EP1952204A1 - Scanning near field ultrasound holography - Google Patents
Scanning near field ultrasound holographyInfo
- Publication number
- EP1952204A1 EP1952204A1 EP05808603A EP05808603A EP1952204A1 EP 1952204 A1 EP1952204 A1 EP 1952204A1 EP 05808603 A EP05808603 A EP 05808603A EP 05808603 A EP05808603 A EP 05808603A EP 1952204 A1 EP1952204 A1 EP 1952204A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sample
- tip
- frequency
- subsurface
- frequencies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H3/00—Holographic processes or apparatus using ultrasonic, sonic or infrasonic waves for obtaining holograms; Processes or apparatus for obtaining an optical image from them
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/0663—Imaging by acoustic holography
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/0681—Imaging by acoustic microscopy, e.g. scanning acoustic microscopy
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/32—AC mode
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/22—Processes or apparatus for obtaining an optical image from holograms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0069—Fatigue, creep, strain-stress relations or elastic constants
- G01N2203/0075—Strain-stress relations or elastic constants
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0092—Visco-elasticity, solidification, curing, cross-linking degree, vulcanisation or strength properties of semi-solid materials
- G01N2203/0094—Visco-elasticity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/012—Phase angle
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/014—Resonance or resonant frequency
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0232—Glass, ceramics, concrete or stone
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/024—Mixtures
- G01N2291/02491—Materials with nonlinear acoustic properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0427—Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
Definitions
- acoustic microscopes are used for imaging structures such as integrated circuit (IC) structures.
- the spatial resolution, w, of an acoustic microscope is given by:
- w 0.51 f.NA
- 3 is the speed of sound in the coupling medium
- / is the frequency of the acoustic/ultrasonic wave
- N is the numerical aperture of the lens.
- impedance mismatches and coupling fluid attenuation that is proportional to f 2 .
- Higher resolution alternatives for nondestructive mechanical imaging include the atomic force microscope (AFM) or scanning probe microscope (SPM) platforms.
- a few examples include: force modulation microscopy (FMM) as described by P. Maivald, HJ. Butt, S.A.C. Gould, CB. Prater, B. Drake, J.A. Gurley, V.B. Elings, and P. K. Hansma in Nanotechnology 2, 103 (1991); ultrasonic-AFM as described by U.
- Ultrasonic force microscopy uses the same method except for a amplitude component rather than a phase contrast. If non-linearity is present in the system, most of the phase contrast will come from the surface and not from a surface/sub-surface phase contrast.
- non-linear tip sample interaction may not provide results for soft materials.
- high mechanical contrast may be acquired with little sub-surface contrast.
- the present invention relates to a high spatial resolution phase-sensitive technique, which employs a scanning near field ultrasonic holography methodology for imaging buried or other subsurface structures or variation in the specimen.
- Scanning near field ultrasound holography uses a near-field approach to measure time-resolved variations in ultrasonic oscillations at a sample surface.
- SNFUH scanning near field ultrasound holography
- the fundamental static and dynamic nanomechanical imaging modes for the instrument of the present invention are based on nanoscale viscoelastic surface and subsurface (e.g., buried nanostructure) imaging using two-frequency ultrasonic holography.
- the scanning near-field ultrasonic technique of the present invention vibrates both the cantilevered tip and the sample at ultrasonic/microwave frequencies.
- the contact, soft-contact and near-contact modes of tip-sample interaction enable the extraction of the surface acoustic waves signal between the two ultrasonic vibrations.
- Perturbations to the phase and amplitude of the surface standing acoustic wave may be locally monitored by the SPM acoustic antenna via lock-in and SNFUH electronic module.
- the SPM cantilever As the specimen acoustic wave gets perturbed by buried features, the resultant alteration in the surface acoustic standing wave, especially its phase, is effectively monitored by the SPM cantilever.
- the acoustic wave (which is non-destructive and sensitive to mechanical/elastic variation along its path) is fully analyzed, point- by-point, by the SPM acoustic antenna in terms of its phase and amplitude.
- a pictorial representation of specimen acoustic wave's perturbation is recorded and displayed, to offer quantitative account of the internal features of the specimen.
- Certain embodiments provide contact, soft (e.g., intermittent) contact, and/or near contact modes of operation to identify surface and subsurface (e.g., buried) characteristics of a specimen. Additionally, an SNFUH electronic module extracts surface acoustic phase and amplitude with or without non-linear tip sample interaction
- FIG. 1 is a block diagram illustrating the scanning probe microscope with scanning near field ultrasound holography of the present invention
- FIG. 2 is an illustration of atomic force microscopy of the present invention with a vibrating cantilever tip and vibrating sample;
- Fig. 3(A) is a schematic illustration of a model nanoparticle system for validation of SNFUH.
- Fig. 3(B) shows an AFM (topography) image with a featureless top polymer surface.
- Fig. 3(C) shows the phase image of SNFUH revealing buried gold nanoparticles with high definition.
- Fig. 4(A) shows a schematic of a model test sample for detecting embedded defects/voiding in shallow trenches.
- Fig. 4(B) shows an AFM (topography) image with a uniform coating of dielectric material.
- Fig. 4(C) shows a phase image of SNFUH that reveals the surface elastic contrast and embedded voiding in polymer coating over nitride and hardening of the coating at the trench walls.
- Fig. 4(D) shows a line profile across a void marked across X-Y.
- Fig. 5(A) shows an AFM topography of malaria- infected red blood cells.
- Fig. 5(B) shows an SNFUH phase image from malaria- infected red blood cells.
- Fig. 5(C) represents an AFM topography of early-stage incubation of parasite infection in malaria-infected red blood cells.
- Fig. 5(D) represents an SNFUH phase image of early- stage incubation of parasite infection in malaria-infected red blood cells.
- FIG. 6(A) depicts AFM (topography) imaging of a copper-low K dielectric interconnect system.
- FIG. 6(B) depicts SNFUH imaging of a copper-low K dielectric interconnect system.
- Fig. 6(C) shows a line profile across the voids in Fig.
- Fig. 7 shows a feedback control circuit used in accordance with an embodiment of the preset invention.
- Fig. 8 illustrates the feedback circuit in the context of an embodiment of an electronic readout system used in accordance with an embodiment of the present invention.
- Fig. 9 illustrates a flow diagram for a method for scanning near field acoustic imaging used in accordance with an embodiment of the present invention.
- Certain embodiments of the present invention are directed to a nondestructive, high resolution, sub-surface nanomechanical imaging system.
- the system is capable of directly and quantitatively imaging the elastic (static) and viscoelastic (dynamic) response of a variety of nanoscale materials and device structures with spatial resolution of a few nanometers depending on the ultrasonic frequencies.
- the target maximum probe frequency is around 5-10 GHz, for example.
- the maximum relative phase resolution at this frequency is estimated to be .001° leading to a viscoelastic time resolution of less than ⁇ 1 ps.
- the instrument of certain embodiments of the present invention operates in a manner similar to commercially available scanning probe microscopes (SPMs) in that quantitative, digital, rastered, nanometer-scale images are obtained of the sample elastic modulus, and sample viscoelastic response frequency.
- SPMs scanning probe microscopes
- the instrument also provides conventional SPM imaging modes including topography, frictional, and force modulation imaging.
- the SNFUH system and method may be used for: (1) in- vitro imaging of biological specimens, tissues and cells, (2) nanomechanical imaging of buried structures, inclusions in nanocomposites, failure analysis in IC structures and devices, (3) mechanical properties of low-K materials, (4) stress variation in 3D structures and interconnects, (5) flaw imaging in ceramics and quantitative evaluation of mechanical properties, etc.
- Certain embodiments of the present invention are based on Nanoscale viscoelastic surface and subsurface (e.g., buried nanostructure) imaging using two-frequency ultrasonic holography. This is essentially a 'scanning near-field' ultrasound technique, where both the cantilevered tip 10 and the sample 12 are vibrated at ultrasonic/microwave frequencies. Contact and soft-contact tip- sample interaction enables the extraction of surface acoustic wave amplitude and phase with high resolution.
- perturbation to the standing surface acoustic wave resulting from specimen acoustic wave scattering is monitored by an SPM acoustic antenna.
- the resulting cantilever deflection merely follows the perturbation to the surface standing acoustic wave, which represents the dissipative lag/lead in the surface response with respect to the tip reference frequency (i.e. the time of flight delay of the specimen acoustic waves reaching the sample surface). Extracting the spatial dependence of this phase term provides image contrast indicative of the relative elastic response of the buried structures, interfaces, and embedded defects to the specimen acoustic wave and thus the resultant perturbation to the standing surface acoustic wave.
- Certain embodiments of the present invention provide a system that measures subsurface (e.g., buried) defects, delaminations; cracks; stress migration and etc., while maintaining the high resolution of the atomic force microscope. It utilizes (1) an atomic force microscopy system having a cantilever 14 with a tip 10 at a free end sitting on top of the vibrating device 16 for supplying vibrations to the cantilever at a frequency greater than cantilever resonance frequency, (2) a sample 12 having a vibration device 18 sitting under it for providing high frequency excitations and (3) an optical detector or other detector for detecting movement of the cantilever.
- an atomic force microscopy system having a cantilever 14 with a tip 10 at a free end sitting on top of the vibrating device 16 for supplying vibrations to the cantilever at a frequency greater than cantilever resonance frequency
- a sample 12 having a vibration device 18 sitting under it for providing high frequency excitations and (3) an optical detector or other detector for detecting movement of the cantilever.
- the microscopy apparatus utilizes scanning Near Field Ultrasound Holography (e.g., SNFUH) for high resolution nanomechanical imaging of buried defects and structures.
- the surface acoustic wave's amplitude and phase are experimentally extracted from the tip deflection signal via lock-in detection.
- the phase sensitivity of this measurement is involved in extracting time-resolved mechanical properties of materials as well as potentially enabling subsurface imaging (e.g., buried nanostructures).
- Certain embodiments of the present invention detect the phase of transmitted acoustic wave directly at wafer/device surface. Further, certain embodiments of the present invention detect the phase of surface acoustic wave directly at wafer/device surface.
- Nanoprobe Acoustic Antenna AFM Tip
- AFM Tip Nanoprobe Acoustic Antenna
- Figs. 1 and 2 two oscillations are applied to the tip 10 and sample 12 by two matched piezo crystals 16 and 18 attached to the Si substrate of the tip and the base of the sample, respectively.
- Each piezo 16, 18 is driven by a separate waveform with a SNFUH electronic module 36 providing the input frequency to an RF lockin amplifier 40 for surface acoustic wave (SAW) amplitude and phase extraction.
- the SNFUH electronic module 36 selects beats, product, and/or addition frequencies for example, to aid in performing holography in contact, soft-contact, and near-contact modes. Additionally, the SNFUH electronic module 36 allows SNFUH to be performed in the linear regime of tip-sample interaction.
- the SNFUH electronic module 36 includes a mixer circuit, variable resistor(s), op-amp(s), band pass filter(s), and/or other filters for mixing frequency signals and selecting frequency products, additions and beats, for example.
- Any Scanning Probe Microscope may serve as the base platform.
- a signal access module (SAM) 22 is used as the input site for SNFUH, and modulus-calibration signals.
- the integrated piezo for high frequency excitation
- the sample ultrasonic vibration is driven by function generator 32.
- Second function generator 34 applies the sample ultrasonic vibration.
- the resulting differential output signal from detector is accessed with the signal access module (SAM) 22 and acts as the input to RF lockin amplifier 30 or similar lockin amplifier for extraction of SAW amplitude and phase.
- the lockin response signal constitutes a SAW amplitude and phase which act as a input into the signal acquisition electronics 46, via the SAM 22, for image display and analysis.
- the SNFUH electronic module circuit 36 extracts beats, products of fundamental and harmonics, and/or modulated waveform(s), which serve as a reference for a RF lockin amplifier 40 or other lockin amplifier, for example.
- the differential output of optical detector (A-B) is input, via the SAM 22, into the RF lockin 40.
- the resulting output constitutes the SNFUH image signal.
- a switch may be included to select an SNFUH or UFM signal for acquisition, for example.
- the sample piezo consists of an insulator/electrode/piezo/electrode/insulator blanket multilayer (e.g.,
- the insulators consist of epoxied machinable ceramics or thin, spin-cast polymer coatings, dependent upon ultrasonic coupling efficiency.
- the Cr/ Au electrodes or other similar electrodes provide electrical contact between the piezo and the second function generator 34.
- the assembly is counter-sunk into a modified SPM sample mount.
- a high frequency acoustic wave is launched from below the specimen 12, while another high frequency acoustic wave is launched at at least a slightly different frequency is launched on the SPM cantilever 10.
- SNFUH electronic module 36 is used to spatially monitor the phase perturbation to a standing surface acoustic wave, which results from a scattered specimen acoustic wave.
- the resonant frequency of the cantilever, f 0 may be in the 10-100 kHz range, for example.
- Certain embodiments may also include a feedback circuit, such as the cantilever resonance feedback circuit 50 depicted in Fig. 7.
- the feedback circuit 50 includes a first op amp (OA) 52, a second op amp (OA) 54, a phase compensator (PC) 56, a voltage- controlled oscillator (VCO) 62, a waveform or function generator 68 and a cantilever tip having a piezo transducer 74 interacting with a sample 78.
- phase of the cantilever may be fixed.
- a resonance feedback circuit said as feedback circuit
- the feedback circuit 50 maintains the tip carrier frequency at resonance and fixes or sets the phase, so that the tip phase is a stable reference for sample phase. For example, at higher frequencies (e.g., 150 MHz-IO GHz), the cantilever easily strays from its resonance, and feedback may be used to maintain the cantilevered tip frequency at resonance. Both the sample and cantilever may maintain their resonance frequencies to generate a high resolution viscoelastic response.
- the system may operate in feedback mode with the feedback circuit 50 generating feedback for frequency resonance, or the system may operate without the feedback circuit 50 activated.
- the voltage-controlled oscillator 62 drives the tip piezo transducer 74.
- Fig. 8 illustrates the feedback circuit 50 in the context of an embodiment of an electronic readout system 800 used in accordance with an embodiment of the present invention.
- the electronic readout system 800 may be a MOSFET embedded electronic readout, for example.
- Deflection sensitivity of the electronic readout may be of the same order as optical feedback detection, for example.
- deflection sensitivity may be approximately three orders of magnitude higher than existing passive and active detection technologies, such as piezoresistive detection.
- a high signal-to-noise ratio and minimal 1/f noise allow the MOSFET embedded electronic readout to be used for electronic feedback in SPM's (scanning probe microscopes), for example.
- the feedback circuit 50 may be used to control a power supply 84 which supplies power to a piezo 86.
- the piezo 86 includes contacts, such as Au (gold) contacts 88, as well as an actuator 90 and a BiMOS transistor 92.
- the piezo 86 is driven by an oscillator 94. Feedback from the oscillating piezo 86 is gathered by the electronic detection unit 96.
- the feedback signal from the electronic detection unit 96 is converted using the analog to digital converter (ADC) 98 and fed into the feedback circuit 50 for control of the power supply 84.
- Set point 100 provides a basis or reference for operation of the feedback circuit 50. Feedback from the circuit 50 helps to ensure that the tip and the sample are being vibrated at their respective resonance frequencies, for example.
- FIG. 3(A) shows gold nanoparticles dispersed on a polymer coated substrate are buried under an approximately 500nm thick polymer layer.
- Use of a model polymer-nanoparticle composite demonstrates the high lateral spatial resolution and depth sensitivity of the SNFUH approach.
- a specimen consisting of gold nanoparticles buried deep underneath a polymer cover layer was prepared by dispersing colloidal gold nanoparticles on a polymer
- phase image of SNFUH shows a smooth featureless surface of top polymeric layer with surface roughness of approximately 0.5 nm.
- phase image of SNFUH shows well-dispersed gold nanoparticles buried approximately 500nm deep from the top surface.
- the contrast in the phase image of SNFUH arises from the elastic modulus difference between the polymer and gold nanoparticle, which induces the time dependent phase delay of the acoustic waves reaching the sample surface.
- shallow trench structures may be fabricated as shown in Fig. 4(A).
- trenches are etched in SOD (spin-on-dielectric) with a 50 nm thin layer of LPCVD Si 3 N 4 as a capping layer and then Si 3 N 4 is etched down in the 1 ⁇ m deep trenches using the wet processing.
- Trench width in the example is about 400 nm.
- BCB (BCB)] was spin-coated followed by thermal annealing for curing the polymer.
- Fig. 4(A) shows a schematic of series of isolated shallow trench structures.
- Fig. 4(B) shows a conventional AFM topography image
- Fig. 4(C) is a corresponding (simultaneously recorded) SNFUH phase image.
- the typical 7.5 x 7.5 ⁇ m 2 topography scan shows uniform and contiguous polymeric coating on SiN and inside the trenches.
- the corresponding SNFUH phase image shown in Fig. 4(B) reveals phase contrast reminiscent of embedded voiding within the polymer, and at the SiN-polymer interfaces.
- the dark contrast in the phase image in polymer coated SiN lines corresponds to voids at polymer-SiN interface, i.e.
- Fig. 4(D) shows a line profile of phase across X-Y from Fig. 4(C).
- a subsurface phase resolution of 50 mdeg may be achieved, for example.
- Current methods of diagnosis employ destructive approaches such as wet etching followed by SEM imaging, which are undesirable.
- SNFUH may be an improved tool-set for such subsurface metrology needs.
- Fig. 5 depicts high resolution and remarkably high contrast arising from malaria parasites inside infected red blood cells (RBCs).
- Fig. 5 demonstrates early stage direct and real-space in-vitro imaging of the presence of parasites inside RBCs without labels or sectioning of cells, and under physiologically viable conditions.
- Plasmodium falciparum strain 3D7 was cultured in-vitro by a modification of the method of Haldar et al. Parasites were synchronized to within 4 hours using a combination of Percoll purification and sorbitol treatments, cultured to 10% parasitemia, and harvested at the indicated times, for example.
- SNFUH imaging may be performed using the near- contact mode method for imaging soft structures, for example.
- An SNFUH electronic module may be used to bring the cantilever in near-contact mode and then the sample was subsequently scanned over the RBCs while maintaining the near-field regime.
- Figs. 5(A) and 5(B) show AFM topography images and SNFUH phase images from infected RBCs, respectively.
- the AFM topography image shows the typical surface morphology of infected RBC
- the SNFUH phase image shows high contrast from the parasite residing well inside the RBC.
- multiple parasites are clearly evident.
- RBCs incubated for only four hours are examined, which is difficult to validate by other non-invasive technique (e.g., fluorescence tagging).
- Figs. 5(C) and 5(D) show a pair of images similar to those in Figs. 5(A) and 5(B).
- SNFUH may be sensitive to early stage parasite infection in RBC, as reflected by image contrast consistent with parasite infection, for example.
- Fig. 6 shows a series of low-K dielectric polymer and copper lines with lateral dimension of about 200nm for the polymer and around 60 run for copper.
- Fig. 6(A) shows the conventional topography image, while Fig. 6(B) is the corresponding (simultaneously recorded) SNFUH phase image.
- the typical 1400 x 1400 run 2 topography scan shows uniform and contiguous polymer and copper lines.
- SNFUH phase contrast reminiscent of sub-surface voiding in copper lines.
- Fig. 6(C) shows a line profile across the voids.
- the dark contrast in the phase image of copper lines corresponds to voids underneath the metal.
- the presence of this contrast in phase image implies that there is insufficient metal filling at the bottom, i.e. voiding underneath the contact, which undergoes a distinct viscoelastic response.
- a hardening of the polymeric regions and its sidewall is also evident in the phase image, which results from RIE processing and chemical-mechanical- polishing (CMP).
- CMP chemical-mechanical- polishing
- SNFUH may be used to facilitate: (1) quantitative high resolution nanomechanical mapping of subsurface ( e -g- > buried) structures to identify process-induced mechanical variations and/or nanoscale cohesive defects; (2) nanomechanical viscoelastic (dynamic) imaging to specifically investigate surface and subsurface interfacial adhesive (bonding) response, etc.
- Other applications for the system and method of the present invention include: (1) non-destructive imaging of subsurface defects in 3D interconnects and stress migration along the devices due to electrical biasing; (2) non-destructive inspection for interconnect nanotechnology for nanometer-scale resolution, to enable imaging of electro-mechanical defects (e.g.
- nanotube contacts and to enable imaging of nanoscale integrity in molecular interconnect assemblies
- subsurface nano-cracks, stress, delamination identification in ferroelectrics, ceramics and micromechanical structures and devices ;
- non-destructive defect review and process control in integrated IC materials and devices to provide modulus measurement for soft materials (i.e. porous dielectrics) and to provide void and delamination defect detection to avoid off-line, cross-sectional failure analysis;
- Fig. 9 illustrates a flow diagram for a method 900 for scanning near field holography imaging used in accordance with an embodiment of the present invention.
- a sample is positioned with respect to a cantilever for nanomechanical imaging of the sample.
- Surface and/or sub-surface imaging may be performed with respect to the sample, such as a tissue or other sample.
- a tip of the cantilever is vibrated at a first frequency.
- the frequency may be a first microwave, ultrasonic, or other acoustic frequency, for example.
- the sample is vibrated at a second frequency, such as a second microwave, ultrasonic, or acoustic frequency, for example.
- the second frequency vibrates the sample at a frequency that is offset from the first frequency vibrating the tip.
- the tip and sample piezos are vibrated at their respective resonance frequencies.
- interaction between the vibrating tip and the vibrating sample is detected.
- the interaction may be a physical interaction and/or a non-contact signal interaction between the tip and sample, for example.
- the interaction may constitute movement of the tip, for example. Tip movement may be provided as a tip deflection signal, for example.
- the interaction may include a linear and/or non-linear interaction between the tip and the sample.
- SNFUH may be performed using the linear tip-sample interaction in soft contact and near contact mode to obtain the high resolution sub-surface phase. SNFUH may be performed in soft and near contact modes to obtain the sub-surface information, such as buried defects or variations.
- amplitude and phase information associated with the surface acoustic waves of the sample are extracted. Amplitude and phase information may be extracted from the tip deflection signal using lock in detection, for example.
- subsurface mechanical data, such as interfacial bonding, regarding the sample may also be extracted from the tip deflection signal.
- step 960 surface and/or subsurface characteristics of the sample may be imaged using the amplitude and phase information.
- a spatial variation of surface and subsurface viscoelastic phase may be imaged, for example.
- a characteristic viscoelastic response time of the sample may be defined based on the amplitude and phase information.
- vibration of the cantilever tip is maintained at a tip piezo resonance frequency, and vibration of the sample is maintained at a sample resonance frequency.
- Feedback such as electrical feedback, may be provided to maintain the tip resonance frequency and the sample resonance frequency.
- product frequencies may be used with optical detection to obtain biological imaging with high subsurface resolution.
- the sample and cantilever are excited at their fundamental resonance frequencies (e.g., 1.96 MHz and 3,28 MHz, respectively).
- the individual sample and cantilever carriers are modulated with one or more modulation frequencies (e.g., 25 kHz and 35 kHz, respectively).
- a combination of a SNFUH electronic module and RF lock in band pass filter outputs a product of the two modulated waveforms.
- the product output is then fed into a
- product frequencies allows improved selection of carrier frequencies.
- the larger the frequency of acoustic oscillations the higher the order of phase contrast that may be obtained from SNFUH images.
- smaller features not seen at lower carrier frequencies may be detected using a higher frequency carrier.
- use of product frequencies allows use of non- matching tip and cantilever piezos.
- forces between the cantilever and sample may be controlled during SNFUH operation in near contact mode. Contacting the cantilever with the biological samples may rupture the samples.
- near contact operation allows monitoring and subsurface imaging of soft structures. Near contact mode operation may provide sub-surface imaging of soft structures as well as providing quantitative analysis of biological structures, cells and/or tissues, for example.
- beat frequencies may be used to monitor samples in near contact mode.
- frequency addition may be used for sample monitoring in near contact mode.
- harmonics as well as or in addition to fundamental frequencies, may be used in beat frequency, product frequency, and/or frequency addition (sum) operation.
- the system may perform optical and/or electronic detection according to a variety of frequency strategies up to 1000 MHz with a very thin film of ZnO.
- cantilever and sample carrier frequencies may be modulated with amplitude modulation. For example, two carriers, a carrier for the cantilever and a carrier for the sample are amplitude modulated individually.
- the tip-sample assembly may be excited with a higher frequency (with or without matching piezos). Then, an amplitude modulated waveform may be obtained from both the cantilever and sample and input to a SNFUH electronic module. The output of the electronic module is a product/difference/addition frequency. A beat or difference frequency is a difference between modulation frequencies, for example.
- an electronic readout device may be implemented with the sample monitoring system. An example of such a readout device may be the readout device described in U.S. Patent Application Serial Number 10/996,274, filed on November 23, 2004, entitled "Method and System for Electronic Detection of
- use of electronic detection eliminates optical detection of amplitude and phase removes or eases limitations imposed by a photo-detector response frequency, such as a 1 MHz photo-detector response frequency.
- Electronic detection aids in fabricating multi-active probes with on-chip integrated piezo- actuator (e.g., ZnO) and embedded MOSFET feedback electronics.
- electronic detection does not limit detection of subsurface features based on beat frequency. Multiples of frequencies may be used to enhance both amplitude and subsurface phase contrast, and thus the viscoelastic response. Enhanced viscoelastic response results in enhanced phase contrast from features less than 50 nm, for example, which may be difficult to detect using only beat frequencies.
- certain embodiments provide a scanning near field ultrasound holography (SNFUH) technique to image high resolution buried nanostructures, defects, 3D tomography, identification of individual layers in multilayer thin film stacks and dopant mapping, for example.
- Certain embodiments integrate three approaches: a combination of scanning probe microscope platform (which enjoys excellent lateral and vertical resolution) coupled to micro-scale ultrasound source and detection (which facilitates "looking" deeper into structures, section-by-section) and a holography approach (to enhance phase resolution and phase coupling in imaging).
- Certain embodiments provide near field, ultrasonic holography, near field microwave holography, or other near field acoustic holography for surface and subsurface imaging in nano- and micro- specimens, such as biological, mechanical, and electrical specimens. Certain embodiments allow SNFUH imaging using linear and/or non-linear interactions between cantilever and specimen in contact, soft contact and/or near contact mode, for example.
- the technique allows subsurface flaw imaging in nano- and micro-composites, MEMS, CMOS, and heterostructures, for example.
- the technique also provides in-vitro imaging of biopolymer, biomaterials and biological structures (e.g. viewing cell-membrane or implant-bio interface). Additionally, certain embodiments detect voiding and subsurface defects in low-K dielectric materials and interconnects, as well as stress migration and defect analysis in 3D interconnects and MEMS. Certain embodiments facilitate dopant profiling and modulus mapping in non-contact mode and also provide non-invasive monitoring of molecular markers/tags -signal pathways, for example.
- a high frequency (e.g., on the order of hundreds of MHz) acoustic wave is launched from the bottom of the specimen, while another wave is launched on the AFM cantilever.
- acoustic waves are mixed together through a SNFUH electronic module, which includes a combination of various filters, mixers, feedback electronics and electronic components used to obtain a desired product and addition of fundamental resonances and related harmonics (in addition to difference frequencies).
- the resulting mixed wave is monitored by the AFM tip, which itself acts as an antenna for both phase and amplitude. As the specimen acoustic wave gets perturbed by buried features, especially its phase, the local surface acoustic waves are very effectively monitored by the AFM tip.
- the acoustic wave (which is nondestructive and sensitive to mechanical/elastic variation in its "path") is fully analyzed, point-by-point, by the AFM acoustic antenna in terms of phase and amplitude.
- a pictorial representation of acoustic wave's perturbation is fully recorded and displayed, to offer a "quantitative" account of internal microstructure of the specimen.
- the SNFUH system is operational in the linear and near-contact regime of tip-sample interaction and proves effective for in-vitro imaging of biological cells and tissues using the SNFUH electronic module, for example.
- certain embodiments provide an electronic readout based on an embedded MOSFET to detect product frequencies, which is thereby not limited by an optical detector. Moreover, electronic readout may help in building a parallel SNFUH system for industrial application. In addition, a Brillion Zone Scattering technique may be used to map the modules of any surface in non-destructive way with greater efficiency than other methods. [00072] Certain embodiments may be applied to microelectronics, especially as an advanced nanoscale surface and sub-surface metrology tool-set. Further, certain embodiments provide imaging for Nanoelectronics, reliability and failure analysis in Microsystems (MEMS), and Nanotechnology, in general, and especially biomolecular interconnects and BioMEMS.
- MEMS Microsystems
- Nanotechnology in general, and especially biomolecular interconnects and BioMEMS.
- certain embodiments provide in-vitro imaging of biological structures without having to "open-up" internal structures.
- certain embodiments may characterize the surface defects and structures with high resolution and will have further potential for developing nanoscale non-invasive
- 3D tomography for example.
- Scanning Near Field Ultrasound Holography may be used, for example, in near " contact and contact mode with product frequencies for the following structures and devices: (1) Investigating mechanical uniformity and process-induced mechanical modification of materials in integrated circuit (IC) structures and MEMS; (2) Real-rime in-vitro biological imaging of red blood cells infected with malaria parasites; (3) Voiding in copper interconnects and (4) Non-invasive monitoring of nanoparticles buried under polymeric films.
- Such capabilities may complement cross-sectional imaging techniques such as SEM-EDS (scanning electron microscope-energy dispersive spectroscopy), TEM-EDS (transmission electron microscope- energy dispersive spectroscopy), TEM-EELS (transmission electron microscope-electron energy-loss microscopy), and ex situ STM (scanning tunneling microscopy) to investigate the nanomechanics and subsurface imaging of material interfaces, the uniformity of conformally deposited coatings, and mechanical defects in multilayer structures, for example.
- SEM-EDS scanning electron microscope-energy dispersive spectroscopy
- TEM-EDS transmission electron microscope- energy dispersive spectroscopy
- TEM-EELS transmission electron microscope-electron energy-loss microscopy
- ex situ STM scanning tunneling microscopy
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Abstract
Description
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2005/036194 WO2007044002A1 (en) | 2005-10-06 | 2005-10-06 | Scanning near field ultrasound holography |
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| EP1952204A1 true EP1952204A1 (en) | 2008-08-06 |
| EP1952204A4 EP1952204A4 (en) | 2011-12-14 |
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| WO (1) | WO2007044002A1 (en) |
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| WO2008141301A1 (en) * | 2007-05-10 | 2008-11-20 | Veeco Instruments Inc. | Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field afm detection |
| JP5277378B2 (en) * | 2008-10-27 | 2013-08-28 | 国立大学法人金沢大学 | Scanning probe microscope |
| JP5223832B2 (en) * | 2009-09-28 | 2013-06-26 | 富士通株式会社 | Internal structure measuring method and internal structure measuring device |
| SG10201601903YA (en) * | 2010-06-08 | 2016-04-28 | Dcg Systems Inc | Three-dimensional hot spot localization |
| CN102698679B (en) * | 2012-06-26 | 2014-04-16 | 南京航空航天大学 | Method for operating nano matters |
| EP3179313B1 (en) | 2015-12-11 | 2021-11-10 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Apparatus and method for creating a holographic ultrasound field in an object |
| CN106097333A (en) * | 2016-06-08 | 2016-11-09 | 上海交通大学 | Microwave holography map generalization and reconstructing method and system thereof |
| EP3349018A1 (en) * | 2017-01-13 | 2018-07-18 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Atomic force microscopy device, method and lithographic system |
| CN109580990B (en) * | 2017-09-28 | 2021-08-06 | 中国医学科学院基础医学研究所 | A method for detecting pores on cell surfaces using atomic force microscopy |
| CN108760771B (en) * | 2018-07-24 | 2022-10-14 | 电子科技大学 | A method for drug tracing using near-field microwave microscopy |
| US10512911B1 (en) * | 2018-12-07 | 2019-12-24 | Ultima Genomics, Inc. | Implementing barriers for controlled environments during sample processing and detection |
| CN110133108B (en) * | 2019-05-13 | 2020-09-22 | 浙江大学 | A kind of ultra-precision component subsurface micro-nano defect measurement system and measurement method |
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| GB9617380D0 (en) * | 1996-08-19 | 1996-10-02 | Isis Innovation | Atomic force microscopy apparatus and a method thereof |
| JP3286565B2 (en) * | 1997-07-28 | 2002-05-27 | セイコーインスツルメンツ株式会社 | Sampling scanning probe microscope |
| US6666075B2 (en) * | 1999-02-05 | 2003-12-23 | Xidex Corporation | System and method of multi-dimensional force sensing for scanning probe microscopy |
| JP2003501647A (en) * | 1999-06-05 | 2003-01-14 | デーウー・エレクトロニクス・カンパニー・リミテッド | Atomic force microscope and driving method thereof |
| US6577417B1 (en) * | 2000-08-19 | 2003-06-10 | Jehad Khoury | Heterodyne-wavelength division demultiplexing for optical pick-ups, microscopy, tomography telecommunication and lidar |
| US6849844B2 (en) * | 2000-10-12 | 2005-02-01 | Jed Khoury | 2-D microscopic tomographic systems utilizing 2-D deflection sensors |
| US6876791B2 (en) * | 2001-09-03 | 2005-04-05 | Sumitomo Electric Industries, Ltd. | Diffraction grating device |
| EP3252538B1 (en) * | 2001-12-04 | 2019-02-06 | Ecole Polytechnique Federale De Lausanne (Epfl) | Apparatus and method for digital holographic imaging |
| US20050056782A1 (en) * | 2003-08-12 | 2005-03-17 | Gajendra Shekhawat | Near field acoustic holography with scanning probe microscope (SPM) |
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| WO2007044002A1 (en) | 2007-04-19 |
| KR20080068689A (en) | 2008-07-23 |
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