EP1559148A2 - Organic electronic component with high-resolution structuring and method for the production thereof - Google Patents

Organic electronic component with high-resolution structuring and method for the production thereof

Info

Publication number
EP1559148A2
EP1559148A2 EP03785493A EP03785493A EP1559148A2 EP 1559148 A2 EP1559148 A2 EP 1559148A2 EP 03785493 A EP03785493 A EP 03785493A EP 03785493 A EP03785493 A EP 03785493A EP 1559148 A2 EP1559148 A2 EP 1559148A2
Authority
EP
European Patent Office
Prior art keywords
electronic component
electrode
depression
organic electronic
conductor track
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03785493A
Other languages
German (de)
French (fr)
Inventor
Wolfgang Clemens
Walter Fix
Alessandro Manuelli
Andreas Ullmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PolyIC GmbH and Co KG
Original Assignee
Siemens AG
PolyIC GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, PolyIC GmbH and Co KG filed Critical Siemens AG
Publication of EP1559148A2 publication Critical patent/EP1559148A2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Definitions

  • the invention relates to an organic electronic component with high-resolution structuring, in particular an organic field-effect transistor (OFET) with a small source-drain spacing, and a production method therefor.
  • OFET organic field-effect transistor
  • Organic electronic components are known, in particular OFETs with high-resolution structuring and a small source-drain distance “1 *, but these are produced in complex process steps which are associated with high costs. These process steps are uneconomical and regularly include photolithography, with depressions being produced photolithographically in a lower layer or in the substrate so that a conductor track with the required capacitance can be formed. These depressions are trough-shaped and have no sharp contours. The bottom of these depressions remains unchanged.
  • a conductor track and / or an electrode needs a certain mass to have a low resistance, which in one
  • the known mass-production-capable and fast processes for producing organic electronic components use the technique of applying the conductor track on the lower layer, generally on the substrate, whereby the problem arises that these “overlying” conductor tracks are either so thick that they cause defects in the subsequent insulator layer (s) or as wide, that much of the total area of the integrated circuit is used for this.
  • DE 10061297.0 discloses a high-resolution printing method which can be used on an industrial scale and in which the conductor tracks are sunk, but this has the disadvantage that the depressions which are produced by pressing on an embossing stamp do not have steep wall surfaces and sharply drawn edges, but are more trough-shaped and are designed without sharp contours. As a result of these soft transitions, the material introduced into the depression does not only fill the depression accurately, but blurs around the depression and thus leads to leakage currents. As a result, the smeared material cannot be wiped off without wiping most of the material out of the recess.
  • the object of the invention is to provide an organic electronic component that is inexpensive to produce on an industrial scale, in particular an OFET with a high-resolution structure and a small source-drain distance.
  • the object and object of the invention is to achieve an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 ⁇ m, which has a substantially flat surface, i.e. the conductor track (s) and / or electrode (s) are raised less than 300 nm above the surface of a lower layer or the substrate.
  • the invention also relates to an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 ⁇ m, in which at least one conductor track and / or one electrode is arranged in a depression in a lower layer , wherein the recess by means of a
  • the invention relates to a method for producing an organic electronic component in which at least one depression is burned into a lower layer or the substrate by means of a laser and mask in order to produce a conductor track and / or an electrode, this depression comprising steep walls, sharp contours and has a rough surface on the floor and is filled with conductive, predominantly organic material in a subsequent process step.
  • excess conductive organic material is wiped off in a process step following the filling of the depressions with this material, without any appreciable amount of conductive material being removed from the recess.
  • the recesses can be filled using various techniques: it can be sprayed, knife-coated, injected, coated, printed or filled in in another manner according to the invention.
  • the depressions are burned into the lower layer and / or the substrate with a pulsed laser, for example with pulse lengths of a few 10 ns. A few pulses can be sufficient to produce depressions in the range of 0.5 to 3 ⁇ m.
  • the depressions created by laser structuring are characterized by the fact that the walls are very steep, in extreme cases directly vertical.
  • the evaporation causes a very rough surface at the bottom of the depressions, which has the consequence that the filled organic conductor adheres very well there and, by removing the superfluous conductive material, is not drawn out to any appreciable extent between the depressions and / or is removed.
  • FIG. 1 shows an example of a schematic representation of a process sequence for producing a conductor track and / or an electrode.
  • the substrate 1 is drawn between several rollers, for example in a roll-to-roll process.
  • the pressure and / or guide rollers 2, which support the smooth running of the belt, can be seen from left to right.
  • a laser 3 for example an excimer laser, is used to produce 4 depressions 5 in the substrate through a mask.
  • the excimer laser 3 is optionally equipped with optical lens systems 3a, 3b, so that the depressions 5 are not necessarily imaged in the same size as the mask 4 specifies. Since the laser pulse e.g. lasts only a few 10ns, the tape 1 has moved only insignificantly in time.
  • the depressions 5 formed in this way, as described above, have sharp edges, steep walls and a rough bottom surface on which the organic conductors adhere particularly well.
  • organic material or “functional material” or ⁇ X (functional) polymer "includes all types of organic African, organometallic and / or organic-inorganic plastics (hybrids), especially those that are referred to in English as "plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A limitation in the dogmatic sense to organic material as carbon-containing material is therefore not provided, rather the broad use of, for example, silicones is also contemplated. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but it is also entirely possible to use "small molecules”. The word component "polymer” in the functional polymer is historically determined and therefore contains no information about the presence of an actually polymeric compound.
  • the invention presents for the first time a method with which an organic electronic component such as an OFET can be produced economically with high switching speed and high reliability. It has been shown that depressions that are burned in with a laser hold the filling with conductive organic material differently than the conventional depressions and that organic conductors can therefore be produced faster and better with this method than with other methods.

Abstract

The invention relates to an organic electronic component with high-resolution structuring, especially an organic field effect transistor (OFET) with a small source-drain distance and a method for the production thereof. The organic electronic component has recesses in which the strip conductors/electrodes are arranged and which are burned in by means of a laser during production.

Description

Beschreibungdescription
Organisches elektronisches Bauteil mit hochaufgelöster Strukturierung und Herstellungsverfahren dazuOrganic electronic component with high-resolution structuring and manufacturing process
Die Erfindung betrifft ein organisches elektronisches Bauteil mit hochaufgelöster Strukturierung, insbesondere einen organischen Feld-Effekt-Transistor (OFET) mit kleinem Source- Drain-Äbstand und ein Herstellungsverfahren dazu.The invention relates to an organic electronic component with high-resolution structuring, in particular an organic field-effect transistor (OFET) with a small source-drain spacing, and a production method therefor.
Bekannt sind organische elektronische Bauteile, insbesondere OFETs mit hochaufgelöster Strukturierung und kleinem Source- Drain-Abstand „1*, jedoch werden diese in aufwendigen Pro- zessschritten, die mit hohen Kosten verbunden sind, hergestellt. Diese Prozessschritte sind unwirtschaftlich und umfassen regelmäßig Fotolithographie, wobei Vertiefungen in einer unteren Schicht oder im Substrat fotolithographisch erzeugt werden, damit eine Leiterbahn mit der erforderlichen Kapazität gebildet werden kann. Diese Vertiefungen sind muldenförmig und haben keine scharfen Konturen. Der Boden dieser Vertiefungen bleibt unverändert .Organic electronic components are known, in particular OFETs with high-resolution structuring and a small source-drain distance “1 *, but these are produced in complex process steps which are associated with high costs. These process steps are uneconomical and regularly include photolithography, with depressions being produced photolithographically in a lower layer or in the substrate so that a conductor track with the required capacitance can be formed. These depressions are trough-shaped and have no sharp contours. The bottom of these depressions remains unchanged.
Eine Leiterbahn und/oder eine Elektrode braucht eine gewisse Masse um einen geringen Widerstand zu haben, die in einerA conductor track and / or an electrode needs a certain mass to have a low resistance, which in one
1-2 μm Vertiefung am besten untergebracht ist. Jedoch gibt es bislang kein Verfahren, das in einem schnellen und billigen Herstellungsprozess die Leiterbahnen/Elektroden eines OFETs so herstellt.1-2 μm well is best accommodated. So far, however, there is no method that can produce the conductor tracks / electrodes of an OFET in a fast and inexpensive manufacturing process.
Die bekannten massenfertigungstauglichen und schnellen Prozesse zur Herstellung organischer elektronischer Bauteile bedienen sich der Technik, die Leiterbahn auf der unteren Schicht, in der Regel also auf dem Substrat, aufzubringen wo- bei das Problem auftritt, dass diese „aufliegenden* Leiterbahnen entweder so dick sind, dass sie in den nachfolgenden Isolatorschicht (en) Defektstellen verursachen oder so breit, dass ein Großteil der Gesamtfläche der integrierten Schaltung dafür verwendet wird.The known mass-production-capable and fast processes for producing organic electronic components use the technique of applying the conductor track on the lower layer, generally on the substrate, whereby the problem arises that these “overlying” conductor tracks are either so thick that they cause defects in the subsequent insulator layer (s) or as wide, that much of the total area of the integrated circuit is used for this.
Aus der DE 10061297.0 ist zwar ein großtechnisch anwendbares hochauflösendes Druckverfahren bekannt, bei dem die Leiterbahnen versenkt werden, jedoch hat das den Nachteil, dass die Vertiefungen, die durch Aufdrücken eines Prägestempels entstehen, keine steilen Wandflächen und scharf gezogene Kanten haben, sondern mehr muldenförmig und ohne scharfe Konturen ausgebildet sind. Als Folge dieser weichen Übergänge füllt das in die Vertiefung eingebrachte Material nicht akkurat nur die Vertiefung, sondern es verwischt um die Vertiefung herum und führt damit zu Leckströmen. Das verschmierte Material lässt sich in der Folge auch nicht abwischen, ohne einen Großteil des Materials wieder aus der Vertiefung herauszuwischen.DE 10061297.0 discloses a high-resolution printing method which can be used on an industrial scale and in which the conductor tracks are sunk, but this has the disadvantage that the depressions which are produced by pressing on an embossing stamp do not have steep wall surfaces and sharply drawn edges, but are more trough-shaped and are designed without sharp contours. As a result of these soft transitions, the material introduced into the depression does not only fill the depression accurately, but blurs around the depression and thus leads to leakage currents. As a result, the smeared material cannot be wiped off without wiping most of the material out of the recess.
Aufgabe der Erfindung ist es, ein großtechnisch und günstig herstellbares organisches elektronisches Bauteil, insbesonde- re einen OFET mit einer hochaufgelösten Struktur und einem kleinen Source-Drain-Abstand, zu schaffen.The object of the invention is to provide an organic electronic component that is inexpensive to produce on an industrial scale, in particular an OFET with a high-resolution structure and a small source-drain distance.
Lösung der Aufgabe und Gegenstand der Erfindung ist ein organisches elektronisches Bauelement mit einem Abstand 1 zwi- sehen zwei Leiterbahnen, Elektroden und/oder zwischen einer Leiterbahn und einer Elektrode kleiner lOμm, das eine im wesentlichen ebene Oberfläche hat, d.h. die Leiterbahn (en) und/oder Elektrode (n) sind weniger als 300nm über der Oberfläche einer unteren Schicht oder des Substrats erhoben. Au- ßerdem ist Gegenstand der Erfindung ein organisches elektronisches Bauteil mit einem Abstand 1 zwischen zwei Leiterbahnen, Elektroden und/oder zwischen einer Leiterbahn und einer Elektrode kleiner 10um, bei dem zumindest eine Leiterbahn und/oder eine Elektrode in einer Vertiefung einer unteren Schicht angeordnet ist, wobei die Vertiefung mittels einesThe object and object of the invention is to achieve an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 μm, which has a substantially flat surface, i.e. the conductor track (s) and / or electrode (s) are raised less than 300 nm above the surface of a lower layer or the substrate. The invention also relates to an organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 μm, in which at least one conductor track and / or one electrode is arranged in a depression in a lower layer , wherein the recess by means of a
Lasers erzeugt wurde das heißt, dass sie steile Wände, scharfe Konturen und eine relativ raue Bodenoberfläche hat. Schließlich ist Gegenstand der Erfindung ein Verfahren zur Herstellung eines organischen elektronischen Bauteils bei dem zur Herstellung einer Leiterbahn und/oder einer Elektrode zumindest eine Vertiefung in eine untere Schicht oder das Substrat mittels Laser und Maske eingebrannt wird, wobei diese Vertiefung steile Wände, scharfe Konturen und eine raue Oberfläche am Boden hat und in einem nachfolgenden Prozessschritt mit leitfähigem überwiegend organischem Material gefüllt wird.Lasers was created that means that it has steep walls, sharp contours and a relatively rough floor surface. Finally, the invention relates to a method for producing an organic electronic component in which at least one depression is burned into a lower layer or the substrate by means of a laser and mask in order to produce a conductor track and / or an electrode, this depression comprising steep walls, sharp contours and has a rough surface on the floor and is filled with conductive, predominantly organic material in a subsequent process step.
Nach einer Ausführungsform des Verfahrens wird überschüssiges leitfähiges organisches Material in einem auf die Befüllung der Vertiefungen mit diesem Material folgenden Prozessschritt abgewischt, ohne dass dabei leitfähiges Material aus der Ver- tiefung in merklichem Umfang wieder entfernt würde.According to one embodiment of the method, excess conductive organic material is wiped off in a process step following the filling of the depressions with this material, without any appreciable amount of conductive material being removed from the recess.
Die Befüllung der Vertiefungen kann nach verschiedenen Techniken erfolgen: Es kann besprüht, eingerakelt, eingespritzt, beschichtet, bedruckt oder sonst wie erfindungsgemäß einge- füllt werden.The recesses can be filled using various techniques: it can be sprayed, knife-coated, injected, coated, printed or filled in in another manner according to the invention.
Nach einer Ausführungsform des Verfahrens werden die Vertiefungen in die untere Schicht und/oder das Substrat mit einem gepulsten Laser, beispielsweise mit Pulslängen von einigen 10 ns, eingebrannt. Dabei können bereits wenige Pulse ausreichen, um Vertiefungen im Bereich von 0,5 bis 3 μm zu erzeugen.According to one embodiment of the method, the depressions are burned into the lower layer and / or the substrate with a pulsed laser, for example with pulse lengths of a few 10 ns. A few pulses can be sufficient to produce depressions in the range of 0.5 to 3 μm.
Die durch Laserstrukturierung erzeugten Vertiefungen zeichnen sich dadurch aus, dass die Wände sehr steil, im Extremfall direkt senkrecht sind. Zudem bewirkt das Verdampfen eine sehr raue Oberfläche am Boden der Vertiefungen, was zur Folge hat, dass der eingefüllte organische Leiter dort sehr gut haftet und durch das Entfernen des überflüssigen leitfähigen Materi- als zwischen den Vertiefungen in keinem nennenswerten Umfang aus der Vertiefung herausgesogen und/oder entfernt wird. Dadurch unterscheiden sich die Vertiefungen, die mit Laser ein- gebrannt werden auch deutlich von den Vertiefungen, die beispielsweise durch Einprägen entstehen, wo sich das überflüssige organische Material, das um die Vertiefung herum verteilt ist, nicht ohne große Verluste abwischen lässt.The depressions created by laser structuring are characterized by the fact that the walls are very steep, in extreme cases directly vertical. In addition, the evaporation causes a very rough surface at the bottom of the depressions, which has the consequence that the filled organic conductor adheres very well there and, by removing the superfluous conductive material, is not drawn out to any appreciable extent between the depressions and / or is removed. This distinguishes the indentations that are laser the indentations, which are created, for example, by embossing, where the superfluous organic material distributed around the indentation cannot be wiped off without great losses, are also clearly burned.
Im folgenden wird die Erfindung noch anhand einer Figur näher erläutert, die beispielhaft eine schematische Widergabe einer Prozessabfolge zur Herstellung einer Leiterbahn und/oder einer Elektrode zeigt.In the following, the invention is explained in more detail with reference to a figure, which shows an example of a schematic representation of a process sequence for producing a conductor track and / or an electrode.
Das Substrat 1 wird beispielsweise im Rolle-zu-Rolle-Ver- fahren zwischen mehreren Walzen hindurchgezogen. Von links nach rechts sind zunächst die Anpress- und/oder Führungsrollen 2 zu erkennen, die den gleichmäßigen Lauf des Bandes un- terstützen. Im ersten gezeigten Arbeitsgang werden dann mit einem Laser 3, beispielsweise einem Excimer-Laser, durch eine Maske 4 Vertiefungen 5 im Substrat erzeugt. Der Excimer-Laser 3 ist gegebenenfalls mit optischen Linsensystemen 3a, 3b ausgestattet, so dass die Vertiefungen 5 nicht unbedingt in der- selben Größe abgebildet werden wie die Maske 4 sie vorgibt. Da der Laserpuls z.B. nur wenige 10ns dauert, hat sich das Band 1 in der Zeit nur unwesentlich weiterbewegt. Die so gebildeten Vertiefungen 5 haben, wie oben beschrieben, scharfe Kanten, steile Wände und eine raue Bodenfläche, auf der die organischen Leiter besonders gut haften. Mit einem Rakel 7 wird dann organisches elektrisch leitfähiges Material 6, wie z.B. PANI (Polyanilin) oder PEDOT in Lösung oder als Paste in die Vertiefungen eingerakelt. Eventuell vorhandenes leitfähiges Material 6 zwischen den Vertiefungen wird dann mit einer saugfähigen Rolle 8 entfernt. Die Rolle 8 dreht sich beispielsweise langsamer als die anderen Rollen, so dass effektiv gewischt wird. Der Abstand zwischen zwei Vertiefungen 5 ist durch den Doppelpfeil gekennzeichnet und wird mit 1 bezeichnet .The substrate 1 is drawn between several rollers, for example in a roll-to-roll process. The pressure and / or guide rollers 2, which support the smooth running of the belt, can be seen from left to right. In the first operation shown, a laser 3, for example an excimer laser, is used to produce 4 depressions 5 in the substrate through a mask. The excimer laser 3 is optionally equipped with optical lens systems 3a, 3b, so that the depressions 5 are not necessarily imaged in the same size as the mask 4 specifies. Since the laser pulse e.g. lasts only a few 10ns, the tape 1 has moved only insignificantly in time. The depressions 5 formed in this way, as described above, have sharp edges, steep walls and a rough bottom surface on which the organic conductors adhere particularly well. With a doctor 7 organic electrically conductive material 6, such as PANI (polyaniline) or PEDOT in solution or as a paste in the recesses. Any existing conductive material 6 between the wells is then removed with an absorbent roller 8. The roller 8 rotates, for example, more slowly than the other rollers, so that wiping is effective. The distance between two depressions 5 is indicated by the double arrow and is designated by 1.
Der Begriff "organisches Material" oder "Funktionsmaterial" oder λX (Funktions-) Polymer" umfasst hier alle Arten von orga- nischen, metallorganischen und/oder organisch-anorganischen Kunststoffen (Hybride) , insbesondere die, die im Englischen z.B. mit "plastics" bezeichnet werden. Es handelt sich um alle Arten von Stoffen mit Ausnahme der Halbleiter, die die klassischen Dioden bilden (Germanium, Silizium) , und der typischen metallischen Leiter. Eine Beschränkung im dogmatischen Sinn auf organisches Material als Kohlenstoff enthaltendes Material ist demnach nicht vorgesehen, vielmehr ist auch an den breiten Einsatz von z.B. Siliconen gedacht. Wei- terhin soll der Term keiner Beschränkung im Hinblick auf die Molekülgröße, insbesondere auf poly ere und/oder oligomere Materialien unterliegen, sondern es ist durchaus auch der Einsatz von "small molecules" möglich. Der Wortbestandteil "polymer" im Funktionspolymer ist historisch bedingt und ent- hält insofern keine Aussage über das Vorliegen einer tatsächlich polymeren Verbindung.The term "organic material" or "functional material" or λX (functional) polymer "includes all types of organic African, organometallic and / or organic-inorganic plastics (hybrids), especially those that are referred to in English as "plastics". These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A limitation in the dogmatic sense to organic material as carbon-containing material is therefore not provided, rather the broad use of, for example, silicones is also contemplated. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but it is also entirely possible to use "small molecules". The word component "polymer" in the functional polymer is historically determined and therefore contains no information about the presence of an actually polymeric compound.
Durch die Erfindung wird erstmals ein Verfahren vorgestellt, mit dem ein organisches elektronisches Bauelement wie ein OFET mit hoher Schaltgeschwindigkeit und hoher Zuverlässigkeit wirtschaftlich hergestellt werden kann. Es hat sich gezeigt, dass Vertiefungen, die mit einem Laser eingebrannt werden, die Befüllung mit leitfähigem organischen Material anders halten als die herkömmlichen Vertiefungen und, dass deshalb mit dieser Methode organische Leiterbahnen schneller und besser herstellbar sind als nach anderen Methoden. The invention presents for the first time a method with which an organic electronic component such as an OFET can be produced economically with high switching speed and high reliability. It has been shown that depressions that are burned in with a laser hold the filling with conductive organic material differently than the conventional depressions and that organic conductors can therefore be produced faster and better with this method than with other methods.

Claims

Patentansprüche claims
1. Organisches elektronisches Bauelement mit einem Abstand 1 zwischen zwei Leiterbahnen, Elektroden und/oder zwischen einer Leiterbahn und einer Elektrode kleiner lOμm, das eine im wesentlichen ebene Oberfläche hat, d.h. die Leiterbahn (en) und/oder Elektrode (n) sind weniger als 300nm über der Oberfläche einer unteren Schicht oder des Substrats erhoben.1. Organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 μm, which has an essentially flat surface, i.e. the conductor track (s) and / or electrode (s) are raised less than 300 nm above the surface of a lower layer or the substrate.
2. Organisches elektronisches Bauteil mit einem Abstand 1 zwischen zwei Leiterbahnen, Elektroden und/oder zwischen einer Leiterbahn und einer Elektrode kleiner lOμm, bei dem zumindest eine Leiterbahn und/oder eine Elektrode in einer Vertiefung einer unteren Schicht angeordnet ist, wobei die Vertiefung mittels eines Lasers erzeugt wurde das heißt, dass sie steile Wände, scharfe Konturen und eine relativ raue Bodenoberfläche hat.2. Organic electronic component with a distance 1 between two conductor tracks, electrodes and / or between a conductor track and an electrode of less than 10 μm, in which at least one conductor track and / or an electrode is arranged in a depression in a lower layer, the depression being by means of a Lasers was created that means that it has steep walls, sharp contours and a relatively rough floor surface.
3. Verfahren zur Herstellung eines organischen elektronischen Bauteils bei dem zur Herstellung einer Leiterbahn und/oder einer Elektrode zumindest eine Vertiefung in eine untere Schicht oder das Substrat mittels Laser und Maske eingebrannt wird, wobei diese Vertiefung steile Wände, scharfe Konturen und eine raue Oberfläche am Boden hat, und in einem nachfol- genden Prozessschritt mit leitfähigem überwiegend organischem Material gefüllt wird.3. A method for producing an organic electronic component in which at least one depression is burned into a lower layer or the substrate by means of a laser and mask in order to produce a conductor track and / or an electrode, this depression on steep walls, sharp contours and a rough surface on Soil, and in a subsequent process step it is filled with conductive, predominantly organic material.
4. Verfahren nach Anspruch 3, bei dem das leitfähige Material in die Vertiefung eingerakelt wird.4. The method according to claim 3, wherein the conductive material is scraped into the recess.
5. Verfahren nach einem der Ansprüche 3 oder 4, bei dem überflüssiges leitfähiges organisches Material in einem auf die Befüllung der Vertiefung mit diesem Material folgenden Prozessschritt abgewischt wird. 5. The method according to any one of claims 3 or 4, in which superfluous conductive organic material is wiped off in a process step following the filling of the depression with this material.
6. Verfahren nach einem der Ansprüche 3 bis 5, bei dem ein gepulster Laser, beispielsweise ein Excimer-Laser eingesetzt wird.6. The method according to any one of claims 3 to 5, in which a pulsed laser, for example an excimer laser, is used.
7. Verfahren nach einem der Ansprüche 3 bis 6, das in einem kontinuierlichen roll-to-roll Prozess durchgeführt wird.7. The method according to any one of claims 3 to 6, which is carried out in a continuous roll-to-roll process.
8. Verfahren nach Anspruch 7, bei dem die Rolle, die das überflüssige organische Material abwischt, langsamer dreht als die anderen Rollen. 8. The method of claim 7, wherein the roller that wipes away the unnecessary organic material rotates slower than the other rollers.
EP03785493A 2002-11-05 2003-11-05 Organic electronic component with high-resolution structuring and method for the production thereof Withdrawn EP1559148A2 (en)

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