EP2135494A1 - Dispositifs de panneaux comportant des pistes conductrices électriques et procédé de fabrication de ceux-ci - Google Patents

Dispositifs de panneaux comportant des pistes conductrices électriques et procédé de fabrication de ceux-ci

Info

Publication number
EP2135494A1
EP2135494A1 EP07722065A EP07722065A EP2135494A1 EP 2135494 A1 EP2135494 A1 EP 2135494A1 EP 07722065 A EP07722065 A EP 07722065A EP 07722065 A EP07722065 A EP 07722065A EP 2135494 A1 EP2135494 A1 EP 2135494A1
Authority
EP
European Patent Office
Prior art keywords
layer
electrically insulating
insulating material
carrier layer
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07722065A
Other languages
German (de)
English (en)
Inventor
Jochen Wieschermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buhmann Robert
Original Assignee
Buhmann Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buhmann Robert filed Critical Buhmann Robert
Publication of EP2135494A1 publication Critical patent/EP2135494A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

  • the invention relates to a panel device with at least one carrier layer having a top and a bottom surface and a layer of a porous electrically insulating material adjoining the bottom surface of the carrier layer.
  • the invention further relates to a method for producing panels containing electrical interconnects with at least one carrier layer having a top and a bottom surface and a layer of an electrically insulating material adjacent to the bottom surface of the carrier layer and having a top and bottom surface.
  • Panel devices of the type mentioned are used in the prior art for a variety of purposes.
  • the known panel devices are either solid made of a refractory and non-outgassing even at high temperatures of up to 1000 ° C material such as a metal that is relatively heavy, or they are massively made of a plastic material that is relatively lightweight but is either non-fireproof and / or deforms at high temperatures of up to 1000 ° Celsius or releases toxic gases.
  • panel devices made of compound materials which are comparatively lightweight, but at high temperatures combine the disadvantages of the two, the former massive materials.
  • the known panel devices are therefore not suitable for use as support elements and / or as protective sheaths for electrical cables which are to be laid.
  • the object of the invention is therefore a panel -
  • this object is achieved in that between the at least one carrier layer and the layer of a porous electrically insulating material one or more electrical
  • Conductor tracks are arranged, wherein the layer of porous material has an anisotropic honeycomb structure with long-narrow tubular honeycomb, wherein the longitudinal axis of the honeycomb in Is oriented substantially perpendicular to the lower surface of the carrier layer.
  • Preferred embodiments of the panel device according to the invention are the subject of the corresponding subclaims.
  • the object of the invention is furthermore to provide a method for producing the panel device according to the invention.
  • the layer of porous material is an anisotropic honeycomb structure with long-narrow tubular honeycomb with the longitudinal axis of the honeycomb oriented substantially perpendicular to the lower surface of the carrier layer, a particularly effective damping of heat conduction towards the interior of the panel device is achieved, whereby a comparison with the prior art improved, particularly effective temperature! pronounced mechanical stability and dimensional stability is given even at high temperatures. Because of these properties, the panel device according to the invention is highly suitable as carrier elements and / or as protective sheaths for electrical cables to be laid.
  • the carrier layer is connected to the layer of plastic material to a solid, extremely dimensionally stable and temperature-sensitive compound unit, wherein the steps for isolated embedding of electrical lines in the panel device according to the invention in the manufacturing method according to the invention are integrated.
  • a layer of polyurethane is provided as a bonding layer, in which the one or more electrical conductor tracks are introduced.
  • a layer of polyurethane is provided as a bonding layer, in which the one or more electrical conductor tracks are introduced.
  • a layer of porous electrically insulating material a layer of epoxy resin is provided as a bonding layer, in which are introduced one or more electrical conductors.
  • a carrier layer can be applied both to the surface and also to the lower surface of the layer of electrically insulating material.
  • Support layer may be made for example of a metal, in particular aluminum, or be made of an isotropic plastic material.
  • a carrier layer preferably has a thickness of about 0.3 mm to 2.0 mm.
  • the layer is made of a polyetherimide electrically insulating material having an anisotropic honeycomb structure with long-narrowed tubular honeycombs.
  • the layer of material having an anisotropic honeycomb structure with long narrow tubular honeycombs may be made of electrically insulating polyethersulfone material.
  • the tubes of the layer of an electrically insulating material with an anisotropic honeycomb structure have a length of 2 mm to 20 mm with a diameter of 0.1 mm to 3.0 mm.
  • the thickness of the layer of electrically insulating material is sized to between 3.0 mm to 20 mm.
  • the viscous adhesive material is produced by liquefying polyurethane at a temperature of 120 0 C to 180 0 C.
  • the viscous adhesive material is formed of viscous epoxy resin, which is produced at room temperature by mixing together bisphenol A and epichlorohydrin with a hardener.
  • the viscous adhesive material can be applied to the lower surface of the carrier layer or to the surface of the layer of electrically insulating material, or alternatively to the lower surface of the carrier layer as well as to the surface of the layer of electrically insulating material. According to an important preferred embodiment of the method according to the invention, it is always provided that the viscous adhesive material is applied by means of a roller to the respective layer or to the respective layers.
  • a carrier layer to be applied both to the surface and to the lower surface of the layer of electrically insulating material, wherein one or more conductor tracks are formed on both the surface and the lower surface of the layer an electrically insulating material can be applied.
  • the carrier layers used in connection with the method according to the invention can be made of a metal, in particular aluminum or alternatively be made of another isotropic material, in particular plastic material.
  • a carrier layer preferably has a thickness of about 0.3 mm to 2.0 mm.
  • the layer of an electrically insulating material used in connection with the method according to the invention preferably has an anisotropic honeycomb structure with long narrow tubular honeycombs whose respective longitudinal axes are oriented substantially perpendicular to their top and bottom surfaces, wherein a layer of liquefied polyurethane as a carrier layer of one or more traces is applied to the surface of the layer of material.
  • This layer is preferably made of polyetherimide or of polyethersulfone, wherein the tubes of this layer preferably have a length of 2 mm to 50 mm with a diameter of 0.1 mm to 3.0 mm.
  • the layer of electrically insulating material preferably has a thickness of 3.0 mm to 50 mm.
  • the layer can be formed from an electrically insulating material of balsa wood or of phenolic resin-lined paper honeycomb or else of a solid foam material.
  • the one or more strip conductors are applied to the surface of the plastic layer by applying powdered metal.
  • a corresponding method is known, for example, from WO 03/070524 A1.
  • the powdered metal preferably passes before a job under high contact pressure, a nozzle in which heat the powder particles by mutual friction.
  • the powder particles can be distributed in a conveying gas that passes under high pressure nozzle.
  • the pressure is chosen so high that the powder particles are heated to a temperature above their melting point and form droplets behind the nozzle, wherein the temperature of the droplets is preferably just chosen so that they meet when hitting the layer of a electrically insulating material to cool to a temperature below its melting point and thereby adhere to the layer of electrically insulating material.
  • the powder particles are preferably heated to about 800 ° Celsius.
  • the one or more conductor tracks may also be formed by one or more flat conductors, which are applied to the surface of the layer of an electrically insulating material.
  • a flat conductor may for example be formed by a prefabricated and assembled electrically insulated conductor, which is preferably incorporated in an electrically insulating film.
  • Fig. 1 shows a preferred embodiment of the device according to the invention in a view obliquely from above; 2 shows the preferred embodiment of the device according to the invention shown in FIG. 1 in a cross-sectional view.
  • the panel device 100 according to the invention shown in FIGS. 1 to 2 contains a first 110 and a second 120 carrier layer made of aluminum, each having an upper 111; 121 and a lower surface 112; 122 and one to the respective lower surface 112; 122, a carrier layer 110; 120 adjacent layer 130 of a porous electrically insulating material, wherein between the first carrier layer 110 and the layer 130 of a porous electrically insulating material, a plurality of electrical conductor tracks 150 is provided.
  • the layer 130 of porous material in this case has an anisotropic honeycomb structure with long-narrow tubular honeycomb 131, and the longitudinal axes of the honeycomb 131 are substantially perpendicular to the lower surface 112; 122 of the carrier layer 110; 120 oriented.
  • a layer of polyurethane 140 is provided as a bonding layer, in which the plurality of electrical conductor tracks 150 is introduced.
  • the layer 130 of the electrically insulating material comprising an anisotropic honeycomb structure with long-narrowed tubular honeycombs 131 is made of polyetherimide, with the tubes 131 having a length of approximately 5 mm and having an average diameter of approximately 0.2 mm.
  • the carrier layers 110; 120 have a thickness of about 0.5 mm, and the layer 130 of electrically insulating material has a thickness of 1.2 mm.
  • the panel device 100 according to the invention shown in Figures 1 to 2 is prepared according to a method in which the viscous adhesive material is produced by liquefying polyurethane 140 at a temperature of 120 0 C to 180 0 C and then by means of a roller on the Lower surface 112; 122 of the carrier layer 110; 120 is applied. Subsequent thereto, a process of pressing the carrier layers 110 takes place; 120 with the layer 130 of electrically insulating material by the action of a technical vacuum.
  • the tracks 150 are deposited by applying powdered metal to the surface of the layer 130 of porous electrically insulating material.
  • the powdered metal passes before a job under high pressure, a nozzle in which heat the powder particles by mutual friction.
  • the pressure generated in the nozzle is so high that the powder particles heat to a temperature above their melting point and form droplets behind the nozzle.
  • the temperature of the droplets is selected so that they cool when they hit the layer 130 of an electrically insulating material to a temperature below their melting point and thereby adhere to the layer 130 of electrically insulating material.
  • the above panel device 100 according to the present invention is constructed by a method including the following steps:
  • the present in viscous form liquefied polyurethane 140 is thereby using a roller on the respective lower surfaces 112; 122 of the carrier layer 110; 120 applied.
  • the pressing of the carrier layers 110; 120 with the layer 130 of an electrically insulating material is effected by the action of a technical vacuum.
  • the conductive traces 150 are deposited by applying powdered metal to the surface of the layer 130 of porous electrically insulating material, wherein the powdered metal, prior to application under high pressure, passes through a nozzle in which the powder particles are heated by mutual friction.
  • the powder particles are distributed in a conveying gas whose pressure is chosen so high that the nozzle passing Powder particles heat to a temperature above their melting point and form droplets behind the nozzle.
  • the temperature of the droplets is just chosen so that these cool when hitting the layer 130 of an electrically insulating material to a temperature below its melting point and thereby adhere to the layer 130 of electrically insulating material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un dispositif de panneau (100) comportant au moins une couche support (110, 120) présentant une surface supérieure (111, 121) et une surface inférieure (112, 122), et une couche (130) adjacente à la surface inférieure (112, 122) de la couche support (110, 120), réalisée dans un matériau électroisolant poreux. Le dispositif de panneau selon l'invention peut être employé en tant qu'élément support et/ou enveloppe protectrice de lignes électriques à poser du fait qu'une ou plusieurs pistes conductrices électriques (150) sont disposées entre la ou les couches support (110, 120) et la couche (130) en matériau électroisolant poreux, cette dernière présentant une structure alvéolaire anisotrope à alvéoles tubulaires allongées (131), l'axe longitudinal des alvéoles (131) étant orienté essentiellement perpendiculairement à la surface inférieure (112, 122) de la couche support (110, 120).
EP07722065A 2007-03-19 2007-03-19 Dispositifs de panneaux comportant des pistes conductrices électriques et procédé de fabrication de ceux-ci Withdrawn EP2135494A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2007/000505 WO2008113304A1 (fr) 2007-03-19 2007-03-19 Dispositifs de panneaux comportant des pistes conductrices électriques et procédé de fabrication de ceux-ci

Publications (1)

Publication Number Publication Date
EP2135494A1 true EP2135494A1 (fr) 2009-12-23

Family

ID=38794145

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07722065A Withdrawn EP2135494A1 (fr) 2007-03-19 2007-03-19 Dispositifs de panneaux comportant des pistes conductrices électriques et procédé de fabrication de ceux-ci

Country Status (3)

Country Link
EP (1) EP2135494A1 (fr)
DE (1) DE112007003505A5 (fr)
WO (1) WO2008113304A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3052749A (en) 1957-11-26 1962-09-04 Martin Marietta Corp Lightweight printed circuit panel
EP0186308B1 (fr) 1984-11-22 1992-01-29 Asahi Kasei Kogyo Kabushiki Kaisha Compositions de polyétherimide expansibles et matériaux expansés dérivés à partir de celles-ci
JPS63229897A (ja) * 1987-03-19 1988-09-26 古河電気工業株式会社 リジツド型多層プリント回路板の製造方法
TW210422B (fr) * 1991-06-04 1993-08-01 Akzo Nv
DE10207589A1 (de) 2002-02-22 2003-10-16 Leoni Ag Verfahren zum Erzeugen einer Leiterbahn auf einem Trägerbauteil sowie Trägerbauteil
DE102005034082A1 (de) * 2005-07-21 2007-02-01 Hirschmann Car Communication Gmbh Verfahren zum Aufbringen von elektrischen Leiterstrukturen auf ein Zielbauteil aus Kunststoff

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2008113304A1 *

Also Published As

Publication number Publication date
DE112007003505A5 (de) 2010-02-11
WO2008113304A1 (fr) 2008-09-25

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