signal lights each other respectively two signal speakers. That depends on the importance of the attention signal in the warning area to be equipped.
Im Ergebnis werden eine elektrische Schaltungsanordnung und eine Baueinheit aus der elektrischen Schaltungsanordnung und dem Adapter zur Verfügung gestellt, die sich zunächst einmal durch die gleichsam unbegrenzte Gestal- tungsvielfalt des Gehäuses und insbesondere der Anordnung des Leuchtmittels bzw. des von der Leiterplatte getragenen elektrischen Bauteils und der zugehörigen Kühleinrichtung auszeichnen. Das erreicht die Erfindung dadurch, dass das Verlustwärme produzierende elektrische Bauteil über die sie tragende Leiterplatte und ein oder mehrere Wärmerohre mit dem Kühlkörper verbunden ist.As a result, an electrical circuit arrangement and a structural unit of the electrical circuit arrangement and the adapter are made available, which first of all by the almost unlimited variety of design of the housing and in particular the arrangement of the light source or of the printed circuit board carried by the electrical component and the Distinguish the associated cooling device. This is achieved by the invention in that the loss-heat-producing electrical component is connected to the heat sink via the printed circuit board carrying it and one or more heat pipes.
Dieser Kühlkörper ist vorteilhaft in einer Gehäuseausnehmung angeordnet, folglich in Wärmekontakt mit der Umgebung. Das gilt auch und insbesondere für den Fall, dass das Gehäuse ganz oder überwiegend aus Kunststoff hergestellt ist. Weil der Kühlkörper zugleich den Befestigungsflansch für die Schaltungsanordnung im Ganzen repräsentiert, wird ein praktisch zweifacher Nutzen zur Verfügung gestellt. Außerdem kann ggf. eine Grundfläche als zusätzliche Wärmesenke genutzt werden, an welcher der Kühlkörper bzw. Befestigungsflansch fixiert wird. Denn bei dieser Grundfläche oder Basis mag es sich um ein (metallenes) Maschinengehäuse oder dergleichen handeln. Für eine zusätzliche Oberflächenvergrößerung des Kühlkörpers bzw. Befestigungsflansches mögen ergänzende Kühlrippen sorgen oder auch eine optionale Kältequelle.This heat sink is advantageously arranged in a housing recess, thus in thermal contact with the environment. This also applies and in particular for the case that the housing is made entirely or predominantly of plastic. Because the heat sink also represents the mounting flange for the circuit as a whole, a practical dual benefit is provided. In addition, if necessary, a base can be used as an additional heat sink to which the heat sink or mounting flange is fixed. For this base area or base may be a (metal) machine housing or the like. For an additional increase in surface area of the heat sink or mounting flange may provide additional cooling fins or an optional source of cold.
Insgesamt lässt sich die beschriebene elektrische Schaltungsanordnung von der Form des Gehäuses her beliebig gestalten, zumal das Gehäuse meistens als preisgünstiges Kunststoffspritzgussteil ausgebildet ist. Dennoch wird die erforderliche explosionsgeschützte Ausrüstung zur Verfügung gestellt, wofür nicht nur die zuverlässige Abfuhr der entstehenden Verlustwärme im Innern sorgt, sondern zusätzlich auch die Tatsache, dass das Innere des Gehäuses mit einer Vergussmasse gefüllt wird. Dieser Vergussmasse kommt ebenfalls zweifache Funktion zu. Sie sorgt nicht nur dafür, dass elektrische Leitungen oder auch das auf der Leiterplatte aufgenommene elektrische Bauteil hermetisch versiegelt sind, sondern stellt zugleich sicher, dass die beiden Gehäuseteile (Grundkörper und Signalhaube) einwandfrei miteinander verbunden werden, und zwar ohne dass an dieser Stelle ergänzende Befestigungsmittel erforderlich wären. Hierin sind die wesentlichen Vorteile zu sehen.Overall, the described electrical circuit arrangement of the shape of the housing can be arbitrarily designed, especially since the housing is usually designed as a low-priced plastic injection molded part. Nevertheless, the required explosion-proof equipment is provided, which not only ensures the reliable dissipation of the resulting heat loss inside, but also the fact that the interior of the housing is filled with a potting compound. This potting compound also has a dual function. It not only ensures that electrical cables or the electrical component accommodated on the printed circuit board are hermetically sealed, but at the same time ensures that the two housing parts (main body and signal hood) are perfectly connected to each other, without additional fastening means at this point would be required. Here are the main benefits.
Im Folgenden wird die Erfindung anhand einer lediglich ein Ausführungsbeispiel darstellenden Zeichnung näher erläutert; es zeigenIn the following the invention will be explained in more detail with reference to a drawing showing only one exemplary embodiment; show it
Fig. 1 und 2 zwei jeweilige Längsschnitte durch eine elektrische Schaltungsanordnung und1 and 2 two respective longitudinal sections through an electrical circuit arrangement and
Fig. 3 eine Baueinheit aus einer abgewandelten elektrischen Schaltungsanordnung und einem zugehörigen Adapter.Fig. 3 shows a structural unit of a modified electrical circuit arrangement and an associated adapter.
In den Figuren ist eine elektrische Schaltungsanordnung dargestellt, die zum Einsatz in explosionsgefährdeten Bereichen dient. Bei der elektrischen Schaltungsanordnung handelt es sich um eine Signal-Schaltungsanordnung, im vorliegenden Fall eine Signalleuchte. Zum grundsätzlichen Aufbau der Schal- tungsanordnung respektive Signalleuchte gehören ein bzw. mehrere elektrische Bauteile 1 , bei denen es sich jeweils um LED's 1 handelt. Diese Bauteile 1 bzw. LED's 1 werden auf einer aus einem wärmeleitenden Material gefertigten Leiterplatte 2 aufgenommen. Die Leiterplatte 2 ist im Ausführungsbeispiel aus einem Metall, insbesondere Aluminium, hergestellt. Bei den LED's 1 handelt es sich um SMD-LED's L Anhand einer vergleichenden Betrachtung der Fig. 1 und 2 erkennt man, dass die LED's bzw. Leuchtmittel 1 kreisförmig im Vergleich zu einer zentralen Achse A eines Gehäuses 3 angeordnet sind. Gegenüber dieser Achse A ist das Gehäuse 3 rotationssymmetrisch ausgeführt. Auf diese Weise wird das von den LED's bzw. Leuchtmitteln 1 abgestrahlte Licht in sämtliche Raumrichtungen ausgestrahlt, so dass eine Rundum-Lichtabstrahlung gewährleistet ist.In the figures, an electrical circuit arrangement is shown, which is used for use in potentially explosive areas. The electrical circuit arrangement is a signal circuit arrangement, in the present case a signal light. The basic structure of the circuit arrangement or signal light includes one or more electrical components 1, each of which is LED 1. These components 1 and LED's 1 are received on a printed circuit board 2 made of a thermally conductive material. The circuit board 2 is made in the embodiment of a metal, in particular aluminum. The LEDs 1 are SMD LEDs L On the basis of a comparative examination of FIGS. 1 and 2, it can be seen that the LEDs or lighting means 1 are arranged in a circle in comparison to a central axis A of a housing 3. Opposite this axis A, the housing 3 is rotationally symmetrical. In this way, the light emitted by the LEDs or light sources 1 is emitted in all spatial directions, so that an all-round light emission is ensured.
Die jeweilige Leiterplatte 2 wird von einem Gehäuseeinsatz 4 getragen, der seinerseits mit dem Gehäuse 3 mechanisch verbunden ist. Der Gehäuseeinsatz 4 setzt sich aus einem Einsatzfuß 4a und einem Einsatzkopf 4b zusammen, wobei der Einsatzkopf 4b im Querschnitt als Vieleck mit Seitenflächen 4c ausgerüstet ist, die jeweils eine Leiterplatte 2 tragen. Dazu ist die jeweilige Leiterplatte 2 mit Hilfe einer oder durch Rückgriff auf mehrere Schrauben 5 mit dem Einsatzkopf 4b verbunden.The respective printed circuit board 2 is supported by a housing insert 4, which in turn is mechanically connected to the housing 3. The housing insert 4 is composed of an insert foot 4a and an insert head 4b, wherein the insert head 4b is equipped in cross-section as a polygon with side surfaces 4c, which each carry a printed circuit board 2. For this purpose, the respective printed circuit board 2 is connected to the insert head 4b by means of or by resorting to a plurality of screws 5.
Mit der Leiterplatte 2 steht eine Kühleinrichtung 6, 7 in Wärmekontakt, die man am besten in der Schnittdarstellung nach den Fig. 1 und 3 erkennt. Erfindungsgemäß setzt sich diese Kühleinrichtung 6, 7 aus einem Wärmerohr 6 und einem Kühlkörper 7 zusammen. Das Wärmerohr 6 verbindet die jeweilige Leiterplatte 2 thermisch mit dem hiervon räumlich entfernt angeordneten Kühlkörper 7. Zu diesem Zweck wird das Wärmerohr 6 im Ausführungsbeispiel zentral im Einsatzkopf 4b des Gehäuseeinsatzes 4 aufgenommen.With the circuit board 2 is a cooling device 6, 7 in thermal contact, which is best seen in the sectional view of FIGS. 1 and 3. According to the invention, this cooling device 6, 7 is composed of a heat pipe 6 and a heat sink 7. The heat pipe 6 thermally connects the respective printed circuit board 2 to the cooling body 7 arranged spatially remote therefrom. For this purpose, the heat pipe 6 is centrally accommodated in the operating head 4b of the housing insert 4 in the exemplary embodiment.
Wie man anhand der Fig. 1 und 3 erkennt, ist der fragliche Einsatzkopf 4b massiv und aus Metall (Aluminium) hergestellt und mit einer Hohlbohrung 8 ausgerüstet, die in ihrem Innern ein Ende des Wärmerohres 6 aufnimmt. Über diese Hohlbohrung 8 findet der eingangs bereits beschriebene Wärmeintrag in das Wärmerohr 6 statt. Auch der Kühlkörper 7 ist mit einer Hohlbohrung 9 ausgerüstet, wobei die Hohlbohrung 9 in Verbindung mit dem Kühlkörper 7 die zuvor bereits beschriebene Wärmesenke darstellt. Folglich fließt von den LED's 1 produzierte Verlustwärme über den Einsatzkopf 4b, das Wärmerohr 6 schließlich zum Kühlkörper 7, der als Wärmesenke fungiert.As can be seen with reference to FIGS. 1 and 3, the insert head 4b in question is solid and made of metal (aluminum) and equipped with a hollow bore 8 which receives one end of the heat pipe 6 in its interior. About this hollow bore 8 takes place at the beginning already described heat input into the heat pipe 6. Also, the heat sink 7 is equipped with a hollow bore 9, wherein the hollow bore 9 in conjunction with the heat sink 7 is the previously described heat sink. Consequently flows from the LEDs 1 produced heat loss via the insert head 4b, the heat pipe 6 finally to the heat sink 7, which acts as a heat sink.
Weil das Wärmerohr 6 als Kupferrohr mit im Innern in einer Kapselung einge- schlossenem Wärmeträgermedium, insbesondere Wasser, ausgerüstet ist, lässt sich das Wärmerohr 6 problemlos biegen und an die topologischen Gegebenheiten im Innern des Gehäuses 3 unschwer anpassen. Etwaige Verlustwärme der LED's 1 wird über die zugehörige Leiterplatte 2 aufgenommen, weil das elektrische Bauteil bzw. die LED 1 im Beispielfall auf der Leiterplatte 2 unter Zwischenschaltung einer Wärmeleitpaste oder dergleichen angebracht ist. Von der Leiterplatte 2 wird die Wärme an den Einsatzkopf 4b des Gehäuseeinsatzes 4 weitergeleitet, der ebenfalls aus einem wärmeleitenden Material (Metall) gefertigt ist. Mit dem Einsatzkopf 4b steht ein Ende des Wärmerohres 6 in Wärmekontakt.Because the heat pipe 6 is equipped as a copper pipe with a heat transfer medium, in particular water, enclosed in an encapsulation, the heat pipe 6 can be easily bent and easily adapted to the topological conditions in the interior of the housing 3. Any heat loss of the LEDs 1 is received via the associated circuit board 2, because the electrical component or the LED 1 is mounted in the example on the circuit board 2 with the interposition of a thermal paste or the like. From the circuit board 2, the heat is transmitted to the insert head 4b of the housing insert 4, which is also made of a thermally conductive material (metal). With the insert head 4b is one end of the heat pipe 6 in thermal contact.
Im Innern des Wärmerohres 6 wird nun die entstehende Verlustwärme in latente Wärme umgewandelt und zur Wärmesenke in Gestalt des Kühlkörpers 7 transportiert. Da der Kühlkörper 7 zugleich als Befestigungsflansch 7 für die Schaltungsanordnung respektive das Gehäuse 3 im Ganzen ausgestaltet ist, wird die solchermaßen transportierte Wärme auf eine große Fläche verteilt. Dies gilt erst recht für den Fall, dass der Kühlkörper 7 mit ergänzenden und nicht ausdrücklich dargestellten Kühlrippen ausgerüstet ist. Auch eine zusätzliche Kältequelle in Gestalt eines Peltier-Elementes kann hier zum Einsatz kommen, was jedoch ebenfalls nicht gezeigt ist.In the interior of the heat pipe 6, the resulting heat loss is now converted into latent heat and transported to the heat sink in the form of the heat sink 7. Since the heat sink 7 is at the same time designed as a mounting flange 7 for the circuit arrangement or the housing 3 as a whole, the heat thus transported is distributed over a large area. This applies even more in the event that the heat sink 7 is equipped with supplementary and not explicitly shown cooling fins. Also, an additional source of cold in the form of a Peltier element can be used here, but this is also not shown.
Man erkennt, dass der Kühlkörper 7 in einer Gehäuseausnehmung 10 platziert ist. Dadurch befindet sich der Kühlkörper 7 unmittelbar in Wärmekontakt mit der Umgebungsatmosphäre. Das ist vor dem Hintergrund von besonderer Bedeutung, als das Gehäuse 3 im Ausführungsbeispiel aus Kunststoff hergestellt ist, folglich über eine schlechte Wärmeleitfähigkeit verfügt. - Jedenfalls wird die Verlustwärme von den LED's 1 letztlich über den in der Gehäuseöffnung 10 platzierten Kühlkörper 7 an die Umgebungsluft respektive Umgebungsatmosphäre abgegeben.It can be seen that the heat sink 7 is placed in a housing recess 10. As a result, the heat sink 7 is directly in thermal contact with the ambient atmosphere. This is of particular importance, as the housing 3 is made of plastic in the exemplary embodiment, thus has a poor thermal conductivity. In any case, the heat loss from the LED's 1 ultimately over that in the housing opening 10th placed heat sink 7 delivered to the ambient air respectively ambient atmosphere.
Das Gehäuse 3 ist vorliegend im Wesentlichen zweiteilig und zylindrisch mit einem opaken Grundkörper 3a und einer durchsichtigen Signalhaube 3b ausgebildet. Infolge der transparenten Signalhaube 3b kann das von den LED's 1 abgegebene Licht rundum problemlos abgestrahlt werden und sorgt für die gewünschte Signalwirkung. Hierzu trägt ergänzend der Umstand bei, dass das Gehäuse 3 mit einer Vergussmasse 11a, 11 b im Innern gefüllt ist. Diese Ver- gussmasse 11a, 11b wird in Überkopfsteilung des Gehäuses 3 und selbstverständlich bei montiertem Gehäuseeinsatz 4, angebrachten LED's 1 und ebenfalls realisierter Kühleinrichtung 6, 7 in zähflüssigem Zustand eingefüllt. Zuvor sind der opake Grundkörper 3a und die durchsichtige Signalhaube 3b über jeweilige Rastverbindungen 12 miteinander gekoppelt worden oder gehen eine gegenseitige Steckverbindung ein. Sobald die Vergussmasse 11a, 11b aushärtet, sind die durchsichtige Signalhaube 3b und der Grundkörper 3a unverlierbar miteinander gekoppelt.In the present case, the housing 3 is formed essentially in two parts and cylindrically with an opaque main body 3a and a transparent signal hood 3b. As a result of the transparent signal hood 3b, the light emitted by the LEDs 1 light can be radiated all around easily and provides the desired signal effect. To this end, the circumstance contributes to the fact that the housing 3 is filled with a potting compound 11a, 11b in the interior. This casting compound 11a, 11b is filled in a viscous state in the overhead division of the housing 3 and, of course, when the housing insert 4 is mounted, LED's 1 mounted thereon and likewise realized cooling device 6, 7. Previously, the opaque main body 3a and the transparent signal cap 3b have been coupled to each other via respective snap-in connections 12 or enter into a mutual plug connection. As soon as the potting compound 11a, 11b hardens, the transparent signal cap 3b and the base body 3a are captively coupled together.
Bei der Vergussmasse 11a handelt es sich um eine transparente Verguss- masse, die im Bereich der Signalhaube 3b das Innere des Gehäuses 3 ausfüllt. Unterhalb des mit Hilfe der transparenten Vergussmasse 11a ausgefüllten Raumes findet sich die trübe oder undurchsichtige weitere Vergussmasse 11 b. Beide Vergussmassen 11a, 11 b werden nacheinander in das Gehäuse 3 eingefüllt, und zwar zunächst die transparente Vergussmasse 11a und danach die undurchsichtige Vergussmasse 11b.The potting compound 11 a is a transparent potting compound which fills the interior of the housing 3 in the region of the signal hood 3 b. Below the filled with the aid of the transparent potting compound 11 a space is the cloudy or opaque further potting compound 11 b. Both potting compounds 11a, 11b are successively filled into the housing 3, first the transparent potting compound 11a and then the opaque potting compound 11b.
Schließlich stellt die Fig. 3 eine Baueinheit aus der bereits beschriebenen elektrischen Schaltungsanordnung respektive der Signalleuchte und einem Adapter 13 dar. Dieser Adapter 13 ist mit einem Anschlussflansch 14 ausgerüstet, an welchem eine weitere Signalleuchte oder auch ein Signallautsprecher angeordnet werden können. Über den Adapter 13 werden beide elektrischen Schaltungsanordnungen gemeinsam mit der erforderlichen elektrischen Energie versorgt. Man erkennt, dass die beiden elektrischen Schaltungsanordnungen im Ausführungsbeispiel rechtwinklig zueinander angeordnet sind, was selbstverständlich keine zwingende Eigenschaft darstellt. Finally, Fig. 3 shows a structural unit of the already described electrical circuitry respectively the signal light and an adapter 13. This adapter 13 is equipped with a flange 14, to which a further signal light or a signal speaker can be arranged. About the adapter 13 are both electrical Circuit arrangements supplied together with the required electrical energy. It can be seen that the two electrical circuit arrangements are arranged at right angles to each other in the embodiment, which of course is not a mandatory feature.

Claims

Patentansprüche: claims:
1. Elektrische Schaltungsanordnung, insbesondere elektrische Signal-Schaltungsanordnung, vorzugsweise Signalleuchte, zum Einsatz in explosions- gefährdeten Bereichen, mit wenigstens einem auf einer aus einem wärmeleitenden Material gefertigten Leiterplatte (2) angeordneten elektrischen Bauteil (1 ), insbesondere Leuchtmittel (1 ), und mit einer mit der Leiterplatte (2) in Wärmekontakt stehenden Kühleinrichtung (6, 7), d a d u r c h g e k e n n z e i c h n e t, dass die Kühleinrichtung (6, 7) zumindest zweiteilig mit Kühlkörper (7) und wenigstens einem Wärmerohr (6) ausgebildet ist, wobei das Wärmerohr (6) die Leiterplatte (2) thermisch mit dem Kühlkörper (7) verbindet.1. Electrical circuit arrangement, in particular electrical signal circuit arrangement, preferably signal light, for use in potentially explosive areas, with at least one on a made of a thermally conductive material printed circuit board (2) arranged electrical component (1), in particular light source (1), and with a cooling device (6, 7) in thermal contact with the printed circuit board (2), characterized in that the cooling device (6, 7) is formed at least in two parts with heat sink (7) and at least one heat pipe (6), wherein the heat pipe (6 ) thermally connects the printed circuit board (2) with the heat sink (7).
2. Elektrische Schaltungsanordnung nach Anspruch 1 , dadurch gekennzeichnet, dass der Kühlkörper (7) zugleich als Befestigungsflansch (7) für die Schal- tungsanordnung insgesamt ausgebildet ist.2. Electrical circuit arrangement according to claim 1, characterized in that the cooling body (7) at the same time as a mounting flange (7) for the circuit arrangement is formed overall.
3. Elektrische Schaltungsanordnung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Kühlkörper (7) mit zusätzlichen Kühlrippen oder einer Kältequelle, beispielsweise einem Peltier-Element, ausgerüstet ist.3. Electrical circuit arrangement according to claim 1 or 2, characterized in that the cooling body (7) is equipped with additional cooling fins or a cold source, for example a Peltier element.
4. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass die Leiterplatte (2) von einem Gehäuseeinsatz (4) getragen wird.4. Electrical circuit arrangement according to one of claims 1 to 3, characterized in that the printed circuit board (2) by a housing insert (4) is supported.
5. Elektrische Schaltungsanordnung nach Anspruch 4, dadurch gekennzeichnet, dass der Gehäuseeinsatz (4) mit einem Gehäuse (3) verbunden ist.5. Electrical circuit arrangement according to claim 4, characterized in that the housing insert (4) with a housing (3) is connected.
6. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass das Gehäuse (3) aus Kunststoff hergestellt ist. 6. Electrical circuit arrangement according to one of claims 1 to 5, characterized in that the housing (3) is made of plastic.
7. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass der Kühlkörper (7) in einer Gehäuseaus- nehmung (10) angeordnet ist.7. Electrical circuit arrangement according to one of claims 1 to 6, characterized in that the cooling body (7) in a housing recess (10) is arranged.
8. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass das Innere des Gehäuses (3) mit einer Vergussmasse (11a, 11 b) gefüllt ist.8. Electrical circuit arrangement according to one of claims 1 to 7, characterized in that the interior of the housing (3) with a potting compound (11 a, 11 b) is filled.
9. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass das Gehäuse (3) wenigstens zweiteilig mit opakem Grundkörper (3a) und durchsichtiger Signalhaube (3b) ausgebildet ist.9. Electrical circuit arrangement according to one of claims 1 to 8, characterized in that the housing (3) is formed at least in two parts with opaque base body (3a) and transparent signal cap (3b).
10. Elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Vergussmasse (11a, 11 b) unterschiedlich transparent gestaltet ist und im Bereich der Signalhaube (3b) transparent und ansonsten trüb oder undurchsichtig ausgebildet ist.10. Electrical circuit arrangement according to one of claims 1 to 9, characterized in that the potting compound (11a, 11b) is designed differently transparent and in the region of the signal hood (3b) is transparent and otherwise opaque or opaque.
11. Baueinheit aus einer elektrischen Schaltungsanordnung nach einem der Ansprüche 1 bis 10 und einem Adapter (13).11. An assembly of an electrical circuit arrangement according to one of claims 1 to 10 and an adapter (13).
12. Baueinheit nach Anspruch 11 , dadurch gekennzeichnet, dass der Adapter (13) wenigstens einen Anschlussflansch (14) für eine weitere elektrische Schaltungsanordnung nach einem der Ansprüche 1 bis 10 aufweist. 12. Assembly according to claim 11, characterized in that the adapter (13) has at least one connecting flange (14) for a further electrical circuit arrangement according to one of claims 1 to 10.
EP09777475A 2008-07-30 2009-07-28 Electrical circuit arrangement Not-in-force EP2318756B1 (en)

Applications Claiming Priority (2)

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DE202008010175U DE202008010175U1 (en) 2008-07-30 2008-07-30 Electrical circuit arrangement
PCT/EP2009/005442 WO2010012443A1 (en) 2008-07-30 2009-07-28 Electrical circuit arrangement

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EP2318756B1 EP2318756B1 (en) 2011-12-21

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US (1) US8740419B2 (en)
EP (1) EP2318756B1 (en)
CN (1) CN102112808A (en)
AT (1) ATE538345T1 (en)
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WO (1) WO2010012443A1 (en)

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ATE538345T1 (en) 2012-01-15
WO2010012443A1 (en) 2010-02-04
CN102112808A (en) 2011-06-29
EP2318756B1 (en) 2011-12-21
DE202008010175U1 (en) 2008-11-06
US8740419B2 (en) 2014-06-03
US20110176317A1 (en) 2011-07-21

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