EP2220263A4 - Thin film coating system and method - Google Patents
Thin film coating system and methodInfo
- Publication number
- EP2220263A4 EP2220263A4 EP08841116.0A EP08841116A EP2220263A4 EP 2220263 A4 EP2220263 A4 EP 2220263A4 EP 08841116 A EP08841116 A EP 08841116A EP 2220263 A4 EP2220263 A4 EP 2220263A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- thin film
- film coating
- coating system
- thin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99606307P | 2007-10-26 | 2007-10-26 | |
PCT/US2008/012170 WO2009055065A1 (en) | 2007-10-26 | 2008-10-27 | Thin film coating system and method |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2220263A1 EP2220263A1 (en) | 2010-08-25 |
EP2220263A4 true EP2220263A4 (en) | 2014-06-04 |
Family
ID=40579882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08841116.0A Withdrawn EP2220263A4 (en) | 2007-10-26 | 2008-10-27 | Thin film coating system and method |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2220263A4 (en) |
JP (1) | JP2011500971A (en) |
CN (1) | CN101809185B (en) |
WO (1) | WO2009055065A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103299392A (en) * | 2010-07-20 | 2013-09-11 | 沉积科学公司 | Improved IR coatings and methods |
US9512519B2 (en) * | 2012-12-03 | 2016-12-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Atomic layer deposition apparatus and method |
JP6566750B2 (en) * | 2015-07-02 | 2019-08-28 | Cbc株式会社 | Method for forming discontinuous metal film |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0428358A2 (en) * | 1989-11-13 | 1991-05-22 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
WO2008153915A1 (en) * | 2007-06-05 | 2008-12-18 | Deposition Sciences, Inc. | Method and apparatus for low cost high rate deposition tooling |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0741940A (en) * | 1993-07-27 | 1995-02-10 | Iwasaki Electric Co Ltd | Sputtering device |
US5849162A (en) * | 1995-04-25 | 1998-12-15 | Deposition Sciences, Inc. | Sputtering device and method for reactive for reactive sputtering |
US6485616B1 (en) * | 1999-12-29 | 2002-11-26 | Deposition Sciences, Inc. | System and method for coating substrates with improved capacity and uniformity |
US6440280B1 (en) * | 2000-06-28 | 2002-08-27 | Sola International, Inc. | Multi-anode device and methods for sputter deposition |
CN100540723C (en) * | 2003-04-25 | 2009-09-16 | 旭硝子株式会社 | Make the method for silicon oxide film and optical multilayer |
WO2005035822A1 (en) * | 2003-10-07 | 2005-04-21 | Deposition Sciences, Inc. | Apparatus and process for high rate deposition of rutile titanium dioxide |
CN1789482A (en) * | 2004-12-17 | 2006-06-21 | 上海广电电子股份有限公司 | Evaporation apparatus and method for content gradually variational film |
-
2008
- 2008-10-27 EP EP08841116.0A patent/EP2220263A4/en not_active Withdrawn
- 2008-10-27 WO PCT/US2008/012170 patent/WO2009055065A1/en active Application Filing
- 2008-10-27 CN CN200880106268.6A patent/CN101809185B/en not_active Expired - Fee Related
- 2008-10-27 JP JP2010531062A patent/JP2011500971A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0428358A2 (en) * | 1989-11-13 | 1991-05-22 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
WO2008153915A1 (en) * | 2007-06-05 | 2008-12-18 | Deposition Sciences, Inc. | Method and apparatus for low cost high rate deposition tooling |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009055065A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN101809185B (en) | 2013-05-08 |
JP2011500971A (en) | 2011-01-06 |
CN101809185A (en) | 2010-08-18 |
EP2220263A1 (en) | 2010-08-25 |
WO2009055065A1 (en) | 2009-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20100520 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140502 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C23C 14/34 20060101ALI20140425BHEP Ipc: C23C 14/50 20060101AFI20140425BHEP |
|
17Q | First examination report despatched |
Effective date: 20180424 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20181106 |