EP2275738A2 - Cooling element for a semiconductor light source of a motor vehicle lighting device - Google Patents

Cooling element for a semiconductor light source of a motor vehicle lighting device Download PDF

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Publication number
EP2275738A2
EP2275738A2 EP10002907A EP10002907A EP2275738A2 EP 2275738 A2 EP2275738 A2 EP 2275738A2 EP 10002907 A EP10002907 A EP 10002907A EP 10002907 A EP10002907 A EP 10002907A EP 2275738 A2 EP2275738 A2 EP 2275738A2
Authority
EP
European Patent Office
Prior art keywords
casting
cooling element
heat sink
characterized
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10002907A
Other languages
German (de)
French (fr)
Other versions
EP2275738A3 (en
EP2275738B2 (en
EP2275738B1 (en
Inventor
Matthias Brendle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Automotive Lighting Reutlingen GmbH
Original Assignee
Automotive Lighting Reutlingen GmbH
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Filing date
Publication date
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Priority to DE102009033949A priority Critical patent/DE102009033949A1/en
Application filed by Automotive Lighting Reutlingen GmbH filed Critical Automotive Lighting Reutlingen GmbH
Publication of EP2275738A2 publication Critical patent/EP2275738A2/en
Publication of EP2275738A3 publication Critical patent/EP2275738A3/en
Publication of EP2275738B1 publication Critical patent/EP2275738B1/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42752280&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2275738(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The element (32) has a cooling body (38) provided for delivering heat to environment, and a flange plate (36) for thermal coupling of a semiconductor light source and for fastening the element to a lighting device of a motor vehicle. A composite part is made from a cast part and an insertion part that is inserted into a casting mold during casting of the cast part, where the flange plate is provided as the cast part and the cooling body is provided as the insertion part. The cooling body is made from aluminum, copper or magnesium alloy. An independent claim is also included for a method for manufacturing a cooling element for a for semiconductor light source of a motor vehicle.

Description

    description
  • The invention relates to a cooling element for a semiconductor light source of a lighting device of a motor vehicle according to the preamble of claim 1. Furthermore, the invention relates to a method for producing such a cooling element according to the preamble of the independent method claim.
  • Such a cooling element has a cooling body arranged for the release of heat to the environment and a flange plate designed for thermal coupling of the semiconductor light source and for fastening the cooling element to the illumination device.
  • Semiconductor light sources are currently increasing used in lighting devices of motor vehicles. After the use was initially limited to signal lights such as brake and turn signals, it is currently being begun to use semiconductor light sources for headlight functions, so for lighting the vehicle environment. An example of this is an LED headlamp for the Audi R8 (LED = Light Emitting Diode) supplied by the Applicant.
  • Unlike halogen or gas discharge lamps, LEDs emit cold light. The radiation itself thus contains no heat radiation components which would be comparable to the corresponding proportions of a halogen lamp or gas discharge lamp. Nevertheless, even when operating LEDs, losses of about 80% occur. This means that 80% of the electrical energy used for operation is released as heat loss and the LED heat up. This is problematic because important properties of LEDs such as their luminous flux, color, forward voltage and lifetime are highly temperature dependent. The temperature of the semiconductor light sources must therefore be within narrow, fixed limits by a predetermined thermal operating point. In particular, the LEDs must be protected against overheating.
  • Depending on the manufacturer, the maximum permissible chip temperature is between 125 ° C and 185 ° C. Exceeding the respective maximum temperature results in destruction of the LED. Since only about 20% of the electrical energy used is converted into light, headlamp heat losses occur, which can reach values between 20 watts and 40 watts.
  • To reliably dissipate these occurring in the LED chip loss heat outputs without impermissibly high LED temperatures To be able to use cooling concepts are applied, which provide in particular large-scale aluminum or copper cooling elements of the type mentioned above to absorb the heat loss through the flange plate and deliver to the environment via serving as heat sink ribs and other surface-enlarging structures.
  • Often, the cooling requirements are so high that the normal convective cooling is no longer sufficient and with a fan a constant cooling air flow must be enforced.
  • The heat sink used are predominantly aluminum heat sinks, which are produced optionally by the die casting, continuous casting or extrusion process.
  • Continuous casting and extruded heat sinks are used on the one hand because of the better thermal properties of the aluminum alloys available for these processes. On the other hand, these methods allow significantly finer structures, i. There are particularly high and thin cooling fins or cooling pins produced with which, because of their large surface, particularly effective heat sink with low thermal resistance can be represented at the same time compact design.
  • The disadvantage is that these methods are poorly suited to mold the usually required centering and fasteners with. In addition, these heatsinks often require a costly machining post-processing of individual functional surfaces, such as the connection surface for the LED.
  • On the other hand, heat sinks produced using the die-casting process enable particularly complex shapes. Thereby Functional elements and functional surfaces can be easily integrated, as fastening and centering elements can be easily molded.
  • In contrast, only relatively short and thick cooling fins can be produced in the die casting process, which suffers from the efficiency of the heat sinks. Furthermore, die-cast alloys have inferior thermal conductivity compared to continuous casting or extrusion alloys. Mostly, these heatsinks require much larger volumes compared to continuous casting or extrusion heatsinks.
  • Various attempts have been made to combine the advantages of die-cast and extruded parts or die-cast and continuous cast parts. In this case, continuous casting or extruded heat sinks were mounted on die-cast holding elements. In such mounting solutions, however, it is difficult to ensure a good thermal connection between the components to be joined: Even if the connecting surfaces are machined consuming on flatness in the range of 0.01 mm, the remaining air gaps and the associated thermal resistances are not large tolerable fluctuations.
  • Against this background, the object of the invention is to specify a cooling element of the type mentioned above, which combines the advantages of the die casting process - great freedom in shaping - with the advantages of extruded or continuously cast heat sinks - namely, low thermal resistances. With regard to the method aspects, the object of the invention is to specify a method for producing such a cooling element.
  • This object is achieved in each case with the features of the independent claims.
  • The invention is characterized in particular by the fact that the cooling element is a composite part of a casting and an inserted during casting of the casting in the mold insert, wherein the flange plate is the casting and the heat sink is the insert.
  • By inserted during casting of the casting in the mold insert of the inserted as an insert heat sink is encircled by the melt to be poured as a casting flange plate so that the casting shrinks on cooling on the insert and the insert thus encloses form-fitting. As a result, in particular a very good thermal connection between the two parts is ensured without disturbing air gaps which disadvantageously increase the thermal resistance.
  • The casting of the flange plate achieves the important advantages of the great freedom of design in the case of the flange plate. The use of the heat sink as an insert allows in particular the use of extruded or continuously cast heat sink. As a result, the invention combines the advantages of lower thermal resistances of a heat sink with the advantages of a large freedom of design in the flange without having to accept disadvantageous large thermal contact resistance between the flange and heat sink in purchasing.
  • The advantage of low thermal resistances is achieved, in particular, with an embodiment which extends through at least one by a continuous casting or Extruded molding produced heat sink made of an aluminum, copper or magnesium alloy.
  • Alternative embodiments of the cooling element with at least one magnesium die-cast heat sink have the advantage that lower wall thicknesses and thus more filigree cooling fins can be realized than in Al diecasting. In addition, the low density allows significant weight savings.
  • Heat sinks designed with stamping and bending technology have cost advantages, especially with large quantities. In addition, cooling elements with particularly small wall thicknesses (and weight) can be represented.
  • Since the complexity of the parts is significantly limited by the manufacturing process, it is particularly possible here to connect several heat sink elements by casting with the material of the flange plate to form a complex composite heat sink. A further preferred embodiment therefore provides a plurality of separate heat sinks, which are connected by the casting to a composite heat sink.
  • It is also preferred that the casting has molded functional surfaces during casting. This reduces the manufacturing effort and at the same time improves the heat transfer through the flange plate, since thermal contact resistance, which could occur through air gaps, can be avoided.
  • For a good heat dissipation from the power dissipation producing LED, it is particularly advantageous that the casting has a set up for thermal coupling of the semiconductor light source bearing surface as a molded functional surface.
  • It is also preferred that the composite part has during encapsulation of the insert with embedded metallic functional parts. By embedding these functional parts in particular a dimensionally accurate and firm mechanical connection of these parts is achieved with the flange plate. This applies in particular to centering elements and / or fastening elements for the semiconductor light source and / or for an optical element and / or for the attachment of the cooling element in the illumination device. Examples of such elements are screw and / or bearing bushes and / or at least centering pins and / or threaded studs and / or bearing pins as centering and / or as fasteners.
  • A particularly preferred refinement is characterized in that the heat sink has a heat sink carrier plate and a heat release side adapted to emit heat to the environment, with a surface which is enlarged by first structures (eg, by pins and / or ribs) and one for insertion in a mold of the casting arranged heat receiving side, wherein the heat receiving side of the heat sink has second surface-enlarging structures that are embedded in the casting.
  • As second surface-enlarging structures ribs, in particular dovetail-shaped profiled ribs, and / or pins and / or openings and / or outbreaks in the heat sink carrier plate are preferred, wherein the heat sink carrier plate on the set up for insertion into the mold of the casting Heat absorption side is arranged.
  • With regard to the method aspects of the invention, there is an advantage in that the production cost is lower than that for those on a continuous casting or extrusion press heatsink required effort for the machining of functional surfaces.
  • Further advantages will be apparent from the dependent claims, the description and the attached figures.
  • It is understood that the features mentioned above and those yet to be explained below can be used not only in the particular combination given, but also in other combinations or in isolation, without departing from the scope of the present invention.
  • drawings
  • Embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description. In each case, in schematic form:
  • FIG. 1
    a known die-cast cooling element;
    FIG. 2
    a plan view of a functional surface of an embodiment of the invention;
    FIG. 3
    a cross section through the subject of FIG. 2 ;
    FIG. 4
    an embodiment of a heat sink insert part; and
    FIG. 5
    a further embodiment of a heat sink insert.
  • In detail, the shows Fig. 1 a perspective view of a conventional die-cast cooling element 10 with cooling fins 12 and a flange plate 14. The flange plate 14 has molded fasteners such Screw-on eyes 16 and screw domes 18 and centering elements such as centering pins 20, 22 and a mounted semiconductor light source 24. The elements 16, 18, 20, 22, 24 are arranged on a functional surface 26. The semiconductor light source is an arrangement 28 of an LED or a plurality of LEDs, which is mounted on a base element 30 and is mechanically and thermally connected to the flange plate 14 of the cooling element 10 via the base element 30.
  • Due to its production as a one-piece produced in a single casting process die-cast cooling element 10, the molded-on cooling fins 12, which represent the heat sink of the known cooling element 10, inevitably made relatively coarse. In the presentation of the FIG. 1 this is expressed by the comparatively rough design of each individual cooling rib 12 and the comparatively small number of eight cooling ribs 12 given given dimensions of the cooling element 10.
  • FIG. 2 shows an embodiment of a cooling element 32 according to the invention in a plan view of a functional surface 26. In the plan view, the cooling element 32, not different from the known cooling element 10 and therefore has in particular those already in connection with the FIG. 1 explained functional surface 26 with molded fasteners in the form of screw-on eyes 16 and screw domes 18 and centering in the form of centering pins 20, 22 and a mounted with a base member 30 to the functional surface 26 semiconductor light source 24 with an LED array 28. The base element 30 is centered by the centering pins 22 in a predetermined position on the functional surface 26 and by fasteners 34, for example by screws or through to the functional surface 26th molded rivet pins, fixed to the flange plate 14.
  • The centering pins 20 and the fastening elements 16, 18 serve for centering and mounting the cooling element 32 in a lighting device (not shown) for a motor vehicle and / or for mounting an optical element (not shown) and / or a shutter arrangement. In one embodiment, the illumination device is a headlight or a light module of a headlight. The optical element is a reflector arranged for focusing the light of the LED array 28 or a lens arranged for this purpose.
  • FIG. 3 shows a section along line III, III cut through the cooling element 32 of the FIG. 2 , In contrast to the conventional one-piece die-cast cooling element 10 of FIG. 1 is the cooling element 32 as an exemplary embodiment of a cooling element according to the invention a composite part of a casting 36 and an inserted during casting of the casting 36 in the mold insert 38. Here, the flange plate, the casting 36 and the heat sink, the insert 38. In the following, therefore, both the flange as well as the casting of a cooling element 32 according to the invention designated by the reference numeral 36. Analogously, both the insert part and the heat sink identical to the insert part are designated by the reference numeral 38 below. The insert is an extrusion or continuous casting heat sink, a magnesium die-cast heat sink, a heat sink designed as a stamped-bent part or an arrangement of several such heat sink.
  • As already mentioned, continuous casting and extrusion processes allow the use of alloys better thermal properties than alloys suitable for die casting. In addition, continuous casting and extrusion processes enable the production of significantly finer structures. That is, these methods allow production of heat sinks 38 with, for example, particularly high and / or thin cooling fins or cooling pins. Due to the resulting large surface can be particularly effective heat sink 38 with low thermal resistance, ie produce high thermal conductivity, at the same time compact dimensions. This will be the subject of FIG. 3 by the number of cooling structures 46, which is higher by a factor of about 1.5 than the number eight of the cooling fins 12 of the conventional die-cast cooling element 10 of the FIG. 1 ,
  • In magnesium diecasting, smaller wall thicknesses and thus more filigree cooling fins can be realized than in die-cast aluminum. In addition, the low density of magnesium die-casting allows significant weight savings. It is disadvantageous that no rivet pegs can be molded onto magnesium die-cast parts, since magnesium die-casting can not be deformed sufficiently plastically. Even screw connections can not be realized without further ado because of the high reduction potential of magnesium (electrochemical voltage series: -2.38 volts, for comparison: aluminum: -1.66 volts). Special aluminum screws or screws with special coatings may be required.
  • Heat sinks designed with stamping and bending technology have cost advantages, especially with large quantities. In addition, cooling elements with particularly low wall thicknesses and thus particularly low weight can be represented. Because the complexity of running in stamping and bending technology Heatshrills is significantly limited by the manufacturing process, it is particularly possible here to connect several heat sink sub-elements by casting with the material of the casting to form a complex composite heat sink.
  • In the production of the cooling element 32, a part of the heat sink 38 is placed in a mold or die-casting tool and encapsulated with the material of the flange plate 36. The material is preferably aluminum, an aluminum alloy, a magnesium alloy, a copper alloy or an alloy having a plurality of these materials.
  • When encapsulating some or all required functional surfaces are molded with the same and some or all metallic functional parts such as centering and mounting elements for the LED array 28 and / or the base element and / or the optics and / or the diaphragm arrangement and in a preferred embodiment / or the attachment in the lighting device with the liquid flange material encapsulated and embedded in the flange plate. The functional surface provided for the thermal coupling of the LED arrangement 28 is in the process cast as flat as possible and only a surface roughness having the lowest possible surface roughness.
  • The einzugießende heat sink 38 has in the embodiment that in the FIG. 3 a heat sink support plate 40 and a heat dissipating side 42 provided for discharging heat to the environment, and a heat receiving side 44 adapted for insertion into a mold of the casting.
  • The heat sink carrier plate 40 is preferably wholly or partly cast in the casting 36. The heat release side 42 has an increased surface area by first structures 46 such as pins and / or ribs to improve the heat dissipation to the environment. The heat receiving side 44 of the heat sink 38 has second surface enlarging structures 48 embedded in the casting 36. As a second surface-enlarging structures are preferably ribs, in particular dovetail-shaped profiled ribs and / or pins and / or openings (the material penetrating recesses) and / or outbreaks (reaching into the material, but not completely penetrating the material recesses) used.
  • The second surface-enlarging structures 48 enlarge the form-fitting surface between the insert 36 and the casting 38. As a result, a firm connection without air gaps between the two components 36, 38 is achieved. The resulting composite part offers great design freedom thanks to the casting process. The casting process offers the possibility of embedding further metallic functional parts, for example screw and bearing bushings, centering pins and bearing bolts.
  • At the same time, the good thermal properties correspond to those of the extruded or continuous casting heat sink. In contrast to screwed, riveted or glued heat sink assemblies, insulating air layers between the parts can be reliably excluded. The production cost is lower when casting, especially for larger quantities, as would be required for the subsequent machining of the functional surfaces on the extrusion or continuous casting heat sink. The cooling element 32 with the features of the invention enables the saving of additional holding and Fasteners.
  • The FIGS. 4 and 5 show embodiments of heat sinks with carrier plates in each case in perspective view. It shows FIG. 4 an embodiment in which both the first surface-enlarging structures 46 on the heat-emitting side 42 and the second surface-enlarging structures 48 on the heat receiving side 44 are pins. FIG. 5 shows an embodiment in which both surface-enlarging structures 46/48 are formed as ribs. It is understood, however, that differently shaped structures can also be used on both sides of the carrier plate 40.

Claims (13)

  1. Cooling element (32) for a semiconductor light source (24) of a motor vehicle with a heatsink (38) adapted to emit heat to the environment and with a flange plate adapted to thermally couple the semiconductor light source (24) and to secure the cooling element (32) to the illuminator (36), characterized in that the cooling element is a composite part of a casting and an inserted during casting of the casting in the mold insert (38), wherein the flange plate (36) is the casting and the heat sink (38) is the insert.
  2. Cooling element (32) according to claim 1, characterized by at least one heat sink (38) made of an aluminum, copper or magnesium alloy produced by a continuous casting or extrusion process.
  3. Cooling element (32) according to claim 1, characterized by at least one designed as a magnesium die-cast heat sink (38) or as a stamped and bent part heat sink (38).
  4. Cooling element (32) according to one of the preceding claims, characterized by a plurality of separate heat sinks, which are connected by the casting (36) to form a composite heat sink.
  5. Cooling element (32) according to claim 1 or 2, characterized in that the casting (36) has molded functional surfaces (26) during casting.
  6. Cooling element (32) according to claim 3, characterized
    characterized in that the casting (36) has a contact surface configured as a molded functional surface (26) for thermal coupling of the semiconductor light source (24).
  7. Cooling element (32) according to any one of the preceding claims, characterized in that it comprises the material of the casting (36) with embedded metallic functional parts during encapsulation of the insert (38).
  8. Cooling element (32) according to claim 5, characterized by at least one centering element and / or at least one fastening element for the semiconductor light source (24) and / or for at least one optical element and / or for the attachment of the cooling element (32) in the illumination device.
  9. Cooling element (32) according to claim 6, characterized by at least one screw and / or at least one bearing bush and / or at least one centering pin (20, 22) and / or at least one threaded stud and / or at least one bearing pin as a centering element and / or as a fastening element ,
  10. Cooling element (32) according to one of the preceding claims, characterized in that the cooling body (38) has a heat sink carrier plate (40) and a heat dissipation side (42) adapted to give off heat to the environment with a surface which is enlarged by first structures (46) and a heat receiving side (44) adapted to be placed in a mold of the casting (36), the heat receiving side (44) of the heat sink (38) being second Surface enlarging structures (48) embedded in the casting (36).
  11. Cooling element (32) according to claim 8, characterized in that the second surface-enlarging structures (48) ribs, in particular dovetail-shaped profiled ribs, and / or pins and / or openings and / or outbreaks in the heat sink carrier plate (40). and the heat sink support plate (40) is disposed on the heat receiving side (44) adapted to be placed in the mold of the casting (36).
  12. A method of manufacturing a cooling element (32) for a semiconductor light source (24) of a motor vehicle having a heat sink (38) adapted to dissipate heat to the environment and having one for thermally coupling the semiconductor light source (24) and mounting the cooling element (32) the lighting device fitted flange plate (36), characterized in that a part of the heat sink (38) inserted into a mold for casting the flange plate (36) and cast with the material of the flange plate (36).
  13. A method according to claim 12, characterized by an aluminum, a magnesium or a copper alloy as the material of the flange plate (36).
EP10002907.3A 2009-07-13 2010-03-19 Cooling element for a semiconductor light source of a motor vehicle lighting device Active EP2275738B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102009033949A DE102009033949A1 (en) 2009-07-13 2009-07-13 Cooling element for a semiconductor light source of a lighting device of a motor vehicle

Publications (4)

Publication Number Publication Date
EP2275738A2 true EP2275738A2 (en) 2011-01-19
EP2275738A3 EP2275738A3 (en) 2012-05-23
EP2275738B1 EP2275738B1 (en) 2014-10-22
EP2275738B2 EP2275738B2 (en) 2019-06-12

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EP2730837A1 (en) * 2012-11-09 2014-05-14 Valeo Vision Lighting module with separate heat sinks mounted on a common printed circuit board
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EP2275738B1 (en) 2014-10-22
EP2275738A3 (en) 2012-05-23
EP2275738B2 (en) 2019-06-12

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