EP1851356A1 - Tubular target comprising a connecting layer that is situated between the tubular target and the tubular support - Google Patents

Tubular target comprising a connecting layer that is situated between the tubular target and the tubular support

Info

Publication number
EP1851356A1
EP1851356A1 EP20050819256 EP05819256A EP1851356A1 EP 1851356 A1 EP1851356 A1 EP 1851356A1 EP 20050819256 EP20050819256 EP 20050819256 EP 05819256 A EP05819256 A EP 05819256A EP 1851356 A1 EP1851356 A1 EP 1851356A1
Authority
EP
European Patent Office
Prior art keywords
target
tube
characterized
tubular
target according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP20050819256
Other languages
German (de)
French (fr)
Inventor
Christoph Simons
Martin Schlott
Markus Schultheis
Martin Weigert
Lars Gusseck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH
Original Assignee
WC Heraus GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102004060423.1A priority Critical patent/DE102004060423B4/en
Application filed by WC Heraus GmbH filed Critical WC Heraus GmbH
Priority to PCT/EP2005/013084 priority patent/WO2006063721A1/en
Publication of EP1851356A1 publication Critical patent/EP1851356A1/en
Application status is Ceased legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/34Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Abstract

The invention relates to a tubular target comprising a cylindrical tubular support and at least one tubular target that is located on the outer surface of said support, a connecting layer being situated between the target and the support. The invention is characterised in that the connecting layer is electrically conductive and has a wetting degree of > 90 %.

Description

TUBE TARGET WITH BETWEEN TARGET AND PIPE TRAGERROHR ARRANGED VERBINDUWGSSCHICHT

The invention relates to a tube target with a cylindrical support tube and at least one is arranged on the lateral surface of the target tube, where a tie layer is disposed between the target tube and support tube.

For sputtering large-area substrates such as glass for the construction / architectural applications for the automotive glazing and for flat display glass large area flat or planar targets are used. These targets are characterized by a relatively low material yield of about 30-40% in the sputtering process. In contrast, the use of tube targets allows material yields at the target of up to 90%, and minimizes the occurrence of so-called Redepositzonen which tend to release particles during the sputtering process. To prepare the tube target hitherto usually thermal spray processes such as plasma spraying and arc spraying, used to give the corresponding target material is coated over the method of thermal spraying on a carrier tube. Disadvantages of this method are generally high oxygen levels, high material losses during the manufacturing process and long process times with high energy and gas consumption. More recent methods permit the direct casting of the target material on a carrier tube (DE 10043 748, DE 100 63 383). This technique is used in particular for low-melting materials such as Sn and Zn successfully and provides target materials with schmelzcharakteristischem microstructure. Tubular sputtering materials with high melting point and a strong difference in thermal expansion coefficient to the carrier pipe can not be produced in this way before. Therefore, some of these Materialein such as Ag, Zn, SiAl be prefabricated by casting in the melting and short tubular segments and then pushed together on a carrier tube and fixed (DE 102 53 319). The carrier tube hereby provides the mech. Stability of the target structure. The attachment of the segments on the support tube takes place in transferring the production of flat targets mainly by means of a solder. However, it turns out that the quality of this attachment is unsatisfactory. For this, there are many, partly interrelated causes. Some of them are bad wetting behavior of a standard solder towards different target materials, different wetting behavior of the solder over target material and carrier tube, very different thermal Ausdehungskoef- coefficients between the target material and carrier pipe inclination for alloying between target material and solder material, poor thermal conductivity of the target material and difficulties in the process management of the soldering, difficulty of temperature control over great lengths during soldering unkontollierbare Lotbefüllung, oxidation of the surfaces of target material and carrier tube and the solder during the soldering process.

The object of the present invention is to improve the prior art and to provide a reliable functioning tube target.

The object is according to the invention) achieved by the features of the main claim. Advantageous embodiments of the invention are contained in the subclaims. segment-shaped structural tube target according to the invention consists of a carrier pipe and one or more target segments. It is characterized in that the connecting layer is electrically conductive and has a degree of wetting of> 90%, preferably> 95%.

Preferably, the degree of wetting is present both on the lateral surface of the support tube and on the inner surface of the target tube. It is expedient that are disposed on at least one end face of the support tube and / or the target tube fittings, storage receptacles or flanges. Furthermore, it is advantageous that at least a target pipe has at least one end an enlarged diameter. The material of the target tube can be made of Cu, Al, Zr, Mo, W, Ti, Cr, Ni, Ta, Nb, Ag, Zn, Bi, Sn, Si or an alloy based on at least one of these elements or a ceramic material formed be, in the case of AI is preferably made of an alloy with a rare earth element, preferably Nd. It is also expedient that the pipes or the target machined from solid material blocks or prepared by direct casting of hollow cylinders, extrusion, extrusion molding, sintering or hot isostatic pressing are.

In particular, the compound layer on a conductive adhesive or a solder material. On the carrier tube and / or the target tube can be either directly a solder material or at least one adhesion promoter or wetting agent layer and then the solder material be angeord- net, wherein the solder material In, Sn, InSn, SnBi or other low-melting solder alloys having a liquidus below 300 0 C contains or is formed therefrom. Advantage in direct wetting is a cost savings compared to the version with adhesive layer. The carrier tube and / or the target tube can be coated with a nickel-based adhesive layer, in particular of a nickel-aluminum or nickel-titanium alloy. Also, an aluminum alloy adhesive layer leads to a, good wettability and adhesion to the base material. The support tube is preferably made of steel, but other materials such as titanium are conceivable.

In particular, tubular target according to the invention for the production of display coatings can be used. It has a long life, low cost, thermally and electrically conductive connection between the carrier tube and target material for cooling and building a stable sputtering plasma. Other advantages are an optimal use of the expensive target material only on the later ablated cladding region, by means of special guide of cooling during the bonding process, a directional solidification from the bottom upwards, which leads to a pore and lunkerarmen compound.

The surface of the support tube is pre-treated to remove any dirt and oxide A / erzunderungsreste and for adjusting a roughness. On this surface, a homogeneous, highly thermally conductive coating <1 mm is applied, the wetting behavior of the Benet- allows for solder and thermally induced stresses between the target material and carrier tube compensated. Preferred layer materials are Al, Ni, Cu, Zn and their alloys. In an analogous way, the inner surfaces of the tubular target segments are treated. Depending on the material properties tailored to this method and materials should be used. After application of the coatings another of the optimal matched Lot interlayer <1 mm is applied both target- and also the support side. Preferred materials are Al, Ni, Zn, In, Sn, Bi and their alloys. After application of the intermediate layer a further lubricating film layer of a volatile oil can be applied to both target as well as the support side. This layer must be removed again before the actual soldering process.

The prepared in this manner tubular target is homogeneous, heated, for example, in a tube furnace under an inert purge gas and then the solder gap between the carrier tube and target segments matched to the materials solder is filled. For this purpose, depending on the materials both rising as well as falling filling techniques to choose from as well, filling under pressure. For certain material combinations, the Lotbefüllung under application of mechanical activation is advantageous. After complete filling with solder a defined cooling program for the solidification of the solder is being driven.

In the case of less high demands on the thermal conductivity of the tube target and the strength of the tube target the segments are fixed by an adhesive method on the carrier tube. This purpose, a thermally conductive adhesive cohesively fills the gap between the carrier tube and target segments. In the case of lower requirements to the thermal conductivity of the tube target and low sputtering power, the tube segments can be secured to the support tube may also by means of spring-like systems, or by means of clamping systems.

The invention is exemplified with reference to a drawing. In the drawing

1 shows a tube target.

On a support tube 1, several target tubes 2 are applied in segments. The making is explained.

Example 1 :

A steel carrier tube 1 of 1.5 m long with an outer diameter 0 a = 133 mm, internal diameter = 125 mm 0j is to prepare in a mixture of HCl: HNO3 stained. Further, the surface of the carrier tube 1 is roughened by means of a brushing process and activated. Subsequently, on the surface of the support tube applied by electroplating a Cu layer as an intermediate layer with about 0.02 mm thickness. In the centrifugal casting method 3 aluminum pipe segments 2 are prepared, cut to length and 0.4 m outside and in skimmed to 0p 135 mm, a = 0 154 mm. The inner surface of the AI-segments is also galvanically copper-plated.

The intermediate layer of the support tube will be widely covered with a 0.5 mm-thick Sn solder foil which is soldered by local heating by a gas burner. The intermediate layer of the aluminum target tube segments 2 will be widely interpreted with a 0.5 mm thick indium foil, which is soldered by local heating by a gas burner. Subsequently, a thin lubricating film layer of an easily vaporizable oil to both last-applied layers is applied. Subsequently, the tubular target segments 2 are pushed onto the carrier tube 1 by means of centering and Distanzhhilfen. The lubricating film is rinsed. For homogeneous heating to soldering temperature, the prepared tube target is homogeneously heated in a tube furnace at 200 0 C. Here, at the same time last remnants of lubricating film are baked. To avoid oxidation / start-up effects is flushed with an inert gas during heating. After reaching the brazing temperature, the tube target is removed from the kiln, erected and assembled in a Vertikallötvorrichtung. Here, all gaps are sealed with quick sealing clips. During these preparations, the tube target is covered with thermally insulating material and held by an internal heating to 17O 0 C. In addition, the inert gas is maintained. As solder to be approximately 1, 5 kg melted indium, brought to 250 0 C and is filled into the soldering gap. strength in order to achieve a 100% filling of the Lotspaltes is coupled a mechanical excitation to the vertically standing tube target during Loteingusses. Once the solder is completely filled, all heating and insulation measures are set to the pipe and four multi-hole lance in the Vertikallötvorrichtung means of compressed air of the cooling process set in motion. The cooling rate is controlled by gas valves. After cooling of the tube target to room temperature, the tube target can be removed from the Vertikallöteinrichtung and serged of solder residues.

Example 2:

A steel carrier tube 1 of length 1, 5 m with an outer diameter 0 a = 133 mm, internal diameter 0 | = 125 mm is to prepare in a mixture of HCl: HNO3 stained. Further, the surface of the carrier tube 1 is roughened by a sandblasting process and activated. an Ni layer is subsequently applied as an intermediate layer with about 0.2 mm thickness by thermal spraying technique to the surface of the carrier pipe. 1 It is a Mo pipe of length 1 4 m 0 \ = 135 mm, 0 a = 154 mm manufactured by powder metallurgy. The inner surface of the Mo-tube is free of brushed Verzunderungsresten and electroless nickel-plated. There are no further applied layers. The further procedure corresponds to Example of the soldering process. 1

Example 3:

A steel carrier tube 1 of length 1, 5 m with an outer diameter 0 a = 133 mm, internal diameter 0 | = 125 mm is roughened to prepare by means of a brushing process and subsequently coated with a Cu plating layer. There are two Cr-pipe segments of length 0.7 m with 0j = 135 mm, 0 a = 154 mm manufactured by powder metallurgy. Both Cr-segments are bonded by means of a thermally conductive and electrically conductive adhesive after heating at 80 0 C for liquefaction adhesive to the carrier pipe. 1 To a high degree of wetting between the adhesive and target tube 2 and carrier tube 1 to achieve the target prepared as described above is maintained at about 8O 0 C approx. 1 Example 4:

A steel carrier tube 1 of length 1, 5 m with an outer diameter 0 a = 133 mm, internal diameter 0 | = 125 mm is to prepare in a mixture of HCl: HNO3 stained. The joining target material consists of an aluminum tube of length 1, with 4 m 0j = 135 mm, 0 a = 155 mm. The inner surface is cleaned by means of suitable surface treatment and roughened. There are no further applied layers. The further procedure corresponds to Example of the soldering process. 1

Claims

claims
1. tubular target with a cylindrical support tube and at least one is arranged on the lateral surface of the target tube, where a tie layer is disposed between the target tube and support tube, characterized in that the connecting layer is electrically conductive and has a degree of wetting of> 90%.
2. Tubular target according to claim 1, characterized in that the degree of wetting is> 95%.
3. tubular target according to claim 1 or 2, characterized in that the degree of wetting is present both on the lateral surface of the support tube and on the inner surface of the target tube.
4. tubular target according to any one of claims 1 to 3, characterized in that disposed at at least one end face of the support tube and / or the target tube connection pieces bearing receptacles or flanges.
5. tubular target according to any one of claims 1 to 4, characterized in that at least one target tube having at least one end an enlarged diameter.
6. tubular target according to any one of claims 1 to 5, characterized in that Cu, the material of the target tube from, Al, Zr, Mo, W, Ti, Cr, Ni, Ta, Nb, Ag, Zn, Bi, Sn, Si, or an alloy is formed on the basis of at least one of these elements or a ceramic material.
7. tube target according to claim 6, characterized in that the target tube made of an alloy of AI is formed with a rare earth element, preferably Nd.
8. tubular target according to any one of claims 1 to 7, characterized in that the pipes or the target machined from blocks or compact material prepared by direct casting of hollow cylinders, extrusion, extrusion molding, sintering or hot isostatic pressing are.
9. tube target according to one of claims 1 to 8, characterized in that the connecting layer comprises a conductive adhesive or a solder material.
10. tubular target according to any one of claims 1 to 9, characterized in that the solder material it is arranged on the carrier pipe and / or the target tube either directly a solder material or at least one adhesion promoter or wetting agent layer and.
11. tubular target according to claim 9 or 10, characterized in that the solder material is In, Sn, InSn, SnBi or other low-melting solder alloys having a Liquidustem- includes temperature below 300 0 C, or is formed therefrom.
12. tubular target according to claim 11, characterized in that the support tube and / or the target tube are coated with a nickel-based adhesive layer, in particular of a nickel aluminum or nickel titanium alloy.
13. The use of a tubular target according to any one of claims 1 to 12 for the manufacture of display coatings.
EP20050819256 2004-12-14 2005-12-07 Tubular target comprising a connecting layer that is situated between the tubular target and the tubular support Ceased EP1851356A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102004060423.1A DE102004060423B4 (en) 2004-12-14 2004-12-14 Pipe target and its use
PCT/EP2005/013084 WO2006063721A1 (en) 2004-12-14 2005-12-07 Tubular target comprising a connecting layer that is situated between the tubular target and the tubular support

Publications (1)

Publication Number Publication Date
EP1851356A1 true EP1851356A1 (en) 2007-11-07

Family

ID=36011023

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20050819256 Ceased EP1851356A1 (en) 2004-12-14 2005-12-07 Tubular target comprising a connecting layer that is situated between the tubular target and the tubular support

Country Status (8)

Country Link
US (1) US20090250337A1 (en)
EP (1) EP1851356A1 (en)
JP (1) JP2008523251A (en)
KR (1) KR20070086523A (en)
CN (1) CN101080508A (en)
DE (1) DE102004060423B4 (en)
TW (1) TWI404813B (en)
WO (1) WO2006063721A1 (en)

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Also Published As

Publication number Publication date
JP2008523251A (en) 2008-07-03
WO2006063721A1 (en) 2006-06-22
DE102004060423A1 (en) 2006-06-29
TW200632121A (en) 2006-09-16
CN101080508A (en) 2007-11-28
US20090250337A1 (en) 2009-10-08
DE102004060423B4 (en) 2016-10-27
TWI404813B (en) 2013-08-11
KR20070086523A (en) 2007-08-27

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